CN106413340A - Heat conducting adhesive film for electronic product - Google Patents
Heat conducting adhesive film for electronic product Download PDFInfo
- Publication number
- CN106413340A CN106413340A CN201610700227.6A CN201610700227A CN106413340A CN 106413340 A CN106413340 A CN 106413340A CN 201610700227 A CN201610700227 A CN 201610700227A CN 106413340 A CN106413340 A CN 106413340A
- Authority
- CN
- China
- Prior art keywords
- film
- graphite
- heat conduction
- pet film
- kapton
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/156—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is calendered and immediately laminated
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- B32B38/18—Handling of layers or the laminate
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/522—Graphite
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
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- C—CHEMISTRY; METALLURGY
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- B32B2307/30—Properties of the layers or laminate having particular thermal properties
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
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- C04B2235/661—Multi-step sintering
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
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- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a heat conducting adhesive film for an electronic product. A graphite layer is obtained by the following technological method through the steps of coating the upper and lower surfaces of a polyimide film which is processed in the step 1 with a layer of graphite modifying agent to obtain a processed polyimide film; heating the processed polyimide film to 800 DEG C, and performing thermal insulation, and then heating to 1,200 DEG C to obtain a pre-sintered carbonized film; performing calendering on the pre-sintered carbonized film in the step 4 through a calendering machine; heating to 2,400 DEG C, performing thermal insulation, and then heating to 2,900 DEG C so as to obtain a main-sintered graphite film; and performing calendering on the main-sintered graphite film obtained in the step 5 so as to obtain the graphite layer. By calendering the pre-sintered carbonized film through the calendering machine, wrinkles and volume shrinkage in a graphitizing sintering process are avoided, thereby improving density and degree of crystallinity.
Description
Technical field
The present invention relates to a kind of use for electronic products heat conduction pad pasting, belong to double faced adhesive chip technology field.
Background technology
With the development of modern microelectronic technology high-speed, electronic equipment(As notebook computer, mobile phone, panel computer etc.)Increasingly
Become ultra-thin, light, this structure makes electronic equipment internal power density significantly improve, and in operation, produced heat is difficult
Discharge, be easy to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity
Life.Therefore, Current electronic industry proposes higher and higher requirement for the heat sink material as heat control system core component, urgently
Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment normally runs.
In prior art, Kapton is mostly used for flexible PCB and is obtained using polyimide film sintered although having
Obtaining graphite heat radiation fin, thus being covered on thermal source, but being constrained to the good and the bad of the product quality and performances of Kapton not
Together, have influence on the performance of radiating two-sided pad pasting heat dispersion, there is following technical problem:Radiating is uneven, adhesive tape easily
Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product
Competitiveness.
Content of the invention
It is an object of the present invention to provide a kind of use for electronic products heat conduction pad pasting, this use for electronic products heat conduction pad pasting is in vertical direction
All improve heat conductivility with horizontal direction, it is to avoid adhesive tape hot-spot it is achieved that while the uniformity of adhesive tape heat conductivility,
Improve heat dispersion stability, the reliability of product, greatly reduce the cost of product.
For reaching above-mentioned purpose, the technical solution used in the present invention is:A kind of use for electronic products heat conduction pad pasting, described radiating
Two-sided pad pasting fits between radiating piece and heat generating components, and the two-sided pad pasting of described radiating includes light strippable PET film and re-release
Type PET film, is disposed with the first heat conduction adhesive layer, graphite linings and between this light strippable PET film and re-release type PET film
Two heat conduction adhesive layers;Described graphite linings are obtained by following process, and this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature;
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes
Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP;
The described graphite modified dose of group by following weight portion is grouped into:25 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride
17 parts, 22 parts of MDA, 33 parts of dimethylformamide, 1.6 parts of ethylene glycol, 2.7 parts of dimethyl silicone polymer;
Step 3, the Kapton after processing is warming up to 800 DEG C, being warming up to 1200 DEG C after insulation, cools down after insulation,
Thus obtaining the carbonized film of pre-burned;
Step 4, using calender roll described step 4 pre-burned carbonized film;
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtaining the graphite that master fires
Film;
The graphite film that the master of step 6 and then step 5 gained fires is rolled thus being obtained described graphite linings.
