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CN110634431B - 检测和制造显示面板的方法 - Google Patents

检测和制造显示面板的方法 Download PDF

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CN110634431B
CN110634431B CN201910880316.7A CN201910880316A CN110634431B CN 110634431 B CN110634431 B CN 110634431B CN 201910880316 A CN201910880316 A CN 201910880316A CN 110634431 B CN110634431 B CN 110634431B
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戈尔拉玛瑞扎·恰吉
斯特凡·亚力山大
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
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    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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Abstract

本发明涉及检测和制造显示面板的方法。其中，检测显示面板的方法，包括：制造所述显示面板，在薄膜晶体管TFT背板上形成多个像素电路，像素电路包括TFT和有机发光器件OLED、在TFT背板的至少一部分上形成连接至信号线的焊接垫、沿着TFT背板的所述一部分的所选边形成探针焊盘，以及形成多个多路复用器，所述多个多路复用器将所述探针焊盘连接至所述焊接垫，所述探针焊盘的数量小于所述焊接垫的数量；将所述TFT背板的所述探针焊盘与测量电子器件接合；通过所述探针焊盘和所述多个多路复用器提供来自所述测量电子器件的测试信号，以在沉积OLED之后且在密封所述显示面板之前检测所述显示面板；以及从所述显示面板的所述检测中确定所述显示面板是否是合格的。

