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CN106304780A - Manufacturing process for high conduction graphite film - Google Patents

Manufacturing process for high conduction graphite film Download PDF

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Publication number
CN106304780A
CN106304780A CN201610696862.1A CN201610696862A CN106304780A CN 106304780 A CN106304780 A CN 106304780A CN 201610696862 A CN201610696862 A CN 201610696862A CN 106304780 A CN106304780 A CN 106304780A
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CN
China
Prior art keywords
graphite
parts
degree
film
hour
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Granted
Application number
CN201610696862.1A
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Chinese (zh)
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CN106304780B (en
Inventor
金闯
梁豪
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Sidike New Materials Jiangsu Co Ltd
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Sidike New Materials Jiangsu Co Ltd
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Publication of CN106304780A publication Critical patent/CN106304780A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention discloses a kind of manufacturing process for high conduction graphite film, comprise the following steps: Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after keeping 1 hour；It is coated with the Kapton after one layer of graphite modified dose of acquisition processes on the upper and lower surface of the Kapton through step one；Described graphite modified dose is made up of the component of following weight portion: benzophenone tetracarboxylic dianhydride 23 parts, pyromellitic acid anhydride 12 parts, MDA 26.5 parts, dimethylformamide 34 parts, ethylene glycol 2.2 parts, polydimethylsiloxane 2 parts.The present invention is filled with the pin hole in heating process, improves degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings biaxial tension performance.

Description

Manufacturing process for high conduction graphite film
Technical field
The present invention relates to a kind of high conduction graphite film, belong to double faced adhesive chip technology field.
Background technology
Along with modern microelectronic technology high-speed develops, electronic equipment (such as notebook computer, mobile phone, panel computer etc.) is day by day Becoming ultra-thin, light, this structure makes electronic equipment internal power density significantly improve, and in operation, produced heat is difficult to Discharge, be prone to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use longevity Life.Therefore, Current electronic industry is for proposing the highest requirement as the heat sink material of heat control system core component, urgently Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment is properly functioning.
In prior art, Kapton is mostly used for flexible PCB, although has and uses polyimide film sintered obtaining Obtain graphite heat radiation fin, thus be covered on thermal source, but be constrained to the good and the bad of the product quality and performances of Kapton not Together, have influence on the performance of heat radiation two-sided pad pasting heat dispersion, there is techniques below problem: dispel the heat uneven, adhesive tape easily occurs Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product Competitiveness.
Summary of the invention
It is an object of the present invention to provide a kind of manufacturing process for high conduction graphite film, this is used for the system of high conduction graphite film Make technique and the most all improve heat conductivility, it is to avoid adhesive tape hot-spot, it is achieved that adhesive tape heat conductivity While the uniformity of energy, improve the heat dispersion stability of product, reliability, greatly reduce the cost of product.
For reaching above-mentioned purpose, the technical solution used in the present invention is: a kind of manufacturing process for high conduction graphite film, Described high conduction graphite film fits between radiating piece and heat generating components, and described high conduction graphite film includes light strippable PET film With weight strippable PET film, between this light strippable PET film and weight strippable PET film, it is disposed with the first heat-conducting glue adhesion coating, stone Layer of ink and the second heat-conducting glue adhesion coating；Described graphite linings is obtained by following process, and this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after keeping 1 hour；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes After Kapton；
Described graphite modified dose is made up of the component of following weight portion: benzophenone tetracarboxylic dianhydride 23 parts, pyromellitic acid anhydride 12 parts, MDA 26.5 parts, dimethylformamide 34 parts, ethylene glycol 2.2 parts, polydimethylsiloxane 2 parts；
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, thus obtain the carbonized film of pre-burned；
