TWI721343B - Handler for electronic component test - Google Patents

Abstract

The present invention relates to a sorting machine for testing electronic components. The sorting machine for testing electronic components according to the present invention includes: a pressurizer for pressurizing electronic components; Between the pushing parts of the sensor, the contact cap of the contact plate is equipped with a temperature measuring device, and the temperature adjustment part is controlled to adjust the temperature of the electronic component through the temperature information obtained by the temperature measuring device. According to the present invention, the stability of the temperature measuring device can be ensured and the temperature of the electronic components can be accurately measured, and the bad contact between the pusher and the contact cap can be grasped, so as to prevent bad tests and further improve the reliability of the test and equipment.

Description

Sorting machine for electronic component testing

The present invention relates to a sorting machine for testing and producing electronic components, and in particular to a pressurizing part that pressurizes electronic components and temperature adjustment of electronic components.

The sorting machine is a device that supports manufacturing of electronic components that can be tested by a testing machine and classifies the electronic components according to the test results.

The sorting machine has been disclosed in multiple patent documents such as Korean Patent Publication No. 10-2002-0053406 (hereinafter referred to as "Prior Art 1") and Japanese Patent Publication No. 2011-247908 (hereinafter referred to as "Prior Art 2").

Fig. 1 is a schematic diagram of a conventional sorting machine TH.

The existing sorting machine TH includes a supply part SP, a pressurizing part PP, and a recovery part WP.

The supply part SP supplies the electronic components loaded on a customer tray to the pressurizing part PP.

The pressurizing part PP pressurizes the electronic components supplied from the supply part SP toward the socket board (Socket board) SB side connected to the main body of a tester, and electrically connects the electronic components to a tester (Tester). Here, the socket board SB is equipped with a plurality of test sockets (Test Socket) TS electrically connected to the electronic components.

The recycling part WP collects the electronic components that have been tested from the pressurizing part PP, and then sorts them based on the test results and loads them on an empty customer tray.

As mentioned above, the supply part SP, the pressurization part PP, and the recovery part WP can have various forms and structures according to the purpose of use of the sorting machine TH.

The present invention relates to the pressurizing part PP and the temperature adjustment function in the aforementioned configuration.

As shown in the schematic diagram of FIG. 2, the pressurizing part PP includes a pressurizer 210' (referred to as "Index head" in prior art 1 and "compression device" in prior art 1), Vertical mover 220' and horizontal mover 230'.

The presser 210 ′ has a pusher 212 ′ for pressurizing each electronic component toward the corresponding test socket TS (referred to as “inspection socket” in prior art 2).

As shown in FIG. 3, the pushing member 212' presses the electronic component D through the lower surface of the pressing part PR. In addition, the pushing member 212 ′ passes through the lower surface of the pressing part PR to suck and grasp the electronic component D by vacuum pressure. For this reason, a vacuum path VW capable of applying vacuum pressure is formed in the pusher 212'. This pushing member 212' is equipped with a temperature sensor 212'c for sensing the temperature of the pushing member 212' itself. The temperature sensor 212'c can indirectly sense the temperature of the electronic component pressurized by the pushing member 212'.

The presser 210' is lowered while gripping the electronic component, so that the electronic component is electrically connected to the test slot TS on the socket board SB. For this reason, the pressurizer 210' is configured to be capable of horizontal movement back and forth and vertical movement up and down.

The vertical mover 220' moves the presser 210' up and down to move the presser 210' forward or backward to the socket board SB side. When the electronic component is gripped or released from the electronic component moving shuttle (referred to as the "sliding table" in the prior art 2) by the presser 210' and when the electronic component D is electrically connected to or disconnected from the test slot TS At this time, the operation of the vertical mover 220' as described above is performed.

The horizontal mover 230' moves the presser 210' horizontally in the front-rear direction. Here, the horizontal movement of the presser 210' is performed when moving the upper fulcrum of the shuttle and the upper fulcrum of the socket board SB.

In addition, electronic components may self-heat during the test procedure. In particular, the self-heating of electronic components that require calculations, such as CPUs, is very large. In addition, self-heating increases the temperature of the electronic component, which prevents the electronic component from being tested while maintaining an appropriate temperature that meets the test conditions.

