KR880003395A - 웨이퍼 취급 아암 - Google Patents
웨이퍼 취급 아암 Download PDFInfo
- Publication number
- KR880003395A KR880003395A KR870004070A KR870004070A KR880003395A KR 880003395 A KR880003395 A KR 880003395A KR 870004070 A KR870004070 A KR 870004070A KR 870004070 A KR870004070 A KR 870004070A KR 880003395 A KR880003395 A KR 880003395A
- Authority
- KR
- South Korea
- Prior art keywords
- cam
- arm
- arm member
- path
- semiconductor substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85674986A | 1986-04-28 | 1986-04-28 | |
| US856749 | 1986-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR880003395A true KR880003395A (ko) | 1988-05-16 |
Family
ID=25324414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR870004070A KR880003395A (ko) | 1986-04-28 | 1987-04-28 | 웨이퍼 취급 아암 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS6342142A (de) |
| KR (1) | KR880003395A (de) |
| DE (1) | DE3714045A1 (de) |
| GB (2) | GB8709064D0 (de) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3704505A1 (de) * | 1987-02-13 | 1988-08-25 | Leybold Ag | Einlegegeraet fuer vakuumanlagen |
| DE3716549A1 (de) * | 1987-05-17 | 1988-12-08 | Leitz Ernst Gmbh | Handhabungsautomat fuer plattenfoermige objekte |
| DE3717628A1 (de) * | 1987-05-26 | 1988-12-15 | Loehr & Herrmann Gmbh | Vorrichtung zum ein- und ausgeben von leiterplatten in geschlitzte wechselpaletten |
| EP0322205A3 (de) * | 1987-12-23 | 1990-09-12 | Texas Instruments Incorporated | Automatische photolithographische Behandlungskammer |
| ES2163388T3 (es) * | 1988-05-24 | 2002-02-01 | Unaxis Balzers Ag | Instalacion de vacio. |
| WO1989012907A1 (en) * | 1988-06-17 | 1989-12-28 | Epsilon Technology, Inc. | Wafer handling system with bernoulli pick-up |
| DE3822598C2 (de) * | 1988-07-04 | 1997-09-04 | Siemens Ag | Justieranordnung und Verfahren zum Justieren einer Greifvorrichtung eines Roboterarms zum Handhaben einer Halbleiterscheibe |
| JP2545591B2 (ja) * | 1988-09-30 | 1996-10-23 | 国際電気株式会社 | ウェーハ処理装置 |
| US5064340A (en) * | 1989-01-20 | 1991-11-12 | Genmark Automation | Precision arm mechanism |
| JPH0793348B2 (ja) * | 1989-05-19 | 1995-10-09 | アプライド マテリアルズ インコーポレーテッド | 多重チャンバ真空式処理装置及び多重チャンバ真空式半導体ウェーハ処理装置 |
| US5241183A (en) * | 1991-03-22 | 1993-08-31 | Nippon Telegraph And Telephone Corporation | Vertical xy stage |
| JP2751975B2 (ja) * | 1991-12-20 | 1998-05-18 | 株式会社日立製作所 | 半導体処理装置のロードロック室 |
| CA2094208A1 (en) * | 1992-04-28 | 1993-10-29 | Richard D. Hein | Prepackaged fluid-damping article for elastomeric mounts and methods of formation and installation |
| CH686445A5 (de) * | 1992-10-06 | 1996-03-29 | Balzers Hochvakuum | Kammer und Kammerkombination fuer eine Vakuumanlage und Verfahren zum Durchreichen mindestens eines Werkstueckes. |
| DE4235676C2 (de) * | 1992-10-22 | 1997-08-28 | Balzers Hochvakuum | Vakuumkammer zum Transport scheibenförmiger Werkstücke in einer Vakuumanlage |
| US5516732A (en) * | 1992-12-04 | 1996-05-14 | Sony Corporation | Wafer processing machine vacuum front end method and apparatus |
| JP2801489B2 (ja) * | 1992-12-17 | 1998-09-21 | 古河電気工業株式会社 | リングフレーム自動洗浄装置 |
| JPH06204316A (ja) * | 1992-12-28 | 1994-07-22 | Mitsubishi Electric Corp | 耐熱ロボットハンド |
| DE4336792A1 (de) * | 1993-10-28 | 1995-05-04 | Leybold Ag | Vorrichtung für den Transport von Werkstücken in Vakuumbeschichtungsanlagen |
| DE4430846C2 (de) * | 1994-08-31 | 1997-04-10 | Jenoptik Jena Gmbh | Einrichtung zur Umsetzung eines Transportobjektes zwischen zwei Endlagen |
| DE4430844C1 (de) * | 1994-08-31 | 1996-02-22 | Jenoptik Technologie Gmbh | Beschickungseinrichtung für Halbleiterbearbeitungsanlagen |
| DE19812670A1 (de) * | 1998-03-23 | 1999-10-07 | Singulus Technologies Ag | Vorrichtung zum Transport von Substraten |
| US6277753B1 (en) | 1998-09-28 | 2001-08-21 | Supercritical Systems Inc. | Removal of CMP residue from semiconductors using supercritical carbon dioxide process |
| US6748960B1 (en) | 1999-11-02 | 2004-06-15 | Tokyo Electron Limited | Apparatus for supercritical processing of multiple workpieces |
| JP3883929B2 (ja) | 2001-09-25 | 2007-02-21 | 大日本スクリーン製造株式会社 | 薄膜形成装置および薄膜形成方法 |
| US7767145B2 (en) | 2005-03-28 | 2010-08-03 | Toyko Electron Limited | High pressure fourier transform infrared cell |
| US7789971B2 (en) | 2005-05-13 | 2010-09-07 | Tokyo Electron Limited | Treatment of substrate using functionalizing agent in supercritical carbon dioxide |
| JP4098338B2 (ja) | 2006-07-20 | 2008-06-11 | 川崎重工業株式会社 | ウェハ移載装置および基板移載装置 |
| CN101929535A (zh) * | 2009-10-29 | 2010-12-29 | 浙江大学 | 利用凸轮和平面带实现平面往复运动的方法及装置 |
| US9149936B2 (en) | 2013-01-18 | 2015-10-06 | Persimmon Technologies, Corp. | Robot having arm with unequal link lengths |
| KR20230062681A (ko) * | 2013-01-18 | 2023-05-09 | 퍼시몬 테크놀로지스 코포레이션 | 로봇, 전자 장치 처리 시스템, 기판 이송 방법 |
| KR20230124100A (ko) * | 2015-03-12 | 2023-08-24 | 퍼시몬 테크놀로지스 코포레이션 | 이송 장치 |
| KR102145848B1 (ko) * | 2018-11-02 | 2020-08-19 | 세메스 주식회사 | 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치 |
-
1987
- 1987-04-15 GB GB878709064A patent/GB8709064D0/en active Pending
- 1987-04-23 GB GB08709595A patent/GB2193482A/en not_active Withdrawn
- 1987-04-27 JP JP62102139A patent/JPS6342142A/ja active Pending
- 1987-04-28 DE DE19873714045 patent/DE3714045A1/de not_active Withdrawn
- 1987-04-28 KR KR870004070A patent/KR880003395A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| DE3714045A1 (de) | 1987-11-05 |
| GB8709595D0 (en) | 1987-05-28 |
| GB8709064D0 (en) | 1987-05-20 |
| GB2193482A (en) | 1988-02-10 |
| JPS6342142A (ja) | 1988-02-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |