KR20190010398A - Hander for testing electronic components - Google Patents

Abstract

The present invention relates to a handler for a low temperature test capable of testing an electronic component under a low temperature environment. According to the present invention, the handler for a low temperature test has a structure to be able to be locally cooled by configuring an environment maintenance chamber and keeping the environment maintenance chamber dry. Therefore, reliability of a test on the electronic component is increased and energy is saved while increasing cooling efficiency. The handler for testing an electronic component comprises: a test supporting part supporting a low temperature test on electronic components; and a stacker part retrieving a customer tray loading a tested electronic component.

Description

[0001] HANDER FOR TESTING ELECTRONIC COMPONENTS [0002]

The present invention relates to a handler for testing electronic components that enables an electronic component such as a semiconductor device to be tested by a tester.

Electronic components such as semiconductor devices are produced through numerous processes as the case may be. Even though each process is done under standardized conditions, it is virtually impossible at present to produce only good products, since electronic products that require precise work are more susceptible to subtle variations in conditions. That is, the generation of defective products is inevitable. Therefore, the produced electronic parts are tested by a tester and then divided into good and defective parts, and only good parts are shipped.

Testing of electronic components is only possible if the electronic components are electrically connected to the tester. At this time, the handler is a device that electrically connects the socket of the tester to the electronic component.

On the other hand, electronic components can be used in a variety of thermal environments. Therefore, when testing electronic components, it is necessary to perform testing in a state in which a specific temperature environment is established. Thus, the handler needs to electrically connect the electronic component to the tester while maintaining the electronic component at a high temperature, a low temperature, or a normal temperature condition according to the required test conditions. Among them, the present invention relates to a handler capable of supporting a test while maintaining an electronic component at a low temperature.

Generally, there are a chamber type and a plate type in which electronic components are cooled.

The chamber system constitutes a chamber in which a low-temperature environment can be formed, and the electronic components are cooled by accommodating the electronic components in the chamber. Such a chamber system has a disadvantage in that it consumes a large amount of energy in order to maintain the temperature inside the chamber having a large space at a low temperature and consumes a long time for cooling the electronic components.

The plate method is a method of cooling an electronic component through conduction by mounting an electronic component on a plate cooled by a cooling fluid. Such a plate method has a disadvantage in that the cooling time is short because the electronic parts are directly cooled through conduction, but the condensation or icing occurs due to the influence of the relatively high temperature ambient air due to local cooling. Particularly, when condensation or freezing occurs before the electronic parts are pre-cooled before the test of the electronic parts, electrical contact between the electronic parts and the tester occurs in the test process, and furthermore, due to condensation or freezing Damage may occur to the components that make up the handler.

Of course, it is possible to mix the chamber type and the plate type, but it is practically impossible to completely block the inside of the chamber from the path of moving the electronic parts and the like, so that the energy consumption is inevitably large. Moreover, it is practically difficult to prevent condensation or freezing from ultimately occurring as relatively humid external air enters the chamber.

Korean Patent Publication No. 10-2003-0023213 Korean Patent Publication No. 10-2004-0026456 Korean Patent Publication No. 10-2014-0125465

It is an object of the present invention to provide a technique which does not cause condensation or freezing at the time of a low temperature test while using a plate method.

A handler for testing electronic components according to the present invention comprises: a test support portion for supporting a low temperature test on an electronic component; A stacker portion for supplying a customer tray on which electronic parts to be tested are to be tested by the test support portion and for retrieving a customer tray on which electronic components having been tested are placed; Wherein the test support portion comprises: a stacker located in a supply region for supplying an electronic component to a test region, the stacker having a first temperature controllable plate on which the temperature of the loaded electronic component can be adjusted; A second temperature-adjusting mounting plate for adjusting the temperature of the loaded electronic component, a second temperature-adjusting mounting plate for adjusting the temperature of the mounted electronic component, moving the tested electronic component through the first temperature-adjusting mounting plate to the test area, A shuttle; Moving the electronic parts to be tested from the customer tray from the stacker portion to the supply position to the first temperature control mounting plate or moving the electronic component from the first temperature control mounting plate to the second temperature controlling mounting plate At least one first mobile device for providing the first mobile device; A connector for electrically connecting the electronic component moved from the supply region to the test region by the second temperature control plate to the tester so that the electronic component can be tested by the tester; A recovery plate located in the recovery area for recovering an electronic component that has been tested on the test area by the second temperature control plate for unloading the recovery area; At least one second movable unit for moving the electronic component moved to the collection area by the second temperature control plate, to the collection plate; The first temperature control plate and the second temperature control plate are provided to maintain the dry environment of the space in which the first temperature control plate and the second temperature control plate are located, An environment-maintaining chamber having at least one supply hole for supplying a gas; A humidity sensor for measuring the humidity inside the environment maintaining chamber; A dryer for supplying dry air into the environment maintaining chamber; A cooler for supplying the cooling fluid to cool the first temperature control plate and the second temperature control plate; And a controller for controlling a supply amount of dry air by controlling the dryer according to the information measured by the humidity measurement sensor. Wherein the first temperature-adjusting mounting plate and the second temperature-adjusting mounting plate are each capable of loading electronic components, the temperature of the loaded electronic components is adjusted by conduction, and the cooling fluid supplied by the cooler And the loader has a first heater for applying heat to the electronic component mounted on the first temperature control mounting plate; And a first temperature measuring sensor for measuring the temperature of the first temperature controlling plate; Wherein the shuttle includes a second heater for applying heat to the electronic component mounted on the second temperature control mounting plate; And a second temperature measurement sensor for measuring the temperature of the second temperature control plate; Wherein the controller controls the cooler and the heater in accordance with the information measured by the first temperature measurement sensor and the second temperature measurement sensor so that the first temperature adjustment mounting plate and the second temperature adjustment mounting plate Lt; / RTI >

At least one of the cooling pipes for supplying or recovering the cooling fluid cooled by the cooler to the cooling furnace is provided as a double pipe and dry air is supplied by the dryer between the inner pipe and the outer pipe of the double pipe, The cooling fluid supplied and recovered by the cooler is transferred to the inner tube of the double tube.

