TW201630796A - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

An objective of the invention is to provide an electronic component conveying device and electronic component inspection device having an abutment member with excellent cooling responsiveness. The electronic component inspection device 1 of the invention comprises a plurality of heads 3 abutted against electronic components; a supplying passage 10A for supplying refrigerant RF to the heads 3; and a recycling passage 10B for recycling refrigerant RF from the heads 3. Moreover, the supplying passage 10A comprises a first supplying passage 47 connected to the refrigerant source 28; and supplying flexible tubes 5A forming second supplying passages 53A branched from the first supply passage 47 toward each head 3. In addition, the recycling passage 10B comprises a first recycling passage 48 connected to the refrigerant source 28; and recycling flexible tubes 5B forming second recycling passages 53B branched from the first recycling passage 48 toward each head 3.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

An electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC device has been known, and an electronic component transportation device for transporting an IC device to a holding portion of an inspection portion is assembled in the electronic component inspection device. . At the time of inspection of the IC device, the IC device is placed in the holding portion, and a plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC device.

In the inspection of such an IC device, there is a case where the IC device is cooled to a specific temperature and is carried out within a specific temperature range (for example, refer to Patent Document 1). Patent Document 1 discloses a configuration in which a heat sink attached to a surface of an IC device is blown by air blown from a fan.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-5685

However, in the configuration for cooling described in Patent Document 1, the air from the fan is not blown to the radiator, and as a result, there is a problem that the cooling response is lowered.

An object of the present invention is to provide an electric power excellent in cooling responsiveness of an abutting member Sub-part transport device and electronic component inspection device.

Such an object is achieved by the present invention described below.

[Application Example 1]

An electronic component conveying apparatus according to the present invention includes: an abutting member including an abutting portion that abuts against the electronic component; a supply flow path that supplies the refrigerant to the abutting member; and a recovery flow path that is The abutting member collects the refrigerant.

Thereby, the contact member is excellent in cooling responsiveness.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, it is preferable that a plurality of the abutting members are provided.

Thereby, a plurality of electronic parts can be uniformly abutted.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, it is preferable that the supply flow path includes a first supply flow path connected to the refrigerant supply unit and a second supply flow path branched from the first supply flow path into a plurality of second supply flow paths.

Thereby, the refrigerant can be supplied to the abutting portion in a simple configuration.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, it is preferable that the recovery flow path includes a first recovery flow path connected to the refrigerant recovery unit and a second recovery flow path branched from the first recovery flow path into a plurality of.

Thereby, the refrigerant can be easily recovered from the abutting portion.

[Application 5]

In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component conveying device includes a flow path member including the first supply flow path and the first recovery flow path.

Thereby, the winding of the first supply flow path and the first recovery flow path becomes easy.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, it is preferable that the flow path member surrounds the contact member in a plan view.

Thereby, the contact member and the flow path member can be connected to the flow path member via the second supply flow path and the second recovery flow path as much as possible with respect to each of the contact members.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, it is preferable that the first supply flow path is disposed on one side of the inner side or the outer side of the first recovery flow path.

Thereby, when the first supply flow path and the first recovery flow path are formed, they can be independently and easily formed by, for example, drilling.

[Application Example 8]

In the electronic component conveying apparatus of the present invention, it is preferable that the second supply flow path and the second recovery flow path have a flexible tube.

Thereby, the winding (pipe) becomes easy.

[Application Example 9]

In the electronic component conveying apparatus of the present invention, preferably, the flow path member includes the first supply flow path and the first recovery flow path, and the tube has a curved portion, and the curved portion is disposed on the The flow path member is vertically above.

Thereby, the second supply flow path and the second recovery flow path can be deflected, that is, the side closer to the other structure in which the second supply flow path and the second recovery flow path are likely to interfere with each other.

[Application Example 10]

In the electronic component conveying apparatus of the present invention, preferably, the flow path member includes the first supply flow path and the first recovery flow path, and surrounds the contact member in plan view; Each of the second supply flow path and the second recovery flow path is disposed inside the flow path member.

With this configuration, the second supply flow path and the second recovery flow path can be restricted from being deformed outward by the flow path member. Therefore, it is possible to prevent the second supply flow path or the second recovery flow path from being stuck by the structure around the second supply flow path or the second recovery flow path. live.

[Application Example 11]

In the electronic component conveying apparatus of the present invention, preferably, the first supply flow path and the supply flow path connection portion of the second supply flow path are connected, and the first recovery flow path and the second connection are connected The recovery flow path connection portion of the recovery flow path is arranged in a zigzag configuration.

Thereby, the adjacent second supply flow path and the second recovery flow path can be narrowed, that is, narrowed at intervals, thereby contributing to downsizing of the electronic component transfer device.

[Application Example 12]

In the electronic component conveying apparatus of the present invention, preferably, the flow path member includes the first supply flow path and the first recovery flow path, and the supply flow path connection portion and the recovery flow path connection portion It is disposed on the vertical upper surface of the flow path member.

Thereby, the second supply flow path and the second recovery flow path can be deflected, that is, the side closer to the other structure in which the second supply flow path and the second recovery flow path are likely to interfere with each other.

