KR20210025554A - 리튬 이온 2차 배터리의 음극 집전 장치용 구리 호일 - Google Patents
리튬 이온 2차 배터리의 음극 집전 장치용 구리 호일 Download PDFInfo
- Publication number
- KR20210025554A KR20210025554A KR1020210024954A KR20210024954A KR20210025554A KR 20210025554 A KR20210025554 A KR 20210025554A KR 1020210024954 A KR1020210024954 A KR 1020210024954A KR 20210024954 A KR20210024954 A KR 20210024954A KR 20210025554 A KR20210025554 A KR 20210025554A
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- electrodeposited copper
- negative electrode
- ion secondary
- mpa
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 129
- 239000011889 copper foil Substances 0.000 title claims abstract description 125
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910001416 lithium ion Inorganic materials 0.000 title claims abstract description 31
- 230000008021 deposition Effects 0.000 claims description 10
- 239000007773 negative electrode material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 description 27
- 239000011800 void material Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 16
- 239000011149 active material Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 10
- 239000003792 electrolyte Substances 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 229910000365 copper sulfate Inorganic materials 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
- 239000011162 core material Substances 0.000 description 6
- 230000001351 cycling effect Effects 0.000 description 6
- 239000011267 electrode slurry Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229920002873 Polyethylenimine Polymers 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010924 continuous production Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229940081974 saccharin Drugs 0.000 description 3
- 235000019204 saccharin Nutrition 0.000 description 3
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 3
- REEBJQTUIJTGAL-UHFFFAOYSA-N 3-pyridin-1-ium-1-ylpropane-1-sulfonate Chemical compound [O-]S(=O)(=O)CCC[N+]1=CC=CC=C1 REEBJQTUIJTGAL-UHFFFAOYSA-N 0.000 description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- 241000156302 Porcine hemagglutinating encephalomyelitis virus Species 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- -1 azole compound Chemical class 0.000 description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000009795 derivation Methods 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000007774 positive electrode material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- ZMCHBSMFKQYNKA-UHFFFAOYSA-N 2-aminobenzenesulfonic acid Chemical compound NC1=CC=CC=C1S(O)(=O)=O ZMCHBSMFKQYNKA-UHFFFAOYSA-N 0.000 description 1
- VPXCXBHLKDPWQV-UHFFFAOYSA-N 5-amino-2-chlorobenzenesulfonic acid Chemical compound NC1=CC=C(Cl)C(S(O)(=O)=O)=C1 VPXCXBHLKDPWQV-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000009500 colour coating Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000002283 diesel fuel Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 239000003502 gasoline Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000009304 pastoral farming Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VRKNGZAPJYUNSN-UHFFFAOYSA-M sodium;3-(1,3-benzothiazol-2-ylsulfanyl)propane-1-sulfonate Chemical compound [Na+].C1=CC=C2SC(SCCCS(=O)(=O)[O-])=NC2=C1 VRKNGZAPJYUNSN-UHFFFAOYSA-M 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/0438—Processes of manufacture in general by electrochemical processing
- H01M4/0469—Electroforming a self-supporting electrode; Electroforming of powdered electrode material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/70—Carriers or collectors characterised by shape or form
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/28—Multiple coating on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/08—Deposition of black chromium, e.g. hexavalent chromium, CrVI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M2004/021—Physical characteristics, e.g. porosity, surface area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
- H01M2004/027—Negative electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Secondary Cells (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
도 1은 연강(mild steel)과 같은 물질에 대한 응력-변형률 플롯을 도시한다.
도 2는 고강도강 또는 스테인레스강과 같은 물질에 대한 응력-변형률 플롯을 도시한다.
도 3은 얇은 구리 호일과 같은 저강도 금속에 대한 응력-변형률 플롯을 도시한다.
도 4는 항복 강도를 정량화하기 위한 하중 하 신장 방법을 나타내는 응력-변형률 플롯을 도시한다.
도 5는 3D 표면 플롯 및 물질비 플롯을 도시한다.
도 6은 물질비 플롯의 세부사항을 도시한다.
본 개시는 다양한 변형 및 대안적인 형태에 영향을 받기 쉽다. 일부 대표적인 실시양태가 도면에 예로서 도시되어 있으며 본원에서 상세하게 설명될 것이다. 그러나, 본 개시는 개시된 특정 형태로 제한되도록 의도되지 않았다는 것이 이해되어야 한다. 오히려, 본 개시는 첨부된 청구범위에 의해 정의된 바와 같이 본 개시의 요지 및 범위 내에 속하는 모든 수정, 등가물 및 대안을 포괄하는 것이다.
Claims (12)
- 드럼면(drum side); 및
이러한 드럼면과 마주하는 침착면(deposited side)을 포함하는 전착된 구리 호일(electrodeposited copper foil)로서,
드럼면 및 침착면이 각각 잔류 응력을 가지며, 전착된 구리 호일의 드럼면과 침착면 사이의 잔류 응력의 차이가 7.4 내지 95 MPa의 범위 내의 크기를 갖고,
전착된 구리 호일의 항복 강도(yield strength)가 11 kg/mm2 내지 45 kg/mm2의 범위 내인, 전착된 구리 호일. - 제1항에 있어서, 전착된 구리 호일의 항복 강도가 16 kg/mm2 내지 36 kg/mm2의 범위 내인, 전착된 구리 호일.
- 제1항에 있어서, 전착된 구리 호일의 드럼면과 침착면 사이의 잔류 응력의 차이가 7.4 내지 85 MPa의 범위 내인, 전착된 구리 호일.
- 제1항에 있어서, 전착된 구리 호일의 드럼면과 침착면 사이의 잔류 응력의 차이가 7.4 내지 81 MPa의 범위 내인, 전착된 구리 호일.
- 제1항에 있어서, 전착된 구리 호일의 침착면 상의 잔류 응력이 -40 MPa 내지 100 MPa의 범위 내인, 전착된 구리 호일.
- 제1항에 있어서, 전착된 구리 호일의 드럼면 상의 잔류 응력이 -47 MPa 내지 42 MPa의 범위 내인, 전착된 구리 호일.