Description

检测和制造显示面板的方法
本申请是申请日为2014年4月21日、发明名称为“用于OLED显示面板的检测系统”的申请号为201480022682.4的专利申请的分案申请。
技术领域
本发明大体涉及OLED显示器，并且更具体地，涉及用于检测诸如有源矩阵有机发光二极管显示器等显示器中的缺陷和不均匀性的检测系统。
背景技术
显示面板可以使用分别由单独电路(即，像素电路)控制的发光器件的阵列构成，所述单独电路具有用于选择性地控制该电路以用显示信息进行编程并根据显示信息使发光器件发光的晶体管。在基板上制造的薄膜晶体管(“TFT”)可以被装入这种显示面板中。由于生产问题，显示面板上的OLED和TFT会呈现出不均匀的表现。如果在生产面板时(例如，在制造期间或紧随制造之后)可以识别出缺陷和不均匀性，则可以解决这种问题。
发明内容
提供了这样的一种系统：该系统用于在制造期间或紧随制造之后检测具有薄膜晶体管(TFT)和发光器件(OLED)的显示面板的至少一部分，从而能够对制造过程进行调节以避免缺陷和不均匀性。所述系统设置有位于显示面板的至少一部分上的连接至信号线的焊接垫(bonding pad)和沿着显示面板的所选边的探针焊盘(probe pad)。所述探针焊盘通过多个多路复用器连接至所述焊接垫，使得所述探针焊盘的数量小于所述焊接垫的数量。
根据参照附图对各实施例和/或各方面进行的详细说明(接下来将对它们进行简要说明)，对本领域技术人员而言，本发明的前述的和附加的方面及实施方式将是显而易见的。
附图说明
通过阅读下面的详细说明并参照附图，本发明的前述的和其它优点将变得显而易见。
图1是适于接收探针板(probe card)的显示面板的示意性立体图。
图2是图1中示出的显示面板的示意性正视图，该图示出了用于接收探针板的探针焊盘的位置。
图3是连接至用于将探针信号提供至探针焊盘的多路复用器的一对探针焊盘的图。
图4是图3中示出的被连接用来接收显示信号的一个探针焊盘的示意性电路图。
图5是用于进行AMOLED面板的测量以及进行能够用来修复通过该测量的分析而识别出的缺陷的各种修正动作的检测系统的示意图。
图6是具有信号WR的像素电路的示意性电路图。
本发明容许各种修改和替代形式，具体实施方案已通过图中的示例示出，并将在本文中详细地说明。然而，应当理解，本发明不旨在局限于所公开的特定形式。相反地，本发明覆盖落入由所附权利要求所限定的本发明的精神和范围内的所有修改、等同物和替代物。
具体实施方式
图1图示了用于在OLED显示面板10的制造的一个或多个阶段(例如，TFT背板、完全制造好的面板或者完全完成并封装的面板)检测面板10的系统。显示面板10通过测量电子设备11和探针板12连接至计算机14，以提供在每个处理步骤对面板进行测试和核查的能力。例如，在完成TFT背板之后，探针板系统可用于单独地检测TFT背板的性能。如果TFT背板是合格的，那么随后将面板10转到下一个步骤，该步骤可以是OLED沉积阶段。在完成OLED沉积之后，可以在密封前针对适当的沉积对面板10进行检测。在密封之后，可以在面板10被送至装配工序之前再次对其进行检测。
如在图2中所能看到的，示例性显示面板10具有沿着面板的四个边中的三个边形成的探针焊盘20。探针焊盘还可优选地在OLED沉积阶段之前被形成在面板内。探针焊盘20用于经由焊接垫30将测试信号提供至显示面板10上的大量像素电路，其中焊接垫30形成在通向所述像素电路的各种信号线的外端。
图3图示了探针焊盘20与焊接垫30的通过多路复用器(MUX)40的连接，该连接减少了所需的探针焊盘的数量，这进而使得能够增大焊盘间距。为了保证连接至探针焊盘20的其它信号被适当地偏置，需要MUX 40能够针对各组信号(例如，源极信号、栅极信号等)将各探针焊盘20连接至共用信号(Vcom)
图4图示了对于每个探针焊盘20具有公共信号控制和两个以上面板信号的MUX40。图4示出了连接至一个探针焊盘20的h个面板信号，因而需要用于与探针焊盘20连接或与公共信号连接的2h个控制信号。面板信号至探针焊盘20的连接由第一开关41和42控制，且公共信号Vcom至面板信号线的连接由第二开关43和44控制。
用于全面板探测的适当的焊盘间距通常约为150微米。如表1中的数据所示，用于最常规构造的焊盘间距满足最小焊盘间距要求。然而，也如表1中的数据所示，利用2:1或更大的复用比能够使焊盘间距增大，这将使探针板更加简单。
表1：针对不同显示器尺寸和分辨率的焊盘间距。
Figure BDA0002205669200000031
