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CN107043108B - Cooling fin manufacturing process for smart phone - Google Patents

Cooling fin manufacturing process for smart phone Download PDF

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Publication number
CN107043108B
CN107043108B CN201710095543.XA CN201710095543A CN107043108B CN 107043108 B CN107043108 B CN 107043108B CN 201710095543 A CN201710095543 A CN 201710095543A CN 107043108 B CN107043108 B CN 107043108B
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parts
kapton
graphite
cooling fin
treated
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CN107043108A (en
Inventor
金闯
梁豪
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Sidike New Materials Jiangsu Co Ltd
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Sidike New Materials Jiangsu Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
    • B28B3/12—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein one or more rollers exert pressure on the material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
    • C04B2235/483—Si-containing organic compounds, e.g. silicone resins, (poly)silanes, (poly)siloxanes or (poly)silazanes
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
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Abstract

A kind of cooling fin manufacturing process for smart phone of the present invention, the heat dissipation patch is obtained by following steps: Step 1: graphite modified dose of acquisition treated Kapton is respectively coated in the upper and lower surfaces in Kapton, treated, and Kapton is made of Kapton, the first coat and the second coat；The graphite modified dose of group by following parts by weight is grouped as: 25 parts of benzophenone tetracarboxylic dianhydride, 16.5 parts of pyromellitic acid anhydride, 23.5 parts of diaminodiphenylmethane, 22 parts of dimethylformamide, 9 parts of N-Methyl pyrrolidone, 2 parts of ethylene glycol, 2.5 parts of dimethyl silicone polymer, 1.5 parts of dibutyl phthalate.Present invention reduces azeotropic point and smooth boiling point areas, improve the flatness and flexibility of final products film forming.

