Nothing Special   »   [go: up one dir, main page]

WO2015037378A1 - Feuille adhésive pour dispositifs electroniques - Google Patents

Feuille adhésive pour dispositifs electroniques Download PDF

Info

Publication number
WO2015037378A1
WO2015037378A1 PCT/JP2014/071271 JP2014071271W WO2015037378A1 WO 2015037378 A1 WO2015037378 A1 WO 2015037378A1 JP 2014071271 W JP2014071271 W JP 2014071271W WO 2015037378 A1 WO2015037378 A1 WO 2015037378A1
Authority
WO
WIPO (PCT)
Prior art keywords
weight
sensitive adhesive
pressure
adhesive sheet
adhesive layer
Prior art date
Application number
PCT/JP2014/071271
Other languages
English (en)
Japanese (ja)
Inventor
戸田　智基
智 土居
達哉 小木曽
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to KR1020157032984A priority Critical patent/KR20160055105A/ko
Priority to JP2014541238A priority patent/JP5703425B1/ja
Priority to CN201480048935.5A priority patent/CN105518094B/zh
Publication of WO2015037378A1 publication Critical patent/WO2015037378A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Definitions

  • the present invention relates to a pressure-sensitive adhesive sheet for electronic equipment that has high impact resistance adhesion, is not easily displaced even when a load is applied in the shear direction, and has excellent resilience.
  • an adhesive sheet is used for assembly.
  • an adhesive sheet is used to bond a cover panel for protecting the surface of an electronic device to a touch panel module or a display panel module, or to bond a touch panel module and a display panel module.
  • Such a pressure-sensitive adhesive sheet is required to have various performances including adhesiveness. For example, it is required to have impact-resistant adhesive that does not peel from the adherend even when subjected to an impact from the outside.
  • Patent Documents 1 and 2 describe a pressure-sensitive adhesive sheet for electronic equipment, which includes a crosslinked polyolefin resin foam sheet and a specific acrylic pressure-sensitive adhesive layer laminated and integrated on one surface of the cross-linked polyolefin resin foam sheet. Yes.
  • the pressure-sensitive adhesive sheet having a foam as a base material has a problem that it is easily displaced when a load is applied in the shearing direction during processing. There is also a problem that the resilience is inferior.
  • the base material excellent in resilience resistance include a polyethylene terephthalate (PET) film, but when a base material having a low buffering property such as a PET film is used, a foam is used. It was difficult to develop high impact resistance adhesion.
  • An object of the present invention is to provide a pressure-sensitive adhesive sheet for electronic equipment that has high impact resistance adhesion, is not easily displaced even when a load is applied in the shear direction, and has excellent resilience.
  • the present invention has a pressure-sensitive adhesive layer containing 100 parts by weight of an acrylic copolymer and 20 to 35 parts by weight of a tackifying resin having a softening point of 110 ° C. or less and an alcoholic hydroxyl value of 30 or more
  • the acrylic copolymer comprises (a) 2-ethylhexyl acrylate 24.7 to 58.98% by weight, (b) butyl acrylate 30 to 50% by weight, (c) methyl acrylate 10 to 20% by weight, (d) acrylic It is obtained by copolymerizing a mixed monomer containing 1 to 5% by weight of an acid and (e) 0.02 to 0.3% by weight of a (meth) acrylate having a hydroxyl group, and has a weight average molecular weight (Mw) of 800,000.
  • Mw weight average molecular weight
  • the pressure-sensitive adhesive layer is a pressure-sensitive adhesive sheet for electronic equipment that has been crosslinked to a gel fraction of 20 to 50% by a crosslinking
  • the present inventor includes a specific acrylic copolymer and a specific tackifying resin, and the pressure-sensitive adhesive sheet for electronic equipment has a pressure-sensitive adhesive layer that is cross-linked to a gel fraction in a specific range by a cross-linking agent. It has been found that high impact-resistant adhesiveness can be exhibited even when a base material having a low buffering property such as a PET film is used instead of a base material having a buffering property such as a foam. Furthermore, the present inventor does not need to use a foam, and the pressure-sensitive adhesive layer has an appropriate hardness, cohesive force, adhesive strength, etc. It has been found that even when a load is applied in the shear direction, it is difficult to shift and has excellent resilience, and the present invention has been completed.
  • the pressure-sensitive adhesive sheet for electronic devices contains 100 parts by weight of an acrylic copolymer and 20 to 35 parts by weight of a tackifying resin having a softening point of 110 ° C. or lower and an alcoholic hydroxyl value of 30 or higher. It has an agent layer.
  • the acrylic copolymer comprises (a) 2-ethylhexyl acrylate 24.7 to 58.98% by weight, (b) butyl acrylate 30 to 50% by weight, (c) methyl acrylate 10 to 20% by weight, (d) acrylic It is obtained by copolymerizing a mixed monomer containing 1 to 5% by weight of an acid and (e) 0.02 to 0.3% by weight of a (meth) acrylate having a hydroxyl group.
  • the pressure-sensitive adhesive layer becomes too soft and easily shifts when a load is applied in the shear direction.
  • the amount of butyl acrylate (b) exceeds 50% by weight, the pressure-sensitive adhesive layer becomes too hard, and impact resistance adhesion is lowered.