如图5所示，安装在探针板12上的电子测量系统13能够测量显示面板10中的每一个TFT和每一个OLED器件的电特性，并识别出缺陷和不均匀性。该数据被提供至GUI 14以获得更高的良品率、更快的工艺提升和更低的线监控成本，其中，在GUI 14中所述数据能够被用于对每个工艺步骤进行微调。图5中图示了能够被微调的各种处理步骤的示例，即，溅射和PECVD模块50、工序间退火模块51、图案化模块52、激光修复模块53、喷墨打印模块54以及蒸发模块55。最终的结果是完整的显示面板56.
图5中所示的电路从测量电子设备13获取数据，分析该数据并以各种报告、表格和图片的形式显示该数据。在下表中对一些视图进行了说明。
Figure BDA0002205669200000041
Figure BDA0002205669200000051
诸如在2013年12月3日公开的名为“Systems and Methods for Extrraction ofThreshold and Mobility Parameters in AMOLED Displays(用于AMOLED显示器中的阈值和迁移率参数的提取的系统和方法)”的美国专利8,599,191中说明的提取系统，各种不同的电路和算法可用来在显示面板制造的不同阶段从显示面板提取不同参数的测量。
本检测系统能够对很多潜在的缺陷和问题(例如，在溅射和PECVD步骤的情况下，本检测系统可被用来识别导致缺陷或问题的可能原因，使得能够立即对制造过程进行微调以解决问题)进行识别。这类问题和它们的可能原因的示例如下：
Figure BDA0002205669200000052
Figure BDA0002205669200000061
对于通过检测系统的单次测量不能够直接识别出的缺陷，第一次测量能够揭示存在问题，并指定将最终识别准确的缺陷的额外测试。一个示例是能够通过下列步骤中的任一步骤进行检测的线路缺陷的识别：
1.测量不同线路的电流：如果电流高于阀值，则像素发生短路。
2.施加脉冲以测量电荷转移：如果电荷转移的量小于阀值，则线路是开路的。
3.对于与直流电流连接的信号(例如，Vdd和Vmonitor)，能够测量电流来检测开路缺陷。
也能够对薄膜晶体管(TFT)中的缺陷进行检测。例如，在图6中的像素电路具有被测量为高(当Vdata＝高，以及还当Vdata＝低且Vdd＝高)的信号WR的情况下，需要进行额外的测试。表1示出了不同的条件以及结果表示的含义。
为检测与工序间退火相关的问题，每个TFT的准确Vt和迁移率可被用来调整工序间退火参数，如下：
Figure BDA0002205669200000062
可以使用缺陷的数目和类型来识别图案化中的问题(颗粒，曝光不足/过度曝光等等)，如下：
Figure BDA0002205669200000063
Figure BDA0002205669200000071
能够使用缺陷位置和缺陷类型来准确地指出适于激光修复(去除材料)或离子束沉积(添加材料)的区域，如下：
Figure BDA0002205669200000072
还可使用均匀性数据来实时地对用于喷墨印刷的各个印刷头进行连续校准。系统知道哪个印刷头被用来打印每个像素，且因此能够检测与单个印刷头相关的问题。然后，可立即对被用来打印那些像素的印刷头进行调整，如下：
Figure BDA0002205669200000073
能够使用每个OLED器件的准确故障模式来调整蒸发过程，如下：
Figure BDA0002205669200000074
(在TFT和OLED检测期间收集的)电特性能够被载入到查找表中，并被用于修正所有TFT和OLED不均匀性。
一旦OLED和TFT均被沉积，就能够对额外的缺陷进行识别。第一次测量能够识别出存在问题，并指定将最终识别准确的缺陷的额外测试。
如果在面板的周边创建测试样品，那么能够提取关于全局工艺参数的更多细节。通常，这是通过从小部分的显示器中截取测试样品并将它们放到单独的特性系统中来实现的。然而，通过使用本检测系统，对于每个面板，这能够作为面板特性的一部分而被完成，如下。
·金属线能够被形成并且电阻被测量。这能够测试金属沉积步骤和蚀刻。
·能够测试将被退火的半导体层的特性和均匀性。
·在面板周围的不同位置的结构可以被用来测试对准。
·OLED结构可被用来测试蒸发步骤和喷墨印刷步骤。
虽然已经示出并说明了本发明的具体的实施方式和应用，但是应该理解的是，本发明并不局限于本文所披露的精确的结构和组合，并且在不脱离如所附权利要求限定的本发明的精神和范围的情况下，各种修改、改变和变化基于前述说明是显而易见的。

