TW201947242A - Handler for testing electronic components - Google Patents

Abstract

The invention relates to a hander for testing electronic components, wherein the hander can support electronic component testing in a low-temperature environment. The hander for testing the electronic components forms an environment maintaining chamber, and furthermore the environment maintaining chamber is sustained to a dry state, and therefore the hander has a structure which can be partially cooled. The hander according to the invention has the following effects of improving testing reliability of the electronic component, improving cooling efficiency and reducing energy.

Description

Sorter for testing electronic components

The present invention relates to a sorting machine for testing electronic components that can support electronic components such as semiconductor elements and can be tested by a tester.

Electronic components such as semiconductor elements are produced in a number of processes depending on the situation. Even if each process is performed under standardized conditions, the more precise electronic components are, the more affected by small changes, so it is currently impossible to produce only good products. That is, the occurrence of defective products cannot be avoided. Therefore, after the produced electronic components pass the tester's test, they are divided into good products and defective products, and only good products are shipped from the factory.

Testing of electronic components can only be performed when the electronic components are electrically connected to the tester. At this time, the equipment for electrically connecting the socket of the tester and the electronic component is a sorter.

In addition, electronic components can be used in a variety of thermal environments. Therefore, when testing electronic components, it is necessary to test under a state of constructing a special temperature environment. Therefore, the sorting machine needs to maintain the electronic components at a high, low or normal temperature state and electrically connect the electronic components to the tester according to the required test conditions. The present invention relates to a sorting machine that supports testing while maintaining electronic components at a low temperature.

Generally, the methods of cooling electronic components include a chamber method and a plate method.

The chamber method is a method of forming a chamber capable of forming a low-temperature environment, and accommodating an electronic component inside the chamber to cool the electronic component. This chamber method has the disadvantages that in order to maintain a low temperature inside the chamber having a large space, a large amount of energy is consumed, and a long time for cooling electronic components is required.

The plate method is a method in which electronic components are placed on a plate cooled by a cooling fluid, and the electronic components are cooled by conduction. This board method directly cools electronic components through conduction, so the cooling time is short, but because it is locally cooled, it has the disadvantage of being affected by relatively high ambient air and causing condensation or icing. In particular, if the electronic components are pre-cooled before the electronic components are tested in advance, dew or icing occurs, the electrical contact between the electronic components and the tester will be poor during the test procedure, and furthermore, due to dew or condensation Ice can damage the components that make up the sorter.

Of course, it is possible to combine the chamber method and the plate method, but in the path of moving electronic components, etc., it is actually impossible to completely block the interior and the outside of the chamber, so the energy consumption must be large, especially with relatively humid external air Into the chamber, it is actually difficult to finally prevent the occurrence of dew or icing.
[Prior technical literature]
(Patent Literature)

(Patent Document 0001) Korean Patent Publication No. 10-2003-0023213 (Patent Document 0002) Korean Patent Publication No. 10-2004-0026456 (Patent Document 0003) Korean Patent Publication No. 10-2014-0125465

[Problems to be solved by the invention]
An object of the present invention is to provide a technology that uses a plate method and also does not generate dew or icing during a low temperature test.

[Technical means to solve the problem]
The sorting machine for testing electronic components according to the present invention includes a test support unit that supports testing of electronic components, and a stacking unit that supplies a customer tray loaded with electronic components to be tested to the test support unit and recycles the completed loading A customer tray for electronic components to be tested, the test support unit including a loader located in a supply area for supplying electronic components to a test area, and having a first temperature-adjusting loading plate capable of adjusting the temperature of the loaded electronic components A shuttle unit that moves the electronic components that have passed through the first temperature-adjusting loading plate to a test area, or moves the completed electronic components from the test area to a recycling area, and has a function of regulating the temperature of the loaded electronic components A second temperature-adjusting loading plate; at least one first mover that moves an electronic component to be tested from a customer tray that reaches the supply position from the stacking section to the first temperature-adjusting loading plate, or causes the electronic component Moving from the first temperature-adjusting loading plate to the second temperature-adjusting loading plate; An electronic component that is moved from the supply area to the test area by the second temperature-adjusting loading board and is electrically connected to a tester, so that the electronic component can be tested by the tester; a recycling board is located in the recycling An area for recovering the electronic components that have completed the test from the test area to the unloading position of the recovery area by means of the second temperature adjustment loading plate; at least one second mover for using the second temperature adjustment The electronic component moved to the collection area by loading the plate is moved to the collection plate; and the environment maintenance chamber is used to maintain a dry environment in a space where the first temperature adjustment loading plate and the second temperature adjustment loading plate exist. And has at least one supply hole, the at least one supply hole provides a channel for moving a customer tray loaded with electronic components to be tested from the stacking section; a humidity measurement sensor that measures the environment to maintain a strong internal Humidity; a dryer to supply dry air to the interior of the environment maintaining chamber; a cooler to supply a cooling fluid to cool the first A temperature-adjusting loading plate and the second temperature-adjusting loading plate; a controller that controls the dryer according to information measured by the humidity measurement sensor, thereby adjusting a supply amount of dry air, wherein the first A temperature-adjusting loading plate and the second temperature-adjusting loading plate can respectively mount electronic components, and regulate the temperature of the loaded electronic components by conduction, and have a movement through which a cooling fluid supplied by the cooler passes. The cooling path of the circuit function, wherein the loader further includes: a first heater that applies heat to an electronic component mounted on the first temperature-adjusting loading plate; and a first temperature measurement sensor for measuring the The temperature of the first temperature-adjusting loading plate, wherein the shuttle unit further includes: a second heater that applies heat to an electronic component mounted on the second temperature-adjusting loading plate; a second temperature measurement sensor, For measuring the temperature of the second temperature-adjusting loading plate, wherein the controller is configured to measure the temperature of the second temperature-adjusting loading plate according to the temperature measured by the first temperature-measuring sensor and the second temperature-measuring sensor; The information controls the cooler, the first heater, and the second heater to adjust the temperatures of the first temperature-adjusting loading plate and the second temperature-adjusting loading plate.

At least one of the cooling pipes for supplying a cooling fluid cooled by the cooler to the cooling path or for recycling is a double pipe, and the inner pipe and the outer pipe of the double pipe are passed through the dryer. Dry air is supplied therebetween, and the cooling fluid supplied and recovered by the cooler moves to the inner pipe of the double pipe.

The environment maintaining chamber has at least one opening and closing door which can be opened and closed by an operator. The opening and closing door includes: a first door capable of opening and closing a first open area; and a second door provided at the first door capable of opening and closing. A second open area smaller than the first open area.

