CN106634658A - Manufacturing process for heat-conducting adhesive tape used for laptop - Google Patents
Manufacturing process for heat-conducting adhesive tape used for laptop Download PDFInfo
- Publication number
- CN106634658A CN106634658A CN201610778259.8A CN201610778259A CN106634658A CN 106634658 A CN106634658 A CN 106634658A CN 201610778259 A CN201610778259 A CN 201610778259A CN 106634658 A CN106634658 A CN 106634658A
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- Prior art keywords
- heat
- degree
- graphite
- film
- manufacturing process
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/156—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is calendered and immediately laminated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/522—Graphite
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/661—Multi-step sintering
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/12—Ceramic
- C09J2400/123—Ceramic in the substrate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a manufacturing process for a heat-conducting adhesive tape used for a laptop. The manufacturing process comprises the following steps: heating a polyimide film to 250 DEG C from room temperature, maintaining the temperature, then heating a polyimide film to 400 DEG C and then carrying out cooling to room temperature; coating both the upper and lower surfaces of the polyimide film with a layer of a polyimide film treated by a graphite modifier, wherein the graphite modifier is composed of, by weight, 20 parts of benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, diaminodiphenylmethane, dimethyl formamide, glycol and polydimethylsiloxane; carrying out heating to 800 DEG C at a rate of 4 to 6 DEG C/min and maintaining the temperature for 0.9 to 1.1 h; and carrying out heating to 1200 DEG C at a rate of 9 to 11 DEG C/min, maintaining the temperature for 0.9 to 1.1 h and then carrying out cooling so as to obtain a pre-sintered carbonized film. The heat-conducting adhesive tape provided by the invention fills in pin holes in the process of heating, improves the degree of crystallization, overcomes the problem of uniformity caused by too great thermal contraction and prevents local overheating of the adhesive tape.
Description
Technical field
The present invention relates to a kind of heat-conducting glue band manufacturing process for notebook computer, belongs to double faced adhesive chip technology neck
Domain.
Background technology
As modern microelectronic technology high-speed develops, electronic equipment(Such as notebook computer, mobile phone, panel computer)Increasingly
Become ultra-thin, light, this structure causes electronic equipment internal power density to significantly improve, and produced heat is difficult in operation
Discharge, be easy to rapid accumulation and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity
Life.Therefore, Current electronic industry proposes higher and higher requirement for the heat sink material as heat control system core component, urgently
Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment normally runs.
Kapton is mostly used for flexible PCB in prior art, although has and is obtained using polyimide film sintered
Graphite heat radiation fin, so as to be covered on thermal source, but be constrained to Kapton product quality and performances the good and the bad not
Together, the performance of the two-sided pad pasting heat dispersion of radiating has been had influence on, has there is following technical problem:Radiating is uneven, adhesive tape easily occurs
Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product
Competitiveness.
The content of the invention
It is an object of the present invention to provide a kind of heat-conducting glue band manufacturing process for notebook computer, this is used for notebook computer
Heat-conducting glue band manufacturing process both vertically and horizontally improve heat conductivility, it is to avoid adhesive tape hot-spot, realize
While the uniformity of adhesive tape heat conductivility, heat dispersion stability, the reliability of product are improve, greatly reduce product
Cost.