  • the impact resistance adhesiveness of the pressure-sensitive adhesive layer is lowered. It is estimated that by copolymerizing 10% by weight or more of the methyl acrylate of (c) above, the side chain of the acrylic copolymer is reduced, thereby improving the linearity of the molecular chain and increasing the entanglement of the molecular chain. The For this reason, when the pressure-sensitive adhesive layer is deformed by receiving an impact, it is presumed that the energy absorption due to the entanglement of molecular chains is increased, and the impact resistance adhesion is improved.
  • the cross-linked structure of the molecular chain is deformed mainly by elastic deformation, it is difficult to convert impact stress into fluid deformation energy, and it is difficult to absorb and disperse. For this reason, the impact stress is stored as elastic energy in the cross-linked structure, the stress dispersibility at the interface with the adherend is lowered, and the impact resistance adhesion is lowered.
  • the entangled structure of molecular chains is different from the crosslinked structure, and can be plastically deformed, and can absorb and disperse by converting impact stress into energy of flow deformation. For this reason, it is thought that the increase in a certain amount of entanglement leads to an improvement in impact resistance adhesion.
  • the pressure-sensitive adhesive layer becomes too hard due to an increase in the glass transition temperature (Tg), and impact resistance adhesion is lowered.
  • the adhesive strength of the pressure-sensitive adhesive layer is lowered.
  • the acrylic acid of (d) exceeds 5% by weight, the pressure-sensitive adhesive layer becomes too hard due to an increase in the glass transition temperature (Tg), and impact resistance adhesion is lowered.
  • the (e) hydroxyl group-containing (meth) acrylate is a component that is cross-linked by an isocyanate-based cross-linking agent described later.
  • the pressure-sensitive adhesive layer is high and is difficult to shift even when a load is applied in the shear direction.
  • the (meth) acrylate having a hydroxyl group of (e) is less than 0.02% by weight, the pressure-sensitive adhesive layer becomes too soft and is easily displaced when a load is applied in the shear direction.
  • the (meth) acrylate having a hydroxyl group of (e) exceeds 0.3% by weight, the cross-linking density of the pressure-sensitive adhesive layer is increased, and the plastic deformation is reduced and elastic deformation is mainly performed. Adhesiveness decreases.
  • the (meth) acrylate having a hydroxyl group (e) include 2-hydroxyethyl (meth) acrylate and 2-hydroxybutyl (meth) acrylate.
  • the mixed monomer may contain other vinyl monomers copolymerizable with the monomers (a) to (e) as necessary.
  • the mixed monomer may be radically reacted in the presence of a polymerization initiator.
  • a conventionally known method is used as a method of radically reacting the mixed monomer, that is, a polymerization method, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, bulk polymerization and the like.
  • the said polymerization initiator is not specifically limited, For example, an organic peroxide, an azo compound, etc. are mentioned.
  • organic peroxide examples include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, t-hexylperoxypivalate, t-butylperoxypivalate, 2,5 -Dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxy Examples include isobutyrate, t-butylperoxy-3,5,5-trimethylhexanoate, and t-butylperoxylaurate.
  • the azo compound examples include azobisisobutyronitrile and azobiscyclohexanecarbonitrile. These polymerization initiators may be used alone or in combination of two or more.
  • reaction solvent examples include ethyl acetate, toluene, methyl ethyl ketone, methyl sulfoxide, ethanol, acetone, diethyl ether and the like. These reaction solvents may be used alone or in combination of two or more.
  • the acrylic copolymer has a weight average molecular weight (Mw) of 800,000 or more.
  • Mw weight average molecular weight
  • the upper limit of the weight average molecular weight (Mw) of the acrylic copolymer is not particularly limited, but is preferably 1.5 million or less. If the weight average molecular weight (Mw) of the acrylic copolymer exceeds 1,500,000, the adhesive strength of the pressure-sensitive adhesive layer decreases, and it may be difficult to achieve both impact resistance and other performances.
  • a weight average molecular weight (Mw) is measured as a polystyrene conversion molecular weight by GPC (Gel Permeation Chromatography: gel permeation chromatography) method. Specifically, the weight average molecular weight (Mw) is obtained by filtering a diluted solution obtained by diluting an acrylic copolymer with tetrahydrofuran (THF) 50 times with a filter, and using the obtained filtrate, polystyrene by GPC method. It is measured as a converted molecular weight. In the GPC method, for example, 2690 Separations Model (manufactured by Waters) or the like can be used.
  • the weight average molecular weight (Mw) of the acrylic copolymer can be adjusted by appropriately adjusting the polymerization conditions (for example, the type or amount of the polymerization initiator, the polymerization temperature, the monomer concentration, etc.).
  • the pressure-sensitive adhesive layer Adhesive strength increases, impact resistance adhesion improves.