[Application Example 13]

In the electronic component conveying apparatus of the present invention, it is preferable that the supply flow path connecting portion and the recovery flow path connecting portion include a relay block and are welded to the relay block.

Thereby, when the second supply flow path or the second recovery flow path is replaced, the relay block can be replaced together with the relay block, and the replacement work becomes easy.

[Application Example 14]

In the electronic component transport apparatus of the present invention, preferably, the relay block system is It is connected to the above-described flow path member by screwing.

Thereby, when the second supply flow path or the second recovery flow path is replaced, the relay block can be replaced together with the relay block, and the replacement work becomes easy.

[Application Example 15]

In the electronic component conveying apparatus of the present invention, preferably, the connection of the second supply flow path to the contact member and the connection of the second recovery flow path to the contact member are performed by welding. .

Thereby, it is possible to prevent the second supply flow path and the second recovery flow path from being accidentally detached from the abutting member.

[Application Example 16]

In the electronic component conveying apparatus of the present invention, preferably, the flow path member includes the supply flow path and the recovery flow path.

Thereby, the winding of the supply flow path and the recovery flow path becomes easy.

[Application Example 17]

In the electronic component conveying apparatus of the present invention, it is preferable that the flow path member has a frame shape.

Thereby, the abutting member and the flow path member can be connected as short as possible with respect to each of the abutting members.

[Application Example 18]

An electronic component inspection apparatus according to the present invention includes: an abutting member including an abutting portion that abuts against an electronic component; a supply flow path that supplies a refrigerant to the abutting member; and a recovery flow path that is from the above The abutting member collects the refrigerant; and the inspection unit checks the electronic component.

Thereby, the contact member is excellent in cooling responsiveness.

1‧‧‧Inspection device (electronic parts inspection device)

3‧‧‧ head

4‧‧‧ runner components

5A‧‧‧ Supply flexible tube

5B‧‧‧Retractable flexible tube

10A‧‧‧Supply runner

10B‧‧‧Recovery runner

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧ Temperature adjustment section (soaking plate)

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department (Supply Shuttle)

15‧‧‧Tray transport mechanism (first transport device)

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧Device Transfer Head

21‧‧‧Tray transport mechanism (first transport device)

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

23‧‧‧Pipe

24‧‧‧ pump

25‧‧‧ valve

26‧‧‧Pipe

27‧‧‧Pipe

28‧‧‧Refrigerant source

31‧‧‧Apartment

32‧‧‧ Thermal block

33‧‧‧Cooling block

34‧‧‧Shell

35‧‧‧Pt sensor

36‧‧‧heater

37‧‧‧Supply connector

38‧‧‧Recycling joints

41‧‧‧Longside

42‧‧‧ Short side

43‧‧‧Longside

44‧‧‧ Short side

45‧‧‧Upright surface

46‧‧‧ screw holes

47‧‧‧1st supply channel

48‧‧‧1st recycling channel

49‧‧‧ pipe plug

51A‧‧‧Supply runner connection

51B‧‧‧Recovery runner connection

52A‧‧‧ head side runner connection

52B‧‧‧ head side runner connection

53A‧‧‧2nd supply flow channel

53B‧‧‧2nd recycling channel

54A‧‧‧Bend

54B‧‧‧Bend

55‧‧‧Relay block

56‧‧‧Bolts (bolts with hexagon holes)

61‧‧‧1st partition

62‧‧‧2nd partition

63‧‧‧3rd partition

64‧‧‧4th partition

65‧‧‧5th partition

66‧‧‧ inside partition

70‧‧‧ front cover

71‧‧‧ side cover

72‧‧‧ side cover

73‧‧‧Back cover

75‧‧‧4th door

80‧‧‧Control Department

90‧‧‧IC devices

171‧‧‧ head unit

172‧‧‧Cooling unit (cooling structure)

173‧‧‧Support

200‧‧‧Tray (configuration component)

311‧‧‧ Front End Blocks

312‧‧‧Flange

331‧‧‧ flow path

341‧‧‧ Space

471‧‧‧ starting point

472‧‧‧ End

481‧‧‧ starting point

482‧‧‧ End

551‧‧‧ counterbore

711‧‧‧1st door

712‧‧‧2nd door

721‧‧‧1st door

722‧‧‧2nd door

731‧‧‧1st door

732‧‧‧2nd door

733‧‧‧3rd door

740‧‧‧ cylinder

741‧‧‧ cylinder

742‧‧‧ cylinder

743‧‧‧ cylinder

744‧‧‧ cylinder

745‧‧‧ cylinder

901‧‧‧ upper surface

A‧‧‧ arrow symbol

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

B‧‧‧arrow symbol

C-C‧‧‧ line

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

RF‧‧‧Refrigerant

WF‧‧‧actuating fluid

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2 is a perspective view showing the device transfer head of the inspection area provided in the electronic component inspection device shown in Fig. 1.

Fig. 3 is a view (top view) taken from the direction of the arrow symbol A in Fig. 2.

Fig. 4 is a view (side view) seen from the direction of the arrow symbol B in Fig. 2.

