JP5551698B2 - 電磁デバイス - Google Patents
電磁デバイス Download PDFInfo
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- JP5551698B2 JP5551698B2 JP2011521189A JP2011521189A JP5551698B2 JP 5551698 B2 JP5551698 B2 JP 5551698B2 JP 2011521189 A JP2011521189 A JP 2011521189A JP 2011521189 A JP2011521189 A JP 2011521189A JP 5551698 B2 JP5551698 B2 JP 5551698B2
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- magnetic powder
- winding
- powder sheet
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- 238000004804 winding Methods 0.000 claims description 538
- 239000006247 magnetic powder Substances 0.000 claims description 386
- 239000004020 conductor Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 32
- 239000002245 particle Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 20
- 238000010168 coupling process Methods 0.000 description 15
- 230000008878 coupling Effects 0.000 description 14
- 238000005859 coupling reaction Methods 0.000 description 14
- 230000003247 decreasing effect Effects 0.000 description 14
- 238000007373 indentation Methods 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 238000000605 extraction Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000010329 laser etching Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
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- 230000008901 benefit Effects 0.000 description 2
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- 238000000206 photolithography Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 235000012489 doughnuts Nutrition 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/245—Magnetic cores made from sheets, e.g. grain-oriented
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2866—Combination of wires and sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/006—Printed inductances flexible printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Description
Claims (18)
- 複数の柔軟な磁性粉シートであって、前記複数の柔軟な磁性粉シートの各々は略平面であり、積み重ねられるとき前記複数の柔軟な磁性粉シートの隣接するものに積層されることが可能である、複数の柔軟な磁性粉シートと、
前記複数の柔軟な磁性粉シートのすべてから分離して製造され提供される少なくとも1つの予め形成された多巻数導電性巻線であって、前記複数の柔軟な磁性粉シートの少なくとも1つは前記少なくとも1つの予め形成された多巻数導電性巻線に対して、かつ、その回りに加圧されて前記少なくとも1つの予め形成された多巻数導電性巻線に対する磁気コア領域を定め、前記複数の柔軟な磁性粉シートの少なくとも2つは前記少なくとも1つの予め形成された多巻数導電性巻線の付近に物理的なギャップを形成することなく前記少なくとも1つの予め形成された多巻数導電性巻線に隣接して配置される、少なくとも1つの予め形成された多巻数導電性巻線と、
前記複数の柔軟な磁性粉シートの第1のものの上の少なくとも1つの第1端子および前記複数の柔軟な磁性粉シートの第2のものの上の少なくとも1つの第2端子とを備える電磁部品。 - 前記少なくとも1つの予め形成された多巻数導電性巻線は、第1のリード、第2のリード、およびそれらの間の軸部分を含む伸長し曲げ易く支えのない巻線導体を備え、前記軸部分はコイル状に曲げられている請求項1記載の電磁部品。
- 前記第1および第2端子は前記磁性粉シートの前記第1および第2のものの全長に及んでいる請求項1記載の電磁部品。
- 前記第1および第2端子の各々は複数のビアで接続されている請求項1記載の電磁部品。
- 前記導電性巻線は巻かれてコイルになり第1および第2のリードを有する導線を備え、前記第1および第2のリードは前記第1端子に取り付けられている請求項1記載の電磁部品。
- 前記第2端子は前記電磁部品の表面実装端子を定める請求項1記載の電磁部品。
- 前記電磁部品は長方形である請求項1記載の電磁部品。
- 前記電磁部品は小型のパワーインダクタである請求項1記載の電磁部品。
- 前記複数の柔軟な磁性粉シートの少なくとも1つは熱可塑性樹脂に混合された磁性金属粉を備える請求項1記載の電磁部品。
- 前記複数の柔軟な磁性粉シートのすべてが熱可塑性樹脂に混合された磁性金属粉を備える請求項9記載の電磁部品。
- 前記少なくとも1つの予め形成された導電性巻線は、電流が巻線を流れるとき予め定められた方向に少なくとも1つの磁場を生成するよう構成される請求項9記載の電磁部品。
- 前記少なくとも1つの磁場は垂直方向に向いている請求項11記載の電磁部品。
- 前記少なくとも1つの予め形成された多巻数導電性巻線は同心に巻かれた複数の巻数を備える請求項1記載の電磁部品。
- 前記少なくとも1つの予め形成された多巻数導電性巻線は曲線の渦巻状の経路を定める複数の巻数を備える請求項1記載の電磁部品。
- 前記少なくとも1つの予め形成された多巻数導電性巻線は互いに同一の平面内に拡がる複数の巻数を備える請求項1記載の電磁部品。
- 前記少なくとも1つの予め形成された多巻数導電性巻線は電流が前記巻線に流れるとき完成した前記電磁部品に選択された量のインダクタンスを付与するよう構成される請求項1記載の電磁部品。
- 前記少なくとも1つの予め形成された多巻数導電性巻線は単一の予め形成された導電性巻線を備え、前記磁気コア領域は前記単一の予め形成された導電性巻線のみを含む請求項16記載の電磁部品。
- 前記少なくとも1つの予め形成された多巻数導電性巻線は単一の予め形成された導電性巻線を備え、前記磁気コア領域は前記単一の予め形成された導電性巻線のみを含む請求項1記載の電子部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/181,436 | 2008-07-29 | ||
US12/181,436 US8378777B2 (en) | 2008-07-29 | 2008-07-29 | Magnetic electrical device |
PCT/US2009/051005 WO2010014444A1 (en) | 2008-07-29 | 2009-07-17 | A magnetic electrical device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011530172A JP2011530172A (ja) | 2011-12-15 |
JP2011530172A5 JP2011530172A5 (ja) | 2012-08-23 |
JP5551698B2 true JP5551698B2 (ja) | 2014-07-16 |
Family
ID=41055219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011521189A Expired - Fee Related JP5551698B2 (ja) | 2008-07-29 | 2009-07-17 | 電磁デバイス |
Country Status (8)
Country | Link |
---|---|
US (4) | US8378777B2 (ja) |
EP (1) | EP2313898A1 (ja) |
JP (1) | JP5551698B2 (ja) |
KR (1) | KR101555398B1 (ja) |
CN (1) | CN102099877B (ja) |
CA (1) | CA2724149A1 (ja) |
TW (2) | TWI467607B (ja) |