  • the softening point of the tackifying resin exceeds 110 ° C., the pressure-sensitive adhesive layer becomes too hard, and impact resistance adhesiveness decreases.
  • the softening point is a softening point measured by the JIS K2207 ring and ball method.
  • the “alcoholic hydroxyl value” means a hydroxyl value based on an alcoholic hydroxyl group. Accordingly, hydroxyl values based on phenolic hydroxyl groups are excluded. The hydroxyl value can be measured by JIS K1557 (phthalic anhydride method).
  • JIS K1557 phthalic anhydride method
  • the average functional group number of the phenolic hydroxyl group and the average functional group number of the alcoholic hydroxyl group contained in one molecule of the tackifying resin are calculated, and one molecule The ratio of the alcoholic hydroxyl group contained in the solution is obtained, and the hydroxyl value of the tackifying resin measured separately is multiplied by the ratio of the alcoholic hydroxyl group contained in one molecule to obtain the hydroxyl value based on the alcoholic hydroxyl group. .
  • the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer is reduced, and impact resistance adhesiveness is reduced.
  • the tackifying resin having a softening point of 110 ° C. or lower and an alcoholic hydroxyl value of 30 or higher exceeds 35 parts by weight, the pressure-sensitive adhesive layer becomes too hard due to an increase in the glass transition temperature (Tg), resulting in resistance to resistance. Impact adhesion decreases.
  • the tackifying resin is not particularly limited as long as it has a softening point of 110 ° C. or less and an alcoholic hydroxyl value of 30 or more, but a rosin ester-based tackifying resin such as a hydrogenated rosin ester resin is preferable.
  • the pressure-sensitive adhesive layer is crosslinked to a gel fraction of 20 to 50% with a crosslinking agent.
  • the said crosslinking agent is not specifically limited, For example, an isocyanate type crosslinking agent, an aziridine type crosslinking agent, an epoxy-type crosslinking agent, a metal chelate type crosslinking agent etc. are mentioned. Especially, since it is excellent in the adhesive stability with respect to a base material, an isocyanate type crosslinking agent is preferable.
  • the isocyanate-based crosslinking agent examples include Coronate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.), Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.), and Mytec NY260A (manufactured by Mitsubishi Chemical Corporation).
  • the amount of the crosslinking agent is preferably 0.1 to 6 parts by weight, more preferably 0.3 to 5 parts by weight with respect to 100 parts by weight of the acrylic copolymer.
  • the pressure-sensitive adhesive layer becomes too soft and easily shifts when a load is applied in the shear direction.
  • the gel fraction of the pressure-sensitive adhesive layer exceeds 50%, the cross-linking density of the pressure-sensitive adhesive layer becomes high, the plastic deformability is lowered and the elastic deformation is the main component, so that the impact resistance adhesion is lowered.
  • the gel fraction is measured as follows. First, the pressure-sensitive adhesive sheet for electronic devices was cut into a flat rectangular shape of 50 mm ⁇ 100 mm to prepare a test piece. After the test piece was immersed in ethyl acetate at 23 ° C. for 24 hours, the test piece was taken out from ethyl acetate.
  • the above-mentioned cross-linking agent is added to form a cross-linked structure between the main chains of the resin constituting the pressure-sensitive adhesive layer.
  • the method is preferred.
  • the pressure-sensitive adhesive layer may contain plasticizers, emulsifiers, softeners, fillers, additives such as pigments and dyes, and other resins such as rosin resins, if necessary.
  • the pressure-sensitive adhesive layer preferably has a tan ⁇ peak frequency in a dynamic viscoelastic master curve at a reference temperature of 25 ° C. of 800 to 10,000 Hz.
  • the frequency of the tan ⁇ peak is from 800 to 10,000 Hz, the pressure-sensitive adhesive layer can be provided with an appropriate hardness, and sufficient impact resistance can be obtained.
  • a more preferable lower limit of the frequency of the tan ⁇ peak is 900 Hz, and a more preferable upper limit is 5000 Hz.
  • the frequency of the tan ⁇ peak in the dynamic viscoelasticity master curve is determined by using a master curve measurement program (measurement mode: shear method) of a dynamic viscoelasticity measurement apparatus (for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.). Calculated from the measured master curve.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 50 to 150 ⁇ m. If the thickness of the pressure-sensitive adhesive layer is less than 50 ⁇ m, impact resistance adhesion may be deteriorated. When the thickness of the pressure-sensitive adhesive layer exceeds 150 ⁇ m, it may be easily displaced when a load is applied in the shear direction, or the resilience resistance may be reduced.
  • the pressure-sensitive adhesive sheet for electronic equipment of the present invention may be a non-support type that does not have a base material, or a support type that has a base material. In the case of a support type, it is preferable that the said adhesive layer is formed on both surfaces of a base material.