In technique scheme, further improved scheme is as follows:
In such scheme, described step 4 acquisition graphite film is carried out calendering process.
In such scheme, the grammes per square metre of described light strippable PET film peeling force is 5 ~ 10g/m2, described re-release type PET film
The grammes per square metre of peeling force is 50 ~ 100g/m2.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
Use for electronic products heat conduction pad pasting of the present invention, in its structure, graphite linings are coated with one layer graphite modified dose by upper and lower surface
Kapton is prepared from, and improves in heat conductivility both vertically and horizontally, it is to avoid adhesive tape hot-spot, real
Show the uniformity of adhesive tape heat conductivility;Next, it is located at graphite modified dose of Kapton surface by benzophenone four
Acid dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, dimethyl silicone polymer composition,
It is coated on Kapton, is filled with the pin hole in heating process, improve degree of crystallinity simultaneously, also overcome thermal contraction
Lead to greatly is uneven, improves graphite linings biaxial tension performance;Again, Kapton surface has graphite modified dose,
Improve graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and roll the carbonization of described pre-burned using calender
Film, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and degree of crystallinity, further increases
Heat conductivility both vertically and horizontally.
Brief description
Accompanying drawing 1 is use for electronic products heat conduction film structure schematic diagram of the present invention;
Accompanying drawing 2 is use for electronic products heat conduction pad pasting application schematic diagram of the present invention;
Accompanying drawing 3 is the partial structural diagram of accompanying drawing 2.
In the figures above:1st, radiating piece;2nd, heat generating components;3rd, light strippable PET film;4th, re-release type PET film;5th, first
Heat conduction adhesive layer;6th, graphite linings;7th, the second heat conduction adhesive layer.
Specific embodiment
With reference to embodiment, the invention will be further described:
Embodiment:A kind of use for electronic products heat conduction pad pasting, the two-sided pad pasting of described radiating fit in radiating piece 1 and heat generating components 2 it
Between, the two-sided pad pasting of described radiating includes light strippable PET film 3 and re-release type PET film 4, this light strippable PET film 3 and again shelling
It is disposed with the first heat conduction adhesive layer 5, graphite linings 6 and the second heat conduction adhesive layer 7 between release PET film 4;Described graphite linings 6
Obtained by following process, this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then
With 2.5 ~ 3.5 degree/min, rise to 400 DEG C, after keeping 1 hour, be down to room temperature;
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes
Kapton afterwards, the described graphite modified dose of group by following weight portion is grouped into, as shown in table 1:
Table 1
Embodiment | |
Benzophenone tetracarboxylic dianhydride | 25 |
Pyromellitic acid anhydride | 17 |
MDA | 22 |
Dimethylformamide | 33 |
Ethylene glycol | 1.6 |
Dimethyl silicone polymer | 2.7 |
The viscosity of graphite modified dose of embodiment is 35000CP;
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour;Again with the speed liter of 9 ~ 11 degree/min
To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, thus obtaining the carbonized film of pre-burned;
Step 4, using calender roll described step 4 pre-burned carbonized film;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then the speed with 19 ~ 21 degree/min
Degree rises to 2900 DEG C, cools down after keeping 1.8 ~ 2.2 hours, thus obtaining the graphite film that master fires;
The graphite film that the master of step 6 and then step 5 gained fires is rolled thus being obtained described graphite linings(6).
Described step 6 acquisition graphite linings are carried out calendering process.
The grammes per square metre of above-mentioned light strippable PET film 1 peeling force is 5 ~ 10g/m2, described re-release type PET film 2 peeling force gram
It is 50 ~ 100g/m again2.