Wherein the environment maintaining chamber has at least one opening / closing door that can open / close the inside of the environment by an operator, the opening / closing door includes: a first door capable of opening / closing a first opening area; And a second door installed in the first door and capable of opening and closing a second opening area narrower than the first opening area; .

The connector presses the electronic component to the socket side of the tester and has a fluid passage through which the cooling fluid supplied from the cooler passes; A heating element installed on the pusher to apply heat to the pusher; A temperature measuring element installed on the pusher and measuring the temperature of the pusher; And cooling tubes for supplying the cooling fluid cooled by the cooler to the pusher or for recovering the cooling fluid from the pusher through the fluid passage to the cooler; Wherein at least one cooling tube of the cooling tubes is spirally arranged to ensure mobility of the pusher and the controller controls the cooler and the heating element by the temperature measured by the temperature measuring element The temperature of the pusher is adjusted.

The loader may further include a spacing element for fixing the first temperature control plate for mounting at a predetermined distance from the base surface; And the first temperature control plate is spaced apart from a lower end and a side end of the first temperature control plate, so that air in the vicinity of the first temperature control plate is loaded on the first temperature control plate Shielding walls to minimize impact on electronic components; And a point where the dry air is supplied by the dryer is a point where the loading plate and the base surface are spaced apart from each other.

The shielding wall is formed with spray holes through which the dry air supplied to a point spaced between the shielding wall and the first temperature control plate can be sprayed to the surroundings.

The shuttle machine includes: a base plate movably provided by a moving source; A spacing element for fixing the second temperature control plate to a predetermined distance from the base plate; And a second thermostatting plate for thermally adjusting the temperature of the second thermostatting plate, the second thermostatting plate being spaced apart from a lower end and a side of the second thermostatting plate, Shielding walls to minimize impact on electronic components; And a point where the dry air is supplied by the dryer is a point where the second temperature control mounting plate and the base plate are spaced apart from each other.

The shielding wall is formed with injection holes through which the dry air supplied to the points separated from the second temperature control-use mounting plate and the base plate can be sprayed to the surroundings.

An opening / closing device for opening / closing the supply hole; And the controller controls the switch so that the supply hole is opened only when the customer tray moves through the supply hole.

The dry air supplied by the dryer is supplied to at least one of the supply region and the test region, thereby generating a pressure difference between the test region and the collection region, so that air in the collection region enters the test region ≪ / RTI >

The second temperature control plate may include a loading portion for holding an electronic component to be tested; And an unloading portion for carrying the tested electronic component; Wherein the shuttle comprises a cooling element for cooling the loading site; And a heating element for heating the loading and unloading portions; And the unloading portion can be heated only in accordance with the control.

The present invention has the following effects.

First, since the outside air is prevented from penetrating into the chamber while using the plate type, the occurrence of condensation or freezing at the time of low temperature test is prevented, so that the reliability of the test for the electronic parts can be improved and the damage of the equipment can be prevented.

Second, the local cooling by the plates improves the cooling efficiency and minimizes the outflow of cold air, thereby saving energy.

Third, the reliability of testing on electronic components is further improved because the heat that can occur in electronic components can be controlled quickly during the test.

1 is a schematic perspective view of a handler for testing electronic components according to an embodiment of the present invention.
2 is a conceptual plan view of the handler for testing electronic components of FIG.
Fig. 3 is a schematic explanatory perspective view of the loader applied to the handler of Fig. 1;
Figure 4 is a conceptual side view of the loader of Figure 3;
5 is a schematic outline schematic diagram of a shuttle machine applied to the handler of FIG.
Fig. 6 is another example of a loader that can be applied to the handler of Fig.
FIG. 7 is an excerpt of a cooling piping applied to the shuttle machine of FIG. 5;
Fig. 8 is a schematic explanatory perspective view of a connector applied to the handler of Fig. 2; Fig.
Figure 9 is a schematic cut-away perspective view of the pusher applied to the connector of Figure 8;
10 is a schematic outline schematic diagram of a modification of the shuttle machine of FIG.

Preferred embodiments according to the present invention will be described with reference to the accompanying drawings, but for the sake of brevity of description, descriptions of redundant or substantially identical configurations are omitted or compressed as much as possible.

1 is a schematic perspective view of a handler 100 (hereinafter, referred to as a 'handler') for testing electronic components according to an embodiment of the present invention.

1, the handler 100 according to the present embodiment includes a test support portion (TSP) capable of supporting testing for electronic components and a stacker (not shown) for supplying or retrieving a customer tray (CT) with a test support portion (SKP). ≪ / RTI > Here, the customer tray (CT) supplying from the stacker portion (SKP) to the test support portion (TSP) contains the electronic components to be tested and the customer tray (CT) contains the tested electronic components.

2, which is a conceptual plan view of the handler 100 of FIG. 1, will be described in detail with reference to the detailed structures of the handler 100. FIG.

The test support portion TSP includes a loader 110, a shuttle 120, a first mobile device 130, a connector 140, a collection plate 150, a second mobile device 160, an environment maintenance chamber 170, A first switch 181, a second switch 182, a humidity sensor SS, a drier 190, a cooler CA and a controller MA.

The stacker 110 is located in a supply region SA for supplying an electronic component to the test region TA and is cooled by the cooling fluid supplied by the cooler CA to thereby directly cool the electronic component carried by the conduction . That is, the handler 100 according to the present embodiment has a structure that can be pre-cooled before the electronic parts are tested using the loader 110. [ To this end, the stacker 110 includes a first temperature controlling plate 111, a first heater 112, a first temperature measuring sensor 113, and a second temperature measuring sensor 113 as shown in a schematic exploded perspective view of FIG. 3 and a conceptual side view of FIG. A first spacing element 114 and a first shielding wall 115.

