DE69433361D1 - Herstellungsmethode von selbstmontierenden Mikrostrukturen - Google Patents
Herstellungsmethode von selbstmontierenden MikrostrukturenInfo
- Publication number
- DE69433361D1 DE69433361D1 DE69433361T DE69433361T DE69433361D1 DE 69433361 D1 DE69433361 D1 DE 69433361D1 DE 69433361 T DE69433361 T DE 69433361T DE 69433361 T DE69433361 T DE 69433361T DE 69433361 D1 DE69433361 D1 DE 69433361D1
- Authority
- DE
- Germany
- Prior art keywords
- self
- manufacturing
- assembling microstructures
- microstructures
- assembling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H01S5/00—Semiconductor lasers
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
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- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Led Devices (AREA)
- Weting (AREA)
- Die Bonding (AREA)
- Drying Of Semiconductors (AREA)
- Semiconductor Lasers (AREA)
- Optical Elements Other Than Lenses (AREA)
- Led Device Packages (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US169298 | 1993-12-17 | ||
US08/169,298 US5545291A (en) | 1993-12-17 | 1993-12-17 | Method for fabricating self-assembling microstructures |
PCT/US1994/014152 WO1995017005A1 (en) | 1993-12-17 | 1994-12-07 | Method for fabricating self-assembling microstructures |
Publications (2)
Publication Number | Publication Date |
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DE69433361D1 true DE69433361D1 (de) | 2004-01-08 |
DE69433361T2 DE69433361T2 (de) | 2004-09-16 |
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Application Number | Title | Priority Date | Filing Date |
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DE69433361T Expired - Lifetime DE69433361T2 (de) | 1993-12-17 | 1994-12-07 | Herstellungsmethode von selbstmontierenden Mikrostrukturen |
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Country | Link |
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US (2) | US5545291A (de) |
EP (3) | EP0734586B1 (de) |
JP (3) | JP3535166B2 (de) |
CN (3) | CN100466250C (de) |
AU (1) | AU681928B2 (de) |
CA (1) | CA2177276C (de) |
DE (1) | DE69433361T2 (de) |
WO (1) | WO1995017005A1 (de) |
Families Citing this family (384)
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US6569382B1 (en) | 1991-11-07 | 2003-05-27 | Nanogen, Inc. | Methods apparatus for the electronic, homogeneous assembly and fabrication of devices |
US5904545A (en) * | 1993-12-17 | 1999-05-18 | The Regents Of The University Of California | Apparatus for fabricating self-assembling microstructures |
US6864570B2 (en) * | 1993-12-17 | 2005-03-08 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
US5824186A (en) * | 1993-12-17 | 1998-10-20 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
US5674785A (en) * | 1995-11-27 | 1997-10-07 | Micron Technology, Inc. | Method of producing a single piece package for semiconductor die |
US6861290B1 (en) | 1995-12-19 | 2005-03-01 | Micron Technology, Inc. | Flip-chip adaptor package for bare die |
JP3097557B2 (ja) * | 1996-05-20 | 2000-10-10 | 日本電気株式会社 | 半導体装置の製造方法 |
GB9616540D0 (en) * | 1996-08-06 | 1996-09-25 | Cavendish Kinetics Ltd | Integrated circuit device manufacture |
US6507989B1 (en) | 1997-03-13 | 2003-01-21 | President And Fellows Of Harvard College | Self-assembly of mesoscale objects |
EP1064584B1 (de) | 1998-03-18 | 2004-05-19 | E Ink Corporation | Elektrophoretische anzeige |
US6391005B1 (en) | 1998-03-30 | 2002-05-21 | Agilent Technologies, Inc. | Apparatus and method for penetration with shaft having a sensor for sensing penetration depth |
USRE43112E1 (en) | 1998-05-04 | 2012-01-17 | Round Rock Research, Llc | Stackable ball grid array package |
CA2330950A1 (en) | 1998-05-12 | 1999-11-18 | E Ink Corporation | Microencapsulated electrophoretic electrostatically-addressed media for drawing device applications |
US6066513A (en) * | 1998-10-02 | 2000-05-23 | International Business Machines Corporation | Process for precise multichip integration and product thereof |
DE19856331B4 (de) * | 1998-12-07 | 2009-01-02 | Robert Bosch Gmbh | Verfahren zur Eingehäusung elektronischer Bauelemente |
US6312304B1 (en) | 1998-12-15 | 2001-11-06 | E Ink Corporation | Assembly of microencapsulated electronic displays |