To reach above-mentioned purpose, the technical solution used in the present invention is:A kind of heat-conducting glue band system for notebook computer
Make technique, the two-sided pad pasting of the radiating is fitted between radiating piece and heat generating components, the two-sided pad pasting of the radiating includes light stripping
Type PET film and re-release type PET film, between this light strippable PET film and re-release type PET film the first heat-conducting glue is disposed with
Adhesion coating, graphite linings and the second heat conduction adhesive layer;It is characterized in that:The graphite linings are obtained by following process, this technique
Method is comprised the following steps:
Step one, Kapton is risen to into 250 DEG C from room temperature, after 400 DEG C are risen to after insulation room temperature is down to;
Step 2, it is coated with one layer graphite modified dose on the upper and lower surface of the Kapton through step one and is processed
Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP;
The graphite modified dose of component by following weight portion is constituted:20 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride
13 parts, 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, 3 parts of dimethyl silicone polymer;
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour;Again with the speed liter of 9 ~ 11 degree/min
To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, so as to obtain the carbonized film of pre-burned;
Step 4, rolled using calender the step 4 pre-burned carbonized film;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min
Degree rises to 2900 DEG C, cools down after being kept for 1.8 ~ 2.2 hours, so as to obtain the graphite film of main firing;
The graphite film of the main firing obtained by step 6 and then step 3 is rolled so as to obtain the graphite linings.
Further improved scheme is as follows in above-mentioned technical proposal:
1st, in such scheme, Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature in the step one, is protected
Hold 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after being kept for 1 hour.
2nd, in such scheme, step 4 acquisition graphite film is carried out into calendering process.
Because above-mentioned technical proposal is used, the present invention has compared with prior art following advantages and effect:
The present invention is used for the heat-conducting glue band manufacturing process of notebook computer, and graphite linings are coated with one by upper and lower surface in its structure
The Kapton of graphite modified dose of layer is prepared from, and improves in heat conductivility both vertically and horizontally, it is to avoid
Adhesive tape hot-spot, realizes the uniformity of adhesive tape heat conductivility;Secondly, it is located at the graphite modified of Kapton surface
Agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, poly- diformazan
Radical siloxane is constituted, and is coated on Kapton, and the pin hole being filled with heating process improves degree of crystallinity simultaneously,
Overcome thermal contraction excessive caused uneven, improve graphite linings biaxial tension performance;Again, Kapton surface tool
There is graphite modified dose, improve graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and it is described using calender calendering
The carbonized film of pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and degree of crystallinity, enters
One step is improve in heat conductivility both vertically and horizontally.
Specific embodiment
With reference to embodiment, the invention will be further described:
Embodiment:A kind of heat-conducting glue band manufacturing process for notebook computer, the heat-conducting glue band fits in radiating piece 1 and sends out
Between thermal part 2, the two-sided pad pasting that radiates includes light strippable PET film 3 and re-release type PET film 4, this light strippable PET
The first heat conduction adhesive layer 5, the heat conduction adhesive layer 7 of graphite linings 6 and second are disposed between film 3 and re-release type PET film 4;Institute
State graphite linings 6 to obtain by following process, this process is comprised the following steps:
Step one, Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature, kept for 0.9 ~ 1.1 hour, then
With 2.5 ~ 3.5 degree/min, 400 DEG C are risen to, after being kept for 1 hour room temperature is down to;
Step 2, it is coated with one layer graphite modified dose on the upper and lower surface of the Kapton through step one and is processed
Kapton afterwards, the graphite modified dose of component by following weight portion is constituted:20 parts of benzophenone tetracarboxylic dianhydride,
13 parts of PMDA, 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, dimethyl silicone polymer
3 parts;Graphite modified dose of viscosity is 45000CP.
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour;Again with the speed of 9 ~ 11 degree/min
Degree rises to 1200 DEG C, cools down after preserving 0.9 ~ 1.1 hour, so as to obtain the carbonized film of pre-burned;
Step 4, rolled using calender the step 4 pre-burned carbonized film;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min
Degree rises to 2900 DEG C, cools down after being kept for 1.8 ~ 2.2 hours, so as to obtain the graphite film of main firing;
The graphite film of the main firing obtained by step 6 and then step 5 is rolled so as to obtain the graphite linings 6.
Step 6 acquisition graphite linings are carried out into calendering process.