In Korean Patent No. 10-0706216 (hereinafter referred to as "Prior Art 3"), a heat sink (Heatsink) is provided in order to adjust the temperature of electronic components. However, according to the prior art 3, the structure of the pushing member is complicated, so that the productivity is poor and the durability is reduced.

In Korean Patent Publication No. 10-2008-0086320 (hereinafter referred to as "Prior Art 4"), in order to adjust the temperature of electronic components, an air through hole is formed in the pusher, and the air through hole is supplied with air for temperature adjustment in the duct. . However, the prior art 4 is difficult to apply to the case where the pusher 212' is used as a structure for grasping electronic components by vacuum pressure. This is because the pusher must be equipped with the vacuum suction function and the ejection temperature adjustment air function, which are opposite to each other.

In addition, the above-mentioned method has a slow response to adjusting the temperature of the electronic component through the operation of the temperature adjustment function, which accordingly leads to a decrease in the reliability of the test.

Therefore, the inventor of the present invention has proposed a technology through Korean Laid-open Patent No. 10-2016-0064964 (hereinafter referred to as "Comparative Technology 1") that adjusts the temperature of the pusher through a cooling bag or a heater, thereby enabling instant response to electronic components The temperature changes.

In addition, Korean Laid-open Patent No. 10-2017-0116875 (hereinafter referred to as "Comparative Technology 2") that further improved the comparative technology 1 proposed a technology in which a fluid passage through which a cooling fluid passes is formed in the pusher. According to this comparative technique 2, a contact plate is provided between the pusher and the electronic component. In addition, the contact plate has contact caps corresponding to the pushing members one-to-one. According to this configuration, in Comparative Technology 2, the pusher is in contact with the contact cap, and the contact cap is in contact with the electronic component. That is, in Comparative Technology 2, the pusher and the electronic component are in indirect contact.

Both Comparative Technology 1 and Comparative Technology 2 are provided with a temperature sensor for measuring the temperature of the electronic component in the pusher, and the temperature sensor is equipped on the side of the contact surface of the pusher with the electronic component. Therefore, although according to the comparative technology 1, the temperature sensor can directly contact the electronic component, according to the comparative technology 2, the temperature sensor cannot directly contact the electronic component.

That is, in the case of the comparative technique 2, there is a structure in which the temperature sensor is placed between the contact caps to measure the temperature of the electronic component, which has the following problems.

First, since the temperature sensor is separated from the electronic component by the thickness of the contact cap, a delay and deviation occur between the temperature of the semiconductor element and the temperature measured by the temperature sensor. And, the thicker the thickness of the contact cap, the greater the delay and deviation.

Second, if the surface of the contact cap contacting the pushing member is uneven or inclined due to poor production or mechanical settings, the accuracy of the temperature measured by the temperature sensor is very low.

In addition, when performing a pressurization operation, in Comparative Technology 1, the temperature sensor is directly in contact with the electronic component, and in Comparative Technology 2, the temperature sensor is directly in contact with the contact cap, so there is a temperature sensor in both There is a risk of damage, which may lead to a decrease in the reliability of the test and the reliability of the equipment due to the failure of temperature regulation.

[Problems to be Solved by the Invention] The objectives of the present invention are as follows:

First, to provide a technology capable of ensuring the stability of a temperature measuring device that measures the temperature of an electronic component and realizing relatively more accurate temperature measurement.

Second, to provide a technology capable of grasping the bad contact between the pusher and the contact cap.

Third, to provide a technology that can shorten the test time by maintaining a proper temperature of the pusher between the test of the previous electronic component and the test of the next electronic component.