The connector includes a pusher that pressurizes an electronic component toward a socket side of the tester and has a fluid passage through which a cooling fluid supplied from the cooler passes; a heating element provided in the pusher to the The thruster applies heat; a temperature measuring element is provided on the thruster to measure the temperature of the thruster; a cooling pipe is used to supply a cooling fluid cooled by the cooler to the thruster or to pass through the thruster The cooling fluid from the thruster is recovered to the cooler through a fluid passage, wherein at least one of the cooling tubes is equipped with a spiral shape to ensure the mobility of the thruster, and the controller The temperature measured by the temperature measuring element controls the cooler and the heating element and adjusts the temperature of the thruster.

The loader further includes a separating member that fixes the first temperature-adjusting loading plate so as to be separated from a base surface by a predetermined distance; and a shield wall that surrounds the first temperature-adjusting loading plate to be separated from the first temperature-adjusting loading plate. The lower end and the side end of the first temperature-adjusting loading plate are provided separately so as to minimize the air around the first temperature-adjusting loading plate to the electronic components mounted on the first temperature-adjusting loading plate. The part of the drying air supplied by the dryer is a part of the phase separation between the loading plate and the base surface.

A spray hole is formed in the mask wall, and the spray hole sprays dry air supplied to a separated portion between the mask wall and the first temperature-adjusting loading plate to the surroundings.

The shuttle unit further includes: a base plate that is provided so as to be movable by a moving source; a separating member that fixes the second temperature-adjusting loading plate so as to be separated from the substrate by a predetermined distance; a cover wall, The periphery of the second temperature-adjusting loading plate is provided so as to be separated from the lower end and the side ends of the second temperature-adjusting loading plate, thereby minimizing the air pair around the second temperature-adjusting loading plate. An influence of the electronic components mounted on the second temperature-adjusting loading plate is that a portion where the drying air is supplied by the dryer is a phase-separated portion between the second temperature-adjusting loading plate and the substrate.

A spray hole is formed in the shield wall, and the spray hole sprays the dry air supplied to the spaced portion between the second temperature-adjusting loading plate and the substrate to the surroundings.

The sorting machine for testing electronic components further includes a shutter that opens and closes the supply hole, wherein the controller controls the shutter to open the supply hole only when a customer tray moves through the supply hole.

The dry air supplied by the dryer is supplied to at least one of the supply area and the test area, so that a pressure difference is generated between the test area and the recovery area, thereby preventing the existence of the recovery Area air enters the test area.

The second temperature-adjusting loading board includes: a loading part for loading electronic components to be tested; and an unloading part for loading electronic components that have been tested, wherein the shuttle part further includes: a cooling unit for cooling the loading part; The heating unit is used for heating the loading part and the unloading part, wherein the unloading part can only be heated according to the control.

[Effect of the invention]
The present invention has the following effects.

First, the board method is used to prevent outside air from penetrating into the interior of the chamber, thereby preventing dew or icing during low-temperature testing, thereby improving the test reliability of electronic components and preventing damage to the device.

Second, the local cooling of the plate improves the cooling efficiency and minimizes the outflow of cold air, which can reduce energy consumption.

Third, it is possible to quickly control the heat that may be generated from the electronic components in the test program, and thus it is possible to further improve the test reliability of the electronic components.

A preferred embodiment according to the present invention will be described with reference to the drawings. For the sake of brevity of description, repetitive or substantially the same configuration is omitted or compressed as much as possible.

FIG. 1 is a perspective view of a sorting machine (hereinafter simply referred to as a “sorting machine”) 100 for testing electronic components according to an embodiment of the present invention.

As shown in FIG. 1, the sorting machine 100 according to this embodiment includes a test support unit TSP capable of supporting testing of electronic components, and a stacking unit SKP that supplies or retrieves a customer tray CT to or from the test support unit TSP. Customer tray CT. Here, the electronic components to be tested are loaded on the customer tray CT supplied from the stacking unit SKP to the test support unit TSP, and the customer trays CT collected from the test support unit TSP to the stacking unit SKP are loaded with the electronic components that have been tested.

Continuing to refer to FIG. 2 which is a schematic plan view of the sorting machine 100 of FIG. 1, the detailed configuration of the sorting machine 100 will be described in detail.

The test support section TSP includes a loader 110, a shuttle 120, a first mover 130, a connector 140, a recovery plate 150, a second mover 160, an environmental maintenance chamber 170, a first shutter 181, and a second The shutter 182, the humidity measurement sensor SS, the dryer 190, the cooler CA, and the controller MA.

The loader 110 is located in a supply area SA for supplying electronic components to the test area TA, and is cooled by a cooling fluid supplied through the cooler CA, thereby directly cooling the loaded electronic components by conduction. That is, the sorting machine 100 according to the present embodiment has a structure in which the loader 110 is used to enable the test electronic components to be cooled before testing. For this reason, as shown in the schematic exploded perspective view of FIG. 3 and the schematic side view of FIG. 4, the loader 110 includes a first temperature adjustment loading plate 111, a first heater 112, a first temperature measurement sensor 113, a first A separating member 114 and a first shielding wall 115.

The first temperature adjustment stacker board 111 has a loading tank LS on the upper surface thereof, on which an electronic component can be placed and loaded. In addition, inside the first temperature-adjusting loading plate 111, two cooling paths CW starting from the front and rear end portions and ending at the middle portion are formed, and a heater groove HS and a sensor are formed to avoid the cooling path CW. Detector slot SG. To this end, the first temperature-adjusting loading plate 111 may include an upper plate 111a and a lower plate 111b that are closely coupled to each other.

The cooling fluid supplied from the cooler CA is preferably configured to flow into the cooling path CW through the start points S of the two end portions of the first temperature-adjusting loading plate 111 and then pass through the middle portion of the first temperature-adjusting loading plate 111. Ending point E flows out from the cooling path CW. The reason why the cooling path CW is constituted in this manner is confirmed by a variety of experimental studies. In an experimental example, the temperature of the cooling fluid at minus 70 degrees at the injection start point S rises toward the end point E. In this case, it is confirmed that the middle portion of the first temperature-adjusting loading plate 111 where the end point E is located does not decrease to -65 ° C or less because the temperature of the surface exposed to the surrounding external air is small. On the contrary, around the two ends of the first temperature-adjusting loading plate 111 where the start point S of the cooling fluid injection of minus 70 degrees is located, it is confirmed that minus 65 degrees is due to the large number of surfaces exposed to the surrounding external air. Obviously, this example is a specific experimental example and may have a temperature deviation of about +/- 1 degree.

The first heater 112 is buried in the heater tank HS, and heat is applied to the electronic components mounted on the first temperature adjustment loading plate 111 through surface contact. Specifically, the heat generated by the first heater 112 heats the first temperature-adjusting loading plate 111 and heats the electronic components mounted on the first temperature-adjusting loading plate 111 by conduction. Such a first heater 112 can be used when performing a high temperature test, and can also be used for precise temperature control during a low temperature test. In addition, the first heater 112 may cause jamming after the low temperature test or stop the operation of the sorting machine 100 for the next operation in order to return the first temperature adjustment loading plate 111 to normal temperature or prevent condensation and Use with ice.