The grammes per square metre of the above-mentioned light peeling force of strippable PET film 1 is 5 ~ 10g/m2, the peeling force of re-release type PET film 2 gram
Weight is 50 ~ 100g/m2。
During using the above-mentioned heat-conducting glue for notebook computer with manufacturing process, graphite linings are by upper and lower surface in its structure
The Kapton for being coated with one layer graphite modified dose is prepared from, and improves in thermal conductivity both vertically and horizontally
Can, it is to avoid adhesive tape hot-spot, realize the uniformity of adhesive tape heat conductivility;Secondly, it is located at Kapton surface
Graphite modified dose by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, second two
Alcohol, dimethyl silicone polymer composition, are coated on Kapton, and the pin hole being filled with heating process improves crystallization
Degree simultaneously, also overcome thermal contraction it is excessive caused by it is uneven, improve graphite linings biaxial tension performance;Again, polyimides
Film surface has graphite modified dose, improves graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and using calendering
Machine rolls the carbonized film of the pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness
And degree of crystallinity, further increase in heat conductivility both vertically and horizontally.
Above-described embodiment technology design only to illustrate the invention and feature, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and implement according to this, can not be limited the scope of the invention with this.It is all according to the present invention
Equivalence changes or modification that Spirit Essence is made, all should be included within the scope of the present invention.
Claims (3)
1. with manufacturing process, the heat-conducting glue band fits in radiating piece and heat generating components to a kind of heat-conducting glue for notebook computer
Between, the two-sided pad pasting that radiates includes light strippable PET film and re-release type PET film, this light strippable PET film and re-release
The first heat conduction adhesive layer, graphite linings and the second heat conduction adhesive layer are disposed between type PET film;It is characterized in that:The stone
Layer of ink is obtained by following process, and this process is comprised the following steps:
Step one, Kapton is risen to into 250 DEG C from room temperature, after 400 DEG C are risen to after insulation room temperature is down to;
Step 2, it is coated with one layer graphite modified dose on the upper and lower surface of the Kapton through step one and is processed
Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP;
The graphite modified dose of component by following weight portion is constituted:20 ~ 25 parts of benzophenone tetracarboxylic dianhydride, Pyromellitic Acid two
12 ~ 18 parts of acid anhydride, 20 ~ 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, dimethyl silicone polymer 3
Part;
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour;Again with the speed liter of 9 ~ 11 degree/min
To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, so as to obtain the carbonized film of pre-burned;
Step 4, rolled using calender the step 4 pre-burned carbonized film;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min
Degree rises to 2900 DEG C, cools down after being kept for 1.8 ~ 2.2 hours, so as to obtain the graphite film of main firing;
The graphite film of the main firing obtained by step 6 and then step 3 is rolled so as to obtain the graphite linings.
2. the heat-conducting glue for notebook computer according to claim 1 is with manufacturing process, it is characterised in that:The step
Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature in one, is kept for 0.9 ~ 1.1 hour, then with 2.5 ~
3.5 degree/min, 400 DEG C are risen to, near room temperature after being kept for 1 hour.
3. the heat-conducting glue for notebook computer according to claim 1 is with manufacturing process, it is characterised in that:By the step
Rapid four acquisitions graphite linings carry out calendering process.
