CN113853093A - High-heat-conductivity soft cushion and preparation method thereof - Google Patents
High-heat-conductivity soft cushion and preparation method thereof Download PDFInfo
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- CN113853093A CN113853093A CN202010595812.0A CN202010595812A CN113853093A CN 113853093 A CN113853093 A CN 113853093A CN 202010595812 A CN202010595812 A CN 202010595812A CN 113853093 A CN113853093 A CN 113853093A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 65
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 49
- 239000000741 silica gel Substances 0.000 claims abstract description 49
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 49
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 41
- 239000004917 carbon fiber Substances 0.000 claims abstract description 41
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 36
- 239000010439 graphite Substances 0.000 claims abstract description 36
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 32
- 239000012528 membrane Substances 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 16
- 239000003365 glass fiber Substances 0.000 claims abstract description 8
- 239000002241 glass-ceramic Substances 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims abstract description 4
- 239000008187 granular material Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 238000003892 spreading Methods 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 239000003638 chemical reducing agent Substances 0.000 claims description 5
- 239000012065 filter cake Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000000967 suction filtration Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 238000003763 carbonization Methods 0.000 claims description 3
- 238000010000 carbonizing Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- -1 graphite alkene Chemical class 0.000 claims description 3
- 238000005087 graphitization Methods 0.000 claims description 3
- 229920006254 polymer film Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 4
- 229920002050 silicone resin Polymers 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The invention discloses a high-thermal-conductivity cushion and a preparation method thereof, wherein the high-thermal-conductivity cushion comprises a plurality of groups of graphite film layers, first silica gel resin layers, carbon fiber film layers, graphene layers and second silica gel resin layers which are sequentially arranged, and the surfaces of all the layers in each group are attached with a heat source; outer graphite rete and outer second silica gel resin layer all are provided with one deck pressure sensitive glue membrane, the surface bonding heat conduction granule of carbon fiber film layer, first silica gel resin layer and the inside support by glass fiber or ceramic particle net of second silica gel resin layer. The invention realizes the special forming combination of the multiple heat dissipation layers and improves the uniform and rapid heat dissipation effect of the graphite film.
Description
Technical Field
The invention belongs to the technical field of heat conduction materials, and particularly relates to a high-heat-conduction cushion and a preparation method thereof.
Background
With the rapid development of microelectronic integration technology and high-density printed board assembly technology, the assembly density is rapidly increased, the volumes of electronic elements and logic circuits are reduced by thousands of times, and electronic instruments and equipment are increasingly developed in the directions of being light, thin, short and small. Under the high-frequency working frequency, the semiconductor working thermal environment moves towards the high-temperature direction rapidly, at the moment, heat generated by the electronic components is accumulated and increased rapidly, and under the temperature of the using environment, the electronic components still can work normally with high reliability, and the timely heat dissipation capability becomes a key limiting factor influencing the service life of the electronic components. In order to ensure the operation reliability of the components, materials with excellent comprehensive properties such as high reliability, high heat conductivity and the like are needed to be used, so that heat accumulated by the heating element is quickly and timely transferred to the heat dissipation equipment, and the normal operation of the electronic equipment is ensured. The simple stack structure of current graphite layer and silica gel resin layer, its horizontal heat conduction efficiency and perpendicular heat conduction efficiency are very far away mutually, lead to the heat to be can not even quick the biography away.
Disclosure of Invention
The invention aims to solve the technical problems and provides a high-thermal-conductivity cushion and a preparation method thereof, so that special forming combination of multiple heat dissipation layers is realized, and uniform and rapid heat dissipation effects of graphite films are improved. In order to achieve the purpose, the technical scheme of the invention is as follows:
the high-thermal-conductivity cushion comprises a plurality of groups of graphite film layers, a first silica gel resin layer, a carbon fiber film layer, a graphene layer and a second silica gel resin layer which are sequentially arranged, wherein the surface of each layer in each group is attached with a heat source; outer graphite rete and outer second silica gel resin layer all are provided with one deck pressure sensitive glue membrane, the surface bonding heat conduction granule of carbon fiber film layer, first silica gel resin layer and the inside support by glass fiber or ceramic particle net of second silica gel resin layer.