The first thermostatic loading plate 111 has loading grooves LS on which the electronic parts can be placed and loaded. Two cooling passages (CW) starting from the front and rear end portions and ending at the intermediate portion are formed in the first temperature controlling use plate 111. The cooling passages A sensor groove SG is formed. To this end, the first temperature controlling plate 111 may be provided with an upper plate 111a and a lower plate 111b which are closely coupled to each other.

The cooling fluid supplied by the cooler CA flows into the cooling path CW through the start point S of both ends of the first temperature control plate 111 and then flows into the first temperature control plate 111 And is configured to flow out of the cooling furnace (CW) through an end point (E) to an intermediate portion. The reason for constructing the cooling furnace (CW) in this way is that it is confirmed through studies with various experiments. In an example of an experiment, the temperature of the cooling fluid injected into the starting point S at a temperature of minus 70 ° C increases toward the end point E. In this case, it was confirmed that the middle portion of the first temperature controllable plate 111 at which the end point E is located does not fall to a temperature of minus 65 degrees or less because the surrounding air and the exposed surface are small. On the other hand, the both end portions of the first temperature control plate 111 where the starting point S where the cooling fluid of minus 70 degrees is injected were found to be minus 65 degrees due to the surrounding air and the exposed surfaces. Of course, this example is a specific example and may have a temperature deviation of +/- 1 degree.

 The first heater 112 is embedded in the heater groove HS to apply heat to the electronic component mounted on the first temperature control mounting plate 111 through the surface contact. More specifically, the heat generated by the first heater 112 heats the first temperature adjustment mounting plate 111, and the electronic component mounted on the first temperature adjustment mounting plate 111 is heated by the heat conduction. This first heater 112 can be used when performing a high temperature test and can be used for precise temperature control even in a low temperature test. When the first heater 112 stops jamming after the low temperature test or stops the operation of the handler 100 for the next operation, the first temperature adjusting plate 111 is returned to room temperature, It can be used to prevent icing.

The first temperature measuring sensor 113 is installed in the sensor groove SG to measure the temperature of the first temperature controlling plate 111. [ The controller MA controls the first heater 112, the dryer 190, and the cooler CA in accordance with the temperature information measured by the first temperature measurement sensor 113.

The first spacing element 114 is positioned between the base surface BF of the handler 100 where the loader 110 is installed and the bottom surface of the first shielding wall 115 And is spaced apart from the portion. The reason why the first spacing element 114 is provided is to minimize the escape of cold air or heat of the locally cooled or heated first temperature control plate 111 to the base surface BF by conduction. Therefore, the first spacing elements 114 need to be provided in a minimum number of materials having a low thermal conductivity (a material similar to a resin rather than a metal), and the thickness of the first spacing elements 114 can be set to a value capable of supporting the first temperature controllable plate 111 Is preferable.

In the handler 100 according to the present invention, the first temperature-adjusting plate 111 and the base surface BF are spaced apart from each other by the first spacing elements 114, 190 are supplied with dry air. By doing so, dry air can be intensively supplied to a region where condensation or icing is most likely to be required to supply dry air, thereby reducing the amount of dry air consumed while increasing the efficiency of drying at that site. The dry air is supplied as needed and functions as a heat insulating means.

The first shielding wall 115 is provided in the form of a substantially rectangular frame so as to be spaced apart from the side of the first temperature controllable plate 111 at the periphery of the first temperature controllable plate 111. [ Accordingly, the first shielding wall 114 forms the shielding film formed by the dry air in the up-and-down direction while shielding the first temperature-adjusting mounting plate 111 and the electronic parts mounted thereon from the surrounding air to a certain degree, Thereby minimizing the influence on the first temperature controllable plate 111 and the electronic components mounted thereon. To this end, the upper end of the first shielding wall 115 is preferably higher than the first thermostat mounting plate 111 and the electronic components mounted thereon, whereby the upper portion of the shielding wall 115 is provided with a first temperature- A replacement groove 115a for facilitating the replacement of the upper plate 111a of the base plate 111 is formed. Of course, the shielding wall 115 is provided with a plurality of through holes (not shown) through which cooling pipes for supplying and recovering the cooling fluid can be passed to the cooling path CW of the first temperature control mounting plate 111, 115b are formed.

On the inner wall surface and the bottom surface of the first shielding wall 115, dry air supplied to the first temperature control plate 111 and the point A of the base surface BF is supplied to the first temperature control plate 111 The spray holes 115c are formed so as to be able to be sprayed toward the inside of the discharge port 115c. The moisture-tight surrounding air is further prevented from moving through the first shielding wall 115 to the first temperature control-use mounting plate 111 or the electronic component mounted thereon, thereby further preventing condensation or freezing phenomenon . The point at which the dry air is injected through the injection holes 115c and the injection holes 115c is located below the uppermost end face of the first loading plate 111 so that the first moving plate 130 can grip or grip It is necessary to prevent the possibility of defective transfer or disconnection of the electronic component to be released.

The inner surface of the side portion of the first shielding wall 115 is spaced apart from the side of the first temperature controllable plate 111 and the bottom surface of the first shielding wall 115 is connected to the first temperature controllable plate 111 ), As shown in Fig. In order to prevent the cooling air or the heat of the first temperature control use mounting plate 111 from escaping through the first shielding wall 111, the above-described injection hole 115c is formed, To provide air that has been dried around the perimeter (111).

The shuttle unit 120 moves the electronic component that has passed through the loader 110 to the test area TA or moves the tested electronic component from the test area TA to the recovery area RA. 5, the shuttle 120 is provided with a second temperature controlling plate 121, a second heater 122, a second temperature measuring sensor 123, a second spacing element 124, A wall 125, a base plate 126, a special structure of cooling lines 127, and a source 128.