- 제1항에 있어서, 두께가 3 ㎛ 내지 20 ㎛인, 전착된 구리 호일.
- 제1항의 전착된 구리 호일을 포함하는 음극 집전체.
- 제8항의 음극 집전체를 포함하고 이러한 음극 집전체 위에 코팅된 음극 활성 물질을 추가로 포함하는 음극.
- 제9항의 음극을 포함하는 리튬-이온 2차 배터리.
- 제10항에 있어서, 충전-방전 사이클 수명이 적어도 900을 나타내는, 리튬-이온 2차 배터리.
- 제11항의 리튬-이온 2차 배터리를 포함하는 디바이스(device).
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962800263P | 2019-02-01 | 2019-02-01 | |
US62/800,263 | 2019-02-01 | ||
US16/429,921 US10581081B1 (en) | 2019-02-01 | 2019-06-03 | Copper foil for negative electrode current collector of lithium ion secondary battery |
US16/429,921 | 2019-06-03 | ||
KR1020200005565A KR102228476B1 (ko) | 2019-02-01 | 2020-01-15 | 리튬 이온 2차 배터리의 음극 집전 장치용 구리 호일 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200005565A Division KR102228476B1 (ko) | 2019-02-01 | 2020-01-15 | 리튬 이온 2차 배터리의 음극 집전 장치용 구리 호일 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20210025554A true KR20210025554A (ko) | 2021-03-09 |
KR102365656B1 KR102365656B1 (ko) | 2022-02-23 |
Family
ID=69645662
Family Applications (13)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200005542A KR102222382B1 (ko) | 2019-02-01 | 2020-01-15 | 저 전도 손실 구리 호일 |
KR1020217000627A KR102486639B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 동박 및 동박 기판 |
KR1020200005565A KR102228476B1 (ko) | 2019-02-01 | 2020-01-15 | 리튬 이온 2차 배터리의 음극 집전 장치용 구리 호일 |
KR1020207037996A KR102567837B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 동박 및 동박 기판 |
KR1020200005337A KR102250785B1 (ko) | 2019-02-01 | 2020-01-15 | 저 프로파일을 갖는 전해 구리 호일 |
KR1020217003753A KR102269105B1 (ko) | 2019-02-01 | 2020-01-15 | 전착 동박, 이를 포함하는 집전체, 전극, 및 리튬 이온 이차 전지 |
KR1020217009202A KR102519446B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 동박 및 동박 기판 |
KR1020217001664A KR102319043B1 (ko) | 2019-02-01 | 2020-01-15 | 전착 동박, 및 이를 포함하는 전극 및 리튬 이온 이차 전지 |
KR1020200005476A KR102245180B1 (ko) | 2019-02-01 | 2020-01-15 | 전송 손실이 적은 인쇄 회로 기판용 전해 구리 호일 |
KR1020200005475A KR102289847B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 구리 호일 |
KR1020217000028A KR102567838B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 동박 및 동박 기판 |
KR1020200005338A KR102253481B1 (ko) | 2019-02-01 | 2020-01-15 | 우수한 접착성을 갖는 구리 호일 |
KR1020210024954A KR102365656B1 (ko) | 2019-02-01 | 2021-02-24 | 리튬 이온 2차 배터리의 음극 집전 장치용 구리 호일 |
Family Applications Before (12)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200005542A KR102222382B1 (ko) | 2019-02-01 | 2020-01-15 | 저 전도 손실 구리 호일 |
KR1020217000627A KR102486639B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 동박 및 동박 기판 |
KR1020200005565A KR102228476B1 (ko) | 2019-02-01 | 2020-01-15 | 리튬 이온 2차 배터리의 음극 집전 장치용 구리 호일 |
KR1020207037996A KR102567837B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 동박 및 동박 기판 |
KR1020200005337A KR102250785B1 (ko) | 2019-02-01 | 2020-01-15 | 저 프로파일을 갖는 전해 구리 호일 |
KR1020217003753A KR102269105B1 (ko) | 2019-02-01 | 2020-01-15 | 전착 동박, 이를 포함하는 집전체, 전극, 및 리튬 이온 이차 전지 |
KR1020217009202A KR102519446B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 동박 및 동박 기판 |
KR1020217001664A KR102319043B1 (ko) | 2019-02-01 | 2020-01-15 | 전착 동박, 및 이를 포함하는 전극 및 리튬 이온 이차 전지 |
KR1020200005476A KR102245180B1 (ko) | 2019-02-01 | 2020-01-15 | 전송 손실이 적은 인쇄 회로 기판용 전해 구리 호일 |
KR1020200005475A KR102289847B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 구리 호일 |
KR1020217000028A KR102567838B1 (ko) | 2019-02-01 | 2020-01-15 | 표면 처리된 동박 및 동박 기판 |
KR1020200005338A KR102253481B1 (ko) | 2019-02-01 | 2020-01-15 | 우수한 접착성을 갖는 구리 호일 |
Country Status (12)
Country | Link |
---|---|
US (8) | US10581081B1 (ko) |
EP (4) | EP3808876B1 (ko) |
JP (12) | JP7082240B2 (ko) |
KR (13) | KR102222382B1 (ko) |
CN (14) | CN111526659B (ko) |
ES (4) | ES2899082T3 (ko) |
HU (4) | HUE062335T2 (ko) |
MY (1) | MY196202A (ko) |
PH (5) | PH12021551726A1 (ko) |
PL (4) | PL3690083T3 (ko) |
TW (13) | TWI715417B (ko) |
WO (6) | WO2020156186A1 (ko) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11251430B2 (en) | 2018-03-05 | 2022-02-15 | The Research Foundation For The State University Of New York | ϵ-VOPO4 cathode for lithium ion batteries |
US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
CN119332315A (zh) * | 2019-07-26 | 2025-01-21 | 东洋钢钣株式会社 | 粗化镀镍材料及其制造方法 |
TWI740515B (zh) | 2019-12-23 | 2021-09-21 | 長春人造樹脂廠股份有限公司 | 液晶高分子膜及包含其之積層板 |
TWI697549B (zh) | 2019-12-23 | 2020-07-01 | 長春人造樹脂廠股份有限公司 | 液晶高分子膜及包含其之積層板 |
