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DE69433361D1 - Herstellungsmethode von selbstmontierenden Mikrostrukturen - Google Patents

Herstellungsmethode von selbstmontierenden Mikrostrukturen

Info

Publication number
DE69433361D1
DE69433361D1 DE69433361T DE69433361T DE69433361D1 DE 69433361 D1 DE69433361 D1 DE 69433361D1 DE 69433361 T DE69433361 T DE 69433361T DE 69433361 T DE69433361 T DE 69433361T DE 69433361 D1 DE69433361 D1 DE 69433361D1
Authority
DE
Germany
Prior art keywords
self
manufacturing
assembling microstructures
microstructures
assembling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69433361T
Other languages
English (en)
Other versions
DE69433361T2 (de
Inventor
S Smith
J Yeh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of California
Original Assignee
University of California
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of California filed Critical University of California
Application granted granted Critical
Publication of DE69433361D1 publication Critical patent/DE69433361D1/de
Publication of DE69433361T2 publication Critical patent/DE69433361T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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DE69433361T 1993-12-17 1994-12-07 Herstellungsmethode von selbstmontierenden Mikrostrukturen Expired - Lifetime DE69433361T2 (de)

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US08/169,298 US5545291A (en) 1993-12-17 1993-12-17 Method for fabricating self-assembling microstructures
PCT/US1994/014152 WO1995017005A1 (en) 1993-12-17 1994-12-07 Method for fabricating self-assembling microstructures

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Families Citing this family (384)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6569382B1 (en) 1991-11-07 2003-05-27 Nanogen, Inc. Methods apparatus for the electronic, homogeneous assembly and fabrication of devices
US5904545A (en) * 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die
US6861290B1 (en) 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
JP3097557B2 (ja) * 1996-05-20 2000-10-10 日本電気株式会社 半導体装置の製造方法
GB9616540D0 (en) * 1996-08-06 1996-09-25 Cavendish Kinetics Ltd Integrated circuit device manufacture
US6507989B1 (en) 1997-03-13 2003-01-21 President And Fellows Of Harvard College Self-assembly of mesoscale objects
EP1064584B1 (de) 1998-03-18 2004-05-19 E Ink Corporation Elektrophoretische anzeige
US6391005B1 (en) 1998-03-30 2002-05-21 Agilent Technologies, Inc. Apparatus and method for penetration with shaft having a sensor for sensing penetration depth
USRE43112E1 (en) 1998-05-04 2012-01-17 Round Rock Research, Llc Stackable ball grid array package
CA2330950A1 (en) 1998-05-12 1999-11-18 E Ink Corporation Microencapsulated electrophoretic electrostatically-addressed media for drawing device applications
US6066513A (en) * 1998-10-02 2000-05-23 International Business Machines Corporation Process for precise multichip integration and product thereof
DE19856331B4 (de) * 1998-12-07 2009-01-02 Robert Bosch Gmbh Verfahren zur Eingehäusung elektronischer Bauelemente
US6312304B1 (en) 1998-12-15 2001-11-06 E Ink Corporation Assembly of microencapsulated electronic displays
US6850312B2 (en) * 1999-03-16 2005-02-01 Alien Technology Corporation Apparatuses and methods for flexible displays
KR100686784B1 (ko) * 1999-02-05 2007-02-23 알리엔 테크놀로지 코포레이션 어셈블리를 형성하는 방법 및 장치
US6683663B1 (en) * 1999-02-05 2004-01-27 Alien Technology Corporation Web fabrication of devices
US6606079B1 (en) 1999-02-16 2003-08-12 Alien Technology Corporation Pixel integrated circuit
US6291896B1 (en) 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die
US6380729B1 (en) 1999-02-16 2002-04-30 Alien Technology Corporation Testing integrated circuit dice
