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CN105979750B - Flexibility heat conduction graphite patch - Google Patents

Flexibility heat conduction graphite patch Download PDF

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Publication number
CN105979750B
CN105979750B CN201511028635.3A CN201511028635A CN105979750B CN 105979750 B CN105979750 B CN 105979750B CN 201511028635 A CN201511028635 A CN 201511028635A CN 105979750 B CN105979750 B CN 105979750B
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CN
China
Prior art keywords
parts
kapton
heat conduction
graphite
film
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Active
Application number
CN201511028635.3A
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Chinese (zh)
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CN105979750A (en
Inventor
金闯
梁豪
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Jiangsu Stick New Materials Polytron Technologies Inc
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Jiangsu Stick New Materials Polytron Technologies Inc
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Priority to CN201511028635.3A priority Critical patent/CN105979750B/en
Publication of CN105979750A publication Critical patent/CN105979750A/en
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    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
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    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J2400/10—Presence of inorganic materials

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Abstract

A kind of high-flexibility heat dissipation pad pasting of the present invention, the first coat are located at Kapton upper surface；First coat by film in Kapton upper surface graphite modified dosage form into this graphite modified dose painting is made of the component of following parts by weight：25 parts of benzophenone tetracarboxylic dianhydride, 16 parts of pyromellitic acid anhydride, 28 parts of diaminodiphenylmethane, 23 parts of dimethylformamide, 8.5 parts of N methyl pyrrolidones, 2 parts of ethylene glycol, 3 parts of dimethyl silicone polymer, 1.5 parts of dibutyl phthalate；Graphite modified dose of film is obtained into treated Kapton in the upper surface of Kapton；By treated, Kapton is warming up to 1200 DEG C of postcoolings, so as to obtain the carbonized film of pre-burned.The present invention avoids hot-spot, while realizing the uniformity of heat conductivility, overcome be heat-shrinked it is excessive caused by it is uneven, improve graphite linings biaxial tension performance.