WO (1) | WO2010014444A1 (ja) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8952776B2 (en) * | 2002-12-13 | 2015-02-10 | Volterra Semiconductor Corporation | Powder core material coupled inductors and associated methods |
US8378777B2 (en) * | 2008-07-29 | 2013-02-19 | Cooper Technologies Company | Magnetic electrical device |
US8466764B2 (en) * | 2006-09-12 | 2013-06-18 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
US8941457B2 (en) * | 2006-09-12 | 2015-01-27 | Cooper Technologies Company | Miniature power inductor and methods of manufacture |
US7791445B2 (en) | 2006-09-12 | 2010-09-07 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
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US8310332B2 (en) | 2008-10-08 | 2012-11-13 | Cooper Technologies Company | High current amorphous powder core inductor |
DE102006049716A1 (de) * | 2006-10-12 | 2008-04-17 | Thyssenkrupp Transrapid Gmbh | Magnetpol für Magnetschwebefahrzeuge |
US8279037B2 (en) | 2008-07-11 | 2012-10-02 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US8659379B2 (en) | 2008-07-11 | 2014-02-25 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US9859043B2 (en) | 2008-07-11 | 2018-01-02 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US9558881B2 (en) | 2008-07-11 | 2017-01-31 | Cooper Technologies Company | High current power inductor |
US20100277267A1 (en) * | 2009-05-04 | 2010-11-04 | Robert James Bogert | Magnetic components and methods of manufacturing the same |
US8674802B2 (en) | 2009-12-21 | 2014-03-18 | Volterra Semiconductor Corporation | Multi-turn inductors |
US8466769B2 (en) | 2010-05-26 | 2013-06-18 | Tyco Electronics Corporation | Planar inductor devices |
TWI474349B (zh) * | 2010-07-23 | 2015-02-21 | Cyntec Co Ltd | 線圈元件 |
US8593016B2 (en) | 2010-12-03 | 2013-11-26 | Sri International | Levitated micro-manipulator system |
US9647523B2 (en) | 2010-12-03 | 2017-05-09 | Sri International | Levitated-micro manipulator system |
US8716991B1 (en) * | 2011-02-28 | 2014-05-06 | Volterra Semiconductor Corporation | Switching power converters including air core coupled inductors |
WO2013005482A1 (ja) * | 2011-07-06 | 2013-01-10 | 株式会社村田製作所 | 電子部品 |
US9159711B2 (en) * | 2011-07-29 | 2015-10-13 | GlobalFoundries, Inc. | Integrated circuit systems including vertical inductors |
JP5902440B2 (ja) * | 2011-10-31 | 2016-04-13 | 京セラ株式会社 | インダクタ部品および電子装置 |
US10128035B2 (en) * | 2011-11-22 | 2018-11-13 | Volterra Semiconductor LLC | Coupled inductor arrays and associated methods |
US9373438B1 (en) | 2011-11-22 | 2016-06-21 | Volterra Semiconductor LLC | Coupled inductor arrays and associated methods |
US8983112B2 (en) * | 2012-03-14 | 2015-03-17 | Harman International Industries, Incorporated | Planar speaker system |
US8948441B2 (en) | 2012-03-14 | 2015-02-03 | Harman International Industries, Inc. | Planar speaker system |
US9263177B1 (en) | 2012-03-19 | 2016-02-16 | Volterra Semiconductor LLC | Pin inductors and associated systems and methods |
JP6062691B2 (ja) | 2012-04-25 | 2017-01-18 | Necトーキン株式会社 | シート状インダクタ、積層基板内蔵型インダクタ及びそれらの製造方法 |
US8975995B1 (en) | 2012-08-29 | 2015-03-10 | Volterra Semiconductor Corporation | Coupled inductors with leakage plates, and associated systems and methods |
US9691538B1 (en) * | 2012-08-30 | 2017-06-27 | Volterra Semiconductor LLC | Magnetic devices for power converters with light load enhancers |
JP6111681B2 (ja) * | 2013-01-18 | 2017-04-12 | Tdk株式会社 | 積層コイル部品 |
US10840005B2 (en) | 2013-01-25 | 2020-11-17 | Vishay Dale Electronics, Llc | Low profile high current composite transformer |
CN105359233A (zh) * | 2013-03-11 | 2016-02-24 | 伯恩斯公司 | 与层叠聚合物平面磁器件相关的器件和方法 |
US20140292462A1 (en) * | 2013-03-28 | 2014-10-02 | Inpaq Technology Co., Ltd. | Power inductor and method for fabricating the same |
WO2014205164A1 (en) * | 2013-06-20 | 2014-12-24 | Liu Yuexin | Magnetic components and rolling manufacturing method |
JP5888289B2 (ja) * | 2013-07-03 | 2016-03-16 | 株式会社村田製作所 | 電子部品 |
CN104282411B (zh) | 2013-07-03 | 2018-04-10 | 库柏技术公司 | 低轮廓、表面安装电磁部件组件以及制造方法 |
WO2015020952A1 (en) * | 2013-08-04 | 2015-02-12 | President And Fellows Of Harvard College | Pop-up laminate structures with integrated electronics |
JP6383215B2 (ja) * | 2014-08-07 | 2018-08-29 | 株式会社トーキン | インダクタおよびその製造方法 |
KR101686989B1 (ko) | 2014-08-07 | 2016-12-19 | 주식회사 모다이노칩 | 파워 인덕터 |