  • the pressure-sensitive adhesive sheet for electronic equipment of the present invention contains a specific acrylic copolymer and a specific tackifying resin as described above, and these are cross-linked to a specific range of gel fraction by a cross-linking agent. Therefore, even if it is not a buffering base material such as a foam but a base material having a low buffering property such as a PET film, high impact adhesiveness can be exhibited.
  • the pressure-sensitive adhesive sheet for electronic devices according to the present invention does not require the use of a foam, and the pressure-sensitive adhesive layer has an appropriate hardness, cohesive force, adhesive force, etc., so that even when a load is applied in the shear direction, Difficult and excellent in resilience.
  • the substrate is not particularly limited, but is preferably not a foam.
  • a polyolefin resin film such as a polyethylene film or a polypropylene film
  • a polyester resin film such as a PET film
  • an ethylene-vinyl acetate copolymer film a poly Examples thereof include a vinyl chloride resin film and a polyurethane resin film.
  • a polyester resin film is preferable because the pressure-sensitive adhesive sheet is not easily displaced even when a load is applied in the shear direction, and is excellent in resilience resistance.
  • a black-printed base material for preventing light transmission, a white-printed base material for improving light reflectivity, a metal-deposited base material, and the like can also be used.
  • the thickness of the substrate is not particularly limited, but is preferably 20 to 100 ⁇ m, more preferably 25 to 75 ⁇ m. When the thickness of the substrate is less than 20 ⁇ m, the resilience resistance or mechanical strength of the electronic device pressure-sensitive adhesive sheet may be lowered. When the thickness of the base material exceeds 100 ⁇ m, the pressure-sensitive adhesive sheet for electronic equipment becomes too strong, and it may be difficult to adhere and adhere together along the shape of the adherend.
  • the shear deviation length of the electronic device pressure-sensitive adhesive sheet of the present invention is preferably 300 ⁇ m or less.
  • the pressure-sensitive adhesive layer can be given an appropriate hardness, and punching workability can be easily improved while maintaining sufficient impact resistance adhesion.
  • the shear deviation length is more preferably 180 ⁇ m or less, and further preferably 150 ⁇ m or less.
  • the shear deviation length is measured as follows. In FIG. 2, the schematic diagram which shows the evaluation method of the shear shift
  • the electronic device pressure-sensitive adhesive sheet is cut into a flat rectangular shape having a length of 5 mm and a width of 20 mm to produce a test piece, and the release films on both sides are peeled off (referred to as test piece B).
  • test piece B As shown in FIG. 2, a PET film C having a thickness of 25 ⁇ m is formed on the adhesive layer on the upper surface of the test piece B, and a metal base D (manufactured by SUS) having a length of 100 mm and a width of 20 mm is formed on the adhesive layer on the lower surface.
  • a test sample is prepared by pasting each of them.
  • a 200 g load is applied in the horizontal direction (arrow direction) to the PET film C on the upper surface of the test sample by a weight E and pulled for 3 minutes.
  • the measurement is performed at 23 ° C. Thereafter, one end (fixing jig) of the pressure-sensitive adhesive layer bonded to the PET film C on the upper surface with reference to the position of one end (end on the fixing jig side) of the pressure-sensitive adhesive layer bonded to the metal base D on the lower surface.
  • the distance L in which the side edge) is displaced in the pulling direction of the PET film C on the upper surface is measured and is defined as the shear displacement length.
  • the method for producing the pressure-sensitive adhesive sheet for electronic equipment of the present invention is not particularly limited.
  • the acrylic copolymer and the tackifying resin having a softening point of 110 ° C. or lower and an alcoholic hydroxyl value of 30 or higher.
  • a pressure-sensitive adhesive solution was prepared.
  • the pressure-sensitive adhesive solution was applied to a release-treated PET film and dried. Examples include a method of forming an adhesive layer and transferring the adhesive layer to a substrate. Further, the pressure-sensitive adhesive layer may be transferred onto the opposite surface of the substrate in the same manner.
  • the use of the adhesive sheet for electronic devices of the present invention is not particularly limited, it is preferably used for assembling an electronic device (for example, a mobile phone, a portable information terminal, etc.) equipped with an image display device or an input device. Specifically, for example, it is preferably used for bonding a cover panel for protecting the surface of the electronic device to the touch panel module or the display panel module, or bonding the touch panel module and the display panel module. Furthermore, the adhesive sheet for electronic devices of the present invention may be used for bonding a film with a metal thin film to a support (PET film or the like) or the like in a touch panel module. Moreover, the shape of the adhesive sheet for electronic devices of the present invention in these applications is not particularly limited and may be a rectangle or the like, but a frame shape is preferable.
