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CN106634658A - Manufacturing process for heat-conducting adhesive tape used for laptop - Google Patents

Manufacturing process for heat-conducting adhesive tape used for laptop Download PDF

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Publication number
CN106634658A
CN106634658A CN201610778259.8A CN201610778259A CN106634658A CN 106634658 A CN106634658 A CN 106634658A CN 201610778259 A CN201610778259 A CN 201610778259A CN 106634658 A CN106634658 A CN 106634658A
Authority
CN
China
Prior art keywords
heat
degree
graphite
film
manufacturing process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610778259.8A
Other languages
Chinese (zh)
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidike New Materials Jiangsu Co Ltd
Original Assignee
Sidike New Materials Jiangsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sidike New Materials Jiangsu Co Ltd filed Critical Sidike New Materials Jiangsu Co Ltd
Priority to CN201610778259.8A priority Critical patent/CN106634658A/en
Publication of CN106634658A publication Critical patent/CN106634658A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
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    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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    • B32B37/156—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is calendered and immediately laminated
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention discloses a manufacturing process for a heat-conducting adhesive tape used for a laptop. The manufacturing process comprises the following steps: heating a polyimide film to 250 DEG C from room temperature, maintaining the temperature, then heating a polyimide film to 400 DEG C and then carrying out cooling to room temperature; coating both the upper and lower surfaces of the polyimide film with a layer of a polyimide film treated by a graphite modifier, wherein the graphite modifier is composed of, by weight, 20 parts of benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, diaminodiphenylmethane, dimethyl formamide, glycol and polydimethylsiloxane; carrying out heating to 800 DEG C at a rate of 4 to 6 DEG C/min and maintaining the temperature for 0.9 to 1.1 h; and carrying out heating to 1200 DEG C at a rate of 9 to 11 DEG C/min, maintaining the temperature for 0.9 to 1.1 h and then carrying out cooling so as to obtain a pre-sintered carbonized film. The heat-conducting adhesive tape provided by the invention fills in pin holes in the process of heating, improves the degree of crystallization, overcomes the problem of uniformity caused by too great thermal contraction and prevents local overheating of the adhesive tape.