Fig. 5 is a schematic horizontal cross-sectional view showing a flow path member of the device transfer head shown in Fig. 2 and its periphery.

Figure 6 is a cross-sectional view taken along line C-C of Figure 5.

Fig. 7 is a schematic vertical cross-sectional view showing the abutting member of the device transfer head shown in Fig. 2 and its periphery.

Fig. 8 is a schematic vertical cross-sectional view showing the abutting member of the device transfer head shown in Fig. 2 and its periphery.

Figure 9 is a block diagram of the device transfer head and its periphery shown in Figure 2.

FIG. 10 is a vertical cross-sectional view showing a part of the device transfer head of the inspection region included in the electronic component inspection device (second embodiment) of the present invention.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on a preferred embodiment shown in the additional drawings.

<First embodiment>

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a perspective view showing the device transfer head of the inspection area provided in the electronic component inspection device shown in Fig. 1. Fig. 3 is a view (top view) taken from the direction of the arrow symbol A in Fig. 2. Fig. 4 is a view (side view) seen from the direction of the arrow symbol B in Fig. 2. Fig. 5 is a schematic horizontal cross-sectional view showing a flow path member of the device transfer head shown in Fig. 2 and its periphery. Figure 6 is a cross-sectional view taken along line C-C of Figure 5. 7 and 8 are respectively the device carrying head shown in FIG. 2; A schematic vertical cross-sectional view of the abutment member and its periphery. Figure 9 is a block diagram of the device transfer head and its periphery shown in Figure 2. In the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, the upstream side of the transport direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Moreover, the "level" as used in the description of the present invention is not limited to a complete level, and includes a state in which it is slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.

The inspection device (electronic component inspection device) 1 shown in Fig. 1 is used for inspection/test (hereinafter referred to as "inspection") such as BGA (Ball Grid Array) package or LGA (Land grid array: platform) Grid array) A device such as an IC device such as a package, an electronic component such as an LCD (Liquid Crystal Display), or a CIS (CMOS Image Sensor: CMOS image sensor). In the following, for the sake of convenience of explanation, a case where the IC device is used as the electronic component to be inspected will be described as a representative, and the IC device will be referred to as "IC device 90".

As shown in FIG. 1, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter simply referred to as "recovery area") A4, and The tray removes the area A5. Then, the IC device 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5 through the above-described respective areas and in the inspection area A3 in the middle. In this manner, the inspection apparatus 1 is formed as an electronic component transport apparatus that transports the IC device 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 80. In the inspection apparatus 1, the supply area A2 to the collection area A4 from the tray supply area A1 to the tray removal area A5 may be referred to as a "Delivery area".

In addition, the inspection apparatus 1 is configured with a tray supply area A1 and a tray removal area A5. The side (the lower side in FIG. 1) is the front side, and the side opposite to the inspection area A3 (the upper side in FIG. 1) is used as the back side.

The tray supply area A1 supplies a supply unit of a tray (arrangement member) 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 is an area in which a plurality of IC devices 90 disposed on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply area A2, a temperature adjustment unit (soaking plate) 12, a device transfer head 13, and a tray transfer mechanism (first transfer device) 15 are provided.

The temperature adjustment unit 12 mounts a plurality of mounting portions of the IC device 90, and can heat or cool the plurality of IC devices 90. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjustment portions 12 are disposed and fixed in the Y direction. In addition, the IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 12 and placed.

The device transfer head 13 is supported to be movable within the supply area A2. Thereby, the device transfer head 13 can carry the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 to be described later. Transfer.

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all of the IC devices 90 are removed in the supply region A2 in the X direction. Then, after the transfer, the empty tray 200 is transported back to the tray supply area A1 from the supply area A2 by the tray transport mechanism 11B.

The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transfer head 17, and a device collection unit (recycling shuttle) 18 are provided.

The device supply unit 14 mounts the mounting portion of the temperature-adjusted IC device 90, and can transport the IC device 90 to the vicinity of the inspection unit 16. The device supply portion 14 is supported to be movable between the supply region A2 and the inspection region A3 in the X direction. Further, in the configuration shown in FIG. 1, two device supply units 14 are disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to any of the device supply units 14 and placed thereon.

The inspection unit 16 is a unit that inspects/tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 in a state in which the IC device 90 is held. Further, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, and the inspection of the IC device 90 is performed via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 16. Further, in the inspection unit 16, the IC device 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device 90 can be adjusted to a temperature suitable for inspection.

The device transfer head 17 is supported to be movable within the inspection area A3. Thereby, the device transfer head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply region A2 to the inspection unit 16 and mount it.

The device recovery unit 18 is placed on the mounting portion of the IC device 90 after the inspection by the inspection unit 16 is completed, and the IC device 90 can be transported to the recovery area A4. The device recovery portion 18 is supported to be movable between the inspection region A3 and the recovery region A4 in the X direction. Further, in the configuration shown in FIG. 1, in the same manner as the device supply unit 14, two device collection units 18 are disposed in the Y direction, and the IC device 90 on the inspection unit 16 is transferred to the device recovery unit of either one. 18 and placed. This transfer is performed by the device transfer head 17.