Specifically, the surface of graphite rete, first silica gel resin layer, carbon fiber film layer, graphite alkene layer, second silica gel resin layer all covers there is the one deck from type paper.
Specifically, the heat conducting particles are silver powder or copper powder.
Specifically, the widths of the first and second silicone resin layers are 400-500 μm.
Specifically, the width of the graphite film layer is 25-30 μm.
Specifically, the width of the graphene layer is 5-10 μm.
Specifically, the width of the carbon fiber film layer is 10-20 μm.
Specifically, the surface of the carbon fiber film layer is bonded with heat conducting particles through an adhesive, and the adhesive is acrylate.
The preparation method of the high-thermal-conductivity cushion comprises the following steps:
1) preparing a graphite film layer, namely selecting a high polymer film material as a raw material, carbonizing the raw material in a carbonization furnace, graphitizing the raw material in a graphitization furnace, and pressing and spreading the raw material to prepare the graphite film layer;
2) preparing a carbon fiber film layer, and pressing and spreading the carbon fiber film to a set size;
3) spraying an adhesive on the surface of the carbon fiber film;
4) spreading the heat conducting particles on the surface of the carbon fiber film, and naturally drying;
5) preparing a graphene layer, uniformly mixing a graphene oxide aqueous solution and a reducing agent, standing at the temperature of 60-80 ℃, performing suction filtration on a filter membrane, drying a filter cake at the temperature of 100-110 ℃, and stripping the filter membrane to obtain the graphene layer;
6) preparing a silica gel resin layer, filling and coating the silica gel resin on a glass fiber or ceramic particle net, and uniformly paving;
7) and carrying out composite molding on the graphite film layer, the first silica gel resin layer, the carbon fiber film layer, the graphene layer and the second silica gel resin layer at 90-150 ℃ by a film laminating machine.
Compared with the prior art, the high-heat-conductivity cushion and the preparation method thereof have the beneficial effects that:
the prepared high-heat-conductivity cushion has excellent heat dissipation performance and certain wear resistance and corrosion resistance; the laminated structure of the graphite film layer and the graphene layer is prepared, so that the heat dissipation effect is enhanced, and the composite material has the advantage of light weight; adopt first silica gel resin layer, carbon fiber film layer, second silica gel resin layer structure, the reinforcing supports the pliability, and when overall structure contacted the heat source, had the good heat transfer performance of horizontal direction and vertical direction, it was more even to transfer heat.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a schematic structural view of a heating test according to the present embodiment;
FIG. 3 is a schematic view of the structure of the present embodiment positioned on the heat source;
the figures in the drawings represent:
1 graphite rete, 2 first silica gel resin layers, 3 carbon fiber film layers, 4 graphite alkene layer, 5 second silica gel resin layers, 6 pressure sensitive glue membrane.
Detailed Description
The technical solutions in the embodiments of the present invention are described clearly and completely below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
Example 1:
referring to fig. 1 to 3, the present embodiment is a high thermal conductivity cushion, and includes a plurality of groups of graphite film layers 1, first silicone resin layers 2, carbon fiber film layers 3, graphene layers 4, and second silicone resin layers 5 arranged in sequence, where the surfaces of each layer in each group are attached to a heat source; lie in outer graphite rete 1 and lie in outer second silica gel resin layer 5 and all be provided with one deck pressure sensitive adhesive film 6, the surface bonding heat conduction granule of carbon fiber film layer 3, first silica gel resin layer 2 and the inside glass fiber support of second silica gel resin layer 5.
The surfaces of the graphite film layer, the first silica gel resin layer, the carbon fiber film layer, the graphene layer and the second silica gel resin layer are all covered with a layer of release paper (not shown in the figure). The heat conducting particles are silver powder or copper powder. The widths of the first and second silicone resin layers were 400 μm. The width of the graphite film layer was 30 μm. The width of the graphene layer was 5 μm. The width of the carbon fiber film layer is 20 μm. The surface of the carbon fiber film layer is bonded with the heat conducting particles through an adhesive, and the adhesive is acrylate.