The first temperature measurement sensor 113 is installed in the sensor groove SG, and measures the temperature of the first temperature adjustment loading plate 111. The controller MA controls the first heater 112, the dryer 190, and the cooler CA based on the temperature information measured by such a first temperature measurement sensor 113.

The first separator 114 is provided to separate the base surface (bottom surface) BF of the first temperature-adjusting loading plate 111 and the sorter 100 on which the loader 110 is installed and the bottom of the first shield wall 115 described below. The reason for providing such a first separator 114 is to minimize the cold air or hot air of the first temperature-adjusting loading plate 111 that is locally cooled or heated, and is discharged to the base surface BF by conduction. Therefore, the first separator 114 needs to use a material with low thermal conductivity (such as a resin material instead of a metal) and needs to be equipped with a minimum number. The thickness of the first separator 114 is preferably the smallest to support the first temperature-adjusting loading plate 111. .

In the sorting machine 100 according to the present invention, the phase-separated portion A between the first temperature-adjusting loading plate 111 and the base surface BF separated from each other by the first separator 114 as described above passes through a dryer. 190 supplies dry air. According to this, it is possible to centrally supply the dry air to a part where the supply of the dry air is most likely to cause dew or icing. Therefore, the efficiency of the drying can be improved and the consumption of the dry air can be reduced in the corresponding part. In addition, dry air can be supplied whenever necessary to provide thermal insulation.

The first shield wall 115 is provided in a shape of a substantially quadrangular frame around the first temperature-adjusting loading plate 111 so as to be spaced apart from the side end of the first temperature-adjusting loading plate 111. Therefore, the first masking wall 115 can block the first temperature-adjusting loading plate 111 and the electronic components loaded therefrom from the surrounding air by a predetermined degree, and minimize the thickness by forming a masking film with dry air in the vertical direction. The influence of ambient air on the first temperature-adjusting loading plate 111 and the electronic components mounted thereon. For this reason, the upper end of the first shield wall 115 is preferably higher than the first temperature-adjusting loading plate 111 and the electronic components mounted thereon. Therefore, an upper end portion of the shield wall 115 is formed for the first temperature adjustment. The alternating grooves 115a of the upper plate 111a of the loading plate 111 are smoothly alternated. Obviously, in the shield wall 115, in addition to the alternating groove 115a, a cooling path CW that can be used to supply cooling fluid to the first temperature-adjusting loading plate 111 and a plurality of cooling pipes through which the cooling fluid is recovered can be formed. Vias 115b.

In addition, a small-diameter spray hole 115c is formed in the inner wall surface and the bottom surface of the first shield wall 115, and the spray hole 115c can supply the dry air to the first temperature-adjusting loading plate 111 and the portion A of the base surface BF. It is sprayed toward the inside which is the side of the first temperature-adjusting loading plate 111. Such a first shield wall 115 further prevents the surrounding humid air from moving to the first temperature-adjusting loading plate 111 or the electronic components mounted thereon, so that condensation or icing can be further prevented. Preferably, the spray hole 115c and a portion of the dry air sprayed through the spray hole 115c are located below the uppermost end surface of the first temperature-adjusting loading plate 111, so that it is necessary to prevent the gripper from being grasped or released by the first mover 130. The possibility of defective electronic components being loaded or detached.

In addition, it can be seen that the inner wall surface of the lateral portion of the first shield wall 115 and the side end of the first temperature-adjusting loading plate 111 are separated from each other, and that the bottom surface of the first shield wall 115 and the first temperature-adjusting loading plate 111 are separated from each other. The lower ends are separated from each other. This structure prevents the cold or hot air of the first temperature-adjusting loading plate 111 from being discharged through the first shield wall 115, and simultaneously forms the above-mentioned spray holes 115c to provide dry air around the first temperature-adjusting loading plate 111.

The shuttle unit 120 moves the electronic component that has passed through the loader to the test area TA or moves the electronic component that has completed the test from the test area TA to the recovery area RA. Therefore, as shown in FIG. 5, the shuttle unit 120 includes a second temperature adjustment loading plate 121, a second heater 122, a second temperature measurement sensor 123, a second separator 124, a second shield wall 125, The base plate 126, the cooling pipe 127 having a special structure, and the movement source 128.

The second temperature-adjusting loading plate 121 can load electronic components, such as Korean Laid-Open Patent No. 10-2014-0125465 (hereinafter referred to as 'the prior art'), and can be divided into loading locations (named 'loading containers' in the prior art) 121a With the unloading part (named 'unloading container' in the prior art) 121b. The loading portion 121 a is a portion where an electronic component to be tested is loaded, and the unloading portion 121 b is a portion where an electronic component which has been tested is loaded. As in the prior art, the second temperature adjustment loading plate 121 can be moved by the moving source 128. At this time, the loading portion 121a moves between the loading position LP and the test position TP, and the unloading portion 121b is between the test position TP and the unloading position UP. Between moves. Obviously, according to the implementation, the following configuration can be fully considered, and there is only one loading site without distinguishing the loading site 121a and the unloading site 121b, and the moving interval of the loading site is extended to the loading position LP, the test position TP, and the unloading position. The second temperature-adjusting mounting plate 121 is also formed with a cooling path, a heater tank, and a sensor tank through which a cooling fluid passes, and functions as the cooling path CW and the heater tank HS of the first temperature-adjusting mounting plate 111. Since it is the same as the sensor slot SG, the description is omitted.

The functions of the second heater 122, the second temperature measurement sensor 123, the second separator 124, and the second shield wall 125 are also the same as those of the first heater 112 and the first temperature-adjusting loading plate 111. Since the temperature measurement sensor 113, the first separation member 114, and the first shield wall 115 are the same, detailed description is omitted.

The substrate 126 is provided so as to be movable by a movement source 128. In addition, the second temperature-adjusting loading plate 121 is provided so as to be separated from the substrate 126 by the second separator 124, so that the second temperature-adjusting loading plate 121 is also moved by the movement of the movement source 128, and the air is dried. It is supplied to the mutually separated part B between the second temperature adjustment loading plate 121 and the substrate 126.

For reference, it may be considered that the loader 110 described above is equipped with the first temperature adjustment loading plate 111 that can be moved like the shuttle 120. In addition, according to implementation, the loader 110 also needs to load more electronic components or rapidly cool electronic components at normal temperature. Therefore, as shown in FIG. 6, the cooling path CQ of the first temperature-adjusting loading plate 111A can be formed to have a ratio The number of the cooling paths of the second temperature-adjusting loading plate 121 is larger. Therefore, unlike the example of FIG. 3, the positions of the start point S and the end point E may be located around the first temperature-adjusting loading plate 111A. The sides are arranged separately.

