TW201908751A - Sorting machine for testing electronic components having an environment maintaining chamber, and maintaining the environment maintaining chamber in a dry state - Google Patents

Abstract

The present invention relates to a sorting machine used for testing electronic components, and capable of supporting tests of electronic components in a low temperature environment. The sorting machine used for testing electronic components according to the present invention comprises a test support portion, which support the testing of the electronic components, and a stacking portion, which supplies a client's tray carrying electronic components to be tested and retrieves the client's tray carrying the tested electronic components. The test support portion is provided with an environment maintaining chamber, and the environment maintaining chamber is maintained in a dry state, thereby possessing a structure capable of local cooling. The sorting machine for testing electronic components according to the present invention has the follow effects: capable of improving the test reliability of the electronic components, and capable of improving the cooling efficiency and reducing the energy.

Description

Sorter for testing electronic components

The present invention relates to a sorting machine capable of supporting an electronic component such as a semiconductor component which can be tested by a tester for testing electronic components.

Electronic components such as semiconductor elements are produced in a number of processes depending on the situation. Even if each process is carried out under standardized conditions, the more electronic components that require precision work are affected by small fluctuations, so it is currently impossible to produce only good products. That is, it is impossible to avoid the occurrence of defective products. Therefore, the electronic components produced are separated into good and defective products after being tested by the tester, and only the good products are shipped.

Testing of electronic components can only be performed when the electronic components are electrically connected to the tester. At this time, the equipment for electrically connecting the socket of the tester to the electronic component is a sorting machine.

In addition, electronic components can be used in a variety of thermal environments. Therefore, it is necessary to test in the state of constructing a special temperature environment when testing electronic components. Therefore, the sorter needs to maintain the electronic components at a high temperature, a low temperature or a normal temperature state according to the required test conditions and electrically connect the electronic components to the tester. The present invention relates to a sorting machine for supporting testing in a state where an electronic component is kept at a low temperature.

Generally, the manner in which electronic components are cooled includes a chamber mode and a board mode.

The chamber method is a method of constituting a chamber capable of forming a low-temperature environment and housing the electronic components inside the chamber to cool the electronic components. This chamber mode has the disadvantage that a large amount of energy is consumed in order to keep the temperature inside the chamber having a large space low, and a long time for cooling the electronic components is required.

The board mode is a way of placing electronic components on a board cooled by a cooling fluid and cooling the electronic parts by conduction. This plate method directly cools the electronic components by conduction, so the cooling time is short, but since it is local cooling, it has the disadvantage of being exposed to condensation or icing due to the influence of the relatively high ambient air. In particular, if condensation or icing occurs in the case where the electronic component is pre-cooled before the electronic component is tested, the electrical contact between the electronic component and the tester may be poor in the test procedure, and thus due to condensation or junction Ice may damage the components that make up the sorter.

Of course, the chamber mode and the plate mode can be combined, but in the path or the like for moving the electronic component, the inside of the chamber and the outside cannot be completely blocked, so the energy consumption is inevitably large, especially, with relatively humid external air. Flowing into the chamber, it is actually difficult to ultimately prevent condensation or icing. [Previous Technical Literature] (Patent Literature)

(Patent Document 0001) Korean Laid-Open Patent Publication No. 10-2003-0023213 (Patent Document 0002) Korean Laid-Open Patent Publication No. 10-2004-0026456 (Patent Document 0003) Korean Laid-Open Patent Publication No. 10-2014-0125465

[Problem to be Solved by the Invention] An object of the present invention is to provide a technique in which a plate method is used and condensation or icing is not generated at a low temperature test.

[Technical means for solving the problem] The sorting machine for testing an electronic component according to the present invention includes: a test support portion that supports testing for an electronic component; and a stacking portion that supplies the test support portion with an electron to be tested a customer tray of the component and reclaiming a customer tray loaded with the electronic component that completes the test, the test support portion including: a loader located at a supply area for supplying the electronic component to the test area, and having an electronic component capable of adjusting the loading a first temperature adjustment loading plate for the temperature; the shuttle moves the electronic component that has passed through the first temperature adjustment loading plate to the test area, or moves the electronic component that has completed the test from the test area to the recovery area, and a second temperature adjustment loading plate having a temperature for adjusting the loaded electronic component; at least one first mover moving the electronic component to be tested from the customer tray from the stacking portion to the supply position to the first temperature Adjusting the loading plate or moving the electronic component from the first temperature adjustment loading plate to the a temperature adjustment loading plate; a connector electrically connecting the electronic component moving from the supply area to the test area by the second temperature adjustment loading plate to the tester, thereby enabling the electronic component to be tested by the tester a recovery plate located in the recovery area for recovering the completed electronic component of the unloading position of the recovery area from the test area by the second temperature adjustment loading plate; at least one second mover Moving the electronic component moved to the recovery area by the second temperature adjustment loading plate to the recovery plate; the environment maintaining chamber for maintaining the first temperature adjustment loading plate and the second temperature adjustment Loading a dry environment of the space in which the board exists, and having at least one supply aperture that provides a passage for moving a customer tray loaded with electronic components to be tested from the stack; a humidity measurement sensor, Measuring that the environment maintains a strong internal humidity; a dryer supplies dry air to the interior of the environment maintaining chamber; a cooler, Cooling the fluid to cool the first temperature adjustment loading plate and the second temperature adjustment loading plate; and controlling the dryer to adjust the drying according to information measured by the humidity measuring sensor a supply amount of air, wherein the first temperature adjustment loading plate and the second temperature adjustment loading plate are capable of respectively loading electronic components, adjusting a temperature of the loaded electronic components by conduction, and having a function of cooling a cooling path of the moving path function through which the cooling fluid supplied by the device, wherein the loader further includes: a first heater applying heat to the electronic components mounted on the first temperature adjustment loading plate; the first temperature measurement a sensor for measuring a temperature of the first temperature adjustment loading plate, wherein the shuttle further includes: a second heater applying heat to an electronic component mounted on the second temperature adjustment loading plate; a second temperature measuring sensor for measuring a temperature of the second temperature adjustment loading plate, wherein the controller is based on the first temperature measuring sensor and the Controlling, by the second temperature measuring sensor, the cooler, the first heater, and the second heater, thereby adjusting temperatures of the first temperature adjustment loading plate and the second temperature adjustment loading plate .

At least one of the cooling pipes for supplying the cooling fluid cooled by the cooler to the cooling circuit or for recovery is a double pipe through which the inner pipe and the outer pipe of the double pipe are passed Dry air is supplied between, and the cooling fluid supplied and recovered by the cooler is moved to the inner tube of the double tube.