The recovery area A4 is a region of a plurality of IC devices 90 after the end of the inspection. In the collection area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism (second transfer device) 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared.

The collection tray 19 is mounted on the mounting portion of the IC device 90, and is fixed in the recovery area A4. In the configuration shown in FIG. 1, three are arranged in the X direction. Also, empty tray 200 Also, the mounting portion of the IC device 90 is placed, and three are arranged in the X direction. Then, the IC device 90 moved to the device recovery unit 18 of the recovery area A4 is transported to any of the recovery trays 19 and the empty trays 200 and placed thereon. Thereby, the IC device 90 is separately recovered and classified by the inspection result.

The device transfer head 20 is supported to be movable within the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction in the collection area A4. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be any one of the above three empty trays 200. In the inspection apparatus 1, the tray conveyance mechanism 21 is provided in the collection area A4, and the tray conveyance mechanism 15 is provided in the supply area A2. By this, the transport of the empty tray 200 to the X direction is performed by, for example, one transport mechanism, and the throughput (the number of transports of the IC device 90 per unit time) can be improved.

In addition, the configuration of the tray transport mechanisms 15 and 21 is not particularly limited, and examples thereof include a suction member having the adsorption tray 200 and a support mechanism such as a ball screw that supports the adsorption member in the X direction.

The tray removal area A5 is a material removal unit that collects and removes the tray 200 of the plurality of IC devices 90 in which the inspection state is completed. In the tray removal area A5, a plurality of trays 200 can be stacked.

Moreover, the tray conveyance mechanisms 22A and 22B of the transfer trays 200 are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the IC device 90 for inspection is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the tray 200 for collecting the empty space of the IC device 90 from the tray removal area A5 to the collection area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, pallet transport Mechanisms 11A and 11B, temperature adjustment unit 12, device transfer head 13, device supply unit 14, tray transfer mechanism 15, inspection unit 16, device transfer head 17, device recovery unit 18, device transfer head 20, tray transfer mechanism 21, and The drive of each of the tray transport mechanisms 22A, 22B.

In addition, the inspection control unit of the tester performs inspection of electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

In the inspection apparatus 1 as described above, the device transfer head 13, the device supply unit 14, and the device transfer head 17 are configured to heat or cool the IC device 90 in addition to the temperature adjustment unit 12 or the inspection unit 16. Thereby, the IC device 90 maintains a constant temperature during the transfer. Further, in the following, the case where the IC device 90 is cooled and inspected in a low temperature environment in the range of, for example, -60 ° C to -40 ° C will be described.

As shown in FIG. 1, the inspection apparatus 1 is partitioned (separated) between the tray supply area A1 and the supply area A2 by the first partition plate 61, and the second partition 62 divides between the supply area A2 and the inspection area A3. The third partition plate 63 divides the inspection area A3 from the recovery area A4, and the fourth partition plate 64 divides the space between the recovery area A4 and the tray removal area A5. Further, the supply area A2 and the recovery area A4 are also divided by the fifth partition plate 65. These separators have a function of maintaining the airtightness of each region. Further, the inspection device 1 is covered with a cover, and the cover includes, for example, a front cover 70, side covers 71 and 72, and a rear cover 73.

Further, the supply region A2 is the first chamber R1 partitioned by the first partition plate 61, the second partition plate 62, the fifth partition plate 65, the side cover 71, and the rear cover 73. In the first chamber R1, a plurality of IC devices 90 in an unchecked state are carried in together with the tray 200.

The inspection area A3 is the second chamber R2 partitioned by the second partition 62, the third partition 63, and the rear cover 73. Further, in the second chamber R2, the inner partition plate 66 is disposed inside the rear cover 73.

The recovery area A4 is the third chamber R3 partitioned by the third partition plate 63, the fourth partition plate 64, the fifth partition plate 65, the side cover 72, and the rear cover 73. In the third chamber R3, a plurality of IC devices 90 that have been inspected are carried in from the second chamber R2.

As shown in FIG. 1, the side door 71 is provided with a first door (left side first door) 711 and a second door (left side second door) 712. By opening the first door 711 or the second door 712, for example, maintenance such as maintenance in the first chamber R1 or release of the pressing of the IC device 90 (hereinafter, collectively referred to as "work") can be performed. Further, the first shutter 711 and the second shutter 712 are configured as so-called "double doors" that are opened and closed in opposite directions. Further, during the operation in the first chamber R1, the movable portion such as the device transfer head 13 in the first chamber R1 is stopped. The first shutter 711 and the second shutter 712 are configured to be unlocked and unlocked by the operation of the air cylinder 740.

Similarly, the side cover 72 is provided with a first door (right first door) 721 and a second door (right second door) 722. By opening the first door 721 or the second door 722, for example, the work in the third chamber R3 can be performed. Further, the first shutter 721 and the second shutter 722 are also configured as "double doors" that are opened and closed in opposite directions. Further, during the operation in the third chamber R3, the movable portion such as the device transfer head 20 in the third chamber R3 is stopped. The first door 721 and the second door 722 are configured to be unlocked and unlocked by the operation of the air cylinder 745.

