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JPS6342142A - ウエ−ハ取扱いア−ム - Google Patents

ウエ−ハ取扱いア−ム

Info

Publication number
JPS6342142A
JPS6342142A JP62102139A JP10213987A JPS6342142A JP S6342142 A JPS6342142 A JP S6342142A JP 62102139 A JP62102139 A JP 62102139A JP 10213987 A JP10213987 A JP 10213987A JP S6342142 A JPS6342142 A JP S6342142A
Authority
JP
Japan
Prior art keywords
arm
cam
wafer
module
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62102139A
Other languages
English (en)
Japanese (ja)
Inventor
リチャード・エス・ワインバーグ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of JPS6342142A publication Critical patent/JPS6342142A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP62102139A 1986-04-28 1987-04-27 ウエ−ハ取扱いア−ム Pending JPS6342142A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85674986A 1986-04-28 1986-04-28
US856749 1986-04-28

Publications (1)

Publication Number Publication Date
JPS6342142A true JPS6342142A (ja) 1988-02-23

Family

ID=25324414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62102139A Pending JPS6342142A (ja) 1986-04-28 1987-04-27 ウエ−ハ取扱いア−ム

Country Status (4)

Country Link
JP (1) JPS6342142A (de)
KR (1) KR880003395A (de)
DE (1) DE3714045A1 (de)
GB (2) GB8709064D0 (de)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0294647A (ja) * 1988-09-30 1990-04-05 Kokusai Electric Co Ltd ウェーハ処理装置
JPH0297035A (ja) * 1988-05-24 1990-04-09 Balzers Ag 真空処理装置及びそれによるワーク処理方法
JPH03505946A (ja) * 1988-06-17 1991-12-19 アドヴァンスド、セミコンダクター・マテリアルズ・アメリカ・インコーポレーテッド ベルヌーイのピックアップを備えるウエーハ取り扱いシステム
JPH06188304A (ja) * 1992-12-17 1994-07-08 Furukawa Electric Co Ltd:The リングフレーム自動洗浄装置
JPH0727168A (ja) * 1992-04-28 1995-01-27 Gencorp Inc 予めパツケージ化した弾性ゴム支持体用流体ダンパー製品と、その形成および取付け方法
USRE45772E1 (en) 2006-07-20 2015-10-20 Kawasaki Jukogyo Kabushiki Kaisha Wafer transfer apparatus and substrate transfer apparatus
JP2019195069A (ja) * 2013-01-18 2019-11-07 パーシモン テクノロジーズ コーポレイションＰｅｒｓｉｍｍｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ， Ｃｏｒｐ． 不等リンク長を有するアームを有するロボット
US11491640B2 (en) 2013-01-18 2022-11-08 Persimmon Technologies Corporation Robot having arm with offset
US11691268B2 (en) * 2015-03-12 2023-07-04 Persimmon Technologies Corporation Robot having a variable transmission ratio