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6316278B1 (en) * 1999-03-16 2001-11-13 Alien Technology Corporation Methods for fabricating a multiple modular assembly
US6531997B1 (en) 1999-04-30 2003-03-11 E Ink Corporation Methods for addressing electrophoretic displays
US6504524B1 (en) 2000-03-08 2003-01-07 E Ink Corporation Addressing methods for displays having zero time-average field
US7030412B1 (en) 1999-05-05 2006-04-18 E Ink Corporation Minimally-patterned semiconductor devices for display applications
EP1196814A1 (de) 1999-07-21 2002-04-17 E Ink Corporation Verwendung eines speicherkondensators zur verbesserung der leistung einer, von einer aktiven matrix gesteuerten elektronischen anzeige
US6420266B1 (en) 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
US6527964B1 (en) * 1999-11-02 2003-03-04 Alien Technology Corporation Methods and apparatuses for improved flow in performing fluidic self assembly
US6479395B1 (en) * 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6623579B1 (en) * 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
KR100658977B1 (ko) * 2000-02-21 2006-12-18 엘지.필립스 엘시디 주식회사 액정 표시장치 및 그 제조방법
KR100726134B1 (ko) * 2000-02-21 2007-06-12 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이기판 및 그의 제조방법
DE60144452D1 (de) * 2000-02-22 2011-05-26 Toray Eng Co Ltd Verfahren zur Herstellung einer kontaktlosen ID Karte
JP2001257218A (ja) 2000-03-10 2001-09-21 Sony Corp 微細チップの実装方法
US6841419B2 (en) * 2000-04-04 2005-01-11 Toray Engineering Company, Limited Method of fabricating a COF utilizing a tapered IC chip and chip mounting hole
DE60139463D1 (de) 2000-04-18 2009-09-17 E Ink Corp Prozess zur herstellung von dünnfilmtransistoren
US7893435B2 (en) 2000-04-18 2011-02-22 E Ink Corporation Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough
CZ20024017A3 (cs) * 2000-06-02 2003-06-18 Teradyne, Inc. Způsob přípravy výsledků z předpovězení schopnosti existující linky podporovat vysokorychlostní přístup
US6687987B2 (en) 2000-06-06 2004-02-10 The Penn State Research Foundation Electro-fluidic assembly process for integration of electronic devices onto a substrate
US6908295B2 (en) * 2000-06-16 2005-06-21 Avery Dennison Corporation Process and apparatus for embossing precise microstructures and embossing tool for making same
JP3829594B2 (ja) 2000-06-30 2006-10-04 セイコーエプソン株式会社 素子実装方法と光伝送装置
US6723576B2 (en) * 2000-06-30 2004-04-20 Seiko Epson Corporation Disposing method for semiconductor elements
US6730990B2 (en) 2000-06-30 2004-05-04 Seiko Epson Corporation Mountable microstructure and optical transmission apparatus
JP4239439B2 (ja) 2000-07-06 2009-03-18 セイコーエプソン株式会社 光学装置およびその製造方法ならびに光伝送装置
US6583580B2 (en) 2000-07-07 2003-06-24 Seiko Epson Corporation EL element driving circuit and method, and electronic apparatus
JP3815269B2 (ja) 2000-07-07 2006-08-30 セイコーエプソン株式会社 有機el表示体及びその製造方法、孔開き基板、電気光学装置及びその製造方法、並びに電子機器
JP3840926B2 (ja) * 2000-07-07 2006-11-01 セイコーエプソン株式会社 有機el表示体及びその製造方法、並びに電子機器
JP3915868B2 (ja) 2000-07-07 2007-05-16 セイコーエプソン株式会社 強誘電体メモリ装置およびその製造方法
US6605902B2 (en) 2000-07-07 2003-08-12 Seiko Epson Corporation Display and electronic device
US20020060321A1 (en) 2000-07-14 2002-05-23 Kazlas Peter T. Minimally- patterned, thin-film semiconductor devices for display applications
JP3963068B2 (ja) * 2000-07-19 2007-08-22 豊田合成株式会社 Iii族窒化物系化合物半導体素子の製造方法
EP1323190A2 (de) * 2000-07-20 2003-07-02 President And Fellows of Harvard College Selbstmontierende elektrische netzwerke
US6780696B1 (en) * 2000-09-12 2004-08-24 Alien Technology Corporation Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
US6980184B1 (en) * 2000-09-27 2005-12-27 Alien Technology Corporation Display devices and integrated circuits