KR101681201B1 (ko) * | 2014-09-11 | 2016-12-01 | 주식회사 모다이노칩 | 파워 인덕터 |
KR101832546B1 (ko) * | 2014-10-16 | 2018-02-26 | 삼성전기주식회사 | 칩 전자부품 및 칩 전자부품의 실장 기판 |
KR101630086B1 (ko) * | 2014-12-10 | 2016-06-21 | 삼성전기주식회사 | 칩 전자부품 |
KR101659206B1 (ko) * | 2015-01-30 | 2016-09-22 | 삼성전기주식회사 | 파워 인덕터 |
US10861627B2 (en) | 2015-04-20 | 2020-12-08 | Sri International | Microrobot and microrobotic train self-assembly with end-effectors |
KR20160126751A (ko) * | 2015-04-24 | 2016-11-02 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
US10253956B2 (en) | 2015-08-26 | 2019-04-09 | Abl Ip Holding Llc | LED luminaire with mounting structure for LED circuit board |
KR101762027B1 (ko) * | 2015-11-20 | 2017-07-26 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
KR101900880B1 (ko) * | 2015-11-24 | 2018-09-21 | 주식회사 모다이노칩 | 파워 인덕터 |
US10998124B2 (en) | 2016-05-06 | 2021-05-04 | Vishay Dale Electronics, Llc | Nested flat wound coils forming windings for transformers and inductors |
CA3035547A1 (en) | 2016-08-31 | 2018-03-08 | Vishay Dale Electronics, Llc | Inductor having high current coil with low direct current resistance |
CN109643597B (zh) * | 2016-09-02 | 2021-08-24 | 株式会社村田制作所 | 电感器部件以及电源模块 |
US10438736B2 (en) * | 2016-10-28 | 2019-10-08 | Delta Electronics (Shanghai) Co., Ltd. | Magnetic component and manufacturing method thereof |
US10720815B2 (en) | 2016-11-07 | 2020-07-21 | The Government Of The United States, As Represented By The Secretary Of The Army | Segmented magnetic core |
WO2018123410A1 (ja) * | 2016-12-28 | 2018-07-05 | 株式会社村田製作所 | インダクタおよびdc-dcコンバータ |
TWI678863B (zh) * | 2017-05-11 | 2019-12-01 | 磁組相對磁極異位之發電裝置 | |
TWI678862B (zh) * | 2017-05-11 | 2019-12-01 | 磁組相對磁極異位之電動裝置 | |
KR102009780B1 (ko) * | 2017-06-08 | 2019-08-12 | 주식회사 아모그린텍 | 적층형 분말 코어 |
US11373803B2 (en) * | 2017-08-11 | 2022-06-28 | Applied Materials, Inc. | Method of forming a magnetic core on a substrate |
JP7168312B2 (ja) * | 2017-11-15 | 2022-11-09 | 太陽誘電株式会社 | 磁気結合型コイル部品 |
US10396046B2 (en) * | 2017-12-29 | 2019-08-27 | Intel Corporation | Substrate assembly with magnetic feature |
US10251279B1 (en) | 2018-01-04 | 2019-04-02 | Abl Ip Holding Llc | Printed circuit board mounting with tabs |
US11443892B2 (en) | 2018-06-27 | 2022-09-13 | Intel Corporation | Substrate assembly with encapsulated magnetic feature |
DE102018218782A1 (de) * | 2018-11-05 | 2020-05-07 | Zf Friedrichshafen Ag | Leiterplatten-Transformator |
US11367564B2 (en) * | 2018-12-19 | 2022-06-21 | Wen-Chin Wang | Manufacturing method of transformer circuit board and transformer thereof |
KR102279305B1 (ko) | 2019-04-16 | 2021-07-21 | 삼성전기주식회사 | 코일 부품 |
JP7358847B2 (ja) * | 2019-08-28 | 2023-10-11 | Tdk株式会社 | 積層コイル部品の製造方法及び積層コイル部品 |
CN114078623A (zh) * | 2020-08-20 | 2022-02-22 | Tdk株式会社 | 线圈部件以及搭载其的开关电源装置 |
KR20220026902A (ko) * | 2020-08-26 | 2022-03-07 | 엘지이노텍 주식회사 | 자성 소자 및 이를 포함하는 회로 기판 |
US12057252B2 (en) * | 2020-09-23 | 2024-08-06 | Intel Corporation | Electronic substrates having embedded inductors |
CN112635182B (zh) * | 2020-11-23 | 2021-10-22 | 深圳市信维通信股份有限公司 | 电感器及其制备方法 |
USD1034462S1 (en) | 2021-03-01 | 2024-07-09 | Vishay Dale Electronics, Llc | Inductor package |
US11948724B2 (en) | 2021-06-18 | 2024-04-02 | Vishay Dale Electronics, Llc | Method for making a multi-thickness electro-magnetic device |
JPWO2023042634A1 (ja) * | 2021-09-16 | 2023-03-23 |
Family Cites Families (207)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2391563A (en) | 1943-05-18 | 1945-12-25 | Super Electric Products Corp | High frequency coil |
US3255512A (en) | 1962-08-17 | 1966-06-14 | Trident Engineering Associates | Molding a ferromagnetic casing upon an electrical component |
US4072780A (en) | 1976-10-28 | 1978-02-07 | Varadyne Industries, Inc. | Process for making electrical components having dielectric layers comprising particles of a lead oxide-germanium dioxide-silicon dioxide glass and a resin binder therefore |
GB2045540B (en) | 1978-12-28 | 1983-08-03 | Tdk Electronics Co Ltd | Electrical inductive device |
NL7900244A (nl) | 1979-01-12 | 1980-07-15 | Philips Nv | Vlakke tweelaags electrische spoel. |
GB2044550A (en) | 1979-03-09 | 1980-10-15 | Gen Electric | Case inductive circuit components |
JPS57170519U (ja) | 1981-04-20 | 1982-10-27 | ||
DE8132269U1 (de) | 1981-11-04 | 1985-11-28 | Siemens AG, 1000 Berlin und 8000 München | Elektromagnetisches Erregersystem |