  • FIG. 1 the schematic diagram which shows the electronic device which bonded the cover panel on the surface of the touch panel module using the adhesive sheet for electronic devices of this invention is shown.
  • a cover panel 3 is bonded to the surface of the touch panel module 4 by an electronic device pressure-sensitive adhesive sheet 2 punched into a frame shape.
  • the adhesive sheet for electronic devices which is high in impact-resistant adhesiveness, cannot be easily shifted even when a load is applied in the shearing direction, and is excellent in resilience can be provided.
  • “boiling point” described in the polymerization method column means that boiling point polymerization was performed.
  • (1-2) Constant Temperature Polymerization A copolymer thermometer, a stirrer, and a condenser provided with a predetermined amount of monomer and reaction solvent shown in the table were added to the reactor, and the reactor was heated to 60 ° C. Subsequently, a predetermined amount of a polymerization initiator shown in the table was added to the reactor to initiate the polymerization reaction. During the reaction, the reactor was appropriately heated and cooled so that the temperature of the reactor became constant at 60 ° C. The reaction was continued for 8 hours to obtain an acrylic copolymer solution.
  • “constant temperature” described in the polymerization method column means that constant temperature polymerization was performed.
  • tackifying resin used is shown below.
  • the obtained pressure-sensitive adhesive solution was applied to a 50 ⁇ m-thick release PET film so that the thickness of the pressure-sensitive adhesive layer after drying was 100 ⁇ m, and then dried at 70 ° C. for 10 minutes.
  • the pressure-sensitive adhesive layer was transferred onto a corona-treated PET film having a thickness of 50 ⁇ m serving as a base material. Further, the pressure-sensitive adhesive layer was transferred onto the opposite surface of the substrate in the same manner to obtain a double-sided pressure-sensitive adhesive sheet.
  • the release film for protecting an adhesive layer was laminated
  • the obtained double-sided PSA sheet was cut into a flat rectangular shape of 50 mm x 100 mm to produce a test piece, and the release film was peeled off. After immersing the test piece in ethyl acetate at 23 ° C. for 24 hours, the test piece was taken out from ethyl acetate and dried at 110 ° C. for 1 hour. The weight of the test piece after drying was measured, and the gel fraction was calculated using the following formula (1).
  • Dynamic viscoelasticity test (3) In the same manner as in the production of the double-sided pressure-sensitive adhesive sheet, the pressure-sensitive adhesive layer after drying the pressure-sensitive adhesive solution on a PET film having a thickness of 50 ⁇ m is 100 ⁇ m. After coating, it was dried at 70 ° C. for 10 minutes. Ten sheets were prepared and laminated one after another to produce a 1 mm thick laminate, and then cut into a size of 6 mm ⁇ 10 mm to obtain a measurement sample. The measurement sample was measured using a master curve measurement program of a dynamic viscoelasticity measuring apparatus (DVA-200, manufactured by IT Measurement Control Co., Ltd.). The measurement mode was a shear method, and the reference temperature was 25 ° C. The peak frequency of tan ⁇ was calculated from the obtained master curve.
  • DVA-200 dynamic viscoelasticity measuring apparatus
  • Adhesive strength The obtained double-sided pressure-sensitive adhesive sheet was cut into a strip having a width of 25 mm to prepare a test piece, and one release film was peeled off to expose the pressure-sensitive adhesive layer. After placing this test piece on a polycarbonate resin plate so that the pressure-sensitive adhesive layer faces the polycarbonate resin plate, a test was performed by reciprocating a 2 kg rubber roller on the test piece at a speed of 300 mm / min. The piece and the polycarbonate resin plate were bonded together, and then allowed to stand at 23 ° C. for 30 minutes to prepare a test sample. This test sample was subjected to a tensile test in the 90 ° direction at a peeling speed of 300 mm / min according to JIS Z0237, and the adhesive strength (N / 25 mm) was measured.
  • FIG. 2 is a schematic diagram showing a method for evaluating the shear deviation length of the double-sided PSA sheet.
  • the obtained double-sided pressure-sensitive adhesive sheet was cut into a plane rectangular shape of 5 mm in length and 20 mm in width to produce a test piece, and the release films on both sides were peeled and removed (referred to as test piece B).
  • test piece B As shown in FIG. 2, a PET film C having a thickness of 25 ⁇ m is formed on the adhesive layer on the upper surface of the test piece B, and a metal base D (manufactured by SUS) having a length of 100 mm and a width of 20 mm is formed on the adhesive layer on the lower surface.
  • a test sample was prepared by pasting each of them.
  • the PET film C on the upper surface of this test sample was pulled by a weight E in the horizontal direction (arrow direction) with a load of 200 g for 3 minutes. The measurement was performed at 23 ° C. Thereafter, one end (fixing jig) of the pressure-sensitive adhesive layer bonded to the PET film C on the upper surface with reference to the position of one end (end on the fixing jig side) of the pressure-sensitive adhesive layer bonded to the metal base D on the lower surface. The distance L in which the side edge) was shifted in the pulling direction of the PET film C on the upper surface was measured.