Further, the rear cover 73 is also provided with a first door (the first door on the back side) 731, a second door (the second door on the back side) 732, and a third door (the third door on the back side). ) 733. By opening the first door 731, for example, the work in the first chamber R1 can be performed. By opening the third door 733, for example, the work in the third chamber R3 can be performed. Further, a fourth shutter 75 is provided on the inner partition plate 66. Further, by opening the second door 732 and the fourth door 75, for example, the work in the second chamber R2 can be performed. Further, the first shutter 731, the second shutter 732, and the fourth shutter 75 are connected in the same direction, and the third shutter 733 is opened and closed in the opposite direction to the shutters. Further, during the operation in the second chamber R2, the movable portion such as the device transfer head 17 in the second chamber R2 is stopped. The first door 731 is configured to be unlocked by the action of the air cylinder 741. The second door 732 is configured to be unlocked by the action of the air cylinder 742. The third door 733 is configured to be actuated by the air cylinder 744. The lock is unlocked, and the fourth door 75 is configured to be unlocked by the action of the cylinder 743.

Moreover, by closing each of the shutters, airtightness or heat insulation in the respective chambers can be ensured.

As described above, in the inspection apparatus 1, the temperature adjustment unit 12, the device transfer head 13, and the device supply unit 14 are inspected in order to inspect the IC device 90 in a low temperature environment in the range of, for example, -60 ° C to -40 ° C. The device transfer head 17 and the inspection unit 16 are configured to cool the IC device 90. Further, even among them, the temperature management of the device transfer head 17 in the inspection area A3 where inspection is performed is relatively important. Hereinafter, the device transfer head 17 will be described.

As shown in FIGS. 2 to 4, the device transfer head 17 has a head unit 171 and a cooling unit (cooling structure) 172.

As shown in FIG. 3, the head unit 171 has 16 heads 3 and supports 173 which collectively support the heads 3.

The support body 173 supports the plate members of the 16 heads 3 from the upper side.

In the present embodiment, the 16 heads 3 are arranged in a matrix of two rows in the Y direction and eight rows in the X direction (see FIG. 3), and sequentially numbered "head1" to "head16" (refer to the figure). 7, Figure 8). Since the heads 3 have substantially the same configuration except for the arrangement positions, the first head 3 will be representatively described below.

As shown in FIGS. 7 and 8, the head 3 abuts against the abutting member of the IC device 90. The head 3 has an abutting portion 31, a heat conducting block 32, a cooling block 33, a casing 34, a Pt sensor 35, and a heater 36.

The abutting portion 31 has a lower end block portion 311 and a flange portion 312 provided at an upper portion of the front end block portion 311. The abutting portion 31 is made of a metal material such as aluminum.

The front end block portion 311 is a portion that abuts on the upper surface 901 from above the IC device 90. A Pt sensor 35 as a temperature detecting unit that detects the temperature of the abutting portion 31 is incorporated in the distal end block portion 311. Moreover, the temperature detected by the Pt sensor 35 can be regarded as the temperature of the IC device 90 abutting on the front end block portion 311.

Further, as shown in FIG. 9, the Pt sensor 35 is electrically connected to the control unit 80, and transmits the detection result when the temperature is detected to the control unit 80. Since the Pt sensor 35 is provided in each of the heads 3, in the configuration shown in FIG. 9, there are a total of 16 Pt sensors 35.

The flange portion 312 is a portion to which the housing 34 is detachably attached. Thereby, the abutting portion 31 can be replaced with respect to the type of the IC device 90.

The heat transfer block 32 and the cooling block 33 are housed in the casing 34.

The heat conducting block 32 is fixed to the housing 34 and abuts against the flange portion 312 of the abutting portion 31. The heat transfer block 32 is made of a metal material such as aluminum. Further, a heater 36 is built in the heat transfer block 32. Thereby, the heat generated by the heater 36 can be transmitted to the IC device 90 via the heat conducting block 32 and the abutting portion 31, whereby the heating of the IC device 90 can also be performed.

Above the heat transfer block 32, a cooling block 33 made of the same material as the heat transfer block 32 is disposed. The cooling block 33 has a flow path 331 through which the refrigerant RF from the cooling unit 172 passes.

The cooling block 33 is slidable in the up and down direction in the casing 34. Further, the cooling block 33 is pushed upward by a spring pushing member (not shown). Thereby, the cooling block 33 can be brought into a state in which it is separated from the heat conducting block 32 (see FIG. 7) and abuts against the heat conducting block 32 against the elastic force of the elastic pressing member (refer to FIG. 8). Further, the heat of the IC device 90 can be absorbed via the abutting portion 31 and the heat transfer block 32 by abutting the cooling block 33 filled with the refrigerant RF in the flow path 331 at a specific timing against the heat transfer block 32. With this endothermic, the IC device 90 can be cooled. In addition, the heater 36 is stopped during cooling.