[Technical Means to Solve the Problem] The sorting machine for testing electronic components according to the present invention as described above includes: a supplying section for supplying electronic components; and a pressing section for electrically connecting the electronic components supplied by the supplying section The electronic component is pressurized in the test slot of the testing machine; the temperature adjusting part is used to adjust the temperature of the electronic component electrically connected to the test slot through the pressurizing part; the recycling part is completed by the testing machine The electronic component to be tested; and a control unit that controls the supply unit, the pressurizing unit, the temperature adjustment unit, and the recovery unit, wherein the pressurizing unit includes: a pressurizer for directing the electronic component toward the test slot side Pressurizing; and a contact plate, which is sandwiched between the pressurizer and the electronic component, and has a plurality of contact caps that directly contact the electronic component to pressurize the electronic component, the pressurizer includes: a plurality of pushers One-to-one correspondence with the contact caps. When the pressure operation is performed, the contact caps are pushed, so that the contact caps can contact the electronic components and press the electronic components; the setting board is provided with the multiple A pusher; and a mover for advancing or retreating the setting plate to the test slot side, so that the pushing element pressurizes or releases the pressure on the contact cap, the contact plate also includes a The contact cap is a plurality of temperature measuring devices that measure the temperature of the electronic component, and the control unit controls the temperature adjustment unit to adjust the temperature of the electronic component to be tested based on the temperature information of the electronic component measured by the temperature measuring device.

When the electronic component is pressurized by the pressurizer, the temperature measuring device can be separated from the pushing member and the electronic component.

The temperature measuring device is equipped to be embedded in the contact cap.

The pressurizer further includes a temperature sensor for sensing the temperature of the pushing member, and the control unit compares the temperature information sensed by the temperature measuring device with the temperature information sensed by the temperature sensor The comparison is performed so that when the difference between the two temperatures exceeds the preset reference value, the alarm occurs.

The temperature adjusting part includes: a cooling fluid supplier, which supplies the cooling fluid to the pressurizer; and a heater, which is disposed on the pushing member to heat the pushing member.

The pressurizer further includes a temperature sensor for sensing the temperature of the pushing member, and the control part stores the temperature of the pushing member when the previous electronic component is tested. The current test of the electronic component When the pressurization operation is released in order to test the next electronic component after the end, the temperature adjustment unit is controlled to maintain the temperature of the pusher at the temperature when the test was performed for the previous electronic component.

[Effects of the invention] According to the present invention, there are the following effects:

First, the temperature measuring device is arranged on the contact cap, and the temperature sensing element is separated from the pusher and the electronic components. Therefore, the risk of damage caused by contact impact is reduced, and relatively more accurate temperature measurement of electronic components can be achieved, thereby improving The reliability of the test is improved.

Second, the difference between the temperature sensed by the temperature measurer and the temperature measured by the temperature sensor can grasp the bad contact between the pusher and the contact cap or whether the temperature measurer or the temperature sensor is malfunctioning, so Can prevent bad tests, thereby improving the reliability of the equipment.

Third, when the pressure is released and the temperature measuring device is separated from the electronic component, the temperature information of the electronic component before the test is used flexibly to maintain the proper temperature of the pusher, thus shortening the test time and increasing the processing capacity. .

Hereinafter, with reference to the accompanying drawings, the above-mentioned preferred embodiments according to the present invention will be described. For the sake of brevity of the description, repeated descriptions are omitted or compressed as much as possible.

As shown in FIG. 4, the sorting machine TH for testing electronic components according to the present invention (hereinafter referred to as "sorting machine") includes a pair of loading trays 111, 112, a first mover 120, and a pair of moving shuttles MS1 and MS2. , The pressurizing unit 200, the temperature adjusting unit 300, the second mover 420, and the control unit 500.

Electronic components can be loaded on the loading trays 111 and 112. Such loading trays 111 and 112 may have heaters to heat the loaded electronic components to a temperature required for testing. Of course, the operation of the heater is stopped when testing at room temperature.

The first mover 120 moves _{the electronic components of the customer tray CT 1} to the loading trays 111 and 112, or moves the electronic components of the loading trays 111, 112 to the moving shuttle MS1/MS2 currently located in the left direction. For this reason, the first mover 120 is equipped to be able to move in the left-right direction and the front-rear direction (refer to arrows a and b).

Electronic components can be installed in the moving shuttles MS1 and MS2, and they can be moved in the left-right direction through the test position TP (see arrows a, b).

The pressing part 200 electrically connects the electronic components loaded on the moving shuttle MS1/MS2 located at the test position TP to the test slot TS of the socket board SB located below. To this end, referring to the solid line part in the schematic diagram of FIG. 5, the pressurizing part 200 includes a pressurizer 210, a vertical mover 220, and a horizontal mover 230.