EP0117764A1 (en) | 1983-03-01 | 1984-09-05 | Mitsubishi Denki Kabushiki Kaisha | Coil device |
JPS59189212U (ja) | 1983-05-18 | 1984-12-15 | 株式会社村田製作所 | チツプ型インダクタ |
JPS6041312A (ja) | 1983-08-16 | 1985-03-05 | Tdk Corp | 回路素子 |
FR2556493B1 (fr) | 1983-12-09 | 1987-05-29 | Inf Milit Spatiale Aeronaut | Bobinage electromagnetique et transformateur comportant un tel bobinage |
JPS60176208A (ja) * | 1984-02-22 | 1985-09-10 | Tdk Corp | 積層部品およびその製造法 |
JPS6261305A (ja) | 1985-09-11 | 1987-03-18 | Murata Mfg Co Ltd | 積層チツプコイル |
US4873757A (en) | 1987-07-08 | 1989-10-17 | The Foxboro Company | Method of making a multilayer electrical coil |
US4803425A (en) | 1987-10-05 | 1989-02-07 | Xerox Corporation | Multi-phase printed circuit board tachometer |
JPH0258813A (ja) | 1988-08-24 | 1990-02-28 | Murata Mfg Co Ltd | 積層型インダクタ |
JPH02172207A (ja) | 1988-12-23 | 1990-07-03 | Murata Mfg Co Ltd | 積層型インダクター |
EP0411341A3 (en) | 1989-07-10 | 1992-05-13 | Yozan Inc. | Neural network |
US5142767A (en) | 1989-11-15 | 1992-09-01 | Bf Goodrich Company | Method of manufacturing a planar coil construction |
US5197170A (en) | 1989-11-18 | 1993-03-30 | Murata Manufacturing Co., Ltd. | Method of producing an LC composite part and an LC network part |
JPH03241711A (ja) | 1990-02-20 | 1991-10-28 | Matsushita Electric Ind Co Ltd | リニアリティコイル |
KR960006848B1 (ko) * | 1990-05-31 | 1996-05-23 | 가부시끼가이샤 도시바 | 평면형 자기소자 |
JP2700713B2 (ja) | 1990-09-05 | 1998-01-21 | 株式会社トーキン | インダクタ |
WO1992005568A1 (en) | 1990-09-21 | 1992-04-02 | Coilcraft, Inc. | Inductive device and method of manufacture |
JP2539367Y2 (ja) * | 1991-01-30 | 1997-06-25 | 株式会社村田製作所 | 積層型電子部品 |
JP3108931B2 (ja) | 1991-03-15 | 2000-11-13 | 株式会社トーキン | インダクタ及びその製造方法 |
JP3197022B2 (ja) | 1991-05-13 | 2001-08-13 | ティーディーケイ株式会社 | ノイズサプレッサ用積層セラミック部品 |
US5487214A (en) | 1991-07-10 | 1996-01-30 | International Business Machines Corp. | Method of making a monolithic magnetic device with printed circuit interconnections |
JP3114323B2 (ja) | 1992-01-10 | 2000-12-04 | 株式会社村田製作所 | 積層チップコモンモードチョークコイル |
US5257000A (en) | 1992-02-14 | 1993-10-26 | At&T Bell Laboratories | Circuit elements dependent on core inductance and fabrication thereof |
JP3160685B2 (ja) | 1992-04-14 | 2001-04-25 | 株式会社トーキン | インダクタ |
US5312674A (en) | 1992-07-31 | 1994-05-17 | Hughes Aircraft Company | Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
US5446428A (en) | 1992-10-12 | 1995-08-29 | Matsushita Electric Industrial Co., Ltd. | Electronic component and its manufacturing method |
JPH06188124A (ja) * | 1992-12-19 | 1994-07-08 | Taiyo Yuden Co Ltd | チップ形インダクタとその製造方法 |
JP3687793B2 (ja) | 1993-06-10 | 2005-08-24 | 横河電機株式会社 | プリントコイル |
US5500629A (en) * | 1993-09-10 | 1996-03-19 | Meyer Dennis R | Noise suppressor |
US5821638A (en) | 1993-10-21 | 1998-10-13 | Auckland Uniservices Limited | Flux concentrator for an inductive power transfer system |
US5529747A (en) | 1993-11-10 | 1996-06-25 | Learflux, Inc. | Formable composite magnetic flux concentrator and method of making the concentrator |
JPH07135114A (ja) * | 1993-11-11 | 1995-05-23 | Yokogawa Electric Corp | 積層形プリントコイル及びその製造方法 |
JPH07201610A (ja) | 1993-11-25 | 1995-08-04 | Mitsui Petrochem Ind Ltd | インダクタンス素子およびこれを用いた集合素子 |
JP3472329B2 (ja) | 1993-12-24 | 2003-12-02 | 株式会社村田製作所 | チップ型トランス |
JPH07268610A (ja) | 1994-03-28 | 1995-10-17 | Alps Electric Co Ltd | 軟磁性合金薄膜 |
JPH07272932A (ja) * | 1994-03-31 | 1995-10-20 | Canon Inc | プリントインダクタ |
US5610433A (en) * | 1995-03-13 | 1997-03-11 | National Semiconductor Corporation | Multi-turn, multi-level IC inductor with crossovers |
US6911887B1 (en) * | 1994-09-12 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
KR100231356B1 (ko) * | 1994-09-12 | 1999-11-15 | 모리시타요이찌 | 적층형 세라믹칩 인덕터 및 그 제조방법 |
US5574470A (en) | 1994-09-30 | 1996-11-12 | Palomar Technologies Corporation | Radio frequency identification transponder apparatus and method |
US5985356A (en) | 1994-10-18 | 1999-11-16 | The Regents Of The University Of California | Combinatorial synthesis of novel materials |
US6362713B1 (en) * | 1994-10-19 | 2002-03-26 | Taiyo Yuden Kabushiki Kaisha | Chip inductor, chip inductor array and method of manufacturing same |
US5821846A (en) * | 1995-05-22 | 1998-10-13 | Steward, Inc. | High current ferrite electromagnetic interference suppressor and associated method |