Above the cooler block 33, a space 341 is defined by cooling the block 33 and the casing 34. The space 341 is in communication with the pump 24 via the pipe 23. By actuating the pump 24, the operating fluid WF can be supplied to bring the inside of the space 341 into a pressurized state, and the cooling block 33 can abut against the heat transfer block 32 against the elastic force of the spring pushing member.

Further, in the pipe 23, a valve 25 is provided between the space 341 and the pump 24. Thereby, the supply of the operating fluid WF in the space 341 and the stop of the supply can be switched.

As shown in FIG. 9, the valve 25 is electrically connected to the control unit 80. Further, based on the detection result of the Pt sensor 35, the control unit 80 sets the valve 25 to the open state when the IC device 90 is to be cooled, thereby supplying the operating fluid WF to the space 341 and stopping the cooling of the IC device 90. When the valve 25 is set to the off state, thereby stopping the supply of the actuating fluid WF. Further, since the valve 25 is provided one for each of the heads 3, there are a total of sixteen in the configuration shown in FIG.

By providing a plurality of (16 in the present embodiment) heads 3 having the above configuration, a plurality of IC devices 90 can be collectively pressed against the inspection portion 16, so that rapid inspection can be easily performed.

As shown in FIG. 2, the cooling unit 172 includes a flow path member 4, 16 supply flexible tubes 5A, 16 collection flexible tubes 5B, a supply joint 37, and a recovery joint 38.

As shown in FIGS. 2 and 3, the flow path member 4 is an "O"-shaped frame that surrounds the head unit 171 (head 3) when viewed from above the vertical direction (in a plan view). Thereby, the head 3 and the flow path member 4 can be connected to the flow-through flexible tube 5A and the recovery flexible tube 5B at the shortest possible distance with respect to each of the heads 3 of the head unit 171.

Further, in the present embodiment, the flow path member 4 has a substantially rectangular outer shape when viewed from above, and has a long side 41 and a long side 43 extending in the X direction and a short side 42 extending in the Y direction. And the short side 44.

Further, as shown in FIG. 5, the flow path member 4 is formed (including) a first supply flow path 47 which is a portion of the supply flow path 10A for supplying the refrigerant RF to each of the heads 3, and a recovery of the refrigerant RF recovered from each of the heads 3. One of the flow paths 10B is the first recovery flow path 48.

The first supply flow path 47 has a long side 41 side of the flow path member 4 as a starting point 471, and proceeds from the starting point 471 sequentially along the long side 41, the short side 42, and the long side 43, and becomes the short side 44 side. End point 472. The refrigerant RF flows down from the starting point 471 side toward the end point 472 side.

Further, the first supply flow path 47 is connected to the supply joint 37 at the starting point 471. Further, the supply joint 37 is connected to the refrigerant source 28 via a pipe 26. The refrigerant source 28 functions as a refrigerant supply unit that supplies the refrigerant RF to the first supply flow path 47. Further, the refrigerant RF is not particularly limited, and for example, a liquid such as a fluorinated liquid can be used.

On the other hand, the first recovery flow path 48 has the long side 41 side of the flow path member 4 as a starting point 481, and sequentially follows the long side 41, the short side 42, the long side 43, and the short side 44 from the starting point 481. It enters and becomes the end point 482 on the short side 41 side. The refrigerant RF flows down from the starting point 481 side toward the end point 482 side.

Further, the first recovery flow path 48 is connected to the recovery joint 38 at the end point 482. Further, the recovery joint 38 is connected to the refrigerant source 28 via a pipe 27. The refrigerant source 28 also functions as a refrigerant recovery unit that recovers the refrigerant RF from the recovery joint 38.

Further, the supply joint 37 or the recovery joint 38 is configured as a so-called "bend type" joint.

As shown in FIG. 5, the first supply flow path 47 is disposed outside the first recovery flow path 48. Moreover, as shown in FIG. 6, the 1st supply flow path 47 is arrange|positioned on the upper side rather than the 1st collection flow path 48. Therefore, although FIG. 5 is a horizontal cross-sectional view, the horizontal cross section of the first supply flow path 47 and the horizontal cross section of the first recovery flow path 48 are horizontal sections which are shifted in the vertical direction, and are not the same horizontal cross section.

Further, by arranging the first supply flow path 47 and the first recovery flow path 48 in such a configuration, the long side 41, the short side 42, the long side 43, and the short side can be formed when the first supply flow path 47 is formed. For each side of the side 44, a straight hole that communicates with each other is formed using, for example, a drill, and each of the long side 41, the short side 42, the long side 43, and the short side 44 can be formed when the first recovery flow path 48 is formed. A linear hole that communicates with each other is formed using, for example, a drill. After the formation of each hole, the first supply flow path 47 and the first recovery flow path 48 are obtained by sealing the opening of the hole with a plug 49.

Since the 16 supply flexible tubes 5A and the 16 collection flexible tubes 5B have the same configuration except for the arrangement portion, the following is a supply flexible tube 5A and one for one head 3; The flexible tube 5B for recycling will be representatively described.