Description

Flexibility heat conduction graphite patch
Technical field
The present invention relates to a kind of flexibility heat conduction graphite patches, belong to heat dissipation Filming Technology field.
Background technology
As modern microelectronic technology high-speed develops, electronic equipment（Such as laptop, mobile phone, tablet computer）Increasingly Become ultra-thin, light, this structure causes electronic equipment internal power density to significantly improve, and generated heat is not easy in operation It discharges, be easy to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and using the longevity Life.Therefore, Current electronic industry proposes increasingly higher demands for the heat sink material as heat control system core component, urgently A kind of high-efficiency heat conduction, light material is needed to transfer heat away from rapidly, ensures electronic equipment normal operation.
Kapton is mostly used for flexible PCB in the prior art, is obtained although having using polyimide film sintered Graphite heat radiation fin, so as to be covered on heat source, but be constrained to Kapton product quality and performances the good and the bad not Together, the performance of the two-sided pad pasting heat dissipation performance of heat dissipation has been influenced, there are following technical problems：It radiates uneven, adhesive tape easily occurs Hot-spot, the heat dissipation performance that improves product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences product Competitiveness.
Invention content
Objects of the present invention are to provide a kind of flexibility heat conduction graphite patch, and the flexibility heat conduction graphite patch is vertical Direction and horizontal direction improve heat conductivility, avoid hot-spot, while realizing the uniformity of heat conductivility, overcome It is uneven caused by thermal contraction is excessive, improve graphite linings biaxial tension performance.
To achieve the above object of the invention, the technical solution adopted by the present invention is：A kind of flexibility heat conduction graphite patch, it is described Flexibility heat conduction graphite patch includes heat conduction graphite patch and heat conduction adhesive layer, this heat-conducting glue positioned at heat conduction graphite patch surface The adhesion coating surface opposite with heat conduction graphite patch is fitted with separated type material layer；The heat conduction graphite patch by Kapton, First coat and the second coat composition, first coat are located at Kapton upper surface；
First coat by film in Kapton upper surface graphite modified dosage form into this graphite modified dose It is made of the component of following parts by weight：25 parts of benzophenone tetracarboxylic dianhydride, 16 parts of pyromellitic acid anhydride, diaminodiphenylmethane 28 parts, 23 parts of dimethylformamide, 8.5 parts of N-Methyl pyrrolidone, 2 parts of ethylene glycol, 3 parts of dimethyl silicone polymer, adjacent benzene two 1.5 parts of formic acid dibutyl ester；
The heat conduction graphite patch is obtained by following steps：
Step 1: graphite modified dose of film is obtained in the upper surface of Kapton, treated that polyimides is thin Film；
Step 2: will treated Kapton under inert gas shielding, rise to 240 DEG C ~ 260 from room temperature DEG C, 480 DEG C ~ 500 DEG C are risen to after heat preservation, 780 DEG C ~ 820 DEG C is warming up to after heat preservation again, 1200 DEG C is risen to after heat preservation Postcooling, so as to obtain the carbonized film of pre-burned；
Step 3: roll the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2850 DEG C ~ 2950 DEG C postcoolings, so as to obtain the graphite film of main firing；
Step 5: then the graphite film of the main firing of gained is rolled to obtain the heat conduction graphite patch.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
1st, flexibility heat conduction graphite patch of the present invention, graphite linings are coated with one layer graphite modified dose by upper surface in structure Kapton be prepared, improve in heat conductivility both vertically and horizontally, avoid adhesive tape hot-spot, Realize the uniformity of adhesive tape heat conductivility；Secondly, it is located at graphite modified dose of Kapton surface by benzophenone Tetracid dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, ethylene glycol, dimethyl silicone polymer group Into coated on the pin hole on Kapton, being filled in heating process, improving crystallinity simultaneously, also overcome hot receipts It contracts excessive caused uneven, improves graphite linings biaxial tension performance.
2nd, flexibility heat conduction graphite patch of the present invention is located at graphite modified dose of Kapton surface by hexichol first Ketone tetracid dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, N-Methyl pyrrolidone, ethylene glycol, Dimethyl silicone polymer forms, and azeotropic point and smooth boiling point are reduced using dimethylformamide, N-Methyl pyrrolidone Area improves the flatness and flexibility of final products film forming；；Secondly, dimethylformamide, N-Methyl pyrrolidone and adjacent benzene Dibutyl carboxylic acid Kapton surface, prevents bubble from generating, and is more advantageous to the small pin hole of filled polyimide film, Improve the uniformity of heat dissipation patch heat conductivility.
3rd, flexibility heat conduction graphite patch of the present invention increases calendaring processes between the carbonized film and graphitization of pre-burned, And roll again after re-forming heat conduction graphite patch, fold and the volume contraction being graphitized in sintering process are avoided, is improved Compactness and crystallinity, further improve in heat conductivility both vertically and horizontally.
Description of the drawings
Attached drawing 1 is flexibility heat conduction graphite patch structure diagram of the present invention.
In the figures above：1st, heat conduction graphite patch；11st, Kapton；12nd, the first coat；13rd, the second coating Layer；2nd, heat conduction adhesive layer；3rd, separated type material layer.
Specific embodiment
With reference to embodiment, the invention will be further described：
Embodiment：A kind of flexibility heat conduction graphite patch, including heat conduction graphite patch 1 and positioned at 1 table of heat conduction graphite patch The surface that heat conduction adhesive layer 2, this heat conduction adhesive layer 2 in face are opposite with heat conduction graphite patch 1 is fitted with separated type material layer 3；It is described Heat conduction graphite patch 1 is made of Kapton 11, the first coat 12 and the second coat 13, first coat 12 Positioned at 11 upper surface of Kapton；
First coat by film in Kapton upper surface graphite modified dosage form into this graphite modified dose It is made of the component of following parts by weight：25 parts of benzophenone tetracarboxylic dianhydride, 16 parts of pyromellitic acid anhydride, diaminodiphenylmethane 28 parts, 23 parts of dimethylformamide, 8.5 parts of N-Methyl pyrrolidone, 2 parts of ethylene glycol, 3 parts of dimethyl silicone polymer, adjacent benzene two 1.5 parts of formic acid dibutyl ester；
The heat conduction graphite patch 1 is obtained by following steps：
Step 1: graphite modified dose of film is obtained in the upper surface of Kapton 11, treated that polyimides is thin Film；
Step 2: will treated Kapton under inert gas shielding, rise to 240 DEG C ~ 260 from room temperature DEG C, 480 DEG C ~ 500 DEG C are risen to after heat preservation, 780 DEG C ~ 820 DEG C is warming up to after heat preservation again, 1200 DEG C is risen to after heat preservation Postcooling, so as to obtain the carbonized film of pre-burned；
Step 3: roll the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2850 DEG C ~ 2950 DEG C postcoolings, so as to obtain the graphite film of main firing；
Step 5: then the graphite film of the main firing of gained is rolled to obtain the heat conduction graphite patch 1.
During using above-mentioned flexibility heat conduction graphite patch, in structure graphite linings by upper surface be coated with one layer it is graphite modified The Kapton of agent is prepared, and improves in heat conductivility both vertically and horizontally, avoids adhesive tape part mistake Heat realizes the uniformity of adhesive tape heat conductivility；Secondly, it is located at graphite modified dose of Kapton surface by hexichol first Ketone tetracid dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, ethylene glycol, dimethyl silicone polymer group Into coated on the pin hole on Kapton, being filled in heating process, improving crystallinity simultaneously, also overcome hot receipts It contracts excessive caused uneven, improves graphite linings biaxial tension performance, also reduce azeotropic point and smooth boiling point area, change It has been apt to the flatness and flexibility of final products film forming；Again, Kapton surface has graphite modified dose, improves double Graphite linings and heat conduction adhesive layer heat conductivility in mask, and using the carbonized film of the calender calendering pre-burned, avoid Volume contraction in fold and graphitization sintering process, improves compactness and crystallinity, further improves in vertical direction With the heat conductivility of horizontal direction；Again, dimethylformamide, N-Methyl pyrrolidone and dibutyl phthalate polyamides are sub- Amine film surface, prevents bubble from generating, and is more advantageous to the small pin hole of filled polyimide film, improves heat dissipation patch heat conduction The uniformity of performance.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention The equivalent change or modification that Spirit Essence is made, should be covered by the protection scope of the present invention.