The second temperature control plate 121 may be loaded with electronic components and may be loaded into the loading part 121a (the 'loading pocket' in the prior art) as in the prior art, And an unloading portion 121b (referred to as " unloading pocket " in the prior art). The loading portion 121a is a portion where the electronic component to be tested is loaded, and the unloading portion 121b is a portion where the tested electronic component is loaded. As in the prior art, the second temperature control mounting plate 121 can be moved by the source 128, wherein the loading portion 121a moves between the loading position LP and the testing position TP, The loading portion 121b moves between the test position TP and the unloading position UP. Of course, according to the embodiment of the present invention, it is possible to have only one loading part without distinguishing between the loading part 121a and the unloading part 121b, and the moving part of the loading part is divided into the loading position LP, the test position TP, The configuration for enlarging the image to the position UP can be sufficiently taken into consideration. The second temperature controlling plate 121 is also provided with a cooling path through which the cooling fluid passes, a heater groove and a sensor groove. The function of the cooling path is the cooling path CW of the first temperature controlling plate 111, HS and the sensor groove SG, and therefore, the description thereof will be omitted.

The second heater 122, the second temperature measuring sensor 123, the second spacing element 124 and the second shielding wall 125 are also connected to the first heater 112 of the first temperature control plate 111, The first temperature measuring sensor 113, the first spacing element 114 and the first shielding wall 115, the detailed description thereof will be omitted.

The base plate 126 is provided movably by the movement source 128. The second temperature controlling plate 121 is provided to be spaced from the base plate 126 by the second spacing member 124 so that the second temperature controlling plate 121 is also moved by the movement of the moving source 128 And the dry air is supplied to the spaced point B between the second temperature control mounting plate 121 and the base plate 126.

For reference, it can be considered sufficiently that the loading unit 110 described above is also movably provided with the first temperature controlling loading plate 111 as in the shuttle 120. [ Since the loader 110 needs to load more electronic parts or quench the electronic parts at room temperature according to the load, the cooling path CW of the first temperature controllable plate 111A is divided into the second The first and second temperature control plates 111A and 111A can be formed in a larger number than the cooling path of the temperature control plate 121. Thus, unlike in the example of FIG. 3, As shown in FIG.

The cooling pipes 127 are provided to supply the cooling fluid supplied from the cooler CA to the second temperature control plate 121 or to recover the cooling fluid from the second temperature control plate 121. It is preferable that the cooling pipes 127 are provided as a double pipe having an outer pipe 127a and an inner pipe 127b inside the outer pipe 127a as shown in FIG. Condensation or freezing may occur on the outer surface of the inner pipe 172b where the low temperature cooling fluid moves to the inside. This is because condensation or freezing may damage the inner pipe 127b which is bent when the second temperature control use mounting plate 127 moves. Therefore, it is provided with an outer pipe 127a which can protect the inner pipe 127b from being directly exposed to the outside air. It is further preferable that the inner pipe 127b is provided as a spiral pipe like a cooling tube of a connector 140 to be described later. It is also preferable that dry air coming from the dryer 190 is supplied to the space S between the inner pipe 127b and the outer pipe 127a. This structure minimizes the damage of the cooling pipe 122 due to the frequent movement of the second temperature control plate 121. Of course, if the first temperature control use mounting plate 111 of the loader 110 is also movably provided, it is preferable that the cooling pipe provided in the loader 110 is also provided with a double pipe.

The first mobile device 130 moves the electronic parts to be tested from the customer tray CT that has come from the stacker portion SKP to the supply position SP to the first temperature control mounting plate 111, The electronic component is moved from the adjustment mounting plate 111 to the loading portion 121a of the second temperature control mounting plate 121. [ The function of moving the electronic component from the customer tray (CT) to the first temperature control mounting plate 111 and the function of moving the first temperature control mounting plate 111 to the second temperature control mounting plate 121 A plurality of first mobile devices 130 may be provided so as to take charge of the functions of moving the first mobile devices 130.

The coupler 140 electrically connects the electronic part held by the suction part to the test socket TS of the tester after gripping and holding the electronic part of the loading part 121a at the test position TP by vacuum pressure, And moves the component to the unloading portion 121b. Here, the electrical connection between the electronic component and the test socket (TS) is made by a method of pressing the electronic component into the test socket (TS). To this end, the coupler 140 includes a head 141, eight pushers 142, a heating element HD, a first temperature measurement element TD ₁ , also it includes a measuring device (TD _2), the cooling tube 143, the vertical mover 144 and the horizontal mover 145.

The head 141 is vertically movable by a vertically movable unit 143. This head 141 has a passageway structure or valve structure for providing vacuum pressure to the eight pushers 142. Of course, a separate tube structure or the like may be used to provide vacuum pressure to the pusher 142.

Each of the eight pushers 142 is provided to press the electronic component. Thus, at a time, eight electronic components are electrically connected to the tester. Of course, the number of pushers 412 may vary depending on the embodiment of the equipment. The pusher 142 has a T-shaped cross section and is divided into an upper engagement portion 142a and a lower contact portion 142b.

The engaging portion 142a is coupled to the head 141. [ The coupling portion 142a is formed with a guide hole GH into which a guide pin (not shown) for guiding the position of the pusher 142 is precisely inserted.

The contact portion 142b is a portion having a narrower width than the coupling portion 142a. The contact end CE, which is the lower end surface of the contact portion 142b, contacts the electronic component and presses the electronic component. The electronic component is also gripped by the user.

The vacuum furnace VW is formed so as to apply vacuum pressure to an electronic component to attract and hold the electronic component. Here, the vacuum pressure may be implemented to be supplied from the outside, or may be implemented by having a regulator for generating a vacuum pressure in the handler 100 so as to be supplied from the regulator.

The pusher 212 is provided with a fluid passage TW through which the cooling fluid supplied by the cooler CA passes.

The fluid passage TW is formed such that the cooling fluid introduced through the inlet IH in the coupling portion 142a moves to the contact portion 142b and then exits through the outlet OH in the coupling portion 142a . Thus, the cooling fluid from the cooler CA to the pusher 142 exits the pusher 142 through the fluid passage TW.

The heating element HD is provided to heat the pusher 142 to heat the electronic component that is ultimately pressed by the pusher 142. Such a heating element HD can be used for heating for high temperature testing, heating for fine temperature control, heating for turning the cooled electronic component to room temperature, and the like as well as the first heater 112 and the second heater 122.