As shown in Fig. 5, the one end portion of the supply flexible tube 5A serves as the supply flow path connecting portion 51A, and is connected to the middle of the first supply flow path 47, and the other end portion serves as the head side flow path connecting portion 52A. The inlets of the flow passages 331 of the head 3 are connected. In this way, the hollow portion (inner chamber portion) of the supply flexible tube 5A is the second supply flow path 53A that branches from the first supply flow path 47 and faces the flow path 331 of the first head 3. The second supply flow path 53A constitutes the supply flow path 10A together with the first supply flow path 47. Thereby, the refrigerant RF can be supplied to the head 3 in a simple configuration.

The one end portion of the collecting flexible pipe 5B is the collecting flow path connecting portion 51B, and is connected to the middle of the first collecting flow path 48, and the other end portion is the head side flow path connecting portion 52B, and the flow path 331 of the head 3 The exit is connected. Thereby, the hollow portion (inner cavity portion) of the recovery flexible tube 5B is the second recovery flow path 53B that branches from the first recovery flow path 48 and faces the flow path 331 of the one head 3. The second recovery flow path 53B constitutes the recovery flow path 10B together with the first recovery flow path 48. Thereby, the refrigerant RF can be recovered from the first 3 in a simple manner.

Further, by the supply flow path 10A and the recovery flow path 10B having the above configuration, the refrigerant RF can be supplied to the respective heads 3 in an appropriate amount, that is, without waste, while circulating the refrigerant RF. Thereby, the cooling responsiveness of the supply flow path 10A is excellent, and therefore, the cooling of the IC device 90 can be performed efficiently.

Further, since the supply flexible tube 5A and the recovery flexible tube 5B are each a flexible tube, the winding is easy. As a result, as shown in FIG. 4, the supply flexible tube 5A and the recovery flexible tube 5B can be piped (arranged) inside the flow path member 4 as much as possible. By such a pipe, the supply flexible pipe 5A and the recovery flexible pipe 5B can be restricted from being deformed outward by the flow path member 4 and protruding. By this means, even if the device transfer head 17 moves in the inspection area A3, the supply flexible tube 5A or the recovery flexible tube 5B can be prevented from being caught by other structures around the periphery (hereinafter simply referred to as "other structures"). .

As shown in Fig. 2, the supply flexible tube 5A has a supply flow path connecting portion 51A disposed on the vertical upper surface 45 of the flow path member 4, and the recovery flexible tube 5B is also disposed in the recovery flow path connecting portion 51B. The vertical upper surface 45 of the flow path member 4. Further, as shown in FIG. 4, the supply flexible tube 5A is formed with a curved portion 54A which is disposed above the vertical flow path member 4 and which is bent in a hairpin shape, and is formed in the recovery flexible tube 5B. The flow path member 4 is disposed in a curved portion 54B that is vertically upward and has a hairpin shape. According to such a pipe, the supply flexible pipe 5A and the recovery flexible pipe 5B can be biased toward each other, that is, on the side where the other structures are relatively disposed.

As shown in FIG. 5, the supply flow path connecting portion 51A and the recovery flow path connecting portion 51B are serrated. Configuration. With this configuration, the supply flexible tube 5A and the recovery flexible tube 5B adjacent to each other in the X direction can be arranged to be narrowed in the X direction, that is, narrowed at intervals, thereby facilitating miniaturization of the device transfer head 17. .

Further, in the present embodiment, it is preferable that the supply flow path connecting portion 51A and the collecting flow path connecting portion 51B and the flow path member 4 are connected by welding.

Further, it is preferable that the head side flow path connecting portion 52A and the head side flow path connecting portion 52B are connected to the head 3 by welding. Thereby, it is possible to prevent the head side flow path connecting portion 52A and the head side flow path connecting portion 52B from being accidentally detached from the head 3, that is, the connection between the head side flow path connecting portion 52A and the head side flow path connecting portion 52B is accidentally released.

<Second embodiment>

FIG. 10 is a vertical cross-sectional view showing a part of the device transfer head of the inspection region included in the electronic component inspection device (second embodiment) of the present invention.

In the following, the second embodiment of the electronic component transporting apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the configuration (connection form) of the supply flow path connecting portion and the recovery flow path connecting portion is different.

As shown in Fig. 10, in the present embodiment, the supply flow path connecting portion 51A (or the recovery flow path connecting portion 51B) has a relay block 55, and the relay block 55 is connected to the supply by welding. The flexible tube 5A (or the flexible tube 5B for recycling).

Further, the relay block 55 has a plurality of counter holes 551 (two in the configuration shown in FIG. 10). On the other hand, in the flow path member 4, a screw hole 46 is formed at a position corresponding to each of the counter holes 551. Further, a bolt (a bolt with a hexagonal hole) 56 is inserted into each of the counterbore 551, and the bolt 56 is screwed into the screw hole 46. Thereby, the relay block 55 can be connected by screwing.

According to the above configuration, when the supply flexible pipe 5A is replaced, the bolts 56 can be loosened, and the relay block 55 can be replaced with the relay block 55. Therefore, the replacement work becomes easy.