The pressurizer 210 pressurizes the electronic component so that the electronic component can be directly connected to the testing machine. An example of such a pressurizer 210 will be described separately later.

The vertical mover 220 raises and lowers the pressurizer 210 (refer to arrow d). Therefore, the presser 210 can advance or retreat to the test slot TS side, and can advance or retreat to the moving shuttles MS1 and MS2.

The horizontal mover 230 moves the pressurizer 210 in the front-rear direction (refer to arrow e). Therefore, the pressurizer 210 can alternately grasp the electronic component between the moving shuttle of reference symbol MS1 and the moving shuttle of reference symbol MS2 to electrically connect it to the test slot TS.

For reference, the area defined as the test position TP may be equipped with a test chamber. Also, in the case of being equipped with a test chamber, the pressurizing part 200 or at least the pressurizer 210 is located inside the test chamber. Of course, the inside of the test chamber is adjusted to the temperature required to test the electronic components.

5, the temperature adjustment part 300 includes a cooling fluid supplier 310, a flow control valve 320, and a heater 330 (refer to FIG. 6) provided on the pusher 212 (refer to FIG. 6) of the above-mentioned pressurizer 210. ).

The cooling fluid supplier 310 supplies the cooling fluid for adjusting the temperature of the electronic components to the pressurizer 210. Such a cooling fluid supply 310 may include: a pump 311 for pumping a predetermined amount of cooling fluid; and a cooling module 312 for cooling the cooling fluid to a predetermined temperature.

The flow control valve 320 controls the supply amount of the cooling fluid supplied through the cooling fluid supplier 310.

Two heaters 330 (refer to FIG. 6) are respectively provided on each pushing member 212 to heat the pushing member 212. Of course, the heater 330 is equipped in order to finally heat the electronic components through the pusher 212.

The pump 311, the cooling module 312, the flow control valve 320 and the heater 330 of the temperature adjustment unit 300 are controlled by the control unit 500. Therefore, the temperature of the supplied cooling fluid, the supply flow rate, and the supply flow rate can be adjusted according to the test temperature condition of the electronic component. Therefore, if the temperature, supply flow rate, and supply flow rate of the cooling fluid are determined according to the test temperature condition, the cooling fluid supplier 310 continuously supplies the cooling fluid adjusted to the determined temperature, supply flow rate, and supply flow rate.

The second mover 420 classifies the tested electronic components of the mobile shuttles MS1 and MS2 currently located on the right side according to the test results, and moves them to the customer tray CT ₂ . To this end, the second mover 420 may move in the left-right direction (refer to arrow f in FIG. 4) or in the front-rear direction (refer to arrow g in FIG. 4).

The control unit 500 controls each of the aforementioned components, and the specific control according to the aforementioned control unit 500 will be described later.

For reference, the loading trays 111 and 112 and the first mover 120 side for supplying the electronic components of the _{customer tray CT 1} to the pressing unit 200 in the above-mentioned configuration can be defined as the supply unit SP that supplies the electronic components The electronic component that has been tested by the testing machine is moved to _{the second mover 420 side of the customer tray CT 2} can be defined as the recovery part WP. Here, the pair of moving shuttles MS1 and MS2 may serve as the supply part SP or the recovery part WP according to their positions.

＜An example of press machine＞

The pressing part 200 has a plurality of pushers 212 for pressing electronic components.

First, referring to FIG. 6, the position of the pusher 212 will be described.

The pushing member 212 of FIG. 6 includes a pushing member 212a, a first temperature sensor 212c, and a second temperature sensor 212d.

The pushing member 212a has a "T" shape in cross section, and is divided into an upper coupling portion 212a-1 and a lower contact portion 212a-2.

The coupling portion 212a-1 is coupled to a mounting plate described later.

The contact portion 212a-2 is a portion having a width smaller than that of the coupling portion 212a-1, and a contact end CE as a lower end surface thereof is inserted and contacted with a contact cap described later. An installation groove for installing the heater 330 is formed in this contact portion 212a-2.