The environment maintenance chamber has at least one opening and closing door that can be opened and closed by an operator, the opening and closing door includes: a first door that can open and close the first open area; and a second door that is openable and closable at the first door a second open area that is smaller than the first open area.

The connector includes: a pusher that presses an electronic component toward a socket side of the tester and has a fluid passage through which a cooling fluid supplied from the cooler passes; a heating element disposed at the pusher The propeller applies heat; a temperature measuring element is disposed at the propeller to measure a temperature of the propeller; a cooling tube for supplying a cooling fluid cooled by the cooler to the propeller or passing through a cooling fluid from the propeller is recovered to the cooler, wherein at least one of the cooling tubes is configured to be helical to ensure mobility of the propeller, The temperature measured by the temperature measuring element controls the cooler and the heating element to adjust the temperature of the propeller.

The loader further includes: a separating member that fixes the first temperature adjustment loading plate to be separated from the base surface by a predetermined distance; and a mask wall around the first temperature adjustment loading plate The lower end and the side end of the first temperature adjustment loading plate are disposed to be separated, thereby minimizing air around the first temperature adjustment loading plate to the electronic component mounted on the first temperature adjustment loading plate The effect of the portion of the dryer that supplies dry air is the phase separation between the loading plate and the base surface.

An injection hole is formed in the mask wall, and the injection hole sprays dry air supplied to a portion separated from the partition wall and the first temperature adjustment load plate to the surroundings.

The shuttle further includes: a substrate configured to be movable by means of a moving source; and a separating member fixing the second temperature adjustment loading plate in a manner of separating a predetermined distance from the substrate; the mask wall The periphery of the second temperature adjustment loading plate is disposed to be separated from the lower end and the side end of the second temperature adjustment loading plate, thereby minimizing air pair around the second temperature adjustment loading plate The influence of the electronic component mounted on the second temperature adjustment loading plate, wherein the portion supplied with the dry air by the dryer is a portion separated from the phase between the second temperature adjustment loading plate and the substrate.

An injection hole is formed in the mask wall, and the injection hole ejects dry air supplied to a portion between the second temperature adjustment loading plate and the substrate.

The sorting machine for testing an electronic component further includes: a shutter that opens and closes the supply hole, wherein the controller controls the shutter to open the supply hole only when the customer tray moves through the supply hole.

Dry air supplied by the dryer is supplied to at least one of the supply area and the test area, thereby generating a difference in air pressure between the test area and the recovery area, thereby preventing the presence of the recovery Air from the area enters the test area.

The second temperature adjustment loading plate includes: a loading portion, loading an electronic component to be tested; an unloading portion, loading the electronic component that completes the test, wherein the shuttle portion further includes: a cooling unit configured to cool the loading portion; a heating unit for heating the loading portion and the unloading portion, wherein the unloading portion can only be heated according to control.

[Effect of the Invention] According to the present invention, the following effects are obtained.

First, the use of the plate mode prevents external air from penetrating into the interior of the chamber, thereby preventing condensation or icing from occurring during the low temperature test, thereby improving the reliability of testing the electronic component and preventing damage to the device.

Second, the local cooling of the plates improves the cooling efficiency and minimizes the outflow of the cold air, thereby reducing energy consumption.

Third, it is possible to quickly control the heat that may be generated from the electronic components in the test program, and thus the test reliability of the electronic components can be further improved.

Preferred embodiments in accordance with the present invention are described with reference to the accompanying drawings, and for the sake of brevity of the description, the repeated or substantially identical configurations are omitted or compressed as much as possible.

1 is a perspective view of a sorting machine (hereinafter simply referred to as 'sorting machine') 100 for testing electronic components according to an embodiment of the present invention.

As shown in FIG. 1, the sorting machine 100 according to the present embodiment includes a test support unit TSP capable of supporting testing of electronic components, and a stacking unit SKP for supplying a customer tray CT to the test support unit TSP or recovering from the test support unit TSP. Customer tray CT. Here, the electronic component to be tested is loaded on the customer tray CT supplied from the stacking section SKP to the test support section TSP, and the electronic component to be tested is uploaded on the customer tray CT recovered from the test support section TSP to the stacking section SKP.

With continued reference to Fig. 2 which is a schematic plan view of the sorter 100 of Fig. 1, the detailed configuration of the sorter 100 will be carefully explained.

The test support portion TSP includes a loader 110, a shuttle 120, a first mover 130, a connector 140, a recovery board 150, a second mover 160, an environment maintenance chamber 170, a first shutter 181, and a second The shutter 182, the humidity measuring sensor SS, the dryer 190, the cooler CA, and the controller MA.

The loader 110 is located in the supply area SA for supplying electronic components to the test area TA, and is cooled by the cooling fluid supplied through the cooler CA, thereby directly cooling the loaded electronic components by conduction. That is, the sorter 100 according to the present embodiment has a structure in which the loader 110 is used to enable the test electronic component to be pre-cooled before the test. To this end, as shown in the schematic exploded perspective view of FIG. 3 and the schematic side view of FIG. 4, the loader 110 includes a first temperature adjustment loading plate 111, a first heater 112, a first temperature measurement sensor 113, and a A separating member 114 and a first mask wall 115.

The first temperature adjustment stacking plate 111 has a loading groove LS on its upper surface capable of placing and loading electronic components. Further, inside the first temperature adjustment loading plate 111, two cooling passages CW are formed starting from the front and rear end portions and ending at the intermediate portion, and the heater groove HS and the feeling are formed avoiding the cooling passage CW. Detector slot SG. To this end, the first temperature adjustment loading plate 111 may include an upper plate 111a and a lower plate 111b that are tightly coupled to each other.

The cooling fluid supplied from the cooler CA is preferably configured to flow into the cooling passage CW through the start point S of the two end portions of the first temperature adjustment loading plate 111, and then pass through the intermediate portion of the first temperature adjustment loading plate 111. At the end point E, it flows out from the cooling path CW. The reason why the cooling path CW is configured in this way is confirmed by various experiments. In one experimental example, the temperature of the cooling fluid at the lower 70 degrees of the injection start point S rises as it approaches the end point E. In this case, the intermediate portion of the first temperature adjustment loading plate 111 where the end point E is located is confirmed to be less than 65 degrees below zero due to the temperature of the surface exposed to the surrounding outside air being small. On the contrary, the periphery of both ends of the first temperature adjustment loading plate 111 where the start point S of the cooling fluid injected at minus 70 degrees was confirmed to be 65 degrees lower due to the large number of faces exposed to the surrounding outside air. Obviously, this example is a specific experimental example and may have a temperature deviation of about +/- 1 degree.