US6198375B1 (en) | 1999-03-16 | 2001-03-06 | Vishay Dale Electronics, Inc. | Inductor coil structure |
US7921546B2 (en) | 1995-07-18 | 2011-04-12 | Vishay Dale Electronics, Inc. | Method for making a high current low profile inductor |
US7034645B2 (en) | 1999-03-16 | 2006-04-25 | Vishay Dale Electronics, Inc. | Inductor coil and method for making same |
CA2180992C (en) | 1995-07-18 | 1999-05-18 | Timothy M. Shafer | High current, low profile inductor and method for making same |
US7263761B1 (en) | 1995-07-18 | 2007-09-04 | Vishay Dale Electronics, Inc. | Method for making a high current low profile inductor |
JPH0935927A (ja) | 1995-07-20 | 1997-02-07 | Tokin Corp | 複合磁性体及びそれを用いた電磁干渉抑制体 |
US5631822A (en) | 1995-08-24 | 1997-05-20 | Interpoint Corporation | Integrated planar magnetics and connector |
US5849355A (en) | 1996-09-18 | 1998-12-15 | Alliedsignal Inc. | Electroless copper plating |
US5572180A (en) | 1995-11-16 | 1996-11-05 | Motorola, Inc. | Surface mountable inductor |
JP2978117B2 (ja) * | 1996-07-01 | 1999-11-15 | ティーディーケイ株式会社 | つぼ型コアを用いた面実装部品 |
US6038134A (en) | 1996-08-26 | 2000-03-14 | Johanson Dielectrics, Inc. | Modular capacitor/inductor structure |
JPH10106839A (ja) | 1996-10-02 | 1998-04-24 | Tokin Corp | 積層型高周波インダクタ |
US6683783B1 (en) | 1997-03-07 | 2004-01-27 | William Marsh Rice University | Carbon fibers formed from single-wall carbon nanotubes |
US5922514A (en) | 1997-09-17 | 1999-07-13 | Dale Electronics, Inc. | Thick film low value high frequency inductor, and method of making the same |
US5945902A (en) | 1997-09-22 | 1999-08-31 | Zefv Lipkes | Core and coil structure and method of making the same |
JP3712163B2 (ja) * | 1997-12-18 | 2005-11-02 | 株式会社村田製作所 | コイル部品の設計方法 |
US6169801B1 (en) | 1998-03-16 | 2001-01-02 | Midcom, Inc. | Digital isolation apparatus and method |
US6054914A (en) | 1998-07-06 | 2000-04-25 | Midcom, Inc. | Multi-layer transformer having electrical connection in a magnetic core |
US7294366B2 (en) | 1998-09-30 | 2007-11-13 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition |
US6287931B1 (en) | 1998-12-04 | 2001-09-11 | Winbond Electronics Corp. | Method of fabricating on-chip inductor |
JP2000182872A (ja) | 1998-12-17 | 2000-06-30 | Tdk Corp | チップインダクタの製造方法およびチップインダクタ |
US6392525B1 (en) * | 1998-12-28 | 2002-05-21 | Matsushita Electric Industrial Co., Ltd. | Magnetic element and method of manufacturing the same |
US6566731B2 (en) | 1999-02-26 | 2003-05-20 | Micron Technology, Inc. | Open pattern inductor |
US6379579B1 (en) | 1999-03-09 | 2002-04-30 | Tdk Corporation | Method for the preparation of soft magnetic ferrite powder and method for the production of laminated chip inductor |
JP2000323336A (ja) * | 1999-03-11 | 2000-11-24 | Taiyo Yuden Co Ltd | インダクタ及びその製造方法 |
JP3571247B2 (ja) * | 1999-03-31 | 2004-09-29 | 太陽誘電株式会社 | 積層電子部品 |
US6198374B1 (en) * | 1999-04-01 | 2001-03-06 | Midcom, Inc. | Multi-layer transformer apparatus and method |
US6114939A (en) * | 1999-06-07 | 2000-09-05 | Technical Witts, Inc. | Planar stacked layer inductors and transformers |
JP2001023822A (ja) | 1999-07-07 | 2001-01-26 | Tdk Corp | 積層フェライトチップインダクタアレイおよびその製造方法 |
US6240622B1 (en) * | 1999-07-09 | 2001-06-05 | Micron Technology, Inc. | Integrated circuit inductors |
JP2001044037A (ja) * | 1999-08-03 | 2001-02-16 | Taiyo Yuden Co Ltd | 積層インダクタ |
US6533956B2 (en) | 1999-12-16 | 2003-03-18 | Tdk Corporation | Powder for magnetic ferrite, magnetic ferrite, multilayer ferrite components and production method thereof |
JP3365622B2 (ja) * | 1999-12-17 | 2003-01-14 | 松下電器産業株式会社 | Lc複合部品および電源素子 |
US6908960B2 (en) | 1999-12-28 | 2005-06-21 | Tdk Corporation | Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin |
JP3670575B2 (ja) | 2000-01-12 | 2005-07-13 | Tdk株式会社 | コイル封入圧粉コアの製造方法およびコイル封入圧粉コア |
US6998939B2 (en) | 2000-03-08 | 2006-02-14 | Matsushita Electric Industrial Co., Ltd. | Noise filter and electronic device using noise filter |
GB2360292B (en) | 2000-03-15 | 2002-04-03 | Murata Manufacturing Co | Photosensitive thick film composition and electronic device using the same |
US6594157B2 (en) | 2000-03-21 | 2003-07-15 | Alps Electric Co., Ltd. | Low-loss magnetic powder core, and switching power supply, active filter, filter, and amplifying device using the same |
JP2001307933A (ja) * | 2000-04-26 | 2001-11-02 | Fdk Corp | 電流共振型コンバータ用トランス |