Description

For the heat-conducting glue band manufacturing process of notebook computer
Technical field
The present invention relates to a kind of heat-conducting glue band manufacturing process for notebook computer, belongs to double faced adhesive chip technology neck Domain.
Background technology
As modern microelectronic technology high-speed develops, electronic equipment（Such as notebook computer, mobile phone, panel computer）Increasingly Become ultra-thin, light, this structure causes electronic equipment internal power density to significantly improve, and produced heat is difficult in operation Discharge, be easy to rapid accumulation and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity Life.Therefore, Current electronic industry proposes higher and higher requirement for the heat sink material as heat control system core component, urgently Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment normally runs.
Kapton is mostly used for flexible PCB in prior art, although has and is obtained using polyimide film sintered Graphite heat radiation fin, so as to be covered on thermal source, but be constrained to Kapton product quality and performances the good and the bad not Together, the performance of the two-sided pad pasting heat dispersion of radiating has been had influence on, has there is following technical problem：Radiating is uneven, adhesive tape easily occurs Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product Competitiveness.
The content of the invention
It is an object of the present invention to provide a kind of heat-conducting glue band manufacturing process for notebook computer, this is used for notebook computer Heat-conducting glue band manufacturing process both vertically and horizontally improve heat conductivility, it is to avoid adhesive tape hot-spot, realize While the uniformity of adhesive tape heat conductivility, heat dispersion stability, the reliability of product are improve, greatly reduce product Cost.
To reach above-mentioned purpose, the technical solution used in the present invention is：A kind of heat-conducting glue band system for notebook computer Make technique, the two-sided pad pasting of the radiating is fitted between radiating piece and heat generating components, the two-sided pad pasting of the radiating includes light stripping Type PET film and re-release type PET film, between this light strippable PET film and re-release type PET film the first heat-conducting glue is disposed with Adhesion coating, graphite linings and the second heat conduction adhesive layer；It is characterized in that：The graphite linings are obtained by following process, this technique Method is comprised the following steps：
Step one, Kapton is risen to into 250 DEG C from room temperature, after 400 DEG C are risen to after insulation room temperature is down to；
Step 2, it is coated with one layer graphite modified dose on the upper and lower surface of the Kapton through step one and is processed Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP；
The graphite modified dose of component by following weight portion is constituted：20 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 13 parts, 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, 3 parts of dimethyl silicone polymer；
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, so as to obtain the carbonized film of pre-burned；
Step 4, rolled using calender the step 4 pre-burned carbonized film；
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after being kept for 1.8 ~ 2.2 hours, so as to obtain the graphite film of main firing；
The graphite film of the main firing obtained by step 6 and then step 3 is rolled so as to obtain the graphite linings.
Further improved scheme is as follows in above-mentioned technical proposal：
1st, in such scheme, Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature in the step one, is protected Hold 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after being kept for 1 hour.
2nd, in such scheme, step 4 acquisition graphite film is carried out into calendering process.
Because above-mentioned technical proposal is used, the present invention has compared with prior art following advantages and effect：
The present invention is used for the heat-conducting glue band manufacturing process of notebook computer, and graphite linings are coated with one by upper and lower surface in its structure The Kapton of graphite modified dose of layer is prepared from, and improves in heat conductivility both vertically and horizontally, it is to avoid Adhesive tape hot-spot, realizes the uniformity of adhesive tape heat conductivility；Secondly, it is located at the graphite modified of Kapton surface Agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, poly- diformazan Radical siloxane is constituted, and is coated on Kapton, and the pin hole being filled with heating process improves degree of crystallinity simultaneously, Overcome thermal contraction excessive caused uneven, improve graphite linings biaxial tension performance；Again, Kapton surface tool There is graphite modified dose, improve graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and it is described using calender calendering The carbonized film of pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and degree of crystallinity, enters One step is improve in heat conductivility both vertically and horizontally.
Specific embodiment
With reference to embodiment, the invention will be further described：
Embodiment：A kind of heat-conducting glue band manufacturing process for notebook computer, the heat-conducting glue band fits in radiating piece 1 and sends out Between thermal part 2, the two-sided pad pasting that radiates includes light strippable PET film 3 and re-release type PET film 4, this light strippable PET The first heat conduction adhesive layer 5, the heat conduction adhesive layer 7 of graphite linings 6 and second are disposed between film 3 and re-release type PET film 4；Institute State graphite linings 6 to obtain by following process, this process is comprised the following steps：
Step one, Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature, kept for 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, 400 DEG C are risen to, after being kept for 1 hour room temperature is down to；
Step 2, it is coated with one layer graphite modified dose on the upper and lower surface of the Kapton through step one and is processed Kapton afterwards, the graphite modified dose of component by following weight portion is constituted：20 parts of benzophenone tetracarboxylic dianhydride, 13 parts of PMDA, 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, dimethyl silicone polymer 3 parts；Graphite modified dose of viscosity is 45000CP.
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed of 9 ~ 11 degree/min Degree rises to 1200 DEG C, cools down after preserving 0.9 ~ 1.1 hour, so as to obtain the carbonized film of pre-burned；
Step 4, rolled using calender the step 4 pre-burned carbonized film；
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after being kept for 1.8 ~ 2.2 hours, so as to obtain the graphite film of main firing；
The graphite film of the main firing obtained by step 6 and then step 5 is rolled so as to obtain the graphite linings 6.
Step 6 acquisition graphite linings are carried out into calendering process.
The grammes per square metre of the above-mentioned light peeling force of strippable PET film 1 is 5 ~ 10g/m2, the peeling force of re-release type PET film 2 gram Weight is 50 ~ 100g/m2。
During using the above-mentioned heat-conducting glue for notebook computer with manufacturing process, graphite linings are by upper and lower surface in its structure The Kapton for being coated with one layer graphite modified dose is prepared from, and improves in thermal conductivity both vertically and horizontally Can, it is to avoid adhesive tape hot-spot, realize the uniformity of adhesive tape heat conductivility；Secondly, it is located at Kapton surface Graphite modified dose by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, second two Alcohol, dimethyl silicone polymer composition, are coated on Kapton, and the pin hole being filled with heating process improves crystallization Degree simultaneously, also overcome thermal contraction it is excessive caused by it is uneven, improve graphite linings biaxial tension performance；Again, polyimides Film surface has graphite modified dose, improves graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and using calendering Machine rolls the carbonized film of the pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness And degree of crystallinity, further increase in heat conductivility both vertically and horizontally.
Above-described embodiment technology design only to illustrate the invention and feature, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implement according to this, can not be limited the scope of the invention with this.It is all according to the present invention Equivalence changes or modification that Spirit Essence is made, all should be included within the scope of the present invention.