The first heater 112 is embedded in the heater tank HS and applies heat to the electronic components mounted on the first temperature adjustment loading plate 111 by surface contact. Specifically, the heat generated by the first heater 112 heats the first temperature adjustment load plate 111, and heats the electronic components mounted on the first temperature adjustment load plate 111 by conduction. This first heater 112 can be used when performing high temperature testing, and can also be used for precise temperature control during low temperature testing. Further, the first heater 112 may cause the first temperature adjustment loading plate 111 to return to normal temperature or prevent condensation when a jam occurs after the low temperature test or when the operation of the sorter 100 is terminated for the next operation. Used for icing.

The first temperature measuring sensor 113 is disposed in the sensor slot SG to measure the temperature of the first temperature adjusting loading plate 111. The controller MA controls the first heater 112, the dryer 190, and the cooler CA based on the temperature information measured by the first temperature measuring sensor 113.

The first separating member 114 is provided to separate the first temperature adjusting loading plate 111 from the base surface (bottom surface) BF of the sorting machine 100 on which the loader 110 is disposed and the bottom portion of the first mask wall 115 described below. The reason why the first separating member 114 is provided is that the cold air or the hot air of the first temperature adjusting loading plate 111 that performs local cooling or heating is discharged to the base surface BF by conduction. Therefore, the first separating member 114 needs to use a material having low thermal conductivity (such as a resin material instead of metal) and needs to be provided in a minimum amount, and the thickness thereof is also preferably minimized to the extent that the first temperature adjusting loading plate 111 can be supported. .

Further, in the sorting machine 100 according to the present invention, the phase-separated portion A between the first temperature-adjusting loading plate 111 and the base surface BF separated from each other by the first separating member 114 as described above is passed through a dryer. 190 supplies dry air. According to this, it is possible to supply the dry air intensively to the portion where the condensation or icing is most likely to occur in the presence of the dry air, so that the drying efficiency can be improved and the consumption of the dry air can be reduced. Also, dry air can be supplied as needed to provide thermal insulation.

The first mask wall 115 is provided in a substantially quadrangular frame shape so as to be spaced apart from the side end of the first temperature adjustment load plate 111 around the first temperature adjustment load plate 111. Therefore, the first mask wall 115 can block the first temperature adjustment loading plate 111 and the electronic components mounted thereon from the surrounding air by a predetermined degree, and minimize the formation of a mask film by dry air in the up and down direction. The influence of the surrounding air on the first temperature adjustment loading plate 111 and the electronic components mounted thereon. Therefore, the upper end of the first mask wall 115 is preferably higher than the first temperature adjustment loading plate 111 and the electronic component mounted thereon. Therefore, at the upper end portion of the mask wall 115, the first temperature adjustment is formed. The alternating upper and lower grooves 111a of the upper plate 111a of the loading plate 111 are alternately arranged. Obviously, in the mask wall 115, in addition to the alternating grooves 115a, a cooling passage CW that can be used to supply the cooling fluid to the first temperature adjustment loading plate 111 and a cooling pipe from which the cooling fluid is recovered can be formed. One via 115b.

Further, on the inner wall surface and the bottom surface of the first mask wall 115, a small-diameter injection hole 115c is formed, which is capable of supplying dry air to the portion A of the first temperature adjustment loading plate 111 and the base surface BF. The inside is injected toward the side of the first temperature adjustment loading plate 111. By this first mask wall 115, the surrounding humid air is further blocked from moving to the first temperature adjustment loading plate 111 or the electronic component mounted thereon, so that dew condensation or icing can be further prevented. Preferably, the injection hole 115c and a portion of the dry air that is ejected through the injection hole 115c are on the lower side of the uppermost end surface of the first temperature adjustment loading plate 111, so that it is necessary to prevent the first mover 130 from being grasped or released. The possibility that the defective electronic components are loaded or detached.

Further, it is understood that the inner wall surface of the side portion of the first mask wall 115 is separated from the side end of the first temperature adjustment loading plate 111, and the bottom surface of the first mask wall 115 and the first temperature adjustment loading plate 111 are The lower ends are separated from each other. This configuration prevents cold air or hot air of the first temperature adjustment loading plate 111 from being discharged through the first mask wall 115, and simultaneously forms the above-described injection holes 115c to supply dry air to the periphery of the first temperature adjustment load plate 111.

The shuttle 120 moves the electronic component that has passed through the loader to the test area TA or moves the electronic component that has completed the test from the test area TA to the recovery area RA. To this end, as shown in FIG. 5, the shuttle 120 has a second temperature adjustment loading plate 121, a second heater 122, a second temperature measurement sensor 123, a second separation member 124, a second mask wall 125, The substrate 126, the cooling pipe 127 having a special structure, and the moving source 128.

The second temperature adjustment loading plate 121 can be loaded with an electronic component, such as Korean Patent Publication No. 10-2014-0125465 (hereinafter referred to as 'prior art'), and can be classified into a loading portion (named 'loading container' in the prior art) 121a. And the unloading site (named 'Unloading Container' in the prior art) 121b. The loading portion 121a is a portion on which an electronic component to be tested is loaded, and the unloading portion 121b is a portion on which an electronic component that has been tested is loaded. As in the prior art, the second temperature adjustment loading plate 121 can be moved by the movement source 128. At this time, the loading portion 121a moves between the loading position LP and the test position TP, and the unloading portion 121b is at the test position TP and the unloading position UP. Move between. Obviously, depending on the configuration, it is possible to sufficiently consider the configuration in which only one loading portion is provided without dividing the loading portion 121a and the unloading portion 121b, and the movement portion of the loading portion is expanded to the loading position LP, the test position TP, and the unloading position. The second temperature adjustment load plate 121 is also formed with a cooling passage, a heater tank, and a sensor tank through which the cooling fluid passes, and functions as a cooling passage CW and a heater tank HS of the first temperature adjustment load plate 111. Since the sensor slot SG is the same, the description is omitted.

Moreover, the functions of the second heater 122, the second temperature measuring sensor 123, the second separating member 124, and the second mask wall 125 are also the same as the first heater 112 of the first temperature adjustment loading plate 111, the first The temperature measuring sensor 113, the first separating member 114, and the first mask wall 115 are the same, and thus detailed description thereof will be omitted.