The preparation method of the high-thermal-conductivity cushion comprises the following steps:
1) preparing a graphite film layer, namely selecting a high polymer film material polyamide as a raw material, carbonizing the polyamide in a carbonization furnace, and heating to 1400 ℃ for 6 hours; pressurizing under argon atmosphere, graphitizing by a graphitization furnace, heating to 2800 ℃ for 10h, and rolling in a rolling mill to prepare a graphite film layer;
2) preparing a carbon fiber film layer, and pressing and spreading the carbon fiber film to a set size;
3) spraying an adhesive on the surface of the carbon fiber film;
4) spreading the heat conducting particles on the surface of the carbon fiber film, and naturally drying;
5) preparing a graphene layer, uniformly mixing a graphene oxide aqueous solution and a reducing agent, standing and reducing for 2 hours at the temperature of 60 ℃, then performing suction filtration on a filter membrane, drying a filter cake for 2 hours at the temperature of 100 ℃, and stripping the filter membrane to prepare the graphene layer;
6) preparing a silica gel resin layer, filling and coating the silica gel resin on a glass fiber or ceramic particle net, and uniformly paving;
7) and carrying out composite molding on the graphite film layer, the first silica gel resin layer, the carbon fiber film layer, the graphene layer and the second silica gel resin layer at 90 ℃ by using a film laminating machine.
The thermal conductivity (horizontal direction) of the prepared high-thermal-conductivity cushion is as follows: 1820W/m.k, thermal conductivity (vertical direction): 1800W/m.k. The total width of high heat conduction cushion is 30mm, and the height is 3 mm.
Example 2:
the distinguishing features from example 1 are: the first and second silicone resin layers 2 and 5 are internally supported by a ceramic particle network. The widths of the first and second silicone resin layers were 500 μm. The width of the graphite film layer is 25 μm. The width of the graphene layer was 10 μm. The width of the carbon fiber film layer is 10 μm.
The preparation method of the high-thermal-conductivity cushion comprises the following steps:
5) preparing a graphene layer, uniformly mixing a graphene oxide aqueous solution and a reducing agent, standing and reducing at the temperature of 80 ℃ for 1h, performing suction filtration on a filter membrane, drying a filter cake at the temperature of 110 ℃ for 1h, and stripping the filter membrane to obtain the graphene layer;
7) and carrying out composite molding on the graphite film layer, the first silica gel resin layer, the carbon fiber film layer, the graphene layer and the second silica gel resin layer at 150 ℃ by using a film laminating machine.
The thermal conductivity (horizontal direction) of the prepared high-thermal-conductivity cushion is as follows: 1800W/m.k, thermal conductivity (vertical direction): 1810W/m.k. The total width of high heat conduction cushion is 40mm, and the height is 3 mm.
Example 3:
the distinguishing features from example 1 are: the widths of the first and second silicone resin layers were 450 μm. The width of the graphite film layer was 28 μm. The width of the graphene layer was 7 μm. The width of the carbon fiber film layer is 15 μm.
The preparation method of the high-thermal-conductivity cushion comprises the following steps:
5) preparing a graphene layer, uniformly mixing a graphene oxide aqueous solution and a reducing agent, standing and reducing at the temperature of 70 ℃ for 1.5h, then performing suction filtration on a filter membrane, drying a filter cake at the temperature of 105 ℃ for 1.5h, and stripping the filter membrane to prepare the graphene layer;
7) and carrying out composite molding on the graphite film layer, the first silica gel resin layer, the carbon fiber film layer, the graphene layer and the second silica gel resin layer at 125 ℃ by using a film laminating machine.
The thermal conductivity (horizontal direction) of the prepared high-thermal-conductivity cushion is as follows: 1850W/m.k, thermal conductivity (vertical direction): 1845W/m.k. The total width of high heat conduction cushion is 35mm, and the height is 3 mm.
Comparative example:
the difference from embodiment 1 is that the high thermal conductive cushion does not include the carbon fiber film layer and the glass fiber.
