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CN106398567A - Pressure sensitive adhesive tape for notebook computer - Google Patents

Pressure sensitive adhesive tape for notebook computer Download PDF

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Publication number
CN106398567A
CN106398567A CN201610777537.8A CN201610777537A CN106398567A CN 106398567 A CN106398567 A CN 106398567A CN 201610777537 A CN201610777537 A CN 201610777537A CN 106398567 A CN106398567 A CN 106398567A
Authority
CN
China
Prior art keywords
adhesive tape
graphite
film
pressure sensitive
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610777537.8A
Other languages
Chinese (zh)
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidike New Materials Jiangsu Co Ltd
Original Assignee
Sidike New Materials Jiangsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sidike New Materials Jiangsu Co Ltd filed Critical Sidike New Materials Jiangsu Co Ltd
Priority to CN201610777537.8A priority Critical patent/CN106398567A/en
Publication of CN106398567A publication Critical patent/CN106398567A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/156—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is calendered and immediately laminated
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
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    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
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    • C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
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    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661—Multi-step sintering
    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/12—Ceramic
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention discloses a pressure sensitive adhesive tape for a notebook computer. The pressure sensitive adhesive tape is pasted between a heat radiation element and a heating component, wherein the heat radiation double-side pasting film comprises a light peeling type PET (polyethylene terephthalate) film and a heavy peeling type PET film; a first heat conduction bonding layer, a graphite layer and a second heat conduction bonding layer are sequentially arranged between the light peeling type PET film and the heavy peeling type PET film; the graphite layer is obtained through the following process method including the steps of 1, raising the temperature of a polyimide film from room temperature to 250 DEG C; after the heat insulation, raising the temperature to 400 DEG C; then, lowering the temperature to the room temperature; 2, coating a layer of graphite modifying agents onto the upper and lower surfaces of the polyimide film obtained in the first step to obtain the treated polyimide film, wherein the viscosity of the graphite modifying agent is 30000 to 48000 CP. The pressure sensitive adhesive tape has the advantages that the heat conduction performance in the vertical direction and the horizontal direction is improved; the local overheating of the adhesive tape is avoided; the uniformity of the heat conduction performance of the adhesive tape is realized.