JP4684461B2 (ja) | 2000-04-28 | 2011-05-18 | パナソニック株式会社 | 磁性素子の製造方法 |
JP3624840B2 (ja) * | 2000-05-16 | 2005-03-02 | Fdk株式会社 | インダクタ |
DE10024824A1 (de) | 2000-05-19 | 2001-11-29 | Vacuumschmelze Gmbh | Induktives Bauelement und Verfahren zu seiner Herstellung |
US6420953B1 (en) | 2000-05-19 | 2002-07-16 | Pulse Engineering. Inc. | Multi-layer, multi-functioning printed circuit board |
JP2001345212A (ja) * | 2000-05-31 | 2001-12-14 | Tdk Corp | 積層電子部品 |
JP2002043143A (ja) | 2000-07-24 | 2002-02-08 | Tdk Corp | コイル部品 |
JP2002109491A (ja) | 2000-09-29 | 2002-04-12 | Sony Corp | Icカード及びその製造方法 |
JP2002134322A (ja) * | 2000-10-24 | 2002-05-10 | Tdk Corp | 高q高周波コイル及びその製造方法 |
US7485366B2 (en) | 2000-10-26 | 2009-02-03 | Inframat Corporation | Thick film magnetic nanoparticulate composites and method of manufacture thereof |
US6720074B2 (en) | 2000-10-26 | 2004-04-13 | Inframat Corporation | Insulator coated magnetic nanoparticulate composites with reduced core loss and method of manufacture thereof |
JP2002158135A (ja) * | 2000-11-16 | 2002-05-31 | Tdk Corp | 電子部品 |
US6749750B2 (en) * | 2000-11-27 | 2004-06-15 | Biocrystal Ltd. | Magnetic sheet assembly for magnetic separation |
US20020067234A1 (en) * | 2000-12-01 | 2002-06-06 | Samuel Kung | Compact surface-mountable inductors |
US6628531B2 (en) | 2000-12-11 | 2003-09-30 | Pulse Engineering, Inc. | Multi-layer and user-configurable micro-printed circuit board |
EP1347475A4 (en) | 2000-12-28 | 2009-07-15 | Tdk Corp | LAMINATED PCB AND METHOD FOR PRODUCING AN ELECTRONIC PART AND LAMINATED ELECTRONIC PART |
TW531976B (en) | 2001-01-11 | 2003-05-11 | Hanex Co Ltd | Communication apparatus and installing structure, manufacturing method and communication method |
JP3815563B2 (ja) | 2001-01-19 | 2006-08-30 | 株式会社豊田中央研究所 | 圧粉磁心およびその製造方法 |
JP3593986B2 (ja) * | 2001-02-19 | 2004-11-24 | 株式会社村田製作所 | コイル部品及びその製造方法 |
JP3941508B2 (ja) * | 2001-02-19 | 2007-07-04 | 株式会社村田製作所 | 積層型インピーダンス素子 |
JP2002324714A (ja) | 2001-02-21 | 2002-11-08 | Tdk Corp | コイル封入圧粉磁芯およびその製造方法 |
JP2002252116A (ja) * | 2001-02-23 | 2002-09-06 | Toko Inc | 積層型電子部品及びその製造方法 |
WO2002069360A2 (en) * | 2001-02-27 | 2002-09-06 | Matsushita Electric Industrial Co., Ltd. | Coil component and method of manufacturing the same |
KR100374292B1 (ko) | 2001-03-06 | 2003-03-03 | (주)창성 | 대전류 직류중첩특성이 우수한 역률개선용 복합금속분말및 그 분말을 이용한 연자성 코아의 제조방법 |
JP4608794B2 (ja) | 2001-03-21 | 2011-01-12 | ソニー株式会社 | 高周波モジュール装置及びその製造方法 |
US6797336B2 (en) | 2001-03-22 | 2004-09-28 | Ambp Tech Corporation | Multi-component substances and processes for preparation thereof |
JP2002289436A (ja) * | 2001-03-28 | 2002-10-04 | Niigata Seimitsu Kk | インダクタンス素子 |
JP2002313632A (ja) | 2001-04-17 | 2002-10-25 | Matsushita Electric Ind Co Ltd | 磁性素子およびその製造方法 |
JP3555598B2 (ja) * | 2001-06-27 | 2004-08-18 | 株式会社村田製作所 | 積層型インダクタ |
US6768409B2 (en) | 2001-08-29 | 2004-07-27 | Matsushita Electric Industrial Co., Ltd. | Magnetic device, method for manufacturing the same, and power supply module equipped with the same |
US6835889B2 (en) | 2001-09-21 | 2004-12-28 | Kabushiki Kaisha Toshiba | Passive element component and substrate with built-in passive element |
EP1439608A4 (en) | 2001-09-28 | 2008-02-06 | Mitsubishi Materials Corp | ANTENNA COIL AND RFID USE LABEL USING IT, TRANSPONDER UTILITY ANTENNA |
CN100403462C (zh) | 2001-10-24 | 2008-07-16 | 松下电器产业株式会社 | 薄型变压器及其制造方法 |
TWI255469B (en) | 2002-01-16 | 2006-05-21 | Mitsui Chemicals Inc | Magnetic substrate, its lamination, and method for manufacturing the same |
US20040210289A1 (en) | 2002-03-04 | 2004-10-21 | Xingwu Wang | Novel nanomagnetic particles |
US7162302B2 (en) | 2002-03-04 | 2007-01-09 | Nanoset Llc | Magnetically shielded assembly |
US6864418B2 (en) | 2002-12-18 | 2005-03-08 | Nanoset, Llc | Nanomagnetically shielded substrate |
US7091412B2 (en) | 2002-03-04 | 2006-08-15 | Nanoset, Llc | Magnetically shielded assembly |
JP2003229311A (ja) | 2002-01-31 | 2003-08-15 | Tdk Corp | コイル封入圧粉磁芯およびその製造方法、コイルおよびその製造方法 |
US7127294B1 (en) | 2002-12-18 | 2006-10-24 | Nanoset Llc | Magnetically shielded assembly |
US20030184423A1 (en) * | 2002-03-27 | 2003-10-02 | Holdahl Jimmy D. | Low profile high current multiple gap inductor assembly |
WO2003081614A1 (en) * | 2002-03-27 | 2003-10-02 | Commergy Technologies Limited | 'a magnetic structure assembly' |