Test data, a heat transfer test was performed on the high thermal conductive pads manufactured according to examples 1 to 3 and comparative example, heating treatment was performed on one end of the high thermal conductive pad, and the temperature was set; carrying out front and back temperature measurement detection at the position 1 at the other end of the high-heat cushion; performing front and back temperature measurement detection of the position 2 at a central position between the heating treatment and the temperature measurement detection of the position 1; the test data are as follows:
| test sequence number | Position of | Test temperature C | Composition of | Setting temperature of |
| 1 | 1 | 44 | Comparative example | 60 |
| 2 | 2 | 39 | Comparative example | 60 |
| 3 | 1 | 50 | Example 1 | 60 |
| 4 | 2 | 51 | Example 1 | 60 |
| 5 | 1 | 60 | Example 2 | 70 |
| 6 | 2 | 61 | Example 2 | 70 |
| 7 | 1 | 68 | Example 3 | 80 |
| 8 | 2 | 69 | Example 3 | 80 |
The heat-conducting performance of the examples 1-3 is obviously better than that of the comparative example, the measured temperature of the high heat-conducting soft pad prepared by the examples 1-3 at the position 1 and the position 2 can be basically consistent, and the temperature conduction at each point in the horizontal direction has no obvious difference.
When the embodiment is applied, the prepared high-heat-conductivity cushion has excellent heat dissipation performance and certain wear resistance and corrosion resistance; the laminated structure of the graphite film layer and the graphene layer is prepared, so that the heat dissipation effect is enhanced, and the composite material has the advantage of light weight; adopt first silica gel resin layer, carbon fiber film layer, second silica gel resin layer structure, the reinforcing supports the pliability, and when overall structure contacted the heat source, had the unanimous good heat transfer performance of horizontal direction and vertical direction, it was more even to transfer heat.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (9)
1. High heat conduction cushion, its characterized in that: the carbon fiber composite membrane comprises a plurality of groups of graphite membrane layers, a first silica gel resin layer, a carbon fiber membrane layer, a graphene layer and a second silica gel resin layer which are sequentially arranged, wherein the surfaces of all the layers in each group are attached with a heat source; outer graphite rete and outer second silica gel resin layer all are provided with one deck pressure sensitive glue membrane, the surface bonding heat conduction granule of carbon fiber film layer, first silica gel resin layer and the inside support by glass fiber or ceramic particle net of second silica gel resin layer.
2. The high thermal conductivity cushion according to claim 1, wherein: the surface of graphite rete, first silica gel resin layer, carbon fiber film layer, graphite alkene layer, second silica gel resin layer all covers there is the one deck from type paper.
3. The high thermal conductivity cushion according to claim 1, wherein: the heat conducting particles are silver powder or copper powder.
4. The high thermal conductivity cushion according to claim 1, wherein: the widths of the first silica gel resin layer and the second silica gel resin layer are 400-500 mu m.
5. The high thermal conductivity cushion according to claim 1, wherein: the width of the graphite film layer is 25-30 μm.
6. The high thermal conductivity cushion according to claim 1, wherein: the width of the graphene layer is 5-10 μm.
7. The high thermal conductivity cushion according to claim 1, wherein: the width of the carbon fiber film layer is 10-20 mu m.
8. The high thermal conductivity cushion according to claim 1, wherein: the surface of the carbon fiber film layer is bonded with the heat conduction particles through an adhesive, and the adhesive is acrylate.