During using above-mentioned use for electronic products heat conduction pad pasting, in its structure, graphite linings are coated with one layer of graphite by upper and lower surface
The Kapton of modifying agent is prepared from, and improves in heat conductivility both vertically and horizontally, it is to avoid adhesive tape office
Portion overheated it is achieved that the uniformity of adhesive tape heat conductivility;Secondly, it is located at graphite modified dose of Kapton surface by two
Benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, polydimethylsiloxanes
Alkane forms, and is coated on Kapton, is filled with the pin hole in heating process, improves degree of crystallinity simultaneously, also overcome
Thermal contraction is excessive lead to uneven, improve graphite linings biaxial tension performance;Again, Kapton surface has graphite
Modifying agent, improves graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and rolls described pre-burned using calender
Carbonized film, it is to avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, carry further
High in heat conductivility both vertically and horizontally.
Above-described embodiment only technology design to illustrate the invention and feature, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and implements according to this, can not be limited the scope of the invention with this.All according to the present invention
Equivalence changes or modification that Spirit Essence is made, all should be included within the scope of the present invention.
Claims (3)
1. a kind of use for electronic products heat conduction pad pasting, described heat conduction attachment film is in radiating piece(1)And heat generating components(2)Between, institute
State heat conduction pad pasting and include light strippable PET film(3)With re-release type PET film(4), this light strippable PET film(3)With re-release type
PET film(4)Between be disposed with the first heat conduction adhesive layer(5), graphite linings(6)With the second heat conduction adhesive layer(7);Its feature exists
In:Described graphite linings(6)Obtained by following process, this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature;
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes
Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP;
The described graphite modified dose of group by following weight portion is grouped into:25 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride
17 parts, 22 parts of MDA, 33 parts of dimethylformamide, 1.6 parts of ethylene glycol, 2.7 parts of dimethyl silicone polymer;
Step 3, the Kapton after processing is warming up to 800 DEG C, being warming up to 1200 DEG C after insulation, cools down after insulation,
Thus obtaining the carbonized film of pre-burned;
Step 4, using calender roll described step 4 pre-burned carbonized film;
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtaining the graphite that master fires
Film;
The graphite film that the master of step 6 and then step 5 gained fires is rolled thus being obtained described graphite linings(6).
2. use for electronic products heat conduction pad pasting according to claim 1 it is characterised in that:Described step 4 is obtained graphite linings
(6)Carry out calendering process.
3. use for electronic products heat conduction pad pasting according to claim 1 it is characterised in that:Described light strippable PET film(1)Stripping
It is 5 ~ 10g/m from the grammes per square metre of power2, described re-release type PET film(2)The grammes per square metre of peeling force is 50 ~ 100g/m2.