Description

Pressure sensitive adhesive tape for notebook computer
Technical field
The present invention relates to a kind of pressure sensitive adhesive tape for notebook computer, belong to pressure sensitive adhesive tape technical field.
Background technology
The trend of development of computer is to develop lighter and thinner product, and for example, panel computer and notebook computer are more next More popular, because the profile of their dexterities.Due to becoming smaller in size of these products, radiating be all the time one considerable Aspect, high temperature can reduce performance, reliability and the service life of electronic equipment.Therefore, Current electronic industry is for as thermal control The heat sink material of system core part proposes higher and higher requirement, rapid in the urgent need to a kind of high-efficiency heat conduction, light material Transfer heat away from, ensure that electronic equipment normally runs.All backing is a kind of transmission between thermal source and secondary unit The heat exchanger of heat, its surface region and shape are more beneficial for radiating compared with thermal source.By equal backing, the heat being produced by thermal source " diffusion ", to secondary unit, is so eliminated the heat accumulation in thermal source well.
In prior art, Kapton is mostly used for flexible PCB and is obtained using polyimide film sintered although having Obtaining graphite heat radiation fin, thus being covered on thermal source, but being constrained to the good and the bad of the product quality and performances of Kapton not Together, have influence on the performance of radiating two-sided pad pasting heat dispersion, there is following technical problem：Radiating is uneven, adhesive tape easily Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product Competitiveness, how to overcome above-mentioned technical problem become those skilled in the art effort direction.
Content of the invention
It is an object of the present invention to provide a kind of pressure sensitive adhesive tape for notebook computer, this is used for the pressure sensitive adhesive of notebook computer Band both vertically and horizontally all improve heat conductivility, it is to avoid adhesive tape hot-spot is it is achieved that adhesive tape heat conductivility While uniformity, improve heat dispersion stability, the reliability of product, greatly reduce the cost of product.
For reaching above-mentioned purpose, the technical solution used in the present invention is：A kind of pressure sensitive adhesive tape for notebook computer, institute State pressure sensitive adhesive tape and fit between radiating piece and heat generating components, the two-sided pad pasting of described radiating includes light strippable PET film and shells again Release PET film, be disposed between this light strippable PET film and re-release type PET film the first heat conduction adhesive layer, graphite linings and Second heat conduction adhesive layer；It is characterized in that：Described graphite linings are obtained by following process, and this process includes following step Suddenly：
Step one, Kapton is risen to 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP；
The described graphite modified dose of group by following weight portion is grouped into：23 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 12 parts, 26.5 parts of MDA, 34 parts of dimethylformamide, 2.2 parts of ethylene glycol, 2 parts of polydimethylsiloxane；
Step 3, the Kapton after processing is warming up to 800 DEG C, being warming up to 1200 DEG C after insulation, cools down after insulation, Thus obtaining the carbonized film of pre-burned；
Step 4, using calender roll described step 4 pre-burned carbonized film；
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtaining the graphite that master fires Film；
The graphite film that the master of step 6 and then step 5 gained fires is rolled thus being obtained described graphite linings.
In technique scheme, further improved scheme is as follows：
1st, in such scheme, described step 4 acquisition graphite linings are carried out calendering process.
2nd, in such scheme, the grammes per square metre of described light strippable PET film peeling force is 5 ~ 10g/m2, described re-release type PET The grammes per square metre of film peeling force is 50 ~ 100g/m2.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect：
The present invention is used for the pressure sensitive adhesive tape of notebook computer, and in its structure, graphite linings are coated with one layer of graphite by upper and lower surface and change Property agent Kapton be prepared from, improve in heat conductivility both vertically and horizontally, it is to avoid adhesive tape local Overheated it is achieved that the uniformity of adhesive tape heat conductivility；Next, it is located at graphite modified dose of Kapton surface by hexichol Ketone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, polydimethylsiloxane Composition, is coated on Kapton, is filled with the pin hole in heating process, improve degree of crystallinity simultaneously, also overcome heat Shrink excessive lead to uneven, improve graphite linings biaxial tension performance；Again, Kapton surface has graphite and changes Property agent, improve graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and described pre-burned rolled using calender Carbonized film, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and degree of crystallinity, improves further In heat conductivility both vertically and horizontally.
Specific embodiment
With reference to embodiment, the invention will be further described：
Embodiment：A kind of pressure sensitive adhesive tape for notebook computer, the two-sided pad pasting of described radiating fits in radiating piece and heating part Between part, the two-sided pad pasting of described radiating includes light strippable PET film and re-release type PET film, this light strippable PET film and again shelling It is disposed with the first heat conduction adhesive layer, graphite linings and the second heat conduction adhesive layer between release PET film；Described graphite linings pass through with Lower process obtains, and this process comprises the following steps：
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, rise to 400 DEG C, after keeping 1 hour, be down to room temperature；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes Kapton afterwards, the described graphite modified dose of group by following weight portion is grouped into：23 parts of benzophenone tetracarboxylic dianhydride, 12 parts of pyromellitic acid anhydride, 26.5 parts of MDA, 34 parts of dimethylformamide, 2.2 parts of ethylene glycol, poly- diformazan 2 parts of radical siloxane；Graphite modified dose of viscosity is 32000CP；
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, thus obtaining the carbonized film of pre-burned；
Step 4, using calender roll described step 4 pre-burned carbonized film；
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then the speed with 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after keeping 1.8 ~ 2.2 hours, thus obtaining the graphite film that master fires；
The graphite film that the master of step 6 and then step 5 gained fires is rolled thus being obtained described graphite linings.
Described step 6 acquisition graphite linings are carried out calendering process.
The grammes per square metre of above-mentioned light strippable PET film 1 peeling force is 5 ~ 10g/m2, described re-release type PET film peeling force gram It is 50 ~ 100g/m again2.
During using the above-mentioned pressure sensitive adhesive tape for notebook computer, in its structure, graphite linings are coated with one by upper and lower surface The Kapton of graphite modified dose of layer is prepared from, and improves in heat conductivility both vertically and horizontally, it is to avoid Adhesive tape hot-spot is it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, it is located at the graphite modified of Kapton surface Agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, poly- diformazan Radical siloxane forms, and is coated on Kapton, is filled with the pin hole in heating process, improves degree of crystallinity simultaneously, Overcome thermal contraction excessive lead to uneven, improve graphite linings biaxial tension performance；Again, Kapton surface tool There is graphite modified dose, improve graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and described using calender calendering The carbonized film of pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and degree of crystallinity, enters One step improves in heat conductivility both vertically and horizontally.
Above-described embodiment only technology design to illustrate the invention and feature, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implements according to this, can not be limited the scope of the invention with this.All according to the present invention Equivalence changes or modification that spirit is made, all should be included within the scope of the present invention.