In the above, the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention have been described with reference to the embodiments. However, the present invention is not limited thereto, and the components constituting the electronic component transport apparatus and the electronic component inspection apparatus can be replaced with the above-described components. Any of the same functions. Further, any constituent may be added.

Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be combined with any two or more of the above-described configurations (characteristics).

Further, although the number of heads of the head unit is 16 in each of the above embodiments, it is of course not limited thereto.

Further, the flow path member is an O-shaped frame in the above embodiments, but the present invention is not limited thereto, and may be a U-shaped frame.

In addition, although the first supply flow path is disposed outside the first recovery flow path in the above embodiment, the first supply flow path is not limited thereto, and may be disposed inside the first recovery flow path.

Further, in the above-described embodiment, the first supply flow path is disposed on the upper side than the first recovery flow path. However, the first supply flow path is not limited thereto, and may be disposed on the lower side than the first recovery flow path.

1‧‧‧Inspection device (electronic parts inspection device)

3‧‧‧ head

4‧‧‧ runner components

5A‧‧‧ Supply flexible tube

5B‧‧‧Retractable flexible tube

10A‧‧‧Supply runner

10B‧‧‧Recovery runner

17‧‧‧Device transfer head

26‧‧‧Pipe

27‧‧‧Pipe

28‧‧‧Refrigerant source

33‧‧‧Cooling block

37‧‧‧Supply connector

38‧‧‧Recycling joints

41‧‧‧Longside

42‧‧‧ Short side

43‧‧‧Longside

44‧‧‧ Short side

47‧‧‧1st supply channel

48‧‧‧1st recycling channel

49‧‧‧ pipe plug

51A‧‧‧Supply runner connection

51B‧‧‧Recovery runner connection

52A‧‧‧ head side runner connection

52B‧‧‧ head side runner connection

53A‧‧‧2nd supply flow channel

53B‧‧‧2nd recycling channel

171‧‧‧ head unit

172‧‧‧Cooling unit (cooling structure)

331‧‧‧ flow path

471‧‧‧ starting point

472‧‧‧ End

481‧‧‧ starting point

482‧‧‧ End

C-C‧‧‧ line

RF‧‧‧Refrigerant

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Claims (18)

An electronic component conveying apparatus comprising: an abutting member including an abutting portion that abuts against an electronic component; a supply flow path that supplies a refrigerant to the abutting member; and a recovery flow path from the above The abutting member recovers the above refrigerant. The electronic component transporting apparatus of claim 1, wherein a plurality of the abutting members are provided. The electronic component transport apparatus according to claim 2, wherein the supply flow path includes a first supply flow path connected to the refrigerant supply unit and a second supply flow path branched from the first supply flow path into a plurality of. The electronic component transport apparatus according to claim 3, wherein the recovery flow path includes a first recovery flow path connected to the refrigerant recovery unit and a second recovery flow path branched from the first recovery flow path into a plurality of. The electronic component conveying apparatus of claim 4, comprising a flow path member including the first supply flow path and the first recovery flow path. The electronic component transporting apparatus of claim 5, wherein the flow path member surrounds the abutting member in a plan view. The electronic component transport apparatus according to claim 6, wherein the first supply flow path is disposed on one of an inner side or an outer side of the first recovery flow path. The electronic component conveying apparatus according to any one of claims 4 to 7, wherein the second supply flow path and the second recovery flow path have flexible tubes. The electronic component conveying apparatus of claim 8, comprising a flow path member including the first supply flow path and the first recovery flow path; wherein the tube has a curved portion, and the curved portion is disposed in the flow The vertical component of the channel member. The electronic component conveying apparatus according to any one of claims 4 to 9, comprising a flow path member including the first supply flow path and the first recovery flow path, and surrounding the abutting member in plan view And the second supply flow path and the second recovery flow path are disposed on the inner side of the flow path member. The electronic component conveying apparatus according to any one of claims 4 to 10, wherein the first supply flow path and the supply flow path connection portion of the second supply flow path are connected, and the first recovery flow path is connected to the The recovery flow path connecting portion of the second recovery flow path is arranged in a zigzag manner. The electronic component conveying device of claim 11, comprising a flow path member including the first supply flow path and the first recovery flow path; and the supply flow path connection portion and the recovery flow path connection portion On the vertical upper surface of the flow path member. The electronic component transport apparatus according to claim 12, wherein the supply flow path connecting portion and the recovery flow path connecting portion include a relay block and are welded to the relay block. The electronic component transporting apparatus of claim 13, wherein the relay block is connected to the flow path member by screwing. The electronic component conveying apparatus according to any one of claims 4 to 14, wherein the connection of the second supply flow path to the abutting member and the connection of the second recovery flow path to the abutting member are welded. And proceed. The electronic component transport apparatus according to any one of claims 1 to 15, comprising a flow path member including the supply flow path and the recovery flow path. The electronic component transporting apparatus of claim 16, wherein the flow path member is in the form of a frame. An electronic component inspection device characterized by comprising: The abutting member includes an abutting portion that abuts against the electronic component, a supply flow path that supplies the refrigerant to the abutting member, a recovery flow path that recovers the refrigerant from the abutting member, and an inspection portion that Check the above electronic parts.