US6811714B1 (en) * 2000-10-06 2004-11-02 Freescale Semiconductor, Inc. Micromachined component and method of manufacture
JP4491948B2 (ja) 2000-10-06 2010-06-30 ソニー株式会社 素子実装方法および画像表示装置の製造方法
DE10053334B4 (de) * 2000-10-27 2018-08-02 Robert Bosch Gmbh Verfahren und Vorrichtung zur Steuerung eines Stellelements in einem Fahrzeug
US20020149107A1 (en) * 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US8641644B2 (en) 2000-11-21 2014-02-04 Sanofi-Aventis Deutschland Gmbh Blood testing apparatus having a rotatable cartridge with multiple lancing elements and testing means
WO2002043032A2 (en) * 2000-11-21 2002-05-30 Avery Dennison Corporation Display device and methods of manufacture and control
US7199527B2 (en) * 2000-11-21 2007-04-03 Alien Technology Corporation Display device and methods of manufacturing and control
US6794221B2 (en) 2000-11-29 2004-09-21 Hrl Laboratories, Llc Method of placing elements into receptors in a substrate
US6291266B1 (en) * 2000-11-29 2001-09-18 Hrl Laboratories, Llc Method for fabricating large area flexible electronics
US6611237B2 (en) 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP4554888B2 (ja) 2001-03-19 2010-09-29 アベソ,インコーポレイティド マトリックスアドレス可能エレクトロクロミック表示装置
JP2002359358A (ja) 2001-03-26 2002-12-13 Seiko Epson Corp 強誘電体メモリ及び電子機器
US6417025B1 (en) * 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
US6864435B2 (en) * 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
GB0112395D0 (en) * 2001-05-22 2001-07-11 Koninkl Philips Electronics Nv Display devices and driving method therefor
US6988667B2 (en) * 2001-05-31 2006-01-24 Alien Technology Corporation Methods and apparatuses to identify devices
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
JP3812368B2 (ja) * 2001-06-06 2006-08-23 豊田合成株式会社 Iii族窒化物系化合物半導体素子及びその製造方法
US6686642B2 (en) * 2001-06-11 2004-02-03 Hewlett-Packard Development Company, L.P. Multi-level integrated circuit for wide-gap substrate bonding
US9795747B2 (en) 2010-06-02 2017-10-24 Sanofi-Aventis Deutschland Gmbh Methods and apparatus for lancet actuation
US9226699B2 (en) 2002-04-19 2016-01-05 Sanofi-Aventis Deutschland Gmbh Body fluid sampling module with a continuous compression tissue interface surface
US8337419B2 (en) 2002-04-19 2012-12-25 Sanofi-Aventis Deutschland Gmbh Tissue penetration device
US9427532B2 (en) 2001-06-12 2016-08-30 Sanofi-Aventis Deutschland Gmbh Tissue penetration device
US7033371B2 (en) 2001-06-12 2006-04-25 Pelikan Technologies, Inc. Electric lancet actuator
AU2002348683A1 (en) 2001-06-12 2002-12-23 Pelikan Technologies, Inc. Method and apparatus for lancet launching device integrated onto a blood-sampling cartridge
US7981056B2 (en) 2002-04-19 2011-07-19 Pelikan Technologies, Inc. Methods and apparatus for lancet actuation
EP1404233B1 (de) 2001-06-12 2009-12-02 Pelikan Technologies Inc. Selbstoptimierende lanzettenvorrichtung mit adaptationsmittel für zeitliche schwankungen von hauteigenschaften
US7041068B2 (en) 2001-06-12 2006-05-09 Pelikan Technologies, Inc. Sampling module device and method
JP2003005212A (ja) * 2001-06-20 2003-01-08 Seiko Instruments Inc 単結晶シリコントランジスタ素子を有する液晶表示装置およびその製造方法
JP3696132B2 (ja) 2001-07-10 2005-09-14 株式会社東芝 アクティブマトリクス基板及びその製造方法
US6657289B1 (en) * 2001-07-13 2003-12-02 Alien Technology Corporation Apparatus relating to block configurations and fluidic self-assembly processes
US6590346B1 (en) * 2001-07-16 2003-07-08 Alien Technology Corporation Double-metal background driven displays
US6967640B2 (en) 2001-07-27 2005-11-22 E Ink Corporation Microencapsulated electrophoretic display with integrated driver
US7218527B1 (en) * 2001-08-17 2007-05-15 Alien Technology Corporation Apparatuses and methods for forming smart labels