9. The preparation method of the high-thermal-conductivity cushion is characterized by comprising the following steps of:
1) preparing a graphite film layer, namely selecting a high polymer film material as a raw material, carbonizing the raw material in a carbonization furnace, graphitizing the raw material in a graphitization furnace, and pressing and spreading the raw material to prepare the graphite film layer;
2) preparing a carbon fiber film layer, and pressing and spreading the carbon fiber film to a set size;
3) spraying an adhesive on the surface of the carbon fiber film;
4) spreading the heat conducting particles on the surface of the carbon fiber film, and naturally drying;
5) preparing a graphene layer, uniformly mixing a graphene oxide aqueous solution and a reducing agent, standing at the temperature of 60-80 ℃, performing suction filtration on a filter membrane, drying a filter cake at the temperature of 100-110 ℃, and stripping the filter membrane to obtain the graphene layer;
6) preparing a silica gel resin layer, filling and coating the silica gel resin on a glass fiber or ceramic particle net, and uniformly paving;
7) and carrying out composite molding on the graphite film layer, the first silica gel resin layer, the carbon fiber film layer, the graphene layer and the second silica gel resin layer at 90-150 ℃ by a film laminating machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010595812.0A CN113853093A (en) | 2020-06-28 | 2020-06-28 | High-heat-conductivity soft cushion and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010595812.0A CN113853093A (en) | 2020-06-28 | 2020-06-28 | High-heat-conductivity soft cushion and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI846507B (en) * | 2023-06-08 | 2024-06-21 | 國立高雄大學 | Compressible Thermally Conductive Pad |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102925859A (en) * | 2011-10-23 | 2013-02-13 | 常州碳元科技发展有限公司 | Preparation method for carbon layer material with protective layer structure |
| CN103895277A (en) * | 2014-04-11 | 2014-07-02 | 江苏悦达新材料科技有限公司 | Graphite film/heat-conducting silica gel/graphene composite radiating fin and preparation method for same |
| KR20140089725A (en) * | 2013-01-07 | 2014-07-16 | 도레이첨단소재 주식회사 | Thermal diffusion sheet and the manufacturing method thereof |
| CN204585979U (en) * | 2015-01-27 | 2015-08-26 | 衡山县佳诚新材料有限公司 | Heat conduction soft silica gel insulation spacer |
| CN105111484A (en) * | 2015-08-28 | 2015-12-02 | 上海利物盛企业集团有限公司 | Method for efficiently and continuously preparing heat-conducting graphite film on large area |
| CN106332522A (en) * | 2014-01-26 | 2017-01-11 | 斯迪克新型材料（江苏）有限公司 | High-heat-conductivity graphite film |
| CN207093112U (en) * | 2017-06-29 | 2018-03-13 | 阜宁县曙光合成革有限公司 | A kind of air duct coating cloth for coal mine |
| CN108819360A (en) * | 2018-04-20 | 2018-11-16 | 哈尔滨理工大学 | A kind of graphene heat conducting film/heat conductive silica gel film composite material of stratiform alternating structure and preparation method thereof |
| CN210011437U (en) * | 2018-12-29 | 2020-02-04 | 东莞市鼎力薄膜科技有限公司 | Heat-conducting silica gel heat-dissipation composite film |
-
2020
- 2020-06-28 CN CN202010595812.0A patent/CN113853093A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102925859A (en) * | 2011-10-23 | 2013-02-13 | 常州碳元科技发展有限公司 | Preparation method for carbon layer material with protective layer structure |
| KR20140089725A (en) * | 2013-01-07 | 2014-07-16 | 도레이첨단소재 주식회사 | Thermal diffusion sheet and the manufacturing method thereof |
| CN106332522A (en) * | 2014-01-26 | 2017-01-11 | 斯迪克新型材料（江苏）有限公司 | High-heat-conductivity graphite film |
| CN103895277A (en) * | 2014-04-11 | 2014-07-02 | 江苏悦达新材料科技有限公司 | Graphite film/heat-conducting silica gel/graphene composite radiating fin and preparation method for same |
| CN204585979U (en) * | 2015-01-27 | 2015-08-26 | 衡山县佳诚新材料有限公司 | Heat conduction soft silica gel insulation spacer |
| CN105111484A (en) * | 2015-08-28 | 2015-12-02 | 上海利物盛企业集团有限公司 | Method for efficiently and continuously preparing heat-conducting graphite film on large area |
| CN207093112U (en) * | 2017-06-29 | 2018-03-13 | 阜宁县曙光合成革有限公司 | A kind of air duct coating cloth for coal mine |
| CN108819360A (en) * | 2018-04-20 | 2018-11-16 | 哈尔滨理工大学 | A kind of graphene heat conducting film/heat conductive silica gel film composite material of stratiform alternating structure and preparation method thereof |
| CN210011437U (en) * | 2018-12-29 | 2020-02-04 | 东莞市鼎力薄膜科技有限公司 | Heat-conducting silica gel heat-dissipation composite film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI846507B (en) * | 2023-06-08 | 2024-06-21 | 國立高雄大學 | Compressible Thermally Conductive Pad |
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