The first temperature measuring element TD ₁ is provided for measuring the temperature of the pusher 142 and the second degree measuring element TD ₂ is provided for directly measuring the temperature of the electronic part. Therefore, it is preferable that the second temperature measuring element TD ₂ is provided on the contact end CE side of the contact portion 142b so as to be in contact with the electronic component.

As can be seen in the figure, the heating element HD, the first temperature measuring element TD ₁ and the second temperature measuring element TD ₂ are installed in the pusher 142.

The cooling tube 143 supplies the cooling fluid cooled by the cooler CA to the pushers 142 or the cooling fluid coming out of the pushers 142 through the fluid passage TW to the cooler CA. It is prepared to recover. It is preferable that the cooling tubes 143 are provided in a spiral shape so as to have flexible bending due to elastic deformability and restoring property in order to ensure the mobility of the pusher 142 moving in the horizontal direction and the vertical direction according to their installation positions.

The vertical mover 144 causes the head 141 to move up and down (see arrow a). Accordingly, the head 141 provided with the pusher 142 can be lowered or raised. When the pusher 142 is lowered, the pusher 142 is moved to a position where the pusher 142 can grip the electronic component or a position where the electronic component is pressed toward the test socket TS .

The horizontal movement device 145 moves the head 141 in the horizontal direction (see arrow b).

That is, the head 141 provided with the pusher 142 by the operation of the vertical movement device 144 and the horizontal movement device 145 grasps the electronic component from the loading part 121a of the second temperature control use mounting plate 121 The gripped electronic component can be electrically connected to the test socket TS and the tested electronic component can be moved to the unloading portion 121b of the second temperature control mounting plate 121. [

The recovery plate 150 is located in the recovery area RA for recovering the tested electronic components and is positioned at the unloading position RA of the recovery area RA in the test area TA by the second temperature- (UP) is completed. Therefore, the recovery plate 150 also has a structure in which the electronic parts can be loaded, and the customer tray CT may simply replace the recovery plate 150. If the customer plate CT replaces the role of the recovery plate 150, it may be implemented to be moved to the recovery position RP by a separate mover, such as the second temperature control plate 121 .

The second mobile unit 160 moves the electronic components of the unloading part 121b from the test area TA to the unloading position UP of the recovery area RA by moving the second temperature control mounting plate 121 To the collection plate 150 or to move the electronic components in the collection plate 150 to the empty empty customer tray CT at the recovery position RP. Of course, when the recovery plate 150 is embodied as the customer plate CT and the structure is such that the customer tray CT can be moved to the forward recovery position RP by a separate mover, Only the function of moving the electronic component from the second temperature control mounting plate 121 to the recovery plate 150 is sufficient.

The environment maintaining chamber 170 is configured to maintain the dry environment of the space in which the first temperature controlling plate 111, the second temperature controlling plate 121, the pusher 142 and the test socket TS exist. Isolate them from the outer air. In this embodiment, at least the head 141 of the first temperature controllable plate 111, the second temperature controllable plate 121, the first mobile unit 130, and the connector 140 is installed in the environment- The pusher 142, the recovery plate 150, the second mobile device 160, and the test socket TS. However, the environment maintaining chamber 170 in the present invention is not provided for cooling the space inside the environment maintaining chamber 170, and is greatly different from the prior art in that it is provided to provide a dry environment inside. The environment maintaining chamber 170 has an opening / closing door 171, a supply opening (SH), and a recovery opening (RH).

The opening and closing door 171 is provided by an operator to open and close the interior of the environment maintaining chamber 170, and is provided with a double door.

The first door 171a can open / close a wide first opening area.

The second door 171b is installed in the vicinity of the center of the first door 171a and can open / close a second opening area narrower than the first opening area.

That is, when manual operation is required inside the environment maintaining chamber 170 due to occurrence of jam or the like, the operator can selectively open the first door 171a according to the degree of the manual operation, 2 door 171b can be opened. In this case, when only the second door 171b is opened, the operator needs to visually check the inside of the environment-maintaining chamber 170, so that the space between the second door 171b and the frame of the first door 171a, As shown in FIG. Further, even when the second door 171b is opened, a separate air curtain which can form an air film to minimize the cold air loss of the environment-maintaining chamber 170 can be formed or the arm can be inserted, It is also conceivable to arrange them tightly in thin yarns, such as in the form of brushes, or to construct other blocking members so as to be blocked as much as possible.

For reference, it is preferable that the opening / closing door 171 is provided as many as necessary at necessary positions.

The supply hole SH provides a passage through which the customer tray CT in the stacker portion SKP can be moved to the supply position SP.

The recovery hole RH provides a passage through which the customer tray CT at the recovery position RP can be moved to the stacker portion SKP.

Naturally, the supply hole SH and the recovery hole RH may be formed in an appropriate number depending on the capacity of the handler 100 or other forms of the structure.

For reference, although the environment maintaining chamber 170 is provided, it is also possible to provide a test chamber TC for providing a separate test chamber in the test region TA as in the present embodiment. It is also preferable to separate the supply area SA and the recovery area RA by a separate barrier.

The first switch 181 opens and closes the supply hole SH.

The second switch 182 opens and closes the recovery hole RH.

In addition to the first and second switches 181 and 182, a means for forming a separate air curtain when the supply hole SH and the recovery hole RH are opened may be further provided.

Of course, the first switch 181 and the second switch 182 are provided in the number corresponding to the number of the supply holes SH and the number of the recovery holes RH.

The humidity measurement sensor SS is required to prevent the humidity inside the environment maintaining chamber 170, particularly the occurrence of condensation or freezing, so that the humidity of the supply area SA and the test area TA, which require precise adjustment of the degree of drying, It is prepared for measurement. Particularly, since the humidity of the space in which the first temperature control plate 111 and the second temperature control plate 121 are present is important, the humidity sensor SS detects the temperature of the first temperature control plate 111 and the second temperature It is preferable that it is provided near the adjustment mounting plate 121. Here, it is preferable that the humidity measuring sensor SS installed on the second temperature controlling use mounting plate 121 is movably installed together with the second temperature adjusting mounting plate 121.