  • the upper surface PET film C was affixed on the adhesive layer of the test piece B so that the adhesive layer adhering to the metal pedestal D on the lower surface and the PET film C on the upper surface were flush with each other.
  • the detector (not shown) which can measure the moving amount
  • FIG. 3 is a schematic diagram showing a method for evaluating the resilience of the double-sided PSA sheet.
  • the obtained double-sided pressure-sensitive adhesive sheet was cut into a flat rectangular shape of 25 mm wide ⁇ 150 mm long to produce a test piece, and the release films on both sides were peeled and removed (referred to as test piece 6).
  • test piece 6 As shown in FIG. 3, an aluminum plate 7 having a width of 25 mm, a length of 150 mm, and a thickness of 0.3 mm was superimposed on the upper surface of the test piece 6, and a polycarbonate resin plate 8 having a width of 25 mm, a length of 200 mm, and a thickness of 1 mm was superimposed on the lower surface.
  • test piece 6 may be located in the center part of the length direction of the polycarbonate resin board 8.
  • FIG. A 2 kg rubber roller is reciprocated once on the polycarbonate resin plate 8 at a speed of 300 mm / min to integrate the polycarbonate resin plate 8 and the aluminum plate 7 through the test piece 6, and then statically kept at 23 ° C. for 24 hours.
  • a test sample 9 was prepared. The test sample 9 is set on a jig 10 and bending stress is applied in the longitudinal direction of the test sample 9 so that the test sample 9 has an arc shape so that the distance between both ends in the length direction of the polycarbonate resin plate 8 is 180 mm. In this state, the test sample 9 was placed in an oven at 85 ° C. and allowed to stand for 24 hours.
  • the test sample 9 was taken out of the oven while being curved in an arc shape, and the height H of the floating between the aluminum plate 7 and the polycarbonate resin plate 8 was measured with a caliper.
  • the floating height H between the aluminum plate 7 and the polycarbonate resin plate 8 is the maximum value of the distance between the facing surfaces of the aluminum plate 7 and the polycarbonate resin plate 8 in the direction perpendicular to the upper surface of the jig 10.
  • a position where the thickness of the test piece 6 is subtracted from the distance between the facing surfaces of the aluminum plate 7 and the polycarbonate resin plate 8 in the direction perpendicular to the upper surface of the jig 10 is specified. .
  • the other release film was peeled and removed, and the center of the opening of the PC plate and the test piece were placed on a PC plate having an outer dimension of 80 ⁇ 115 mm and a thickness of 2 mm provided with an opening of 38 ⁇ 50 mm in the center. Gently place it so that it is almost coincident with the center, put a 5 kg weight from the top for 10 seconds and paste the two PC plates together, and then let stand at 23 ° C for 24 hours to perform adhesion curing and prepare a test sample did.
  • This test sample is set on a fixing jig so that the PC plate with the opening is on the upper surface, and a shock is applied by dropping a 300 g weight through the opening to the PC plate on the lower surface from a drop height of 5 cm. It was. When peeling was not recognized, the drop height was raised in steps of 5 cm, impact was applied again, and the drop height at which peeling was recognized was measured. The measurement was performed at 23 ° C.
  • the adhesive sheet for electronic devices which is high in impact-resistant adhesiveness, cannot be easily shifted even when a load is applied in the shearing direction, and is excellent in resilience can be provided.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention a pour objet une feuille adhésive pour des dispositifs électroniques, qui a une propriété de forte adhérence résistante au choc, qui est peu déplacée même lorsqu'une charge est appliquée sur la feuille adhésive dans la direction de cisaillement et qui a également une excellente résistance à la répulsion. La feuille adhésive pour des dispositifs électroniques selon la présente invention comprend une couche d'agent adhésif comprenant 100 parties en poids d'un copolymère acrylique et 20 à 35 parties en poids d'une résine conférant de l'adhésivité ayant un point de ramollissement inférieur ou égal à 110 °C et un indice d'hydroxyle alcoolique supérieur ou égal à 30, le copolymère acrylique étant produit par copolymérisation d'un mélange de monomères comprenant (a) 24,7 à 58,98 % en poids d'acrylate de 2-éthylhexyle, (b) 30 à 50 % en poids d'acrylate de butyle, (c) 10 à 20 % en poids d'acrylate de méthyle, (d) 1 à 5 % en poids d'acide acrylique et (e) 0,02 à 0,3 % en poids d'un (méth)acrylate ayant un groupe hydroxy et ayant une masse moléculaire moyenne en poids (Mw) supérieure ou égale à 800 000, la couche d'agent adhésif étant réticulée avec un agent de réticulation au point que la fraction de gel devienne de 20 à 50 %.
PCT/JP2014/071271 2013-09-10 2014-08-12 Feuille adhésive pour dispositifs electroniques WO2015037378A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020157032984A KR20160055105A (ko) 2013-09-10 2014-08-12 전자 기기용 점착 시트
JP2014541238A JP5703425B1 (ja) 2013-09-10 2014-08-12 電子機器用粘着シート
CN201480048935.5A CN105518094B (zh) 2013-09-10 2014-08-12 电子设备用粘合片