The substrate 126 is provided in a manner that can be moved by the movement source 128. Further, the second temperature adjustment loading plate 121 is disposed to be separated from the substrate 126 by the second separating member 124, so that the second temperature adjustment loading plate 121 is also moved by the action of the moving source 128, and the dry air is dried. It is supplied to the portion B separated from each other between the second temperature adjustment loading plate 121 and the substrate 126.

For reference, it is also conceivable that the above-described loader 110 is equipped with a first temperature adjustment loading plate 111 that is movable like the shuttle portion 120. Further, depending on the implementation, the loader 110 also needs to load more electronic components or rapidly cool the electronic components at normal temperature. Therefore, as shown in FIG. 6, the cooling path CQ of the first temperature adjustment loading plate 111A can be formed to have a ratio. The number of cooling paths of the second temperature adjustment loading plate 121 is larger. Therefore, unlike the example of FIG. 3, the positions of the start point S and the end point E may be set to the left and right of the first temperature adjustment loading plate 111A. The sides are arranged separately.

The cooling pipe 127 is provided in order to supply the cooling fluid supplied from the cooler CA to the second temperature adjustment loading plate 121 or to recover the cooling fluid from the second temperature adjustment loading plate 121. As shown in Fig. 7, such a cooling pipe is preferably constituted by a double pipe having an outer pipe 127a and an inner pipe 127a located inside the outer pipe 127a. The inner pipe 172b that internally moves the cooling fluid having a low temperature may cause condensation or ice formation on the outer surface. Further, due to such dew condensation or icing, the inner pipe 127b bent when the second temperature adjustment loading plate 121 moves may be damaged. Therefore, the outer pipe 127a is provided, and the inner pipe 127b is protected from direct exposure to the outside. Here, it is more preferable to consider that the inner pipe 127b is constituted by a spiral pipe like the cooling pipe of the connector 140 to be described later. Further, it is preferable to supply the dry air from the dryer 190 to the space S between the inner pipe 127b and the outer pipe 127a. Due to such a configuration, damage of the cooling pipe 127 due to frequent movement of the second temperature adjustment loading plate 121 can be minimized. Obviously, if the first temperature adjustment loading plate 111 of the loader 110 is also movably equipped, the cooling pipe provided to the loader 110 is also preferably constituted by a double pipe.

The first mover 130 moves the electronic component to be tested from the customer tray CT that has come from the stacking portion SKP to the supply position SP to the first temperature adjustment load plate 111, or moves the electronic component from the first temperature adjustment load plate 111. It is to the loading portion 121a of the second temperature adjustment loading plate 121. Obviously, depending on the implementation, a plurality of first movers 130 may be provided, and the functions of moving the electronic components from the customer tray CT to the first temperature adjustment load plate 111 and moving from the first temperature adjustment load plate 111 to the first The function of the temperature adjustment loading plate 121.

The connector 140 adsorbs the electronic component of the loading portion 121a at the test position TP by vacuum pressing, and then electrically connects the grasped electronic component to the test socket TS of the tester, and moves the electronic component that has completed the test to the unloading site. 121b. Here, the electrical connection of the electronic component to the test socket TS is carried out by means of pressurizing the electronic component to the test socket TS. To this end, as shown in FIG. 8 and FIG. 9 which is cut and partially expanded, the connector 140 includes a head 141, eight pushers 142, a heating element HD, a first temperature measuring element TD ₁ , and a second temperature measuring element TD _{2 .} Cooling tube 143, vertical mover 144 and horizontal mover 145.

The head 141 is equipped in such a manner as to be movable up and down by means of the vertical mover 144. Such a head 141 has a channel structure or valve structure that provides vacuum pressure for the eight thrusters 142. It is apparent that a separate tube structure can be utilized to provide vacuum pressure to the pusher 142.

Eight thrusters 142 are provided for pressurizing electronic components, respectively. Therefore, 8 electronic components can be electrically connected to the tester at one time. Obviously, the number of pushers 412 can vary depending on the implementation of the equipment. The pusher 142 has a 'T' shape in cross section and is divided into an upper joint portion 142a and a lower contact portion 142b.

The joint portion 142a is coupled to the head portion 141. A guide hole GH is formed in this joint portion 142a, and a guide pin (not shown) for accurately guiding the position of the pusher 142 is inserted into the guide hole GH.

The contact portion 142b is a portion having a width smaller than the joint portion 142a, and the contact end CE as the lower end surface thereof is in contact with the electronic component to pressurize the electronic component, or the electronic component is gripped by vacuum pressure from the vacuum path VW.

The purpose of forming the vacuum path VW is to apply a vacuum pressure to the electronic component in order to adsorb and hold the electronic component. Here, the vacuum pressure may be realized by being supplied from the outside, or may be realized by the sorter 100 being equipped with a regulator that generates a vacuum pressure to be supplied from the regulator.

Further, a fluid passage TW through which the cooling fluid supplied from the cooler CA passes is formed in the pusher 142.

The fluid passage TW is formed such that the cooling fluid that has flowed in through the inlet IH at the joint portion 142a moves to the contact portion 142b and then flows out through the outlet located at the joint portion 142a. Therefore, the cooling fluid reaching the pusher 142 from the cooler CA is discharged from the pusher 142 through the fluid passage TW.

The heating element HD is provided for the purpose of heating the pusher 142 to finally heat the electronic component pressurized by the pusher 142. Like the first heater 112 and the second heater 122, such a heating element HD can be used for heating for high temperature testing, heating for cooling or cooling of electronic components for temperature fine adjustment, heating to normal temperature, and the like.

The first temperature measuring element TD _{1 is provided} for measuring the temperature of the pusher 142, and the second temperature measuring element TD _{2 is provided} for directly measuring the temperature of the electronic component. Therefore, the second temperature measuring file TD ₂ is preferably provided on the contact end CE side of the contact portion 142b to be in contact with the electronic component.

As shown, the above-described heating element HD, TD ₁ a first temperature measuring element and the second temperature measuring element disposed in the TD ₂ pusher 142.

The cooling pipe 143 is provided in order to supply the cooling fluid cooled by the cooler CA to the propeller 142 or to recover the cooling fluid discharged from the propeller 142 through the fluid passage TW to the cooler CA. Such a cooling pipe 143 is provided in a spiral shape in order to ensure the mobility of the pusher 142 that moves in the horizontal direction and the vertical direction according to their installation positions, so as to have a soft bending due to elastic deformability and restorability.