US6863219B1 (en) * 2001-08-17 2005-03-08 Alien Technology Corporation Apparatuses and methods for forming electronic assemblies
US6731353B1 (en) * 2001-08-17 2004-05-04 Alien Technology Corporation Method and apparatus for transferring blocks
US20030057544A1 (en) * 2001-09-13 2003-03-27 Nathan Richard J. Integrated assembly protocol
US6528351B1 (en) 2001-09-24 2003-03-04 Jigsaw Tek, Inc. Integrated package and methods for making same
US20030059976A1 (en) * 2001-09-24 2003-03-27 Nathan Richard J. Integrated package and methods for making same
US7253091B2 (en) * 2001-09-28 2007-08-07 Hrl Laboratories, Llc Process for assembling three-dimensional systems on a chip and structure thus obtained
US6974604B2 (en) * 2001-09-28 2005-12-13 Hrl Laboratories, Llc Method of self-latching for adhesion during self-assembly of electronic or optical components
WO2003030254A2 (en) * 2001-09-28 2003-04-10 Hrl Laboratories, Llc Process for assembling systems and structure thus obtained
US7351660B2 (en) * 2001-09-28 2008-04-01 Hrl Laboratories, Llc Process for producing high performance interconnects
US7018575B2 (en) * 2001-09-28 2006-03-28 Hrl Laboratories, Llc Method for assembly of complementary-shaped receptacle site and device microstructures
US7193504B2 (en) 2001-10-09 2007-03-20 Alien Technology Corporation Methods and apparatuses for identification
JP2003141761A (ja) * 2001-10-31 2003-05-16 Sanyo Electric Co Ltd 光ディスク装置および記録/再生方法
TW586091B (en) * 2001-12-07 2004-05-01 Sharp Kk Display device comprising bidirectional two-terminal element and method of fabricating the same
JP3844061B2 (ja) * 2002-01-16 2006-11-08 ソニー株式会社 電子部品の配置方法及びその装置
JP4082031B2 (ja) * 2002-01-17 2008-04-30 ソニー株式会社 素子の配列方法、及び表示装置
EP1464080B1 (de) * 2002-01-18 2007-09-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur herstellung einer verbundvorrichtung
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
CN1606796A (zh) * 2002-01-23 2005-04-13 艾伦技术公司 具有小形体尺寸和大形体尺寸元件的装置以及制造这种装置的方法
US6888178B2 (en) * 2002-01-24 2005-05-03 Massachusetts Institute Of Technology Method and system for magnetically assisted statistical assembly of wafers
US6900851B2 (en) 2002-02-08 2005-05-31 E Ink Corporation Electro-optic displays and optical systems for addressing such displays
US20030153119A1 (en) * 2002-02-14 2003-08-14 Nathan Richard J. Integrated circuit package and method for fabrication
US7080444B1 (en) 2002-02-28 2006-07-25 Alien Technology Corporation Apparatus for forming an electronic assembly
US6744549B2 (en) * 2002-03-19 2004-06-01 Dow Global Technologies Inc. Electrochromic display device
US7229458B2 (en) 2002-04-19 2007-06-12 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US9314194B2 (en) 2002-04-19 2016-04-19 Sanofi-Aventis Deutschland Gmbh Tissue penetration device
US7892185B2 (en) 2002-04-19 2011-02-22 Pelikan Technologies, Inc. Method and apparatus for body fluid sampling and analyte sensing
US7674232B2 (en) 2002-04-19 2010-03-09 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US8784335B2 (en) 2002-04-19 2014-07-22 Sanofi-Aventis Deutschland Gmbh Body fluid sampling device with a capacitive sensor
US7892183B2 (en) 2002-04-19 2011-02-22 Pelikan Technologies, Inc. Method and apparatus for body fluid sampling and analyte sensing
US7232451B2 (en) 2002-04-19 2007-06-19 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US7297122B2 (en) 2002-04-19 2007-11-20 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US8221334B2 (en) 2002-04-19 2012-07-17 Sanofi-Aventis Deutschland Gmbh Method and apparatus for penetrating tissue
US7331931B2 (en) 2002-04-19 2008-02-19 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US8702624B2 (en) 2006-09-29 2014-04-22 Sanofi-Aventis Deutschland Gmbh Analyte measurement device with a single shot actuator