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013187630 2013-09-10
JP2013-187630 2013-09-10
JP2013-208414 2013-10-03
JP2013208414 2013-10-03

Publications (1)

Publication Number Publication Date
WO2015037378A1 true WO2015037378A1 (fr) 2015-03-19

Family

ID=52665497

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/071271 WO2015037378A1 (fr) 2013-09-10 2014-08-12 Feuille adhésive pour dispositifs electroniques

Country Status (5)

Country Link
JP (1) JP5703425B1 (fr)
KR (1) KR20160055105A (fr)
CN (1) CN105518094B (fr)
TW (1) TWI639674B (fr)
WO (1) WO2015037378A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016203510A1 (fr) * 2015-06-15 2016-12-22 株式会社寺岡製作所 Composition adhésive sensible à la pression et ruban adhésif sensible à la pression
JP2018177902A (ja) * 2017-04-07 2018-11-15 綜研化学株式会社 粘着剤組成物および粘着シート
WO2022131163A1 (fr) * 2020-12-18 2022-06-23 日東電工株式会社 Feuille adhésive
JP2022141932A (ja) * 2020-12-18 2022-09-29 日東電工株式会社 粘着シート
JP7321328B1 (ja) 2022-07-04 2023-08-04 日東電工株式会社 粘着シート
JP7321344B1 (ja) 2022-09-13 2023-08-04 日東電工株式会社 粘着シート

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017073722A1 (fr) * 2015-10-30 2017-05-04 積水化学工業株式会社 Bande adhésive double face sensible à la pression
JP6205081B1 (ja) * 2016-08-10 2017-09-27 日東電工株式会社 粘着シート
CN113980612A (zh) * 2016-12-20 2022-01-28 Dic株式会社 粘合带及其制造方法
JP6921572B2 (ja) * 2017-03-23 2021-08-18 綜研化学株式会社 粘着シート
CN111073558A (zh) * 2019-12-30 2020-04-28 苏州赛伍应用技术股份有限公司 一种高抗剪切的丙烯酸酯压敏胶、压敏胶带及其制备方法
CN114787309A (zh) * 2020-02-10 2022-07-22 积水化学工业株式会社 粘合带
CN111440572A (zh) * 2020-05-22 2020-07-24 苏州世华新材料科技股份有限公司 抗冲击型聚丙烯酸酯压敏胶层、制备方法及压敏胶带

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073235A (ja) * 1993-06-18 1995-01-06 Nippon Synthetic Chem Ind Co Ltd:The 粘着剤組成物
JP2004224873A (ja) * 2003-01-22 2004-08-12 Nippon Carbide Ind Co Inc 偏光フィルム用感圧接着剤組成物
JP2007138013A (ja) * 2005-11-18 2007-06-07 Toyo Ink Mfg Co Ltd 両面粘着シート及びそれを用いた部材の製造方法
JP2010174087A (ja) * 2009-01-28 2010-08-12 Lintec Corp 再剥離用粘着剤組成物及び粘着シート
JP2013151641A (ja) * 2011-12-27 2013-08-08 Toyo Ink Sc Holdings Co Ltd 発泡体用粘着剤