In addition, the pushing member 212a is formed with a fluid passage FT through which the cooling fluid supplied and recovered by the cooling fluid supplier 310 passes.

The first temperature sensor 212c and the second temperature sensor 212d are arranged to measure the temperature of the upper side and the lower side of the pushing member 212a, respectively. Here, the second temperature sensor 212d is preferably provided on the contact end CE side of the contact portion 212a-2 so as to be close to the electronic component.

FIG. 7 is an example of the pressurizer 210 in which the aforementioned pusher 212 is actually applied, and FIG. 8 is an exploded view of the main part of the pressurizer 210.

As shown in FIGS. 7 and 8, the pressurizer 210 includes a setting plate 211, a pushing member 212, a setting structure 213, a supporting spring 214, a fluid distributor 215 and a contact plate 216.

Referring to FIG. 9, a pushing member 212 is provided on the setting plate 211 with the setting structure 213 as a medium. The setting plate 211 is formed with a setting hole 10 in which the contact portion 212a-2 of the pusher 212 can pass through and be provided protruding forward.

The pushing member 212 has been described above, so the description is omitted.

The installation structure 213 is provided for installing the pushing member 212 on the installation plate 211. This arrangement structure 213 includes a coupling plate 213a and a support stand 213b.

The coupling plate 213a is coupled to the setting plate 211, and is formed with a through hole TH capable of passing the contact portion 212a-2 of the pushing member 212. In addition, the coupling plate 213a is formed with a row of holes AH into which the guide pin 212f-1 provided in the guide member 212f of the pusher 212 as shown in FIG. 6 is inserted. Therefore, the upper end of the pushing member 212 in the figure can be neatly arranged through the array of holes AH.

The support platform 213b is arranged at a predetermined interval on the coupling plate 213a to support the upper end of the support spring 214 so that the support spring 214 can elastically support the pusher 212.

The support spring 214 elastically supports the upper end of the pushing member 212, so that the pushing member 212 can be realized to be able to advance and retreat a predetermined distance.

The fluid distributor 215 is arranged in order to supply the cooling fluid to the fluid passage FT of the pusher 212 provided by the arranging structure 213.

The contact plate 216 is sandwiched between the pushing member 212 and the electronic component D, and has a plurality of contact caps 216a and temperature measuring devices 216b.

The contact cap 216a is opened upward and is made of a metal material such as copper with excellent thermal conductivity, so that the cold air or heat of the pushing member 212a can be quickly transferred to the electronic component.

The temperature measuring device 216b is provided for sensing the temperature of the electronic component. That is, in this embodiment, the second temperature sensor 212d and the temperature measuring device 216b are provided in order to sense the temperature of the electronic component. In this embodiment, a temperature measuring device 216b for sensing the temperature of the electronic component independently of the second temperature sensor 212d is provided on the contact cap 216a. This is for the need to sense the temperature of the electronic component more accurately and Determine whether there is any bad operation.

The above-mentioned application of the contact board 216 is provided for the convenience of component exchange and the effective use of resources. Generally, if the sizes of the electronic components to be tested are different, all the pushing parts 212 can only be replaced. At this time, due to the connection relationship between the pushing member 212 and the cooling fluid, the operation of replacing the pushing member 212 is very cumbersome and consumes a lot of time. If the scale of the refrigerant or other replacement parts is taken into consideration, resources will be wasted. However, if the contact plate 216 is used as in this embodiment, the contact cap 216a can be replaced after only the contact plate 216 is removed, or the contact plate 216 prepared in advance can be installed. Therefore, the replacement operation is very easy and resource waste can also be prevented. .

Of course, the number of contact caps 216a provided on the contact plate 216 is the same as the number of the pushing members 212. That is, if it is a sorting machine used to test eight electronic components at a time, eight pushers 212 and contact caps 216a need to be equipped, and the pushers 212 correspond to the contact caps 216a one-to-one.