US8267870B2 (en) 2002-04-19 2012-09-18 Sanofi-Aventis Deutschland Gmbh Method and apparatus for body fluid sampling with hybrid actuation
US7547287B2 (en) 2002-04-19 2009-06-16 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US9795334B2 (en) 2002-04-19 2017-10-24 Sanofi-Aventis Deutschland Gmbh Method and apparatus for penetrating tissue
US7976476B2 (en) 2002-04-19 2011-07-12 Pelikan Technologies, Inc. Device and method for variable speed lancet
US7909778B2 (en) 2002-04-19 2011-03-22 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US7491178B2 (en) 2002-04-19 2009-02-17 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US7901362B2 (en) 2002-04-19 2011-03-08 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US8360992B2 (en) 2002-04-19 2013-01-29 Sanofi-Aventis Deutschland Gmbh Method and apparatus for penetrating tissue
US8579831B2 (en) 2002-04-19 2013-11-12 Sanofi-Aventis Deutschland Gmbh Method and apparatus for penetrating tissue
US9248267B2 (en) 2002-04-19 2016-02-02 Sanofi-Aventis Deustchland Gmbh Tissue penetration device
US7175642B2 (en) 2002-04-19 2007-02-13 Pelikan Technologies, Inc. Methods and apparatus for lancet actuation
US7198606B2 (en) 2002-04-19 2007-04-03 Pelikan Technologies, Inc. Method and apparatus for a multi-use body fluid sampling device with analyte sensing
US6927382B2 (en) * 2002-05-22 2005-08-09 Agilent Technologies Optical excitation/detection device and method for making same using fluidic self-assembly techniques
US6903458B1 (en) 2002-06-20 2005-06-07 Richard J. Nathan Embedded carrier for an integrated circuit chip
US20060014322A1 (en) * 2002-07-11 2006-01-19 Craig Gordon S Methods and apparatuses relating to block configurations and fluidic self-assembly processes
US6946322B2 (en) * 2002-07-25 2005-09-20 Hrl Laboratories, Llc Large area printing method for integrating device and circuit components
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
JP4057861B2 (ja) * 2002-08-20 2008-03-05 松下電器産業株式会社 半導体レーザ装置及びその製造方法
DE10238601A1 (de) * 2002-08-22 2004-03-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Handhabungswafer zur Handhabung von Substraten
JP2004119620A (ja) * 2002-09-25 2004-04-15 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP4197420B2 (ja) * 2002-09-27 2008-12-17 パナソニック株式会社 半導体装置の製造方法
US6710436B1 (en) * 2002-12-12 2004-03-23 Sun Microsystems, Inc. Method and apparatus for electrostatically aligning integrated circuits
JP2006511969A (ja) * 2002-12-18 2006-04-06 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 液体の小滴でのマイクロメートル寸法の電子物体の操作
US8574895B2 (en) 2002-12-30 2013-11-05 Sanofi-Aventis Deutschland Gmbh Method and apparatus using optical techniques to measure analyte levels
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US7225992B2 (en) * 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
JP2004272014A (ja) * 2003-03-10 2004-09-30 Seiko Epson Corp 光通信モジュールの製造方法、光通信モジュール、及び電子機器
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7059518B2 (en) * 2003-04-03 2006-06-13 Avery Dennison Corporation RFID device detection system and method
US7652636B2 (en) * 2003-04-10 2010-01-26 Avery Dennison Corporation RFID devices having self-compensating antennas and conductive shields
US7501984B2 (en) * 2003-11-04 2009-03-10 Avery Dennison Corporation RFID tag using a surface insensitive antenna structure
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
JP3927919B2 (ja) * 2003-05-07 2007-06-13 松下電器産業株式会社 半導体装置の製造方法
US7244326B2 (en) * 2003-05-16 2007-07-17 Alien Technology Corporation Transfer assembly for manufacturing electronic devices
US7324061B1 (en) 2003-05-20 2008-01-29 Alien Technology Corporation Double inductor loop tag antenna
EP2238892A3 (de) 2003-05-30 2011-02-09 Pelikan Technologies Inc. Vorrichtung zur Entnahme von Körperflüssigkeit
US7850621B2 (en) 2003-06-06 2010-12-14 Pelikan Technologies, Inc. Method and apparatus for body fluid sampling and analyte sensing
WO2006001797A1 (en) 2004-06-14 2006-01-05 Pelikan Technologies, Inc. Low pain penetrating
US7223635B1 (en) 2003-07-25 2007-05-29 Hrl Laboratories, Llc Oriented self-location of microstructures with alignment structures
US7015479B2 (en) * 2003-07-31 2006-03-21 Eastman Kodak Company Digital film grain
US8102244B2 (en) 2003-08-09 2012-01-24 Alien Technology Corporation Methods and apparatuses to identify devices
US7265803B2 (en) * 2003-08-27 2007-09-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Reconfigurable logic through deposition of organic pathways
US8282576B2 (en) 2003-09-29 2012-10-09 Sanofi-Aventis Deutschland Gmbh Method and apparatus for an improved sample capture device
EP1680014A4 (de) 2003-10-14 2009-01-21 Pelikan Technologies Inc Verfahren und gerät für eine variable anwenderschnittstelle
US7716160B2 (en) * 2003-11-07 2010-05-11 Alien Technology Corporation Methods and apparatuses to identify devices
WO2005065414A2 (en) 2003-12-31 2005-07-21 Pelikan Technologies, Inc. Method and apparatus for improving fluidic flow and sample capture
US7822454B1 (en) 2005-01-03 2010-10-26 Pelikan Technologies, Inc. Fluid sampling device with improved analyte detecting member configuration
JP4534491B2 (ja) * 2004-01-09 2010-09-01 ソニー株式会社 電子応用装置の製造方法およびマイクロロッドトランジスタのアッセンブリ方法
JP4396285B2 (ja) * 2004-01-21 2010-01-13 ソニー株式会社 素子配列基板および素子配列方法
JP3978189B2 (ja) * 2004-01-23 2007-09-19 松下電器産業株式会社 半導体装置の製造方法及びその製造装置
CN101427182B (zh) * 2004-04-27 2011-10-19 伊利诺伊大学评议会 用于软光刻法的复合构图设备
US20080055581A1 (en) * 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
WO2006011062A2 (en) 2004-05-20 2006-02-02 Albatros Technologies Gmbh & Co. Kg Printable hydrogel for biosensors
US9775553B2 (en) 2004-06-03 2017-10-03 Sanofi-Aventis Deutschland Gmbh Method and apparatus for a fluid sampling device
EP1765194A4 (de) 2004-06-03 2010-09-29 Pelikan Technologies Inc Verfahren und gerät für eine flüssigkeitsentnahmenvorrichtung
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
WO2005122285A2 (en) 2004-06-04 2005-12-22 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US20050281944A1 (en) * 2004-06-17 2005-12-22 Jang Bor Z Fluid-assisted self-assembly of meso-scale particles
EP2463668A2 (de) 2004-06-21 2012-06-13 Capres A/S Verfahren und Vorrichtung zum Testen elektrischer Eigenschaften
EP2463667A3 (de) 2004-06-21 2015-07-29 Capres A/S Flexible Sonde
DE102004044179B4 (de) * 2004-06-30 2010-04-22 Osram Opto Semiconductors Gmbh Verfahren zur Montage von Halbleiterchips
US7307527B2 (en) * 2004-07-01 2007-12-11 Avery Dennison Corporation RFID device preparation system and method
US20070007637A1 (en) * 2004-08-12 2007-01-11 Marinov Valery R Multi-layered substrate assembly with vialess electrical interconnect scheme
US20060044769A1 (en) * 2004-09-01 2006-03-02 Forster Ian J RFID device with magnetic coupling
US7251882B2 (en) * 2004-09-03 2007-08-07 Eastman Kodak Company Method for assembling micro-components to binding sites
US7629026B2 (en) * 2004-09-03 2009-12-08 Eastman Kodak Company Thermally controlled fluidic self-assembly
US20060051517A1 (en) * 2004-09-03 2006-03-09 Eastman Kodak Company Thermally controlled fluidic self-assembly method and support
US7501955B2 (en) * 2004-09-13 2009-03-10 Avery Dennison Corporation RFID device with content insensitivity and position insensitivity