The vertical mover 144 raises and lowers the head 141 (refer to arrow a). Therefore, the head provided with the pusher 142 can be lowered or raised, and when descending, the pusher 142 is at a position where the electronic component can be gripped or a position where the electronic component is pressed toward the test socket TS side.

The horizontal mover 145 moves the head 141 in the horizontal direction (refer to arrow b).

That is, after the head portion 141 provided with the pusher 142 is gripped by the loading portion 121a of the second temperature adjustment loading plate 121 by the operation of the vertical mover 144 and the horizontal mover 145, the electronic component to be gripped It is electrically connected to the test socket TS, and the electronic component that has completed the test can be moved to the unloading portion 121b of the second temperature adjustment loading plate 121.

The recovery plate 150 is located in the recovery area RA for recycling the electronic components that have completed the test, and is provided with the recovery plate 150 for recycling the unloading position UP from the test area TA to the recovery area RA by means of the second temperature adjustment loading plate 121 The electronic components that complete the test. Therefore, the recovery plate 150 is also formed into a structure capable of loading electronic components, and simply, the customer tray CT can replace the function of the recovery plate 150. In the case where the customer tray CT is used instead of the recovery plate 150, the second temperature adjustment loading plate 121 as described above may be configured to be moved to the recovery position RP by a separate mover.

The second mover 160 moves the electronic component from the test area TA to the unloading portion 121b of the unloading position UP of the recovery area RA by the movement of the second temperature adjustment loading plate 121 to the recovery plate 150, or is placed on the recovery plate 150. The electronic components are moved to the customer tray CT located in front of the recycling position RP. Obviously, in the case where the recovery plate 150 is constituted by the customer tray CT and the structure in which the customer tray CT can be moved to the front recovery position RP by means of a separate mover, the second mover 160 has only the electronic component from the second The function of the temperature adjustment loading plate 121 to move to the recovery plate 150 may be sufficient.

The environment maintaining chamber 170 isolates the corresponding configuration from the outside air in order to maintain the dry environment of the space in which the first temperature adjustment loading plate 111, the second temperature adjustment loading plate 121, the pusher 142, and the test socket TS are located. In the present embodiment, at least the head portion 141 and the thruster of the first temperature adjustment load plate 111, the second temperature adjustment load plate 121, the first mover 130, and the connector 140 are housed inside the environment maintenance chamber 170. 142. The recovery board 150, the second mover 160, and the test socket TS. However, the environment maintaining chamber 170 in the present invention is not provided for cooling the space inside thereof, but is provided in order to provide an internal dry space, which is largely different from the prior art. This environment maintaining chamber 170 has an opening and closing door 171, a supply hole SH, and a recovery hole RH.

The opening and closing door 171 is provided to maintain the inside of the chamber 170 by the operator's opening and closing environment, and is equipped as a double door.

The first door 171a can open and close a larger first open area.

The second door 171b is disposed near the center of the first door 171a, and can open and close the second open area smaller than the first open area.

That is, in the case where manual work is required inside the environment maintenance chamber 170 due to clogging or the like, the worker can selectively open the first door 171a according to the degree of the corresponding manual work, or the opening can only extend into the operator. The second door 171b of the size of the arm. At this time, in the case where only the second door 171b is opened, the worker needs to visually confirm the inside of the environment maintenance chamber 170, and therefore it is necessary to form a space from the frame of the first door 171a to the second door 171b by using a transparent panel such as glass. part. Further, in the case where the second door 171b is opened, in order to minimize the cold air loss of the chamber 170, it is possible to constitute a separate air curtain capable of forming an air film, or to block or form a high density with a filament as in the brush form. Other blocking components are provided to allow the arm to enter but to minimize the outflow of cold air.

For reference, the opening and closing door 171 is preferably provided in a required number in a desired position.

The supply hole SH provides a passage capable of moving the customer tray CT located at the stacking portion SKP to the supply position SP.

The recovery hole RH provides a passage that enables the customer tray CT located at the recovery position RP to be moved to the stacking portion SKP.

Obviously, depending on the capacity of the sorter 100 or the configuration of other embodiments, the supply holes SH or the recovery holes RH may be formed in an appropriate amount.

For reference, even if the environment maintaining chamber 170 is provided, as in the present embodiment, a test chamber TC for forming a separate test chamber in the test area TA may be provided. Also, it may be preferable to separate the supply region SA and the recovery region RA by means of a separate blocking membrane.

The first shutter 181 opens and closes the supply hole SH.

The second shutter 182 opens and closes the recovery hole RH.

Similarly, in addition to the first shutter 181 and the second shutter 182, a unit for forming a separate air curtain when opening the supply hole SH and the recovery hole RH may be provided.

It is apparent that the first shutter 181 and the second shutter 182 described above are provided in an amount corresponding to the number of the supply holes SH and the recovery holes RH.

The humidity measurement sensor SS is used to measure the humidity inside the environment maintenance chamber 170, and is especially equipped for measuring the humidity of the supply area SA and the test area TA which are required to accurately adjust the dryness to prevent condensation or icing from occurring. In particular, the humidity of the space in which the first temperature adjustment loading plate 111 and the second temperature adjustment loading plate 121 are located is important, and therefore the humidity measurement sensor SS is preferably provided to the first temperature adjustment loading plate 111 and the second temperature adjustment. Use the vicinity of the loading plate 121. Here, the humidity measuring sensor SS provided in the second temperature adjustment loading plate 121 is preferably provided so as to be movable together with the second temperature adjustment loading plate 121.

The dryer 190 is equipped to supply dry air to the interior of the environment maintaining chamber 170. Such a dryer 190 may be configured to move the dry air from the external supply to the inside of the environment maintaining chamber 170. As in the present embodiment, the sorting machine 100 itself may be configured to generate dry air. Here, the supply portion of the dry air supplied to the inside of the environment maintaining chamber 170 by means of the dryer 190 is preferably located in the supply area SA and the test area TA. As described above, in the present invention, it is understood that the dry air supplied by the dryer 190 is supplied through the loader 110 located in the supply area SA and at least a part of the shuttle portion 120 always located in the test area TA. Moreover, the sorting machine 100 according to the present invention supplies dry air to a fixed portion C of the test area TA most sensitive to the test conditions through a separate spray nozzle, and for its efficiency, constitutes a separate test chamber TC. Therefore, the test area TA becomes a high pressure compared to the adjacent recovery area RA, so that the humid air of the recovery area RA can be prevented from entering the test area TA by the difference in air pressure between the two areas.