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4；
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then the speed with 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after keeping 1.8 ~ 2.2 hours, thus obtains the main graphite film fired；
Step 6, the graphite film that then master of step 3 gained fires carry out rolling thus obtain described graphite linings.
In technique scheme, further improved plan is as follows:
In such scheme, the viscosity of described graphite modified dose is 30000 ~ 48000CP.
Owing to technique scheme is used, the present invention compared with prior art has following advantages and an effect:
The present invention is for the manufacturing process of high conduction graphite film, and in its structure, graphite linings is coated with one layer of graphite by upper and lower surface The Kapton of modifying agent is prepared from, and improves at heat conductivility both vertically and horizontally, it is to avoid adhesive tape office Portion is overheated, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, it is positioned at graphite modified dose of Kapton surface by two Benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, polydimethylsiloxanes Alkane forms, and is coated on Kapton, the pin hole being filled with in heating process, improves degree of crystallinity simultaneously, also overcomes Thermal contraction is excessive cause uneven, improve graphite linings biaxial tension performance；Again, Kapton surface has graphite Modifying agent, improves graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and uses calender to roll described pre-burned Carbonized film, it is to avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, carry further High at heat conductivility both vertically and horizontally.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of manufacturing process for high conduction graphite film, described high conduction graphite film fits in radiating piece and heating Between parts, described high conduction graphite film includes light strippable PET film and weight strippable PET film, this light strippable PET film and weight The first heat-conducting glue adhesion coating, graphite linings and the second heat-conducting glue adhesion coating it is disposed with between strippable PET film；Described graphite linings is passed through Following process obtains, and this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, rise to 400 DEG C, after keeping 1 hour, be down to room temperature；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes After Kapton, described graphite modified dose is made up of the component of following weight portion, as shown in table 1:
Table 1
Note: the viscosity of graphite modified dose of embodiment is 32000CP；
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, thus obtain the carbonized film of pre-burned；
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4；
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then the speed with 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after keeping 1.8 ~ 2.2 hours, thus obtains the main graphite film fired；
Step 6, the graphite film that then master of step 5 gained fires carry out rolling thus obtain described graphite linings.
Described step 6 acquisition graphite linings is carried out calendering process.
The grammes per square metre of above-mentioned light strippable PET film 1 peeling force is 5 ~ 10g/m2, described heavy strippable PET film 2 peeling force gram It is heavily 50 ~ 100g/m2。
Using above-mentioned when the manufacturing process of high conduction graphite film, in its structure, graphite linings is coated with by upper and lower surface The Kapton of one layer graphite modified dose is prepared from, and improves at heat conductivility both vertically and horizontally, keeps away Exempt from adhesive tape hot-spot, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, its graphite being positioned at Kapton surface changes Property agent by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, poly-two Methylsiloxane forms, and is coated on Kapton, the pin hole being filled with in heating process, improves degree of crystallinity simultaneously, Also overcome thermal contraction excessive cause uneven, improve graphite linings biaxial tension performance；Again, Kapton surface There is graphite modified dose, improve graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and use calender to roll institute State the carbonized film of pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, Further increase at heat conductivility both vertically and horizontally.
Above-described embodiment, only for technology design and the feature of the explanation present invention, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implements according to this, can not limit the scope of the invention with this.All according to the present invention The equivalence that spirit is made changes or modifies, and all should contain within protection scope of the present invention.