JPWO2022085371A1 (ko) * | 2020-10-22 | 2022-04-28 | ||
CN112981473B (zh) * | 2021-02-05 | 2021-11-23 | 广东嘉元科技股份有限公司 | 一种电解铜箔及其制备方法 |
CN113066767B (zh) * | 2021-03-05 | 2022-01-25 | 南通越亚半导体有限公司 | 临时承载板及其制作方法和封装基板的制造方法 |
WO2022244826A1 (ja) * | 2021-05-20 | 2022-11-24 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
WO2022244827A1 (ja) * | 2021-05-20 | 2022-11-24 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
JP7366436B2 (ja) * | 2021-05-31 | 2023-10-23 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
JPWO2022255420A1 (ko) * | 2021-06-03 | 2022-12-08 | ||
TWI760249B (zh) | 2021-06-16 | 2022-04-01 | 長春石油化學股份有限公司 | 電解銅箔及銅箔基板 |
US12060647B2 (en) | 2021-07-06 | 2024-08-13 | Chang Chun Petrochemical Co., Ltd. | Surface-treated copper foil and copper clad laminate |
TWI809441B (zh) * | 2021-07-06 | 2023-07-21 | 長春石油化學股份有限公司 | 表面處理銅箔及銅箔基板 |
CN115589667B (zh) * | 2021-07-06 | 2023-09-08 | 长春石油化学股份有限公司 | 表面处理铜箔及铜箔基板 |
US11540389B1 (en) | 2021-07-06 | 2022-12-27 | Chang Chun Petrochemical Co., Ltd. | Surface-treated copper foil and copper clad laminate |
CN115413119B (zh) * | 2021-07-06 | 2023-03-24 | 长春石油化学股份有限公司 | 表面处理铜箔及铜箔基板 |
JPWO2023281774A1 (ko) * | 2021-07-09 | 2023-01-12 | ||
KR20230113357A (ko) * | 2021-07-09 | 2023-07-28 | 제이엑스금속주식회사 | 표면 처리 구리박, 동장 적층판 및 프린트 배선판 |
KR20230121117A (ko) * | 2021-07-09 | 2023-08-17 | 제이엑스금속주식회사 | 표면 처리 구리박, 동장 적층판 및 프린트 배선판 |
KR102517417B1 (ko) | 2021-07-09 | 2023-04-03 | 주식회사 다이브 | 반도체용 동박의 제조방법 및 이를 이용한 반도체용 동박 |
JPWO2023281777A1 (ko) * | 2021-07-09 | 2023-01-12 | ||
TWI802226B (zh) * | 2021-07-09 | 2023-05-11 | 日商Jx金屬股份有限公司 | 表面處理銅箔、覆銅積層板及印刷配線板 |
WO2023057068A1 (en) * | 2021-10-07 | 2023-04-13 | Circuit Foil Luxembourg | Copper foil with high engery at break and secondary battery comprising the same |
US12036770B2 (en) | 2021-10-18 | 2024-07-16 | Chang Chun Petrochemical Co., Ltd. | Polymer film and uses of the same |
TWI778833B (zh) * | 2021-10-18 | 2022-09-21 | 長春石油化學股份有限公司 | 聚合物膜及其應用 |
TWI781818B (zh) * | 2021-11-05 | 2022-10-21 | 長春石油化學股份有限公司 | 表面處理銅箔及銅箔基板 |
US12222201B2 (en) | 2021-12-22 | 2025-02-11 | Mitsui Mining & Smelting Co., Ltd. | Method for measuring surface parameter of copper foil, method for sorting copper foil, and method for producing surface-treated copper foil |
LU501394B1 (en) | 2022-02-07 | 2023-08-07 | Circuit Foil Luxembourg | Surface-treated copper foil for high-frequency circuit and method for producing the same |
CN114657610A (zh) * | 2022-03-28 | 2022-06-24 | 电子科技大学 | 一种可剥离超薄载体铜箔的制备方法 |
GB2618129A (en) * | 2022-04-28 | 2023-11-01 | Airbus Operations Ltd | Multi-material joint |
CN114990654B (zh) * | 2022-06-02 | 2024-04-26 | 山东金宝电子有限公司 | 一种电解铜箔表面处理工艺与hvlp铜箔产品及其应用 |
CN119452124A (zh) * | 2022-09-28 | 2025-02-14 | Jx金属株式会社 | 表面处理铜箔、覆铜积层板及印刷线路板 |
WO2024070248A1 (ja) * | 2022-09-28 | 2024-04-04 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2024070247A1 (ja) * | 2022-09-28 | 2024-04-04 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
TWI858925B (zh) * | 2023-09-18 | 2024-10-11 | 南亞塑膠工業股份有限公司 | 鋰電池負極的製造方法 |
CN117737653B (zh) * | 2023-12-19 | 2024-08-16 | 深圳市知音科技有限公司 | 可剥铜载板及其制备方法以及其在先进封装中的应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006253345A (ja) * | 2005-03-10 | 2006-09-21 | Furukawa Circuit Foil Kk | 高純度電解銅箔及びその製造方法 |
JP2016009526A (ja) * | 2014-06-20 | 2016-01-18 | 古河電気工業株式会社 | 全固体電池用負極集電体及び全固体電池 |
KR20180080512A (ko) * | 2017-01-04 | 2018-07-12 | 케이씨에프테크놀로지스 주식회사 | 최적화된 피크 조도를 갖는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
Family Cites Families (136)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3927208A (en) * | 1973-05-14 | 1975-12-16 | Rit Rech Ind Therapeut | Live bovine adenovirus vaccines, preparation thereof and method of vaccination using them |
US4876899A (en) | 1988-10-31 | 1989-10-31 | Texas Instruments Incorporated | Torque sensing device |
JPH0787270B2 (ja) | 1992-02-19 | 1995-09-20 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
JP3500072B2 (ja) | 1998-07-27 | 2004-02-23 | 新日本製鐵株式会社 | 電解金属箔製造ドラム用チタン材およびその製造方法 |
JP2000119892A (ja) | 1998-10-12 | 2000-04-25 | Sumitomo Metal Mining Co Ltd | 電気銅の製造方法およびこの方法により得られた電気銅 |
JP3850155B2 (ja) | 1998-12-11 | 2006-11-29 | 日本電解株式会社 | 電解銅箔、二次電池の集電体用銅箔及び二次電池 |
JP2001192879A (ja) | 2000-01-13 | 2001-07-17 | Sumitomo Metal Mining Co Ltd | 電気銅製造用の種板成形ロールおよびそれを用いて成形された電気銅製造用の種板、ならびに該種板を用いて電気銅を製造する方法および該方法により得られた電気銅 |