The cooling pipe 127 is provided in order to supply the cooling fluid supplied from the cooler CA to the second temperature adjustment loading plate 121 or to recover the cooling fluid from the second temperature adjustment loading plate 121. As shown in FIG. 7, such a cooling pipe preferably includes a double pipe having an outer pipe 127 a and an inner pipe 127 a located inside the outer pipe 127 a. The inner pipe 172b, which has a low-temperature cooling fluid moving inside, may cause dew or ice to form on the outer surface. In addition, due to such dew or icing, the inner pipe 127b that is bent when the second temperature adjustment loading plate 121 is moved may be damaged. Therefore, the outer pipe 127a is provided, and the inner pipe 127b is protected from being directly exposed to the outside. Here, it is more preferable to consider that the inner pipe 127b is formed of a spiral pipe like a cooling pipe of the connector 140 described later. In addition, it may be considered to supply dry air from the dryer 190 to the space S between the inner pipe 127b and the outer pipe 127a. With this structure, damage to the cooling pipe 127 caused by frequent movement of the second temperature adjustment loading plate 121 can be minimized. Obviously, if the first temperature-adjusting loading plate 111 of the loader 110 is also movably provided, the cooling pipe provided in the loader 110 is also preferably composed of a double pipe.

The first mover 130 moves the electronic component to be tested from the customer tray CT that has reached the supply position SP from the stacking section SKP to the first temperature-adjusting loading plate 111 or moves the electronic component from the first temperature-adjusting loading plate 111. To the loading portion 121 a of the second temperature-adjusting loading plate 121. Obviously, according to the implementation, a plurality of first movers 130 may be provided, and the functions of moving the electronic components from the customer tray CT to the first temperature adjustment loading plate 111 and the first temperature adjustment loading plate 111 to the first Functions of the temperature-adjusting loading plate 121.

The connector 140 sucks and holds the electronic component at the loading portion 121a of the test position TP by vacuum pressure, and then electrically connects the held electronic component to the test socket TS of the tester, and moves the completed electronic component to the unloading portion. 121b. Here, the electrical connection between the electronic component and the test socket TS is performed by pressurizing the electronic component to the test socket TS. To this end, as shown in FIG. 8 and FIG. 9, which is cut out and partially expanded, the connector 140 includes a head 141, eight thrusters 142, a heating element HD, a first temperature measurement element TD ₁ , and a second temperature measurement element TD _2. , Cooling pipe 143, vertical mover 144 and horizontal mover 145.

The head 141 is provided so as to be able to be raised and lowered by a vertical mover 144. This head 141 has a channel structure or a valve structure that provides vacuum pressure to the eight thrusters 142. Obviously, a separate tube structure may be utilized to provide vacuum pressure to the thruster 142.

Each of the eight thrusters 142 is provided for pressurizing the electronic components. Therefore, 8 electronic components can be electrically connected to the tester at one time. Obviously, the number of thrusters 412 may be different according to the implementation form of the equipment. The thruster 142 has a 'T' cross-section and is divided into an upper joint portion 142a and a lower contact portion 142b.

The coupling portion 142 a is coupled to the head 141. A guide hole GH is formed in such a joint portion 142a, and a guide pin (not shown) for accurately guiding the position of the pusher 142 is inserted into the guide hole GH.

The contact portion 142b is a portion having a width smaller than that of the bonding portion 142a. The contact end CE, which is the lower end surface, contacts the electronic component to press the electronic component, or holds the electronic component by vacuum pressure from the vacuum path VW.

The purpose of forming the vacuum path VW is to apply a vacuum pressure to the electronic component in order to attract and hold the electronic component. Here, the vacuum pressure may be realized by supplying from the outside, or the sorting machine 100 may be equipped with a regulator that generates a vacuum pressure, and may be realized by obtaining a supply from the regulator.

A fluid passage TW through which a cooling fluid supplied from the cooler CA passes is formed in the thruster 142.

The fluid passage TW is formed so that the cooling fluid that has flowed in through the inlet IH located at the joining portion 142a moves to the contact portion 142b and then flows out through the outlet located at the joining portion 142a. Therefore, the cooling fluid reaching the propeller 142 from the cooler CA passes through the fluid passage TW and is discharged from the propeller 142.

The heating element HD is provided for the purpose of heating the pusher 142 and finally heating the electronic component pressurized by the pusher 142. Like the first heater 112 and the second heater 122, this heating element HD can be used for heating for high-temperature tests, heating for cooling or temperature adjustment of electronic components to return to normal temperature, and the like.

The first temperature measuring element TD ₁ In order to measure the temperature of the pusher 142 and with the second temperature measuring element TD ₂ to directly measure temperature of the electronic components and equipment. Therefore, the second temperature measurement stage TD ₂ is preferably provided on the contact end CE side of the contact portion 142 b to contact the electronic component.

As shown, the above-described heating element HD, TD ₁ a first temperature measuring element and the second temperature measuring element disposed in the TD ₂ pusher 142.

The cooling pipe 143 is provided to supply the cooling fluid cooled by the cooler CA to the propeller 142 or to recover the cooling fluid discharged from the propeller 142 through the fluid passage TW to the cooler CA. Such a cooling pipe 143 is provided with a spiral shape in order to ensure the mobility of the propeller 142 moving in the horizontal direction and the vertical direction according to their installation positions so as to have a flexible bend due to elastic deformability and resilience.

The vertical mover 144 raises and lowers the head 141 (refer to arrow a). Therefore, the head provided with the pusher 142 can be lowered or raised. When the pusher 142 is lowered, the pusher 142 is in a position capable of holding the electronic component or pressurizing the electronic component toward the test socket TS side.

The horizontal mover 145 moves the head 141 in the horizontal direction (see arrow b).

That is, after the head 141 provided with the pusher 142 is operated by the vertical mover 144 and the horizontal mover 145 to grasp the electronic component from the loading portion 121 a of the second temperature adjustment loading plate 121, the electronic component to be grasped is held. It is electrically connected to the test socket TS, and the test-completed electronic component can be moved to the unloading portion 121 b of the second temperature adjustment loading plate 121.

The recovery board 150 is located in the recovery area RA for recovering the electronic components that have been tested. The purpose of the recovery board 150 is to recover the unloading position UP from the test area TA to the recovery area RA by the second temperature adjustment loading plate 121. Completed testing of electronic components. Therefore, the recovery board 150 is also configured to be capable of loading electronic components, and simply, the customer tray CT can replace the role of the recovery board 150. When the customer tray CT functions instead of the recovery plate 150, as in the second temperature adjustment loading plate 121 described above, it can be configured to be moved to the recovery position RP by a separate mover.