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CN201610700227.6A CN106413340A (en) | 2014-01-26 | 2014-01-26 | Heat conducting adhesive film for electronic product |
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CN201410037378.9A CN103763892B (en) | 2014-01-26 | 2014-01-26 | Heat conduction graphite patch for microelectronic device |
CN201610700227.6A CN106413340A (en) | 2014-01-26 | 2014-01-26 | Heat conducting adhesive film for electronic product |
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CN201610705947.1A Active CN106304783B (en) | 2014-01-26 | 2014-01-26 | Thermal conductivity both-sided adhesive graphite flake |
CN201610777909.7A Pending CN106366971A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity double-sided adhesive tape |
CN201610704135.5A Pending CN106281087A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting double-sided adhesive tape |
CN201610787557.3A Pending CN106520003A (en) | 2014-01-26 | 2014-01-26 | Thermal conductive graphite tape used for laptops |
CN201610705884.XA Pending CN106332522A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity graphite film |
CN201610700227.6A Pending CN106413340A (en) | 2014-01-26 | 2014-01-26 | Heat conducting adhesive film for electronic product |
CN201610777925.6A Active CN106427180B (en) | 2014-01-26 | 2014-01-26 | Preparation method for the two-sided pad pasting of soaking |
CN201410037378.9A Active CN103763892B (en) | 2014-01-26 | 2014-01-26 | Heat conduction graphite patch for microelectronic device |
CN201610787504.1A Pending CN106520002A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting pressure-sensitive double-sided tape |
CN201610787521.5A Pending CN106535560A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting graphite paste films for flat computers |
CN201610794749.7A Pending CN106398570A (en) | 2014-01-26 | 2014-01-26 | High-compactness graphite soaking adhesive tape |
CN201610799197.9A Pending CN106381083A (en) | 2014-01-26 | 2014-01-26 | Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones |
CN201610777537.8A Pending CN106398567A (en) | 2014-01-26 | 2014-01-26 | Pressure sensitive adhesive tape for notebook computer |
CN201610777340.4A Pending CN106398566A (en) | 2014-01-26 | 2014-01-26 | Double-face pad pasting with heat radiation |
CN201610696479.6A Pending CN106332521A (en) | 2014-01-26 | 2014-01-26 | Manufacturing method for double-sided adhesive graphite flake |
CN201610696474.3A Pending CN106318250A (en) | 2014-01-26 | 2014-01-26 | Preparation process of thermal double-sided adhesive tape |
CN201610777339.1A Pending CN106349964A (en) | 2014-01-26 | 2014-01-26 | Process for preparing heat-conduction double-sided adhesive tape |
CN201610696862.1A Active CN106304780B (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for high thermal conductivity graphite film |
CN201610778259.8A Pending CN106634658A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting adhesive tape used for laptop |
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CN201610777909.7A Pending CN106366971A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity double-sided adhesive tape |
CN201610704135.5A Pending CN106281087A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting double-sided adhesive tape |
CN201610787557.3A Pending CN106520003A (en) | 2014-01-26 | 2014-01-26 | Thermal conductive graphite tape used for laptops |
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CN201610787504.1A Pending CN106520002A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting pressure-sensitive double-sided tape |
CN201610787521.5A Pending CN106535560A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting graphite paste films for flat computers |
CN201610794749.7A Pending CN106398570A (en) | 2014-01-26 | 2014-01-26 | High-compactness graphite soaking adhesive tape |
CN201610799197.9A Pending CN106381083A (en) | 2014-01-26 | 2014-01-26 | Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones |
CN201610777537.8A Pending CN106398567A (en) | 2014-01-26 | 2014-01-26 | Pressure sensitive adhesive tape for notebook computer |
CN201610777340.4A Pending CN106398566A (en) | 2014-01-26 | 2014-01-26 | Double-face pad pasting with heat radiation |
CN201610696479.6A Pending CN106332521A (en) | 2014-01-26 | 2014-01-26 | Manufacturing method for double-sided adhesive graphite flake |
CN201610696474.3A Pending CN106318250A (en) | 2014-01-26 | 2014-01-26 | Preparation process of thermal double-sided adhesive tape |
CN201610777339.1A Pending CN106349964A (en) | 2014-01-26 | 2014-01-26 | Process for preparing heat-conduction double-sided adhesive tape |
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CN106332522A (en) | 2017-01-11 |
CN106634658A (en) | 2017-05-10 |
CN106304783A (en) | 2017-01-04 |
CN106398570A (en) | 2017-02-15 |
CN106318251A (en) | 2017-01-11 |
CN106427180A (en) | 2017-02-22 |
CN106349965A (en) | 2017-01-25 |
CN106520002A (en) | 2017-03-22 |
CN106332521A (en) | 2017-01-11 |
CN106398566A (en) | 2017-02-15 |
CN106304780B (en) | 2019-01-01 |
CN103763892A (en) | 2014-04-30 |
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CN106381083A (en) | 2017-02-08 |
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