Claims (10)

1.一种检测显示面板的方法，包括：
制造所述显示面板，包括：在薄膜晶体管TFT背板上形成多个像素电路，所述像素电路包括TFT和有机发光器件OLED、在所述TFT背板的至少一部分上形成连接至信号线的焊接垫、沿着所述TFT背板的所述一部分的所选边形成探针焊盘，以及形成多个多路复用器，所述多个多路复用器将所述探针焊盘连接至所述焊接垫，所述探针焊盘的数量小于所述焊接垫的数量，其中所述多个多路复用器能够将所述探针焊盘中的每一者单独地连接至所述焊接垫中的至少两个焊接垫中的每一者，各所述多路复用器包括第一开关和第二开关，所述第一开关提供多个面板信号线至所述探针焊盘的连接，并且所述第二开关提供共用信号至所述面板信号线的连接；
将所述TFT背板的所述探针焊盘与测量电子器件接合；
通过所述探针焊盘和所述多个多路复用器提供来自所述测量电子器件的测试信号，以在沉积OLED之后且在密封所述显示面板之前检测所述显示面板；以及
从所述显示面板的所述检测中确定所述显示面板是否是合格的。
2.如权利要求1所述的方法，其中，所述显示面板的所述检测包括测量所述TFT背板的所述像素电路的所述TFT的电特性，并且所述确定包括基于所测量的所述电特性识别出所述TFT背板中的缺陷和不均匀性。
3.如权利要求1所述的方法，其中，所述显示面板的所述检测包括测量所述像素电路的所述OLED的电特性，并且所述确定包括基于所测量的所述电特性识别出所述OLED中的缺陷和不均匀性。
4.如权利要求1所述的方法，还包括：
使用所述确定和所述检测，在随后的制造步骤中调整要被施加到所述显示面板上的制造工艺。
5.一种检测显示面板的方法，包括：
制造所述显示面板，包括：在薄膜晶体管TFT背板上形成多个像素电路，所述像素电路包括TFT和有机发光器件OLED、在所述TFT背板的至少一部分上形成连接至信号线的焊接垫、沿着所述TFT背板的所述一部分的所选边形成探针焊盘，以及形成多个多路复用器，所述多个多路复用器将所述探针焊盘连接至所述焊接垫，所述探针焊盘的数量小于所述焊接垫的数量，其中所述多个多路复用器能够将所述探针焊盘中的每一者单独地连接至所述焊接垫中的至少两个焊接垫中的每一者，各所述多路复用器包括第一开关和第二开关，所述第一开关提供多个面板信号线至所述探针焊盘的连接，并且所述第二开关提供共用信号至所述面板信号线的连接；
将所述TFT背板的所述探针焊盘与测量电子器件接合；
通过所述探针焊盘和所述多个多路复用器提供来自所述测量电子器件的测试信号，以在沉积OLED之后且在密封所述显示面板之后检测所述显示面板；以及
从所述显示面板的所述检测中确定所述显示面板是否是合格的。
6.如权利要求5所述的方法，其中，所述显示面板的所述检测包括：测量所述TFT背板的所述像素电路的所述TFT的电特性，并且所述确定包括基于所测量的所述电特性识别出所述TFT背板中的缺陷和不均匀性。
7.如权利要求5所述的方法，其中，所述显示面板的所述检测包括：测量所述像素电路的所述OLED的电特性，并且所述确定包括基于所测量的所述电特性识别出所述OLED中的缺陷和不均匀性。
8.如权利要求5所述的方法，还包括：
使用所述确定和所述检测，在随后的制造步骤中调整要被施加到所述显示面板上的制造工艺。
9.一种制造多个显示面板的方法，所述方法包括：
制造第一显示面板，包括：在薄膜晶体管TFT背板上形成多个像素电路，所述像素电路包括TFT和有机发光器件OLED、在所述TFT背板的至少一部分上形成连接至信号线的焊接垫、沿着所述TFT背板的所述一部分的所选边形成探针焊盘，以及形成多个多路复用器，所述多个多路复用器将所述探针焊盘连接至所述焊接垫，所述探针焊盘的数量小于所述焊接垫的数量，其中所述多个多路复用器能够将所述探针焊盘中的每一者单独地连接至所述焊接垫中的至少两个焊接垫中的每一者，各所述多路复用器包括第一开关和第二开关，所述第一开关提供多个面板信号线至所述探针焊盘的连接，并且所述第二开关提供共用信号至所述面板信号线的连接；
将所述TFT背板的所述探针焊盘与测量电子器件接合；
通过所述探针焊盘和所述多个多路复用器提供来自所述测量电子器件的测试信号，以在沉积OLED之后且在密封所述第一显示面板之前检测所述第一显示面板；
从所述第一显示面板的所述检测中确定所述第一显示面板是否是合格的；以及；
使用所述确定和所述检测，调整要在第二显示面板的制造中施加的制造工艺。
10.一种制造多个显示面板的方法，所述方法包括：
制造第一显示面板，包括：在薄膜晶体管TFT背板上形成多个像素电路，所述像素电路包括TFT和有机发光器件OLED、在所述TFT背板的至少一部分上形成连接至信号线的焊接垫、沿着所述TFT背板的所述一部分的所选边形成探针焊盘，以及形成多个多路复用器，所述多个多路复用器将所述探针焊盘连接至所述焊接垫，所述探针焊盘的数量小于所述焊接垫的数量，其中所述多个多路复用器能够将所述探针焊盘中的每一者单独地连接至所述焊接垫中的至少两个焊接垫中的每一者，各所述多路复用器包括第一开关和第二开关，所述第一开关提供多个面板信号线至所述探针焊盘的连接，并且所述第二开关提供共用信号至所述面板信号线的连接；
将所述TFT背板的所述探针焊盘与测量电子器件接合；
通过所述探针焊盘和所述多个多路复用器提供来自所述测量电子器件的测试信号，以在沉积OLED之后且在密封所述第一显示面板之后检测所述第一显示面板；
从所述第一显示面板的所述检测中确定所述第一显示面板是否是合格的；以及；
使用所述确定和所述检测，调整要在第二显示面板的制造中施加的制造工艺。
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