KR100478710B1 (ko) | 2002-04-12 | 2005-03-24 | 휴먼일렉스(주) | 연자성 분말의 제조 및 이를 이용한 인덕터의 제조방법 |
US6952355B2 (en) | 2002-07-22 | 2005-10-04 | Ops Power Llc | Two-stage converter using low permeability magnetics |
TW553465U (en) * | 2002-07-25 | 2003-09-11 | Micro Star Int Co Ltd | Integrated inductor |
KR100479625B1 (ko) | 2002-11-30 | 2005-03-31 | 주식회사 쎄라텍 | 칩타입 파워인덕터 및 그 제조방법 |
EP1958783B1 (en) | 2002-12-11 | 2010-04-07 | Konica Minolta Holdings, Inc. | Ink jet printer and image recording method |
JP4140632B2 (ja) | 2002-12-13 | 2008-08-27 | 松下電器産業株式会社 | 多連チョークコイルおよびそれを用いた電子機器 |
US7352269B2 (en) | 2002-12-13 | 2008-04-01 | Volterra Semiconductor Corporation | Method for making magnetic components with N-phase coupling, and related inductor structures |
US7965165B2 (en) | 2002-12-13 | 2011-06-21 | Volterra Semiconductor Corporation | Method for making magnetic components with M-phase coupling, and related inductor structures |
US7295092B2 (en) * | 2002-12-19 | 2007-11-13 | Cooper Technologies Company | Gapped core structure for magnetic components |
JP2004200468A (ja) | 2002-12-19 | 2004-07-15 | Denso Corp | インダクタ及びその製造方法 |
JP3800540B2 (ja) | 2003-01-31 | 2006-07-26 | Tdk株式会社 | インダクタンス素子の製造方法と積層電子部品と積層電子部品モジュ−ルとこれらの製造方法 |
US6924777B2 (en) | 2003-03-17 | 2005-08-02 | Hewlett-Packard Development Company, L.P. | Enhanced antenna using flexible circuitry |
JP2004296630A (ja) * | 2003-03-26 | 2004-10-21 | Matsushita Electric Ind Co Ltd | チョークコイルおよびそれを用いた電子機器 |
US6879238B2 (en) | 2003-05-28 | 2005-04-12 | Cyntec Company | Configuration and method for manufacturing compact high current inductor coil |
US20050007232A1 (en) | 2003-06-12 | 2005-01-13 | Nec Tokin Corporation | Magnetic core and coil component using the same |
US7598837B2 (en) | 2003-07-08 | 2009-10-06 | Pulse Engineering, Inc. | Form-less electronic device and methods of manufacturing |
US7307502B2 (en) | 2003-07-16 | 2007-12-11 | Marvell World Trade Ltd. | Power inductor with reduced DC current saturation |
EP1661149A2 (en) | 2003-08-26 | 2006-05-31 | Philips Intellectual Property & Standards GmbH | Ultra-thin flexible inductor |
KR100644790B1 (ko) | 2003-09-01 | 2006-11-15 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 코일 부품 및 그 제조방법 |
US7915991B2 (en) | 2003-09-04 | 2011-03-29 | Koninklijke Philips Electronics N.V. | Fractional turns transformers with ferrite polymer core |
JP2004007010A (ja) * | 2003-09-19 | 2004-01-08 | Mitsubishi Electric Corp | 回路基板およびその製造方法 |
WO2005031764A1 (ja) | 2003-09-29 | 2005-04-07 | Tamura Corporation | 積層型磁性部品及びその製造方法 |
US7319599B2 (en) | 2003-10-01 | 2008-01-15 | Matsushita Electric Industrial Co., Ltd. | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
WO2005036566A1 (ja) * | 2003-10-10 | 2005-04-21 | Murata Manufacturing Co., Ltd. | 積層コイル部品およびその製造方法 |
EP1526556A1 (en) | 2003-10-21 | 2005-04-27 | Yun-Kuang Fan | Ferrite cored coil structure for SMD and fabrication method of the same |
US7489225B2 (en) | 2003-11-17 | 2009-02-10 | Pulse Engineering, Inc. | Precision inductive devices and methods |
US7187263B2 (en) | 2003-11-26 | 2007-03-06 | Vlt, Inc. | Printed circuit transformer |
JP4851062B2 (ja) | 2003-12-10 | 2012-01-11 | スミダコーポレーション株式会社 | インダクタンス素子の製造方法 |
JP4293603B2 (ja) | 2004-02-25 | 2009-07-08 | Tdk株式会社 | コイル部品及びその製造方法 |
JP2005277244A (ja) * | 2004-03-26 | 2005-10-06 | Sao Denki Kogyosho:Kk | リアクトルの製造法 |
US7019391B2 (en) | 2004-04-06 | 2006-03-28 | Bao Tran | NANO IC packaging |
US7330369B2 (en) | 2004-04-06 | 2008-02-12 | Bao Tran | NANO-electronic memory array |
CN2726077Y (zh) * | 2004-07-02 | 2005-09-14 | 郑长茂 | 电感器 |
JP2006032587A (ja) | 2004-07-15 | 2006-02-02 | Matsushita Electric Ind Co Ltd | インダクタンス部品およびその製造方法 |
JP4528058B2 (ja) | 2004-08-20 | 2010-08-18 | アルプス電気株式会社 | コイル封入圧粉磁心 |
US7567163B2 (en) | 2004-08-31 | 2009-07-28 | Pulse Engineering, Inc. | Precision inductive devices and methods |
US7339451B2 (en) * | 2004-09-08 | 2008-03-04 | Cyntec Co., Ltd. | Inductor |
JP2006128224A (ja) * | 2004-10-26 | 2006-05-18 | Neomax Co Ltd | 積層基板の製造方法及び積層基板 |
CN101151688B (zh) | 2004-12-07 | 2013-01-16 | 富多电子公司 | 微型变压器、多层印刷电路及其制造方法 |
KR20070088554A (ko) * | 2004-12-27 | 2007-08-29 | 스미다 코포레이션 | 자성 소자 |
TWM278046U (en) | 2005-02-22 | 2005-10-11 | Traben Co Ltd | Inductor component |
JP2006245055A (ja) * | 2005-02-28 | 2006-09-14 | Mitsubishi Materials Pmg Corp | 圧粉磁心とその製造方法並びにその圧粉磁心を用いたアクチュエータ及び電磁弁 |