Claims (1)

1. a kind of flexibility heat conduction graphite patch, including heat conduction graphite patch（1）With positioned at heat conduction graphite patch（1）It leads on surface Hot glue adhesion coating（2）, this heat conduction adhesive layer（2）With heat conduction graphite patch（1）Opposite surface is fitted with separated type material layer（3）；Its It is characterized in that：The heat conduction graphite patch（1）By Kapton（11）, the first coat（12）With the second coat（13） Composition, first coat（12）Positioned at Kapton（11）Upper surface；
First coat by film in Kapton upper surface graphite modified dosage form into, this graphite modified dose by with The component composition of lower parts by weight：25 parts of benzophenone tetracarboxylic dianhydride, 16 parts of pyromellitic acid anhydride, diaminodiphenylmethane 28 Part, 23 parts of dimethylformamide, 8.5 parts of N-Methyl pyrrolidone, 2 parts of ethylene glycol, 3 parts of dimethyl silicone polymer, O-phthalic 1.5 parts of dibutyl phthalate；
The heat conduction graphite patch（1）It is obtained by following steps：
Step 1: by graphite modified dose of film in Kapton（11）Upper surface obtain that treated that polyimides is thin Film；
Step 2: will treated Kapton under inert gas shielding, rise to 240 DEG C ~ 260 DEG C from room temperature, 480 DEG C ~ 500 DEG C are risen to after heat preservation, is warming up to 780 DEG C ~ 820 DEG C after heat preservation again, it is cold after 1200 DEG C are risen to after heat preservation But, so as to obtain the carbonized film of pre-burned；
Step 3: roll the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2850 DEG C ~ 2950 DEG C postcoolings, so as to obtain the graphite film of main firing；
Step 5: then the graphite film of the main firing of gained is rolled to obtain the heat conduction graphite patch（1）.
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CN201610250630.3A Pending CN105860867A (en) 2014-01-26 2014-01-26 Preparation technology of uniform heating rubber belt applied in electronic device
CN201511029000.5A Active CN105979751B (en) 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin
CN201610249636.9A Active CN105860866B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape
CN201511028668.8A Active CN105966019B (en) 2014-01-26 2014-01-26 For the heat conduction graphite patch of adhesive tape
CN201511014593.8A Active CN105965985B (en) 2014-01-26 2014-01-26 Preparation method for the heat conduction graphite patch of adhesive tape
CN201610250629.0A Active CN105873414B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat conducting heat dissipation patch
CN201610255486.2A Pending CN105860868A (en) 2014-01-26 2014-01-26 Preparation process of heat dissipation lamination film
CN201511028692.1A Active CN105969224B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape for electronic device
CN201410036121.1A Active CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof
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CN201610250630.3A Pending CN105860867A (en) 2014-01-26 2014-01-26 Preparation technology of uniform heating rubber belt applied in electronic device
CN201511029000.5A Active CN105979751B (en) 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin
CN201610249636.9A Active CN105860866B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape
CN201511028668.8A Active CN105966019B (en) 2014-01-26 2014-01-26 For the heat conduction graphite patch of adhesive tape
CN201511014593.8A Active CN105965985B (en) 2014-01-26 2014-01-26 Preparation method for the heat conduction graphite patch of adhesive tape
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CN201610255486.2A Pending CN105860868A (en) 2014-01-26 2014-01-26 Preparation process of heat dissipation lamination film
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CN107418392A (en) * 2017-08-02 2017-12-01 合肥东恒锐电子科技有限公司 A kind of heat radiation coating of household electrical appliance and preparation method thereof
CN107441619A (en) * 2017-08-17 2017-12-08 成都三乙医疗科技有限公司 A kind of thermal conducting piece for electrotherapy
CN107551392A (en) * 2017-08-29 2018-01-09 成都三乙医疗科技有限公司 A kind of thermal conducting piece for thermotherapy

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CN105860866B (en) 2019-01-01
CN105979751A (en) 2016-09-28

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