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CN201610778259.8A CN106634658A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting adhesive tape used for laptop |
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CN201610778259.8A CN106634658A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting adhesive tape used for laptop |
CN201410037378.9A CN103763892B (en) | 2014-01-26 | 2014-01-26 | Heat conduction graphite patch for microelectronic device |
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CN201610696475.8A Pending CN106318251A (en) | 2014-01-26 | 2014-01-26 | Manufacture method of thermal transfer film |
CN201610705947.1A Active CN106304783B (en) | 2014-01-26 | 2014-01-26 | Thermal conductivity both-sided adhesive graphite flake |
CN201610777909.7A Pending CN106366971A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity double-sided adhesive tape |
CN201610704135.5A Pending CN106281087A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting double-sided adhesive tape |
CN201610787557.3A Pending CN106520003A (en) | 2014-01-26 | 2014-01-26 | Thermal conductive graphite tape used for laptops |
CN201610705884.XA Pending CN106332522A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity graphite film |
CN201610700227.6A Pending CN106413340A (en) | 2014-01-26 | 2014-01-26 | Heat conducting adhesive film for electronic product |
CN201610777925.6A Active CN106427180B (en) | 2014-01-26 | 2014-01-26 | Preparation method for the two-sided pad pasting of soaking |
CN201410037378.9A Active CN103763892B (en) | 2014-01-26 | 2014-01-26 | Heat conduction graphite patch for microelectronic device |
CN201610787504.1A Pending CN106520002A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting pressure-sensitive double-sided tape |
CN201610787521.5A Pending CN106535560A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting graphite paste films for flat computers |
CN201610794749.7A Pending CN106398570A (en) | 2014-01-26 | 2014-01-26 | High-compactness graphite soaking adhesive tape |
CN201610799197.9A Pending CN106381083A (en) | 2014-01-26 | 2014-01-26 | Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones |
CN201610777537.8A Pending CN106398567A (en) | 2014-01-26 | 2014-01-26 | Pressure sensitive adhesive tape for notebook computer |
CN201610777340.4A Pending CN106398566A (en) | 2014-01-26 | 2014-01-26 | Double-face pad pasting with heat radiation |
CN201610696479.6A Pending CN106332521A (en) | 2014-01-26 | 2014-01-26 | Manufacturing method for double-sided adhesive graphite flake |
CN201610696474.3A Pending CN106318250A (en) | 2014-01-26 | 2014-01-26 | Preparation process of thermal double-sided adhesive tape |
CN201610777339.1A Pending CN106349964A (en) | 2014-01-26 | 2014-01-26 | Process for preparing heat-conduction double-sided adhesive tape |
CN201610696862.1A Active CN106304780B (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for high thermal conductivity graphite film |
CN201610778259.8A Pending CN106634658A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting adhesive tape used for laptop |
CN201610777536.3A Pending CN106349965A (en) | 2014-01-26 | 2014-01-26 | preparing method of heat-conducting adhesive tape for consumer electronic product |
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CN201610705947.1A Active CN106304783B (en) | 2014-01-26 | 2014-01-26 | Thermal conductivity both-sided adhesive graphite flake |
CN201610777909.7A Pending CN106366971A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity double-sided adhesive tape |
CN201610704135.5A Pending CN106281087A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting double-sided adhesive tape |
CN201610787557.3A Pending CN106520003A (en) | 2014-01-26 | 2014-01-26 | Thermal conductive graphite tape used for laptops |