Description

Cooling fin manufacturing process for smart phone
Technical field
The present invention relates to a kind of cooling fin manufacturing process for smart phone, belong to graphite flake technical field.
Background technique
With modern microelectronic technology high speed development, electronic equipment (such as laptop, mobile phone, tablet computer) is increasingly Become ultra-thin, light, this structure significantly improves electronic equipment internal power density, and generated heat is not easy in operation It is discharged, is easy to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity Life.Therefore, Current electronic industry proposes increasingly higher demands for the heat sink material as heat control system core component, urgently It needs a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensures that electronic equipment operates normally.
Kapton is mostly used for flexible circuit board in the prior art, is obtained although having using polyimide film sintered Graphite heat radiation fin, to be covered on heat source, but be constrained to Kapton product quality and performances the good and the bad not Together, influenced the performance of the two-sided pad pasting heat dissipation performance of heat dissipation, there are following technical problems: heat dissipation is uneven, adhesive tape easily occurs Hot-spot, the heat dissipation performance for improving product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences product Competitiveness.
Summary of the invention
Objects of the present invention are to provide a kind of cooling fin manufacturing process for smart phone, what which obtained Cooling fin improves heating conduction in the vertical direction and the horizontal direction, avoids hot-spot, realizes the uniform of heating conduction While property, heat dissipation performance stability, the reliability of product are improved, the cost of product is greatly reduced.
To achieve the above object of the invention, the technical solution adopted by the present invention is that: a kind of cooling fin system for smart phone Technique is made, the graphite heat radiation fin is obtained by following steps:
Step 1: the upper and lower surfaces in Kapton are respectively coated graphite modified dose to obtain treated polyamides sub- Amine film, treated, and Kapton is made of Kapton, the first coat and the second coat；
The graphite modified dose of group by following parts by weight is grouped as:
25 parts of benzophenone tetracarboxylic dianhydride,
16.5 parts of pyromellitic acid anhydride,
23.5 parts of diaminodiphenylmethane,
22 parts of dimethylformamide,
9 parts of N-Methyl pyrrolidone,
2 parts of ethylene glycol,
2.5 parts of dimethyl silicone polymer,
1.5 parts of dibutyl phthalate；
Step 2: will treated Kapton under inert gas protection, rise to 240 DEG C ~ 260 DEG C from room temperature, 480 DEG C ~ 500 DEG C are risen to after heat preservation, are warming up to 780 DEG C ~ 820 DEG C after heat preservation again, it is cooling after 1200 DEG C are risen to after heat preservation, to obtain Obtain the carbonized film of pre-burned；
Step 3: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then cooled down after being warming up to 2850 DEG C ~ 2950 DEG C, To obtain the graphite film of main firing；
It is pasted Step 4: the graphite film of the resulting main firing of step 3 is then carried out calendering to obtain the heat conductive graphite Piece.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art:
1, the present invention is used for the cooling fin manufacturing process of smart phone, and graphite linings are coated with by upper and lower surfaces in structure One layer graphite modified dose of Kapton is prepared, and improves heating conduction in the vertical direction and the horizontal direction, keeps away Exempt from adhesive tape hot-spot, realizes the uniformity of adhesive tape heating conduction；Secondly, its graphite for being located at Kapton surface changes Property agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, ethylene glycol, poly- two Methylsiloxane composition, is coated on Kapton, and the pin hole being filled in heating process improves crystallinity simultaneously, It is excessive caused uneven to also overcome thermal contraction, improves graphite linings biaxial tension performance.
2, the present invention is used for the cooling fin manufacturing process of smart phone, is located at the graphite modified of Kapton surface Agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, N- crassitude Ketone, ethylene glycol, dimethyl silicone polymer composition, using dimethylformamide, N-Methyl pyrrolidone reduce azeotropic point and Smooth boiling point area improves the flatness and flexibility of final products film forming；Secondly, dimethylformamide, N- methylpyrrole Alkanone and dibutyl phthalate Kapton surface, prevent bubble from generating, are more advantageous to filled polyimide film Small pin hole, improve heat dissipation patch heating conduction uniformity.
3, the present invention is used for the cooling fin manufacturing process of smart phone, increases between the carbonized film and graphitization of pre-burned Calendaring processes, and roll again after re-forming heat conduction graphite patch, the volume for avoiding fold and being graphitized in sintering process It shrinks, improves compactness and crystallinity, further improve heating conduction in the vertical direction and the horizontal direction.
Specific embodiment
The present invention will be further described below with reference to examples:
Embodiment: a kind of cooling fin manufacturing process for smart phone, the graphite heat radiation fin are obtained by following steps :
Step 1: the upper and lower surfaces in Kapton are respectively coated graphite modified dose to obtain treated polyamides sub- Amine film, treated, and Kapton is made of Kapton, the first coat and the second coat；
The graphite modified dose of group by following parts by weight is grouped as:
25 parts of benzophenone tetracarboxylic dianhydride,
16.5 parts of pyromellitic acid anhydride,
23.5 parts of diaminodiphenylmethane,
22 parts of dimethylformamide,
9 parts of N-Methyl pyrrolidone,
2 parts of ethylene glycol,
2.5 parts of dimethyl silicone polymer,
1.5 parts of dibutyl phthalate；
Step 2: will treated Kapton under inert gas protection, rise to 240 DEG C ~ 260 DEG C from room temperature, 480 DEG C ~ 500 DEG C are risen to after heat preservation, are warming up to 780 DEG C ~ 820 DEG C after heat preservation again, it is cooling after 1200 DEG C are risen to after heat preservation, to obtain Obtain the carbonized film of pre-burned；
Step 3: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then cooled down after being warming up to 2850 DEG C ~ 2950 DEG C, To obtain the graphite film of main firing；
It is pasted Step 4: the graphite film of the resulting main firing of step 3 is then carried out calendering to obtain the heat conductive graphite Piece.
Above-mentioned graphite modified dose of viscosity is 30000 ~ 48000CP.
A kind of manufacturing process of above-mentioned graphite heat radiation fin, comprising the following steps:
Step 1: the upper and lower surfaces in Kapton are respectively coated graphite modified dose to obtain treated polyamides sub- Amine film, treated, and Kapton is made of Kapton, the first coat and the second coat, the graphite The viscosity of modifying agent is 30000 ~ 48000CP；
The graphite modified dose of group by following parts by weight is grouped as:
25 parts of benzophenone tetracarboxylic dianhydride,
16.5 parts of pyromellitic acid anhydride,
23.5 parts of diaminodiphenylmethane,
22 parts of dimethylformamide,
9 parts of N-Methyl pyrrolidone,
2 parts of ethylene glycol,
2.5 parts of dimethyl silicone polymer,
1.5 parts of dibutyl phthalate；
Step 2: will treated Kapton under inert gas protection, rise to 240 DEG C ~ 260 DEG C from room temperature, 480 DEG C ~ 500 DEG C are risen to after heat preservation, are warming up to 780 DEG C ~ 820 DEG C after heat preservation again, it is cooling after 1200 DEG C are risen to after heat preservation, to obtain Obtain the carbonized film of pre-burned；
Step 3: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then cooled down after being warming up to 2850 DEG C ~ 2950 DEG C, To obtain the graphite film of main firing；
It is pasted Step 4: the graphite film of the resulting main firing of step 3 is then carried out calendering to obtain the heat conductive graphite Piece.
When using above-mentioned manufacturing process, obtains and be coated with for graphite linings in its structure of graphite heat radiation fin by upper and lower surfaces One layer graphite modified dose of Kapton is prepared, and improves heating conduction in the vertical direction and the horizontal direction, keeps away Exempt from adhesive tape hot-spot, realizes the uniformity of adhesive tape heating conduction；Secondly, its graphite for being located at Kapton surface changes Property agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, ethylene glycol, poly- two Methylsiloxane composition, is coated on Kapton, and the pin hole being filled in heating process improves crystallinity simultaneously, It is excessive caused uneven to also overcome thermal contraction, improves graphite linings biaxial tension performance, also reduces azeotropic point and put down Sliding boiling point area improves the flatness and flexibility of final products film forming；Again, Kapton surface changes with graphite Property agent, improve graphite linings and thermally conductive adhesive layer heating conduction in two-sided pad pasting, and the pre-burned is rolled using calender Carbonized film, the volume contraction for avoiding fold and being graphitized in sintering process, improves compactness and crystallinity, further increases Heating conduction in the vertical direction and the horizontal direction.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.