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140405A (ja) * 1997-11-04 1999-05-25 Mitsubishi Rayon Co Ltd 粘着剤用樹脂
JP2005187538A (ja) * 2003-12-24 2005-07-14 Nippon Shokubai Co Ltd 粘着剤組成物
JP4837311B2 (ja) * 2005-06-21 2011-12-14 リンテック株式会社 血液バック用粘着シート
CN101622322B (zh) * 2007-03-09 2012-05-30 积水化学工业株式会社 粘合剂、双面粘合片及显示装置
DE102008059050A1 (de) * 2008-11-26 2010-05-27 Tesa Se Thermisch vernetzende Polyacrylate und Verfahren zu deren Herstellung
CN103168083B (zh) * 2010-10-12 2015-11-25 日本合成化学工业株式会社 光学构件用粘合剂组合物、光学构件用粘合剂、带粘合剂层的光学构件和图像显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073235A (ja) * 1993-06-18 1995-01-06 Nippon Synthetic Chem Ind Co Ltd:The 粘着剤組成物
JP2004224873A (ja) * 2003-01-22 2004-08-12 Nippon Carbide Ind Co Inc 偏光フィルム用感圧接着剤組成物
JP2007138013A (ja) * 2005-11-18 2007-06-07 Toyo Ink Mfg Co Ltd 両面粘着シート及びそれを用いた部材の製造方法
JP2010174087A (ja) * 2009-01-28 2010-08-12 Lintec Corp 再剥離用粘着剤組成物及び粘着シート
JP2013151641A (ja) * 2011-12-27 2013-08-08 Toyo Ink Sc Holdings Co Ltd 発泡体用粘着剤

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016203510A1 (fr) * 2015-06-15 2016-12-22 株式会社寺岡製作所 Composition adhésive sensible à la pression et ruban adhésif sensible à la pression
JPWO2016203510A1 (ja) * 2015-06-15 2018-01-25 株式会社寺岡製作所 粘着剤組成物及び粘着テープ
JP2018177902A (ja) * 2017-04-07 2018-11-15 綜研化学株式会社 粘着剤組成物および粘着シート
JP2022141932A (ja) * 2020-12-18 2022-09-29 日東電工株式会社 粘着シート
JP2022096692A (ja) * 2020-12-18 2022-06-30 日東電工株式会社 粘着シート
JP7114685B2 (ja) 2020-12-18 2022-08-08 日東電工株式会社 粘着シート
WO2022131163A1 (fr) * 2020-12-18 2022-06-23 日東電工株式会社 Feuille adhésive
JP7176153B2 (ja) 2020-12-18 2022-11-21 日東電工株式会社 粘着シート
JP7321328B1 (ja) 2022-07-04 2023-08-04 日東電工株式会社 粘着シート
WO2024009531A1 (fr) * 2022-07-04 2024-01-11 日東電工株式会社 Feuille adhésive
JP2024006795A (ja) * 2022-07-04 2024-01-17 日東電工株式会社 粘着シート
JP7321344B1 (ja) 2022-09-13 2023-08-04 日東電工株式会社 粘着シート
JP2024041000A (ja) * 2022-09-13 2024-03-26 日東電工株式会社 粘着シート

Also Published As

Publication number Publication date
KR20160055105A (ko) 2016-05-17
JP5703425B1 (ja) 2015-04-22
CN105518094B (zh) 2019-04-05
CN105518094A (zh) 2016-04-20
TW201510168A (zh) 2015-03-16
JPWO2015037378A1 (ja) 2017-03-02
TWI639674B (zh) 2018-11-01

Similar Documents

Publication Publication Date Title
JP5703425B1 (ja) 電子機器用粘着シート
JP4555882B2 (ja) 両面粘着シート及び表示装置
TWI478997B (zh) Adhesive tape, laminated body and image display device
JP2010065095A (ja) 粘着剤、両面粘着シート及び表示装置
JP2015212326A (ja) 光学フィルム固定用両面粘着テープ
JP6984125B2 (ja) 薄型粘着テープ
TWI843788B (zh) 黏著片材
JP6043240B2 (ja) 電子機器用粘着シート
JP6412453B2 (ja) 粘着剤組成物及び粘着テープ
JP6411127B2 (ja) アクリル粘着剤及び電子機器用粘着シート
JP5483843B2 (ja) 両面粘着テープ及び液晶表示装置
JP6204845B2 (ja) 電子機器用粘着シート
JP6511314B2 (ja) 粘着テープ
JP2019214739A (ja) アクリル粘着剤及び電子機器用粘着シート
JP7201397B2 (ja) 粘着付与樹脂、アクリル粘着剤及び粘着テープ
JP2015040215A (ja) タッチパネル用粘着剤組成物及びタッチパネル用粘着テープ
CN109852267B (zh) 粘合片
JP7474118B2 (ja) 粘着剤及び粘着テープ
JP6578422B2 (ja) アクリル粘着剤及び電子機器用粘着シート
JP5386792B2 (ja) 粘着剤組成物及びこれを用いた粘着シート
JP7176897B2 (ja) 粘着剤及び粘着テープ
JP7176898B2 (ja) アクリル粘着剤及び粘着テープ
CN113260689A (zh) 粘合剂组合物及粘合带
WO2023145567A1 (fr) Ruban adhésif
JP7327701B1 (ja) 両面粘着シートおよび画像表示装置用積層体

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2014541238

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14843432

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20157032984

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14843432

Country of ref document: EP

Kind code of ref document: A1