The second mover 160 moves the electronic component located at the unloading portion 121 b from the test area TA to the unloading position UP of the recovery area RA by the movement of the second temperature-adjusting loading plate 121 to the recovery plate 150 or the recovery plate 150. The electronic components are moved to the customer tray CT located in front of the recovery position RP. Obviously, in the case where the recovery plate 150 is constituted by the customer tray CT and adopts a structure capable of moving the customer tray CT to the forward recovery position RP by a separate mover, the second mover 160 only needs to have the electronic components removed from the second The temperature adjustment loading plate 121 may move to the function of the recovery plate 150.

The environment maintenance chamber 170 isolates the corresponding structure from external air in order to maintain a dry environment in the space where the first temperature adjustment loading plate 111, the second temperature adjustment loading plate 121, the thruster 142, and the test socket TS are located. In this embodiment, at least the head 141 and the propeller of the first temperature adjustment loading plate 111, the second temperature adjustment loading plate 121, the first mover 130, the connector 140 are housed inside the environment maintenance chamber 170. 142. The recovery board 150, the second mover 160, and the test socket TS. However, the environment maintaining chamber 170 in the present invention is not provided for cooling the space inside, but is provided for providing a dry space inside, which is greatly different from the prior art in this regard. This environment maintenance chamber 170 has an opening / closing door 171, a supply hole SH, and a recovery hole RH.

The opening / closing door 171 is provided to maintain the inside of the chamber 170 by an operator's opening and closing environment, and is provided as a double door.

The first door 171a can open and close a large first open area.

The second door 171b is provided near the center of the first door 171a and can open and close a second open area smaller than the first open area.

That is, in the case where manual work is required inside the environment maintenance chamber 170 due to clogging or the like, the operator may selectively open the first door 171a according to the degree of manual work, or open only to the operator Arm-sized second door 171b. At this time, when only the second door 171b is opened, the operator needs to visually check the inside of the environment maintenance chamber 170. Therefore, it is necessary to use a transparent panel such as glass to form the space between the first door 171a and the second door 171b. part. In addition, when the second door 171b is opened, in order to minimize the loss of cold air in the environment maintenance chamber 170, a separate air curtain capable of forming an air film may be formed, or a high-density block or formation with a filament may be used in the form of a brush. Other blocking parts to allow the arm to enter but block the outflow of cold air to the greatest extent.

For reference, the number of the opening and closing doors 171 is preferably provided at a desired position.

The supply hole SH provides a passage capable of moving the customer tray CT located in the stacking section SKP to the supply position SP.

The recovery hole RH provides a passage through which the customer tray CT located at the recovery position RP can be moved to the stacking section SKP.

Obviously, the supply holes SH or the recovery holes RH can be formed in an appropriate number according to the capacity of the sorting machine 100 or the form of other implementation structures.

For reference, even if the environment maintenance chamber 170 is provided, as in this embodiment, a test chamber TC for forming a separate test chamber in the test area TA may be provided. Furthermore, it can be considered preferably to separate the supply area SA and the recovery area RA by a separate blocking film.

The first shutter 181 opens and closes the supply hole SH.

The second shutter 182 opens and closes the recovery hole RH.

Similarly, in addition to the first shutter 181 and the second shutter 182, a unit for forming a separate air curtain when the supply hole SH and the recovery hole RH are opened may be provided.

Obviously, the above-mentioned first shutters 181 and second shutters 182 are provided in a number corresponding to the number of the supply holes SH and the recovery holes RH.

The humidity measurement sensor SS is used to measure the humidity inside the environment maintenance chamber 170, and is especially provided to measure the humidity of the supply area SA and the test area TA that require precise adjustment of the degree of dryness to prevent the occurrence of dew or icing. In particular, the humidity of the space in which the first temperature-adjusting loading plate 111 and the second temperature-adjusting loading plate 121 are important, and therefore the humidity measurement sensor SS is preferably provided in the first temperature-adjusting loading plate 111 and the second temperature-adjusting Use the mounting plate 121 nearby. Here, it is considered that the humidity measurement sensor SS provided on the second temperature adjustment loading plate 121 is preferably provided so as to be movable together with the second temperature adjustment loading plate 121.

The dryer 190 is provided to supply dry air to the inside of the environment maintenance chamber 170. Such a dryer 190 may be configured as a mobile circuit that moves dry air from an external supplier to the inside of the environmental maintenance chamber 170. As in this embodiment, the dryer 100 may be configured to generate dry air. Here, the supply part of the dry air supplied to the inside of the environment maintenance chamber 170 by the dryer 190 is preferably located in the supply area SA and the test area TA. As described above, in the present invention, it can be seen that the dry air supplied by the dryer 190 is supplied through the loader 110 located in the supply area SA and the shuttle portion 120 whose at least a part is always located in the test area TA. In addition, the sorting machine 100 according to the present invention supplies dry air to a fixed portion C of the test area TA that is most sensitive to test conditions through a separate spray nozzle, and constitutes a separate test chamber TC for efficiency. Therefore, the test area TA has a higher pressure than the adjacent recovery area RA, and therefore the humid air in the recovery area RA can be prevented from entering the test area TA to the greatest extent by the difference in air pressure between the two areas.

Further explanation is the reason why the aforementioned dryer 190 is required. Generally, the dew phenomenon occurs due to a decrease in the temperature of the atmosphere and a decrease in the amount of saturated water vapor in the atmosphere. In particular, the dew condensation that occurs at a temperature below zero is frozen and a icing phenomenon occurs. However, for a sorter capable of performing a low temperature test, the electronic components need to be rapidly cooled to an extremely low temperature of -10 ° C or lower, so the temperature of other structures is also kept very low. In the state as described above, the atmospheric temperature in the vicinity of the structure is also reduced, resulting in a very low amount of saturated water vapor. For example, the amount of saturated water vapor in the atmosphere at room temperature is 22.830 g / m ³ , but the amount of saturated water vapor in the atmosphere at minus 10 degrees is 2.156 / m ³ . Therefore, condensation and icing of water vapor may occur on the surface of electronic components, structures, etc., and the device may not be driven, or the device may be seriously damaged. Therefore, the present invention has been achieved through continuous experimentation and research.

The cooler CA supplies cooling fluid to the first temperature-adjusting loading plate 111, the second temperature-adjusting loading plate 121, and the propeller 142. Similarly, the cooling module of the cooler CA is provided in the sorting machine 100 itself, or it can be separately installed in a factory system according to implementation. If the cooling module and the sorting machine 100 are separately provided, the concept of the cooler CA provided in the sorting machine 100 can be interpreted as a cooling flow path that moves a cooling fluid from an external cooling module to a desired position.

The controller MA controls a structure to be controlled among the above-mentioned structures. In particular, the controller MA controls the dryer 190 according to the humidity information measured by the humidity measurement sensor SS, thereby adjusting the supply amount of dry air, and controls the first shutter in order to minimize the loss of cold air inside the environmental maintenance chamber 170. The 181 and the second shutter 182 open the supply hole SH or the recovery hole RH only when the customer tray CT moves through the supply hole SH or the recovery hole RH. The controller MA adjusts the degree of cooling or the degree of heating based on the temperature information of the loading portion 121 a of the first temperature adjustment loading plate 111, the loading portion 121 a of the second temperature adjustment loading plate 121, the propeller 142, and the electronic components, respectively.