JP4441642B2 (ja) | 2000-12-27 | 2010-03-31 | 三井金属鉱業株式会社 | 電解銅箔製造用のチタン製カソード電極、そのチタン製カソード電極を用いた回転陰極ドラム、チタン製カソード電極に用いるチタン材の製造方法及びチタン製カソード電極用チタン材の矯正加工方法 |
JP3850321B2 (ja) | 2002-03-19 | 2006-11-29 | 日本電解株式会社 | 二次電池 |
JP4094395B2 (ja) | 2002-04-10 | 2008-06-04 | 新日本製鐵株式会社 | 電解Cu箔製造ドラム用チタン板およびその製造方法 |
TW200403358A (en) * | 2002-08-01 | 2004-03-01 | Furukawa Circuit Foil | Electrodeposited copper foil and electrodeposited copper foil for secondary battery collector |
TW200424359A (en) | 2003-02-04 | 2004-11-16 | Furukawa Circuit Foil | Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil |
JP4061211B2 (ja) | 2003-02-20 | 2008-03-12 | 新日本製鐵株式会社 | 電解銅箔製造用カソード電極に用いるチタン合金及びその製造方法 |
JP4273309B2 (ja) | 2003-05-14 | 2009-06-03 | 福田金属箔粉工業株式会社 | 低粗面電解銅箔及びその製造方法 |
JPWO2004113966A1 (ja) * | 2003-06-18 | 2006-08-03 | 旭化成株式会社 | 反射防止膜 |
JP4567360B2 (ja) | 2004-04-02 | 2010-10-20 | 三井金属鉱業株式会社 | 銅箔の製造方法及びその製造方法で得られる銅箔 |
JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
DE102004056879B4 (de) * | 2004-10-27 | 2008-12-04 | Curamik Electronics Gmbh | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
CN2752274Y (zh) | 2004-12-29 | 2006-01-18 | 北京远创铜箔设备有限公司 | 制备铜箔的电解装置 |
TW200738913A (en) | 2006-03-10 | 2007-10-16 | Mitsui Mining & Smelting Co | Surface treated elctrolytic copper foil and process for producing the same |
WO2007145164A1 (ja) | 2006-06-12 | 2007-12-21 | Nippon Mining & Metals Co., Ltd. | 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法 |
JP4743020B2 (ja) | 2006-06-26 | 2011-08-10 | ソニー株式会社 | 電極集電体及びその製造方法、電池用電極及びその製造方法、並びに二次電池 |
CN1995469B (zh) | 2006-11-28 | 2011-06-15 | 山东金宝电子股份有限公司 | 高温高延展电解铜箔制造工艺 |
WO2008111315A1 (ja) * | 2007-03-13 | 2008-09-18 | Panasonic Corporation | リチウム二次電池用負極およびその製造方法、ならびにリチウム二次電池用負極を備えたリチウム二次電池 |
MY158819A (en) | 2007-04-20 | 2016-11-15 | Jx Nippon Mining & Metals Corp | Electrolytic copper foil for lithium rechargeable battery and process for producing the copper foil |
CN101302635B (zh) | 2008-01-18 | 2010-12-08 | 梁国柱 | 钢铁件酸性预镀铜电镀添加剂及预镀工艺 |
TWI434965B (zh) | 2008-05-28 | 2014-04-21 | Mitsui Mining & Smelting Co | A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method |
JP5235542B2 (ja) | 2008-07-15 | 2013-07-10 | キヤノン株式会社 | 像振れ補正装置またはそれを備えたレンズ装置、撮像装置並びに像振れ補正装置の制御方法 |
WO2010027052A1 (ja) | 2008-09-05 | 2010-03-11 | 古河電気工業株式会社 | キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板 |
FR2938522B1 (fr) | 2008-11-20 | 2010-12-17 | Inst Francais Du Petrole | Procede de production d'hydrogene avec captation totale du co2 et recyclage du methane non converti |
JP5437155B2 (ja) | 2009-05-08 | 2014-03-12 | 古河電気工業株式会社 | 2次電池用負極、電極用銅箔、2次電池および2次電池用負極の製造方法 |
US20120189859A1 (en) | 2009-07-24 | 2012-07-26 | Pi R&D Co., Ltd. | Resin composite electrolytic copper foil, copper clad laminate and printed wiring board |
JP4927963B2 (ja) | 2010-01-22 | 2012-05-09 | 古河電気工業株式会社 | 表面処理銅箔、その製造方法及び銅張積層基板 |
JP5103496B2 (ja) | 2010-03-09 | 2012-12-19 | 日立ビークルエナジー株式会社 | リチウムイオン二次電池 |
JP2011192879A (ja) | 2010-03-16 | 2011-09-29 | Toshiba Corp | 不揮発性記憶装置および不揮発性記憶装置の製造方法 |
CN102234823B (zh) | 2010-04-28 | 2013-11-06 | 长春石油化学股份有限公司 | 用于制造电解铜箔的铜料以及电解铜箔的制造方法 |
MY161040A (en) | 2010-05-07 | 2017-04-14 | Jx Nippon Mining & Metals Corp | Copper foil for printed circuit |
TWI417424B (zh) * | 2010-11-08 | 2013-12-01 | Chang Chun Petrochemical Co | 多孔性銅箔之製造方法 |
JP5617611B2 (ja) | 2010-12-27 | 2014-11-05 | 日立金属株式会社 | 引張強度に優れる複合金属箔 |
WO2012091060A1 (ja) | 2010-12-27 | 2012-07-05 | 古河電気工業株式会社 | リチウムイオン二次電池、その二次電池用電極、その二次電池の電極用電解銅箔 |
JP2012172198A (ja) | 2011-02-22 | 2012-09-10 | Jx Nippon Mining & Metals Corp | 電解銅箔及びその製造方法 |
EP2736093B1 (en) * | 2011-07-20 | 2018-01-10 | LG Chem, Ltd. | Separator, manufacturing method thereof, and electrochemical device employing same |
CN103392028B (zh) * | 2011-08-31 | 2016-01-06 | Jx日矿日石金属株式会社 | 附载体铜箔 |
CN102418129A (zh) | 2011-11-18 | 2012-04-18 | 山东金宝电子股份有限公司 | 一种高Tg、无卤素板用铜箔的表面处理工艺 |
JP2013133514A (ja) | 2011-12-27 | 2013-07-08 | Furukawa Electric Co Ltd:The | 銅箔、二次電池の電極、二次電池、並びにプリント回路基板 |
JP5886416B2 (ja) | 2012-03-29 | 2016-03-16 | Jx金属株式会社 | 表面処理銅箔 |
KR20130127031A (ko) | 2012-05-10 | 2013-11-22 | 현대자동차주식회사 | 금속 합금 전극 리튬이온 이차전지 음극소재 및 이의 제조 방법 |
JP2014015674A (ja) | 2012-06-11 | 2014-01-30 | Sh Copper Products Corp | 圧延銅箔、および銅張積層板 |