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3704505A1 (de) * 1987-02-13 1988-08-25 Leybold Ag Einlegegeraet fuer vakuumanlagen
DE3716549A1 (de) * 1987-05-17 1988-12-08 Leitz Ernst Gmbh Handhabungsautomat fuer plattenfoermige objekte
DE3717628A1 (de) * 1987-05-26 1988-12-15 Loehr & Herrmann Gmbh Vorrichtung zum ein- und ausgeben von leiterplatten in geschlitzte wechselpaletten
EP0322205A3 (de) * 1987-12-23 1990-09-12 Texas Instruments Incorporated Automatische photolithographische Behandlungskammer
DE3822598C2 (de) * 1988-07-04 1997-09-04 Siemens Ag Justieranordnung und Verfahren zum Justieren einer Greifvorrichtung eines Roboterarms zum Handhaben einer Halbleiterscheibe
US5064340A (en) * 1989-01-20 1991-11-12 Genmark Automation Precision arm mechanism
JPH0793348B2 (ja) * 1989-05-19 1995-10-09 アプライド マテリアルズ インコーポレーテッド 多重チャンバ真空式処理装置及び多重チャンバ真空式半導体ウェーハ処理装置
US5241183A (en) * 1991-03-22 1993-08-31 Nippon Telegraph And Telephone Corporation Vertical xy stage
JP2751975B2 (ja) * 1991-12-20 1998-05-18 株式会社日立製作所 半導体処理装置のロードロック室
CH686445A5 (de) * 1992-10-06 1996-03-29 Balzers Hochvakuum Kammer und Kammerkombination fuer eine Vakuumanlage und Verfahren zum Durchreichen mindestens eines Werkstueckes.
DE4235676C2 (de) * 1992-10-22 1997-08-28 Balzers Hochvakuum Vakuumkammer zum Transport scheibenförmiger Werkstücke in einer Vakuumanlage
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
JPH06204316A (ja) * 1992-12-28 1994-07-22 Mitsubishi Electric Corp 耐熱ロボットハンド
DE4336792A1 (de) * 1993-10-28 1995-05-04 Leybold Ag Vorrichtung für den Transport von Werkstücken in Vakuumbeschichtungsanlagen
DE4430846C2 (de) * 1994-08-31 1997-04-10 Jenoptik Jena Gmbh Einrichtung zur Umsetzung eines Transportobjektes zwischen zwei Endlagen
DE4430844C1 (de) * 1994-08-31 1996-02-22 Jenoptik Technologie Gmbh Beschickungseinrichtung für Halbleiterbearbeitungsanlagen
DE19812670A1 (de) * 1998-03-23 1999-10-07 Singulus Technologies Ag Vorrichtung zum Transport von Substraten
US6277753B1 (en) 1998-09-28 2001-08-21 Supercritical Systems Inc. Removal of CMP residue from semiconductors using supercritical carbon dioxide process
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
JP3883929B2 (ja) 2001-09-25 2007-02-21 大日本スクリーン製造株式会社 薄膜形成装置および薄膜形成方法
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
US7789971B2 (en) 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
CN101929535A (zh) * 2009-10-29 2010-12-29 浙江大学 利用凸轮和平面带实现平面往复运动的方法及装置
KR102145848B1 (ko) * 2018-11-02 2020-08-19 세메스 주식회사 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0297035A (ja) * 1988-05-24 1990-04-09 Balzers Ag 真空処理装置及びそれによるワーク処理方法
JPH03505946A (ja) * 1988-06-17 1991-12-19 アドヴァンスド、セミコンダクター・マテリアルズ・アメリカ・インコーポレーテッド ベルヌーイのピックアップを備えるウエーハ取り扱いシステム
JPH0294647A (ja) * 1988-09-30 1990-04-05 Kokusai Electric Co Ltd ウェーハ処理装置
JPH0727168A (ja) * 1992-04-28 1995-01-27 Gencorp Inc 予めパツケージ化した弾性ゴム支持体用流体ダンパー製品と、その形成および取付け方法
JPH06188304A (ja) * 1992-12-17 1994-07-08 Furukawa Electric Co Ltd:The リングフレーム自動洗浄装置
USRE48792E1 (en) 2006-07-20 2021-10-26 Kawasaki Jukogyo Kabushiki Kaisha Wafer transfer apparatus and substrate transfer apparatus
USRE46465E1 (en) 2006-07-20 2017-07-04 Kawasaki Jukogyo Kabushiki Kaisha Wafer transfer apparatus and substrate transfer apparatus
USRE47145E1 (en) 2006-07-20 2018-11-27 Kawasaki Jukogyo Kabushiki Kaisha Wafer transfer apparatus and substrate transfer apparatus
USRE47909E1 (en) 2006-07-20 2020-03-17 Kawasaki Jukogyo Kabushiki Kaisha Wafer transfer apparatus and substrate transfer apparatus
USRE48031E1 (en) 2006-07-20 2020-06-02 Kawasaki Jukogyo Kabushiki Kaisha Wafer transfer apparatus and substrate transfer apparatus
USRE45772E1 (en) 2006-07-20 2015-10-20 Kawasaki Jukogyo Kabushiki Kaisha Wafer transfer apparatus and substrate transfer apparatus
USRE49671E1 (en) 2006-07-20 2023-09-26 Kawasaki Jukogyo Kabushiki Kaisha Wafer transfer apparatus and substrate transfer apparatus
JP2019195069A (ja) * 2013-01-18 2019-11-07 パーシモン テクノロジーズ コーポレイションＰｅｒｓｉｍｍｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ， Ｃｏｒｐ． 不等リンク長を有するアームを有するロボット
JP2021088055A (ja) * 2013-01-18 2021-06-10 パーシモン テクノロジーズ コーポレイションＰｅｒｓｉｍｍｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ， Ｃｏｒｐ． 不等リンク長を有するアームを有するロボット
US11491640B2 (en) 2013-01-18 2022-11-08 Persimmon Technologies Corporation Robot having arm with offset
US11787042B2 (en) 2013-01-18 2023-10-17 Persimmon Technologies Corporation Robot having arm with end effector having bend portion
US11691268B2 (en) * 2015-03-12 2023-07-04 Persimmon Technologies Corporation Robot having a variable transmission ratio

Also Published As

Publication number Publication date
KR880003395A (ko) 1988-05-16
DE3714045A1 (de) 1987-11-05
GB8709595D0 (en) 1987-05-28
GB8709064D0 (en) 1987-05-20
GB2193482A (en) 1988-02-10

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