In addition, the stacking section SKP includes a supply stacker PS for supplying the customer tray CT to the supply position SP, and a recovery stacker RS for recovering the customer tray CT from the recovery position RP.

The description of the sorter 100 having the above-described configuration will be continued.

The customer trays CT located in the supply stacker PS are sequentially supplied to the supply position SP one sheet at a time. At this time, in the procedure of moving the customer tray CT, the first shutter 181 opens the supply hole SH, and closes the supply hole SH if the customer tray CT enters the inside of the environment maintenance chamber 170.

The first mover 130 moves the electronic components from the customer tray CT of the supply position SP to the first temperature adjustment loading plate 111. Therefore, the electronic components mounted on the first temperature-adjusting loading plate 111 are cooled by coming into contact with the first temperature-adjusting loading plate 111 in a state cooled by the cooler CA.

When the electronic component is loaded on the first temperature-adjusting loading plate 111, the first mover 130 moves the pre-cooled electronic component from the first temperature-adjusting loading plate 111 to the second temperature-adjusting loading plate at the loading position LP. 121 的 装 部 121a。 121 loading portion 121a. When the electronic component is loaded on the loading portion 121a, the second temperature-adjusting loading plate 121 is moved to the right by the movement source 128, so that the second temperature-adjusting loading plate 121 is positioned at the test position TP. Then, the connector 140 is operated, and the pusher 142 is used to hold the electronic component under vacuum from the loading portion 121a. Then, the electronic components held by the pusher 142 are electrically connected by the actions of the vertical mover 144 and the horizontal mover 145. For test socket TS. Obviously, the loading portion 121a and the thruster 142 are cooled by the cooler CA to a temperature that meets the test conditions, and therefore, in this movement procedure, the electronic components do not depart from the temperature that meets the test conditions. In the test procedure, heat may be generated in the electronic component, but the controller MA controls the cooler CA to maintain the electronic component at a desired temperature condition.

When the test of the electronic component is completed, the connector 140 moves the electronic component to the unloading position 121 b of the second temperature adjustment loading plate 121 located at the test position TP. At this time, since the loading portion 121a of the second temperature-adjusting loading plate 121 is located at the loading position LP, the electronic component to be tested in the next step is loaded to the loading portion 121a. When the tested electronic component is loaded on the unloading portion 121b, the second temperature-adjusting loading plate 121 moves to the right to move the unloading portion 121b to the unloading position UP, and the second mover 160 moves the electronic component from the unloading portion 121b. To the recovery plate 150. Then, the electronic components located on the collection board 150 are moved to the customer tray CT of the collection position RP located forward by the second mover 160. At this time, the electronic components that have completed the test can be moved in a graded manner according to the test results. Next, if the electronic component fills the customer tray CT located at the recycling position RP, the second shutter 182 operates to open the recycling hole RH, and the customer tray CT moves from the recycling position RP to the recycling stacker RS.

In addition, in the procedure of performing the test while continuously performing the movement and test of the electronic components as described above, the humidity sensor SS continuously measures the interior of the environment maintenance chamber 170 (more specifically, the first in the supply area) at predetermined time intervals. Near the temperature-adjusting loading plate and near the second temperature-adjusting loading plate in the test area), and the controller MA adjusts the amount of dry air based on the corresponding information, and supplies dry air to the above portion. Obviously, the inside of the environmental maintenance chamber 170 can maintain a required degree of dryness due to the supply of dry air.

Furthermore, the inside of the environment maintenance chamber 170 in which the dry air is continuously supplied by the dryer 190 is maintained at a higher pressure than the outside. Therefore, the internal air of the environment maintenance chamber 170 flows out through the supply hole SH, the recovery hole RH, or other parts that cannot be closed, which can serve to block the flow of external air into the interior.

In addition, most of the dry air is injected into the supply area SA and the test area TA. Therefore, the supply area SA and the test area TA that need to be precisely adjusted for dryness have a higher pressure than the recovery area RA. Therefore, in the case where the supply area SA and the recovery area RA are blocked by each other by the blocking film, the air mainly moves from the supply area SA and the test area TA to the recovery area RA that does not require a high degree of drying accuracy due to the pressure difference. It is therefore possible to prevent the air of the recovery area RA from affecting the air of the supply area SA, and this becomes the reason that the dryness of the supply area SA can be accurately controlled.

In addition, the dryer 190 supplies dry air between the outer piping 122a and the inner piping 122b of the cooling pipe 122 provided as a double pipe, thereby preventing damage to the cooling pipe 122 described above.

[Modification]

In the above embodiment, the second temperature adjustment loading plate 121 included in the shuttle 120 is divided into a loading portion 121a and an unloading portion 121b, and the second heater 122 as a heating element and the cooling element 122 The cooling pipe 127 heats or cools all of the loading portion 121a and the unloading portion 121b.

However, as shown in FIG. 10, the shuttle part 120 may be deformed and provided.

10, the second heater 122 is provided to heat both the loading portion 121a and the unloading portion 121b, but the cooling pipe 127 is provided to cool only the loading portion 121a. Therefore, the loading portion 121 a may be heated or cooled by the second heater 122 and the cooling pipe 127, but the unloading portion 121 b may be heated only by the second heater 122. The reason for realizing such a modification will be described below.

Generally, the test types of electronic components include high temperature test, normal temperature test, and low temperature test.

In the high-temperature test, the test needs to be performed while the electronic component is maintained at a high temperature, and in the low-temperature test, the test is required to be performed while the electronic component is maintained at a low temperature. In the normal temperature test, the test is performed while the electronic component is maintained at a normal temperature. Therefore, except for special conditions, the second heater 122 and the cooling pipe 127 are used only for a high temperature test or a low temperature test.

In most cases, the finished electronic components are unloaded by means of a picker. At this time, in order to perform an appropriate unloading operation without causing damage to the pickup or the electronic component, it is necessary to cool the high-temperature electronic component and heat the low-temperature electronic component.

First, for the low temperature test, the loading portion 121 a must be cooled, and for accurate temperature control, the loading portion 121 a needs to be able to be heated by the second heater 122. In addition, the unloading portion 121b can be heated by the second heater 122, so that the temperature of the electronic component mounted can be increased.

If the electronic component loaded in the unloading portion 121b is not heated to near normal temperature, frost is generated and the picking operation of the picker following the operation of the second mover 160 is hindered, or problems such as generation of picking marks may occur.

Therefore, in the low-temperature test, both the cooling and heating of the loading portion 121a are required, but the unloading portion 121b only needs to be heated.