US7500307B2 (en) * 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7221277B2 (en) * 2004-10-05 2007-05-22 Tracking Technologies, Inc. Radio frequency identification tag and method of making the same
US7353598B2 (en) 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7615479B1 (en) * 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein
JP4548096B2 (ja) * 2004-11-11 2010-09-22 ソニー株式会社 半導体チップと基板との嵌合構造、半導体チップ実装方法及び電子装置
US7385284B2 (en) 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7342490B2 (en) * 2004-11-23 2008-03-11 Alien Technology Corporation Radio frequency identification static discharge protection
US7332361B2 (en) * 2004-12-14 2008-02-19 Palo Alto Research Center Incorporated Xerographic micro-assembler
US7538756B2 (en) * 2004-12-17 2009-05-26 Eastman Kodak Company Methods for making display
US7515149B2 (en) * 2004-12-17 2009-04-07 Eastman Kodak Company Display with wirelessly controlled illumination
US20060131505A1 (en) * 2004-12-17 2006-06-22 Eastman Kodak Company Imaging element
US7417550B2 (en) * 2004-12-20 2008-08-26 3M Innovative Properties Company Environmentally friendly radio frequency identification (RFID) labels and methods of using such labels
US7687277B2 (en) * 2004-12-22 2010-03-30 Eastman Kodak Company Thermally controlled fluidic self-assembly
WO2006071806A2 (en) * 2004-12-27 2006-07-06 Quantum Paper, Inc. Addressable and printable emissive display
US8652831B2 (en) 2004-12-30 2014-02-18 Sanofi-Aventis Deutschland Gmbh Method and apparatus for analyte measurement test time
KR101158158B1 (ko) * 2005-01-24 2012-06-19 파나소닉 주식회사 반도체 칩의 제조 방법, 및 반도체 칩
US8390537B2 (en) * 2005-03-11 2013-03-05 The Invention Science Fund I, Llc Method of assembling displays on substrates
US8711063B2 (en) 2005-03-11 2014-04-29 The Invention Science Fund I, Llc Self assembly of elements for displays
US9153163B2 (en) * 2005-03-11 2015-10-06 The Invention Science Fund I, Llc Self assembly of elements for displays
US7977130B2 (en) * 2006-08-03 2011-07-12 The Invention Science Fund I, Llc Method of assembling displays on substrates
US7990349B2 (en) * 2005-04-22 2011-08-02 The Invention Science Fund I, Llc Superimposed displays
US8334819B2 (en) * 2005-03-11 2012-12-18 The Invention Science Fund I, Llc Superimposed displays
US8860635B2 (en) * 2005-04-04 2014-10-14 The Invention Science Fund I, Llc Self assembling display with substrate
US8300007B2 (en) * 2005-03-11 2012-10-30 The Invention Science Fund I, Llc Self assembling display with substrate
US7662008B2 (en) * 2005-04-04 2010-02-16 Searete Llc Method of assembling displays on substrates
US20060202944A1 (en) * 2005-03-11 2006-09-14 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Elements for self assembling displays
US7625780B2 (en) * 2005-03-15 2009-12-01 Regents Of The University Of Minnesota Fluidic heterogeneous microsystems assembly and packaging
US7623034B2 (en) * 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
US7943052B2 (en) * 2005-07-05 2011-05-17 National Taiwan University Method for self-assembling microstructures
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
US20070040688A1 (en) 2005-08-16 2007-02-22 X-Cyte, Inc., A California Corporation RFID inlays and methods of their manufacture
EP1920391B1 (de) * 2005-08-22 2016-11-16 Avery Dennison Retail Information Services, LLC Verfahren zur herstellung von rfid-geräten
US20070082464A1 (en) * 2005-10-11 2007-04-12 Schatz Kenneth D Apparatus for block assembly process
US7926176B2 (en) * 2005-10-19 2011-04-19 General Electric Company Methods for magnetically directed self assembly
US8022416B2 (en) * 2005-10-19 2011-09-20 General Electric Company Functional blocks for assembly
US7555826B2 (en) * 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US20070158804A1 (en) * 2006-01-10 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of semiconductor device, and RFID tag