In addition, if only the second temperature sensor 212d is used to sense the temperature of the electronic component as in the aforementioned comparative technique 2, even if the thermal conductivity of the contact cap 216a is good, it may be caused by the time required to sense the temperature. Delay is caused by the degree of contact between the pusher 212 and the contact cap 216a, resulting in uneven thermal conductivity, etc., and eventually poor temperature control. However, if the temperature of the electronic component is measured by the temperature measuring device 216b provided in the contact cap 216a as in the present embodiment, the time delay for measuring the temperature of the electronic component is minimized, and there is no need to consider the distance between the pusher 212 and the contact cap 216a. The degree of exposure.

The temperature difference between the first temperature sensor 212c or the second temperature sensor 212d and the temperature measuring device 216b is used to determine whether a bad operation has occurred, which will be described later in the relevant part.

FIG. 10 illustrates the relationship between the pusher 212 and the contact cap 216a in a state in which the electronic component is electrically connected to the testing machine by the presser 210.

As shown in FIG. 10, the pushing member 212 pushes the contact cap 216a in a state where the lower end portion of the contact portion 212a-2 is covered by the contact cap 216a, so that the contact cap 216a can press the electronic component D. At this time, the contact end CE of the contact portion 212a-2 is in surface contact with the contact end 216a-1 of the contact cap 216a, so as to achieve rapid conduction of hot air or cold air and proper pressure transmission. Here, the contact end 216a-1 of the contact cap 216a is the lower end of the contact cap 216a that is in surface contact with the electronic component. In addition, as shown in the figure, the temperature measuring device 216b is equipped to be embedded in the contact end 216a-1 of the contact cap 216a. Thus, the temperature measuring device 216b is separated from the pushing member 212, and also separated from the electronic component D. However, the temperature measuring device 216b is arranged closer to the electronic component than the second temperature sensor 212d, and therefore the temperature of the electronic component can be sensed more quickly and accurately. The temperature measuring device 216b is not directly impacted, so the risk of breakage is reduced. Preferably, in order to accurately and quickly sense the temperature, it can be considered that the distance between the temperature measuring device 216b and the electronic component D is within 2 mm when the pusher 212 pressurizes the electronic component D.

In addition, the contact cap 216a or at least the contact end 216a-1 is made of a metal material such as copper with high thermal conductivity, so as to ensure the accuracy of almost directly sensing the temperature of the electronic component.

For reference, FIG. 11 illustrates a state where the electronic component to be tested is replaced with the contact cap 216a corresponding to it when the size of the electronic component becomes smaller. In this way, when the contact plate 216 is applied as in the present embodiment, the compatibility of the sorting machine TH for testing electronic components of various specifications is improved.

For the sorting machine TH according to the present invention, the temperature measuring device 216b, the first temperature sensor 212c, and the second temperature sensor 212d can be diversified and applied flexibly by the control unit 500, and therefore continue to be used. Description.

1. Bad alarm

When testing an electronic component, the control unit 500 appropriately controls the temperature adjustment unit 300 by the temperature information sensed from the temperature measuring device 216b, so that the electronic component can be tested under the required test temperature condition.

In addition, the control unit 500 compares the temperature information sensed from the temperature measuring device 216b with the temperature information sensed by the first temperature sensor 212c or the second temperature sensor 212d. In addition, when the temperature difference according to the comparison exceeds a preset reference value (for example, 30 degrees), the control unit 500 can know that the pusher 212 is not in normal contact with the contact cap 216a, or that the first temperature sensor 212c, The second temperature sensor 212d or the temperature measuring device 216b is malfunctioning. In this case, the manager is notified of the malfunction. That is, according to the present invention, the temperature of the electronic component D is sensed by the temperature measuring device 216b, so the first temperature sensor 212c or the second temperature sensor 212d is not a necessary configuration and can be omitted altogether. However, as mentioned above, by comparing the temperature information sensed from the temperature measuring device 216b with the temperature information sensed by the first temperature sensor 212c or the second temperature sensor 212d, various faults can be grasped. Preferably, it should be considered to equip the first temperature sensor 212c or the second temperature sensor 212d. Similarly, it is also possible to selectively equip only one of the first temperature sensor 212c and the second temperature sensor 212d. In addition, the second temperature sensor 212d is provided on the side surface of the pushing member 212a, so that it can be equipped to prevent direct contact with the contact cap 216a.