Claims (1)

1. a kind of cooling fin manufacturing process for smart phone, it is characterised in that: the cooling fin is obtained by following steps:
Step 1: the upper and lower surfaces in Kapton are respectively coated graphite modified dose and obtain that treated that polyimides is thin Film, treated, and Kapton is made of Kapton, the first coat and the second coat；
The graphite modified dose of group by following parts by weight is grouped as:
25 parts of benzophenone tetracarboxylic dianhydride,
16.5 parts of pyromellitic acid anhydride,
23.5 parts of diaminodiphenylmethane,
22 parts of dimethylformamide,
9 parts of N-Methyl pyrrolidone,
2 parts of ethylene glycol,
2.5 parts of dimethyl silicone polymer,
1.5 parts of dibutyl phthalate；
Step 2: will treated Kapton under inert gas protection, rise to 240 DEG C ~ 260 DEG C from room temperature, heat preservation After rise to 480 DEG C ~ 500 DEG C, 780 DEG C ~ 820 DEG C are warming up to after heat preservation again, it is cooling after 1200 DEG C are risen to after heat preservation, to obtain pre- The carbonized film of firing；
Step 3: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then is cooled down after being warming up to 2850 DEG C ~ 2950 DEG C, thus Obtain the graphite film of main firing；
Step 4: the graphite film of the resulting main firing of step 3 is then carried out calendering to obtain the cooling fin.
CN201710095543.XA 2014-01-26 2014-01-26 Cooling fin manufacturing process for smart phone Active CN107043108B (en)

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CN201710095543.XA CN107043108B (en) 2014-01-26 2014-01-26 Cooling fin manufacturing process for smart phone
CN201410036320.2A CN104812204B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat radiation fin

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CN201410036320.2A Division CN104812204B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat radiation fin

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CN107043108A CN107043108A (en) 2017-08-15
CN107043108B true CN107043108B (en) 2019-04-23

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CN201710095545.9A Pending CN107043257A (en) 2014-01-26 2014-01-26 Manufacture method for the fin of computer radiator
CN201710665184.7A Pending CN108218428A (en) 2014-01-26 2014-01-26 For the manufacturing method of tablet computer soaking patch
CN201710665173.9A Pending CN107573072A (en) 2014-01-26 2014-01-26 The production method of high compactness fin
CN201710095543.XA Active CN107043108B (en) 2014-01-26 2014-01-26 Cooling fin manufacturing process for smart phone
CN201410036320.2A Active CN104812204B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat radiation fin
CN201710095575.XA Pending CN107043255A (en) 2014-01-26 2014-01-26 The manufacturing process of fin
CN201710095581.5A Pending CN107043258A (en) 2014-01-26 2014-01-26 The manufacture method of notebook computer fin
CN201710665192.1A Pending CN108646885A (en) 2014-01-26 2014-01-26 Cooling fin for laptop
CN201710095544.4A Pending CN107043256A (en) 2014-01-26 2014-01-26 Manufacturing process for the paster that radiates
CN201710665183.2A Pending CN107986789A (en) 2014-01-26 2014-01-26 Smart mobile phone heat dissipation film
CN201710665185.1A Pending CN108206164A (en) 2014-01-26 2014-01-26 For the cooling fin of microelectronics heat dissipation

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CN104812204B (en) 2017-08-25
CN108646885A (en) 2018-10-12
CN107043108A (en) 2017-08-15
CN108218428A (en) 2018-06-29
CN107573072A (en) 2018-01-12
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CN107986789A (en) 2018-05-04
CN107043258A (en) 2017-08-15

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