Claims (3)

1. a kind of pressure sensitive adhesive tape for notebook computer, described pressure sensitive adhesive tape fits between radiating piece and heat generating components, institute State the two-sided pad pasting of radiating and include light strippable PET film and re-release type PET film, this light strippable PET film and re-release type PET film Between be disposed with the first heat conduction adhesive layer, graphite linings and the second heat conduction adhesive layer；It is characterized in that：Described graphite linings are passed through Following process obtains, and this process comprises the following steps：
Step one, Kapton is risen to 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP；
The described graphite modified dose of group by following weight portion is grouped into：20 ~ 25 parts of benzophenone tetracarboxylic dianhydride, Pyromellitic Acid two 12 ~ 18 parts of acid anhydride, 20 ~ 28 parts of MDA, 34 parts of dimethylformamide, 2.2 parts of ethylene glycol, polydimethylsiloxane 2 Part；
Step 3, the Kapton after processing is warming up to 800 DEG C, being warming up to 1200 DEG C after insulation, cools down after insulation, Thus obtaining the carbonized film of pre-burned；
Step 4, using calender roll described step 4 pre-burned carbonized film；
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtaining the graphite that master fires Film；
The graphite film that the master of step 6 and then step 5 gained fires is rolled thus being obtained described graphite linings.
2. pressure sensitive adhesive tape according to claim 1 it is characterised in that：Described step 4 acquisition graphite linings are carried out at calendering Reason.
3. pressure sensitive adhesive tape according to claim 1 it is characterised in that：The grammes per square metre of described light strippable PET film peeling force is 5 ~10g/m2, the grammes per square metre of described re-release type PET film peeling force is 50 ~ 100g/m2.
CN201610777537.8A 2014-01-26 2014-01-26 Pressure sensitive adhesive tape for notebook computer Pending CN106398567A (en)

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CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610787521.5A Pending CN106535560A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers
CN201610777909.7A Pending CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
CN201610696862.1A Active CN106304780B (en) 2014-01-26 2014-01-26 Manufacturing process for high thermal conductivity graphite film
CN201610787504.1A Pending CN106520002A (en) 2014-01-26 2014-01-26 Heat-conducting pressure-sensitive double-sided tape
CN201610704135.5A Pending CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610696479.6A Pending CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610787557.3A Pending CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
CN201610777925.6A Active CN106427180B (en) 2014-01-26 2014-01-26 Preparation method for the two-sided pad pasting of soaking
CN201610778259.8A Pending CN106634658A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop
CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610777340.4A Pending CN106398566A (en) 2014-01-26 2014-01-26 Double-face pad pasting with heat radiation
CN201610705884.XA Pending CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
CN201610700227.6A Pending CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product
CN201610777537.8A Pending CN106398567A (en) 2014-01-26 2014-01-26 Pressure sensitive adhesive tape for notebook computer
CN201610705947.1A Active CN106304783B (en) 2014-01-26 2014-01-26 Thermal conductivity both-sided adhesive graphite flake
CN201610696475.8A Pending CN106318251A (en) 2014-01-26 2014-01-26 Manufacture method of thermal transfer film
CN201610777536.3A Pending CN106349965A (en) 2014-01-26 2014-01-26 preparing method of heat-conducting adhesive tape for consumer electronic product
CN201410037378.9A Active CN103763892B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device
CN201610777339.1A Pending CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape
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CN201610787521.5A Pending CN106535560A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers
CN201610777909.7A Pending CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
CN201610696862.1A Active CN106304780B (en) 2014-01-26 2014-01-26 Manufacturing process for high thermal conductivity graphite film
CN201610787504.1A Pending CN106520002A (en) 2014-01-26 2014-01-26 Heat-conducting pressure-sensitive double-sided tape
CN201610704135.5A Pending CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610696479.6A Pending CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610787557.3A Pending CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
CN201610777925.6A Active CN106427180B (en) 2014-01-26 2014-01-26 Preparation method for the two-sided pad pasting of soaking
CN201610778259.8A Pending CN106634658A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop
CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610777340.4A Pending CN106398566A (en) 2014-01-26 2014-01-26 Double-face pad pasting with heat radiation
CN201610705884.XA Pending CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
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CN201610777536.3A Pending CN106349965A (en) 2014-01-26 2014-01-26 preparing method of heat-conducting adhesive tape for consumer electronic product
CN201410037378.9A Active CN103763892B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device
CN201610777339.1A Pending CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape
CN201610696474.3A Pending CN106318250A (en) 2014-01-26 2014-01-26 Preparation process of thermal double-sided adhesive tape

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