KR101716988B1 (ko) | 2012-09-10 | 2017-03-15 | 제이엑스금속주식회사 | 표면 처리 동박 및 그것을 사용한 적층판 |
JP6415033B2 (ja) | 2012-09-11 | 2018-10-31 | Jx金属株式会社 | キャリア付銅箔、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
JP5481577B1 (ja) * | 2012-09-11 | 2014-04-23 | Jx日鉱日石金属株式会社 | キャリア付き銅箔 |
KR20140034698A (ko) * | 2012-09-12 | 2014-03-20 | 주식회사 두산 | 동박의 표면처리 방법 및 그 방법으로 표면처리된 동박 |
JP5358739B1 (ja) | 2012-10-26 | 2013-12-04 | Jx日鉱日石金属株式会社 | キャリア付銅箔、それを用いた銅張積層板、プリント配線板、プリント回路板、及び、プリント配線板の製造方法 |
MY176308A (en) | 2012-11-26 | 2020-07-28 | Jx Nippon Mining & Metals Corp | Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic device |
CN102965698B (zh) | 2012-11-28 | 2015-09-09 | 山东金宝电子股份有限公司 | 低翘曲电解铜箔生产工艺 |
JP5578383B2 (ja) | 2012-12-28 | 2014-08-27 | Toto株式会社 | 耐プラズマ性部材 |
TWI539033B (zh) * | 2013-01-07 | 2016-06-21 | Chang Chun Petrochemical Co | Electrolytic copper foil and its preparation method |
CN104781973A (zh) | 2013-01-15 | 2015-07-15 | 松下知识产权经营株式会社 | 锂二次电池 |
TWI518210B (zh) | 2013-01-31 | 2016-01-21 | 三井金屬鑛業股份有限公司 | 電解銅箔、該電解銅箔之製造方法及使用該電解銅箔而得之表面處理銅箔 |
JP6116949B2 (ja) | 2013-03-14 | 2017-04-19 | 新光電気工業株式会社 | 発光素子搭載用の配線基板、発光装置、発光素子搭載用の配線基板の製造方法及び発光装置の製造方法 |
JP6403969B2 (ja) | 2013-03-29 | 2018-10-10 | Jx金属株式会社 | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 |
CN104125711B (zh) | 2013-04-26 | 2017-10-24 | Jx日矿日石金属株式会社 | 高频电路用铜箔、覆铜板、印刷布线板、带载体的铜箔、电子设备及印刷布线板的制造方法 |
JP6166614B2 (ja) * | 2013-07-23 | 2017-07-19 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
CN105408525B (zh) | 2013-07-23 | 2019-03-08 | Jx日矿日石金属株式会社 | 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法 |
KR101497824B1 (ko) | 2013-08-20 | 2015-03-04 | 고려대학교 산학협력단 | 리튬 이차 전지용 애노드, 이의 형성 방법 및 리튬 이차 전지 |
MY182166A (en) | 2013-09-20 | 2021-01-18 | Namics Corp | Copper foil, copper foil with carrier foil, and copper-clad laminate |
KR101502373B1 (ko) | 2013-10-14 | 2015-03-16 | 일진머티리얼즈 주식회사 | 전해동박, 이를 포함하는 전기부품 및 전지 |
KR101571060B1 (ko) | 2013-11-28 | 2015-11-24 | 일진머티리얼즈 주식회사 | 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법 |
JP5710737B1 (ja) | 2013-11-29 | 2015-04-30 | Jx日鉱日石金属株式会社 | 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器 |
TWI574589B (zh) | 2013-12-10 | 2017-03-11 | Jx Nippon Mining & Metals Corp | Manufacturing method of surface-treated copper foil, copper-clad laminate, printed wiring board, electronic machine and printed wiring board |
JP5810249B1 (ja) | 2014-01-07 | 2015-11-11 | 古河電気工業株式会社 | 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池、プリント配線板並びに電磁波シールド材 |
WO2015111756A1 (ja) | 2014-01-27 | 2015-07-30 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
TWI542739B (zh) | 2014-03-21 | 2016-07-21 | 長春石油化學股份有限公司 | 電解銅箔 |
WO2015151935A1 (ja) | 2014-03-31 | 2015-10-08 | 三井金属鉱業株式会社 | キャリア箔付銅箔、銅張積層板及びプリント配線板 |
TWI616122B (zh) | 2014-05-28 | 2018-02-21 | Jx Nippon Mining & Metals Corp | 表面處理銅箔、附載體銅箔、積層體、印刷配線板、電子機器、表面處理銅箔的製造方法及印刷配線板的製造方法 |
WO2016038923A1 (ja) * | 2014-09-09 | 2016-03-17 | 古河電気工業株式会社 | プリント配線板用銅箔及び銅張積層板 |
JP6867102B2 (ja) * | 2014-10-22 | 2021-04-28 | Jx金属株式会社 | 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法 |
JP5871443B1 (ja) | 2015-01-08 | 2016-03-01 | 古河電気工業株式会社 | 銅合金板材およびその製造方法 |
KR101852671B1 (ko) * | 2015-01-21 | 2018-06-04 | 제이엑스금속주식회사 | 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법 |
CN107135650A (zh) | 2015-01-23 | 2017-09-05 | 古河电气工业株式会社 | 金属构件与树脂模制件的复合体以及用于与树脂模制件形成复合体的金属构件 |
CN105986288A (zh) | 2015-02-28 | 2016-10-05 | 日进材料股份有限公司 | 电解铜箔、包含该电解铜箔的电气部件及电池 |
JP6014186B2 (ja) | 2015-03-03 | 2016-10-25 | イルジン マテリアルズ カンパニー リミテッドIljin Materials Co., Ltd. | 電解銅箔、これを含む電気部品および電池 |
US9899683B2 (en) * | 2015-03-06 | 2018-02-20 | Iljin Materials Co., Ltd. | Electrolytic copper foil, electric component and battery including the same |
EP3067442A1 (en) | 2015-03-09 | 2016-09-14 | Iljin Materials Co., Ltd. | Electrolytic copper foil, electric component and battery including the same |
KR102122425B1 (ko) | 2015-06-18 | 2020-06-12 | 케이씨에프테크놀로지스 주식회사 | 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지 |
JP6236120B2 (ja) | 2015-06-24 | 2017-11-22 | Jx金属株式会社 | キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
CN104992998B (zh) | 2015-06-30 | 2017-01-18 | 杭州福斯特光伏材料股份有限公司 | 一种晶硅组件用导热背板及其制备方法 |
JP6193534B2 (ja) | 2015-07-03 | 2017-09-06 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