The dryer (190) is provided to supply dry air into the environment maintaining chamber (170). The dryer 190 may be configured in the form of a moving circuit that moves the dry air from the external feeder to the interior of the environment maintaining chamber 170. In this embodiment, . ≪ / RTI > Here, it is preferable that the supply point of the dry air supplied into the environment maintaining chamber 170 by the dryer 190 is located in the supply area SA and the test area TA. As described above, in the present invention, the dry air supplied by the dryer 190 is supplied to the loader 110 in the supply area SA and the shuttle 120, which is at least partly located in the test area TA at all times As shown in Fig. The handler 100 according to the present invention supplies dry air through a separate spray nozzle to a fixed point C of a test area TA most sensitive to test conditions. Thereby constituting a chamber TC. Therefore, the test area TA becomes higher in pressure than the neighboring collection area RA, and the air pressure difference between the both areas can be prevented as much as the highly humid air in the recovery area RA enters the test area TA .

Hereinafter, the dryer 190 should be provided. Generally, condensation occurs due to lowering of atmospheric saturated water vapor as the atmospheric temperature falls. Especially, condensation generated at sub-zero temperature condition causes icing which freezes and freezes. However, in the case of a handler capable of low-temperature testing, the temperature of the other components is kept very low because the electronic components must be rapidly cooled to a cryogenic temperature of minus 10 degrees or less. In such a state, the atmospheric temperature in the vicinity of the devices is also lowered, so that the amount of saturated water vapor becomes very low. For example, the saturated water vapor at room temperature is 22.830 g / m ³ , and the saturated water vapor in the atmosphere at -10 ° C is 2.156 g / m ³ . Therefore, condensation and freezing of water vapor may occur on the surfaces of electronic parts and equipment, which may make the equipment incapable of being driven or cause serious damage to the equipment. The present invention has been accomplished through continuous experiments and studies.

The cooler (CA) supplies the cooling fluid to the first temperature control plate (111), the second temperature control plate (121) and the pusher (142). Likewise, the cooling module of the cooler CA may be provided in the handler 100 itself, or may be separately provided in the factory system depending on the implementation. If the cooling module is provided separately from the handler 100, the concept of the cooler CA provided in the handler 100 can be interpreted as a cooling circuit that moves the cooling fluid from the external cooling module to the required location.

The controller MA controls the configurations requiring control among the above configurations. In particular, the controller MA controls the dryer 190 in accordance with the humidity information measured by the humidity sensor SS to adjust the supply amount of the dry air, and to minimize the cold loss inside the environment maintaining chamber 170 The first switch 181 and the second switch 182 are opened so that the supply hole SH and the recovery hole RH are opened only when the customer tray CT is moved through the supply hole SH or the recovery hole RH. . The controller MA controls the degree of cooling or the degree of cooling based on the temperature information of the loading part 121a of the first temperature controlling plate 111, the loading plate 121 of the second temperature controlling plate 121, the pusher 142, Adjust the degree of heating.

On the other hand, the stacker portion SKP includes a supply stacker PS for supplying the customer tray CT to the supply position SP and a recovery stacker PS for withdrawing the customer tray CT from the recovery position RP. (RS).

Next, the handler 100 having the above configuration will be described.

The customer trays (CT) in the supply stacker (PS) are sequentially fed one by one to the supply position (SP). At this time, the first switch 181 opens the supply hole SH while the customer tray CT moves, and when the customer tray CT enters the environment holding chamber 170, the supply hole SH Lt; / RTI >

The first mobile unit 130 moves the electronic components from the customer tray CT at the supply position SP to the first temperature control mounting plate 111. [ As a result, the electronic components mounted on the first temperature controllable plate 111 are cooled by contact with the first temperature controllable plate 111 that is in a cooled state by the cooler CA.

When the electronic component is mounted on the first temperature control use mounting plate 111, the first mobile unit 130 is moved from the first temperature control mounting plate 111 to the second temperature control mounting plate 121 in the loading position LP And moves the precooled electronic components to the loading portion 121a. When the electronic part is loaded on the loading part 121a, the second temperature adjusting loading plate 121 is moved to the right by the moving source 123 so that the loading part 121a of the second temperature adjusting loading plate 121 is moved to the testing position TP. Then, the connector 140 is operated to grip the electronic component from the loading portion 121a using the pusher 142 by the vacuum pressure, and then the pusher 142 is moved by the operation of the vertical and horizontal moveers 144 and 145, Thereby electrically connecting the electronic component held by the test socket TS to the test socket TS. Of course, since the loading part 121a and the pusher 142 are cooled by the cooler CA to a temperature suitable for the test condition, the electronic part does not deviate from the temperature suitable for the test condition in this movement process. In the test process, heat may be generated in the electronic component, but the controller MA controls the cooler (CA) to maintain the electronic component in the required temperature condition.

When the test for the electronic component is completed, the connector 140 moves the electronic component to the unloading portion 121b of the second temperature control mounting plate 121 in the test position TP. At this time, since the loading portion 121a of the second temperature-adjusting mounting plate 121b is at the loading position LP, the electronic components to be tested next are loaded on the loading portion 121a. The unloading portion 121b is moved to the unloading position UP, and the unloading portion 121b is moved to the unloading position UP, 2 mobile unit 160 moves the electronic component from the unloading portion 121b to the recovery plate 150. [ And the electronic component in the recovery plate 150 is moved to the customer tray CT at the forward recovery position RP by the second mobile device 160. [ At this time, the electronic components whose tests have been completed can be moved in accordance with the test results. When the electronic part is filled in the customer tray CT at the recovery position RP, the second switch 182 is operated to open the recovery hole RH, and the customer tray CT is returned from the recovery position RP to the recovery stack (RS).