Further explanation is given for the reason that it is necessary to equip the dryer 190 as described above. In general, the condensation phenomenon occurs due to a decrease in the temperature of the atmosphere and a decrease in the amount of saturated water vapor in the atmosphere. In particular, condensation formed under sub-zero temperature conditions freezes to cause icing. However, for a sorter capable of performing low-temperature testing, it is necessary to rapidly cool the electronic component to an extremely low temperature of minus 10 degrees or less, so that the temperature of other structures is also maintained at a very low state. In the state as described above, the atmospheric temperature in the vicinity of the structure also decreases, resulting in a very low saturated steam amount. For example, the saturated water vapor amount in the normal temperature atmosphere is 22.830 g/m ³ , but the saturated steam amount of the atmosphere at minus 10 degrees is 2.156/m ³ . Therefore, condensation and icing of water vapor are generated on the surface of an electronic component or a structure, etc., and it may become a state in which the device cannot be driven, or cause serious damage to the device. Therefore, the present invention has been achieved through continuous experimentation and research.

The cooler CA supplies the cooling fluid to the first temperature adjustment load plate 111, the second temperature adjustment load plate 121, and the pusher 142. Similarly, the cooling module of the cooler CA is provided to the sorter 100 itself, or may be separately equipped in the factory system depending on the implementation. If the cooling module is separately provided with the sorter 100, the concept of the cooler CA equipped in the sorter 100 can be interpreted as moving the cooling fluid from the external cooling module to the cooling flow path at the desired position.

The controller MA controls the configuration of the above-described configuration that requires control. In particular, the controller MA controls the dryer 190 based on the humidity information measured by the humidity measuring sensor SS, thereby adjusting the supply amount of the dry air, and controls the first shutter to maintain the cold air loss inside the chamber 170 in order to minimize the environment. The 181 and the second shutter 182 open the supply hole SH or the recovery hole RH only when the customer tray CT moves through the supply hole SH or the recovery hole RH. Further, the controller MA adjusts the degree of cooling or the degree of heating based on the temperature information of the loading portion 121a of the first temperature adjustment loading plate 111, the second temperature adjustment loading plate 121, the pusher 142, and the electronic component.

In addition, the stacking section SKP includes a supply stacker PS for supplying the customer tray CT to the supply location SP and a recycling stacker RS for recycling the customer tray CT from the recovery location RP.

The sorting machine 100 having the above configuration will be described.

The customer trays CT located at the supply stacker PS are sequentially supplied to the supply position SP one at a time. At this time, in the procedure of moving the customer tray CT, the first shutter 181 opens the supply hole SH, and if the customer tray CT enters the inside of the environment maintenance chamber 170, the supply hole SH is closed.

The first mover 130 moves the electronic component from the customer tray CT of the supply position SP to the first temperature adjustment load plate 111. Therefore, the electronic component mounted on the first temperature adjustment load plate 111 is brought into contact with the first temperature adjustment load plate 111 in a state of being cooled by the cooler CA, and is cooled.

If the electronic component is mounted on the first temperature adjustment loading plate 111, the first mover 130 moves the pre-cooled electronic component from the first temperature adjustment loading plate 111 to the second temperature adjustment loading plate at the loading position LP. The loading portion 121a of 121. When the electronic component is loaded to the loading portion 121a, the second temperature adjustment loading plate 121 is moved to the right side by the movement source 128, so that the loading portion 121a of the second temperature adjustment loading plate 121 will be located at the test position TP. Then, the connector 140 operates to grasp the electronic component by the vacuum pressure from the loading portion 121a by the pusher 142, and then electrically connect the electronic components grasped by the pusher 142 by the actions of the vertical mover 144 and the horizontal mover 145. Test socket TS. It is apparent that the loading portion 121a and the pusher 142 are cooled by the cooler CA to a temperature that meets the test conditions, so that in this moving procedure, the electronic components do not escape the temperature meeting the test conditions. Also, in the test procedure, heat may be generated in the electronic component, but the controller MA controls the cooler CA to maintain the electronic component at the required temperature condition.

If the test of the electronic component is completed, the connector 140 moves the electronic component to the unloading position 121b of the second temperature adjustment loading plate 121 at the test position TP. At this time, the loading portion 121a of the second temperature adjustment loading plate 121 is located at the loading position LP, so the electronic component tested in the next step is loaded to the loading portion 121a. If the electronic component that has been tested is loaded on the unloading portion 121b, the second temperature adjustment loading plate 121 moves to the right side to move the unloading portion 121b toward the unloading position UP, and the second mover 160 moves the electronic component from the unloading portion 121b. To the recovery board 150. Further, the electronic component located on the recovery board 150 is moved to the customer tray CT located at the front recovery position RP by the second mover 160. At this point, the electronic components that complete the test can be moved in a graded manner based on the test results. Next, if the electronic component fills the customer tray CT at the recovery position RP, the second shutter 182 operates to open the recovery hole RH, and the customer tray CT moves from the recovery position RP to the recovery stacker RS.

In addition, in the procedure of performing the test while continuously performing the movement and testing of the electronic component as described above, the humidity sensor SS continuously measures the inside of the environment maintenance chamber 170 at a predetermined time interval (more specifically, the first of the supply region) The humidity in the vicinity of the temperature adjustment load plate and in the vicinity of the second temperature adjustment load plate of the test area, and the controller MA adjusts the amount of dry air based on the corresponding information, and supplies the dry air to the above portion. It will be apparent that the interior of the environment maintenance chamber 170 can maintain the required dryness due to the supply of dry air.

Further, the environment in which the dry air is continuously supplied by the dryer 190 maintains the inside of the chamber 170 continuously maintaining the high pressure as compared with the outside. Therefore, the internal air of the environment maintenance chamber 170 flows out through the supply hole SH, the recovery hole RH, or other portions where the closed portion cannot be realized, which can function to block the flow of the outside air into the inside.

Further, most of the dry air is injected into the supply area SA and the test area TA, so the supply area SA and the test area TA side which need to be accurately adjusted in dryness are high in pressure compared to the recovery area RA side. Therefore, in the case where the supply region SA and the recovery region RA are blocked by the blocking film, the air mainly moves from the supply region SA and the test region TA to the recovery region RA which does not require a higher degree of dryness due to the difference in air pressure, Therefore, it is possible to prevent the air of the recovery area RA from affecting the air of the supply area SA, and this becomes a reason why the dryness of the supply area SA can be accurately controlled.