Claims (3)

1. with manufacturing process, the heat-conducting glue band fits in radiating piece and heat generating components to a kind of heat-conducting glue for notebook computer Between, the two-sided pad pasting that radiates includes light strippable PET film and re-release type PET film, this light strippable PET film and re-release The first heat conduction adhesive layer, graphite linings and the second heat conduction adhesive layer are disposed between type PET film；It is characterized in that：The stone Layer of ink is obtained by following process, and this process is comprised the following steps：
Step one, Kapton is risen to into 250 DEG C from room temperature, after 400 DEG C are risen to after insulation room temperature is down to；
Step 2, it is coated with one layer graphite modified dose on the upper and lower surface of the Kapton through step one and is processed Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP；
The graphite modified dose of component by following weight portion is constituted：20 ~ 25 parts of benzophenone tetracarboxylic dianhydride, Pyromellitic Acid two 12 ~ 18 parts of acid anhydride, 20 ~ 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, dimethyl silicone polymer 3 Part；
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, so as to obtain the carbonized film of pre-burned；
Step 4, rolled using calender the step 4 pre-burned carbonized film；
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after being kept for 1.8 ~ 2.2 hours, so as to obtain the graphite film of main firing；
The graphite film of the main firing obtained by step 6 and then step 3 is rolled so as to obtain the graphite linings.
2. the heat-conducting glue for notebook computer according to claim 1 is with manufacturing process, it is characterised in that：The step Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature in one, is kept for 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, 400 DEG C are risen to, near room temperature after being kept for 1 hour.
3. the heat-conducting glue for notebook computer according to claim 1 is with manufacturing process, it is characterised in that：By the step Rapid four acquisitions graphite linings carry out calendering process.
CN201610778259.8A 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop Pending CN106634658A (en)

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CN201610705947.1A Active CN106304783B (en) 2014-01-26 2014-01-26 Thermal conductivity both-sided adhesive graphite flake
CN201610777909.7A Pending CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
CN201610704135.5A Pending CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610787557.3A Pending CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
CN201610705884.XA Pending CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
CN201610700227.6A Pending CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product
CN201610777925.6A Active CN106427180B (en) 2014-01-26 2014-01-26 Preparation method for the two-sided pad pasting of soaking
CN201410037378.9A Active CN103763892B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device
CN201610787504.1A Pending CN106520002A (en) 2014-01-26 2014-01-26 Heat-conducting pressure-sensitive double-sided tape
CN201610787521.5A Pending CN106535560A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers
CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610777537.8A Pending CN106398567A (en) 2014-01-26 2014-01-26 Pressure sensitive adhesive tape for notebook computer
CN201610777340.4A Pending CN106398566A (en) 2014-01-26 2014-01-26 Double-face pad pasting with heat radiation
CN201610696479.6A Pending CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610696474.3A Pending CN106318250A (en) 2014-01-26 2014-01-26 Preparation process of thermal double-sided adhesive tape
CN201610777339.1A Pending CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape
CN201610696862.1A Active CN106304780B (en) 2014-01-26 2014-01-26 Manufacturing process for high thermal conductivity graphite film
CN201610778259.8A Pending CN106634658A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop
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CN201610777909.7A Pending CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
CN201610704135.5A Pending CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610787557.3A Pending CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
CN201610705884.XA Pending CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
CN201610700227.6A Pending CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product
CN201610777925.6A Active CN106427180B (en) 2014-01-26 2014-01-26 Preparation method for the two-sided pad pasting of soaking
CN201410037378.9A Active CN103763892B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device
CN201610787504.1A Pending CN106520002A (en) 2014-01-26 2014-01-26 Heat-conducting pressure-sensitive double-sided tape
CN201610787521.5A Pending CN106535560A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers
CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610777537.8A Pending CN106398567A (en) 2014-01-26 2014-01-26 Pressure sensitive adhesive tape for notebook computer
CN201610777340.4A Pending CN106398566A (en) 2014-01-26 2014-01-26 Double-face pad pasting with heat radiation
CN201610696479.6A Pending CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
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