US6850312B2 (en) * | 1999-03-16 | 2005-02-01 | Alien Technology Corporation | Apparatuses and methods for flexible displays |
KR100686784B1 (ko) * | 1999-02-05 | 2007-02-23 | 알리엔 테크놀로지 코포레이션 | 어셈블리를 형성하는 방법 및 장치 |
US6683663B1 (en) * | 1999-02-05 | 2004-01-27 | Alien Technology Corporation | Web fabrication of devices |
US6606079B1 (en) | 1999-02-16 | 2003-08-12 | Alien Technology Corporation | Pixel integrated circuit |
US6291896B1 (en) | 1999-02-16 | 2001-09-18 | Alien Technology Corporation | Functionally symmetric integrated circuit die |
US6380729B1 (en) | 1999-02-16 | 2002-04-30 | Alien Technology Corporation | Testing integrated circuit dice |
US6468638B2 (en) * | 1999-03-16 | 2002-10-22 | Alien Technology Corporation | Web process interconnect in electronic assemblies |
US6316278B1 (en) * | 1999-03-16 | 2001-11-13 | Alien Technology Corporation | Methods for fabricating a multiple modular assembly |
US6531997B1 (en) | 1999-04-30 | 2003-03-11 | E Ink Corporation | Methods for addressing electrophoretic displays |
US6504524B1 (en) | 2000-03-08 | 2003-01-07 | E Ink Corporation | Addressing methods for displays having zero time-average field |
US7030412B1 (en) | 1999-05-05 | 2006-04-18 | E Ink Corporation | Minimally-patterned semiconductor devices for display applications |
EP1196814A1 (de) | 1999-07-21 | 2002-04-17 | E Ink Corporation | Verwendung eines speicherkondensators zur verbesserung der leistung einer, von einer aktiven matrix gesteuerten elektronischen anzeige |
US6420266B1 (en) | 1999-11-02 | 2002-07-16 | Alien Technology Corporation | Methods for creating elements of predetermined shape and apparatuses using these elements |
US6527964B1 (en) * | 1999-11-02 | 2003-03-04 | Alien Technology Corporation | Methods and apparatuses for improved flow in performing fluidic self assembly |
US6479395B1 (en) * | 1999-11-02 | 2002-11-12 | Alien Technology Corporation | Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings |
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- 1993-12-17 US US08/169,298 patent/US5545291A/en not_active Expired - Lifetime
-
1994
- 1994-12-07 JP JP51684695A patent/JP3535166B2/ja not_active Expired - Fee Related
- 1994-12-07 CN CNB2006100819051A patent/CN100466250C/zh not_active Expired - Lifetime
- 1994-12-07 EP EP95904304A patent/EP0734586B1/de not_active Expired - Lifetime
- 1994-12-07 DE DE69433361T patent/DE69433361T2/de not_active Expired - Lifetime
- 1994-12-07 CA CA002177276A patent/CA2177276C/en not_active Expired - Fee Related
- 1994-12-07 WO PCT/US1994/014152 patent/WO1995017005A1/en active IP Right Grant
- 1994-12-07 AU AU13046/95A patent/AU681928B2/en not_active Ceased
- 1994-12-07 CN CNB021561044A patent/CN1263098C/zh not_active Expired - Lifetime
- 1994-12-07 EP EP03020566A patent/EP1372194A1/de not_active Withdrawn
- 1994-12-07 EP EP04014244A patent/EP1463116A3/de not_active Withdrawn
- 1994-12-07 CN CN94194495A patent/CN1103118C/zh not_active Expired - Fee Related
-
1995
- 1995-05-09 US US08/437,540 patent/US5783856A/en not_active Expired - Lifetime
-
2003
- 2003-12-10 JP JP2003411714A patent/JP3884426B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-06 JP JP2005293820A patent/JP3828567B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1372194A1 (de) | 2003-12-17 |
JP3828567B2 (ja) | 2006-10-04 |
CN1103118C (zh) | 2003-03-12 |
CA2177276C (en) | 2008-04-01 |
EP0734586A1 (de) | 1996-10-02 |
EP0734586B1 (de) | 2003-11-26 |
EP1463116A3 (de) | 2007-12-05 |
CN1492483A (zh) | 2004-04-28 |
JP2006074062A (ja) | 2006-03-16 |
JP3884426B2 (ja) | 2007-02-21 |
DE69433361T2 (de) | 2004-09-16 |
CA2177276A1 (en) | 1995-06-22 |
US5783856A (en) | 1998-07-21 |
JPH09506742A (ja) | 1997-06-30 |
CN1137329A (zh) | 1996-12-04 |
CN1263098C (zh) | 2006-07-05 |
AU681928B2 (en) | 1997-09-11 |
EP1463116A2 (de) | 2004-09-29 |
AU1304695A (en) | 1995-07-03 |
EP0734586A4 (de) | 1998-10-14 |
CN100466250C (zh) | 2009-03-04 |
JP2004165680A (ja) | 2004-06-10 |
WO1995017005A1 (en) | 1995-06-22 |
US5545291A (en) | 1996-08-13 |
CN1893062A (zh) | 2007-01-10 |
JP3535166B2 (ja) | 2004-06-07 |
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