DE102005039379B4 (de) | 2005-08-19 | 2010-05-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Magnetisches Bauelement mit Spiralspule(n), Arrays solcher Bauelemente und Verfahren zu ihrer Herstellung |
JP4965116B2 (ja) * | 2005-12-07 | 2012-07-04 | スミダコーポレーション株式会社 | 可撓性コイル |
US7142066B1 (en) | 2005-12-30 | 2006-11-28 | Intel Corporation | Atomic clock |
CN101361146B (zh) * | 2006-01-16 | 2011-09-07 | 株式会社村田制作所 | 电感器的制造方法 |
JP4849545B2 (ja) | 2006-02-02 | 2012-01-11 | Necトーキン株式会社 | 非晶質軟磁性合金、非晶質軟磁性合金部材、非晶質軟磁性合金薄帯、非晶質軟磁性合金粉末、及びそれを用いた磁芯ならびにインダクタンス部品 |
KR20070082539A (ko) | 2006-02-15 | 2007-08-21 | 쿠퍼 테크놀로지스 컴파니 | 자기 부품을 위한 갭이 있는 코어 구조체 |
US7864015B2 (en) | 2006-04-26 | 2011-01-04 | Vishay Dale Electronics, Inc. | Flux channeled, high current inductor |
US7994889B2 (en) | 2006-06-01 | 2011-08-09 | Taiyo Yuden Co., Ltd. | Multilayer inductor |
US7393699B2 (en) | 2006-06-12 | 2008-07-01 | Tran Bao Q | NANO-electronics |
CN101501791A (zh) | 2006-07-14 | 2009-08-05 | 美商·帕斯脉冲工程有限公司 | 自引线表面安装电感器和方法 |
US20080278275A1 (en) | 2007-05-10 | 2008-11-13 | Fouquet Julie E | Miniature Transformers Adapted for use in Galvanic Isolators and the Like |
US7986208B2 (en) | 2008-07-11 | 2011-07-26 | Cooper Technologies Company | Surface mount magnetic component assembly |
US8378777B2 (en) | 2008-07-29 | 2013-02-19 | Cooper Technologies Company | Magnetic electrical device |
US8310332B2 (en) | 2008-10-08 | 2012-11-13 | Cooper Technologies Company | High current amorphous powder core inductor |
US8466764B2 (en) | 2006-09-12 | 2013-06-18 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
US8941457B2 (en) | 2006-09-12 | 2015-01-27 | Cooper Technologies Company | Miniature power inductor and methods of manufacture |
US8400245B2 (en) | 2008-07-11 | 2013-03-19 | Cooper Technologies Company | High current magnetic component and methods of manufacture |
US7791445B2 (en) | 2006-09-12 | 2010-09-07 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
JP2008078178A (ja) | 2006-09-19 | 2008-04-03 | Shindengen Electric Mfg Co Ltd | インダクタンス素子 |
JP2008270532A (ja) * | 2007-04-20 | 2008-11-06 | Shinko Electric Ind Co Ltd | インダクタ内蔵基板及びその製造方法 |
CN101325122B (zh) | 2007-06-15 | 2013-06-26 | 库帕技术公司 | 微型屏蔽磁性部件 |
JP5054445B2 (ja) * | 2007-06-26 | 2012-10-24 | スミダコーポレーション株式会社 | コイル部品 |
JP5084408B2 (ja) | 2007-09-05 | 2012-11-28 | 太陽誘電株式会社 | 巻線型電子部品 |
US8004379B2 (en) | 2007-09-07 | 2011-08-23 | Vishay Dale Electronics, Inc. | High powered inductors using a magnetic bias |
US20090096565A1 (en) | 2007-10-16 | 2009-04-16 | Comarco Wireless Technologies, Inc. | Parallel gapped ferrite core |
US7525406B1 (en) | 2008-01-17 | 2009-04-28 | Well-Mag Electronic Ltd. | Multiple coupling and non-coupling inductor |
JP5165415B2 (ja) * | 2008-02-25 | 2013-03-21 | 太陽誘電株式会社 | 面実装型コイル部材 |
KR100982639B1 (ko) | 2008-03-11 | 2010-09-16 | (주)창성 | 연자성 금속분말이 충전된 시트를 이용한 적층형 파워인덕터 |
EP2131373B1 (de) | 2008-06-05 | 2016-11-02 | TRIDELTA Weichferrite GmbH | Weichmagnetischer Werkstoff und Verfahren zur Herstellung von Gegenständen aus diesem weichmagnetischen Werkstoff |
US8183967B2 (en) | 2008-07-11 | 2012-05-22 | Cooper Technologies Company | Surface mount magnetic components and methods of manufacturing the same |
US8279037B2 (en) | 2008-07-11 | 2012-10-02 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US8659379B2 (en) | 2008-07-11 | 2014-02-25 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US8188933B2 (en) * | 2008-12-17 | 2012-05-29 | Panasonic Corporation | Antenna unit and mobile terminal therewith |
US20100277267A1 (en) | 2009-05-04 | 2010-11-04 | Robert James Bogert | Magnetic components and methods of manufacturing the same |
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US20100171579A1 (en) | 2010-07-08 |
CN102099877A (zh) | 2011-06-15 |
CN102099877B (zh) | 2015-08-12 |
TW201009859A (en) | 2010-03-01 |
WO2010014444A1 (en) | 2010-02-04 |
JP2011530172A (ja) | 2011-12-15 |
CA2724149A1 (en) | 2010-02-04 |
US20100026443A1 (en) | 2010-02-04 |
KR101555398B1 (ko) | 2015-09-23 |
US8910373B2 (en) | 2014-12-16 |
US20130113591A1 (en) | 2013-05-09 |
TWI467607B (zh) | 2015-01-01 |
EP2313898A1 (en) | 2011-04-27 |
TW201503179A (zh) | 2015-01-16 |
US8378777B2 (en) | 2013-02-19 |
US20130113592A1 (en) | 2013-05-09 |
KR20110042151A (ko) | 2011-04-25 |
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