Further, the dryer 190 supplies dry air between the outer pipe 122a and the inner pipe 122b of the cooling pipe 122 equipped with the double pipe, thereby preventing the above-described damage of the cooling pipe 122.

[Modification]

In the above embodiment, the second temperature adjustment loading plate 121 formed in the shuttle unit 120 is divided into a loading portion 121a and an unloading portion 121b, and is provided by the second heater 122 as a heating element and as a cooling element. The piping 127 is cooled to heat or cool all of the loading portion 121a and the unloading portion 121b.

However, as shown in FIG. 10, the shuttle 120 can be deformed and equipped.

Referring to Fig. 10, the second heater 122 is provided to heat both the loading portion 121a and the unloading portion 121b, but the cooling pipe 127 is disposed to cool only the loading portion 121a. Therefore, the loading portion 121a can be heated or cooled by the second heater 122 and the cooling pipe 127, but the unloading portion 121b may be heated only by the second heater 122. Hereinafter, the reason for realizing such a modification will be described.

Generally, the types of testing of electronic components include high temperature testing, normal temperature testing, and low temperature testing.

In the high temperature test, it is necessary to test the electronic component while maintaining the high temperature. In the low temperature test, it is necessary to test the electronic component while maintaining the low temperature. Further, in the room temperature test, the test was performed while the electronic component was maintained at a normal temperature. Therefore, the second heater 122 and the cooling pipe 127 are used only for the high temperature test or the low temperature test except for the special case.

In most cases, the electronic components that complete the test are unloaded by means of a pickup. At this time, in order to perform an appropriate unloading operation in which the pickup or the electronic component does not cause damage, it is necessary to cool the high-temperature electronic component and heat the low-temperature electronic component.

First, for the low temperature test, the loading portion 121a must be cooled, and for precise temperature control, the loading portion 121a needs to be able to be heated by the second heater 122. Also, the unloading portion 121b can be heated by the second heater 122, so that the temperature of the loaded electronic component can be increased.

If the electronic component mounted on the unloading portion 121b is not heated to near normal temperature, frost is generated to cause an obstacle to the pickup operation of the pickup accompanying the operation of the second mover 160, or a problem such as a pickup mark may occur.

Therefore, at the time of the low temperature test, both the cooling and the heating of the loading portion 121a are required, but it is only necessary to heat the unloading portion 121b.

In addition, for high temperature testing, the loading site 121a needs to be heated, and occasionally needs to be cooled for precise temperature control. However, depending on the device, the degree of high temperature can be expressed as a relatively low temperature (100 degrees +/- 50 degrees), and in this case, there is no need to cool the electronic components for the unloading operation.

Therefore, at the time of the high temperature test, both heating and cooling of the loading portion 121a are required, but cooling of the unloading portion 121b is not required depending on the device.

That is, in the case where the apparatus is configured to perform the low temperature test and the high temperature test, the loading portion 121a requires both cooling and heating. However, depending on the device, the unloading portion 121b requires heating only during the cooling test without cooling, and thus may not have a separate cooling element for cooling the unloading portion 121b. In this case, the unloading portion 121b can only be heated according to the control of the test mode.

The sorting machine according to the above embodiment adopts a simple configuration for clarity of explanation, but according to the processing capacity, the loader 110, the shuttle 120, the first mover 130, the recovery plate 150, the second mover 160, and the supply hole SH And the recovery hole RH can be equipped with multiple.

Further, in the above embodiment, the loading portion 121a and the unloading portion 121b are disposed in different regions in a second temperature adjustment loading plate 121, and move together, but depending on the implementation, the loading portion 121a and the unloading portion 121b may also be configured as an arrangement. Moving independently on a separate board with a separate source of movement. In other words, the second temperature adjustment loading plate may be two, one second temperature adjustment loading plate has a loading portion 121a, and the other second temperature adjustment loading plate has an unloading portion 121b.

That is, the above-described embodiments are only the most basic examples of the present invention, and thus the present invention should not be construed as being limited to the above-described embodiments, and the scope of the invention should be construed as the scope of the claims and the equivalents thereof.

100‧‧‧ sorting machine for testing electronic components

TSP‧‧‧ Test Support Department

SKP‧‧‧Stacking Department

110‧‧‧Loader

111‧‧‧First temperature adjustment loading plate

112‧‧‧First heater

113‧‧‧First temperature measurement sensor

114‧‧‧First separation piece

115‧‧‧Mask wall

115c‧‧‧spray hole

120‧‧‧ Shuttle

121‧‧‧Second temperature adjustment loading plate

122‧‧‧second heater

123‧‧‧Second temperature measurement sensor

124‧‧‧Second separation piece

125‧‧‧Mask wall

126‧‧‧Substrate

127‧‧‧Cooling piping

127a‧‧‧Outer piping

127b‧‧‧Outer piping

130‧‧‧First mover

140‧‧‧Connector

142‧‧‧ Pusher

TW‧‧‧ fluid pathway

143‧‧‧ Cooling tube

HD‧‧‧ heating element

TD ₁ ‧‧‧First temperature measuring component

TD ₂ ‧‧‧Second temperature measuring component

150‧‧‧Recycling board

160‧‧‧Second mover

170‧‧‧Environmental maintenance chamber

171‧‧‧Open and close the door

171a‧‧‧The first door

171b‧‧‧second door

SH‧‧‧ supply hole

SS‧‧‧Humidity Measurement Sensor

181‧‧‧First switch

190‧‧‧Dryer

CA‧‧‧ cooler

MA‧‧‧ controller

SP‧‧‧ supply location

RH‧‧‧Recovery hole

1 is a schematic perspective view of a sorter for testing electronic components in accordance with an embodiment of the present invention. 2 is a schematic plan view of the sorter of FIG. 1 for testing electronic components. 3 is a schematic cutaway perspective view of a stacker applied to the sorter of FIG. 1. 4 is a schematic side view of the loader of FIG. 3. Figure 5 is a schematic cutaway view of a shuttle applied to the sorter of Figure 1. Fig. 6 is another example of a stacker that can be applied to the sorter of Fig. 1. Fig. 7 is a cut-away view of a cooling pipe applied to the shuttle of Fig. 5; Figure 8 is a schematic cutaway view of a connected machine applied to the sorter of Figure 2. Figure 9 is a schematic cutaway perspective view of a pusher applied to the connector of Figure 8. Fig. 10 is a schematic cross-sectional view showing a modification applied to the shuttle portion of Fig. 5.