In addition, the loading portion 121a needs to be heated for high temperature testing, and occasionally needs to be cooled for accurate temperature control. However, depending on the device, the degree of high temperature may be reflected as a relatively low temperature (100 degrees +/- 50 degrees), and in this case, there is no need to cool the electronic components for unloading work.

Therefore, during the high temperature test, both the heating and cooling of the loading portion 121a are required, but the cooling of the unloading portion 121b is not required depending on the device.

That is, in a case where the device is configured to perform a low temperature test and a high temperature test, both the cooling site and the heating site 121 a need to be cooled. However, depending on the device, the unloading portion 121b needs to be heated only during the cooling test and does not need to be cooled. Therefore, a separate cooling element for cooling the unloading portion 121b may not be provided. In this case, under the control of the test mode, the unloading portion 121b can only be heated.

The sorting machine according to the above-mentioned embodiment adopts a simple structure for clarity of explanation, but according to the processing capacity, the loader 110, the shuttle 120, the first mover 130, the recovery plate 150, the second mover 160, and the supply hole SH And multiple recovery holes RH can be provided.

Further, in the above-mentioned embodiment, the loading portion 121a and the unloading portion 121b are arranged in different areas on a second temperature-adjusting loading plate 121 and moved together. However, depending on the implementation, the loading portion 121a and the unloading portion 121b may be configured to be arranged. Move independently on a separate board with the aid of a separate source of movement. That is, two second temperature adjustment loading plates may be configured, one second temperature adjustment loading plate may have a loading portion 121a, and the other second temperature adjustment loading plates may have a unloading portion 121b.

That is, the above-mentioned embodiments are only the most basic examples of the present invention, so the present invention should not be understood as being limited to the above-mentioned embodiments, and the scope of rights of the present invention should be understood as the scope of patent application and its equivalent scope.

100‧‧‧ Sorter for testing electronic components

TSP‧‧‧Test Support Department

SKP‧‧‧Stacking Department

110‧‧‧Loader

111‧‧‧ the first temperature adjustment loading plate

112‧‧‧The first heater

113‧‧‧The first temperature measurement sensor

114‧‧‧First Split

115‧‧‧Mask wall

115c‧‧‧jet hole

120‧‧‧ Shuttle Department

121‧‧‧ second temperature adjustment loading plate

122‧‧‧Second heater

123‧‧‧Second temperature measurement sensor

124‧‧‧Second Split

125‧‧‧Mask wall

126‧‧‧ substrate

127‧‧‧cooling pipe

127a‧‧‧Outside piping

127b‧‧‧Outside piping

130‧‧‧The first mover

140‧‧‧ connector

142‧‧‧ Pusher

TW‧‧‧ Fluid Path

143‧‧‧cooling pipe

HD‧‧‧Heating element

TD ₁ ‧‧‧The first temperature measuring element

TD ₂ ‧‧‧Second temperature measuring element

150‧‧‧Recycling board

160‧‧‧Second Mover

170‧‧‧Environment maintenance chamber

171‧‧‧Opening and closing doors

171a‧‧‧first door

171b‧‧‧Second Door

SH‧‧‧ supply hole

SS‧‧‧Humidity measurement sensor

181‧‧‧The first shutter

190‧‧‧ dryer

CA‧‧‧Cooler

MA‧‧‧ Controller

SP‧‧‧ Supply location

RH‧‧‧ Recovery hole

FIG. 1 is a schematic perspective view of a sorter for testing electronic components according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of the sorter for testing electronic components of FIG. 1. FIG.

3 is a schematic cut-away perspective view of a stacker applied to the sorter of FIG. 1.

FIG. 4 is a schematic side view of the loader of FIG. 3.

FIG. 5 is a schematic cut-away view of a shuttle section applied to the sorting machine of FIG. 1.

Fig. 6 is another example of a stacker that can be applied to the sorting machine of Fig. 1.

FIG. 7 is a cut-away view of a cooling pipe applied to the shuttle portion of FIG. 5.

FIG. 8 is a schematic cut-away view of a connected machine applied to the sorting machine of FIG. 2.

FIG. 9 is a schematic cut-away perspective view of a pusher applied to the connector of FIG. 8.

FIG. 10 is a schematic cut-away view of a modification example applied to the shuttle portion of FIG. 5.

Domestic storage information (please note in order of storage organization, date, and number)
no

Information on foreign deposits (please note according to the order of the country, institution, date, and number)
no

Claims (5)