CN201610705884.XA Pending CN106332522A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity graphite film |
CN201610700227.6A Pending CN106413340A (en) | 2014-01-26 | 2014-01-26 | Heat conducting adhesive film for electronic product |
CN201610777925.6A Active CN106427180B (en) | 2014-01-26 | 2014-01-26 | Preparation method for the two-sided pad pasting of soaking |
CN201410037378.9A Active CN103763892B (en) | 2014-01-26 | 2014-01-26 | Heat conduction graphite patch for microelectronic device |
CN201610787504.1A Pending CN106520002A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting pressure-sensitive double-sided tape |
CN201610787521.5A Pending CN106535560A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting graphite paste films for flat computers |
CN201610794749.7A Pending CN106398570A (en) | 2014-01-26 | 2014-01-26 | High-compactness graphite soaking adhesive tape |
CN201610799197.9A Pending CN106381083A (en) | 2014-01-26 | 2014-01-26 | Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones |
CN201610777537.8A Pending CN106398567A (en) | 2014-01-26 | 2014-01-26 | Pressure sensitive adhesive tape for notebook computer |
CN201610777340.4A Pending CN106398566A (en) | 2014-01-26 | 2014-01-26 | Double-face pad pasting with heat radiation |
CN201610696479.6A Pending CN106332521A (en) | 2014-01-26 | 2014-01-26 | Manufacturing method for double-sided adhesive graphite flake |
CN201610696474.3A Pending CN106318250A (en) | 2014-01-26 | 2014-01-26 | Preparation process of thermal double-sided adhesive tape |
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Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106231865A (en) * | 2016-07-29 | 2016-12-14 | 芜湖迈特电子科技有限公司 | A kind of Novel heat-conducting graphite flake and manufacture method thereof |
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CN109554130A (en) * | 2019-01-31 | 2019-04-02 | 常德力元新材料有限责任公司 | A kind of graphite glue band and preparation method thereof |
CN110092374A (en) * | 2019-05-28 | 2019-08-06 | 宇冠芯龙(武汉)科技有限公司 | A kind of preparation method and graphite film material of electrographite film |
CN113853093A (en) * | 2020-06-28 | 2021-12-28 | 昆山威斯泰电子技术有限公司 | High-heat-conductivity soft cushion and preparation method thereof |
CN113444499B (en) * | 2021-06-25 | 2022-03-11 | 深圳市三科斯电子材料有限公司 | Double-sided adhesive high-thermal-conductivity synthetic graphite flake and preparation method thereof |
CN113880595B (en) * | 2021-11-16 | 2023-03-28 | 江西鸿美新能源科技有限公司 | Graphite film with high heat conductivity in vertical direction and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101289544A (en) * | 2007-04-18 | 2008-10-22 | 宇部兴产株式会社 | Process for producing polyimide film and polyimide film |
CN103045119A (en) * | 2012-12-28 | 2013-04-17 | 苏州斯迪克新材料科技股份有限公司 | Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient |
CN103144387A (en) * | 2007-05-17 | 2013-06-12 | 株式会社钟化 | Graphite film and graphite composite film |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7758842B2 (en) * | 2003-09-02 | 2010-07-20 | Kaneka Corporation | Filmy graphite and process for producing the same |
CN2696285Y (en) * | 2004-04-27 | 2005-04-27 | 天瑞企业股份有限公司 | Radiation structure of elatroluminescent display element |
WO2011007510A1 (en) * | 2009-07-13 | 2011-01-20 | パナソニック株式会社 | Graphite sheet and heat transfer structure using same |
KR101125266B1 (en) * | 2010-02-17 | 2012-03-21 | 그린스타 주식회사 | Heat radiating sheet comprising adhesives with improved heat conductivity |
JP5460569B2 (en) * | 2010-12-17 | 2014-04-02 | 株式会社カネカ | Film-like graphite and method for producing the same |
US9067185B2 (en) * | 2011-03-28 | 2015-06-30 | Kaneka Corporation | Process for producing graphite film |
CN103045199A (en) * | 2011-10-13 | 2013-04-17 | 张彪 | Process for preparing drilling fluid based on control of dosage of viscosity reducer |