JP6782561B2 (ja) | 2015-07-16 | 2020-11-11 | Jx金属株式会社 | キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
MY186397A (en) * | 2015-07-29 | 2021-07-22 | Namics Corp | Roughened copper foil, copper-clad laminate, and printed wiring board |
JP6190500B2 (ja) | 2015-08-06 | 2017-08-30 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6339636B2 (ja) | 2015-08-06 | 2018-06-06 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6200042B2 (ja) | 2015-08-06 | 2017-09-20 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6543141B2 (ja) * | 2015-09-01 | 2019-07-10 | Dowaメタルテック株式会社 | Snめっき材およびその製造方法 |
KR102473557B1 (ko) | 2015-09-24 | 2022-12-01 | 에스케이넥실리스 주식회사 | 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
JP6498091B2 (ja) | 2015-09-25 | 2019-04-10 | Jx金属株式会社 | 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器 |
WO2017051767A1 (ja) | 2015-09-25 | 2017-03-30 | 古河電気工業株式会社 | 電解銅箔、その電解銅箔を用いた各種製品 |
US9397343B1 (en) | 2015-10-15 | 2016-07-19 | Chang Chun Petrochemical Co., Ltd. | Copper foil exhibiting anti-swelling properties |
US9709348B2 (en) | 2015-10-27 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Heat-dissipating copper foil and graphene composite |
JP6115687B1 (ja) | 2015-11-05 | 2017-04-19 | 東レ株式会社 | 二軸配向ポリプロピレンフィルム、金属膜積層フィルムおよびフィルムコンデンサ |
JP6854114B2 (ja) * | 2016-01-04 | 2021-04-07 | Jx金属株式会社 | 表面処理銅箔 |
US9707738B1 (en) | 2016-01-14 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Copper foil and methods of use |
US10448507B2 (en) | 2016-01-15 | 2019-10-15 | Jx Nippon Mining & Metals Corporation | Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna |
WO2017179416A1 (ja) | 2016-04-14 | 2017-10-19 | 三井金属鉱業株式会社 | 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法 |
JP2017193778A (ja) * | 2016-04-15 | 2017-10-26 | Jx金属株式会社 | 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
US9673646B1 (en) | 2016-08-19 | 2017-06-06 | Chang Chun Petrochemical Co., Ltd. | Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board |
CN106350862B (zh) | 2016-08-30 | 2018-08-24 | 灵宝金源朝辉铜业有限公司 | 一种压延铜箔粗化处理方法 |
JP6783205B2 (ja) | 2016-09-06 | 2020-11-11 | タツタ電線株式会社 | 電磁波シールドフィルム |
JP6479254B2 (ja) | 2016-09-12 | 2019-03-06 | 古河電気工業株式会社 | 銅箔およびこれを有する銅張積層板 |
US10263257B2 (en) | 2016-09-22 | 2019-04-16 | Grst International Limited | Electrode assemblies |
KR20180040754A (ko) | 2016-10-12 | 2018-04-23 | 케이씨에프테크놀로지스 주식회사 | 핸들링이 용이한 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
KR101755203B1 (ko) * | 2016-11-11 | 2017-07-10 | 일진머티리얼즈 주식회사 | 이차전지용 전해동박 및 그의 제조방법 |
US9955588B1 (en) | 2016-11-28 | 2018-04-24 | Chang Chun Petrochemical Co., Ltd. | Multilayer carrier foil |
KR102268478B1 (ko) | 2016-12-14 | 2021-06-22 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박 및 동 클래드 적층판 |
KR102745621B1 (ko) | 2017-01-04 | 2024-12-20 | 에스케이넥실리스 주식회사 | 높은 내부식성을 갖고 활물질과의 접착력이 우수한 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
KR102725501B1 (ko) | 2017-01-13 | 2024-11-01 | 에스케이넥실리스 주식회사 | 울음 불량이 실질적으로 없는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
CN108345195B (zh) * | 2017-01-23 | 2021-11-26 | 住友橡胶工业株式会社 | 充电辊及其制造方法 |
US10057984B1 (en) | 2017-02-02 | 2018-08-21 | Chang Chun Petrochemical Co., Ltd. | Composite thin copper foil and carrier |
JP7193915B2 (ja) | 2017-02-03 | 2022-12-21 | Jx金属株式会社 | 表面処理銅箔並びにこれを用いた集電体、電極及び電池 |
JP2018138687A (ja) | 2017-02-24 | 2018-09-06 | 日立化成株式会社 | 接続構造、接続構造の製造方法、接続構造体及び半導体装置 |
TWI619851B (zh) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | 具近似絨毛狀銅瘤的電解銅箔與線路板組件的製造方法 |
TWI619850B (zh) | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | 電解液、電解銅箔及其製造方法 |
KR102136794B1 (ko) | 2017-03-09 | 2020-07-22 | 케이씨에프테크놀로지스 주식회사 | 우수한 밀착력을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
KR101809985B1 (ko) * | 2017-03-30 | 2017-12-18 | 와이엠티 주식회사 | 다공성 구리박의 제조방법 및 이를 이용한 다공성 구리박 |
CN108697006B (zh) | 2017-03-31 | 2021-07-16 | Jx金属株式会社 | 表面处理铜箔、附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法 |
JP7356209B2 (ja) * | 2017-03-31 | 2023-10-04 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
US10190225B2 (en) | 2017-04-18 | 2019-01-29 | Chang Chun Petrochemical Co., Ltd. | Electrodeposited copper foil with low repulsive force |
TW201900939A (zh) | 2017-05-09 | 2019-01-01 | 日商Jx金屬股份有限公司 | 電解銅箔、覆銅積層板、印刷配線板及其製造方法、以及電子機器及其製造方法 |
KR102433032B1 (ko) | 2017-07-31 | 2022-08-16 | 에스케이넥실리스 주식회사 | 주름 발생이 방지된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