Claims (2)

1. for the manufacturing process of high conduction graphite film, described high conduction graphite film fit in radiating piece and heat generating components it Between, described high conduction graphite film includes that light strippable PET film and weight strippable PET film, this light strippable PET film and weight are exfoliated The first heat-conducting glue adhesion coating, graphite linings and the second heat-conducting glue adhesion coating it is disposed with between PET film；It is characterized in that: described graphite Layer is obtained by following process, and this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after keeping 1 hour；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes After Kapton；
Described graphite modified dose is made up of the component of following weight portion: benzophenone tetracarboxylic dianhydride 23 parts, pyromellitic acid anhydride 12 parts, MDA 26.5 parts, dimethylformamide 34 parts, ethylene glycol 2.2 parts, polydimethylsiloxane 2 parts；
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, thus obtain the carbonized film of pre-burned；
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4；
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then the speed with 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after keeping 1.8 ~ 2.2 hours, thus obtains the main graphite film fired；
Step 6, the graphite film that then master of step 3 gained fires carry out rolling thus obtain described graphite linings.
Manufacturing process for high conduction graphite film the most according to claim 1, it is characterised in that: described graphite modified dose Viscosity be 30000 ~ 48000CP.
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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106231865A (en) * 2016-07-29 2016-12-14 芜湖迈特电子科技有限公司 A kind of Novel heat-conducting graphite flake and manufacture method thereof
CN107473212A (en) * 2017-07-11 2017-12-15 广东思泉新材料股份有限公司 A kind of synthetic method of synthetic graphite and native graphite mixing coiled material
CN107266076A (en) * 2017-07-12 2017-10-20 合肥东恒锐电子科技有限公司 A kind of manufacturing process of the heat conduction pad pasting of mobile phone
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CN109280501A (en) * 2018-08-22 2019-01-29 江苏博之高新材料科技有限公司 A kind of smart phone soaking pressure sensitive adhesive tape
CN109819629A (en) * 2019-01-16 2019-05-28 苏州世沃电子科技有限公司 A kind of fire-retardant crack resistance type graphite heat radiation fin and preparation method thereof
CN109554130A (en) * 2019-01-31 2019-04-02 常德力元新材料有限责任公司 A kind of graphite glue band and preparation method thereof
CN110092374A (en) * 2019-05-28 2019-08-06 宇冠芯龙(武汉)科技有限公司 A kind of preparation method and graphite film material of electrographite film
CN113853093A (en) * 2020-06-28 2021-12-28 昆山威斯泰电子技术有限公司 High-heat-conductivity soft cushion and preparation method thereof
CN113444499B (en) * 2021-06-25 2022-03-11 深圳市三科斯电子材料有限公司 Double-sided adhesive high-thermal-conductivity synthetic graphite flake and preparation method thereof
CN113880595B (en) * 2021-11-16 2023-03-28 江西鸿美新能源科技有限公司 Graphite film with high heat conductivity in vertical direction and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011007510A1 (en) * 2009-07-13 2011-01-20 パナソニック株式会社 Graphite sheet and heat transfer structure using same
US20120298345A1 (en) * 2010-02-17 2012-11-29 Green Star Co., Ltd. Heat sink sheet including an adhesive having good heat conductivity
CN203181498U (en) * 2013-03-25 2013-09-04 深圳市跨越电子有限公司 A graphite film with high thermal conductivity
CN203243663U (en) * 2013-04-24 2013-10-16 常州碳元科技发展有限公司 High heat conductivity graphite film heat-dissipating structure applied to shell of electronic terminal
CN203289811U (en) * 2013-05-27 2013-11-13 苏州沛德导热材料有限公司 A graphite heat conduction and wave absorption device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7758842B2 (en) * 2003-09-02 2010-07-20 Kaneka Corporation Filmy graphite and process for producing the same
CN2696285Y (en) * 2004-04-27 2005-04-27 天瑞企业股份有限公司 Radiation structure of elatroluminescent display element
JP2008266416A (en) * 2007-04-18 2008-11-06 Ube Ind Ltd Method for producing polyimide film and polyimide film
CN101687647B (en) * 2007-05-17 2013-04-17 株式会社钟化 Graphite film and graphite composite film
JP5460569B2 (en) * 2010-12-17 2014-04-02 株式会社カネカ Film-like graphite and method for producing the same
US9067185B2 (en) * 2011-03-28 2015-06-30 Kaneka Corporation Process for producing graphite film
CN103045199A (en) * 2011-10-13 2013-04-17 张彪 Process for preparing drilling fluid based on control of dosage of viscosity reducer
CN202322703U (en) * 2011-11-07 2012-07-11 吴志高 Adhesive tape with heat conduction performance
CN202936356U (en) * 2012-11-01 2013-05-15 斯迪克新型材料（江苏）有限公司 Double-sided adhesive for heat dissipation of electronic elements
CN103865417B (en) * 2012-12-18 2016-04-27 苏州斯迪克新材料科技股份有限公司 The manufacturing process of acrylate sealing tape
CN103059761B (en) * 2012-12-28 2014-09-03 斯迪克新型材料（江苏）有限公司 High-heat conductivity coefficient graphite heat-radiation adhesive tape
CN103043657B (en) * 2012-12-28 2014-10-15 苏州斯迪克新材料科技股份有限公司 Graphite radiation fin for adhesive tapes
CN103045119B (en) * 2012-12-28 2014-04-23 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011007510A1 (en) * 2009-07-13 2011-01-20 パナソニック株式会社 Graphite sheet and heat transfer structure using same
US20120298345A1 (en) * 2010-02-17 2012-11-29 Green Star Co., Ltd. Heat sink sheet including an adhesive having good heat conductivity
CN203181498U (en) * 2013-03-25 2013-09-04 深圳市跨越电子有限公司 A graphite film with high thermal conductivity
CN203243663U (en) * 2013-04-24 2013-10-16 常州碳元科技发展有限公司 High heat conductivity graphite film heat-dissipating structure applied to shell of electronic terminal
CN203289811U (en) * 2013-05-27 2013-11-13 苏州沛德导热材料有限公司 A graphite heat conduction and wave absorption device

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