A sorting machine for testing electronic components, including: The test support unit supports testing of electronic components; the stacking unit supplies to the test support department a customer tray loaded with the electronic components to be tested and recycles the customer tray loaded with the completed electronic components. The test support department includes: loading And a first temperature-adjusting loading plate capable of adjusting the temperature of the loaded electronic component in a supply area for supplying electronic components to a test area; and a shuttle section passing through the first temperature-adjusting loading plate and The passed electronic component is moved to the test area, or the completed electronic component is moved from the test area to the recycling area, and has a second temperature-adjusting loading plate for adjusting the temperature of the loaded electronic component; at least one first mover, so that Moving the electronic component to be tested from a customer tray that has reached the supply position from the stacking section to the first temperature-adjusting loading plate or moving the electronic component from the first temperature-adjusting loading plate to the second A temperature-adjusting loading plate; a connector that connects the second temperature-adjusting loading plate from the supply The electronic components moved from the area to the test area are electrically connected to the tester so that the electronic components can be tested by the tester; a recycling board is located in the recycling area for recycling The electronic component that completes the test when the test area arrives at the unloading position of the recycling area; at least one second mover moves the electronic component moved to the recycling area by the second temperature-adjusting loading plate to the recycling plate; An environment maintenance chamber for maintaining a dry environment in a space in which the first temperature-adjusting loading plate and the second temperature-adjusting loading plate exist, and having at least one supply hole, the at least one supply hole provides loading A passage for a customer tray with electronic components to be tested moved from the stacking section; a cooler that supplies a cooling fluid to cool the first temperature-adjusting loading plate and the second temperature-adjusting loading plate; a controller, A controller controlling the cooler, wherein the first temperature-adjusting loading plate and the second temperature The loading plate for adjustment can separately load electronic components, and adjust the temperature of the loaded electronic components by conduction, and has a cooling path that functions as a moving path through which a cooling fluid supplied by the cooler passes, wherein the loader also It includes: a first heater for applying heat to an electronic component mounted on the first temperature-adjusting loading plate; a first temperature measurement sensor for measuring a temperature of the first temperature-adjusting loading plate; a separator Fixing the first temperature-adjusting loading plate to a predetermined distance from the base surface; and a shield wall surrounding the first temperature-adjusting loading plate so as to be separated from the first temperature-adjusting loading plate. The lower end and the side end are provided separately so as to minimize the influence of air around the first temperature-adjusting loading plate on the electronic components loaded on the first temperature-adjusting loading plate, wherein the shuttle portion The method further includes a second heater for applying heat to an electronic component mounted on the second temperature adjustment loading plate, and a second temperature measurement sensor for measuring the second temperature adjustment. The temperature of the loading plate, wherein the controller controls the cooler, the first heater, and the second heater according to the information measured by the first temperature measurement sensor and the second temperature measurement sensor Thus, the temperatures of the first temperature-adjusting loading plate and the second temperature-adjusting loading plate are adjusted. A sorting machine for testing electronic components, as in item 1, wherein A spray hole is formed in the mask wall, and the spray hole sprays dry air supplied to a separated portion between the mask wall and the first temperature-adjusting loading plate to the surroundings. A sorting machine for testing electronic components, including: The test support unit supports testing of electronic components; the stacking unit supplies to the test support department a customer tray loaded with the electronic components to be tested and recycles the customer tray loaded with the completed electronic components. The test support department includes: loading And a first temperature-adjusting loading plate capable of adjusting the temperature of the loaded electronic component in a supply area for supplying electronic components to a test area; and a shuttle section passing through the first temperature-adjusting loading plate and The passed electronic component is moved to the test area, or the completed electronic component is moved from the test area to the recycling area, and has a second temperature-adjusting loading plate for adjusting the temperature of the loaded electronic component; at least one first mover, so that Moving the electronic component to be tested from a customer tray that has reached the supply position from the stacking section to the first temperature-adjusting loading plate or moving the electronic component from the first temperature-adjusting loading plate to the second A temperature-adjusting loading plate; a connector that connects the second temperature-adjusting loading plate from the supply The electronic components moved from the area to the test area are electrically connected to the tester so that the electronic components can be tested by the tester; a recycling board is located in the recycling area for recycling The electronic component that completes the test when the test area comes to the unloading position of the recycling area; at least one second mover moves the electronic component moved to the recycling area by the second temperature-adjusting loading plate to the recycling plate; An environment maintenance chamber for maintaining a dry environment in a space in which the first temperature-adjusting loading plate and the second temperature-adjusting loading plate exist, and having at least one supply hole, the at least one supply hole provides loading A passage for a customer tray with electronic components to be tested moved from the stacking section; a cooler that supplies a cooling fluid to cool the first temperature-adjusting loading plate and the second temperature-adjusting loading plate; a controller, A controller controlling the cooler, wherein the first temperature-adjusting loading plate and the second temperature The loading plate for adjustment can separately load electronic components, and adjust the temperature of the loaded electronic components by conduction, and has a cooling path that functions as a moving path through which a cooling fluid supplied by the cooler passes, wherein the loader also It includes: a first heater for applying heat to an electronic component mounted on the first temperature-adjusting loading board; a first temperature measurement sensor for measuring a temperature of the first temperature-adjusting loading board; The shuttle unit further includes: a second heater that applies heat to an electronic component mounted on the second temperature-adjusting loading plate; and a second temperature measurement sensor for measuring the temperature of the second temperature-adjusting loading plate. Temperature; the substrate is provided so that it can be moved by a moving source; the separator fixes the second temperature-adjusting loading plate so as to be separated from the substrate by a predetermined distance; the cover wall is at the second temperature The periphery of the loading plate for adjustment is provided so as to be separated from the lower and side ends of the loading plate for second temperature adjustment, thereby minimizing the loading for the second temperature adjustment The influence of the air around the board on the electronic components mounted on the second temperature-adjusting loading board, The controller controls the cooler, the first heater, and the second heater according to information measured by the first temperature measurement sensor and the second temperature measurement sensor, thereby adjusting the The temperature of the first temperature-adjusting loading plate and the second temperature-adjusting loading plate. A sorting machine for testing electronic components as in item 3, where A spray hole is formed in the shield wall, and the spray hole sprays the dry air supplied to the spaced portion between the second temperature-adjusting loading plate and the substrate to the surroundings. A sorting machine for testing electronic components, including: The test support unit supports testing of electronic components; the stacking unit supplies to the test support department a customer tray loaded with the electronic components to be tested and recycles the customer tray loaded with the completed electronic components. The test support department includes: loading And a first temperature-adjusting loading plate capable of adjusting the temperature of the loaded electronic component in a supply area for supplying electronic components to a test area; and a shuttle section passing through the first temperature-adjusting loading plate and The passed electronic component is moved to the test area, or the completed electronic component is moved from the test area to the recycling area, and has a second temperature-adjusting loading plate for adjusting the temperature of the loaded electronic component; at least one first mover, so that Moving the electronic component to be tested from a customer tray that has reached the supply position from the stacking section to the first temperature-adjusting loading plate or moving the electronic component from the first temperature-adjusting loading plate to the second A temperature-adjusting loading plate; a connector that connects the second temperature-adjusting loading plate from the supply The electronic components moved from the area to the test area are electrically connected to the tester so that the electronic components can be tested by the tester; a recycling board is located in the recycling area for recycling The electronic component that completes the test when the test area arrives at the unloading position of the recycling area; at least one second mover moves the electronic component moved to the recycling area by the second temperature-adjusting loading plate to the recycling plate; An environment maintenance chamber for maintaining a dry environment in a space in which the first temperature-adjusting loading plate and the second temperature-adjusting loading plate exist, and having at least one supply hole, the at least one supply hole provides loading A passage for a customer tray with electronic components to be tested moved from the stacking section; a cooler that supplies a cooling fluid to cool the first temperature-adjusting loading plate and the second temperature-adjusting loading plate; a controller, A controller controlling the cooler, wherein the first temperature-adjusting loading plate and the second temperature The loading plate for adjustment can separately load electronic components, and adjust the temperature of the loaded electronic components by conduction, and has a cooling path that functions as a moving path through which a cooling fluid supplied by the cooler passes, wherein the loader also The method includes: a first heater for applying heat to an electronic component mounted on the first temperature-adjusting loading board; a first temperature measurement sensor for measuring a temperature of the first temperature-adjusting loading board; The shuttle unit further includes: a second heater that applies heat to an electronic component mounted on the second temperature-adjusting loading plate; and a second temperature measurement sensor for measuring the temperature of the second temperature-adjusting loading plate. Temperature; a cooling unit for cooling the second temperature-adjusting loading plate; a heating unit for heating the second temperature-adjusting loading plate, The controller controls the cooler, the first heater, and the second heater according to information measured by the first temperature measurement sensor and the second temperature measurement sensor, thereby adjusting the The temperature of the first temperature-adjusting loading plate and the second temperature-adjusting loading plate, wherein the second temperature-adjusting loading plate includes: Loading part, loading the electronic components to be tested; Unloading part, loading the tested electronic components, The cooling unit cools the loading site, and the heating unit heats the loading site and the unloading site. Therefore, the unloading site can only be heated.