US10424793B2 (en) * | 2017-11-14 | 2019-09-24 | Chang Chun Petrochemical Co., Ltd. | Electrodeposited copper foil and method for producing the same, and current collector for lithium secondary battery and secondary battery comprising the electrodeposited copper foil |
TWI652163B (zh) | 2017-11-15 | 2019-03-01 | 財團法人工業技術研究院 | 高頻電路用銅箔及其製造方法 |
US10205170B1 (en) | 2017-12-04 | 2019-02-12 | Chang Chun Petrochemical Co., Ltd. | Copper foil for current collector of lithium secondary battery |
US10337115B1 (en) | 2018-01-05 | 2019-07-02 | Chang Chun Petrochemical Co., Ltd. | Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making |
KR102500676B1 (ko) | 2018-02-02 | 2023-02-16 | 삼성디스플레이 주식회사 | 발광 표시 장치 |
JP2020052212A (ja) * | 2018-09-26 | 2020-04-02 | 富士ゼロックス株式会社 | 電子写真感光体、プロセスカートリッジ及び画像形成装置 |
US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
-
2019
- 2019-06-03 US US16/429,921 patent/US10581081B1/en active Active
- 2019-09-26 US US16/584,157 patent/US10622637B1/en active Active
- 2019-10-16 US US16/654,723 patent/US11145867B2/en active Active
- 2019-11-25 US US16/694,434 patent/US10765010B2/en active Active
- 2019-11-25 US US16/694,412 patent/US10787751B2/en active Active
- 2019-12-16 US US16/715,284 patent/US10772199B2/en active Active
-
2020
- 2020-01-15 CN CN202010040372.2A patent/CN111526659B/zh active Active
- 2020-01-15 JP JP2021500101A patent/JP7082240B2/ja active Active
- 2020-01-15 CN CN202080002048.XA patent/CN111936670B/zh active Active
- 2020-01-15 KR KR1020200005542A patent/KR102222382B1/ko active IP Right Grant
- 2020-01-15 TW TW109101361A patent/TWI715417B/zh active
- 2020-01-15 TW TW109101373A patent/TWI700394B/zh active
- 2020-01-15 PH PH1/2021/551726A patent/PH12021551726A1/en unknown
- 2020-01-15 PL PL20152064T patent/PL3690083T3/pl unknown
- 2020-01-15 CN CN202010040543.1A patent/CN111525138B/zh active Active
- 2020-01-15 CN CN202010043439.8A patent/CN111526660B/zh active Active
- 2020-01-15 JP JP2020004656A patent/JP6759476B2/ja active Active
- 2020-01-15 KR KR1020217000627A patent/KR102486639B1/ko active IP Right Grant
- 2020-01-15 TW TW109101365A patent/TWI719805B/zh active
- 2020-01-15 PL PL20749192.9T patent/PL3808876T3/pl unknown
- 2020-01-15 WO PCT/CN2020/072312 patent/WO2020156186A1/zh active Application Filing
- 2020-01-15 JP JP2021506268A patent/JP6983356B2/ja active Active
- 2020-01-15 JP JP2021540364A patent/JP7116848B2/ja active Active
- 2020-01-15 JP JP2021500102A patent/JP7065250B2/ja active Active
- 2020-01-15 TW TW109101360A patent/TWI707063B/zh active
- 2020-01-15 KR KR1020200005565A patent/KR102228476B1/ko active IP Right Grant
- 2020-01-15 EP EP20749192.9A patent/EP3808876B1/en active Active
- 2020-01-15 TW TW109101363A patent/TWI720783B/zh active
- 2020-01-15 CN CN202010040365.2A patent/CN111519215B/zh active Active
- 2020-01-15 PL PL20151885T patent/PL3690082T3/pl unknown
- 2020-01-15 EP EP20151885.9A patent/EP3690082B1/en active Active
- 2020-01-15 WO PCT/CN2020/072305 patent/WO2020156183A1/zh active Application Filing
- 2020-01-15 HU HUE20749195A patent/HUE062335T2/hu unknown
- 2020-01-15 HU HUE20152064A patent/HUE057222T2/hu unknown
- 2020-01-15 ES ES20152064T patent/ES2899082T3/es active Active
- 2020-01-15 CN CN202080002025.9A patent/CN111937197B/zh active Active
- 2020-01-15 CN CN202010040373.7A patent/CN111519216B/zh active Active
- 2020-01-15 CN CN202080006099.XA patent/CN112997590A/zh active Pending
- 2020-01-15 JP JP2020004661A patent/JP6913189B2/ja active Active
- 2020-01-15 ES ES20749192T patent/ES2932464T3/es active Active
- 2020-01-15 TW TW109101350A patent/TWI745835B/zh active
- 2020-01-15 WO PCT/CN2020/072158 patent/WO2020156159A1/zh active Application Filing
- 2020-01-15 JP JP2020004658A patent/JP6913187B2/ja active Active
- 2020-01-15 JP JP2021503555A patent/JP7030239B2/ja active Active
- 2020-01-15 TW TW109101364A patent/TWI698536B/zh active
- 2020-01-15 US US17/259,333 patent/US11283080B2/en active Active
- 2020-01-15 CN CN202010040377.5A patent/CN111526661B/zh active Active
- 2020-01-15 TW TW109101372A patent/TWI720784B/zh active
- 2020-01-15 WO PCT/CN2020/072157 patent/WO2020156158A1/zh unknown
- 2020-01-15 JP JP2020004660A patent/JP6860706B2/ja active Active
- 2020-01-15 KR KR1020207037996A patent/KR102567837B1/ko active IP Right Grant