On the other hand, the humidity sensor SS is disposed inside the environment maintaining chamber 170 (more specifically, near the first temperature controllable plate of the supply region) while the test is continuously performed with movement and testing of the above- And the humidity of the test zone in the vicinity of the second temperature control plate) is continuously measured at predetermined time intervals, and the controller MA adjusts the amount of dry air based on the information and supplies the dry air to the above-mentioned points . Of course, by supplying dry air, the interior of the environment maintaining chamber 170 can maintain the required degree of drying.

Furthermore, the interior of the environment-maintaining chamber 170, in which dry air is continuously supplied by the dryer 190, is constantly higher in pressure than the outside. Accordingly, the internal air of the environment-maintaining chamber 170 flows out to the supply hole (SH), the recovery hole (RH), or other unsealed area, which functions to prevent the external air from flowing into the interior .

Since the dry air is largely injected into the supply area SA and the test area TA, the supply area SA and the test area TA side, in which the drying degree is to be finely adjusted, It is higher pressure. Therefore, when the supply area SA and the recovery area RA are blocked by the shielding film, the air is removed from the supply area SA and the test area TA by the air pressure difference, The air in the recovery area RA is prevented from influencing the air in the supply area SA and this also makes it possible to precisely control the drying degree of the supply area SA .

 In addition, the dryer 190 supplies dry air between the outer pipe 122a and the inner pipe 122b of the cooling pipe 122, which is provided as a double pipe, to prevent the aforementioned cooling pipe 122 from being damaged.

<Modifications>

In the previous embodiment, the second temperature control mounting plate 121 constituting the shuttle 120 is divided into a loading portion 121a and an unloading portion 121b, and the second heater 122, which is a heating element, And is configured to heat or cool both the loading part 121a and the unloading part 121b by the cooling piping 127. [

However, as shown in FIG. 10, the shuttle 120 may be deformed.

10, the second heater 122 is installed to heat both the loading part 121a and the unloading part 121b, but the cooling pipe 127 is disposed to cool only the loading part 121a . Accordingly, the unloading portion 121b can be heated only by the second heater 122, although the loading portion 121a can be heated or cooled by the second heater 122 and the cooling pipe 127. [ Hereinafter, reasons for implementing such a modification will be described.

Typical tests for electronic components include high temperature testing, room temperature testing, and low temperature testing.

In the high temperature test, the test should be performed while the electronic component is maintained at a high temperature. In the low temperature test, the test should be performed while maintaining the electronic component at a low temperature. In the room temperature test, the test is performed while the electronic component is kept at room temperature. Therefore, the second heater 122 and the cooling piping 127 are utilized only in a high temperature test or a low temperature test, except for a special situation.

In most cases, the tested electronic components are unloaded by the picker. At this time, there is a need to cool high-temperature electronic components and heat low-temperature electronic components for proper unloading operations that do not cause damage to the picker or electronic components.

First, the loading portion 121a must be cooled for the low temperature test, and the loading portion 121a must be able to be heated by the second heater 122 for precise temperature control. And the unloading portion 121b must be heated by the second heater 122 to raise the temperature of the loaded electronic component.

If the electronic parts loaded on the unloading portion 121b are not heated close to room temperature, malaise may occur, which may interfere with the picking operation of the picker due to the operation of the second mobile device 160, Can cause problems.

Therefore, in the low temperature test, both the cooling and heating of the loading part 121a are required, but the unloading part 121b needs only to be heated.

On the other hand, for the high temperature test, the loading portion 121a must be heated, and often needs to be cooled for precise temperature control. However, depending on the equipment, the degree of high temperature can be realized at a relatively low temperature (100 degrees +/- 50 degrees), and in this case, it is not necessary to cool the electronic parts for unloading work.

Therefore, at the time of the high temperature test, both the heating and cooling of the loading portion 121a are required, but cooling of the unloading portion 121b is not required depending on the equipment.

That is, even if the equipment is implemented so as to perform both the low temperature test and the high temperature test, the loading portion 121a requires both cooling and heating. However, depending on the equipment, the unloading portion 121b may not have a separate cooling element for cooling the unloading portion 121b since heating is required only during the cooling test and cooling is not required. In this case, the unloading portion 121b can be heated only by the control according to the test mode.

Although the handler according to the above embodiment has a simple structure for clarity of explanation, the handler 110, the shuttle 120, the first mobile device 130, the recovery plate 150, A supply hole (SH), a recovery hole (RH), and the like.

In the above embodiment, the loading part 121a and the unloading part 121b are separately arranged on one second temperature-adjusting mounting plate 121 and are moved together. However, The loading portion 121a and the unloading portion 121b may be disposed on separate plates so that they can be independently moved by a separate moving source. That is, two second temperature control plates may be provided, one second temperature control plate may have a loading portion 121a, and another second temperature control plate may have an unloading portion 121b .

It should be understood, however, that the present invention is not limited to the above-described embodiment, and that the scope of the present invention is not limited to the following claims and equivalents thereof It should be understood.

100: Handler for testing electronic components
TSP: Test support SKP: Stacker part
110: Stacker
111: a first temperature control mounting plate
112: first heater 113: first temperature measuring sensor
114: first spacing element
115: Shielding wall
115c: injection hole
120: Shuttle machine
121: second temperature control plate
122: second heater 123: second temperature measuring sensor
124: second spacing element 125: shielding wall
126: Base plate
127: Cooling piping
127a: Outside piping 127b: Outside piping
130: first mobile station
140: connector
142: pusher
TW: fluid passage path
143: cooling tube
HD: Heating element
TD ₁ : first temperature measuring element TD ₂ : second temperature measuring element
150: Collection plate
160: second mobile station
170: environment maintaining chamber
171: opening and closing door
171a: first door 171b: second door
SH: Feed hole
SS: Humidity sensor
181: First switch 190: Dryer
CA: cooler MA: controller
SP: Supply location

Claims (11)