2. Selectively turn on (ON) and turn off (OFF)

When testing the electronic component D, accurate temperature measurement of the electronic component D is required, so the temperature measuring device 216b should be in an ON state. At this time, depending on the implementation situation, the temperature information about the pusher 212 from the first temperature sensor 212c or the second temperature sensor 212d may not be needed, so the first temperature sensor 212c and the second temperature sensor 212c 212d is in the OFF state.

In addition, the temperature information measured by the temperature measuring device 216b is not required in the blank time between the electronic component D that has been tested before and the electronic component D to be tested next, so the temperature measuring device 216b needs to be in the off state. However, for the next test, the pusher 212 cannot be too cold or too hot. Therefore, the first temperature sensor 212c and the second temperature sensor 212d should be in the ON state, based on the first temperature sensor The temperature information measured by the temperature sensor 212c or the second temperature sensor 212d adjusts the temperature of the pushing member 212.

3. Maintain the proper temperature of the pusher

As mentioned above, the temperature information measured by the temperature measuring device 216b is not required in the blank time between the electronic component D after the previous test and the electronic component D to be tested next. However, in order to maintain the proper temperature of the electronic component D, it is necessary to maintain the proper temperature of the pusher 212. Therefore, when the current electronic component D is tested, the first temperature sensor 212c and the second temperature sensor 212d sense the test temperature of the pusher 212 and store it, and after the current test of the current electronic component D is completed When the next electronic component D is tested and the pressurization operation of the pressurizer 210 is released, the temperature of the pusher 212 needs to be maintained at the temperature when the previous electronic component D was tested. In this case, the control unit 500 needs to make the first temperature sensor 212c and the second temperature sensor 212d also be in the ON state when the previous electronic component D is tested, and to sense the pusher 212 The temperature is stored, and the temperature adjusting part 300 is controlled based on the stored temperature information and the temperature information from the first temperature sensor 212c and the second temperature sensor 212d to maintain the proper temperature of the pusher 212.

The combination of the setting plate 211 of the pressurizer 210 and the pusher 212 described above with reference to FIG. 7 and the like is, for example, a form suitable for use in a sorting machine manufactured for processing small-variety mass-produced electronic components such as memory semiconductor . However, the present invention can also be realized as an assembly of the form shown in FIG. 12 suitable for application to a sorting machine manufactured for processing small-variety mass-produced electronic components such as memory semiconductors.

For reference, the assembly in FIG. 12 also has a setting plate 1211 and a pushing member 1212 that are almost similar to the above-mentioned embodiment. In the case of applying such a combination, a contact plate with a contact cap is also provided. Of course, a temperature measuring device is also provided in the contact cap. As described above, the present invention can be preferably applied to all kinds of sorting machines for adjusting the temperature of electronic components using pushers.

Therefore, the specific description of the present invention is carried out by referring to the embodiments of the accompanying drawings, but the above-mentioned embodiments are only preferred embodiments of the present invention, so it should not be understood that the present invention is limited to the above-mentioned embodiments, and the rights of the present invention The scope should be understood as the scope of the patent application and its equivalent scope.

TH‧‧‧Electronic component testing sorting machine SP‧‧‧Supply part 200‧‧‧Pressure part 210‧‧‧Pressurizer 212‧‧‧Pushing part 212a‧‧‧Pushing part 212c‧‧‧First temperature Sensor 212d‧‧‧Second temperature sensor FT‧‧‧Fluid path 216‧‧‧Contact plate 216a‧‧‧Contact cap 216b‧‧‧Temperature measuring device 220‧‧‧Vertical mover 300‧‧‧ Temperature Control Department WP‧‧‧Recycling Department 500‧‧‧Control Department

1 to 3 are reference diagrams for explaining a conventional sorting machine for testing electronic components. Fig. 4 is a plan view of a sorting machine for testing electronic components according to an embodiment of the present invention. Fig. 5 is a schematic perspective view of a pressing part applied to the sorting machine of Fig. 4. Fig. 6 is a schematic cross-sectional view of a pusher that can be applied to the pressing part of Fig. 5. Fig. 7 is a side view of a presser according to an example of applying the pusher of Fig. 6. Fig. 8 is an exploded view of the main part of the pressurizer of Fig. 7. 9 and 10 are reference diagrams for explaining the main features of the pressurizer of FIG. 8. FIG. 11 is a reference diagram for comparing with FIG. 10 to explain a state in which the contact cap is replaced according to the dimensional change of the electronic component to be tested. Fig. 12 is a schematic diagram of another form of pressurizer to which the present invention can be applied.