- 2020-01-15 EP EP20749195.2A patent/EP3828970B1/en active Active
- 2020-01-15 CN CN202080001237.5A patent/CN111788727B/zh active Active
- 2020-01-15 PH PH1/2021/551824A patent/PH12021551824A1/en unknown
- 2020-01-15 TW TW109101301A patent/TWI725706B/zh active
- 2020-01-15 JP JP2021500514A patent/JP7144593B2/ja active Active
- 2020-01-15 JP JP2020004659A patent/JP6913188B2/ja active Active
- 2020-01-15 KR KR1020200005337A patent/KR102250785B1/ko active IP Right Grant
- 2020-01-15 EP EP20152064.0A patent/EP3690083B1/en active Active
- 2020-01-15 WO PCT/CN2020/072282 patent/WO2020156179A1/zh active Application Filing
- 2020-01-15 KR KR1020217003753A patent/KR102269105B1/ko active IP Right Grant
- 2020-01-15 CN CN202080001233.7A patent/CN111801444B/zh active Active
- 2020-01-15 HU HUE20749192A patent/HUE060039T2/hu unknown
- 2020-01-15 ES ES20749195T patent/ES2945215T3/es active Active
- 2020-01-15 KR KR1020217009202A patent/KR102519446B1/ko active IP Right Grant
- 2020-01-15 KR KR1020217001664A patent/KR102319043B1/ko active IP Right Grant
- 2020-01-15 CN CN202310393051.4A patent/CN116706083B/zh active Active
- 2020-01-15 ES ES20151885T patent/ES2899080T3/es active Active
- 2020-01-15 KR KR1020200005476A patent/KR102245180B1/ko active IP Right Grant
- 2020-01-15 CN CN202080002057.9A patent/CN111989989B/zh active Active
- 2020-01-15 KR KR1020200005475A patent/KR102289847B1/ko active IP Right Grant
- 2020-01-15 PH PH1/2021/551706A patent/PH12021551706B1/en unknown
- 2020-01-15 HU HUE20151885A patent/HUE056874T2/hu unknown
- 2020-01-15 KR KR1020217000028A patent/KR102567838B1/ko active IP Right Grant
- 2020-01-15 TW TW109101297A patent/TWI744773B/zh active
- 2020-01-15 MY MYPI2021004426A patent/MY196202A/en unknown
- 2020-01-15 PL PL20749195.2T patent/PL3828970T3/pl unknown
- 2020-01-15 TW TW109101362A patent/TWI705607B/zh active
- 2020-01-15 WO PCT/CN2020/072300 patent/WO2020156181A1/zh active Application Filing
- 2020-01-15 TW TW109101355A patent/TWI722763B/zh active
- 2020-01-15 US US17/260,405 patent/US11362337B2/en active Active
- 2020-01-15 TW TW109101285A patent/TWI718843B/zh active
- 2020-01-15 CN CN202010044774.XA patent/CN111525176A/zh active Pending
- 2020-01-15 KR KR1020200005338A patent/KR102253481B1/ko active IP Right Grant
- 2020-01-15 JP JP2020004657A patent/JP6942826B2/ja active Active
- 2020-01-28 PH PH12020000027A patent/PH12020000027A1/en unknown
-
2021
- 2021-02-24 KR KR1020210024954A patent/KR102365656B1/ko active IP Right Grant
- 2021-06-29 PH PH12021551552A patent/PH12021551552A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006253345A (ja) * | 2005-03-10 | 2006-09-21 | Furukawa Circuit Foil Kk | 高純度電解銅箔及びその製造方法 |
JP2016009526A (ja) * | 2014-06-20 | 2016-01-18 | 古河電気工業株式会社 | 全固体電池用負極集電体及び全固体電池 |
KR20180080512A (ko) * | 2017-01-04 | 2018-07-12 | 케이씨에프테크놀로지스 주식회사 | 최적화된 피크 조도를 갖는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102228476B1 (ko) | 리튬 이온 2차 배터리의 음극 집전 장치용 구리 호일 | |
US10619262B1 (en) | Electrodeposited copper foil |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A107 | Divisional application of patent | ||
PA0107 | Divisional application |
Comment text: Divisional Application of Patent Patent event date: 20210224 Patent event code: PA01071R01D Filing date: 20200115 Application number text: 1020200005565 |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20210507 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20211118 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20210507 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
X091 | Application refused [patent] | ||
AMND | Amendment | ||
PX0901 | Re-examination |
Patent event code: PX09011S01I Patent event date: 20211118 Comment text: Decision to Refuse Application |
|
PX0701 | Decision of registration after re-examination |
Patent event date: 20220125 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20220118 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20211118 Comment text: Decision to Refuse Application Patent event code: PX07011S01I |
|
X701 | Decision to grant (after re-examination) | ||
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20220216 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20220217 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20240909 Start annual number: 4 End annual number: 4 |