Test support to support low temperature testing of electronic components;
A stacker portion for supplying a customer tray on which electronic parts to be tested are to be tested by the test support portion and for retrieving a customer tray on which electronic components having been tested are placed; / RTI &gt;
The test support section,
A loader having a first temperature controllable plate disposed in a supply region for supplying the electronic component to the test region and capable of controlling the temperature of the loaded electronic component;
A second temperature-adjusting mounting plate for adjusting the temperature of the loaded electronic component, a second temperature-adjusting mounting plate for adjusting the temperature of the mounted electronic component, moving the tested electronic component through the first temperature-adjusting mounting plate to the test area, A shuttle;
Moving the electronic parts to be tested from the customer tray from the stacker portion to the supply position to the first temperature control mounting plate or moving the electronic component from the first temperature control mounting plate to the second temperature controlling mounting plate At least one first mobile device for providing the first mobile device;
A connector for electrically connecting the electronic component moved from the supply region to the test region by the second temperature control plate to the tester so that the electronic component can be tested by the tester;
A recovery plate located in the recovery area for recovering an electronic component that has been tested on the test area by the second temperature control plate for unloading the recovery area;
At least one second movable unit for moving the electronic component moved to the collection area by the second temperature control plate, to the collection plate;
The first temperature control plate and the second temperature control plate are provided to maintain the dry environment of the space in which the first temperature control plate and the second temperature control plate are located, An environment-maintaining chamber having at least one supply hole for supplying a gas;
A humidity sensor for measuring the humidity inside the environment maintaining chamber;
A dryer for supplying dry air into the environment maintaining chamber;
A cooler for supplying the cooling fluid to cool the first temperature control plate and the second temperature control plate; And
A controller for controlling a supply amount of dry air by controlling the dryer according to information measured by the humidity measurement sensor; Lt; / RTI &gt;
The first temperature-adjusting mounting plate and the second temperature-adjusting mounting plate can respectively load electronic components, adjust the temperature of the electronic components loaded through the conduction, and move the cooling fluid supplied by the cooler And a cooling passage
The load-
A first heater for applying heat to the electronic component mounted on the first temperature control mounting plate; And
A first temperature measurement sensor for measuring the temperature of the first temperature control plate; Further comprising:
The shuttle machine includes:
A second heater for applying heat to the electronic component mounted on the second temperature control mounting plate; And
A second temperature measurement sensor for measuring the temperature of the second temperature control plate; Further comprising:
The controller controls the cooler and the heater according to the information measured by the first temperature measurement sensor and the second temperature measurement sensor to adjust the temperature of the first temperature control mounting plate and the second temperature control mounting plate
Handler for testing electronic components. The method according to claim 1,
At least one of the cooling pipes for supplying or recovering the cooling fluid cooled by the cooler to the cooling furnace is provided as a double pipe,
Dry air is supplied between the inner tube and the outer tube of the double tube by the dryer, and the cooling fluid supplied and recovered by the cooler is moved to the inner tube of the double tube
Handler for testing electronic components. The method according to claim 1,
Wherein the environment maintaining chamber has at least one opening / closing door capable of opening and closing the inside by an operator,
Wherein the opening /
A first door capable of opening and closing a first opening area; And
A second door installed in the first door and capable of opening and closing a second opening area narrower than the first opening area; Containing
Handler for testing electronic components. The method according to claim 1,
The connector presses the electronic component to the socket side of the tester and has a fluid passage through which the cooling fluid supplied from the cooler passes;
A heating element installed on the pusher to apply heat to the pusher;
A temperature measuring element installed on the pusher and measuring the temperature of the pusher; And
Cooling tubes for supplying the cooling fluid cooled by the cooler to the pusher or for recovering the cooling fluid from the pusher through the fluid passage to the cooler; / RTI &gt;
Wherein at least one cooling tube of the cooling tubes is spirally provided to ensure mobility of the pusher,
Wherein the controller controls the cooler and the heating element by the temperature measured by the temperature measuring element to adjust the temperature of the pusher
Handler for testing electronic components. The method according to claim 1,
The load-
A spacing element for fixing the first temperature control plate to a predetermined distance from the base surface; And
The first temperature-adjusting plate is spaced apart from the lower end and the side edges of the first temperature-adjusting plate, so that air in the vicinity of the first temperature-adjusting plate is placed in the vicinity of the first temperature- Shielding wall to minimize impact on parts; Further comprising:
The point at which the dry air is supplied by the dryer is a distance between the loading plate and the base surface
Handler for testing electronic components. 6. The method of claim 5,
Wherein the shielding wall is formed with spray holes through which the dry air supplied to a position spaced apart from the shielding wall and the first temperature controllable plate can be sprayed to the surroundings
Handler for testing electronic components. The method according to claim 1,
The shuttle machine includes:
A base plate movably provided by the moving source;
A spacing element for fixing the second temperature control plate to a predetermined distance from the base plate; And
And the second temperature-adjusting plate is provided at a periphery of the second temperature-adjusting plate for mounting the second temperature-adjusting plate for mounting thereon, Shielding wall to minimize impact on parts; Further comprising:
The point at which the dry air is supplied by the dryer is a distance between the second temperature-adjusting mounting plate and the base plate
Handler for testing electronic components. 8. The method of claim 7,
And the shielding wall is formed with spray holes through which the dry air supplied to the points separated from the second temperature control-use mounting plate and the base plate can be sprayed to the surroundings
Handler for testing electronic components. The method according to claim 1,
An opening / closing device for opening / closing the supply hole; Further comprising:
The controller controls the switch so that the supply hole is opened only when the customer tray moves through the supply hole
Handler for testing electronic components. The method according to claim 1,
The dry air supplied by the dryer is supplied to at least one of the supply region and the test region, thereby generating a pressure difference between the test region and the collection region, so that air in the collection region enters the test region To prevent
Handler for testing electronic components. The method according to claim 1,
The second temperature-adjusting mounting plate may have a first temperature-
A loading area on which electronic components to be tested are loaded; And
An unloading portion carrying the tested electronic component; Lt; / RTI &gt;
The shuttle machine includes:
A cooling element for cooling the loading site; And
A heating element for heating the loading and unloading portions; / RTI &gt;
The unloading portion can be heated only in accordance with the control.
Handler for testing electronic components.

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