Domestic deposit information (please note according to the order of the depository, date, number)

Foreign deposit information (please note in the order of country, organization, date, number)

Claims (11)

A sorting machine for testing electronic components, comprising: a test support portion that supports testing of electronic components; a stacking portion that supplies a test tray with a customer tray loaded with electronic components to be tested and recovers electronic loaded with the completed test a customer tray of the component, the test support portion including: a loader, a supply region for supplying the electronic component to the test area, and a first temperature adjustment loading plate capable of adjusting the temperature of the loaded electronic component; the shuttle Moving the electronic component that has passed through the first temperature adjustment loading plate to the test area, or moving the electronic component that has completed the test from the test area to the recovery area, and having a second temperature that adjusts the temperature of the loaded electronic component An adjustment loading plate; at least one first mover moving the electronic component to be tested from the customer tray from the stacking portion to the supply position to the first temperature adjustment loading plate, or causing the electronic component to be The first temperature adjustment loading plate is moved to the second temperature adjustment loading plate; the connector, The electronic component moved from the supply area to the test area by the second temperature adjustment loading plate is electrically connected to the tester, thereby enabling the electronic component to be tested by the tester; the recovery plate is located in the recovery area, And an electronic component for recovering the test from the test area to the unloading position of the recovery area by means of the second temperature adjustment loading plate; at least one second mover, by means of the second temperature adjustment loading plate Moving the electronic component to the recovery area to the recovery plate; the environment maintaining chamber for maintaining a dry environment of the space in which the first temperature adjustment loading plate and the second temperature adjustment loading plate exist, and having At least one supply aperture, the at least one supply aperture providing a channel for moving a customer tray loaded with electronic components to be tested from the stack; a humidity measurement sensor that measures the humidity within the environment to maintain a strong interior; drying Cooling air is supplied to the interior of the environment maintaining chamber; a cooler supplies cooling fluid to cool the first temperature Using a loading plate and the second temperature adjustment loading plate; a controller that controls the dryer to adjust a supply of dry air according to information measured by the humidity measuring sensor, wherein the first temperature The adjustment loading plate and the second temperature adjustment loading plate are capable of respectively loading electronic components, adjusting the temperature of the loaded electronic components by conduction, and having a function of a moving path through which the cooling fluid supplied by the cooler passes a cooling circuit, wherein the loader further includes: a first heater applying heat to an electronic component mounted on the first temperature adjustment loading plate; a first temperature measuring sensor for measuring the first The temperature of the temperature adjustment loading plate, wherein the shuttle further comprises: a second heater applying heat to the electronic component loaded on the second temperature adjustment loading plate; and a second temperature measurement sensor for measuring a temperature of the second temperature adjustment loading plate, wherein the controller is based on information measured by the first temperature measurement sensor and the second temperature measurement sensor The cooling system, a first heater and a second heater to adjust the temperature of the first temperature control with adjustment of the loading plate and the second loading plate temperature. A sorting machine for testing an electronic component according to claim 1, wherein at least one of the cooling pipes for supplying the cooling fluid cooled by the cooler to the cooling circuit or the cooling pipe for recovery is a double pipe The dryer supplies dry air between the inner tube and the outer tube of the double tube, and the cooling fluid supplied and recovered by the cooler moves to the inner tube of the double tube. The sorting machine for testing an electronic component according to claim 1, wherein the environment maintaining chamber has at least one opening and closing door that can be opened and closed by an operator, the opening and closing door comprising: a first door capable of opening and closing the first opening The second door is disposed on the first door to open and close the second open area smaller than the first open area. A sorting machine for testing an electronic component according to claim 1, wherein the connector comprises: a pusher that pressurizes the electronic component toward a socket side of the tester and has a cooling fluid supplied from the cooler a fluid passage; a heating element disposed to the propeller to apply heat to the propeller; a temperature measuring element disposed to the propeller to measure a temperature of the propeller; a cooling tube for being cooled by the Cooling fluid supplied to the propeller or to a cooling fluid exiting the propeller through the fluid passage to the cooler, wherein at least one of the cooling tubes is provided with a spiral To ensure the mobility of the thruster, the controller controls the cooler and the heating element to adjust the temperature of the thruster based on the temperature measured by the temperature measuring component. A sorting machine for testing an electronic component according to claim 1, wherein the loader further comprises: a separating member that fixes the first temperature adjustment loading plate to be separated from the base surface by a predetermined distance; and a mask wall, Provided around the first temperature adjustment loading plate so as to be separated from the lower end and the side end of the first temperature adjustment loading plate, thereby minimizing the periphery of the first temperature adjustment loading plate The effect of air on the electronic components mounted on the first temperature-adjusting loading plate, the portion where the dry air is supplied by the dryer is a portion separated from the phase between the loading plate and the base surface. A sorting machine for testing an electronic component according to claim 5, wherein an ejection hole is formed in the mask wall, the ejection hole being made between the mask wall and the first temperature adjustment loading plate The partially separated portion of the supplied dry air is sprayed around. The sorting machine for testing an electronic component of claim 1, wherein the shuttle further comprises: a substrate configured to be movable by means of a moving source; and a separating member to take the second temperature adjusting loading plate The substrate is fixed in such a manner as to be separated by a predetermined pitch; the mask wall is disposed around the second temperature adjustment loading plate so as to be separated from the lower end and the side end of the second temperature adjustment loading plate, thereby Minimizing the influence of the air around the second temperature adjustment loading plate on the electronic components mounted on the second temperature adjustment loading plate, wherein the portion supplied with the dry air by the dryer is the second temperature A portion for phase separation between the loading plate and the substrate is adjusted. A sorting machine for testing an electronic component according to claim 7, wherein the mask wall is formed with an ejection hole that separates the second temperature adjustment loading plate from the substrate Part of the supplied dry air is sprayed around. The sorting machine for testing an electronic component of claim 1, further comprising: a shutter that opens and closes the supply hole, wherein the controller controls the shutter to open only when the customer tray moves through the supply hole The supply hole. A sorting machine for testing an electronic component according to claim 1, wherein dry air supplied from said dryer is supplied to at least one of said supply area and said test area, thereby said test area and said A difference in air pressure is generated between the recovery zones, thereby preventing air present in the recovery zone from entering the test zone. A sorting machine for testing an electronic component according to claim 1, wherein the second temperature adjustment loading plate comprises: a loading portion that loads an electronic component to be tested; an unloading portion, and an electronic component that is loaded with the test, wherein The shuttle further includes: a cooling unit for cooling the loading portion; and a heating unit for heating the loading portion and the unloading portion, wherein the unloading portion can only be heated according to the control.