Domestic hosting information (please note in the order of hosting organization, date, and number) None

Foreign hosting information (please note in the order of hosting country, institution, date, and number) None

212‧‧‧Pushing piece

212a-2‧‧‧Contact part

212d‧‧‧Second temperature sensor

216a‧‧‧Contact cap

216a-1‧‧‧Contact terminal

216b‧‧‧Temperature Measuring Device

CE‧‧‧Contact

D‧‧‧Electronic parts

Claims (2)

A sorting machine for testing electronic components, comprising: a supply part, which supplies electronic parts; and a pressure part, which pressurizes the electronic parts in order to electrically connect the electronic parts supplied by the supply part to the test slot of the testing machine A temperature adjustment part for adjusting the temperature of the electronic components electrically connected to the test socket through the pressurizing part; a recycling part for recycling electronic components that have been tested by a testing machine; and a control part for controlling the supply part , A pressing part, a temperature adjusting part and a recovery part, wherein the pressing part includes: a presser for pressing the electronic component toward the test slot side; and a contact plate, which is sandwiched between the pressing Between the device and the electronic component, and has a plurality of contact caps that directly contact the electronic component to press the electronic component, wherein the pressurizer includes: a plurality of pushing members corresponding to the plurality of contact caps one-to-one, When the pressing operation is performed, the contact cap is pushed, so that the contact cap can contact the electronic component and press the electronic component; a setting plate is provided with the plurality of pushing members; and A mover for advancing or retreating the setting board to the test slot side, so that the pushing member pressurizes or releases the pressurization of the contact cap, wherein the contact plate further includes a contact cap provided in each of the contact caps. With a plurality of temperature measuring devices that measure the temperature of electronic components, the control unit controls the temperature adjusting unit to adjust the temperature of the electronic component to be tested based on the temperature information of the electronic components measured by the temperature measuring device, wherein the adding The pressure device further includes a temperature sensor for sensing the temperature of the pushing member, and the control part compares the temperature information sensed by the temperature measuring device with the temperature information sensed by the temperature sensor, Therefore, if the difference between the two temperatures exceeds the preset reference value, the alarm will fail. A sorting machine for testing electronic components, comprising: a supply part, which supplies electronic parts; and a pressure part, which pressurizes the electronic parts in order to electrically connect the electronic parts supplied by the supply part to the test slot of the testing machine A temperature adjustment part for adjusting the temperature of the electronic components electrically connected to the test socket through the pressurizing part; a recycling part for recycling electronic components that have been tested by a testing machine; and a control part for controlling the supply part , Pressure part, temperature adjustment part And a recovery part, wherein the pressing part includes: a presser for pressing the electronic component toward the test slot side; and a contact plate sandwiched between the presser and the electronic component, and There are a plurality of contact caps that directly contact the electronic components to pressurize the electronic components, wherein the presser includes: a plurality of pushers corresponding to the plurality of contact caps one-to-one, and pushes all the caps when the pressing operation is performed. The contact cap, so that the contact cap can contact the electronic component and press the electronic component; a setting board is provided with the plurality of pushing members; and a mover, the setting board is directed toward the test slot Side forward or backward, so that the pushing member pressurizes or depressurizes the contact cap, wherein the contact plate further includes a plurality of temperature measuring devices equipped with each of the contact caps to measure the temperature of the electronic component, so The control unit controls the temperature adjustment unit to adjust the temperature of the electronic component to be tested based on the temperature information of the electronic component measured by the temperature measuring device, wherein the pressurizer further includes a device for sensing the temperature of the pushing member Temperature sensor, the control unit stores when the previous electronic component is tested The temperature of the pushing member is controlled to maintain the temperature of the pushing member at the temperature of the pushing member when the pressure operation is released for testing the next electronic component after the test of the previous electronic component is completed. The temperature at which the component was tested.

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