CN202322703U (en) * | 2011-11-07 | 2012-07-11 | 吴志高 | Adhesive tape with heat conduction performance |
CN202936356U (en) * | 2012-11-01 | 2013-05-15 | 斯迪克新型材料(江苏)有限公司 | Double-sided adhesive for heat dissipation of electronic elements |
CN103865417B (en) * | 2012-12-18 | 2016-04-27 | 苏州斯迪克新材料科技股份有限公司 | The manufacturing process of acrylate sealing tape |
CN103059761B (en) * | 2012-12-28 | 2014-09-03 | 斯迪克新型材料(江苏)有限公司 | High-heat conductivity coefficient graphite heat-radiation adhesive tape |
CN103043657B (en) * | 2012-12-28 | 2014-10-15 | 苏州斯迪克新材料科技股份有限公司 | Graphite radiation fin for adhesive tapes |
CN203181498U (en) * | 2013-03-25 | 2013-09-04 | 深圳市跨越电子有限公司 | A graphite film with high thermal conductivity |
CN203243663U (en) * | 2013-04-24 | 2013-10-16 | 常州碳元科技发展有限公司 | High heat conductivity graphite film heat-dissipating structure applied to shell of electronic terminal |
CN203289811U (en) * | 2013-05-27 | 2013-11-13 | 苏州沛德导热材料有限公司 | A graphite heat conduction and wave absorption device |
-
2014
- 2014-01-26 CN CN201610696475.8A patent/CN106318251A/en active Pending
- 2014-01-26 CN CN201610705947.1A patent/CN106304783B/en active Active
- 2014-01-26 CN CN201610777909.7A patent/CN106366971A/en active Pending
- 2014-01-26 CN CN201610704135.5A patent/CN106281087A/en active Pending
- 2014-01-26 CN CN201610787557.3A patent/CN106520003A/en active Pending
- 2014-01-26 CN CN201610705884.XA patent/CN106332522A/en active Pending
- 2014-01-26 CN CN201610700227.6A patent/CN106413340A/en active Pending
- 2014-01-26 CN CN201610777925.6A patent/CN106427180B/en active Active
- 2014-01-26 CN CN201410037378.9A patent/CN103763892B/en active Active
- 2014-01-26 CN CN201610787504.1A patent/CN106520002A/en active Pending
- 2014-01-26 CN CN201610787521.5A patent/CN106535560A/en active Pending
- 2014-01-26 CN CN201610794749.7A patent/CN106398570A/en active Pending
- 2014-01-26 CN CN201610799197.9A patent/CN106381083A/en active Pending
- 2014-01-26 CN CN201610777537.8A patent/CN106398567A/en active Pending
- 2014-01-26 CN CN201610777340.4A patent/CN106398566A/en active Pending
- 2014-01-26 CN CN201610696479.6A patent/CN106332521A/en active Pending
- 2014-01-26 CN CN201610696474.3A patent/CN106318250A/en active Pending
- 2014-01-26 CN CN201610777339.1A patent/CN106349964A/en active Pending
- 2014-01-26 CN CN201610696862.1A patent/CN106304780B/en active Active
- 2014-01-26 CN CN201610778259.8A patent/CN106634658A/en active Pending
- 2014-01-26 CN CN201610777536.3A patent/CN106349965A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101289544A (en) * | 2007-04-18 | 2008-10-22 | 宇部兴产株式会社 | Process for producing polyimide film and polyimide film |
CN103144387A (en) * | 2007-05-17 | 2013-06-12 | 株式会社钟化 | Graphite film and graphite composite film |
CN103045119A (en) * | 2012-12-28 | 2013-04-17 | 苏州斯迪克新材料科技股份有限公司 | Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient |
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CN106332522A (en) | 2017-01-11 |
CN106304783A (en) | 2017-01-04 |
CN106398570A (en) | 2017-02-15 |
CN106318251A (en) | 2017-01-11 |
CN106427180A (en) | 2017-02-22 |
CN106349965A (en) | 2017-01-25 |
CN106520002A (en) | 2017-03-22 |
CN106332521A (en) | 2017-01-11 |
CN106398566A (en) | 2017-02-15 |
CN106304780B (en) | 2019-01-01 |
CN103763892A (en) | 2014-04-30 |
CN106318250A (en) | 2017-01-11 |
CN106304783B (en) | 2019-01-01 |
CN106427180B (en) | 2018-09-18 |
CN106535560A (en) | 2017-03-22 |
CN106304780A (en) | 2017-01-04 |
CN106381083A (en) | 2017-02-08 |
CN103763892B (en) | 2017-01-11 |
CN106281087A (en) | 2017-01-04 |
CN106349964A (en) | 2017-01-25 |
CN106520003A (en) | 2017-03-22 |
CN106413340A (en) | 2017-02-15 |
CN106398567A (en) | 2017-02-15 |
CN106366971A (en) | 2017-02-01 |
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