US7154283B1 (en) 2006-02-22 2006-12-26 Avery Dennison Corporation Method of determining performance of RFID devices
EP1991723A2 (de) 2006-03-03 2008-11-19 The Board Of Trustees Of The University Of Illinois Verfahren zur herstellung räumlich ausgerichteter nanoröhrchen und nanoröhrchenanordnungen
US7774929B2 (en) * 2006-03-14 2010-08-17 Regents Of The University Of Minnesota Method of self-assembly on a surface
KR100847598B1 (ko) * 2006-05-10 2008-07-21 주식회사 큐리어스 백라이트 유닛 및 그 제조 방법
TWI294404B (en) * 2006-07-18 2008-03-11 Ind Tech Res Inst Method and apparatus for microstructure assembly
KR100755656B1 (ko) * 2006-08-11 2007-09-04 삼성전기주식회사 질화물계 반도체 발광소자의 제조방법
US7875952B1 (en) 2006-09-19 2011-01-25 Hrl Laboratories, Llc Method of transistor level heterogeneous integration and system
JP5171016B2 (ja) 2006-10-27 2013-03-27 キヤノン株式会社 半導体部材、半導体物品の製造方法、その製造方法を用いたledアレイ
JP2008118024A (ja) * 2006-11-07 2008-05-22 Sony Corp 発光素子及びその製造方法
US20080135956A1 (en) * 2006-12-12 2008-06-12 General Electric Company Articles and assembly for magnetically directed self assembly and methods of manufacture
CN104637954B (zh) 2007-01-17 2018-02-16 伊利诺伊大学评议会 制造半导体基光学系统的方法
US20080229574A1 (en) * 2007-03-19 2008-09-25 Advanced Chip Engineering Technology Inc. Self chip redistribution apparatus and method for the same
US8395568B2 (en) 2007-05-31 2013-03-12 Nthdegree Technologies Worldwide Inc Light emitting, photovoltaic or other electronic apparatus and system
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US8889216B2 (en) * 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US8133768B2 (en) * 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
DE202007018520U1 (de) 2007-08-17 2008-10-09 Advanced Display Technology Ag Pixel-Bauelement und Display mit Pixel-Bauelement
US8674212B2 (en) * 2008-01-15 2014-03-18 General Electric Company Solar cell and magnetically self-assembled solar cell assembly
US7861405B2 (en) 2008-03-03 2011-01-04 Palo Alto Research Center Incorporated System for forming a micro-assembler
CN102113089B (zh) 2008-03-05 2014-04-23 伊利诺伊大学评议会 可拉伸和可折叠的电子器件
US8470701B2 (en) * 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
EP2277131A2 (de) 2008-04-07 2011-01-26 Alien Technology Corporation Teilsatzauswahl von rfid-tags mithilfe von licht
US9386944B2 (en) 2008-04-11 2016-07-12 Sanofi-Aventis Deutschland Gmbh Method and apparatus for analyte detecting device
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
EP2286445A1 (de) * 2008-06-02 2011-02-23 Nxp B.V. Herstellungsverfahren für eine elektronische vorrichtung
WO2010005707A1 (en) * 2008-06-16 2010-01-14 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
WO2010042653A1 (en) 2008-10-07 2010-04-15 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8736082B1 (en) 2008-10-25 2014-05-27 Hrl Laboratories, Llc Key structure and expansion enhanced alignment of self-assembled microstructures
US8288877B1 (en) 2008-10-25 2012-10-16 Hrl Laboratories, Llc Actuator enhanced alignment of self-assembled microstructures
KR20100087932A (ko) * 2009-01-29 2010-08-06 삼성전기주식회사 자기 조립 단분자막을 이용한 다이 어태치 방법 및 자기 조립 단분자막을 이용하여 다이가 어태치된 패키지 기판
US9375169B2 (en) 2009-01-30 2016-06-28 Sanofi-Aventis Deutschland Gmbh Cam drive for managing disposable penetrating member actions with a single motor and motor and control system
WO2010105247A1 (en) * 2009-03-13 2010-09-16 California Institute Of Technology Systems and methods for concentrating solar energy without tracking the sun
TWI573185B (zh) 2009-05-12 2017-03-01 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
JP5256501B2 (ja) * 2009-06-16 2013-08-07 コニカミノルタ株式会社 薄片状素子配列化基板の製造方法及び熱電変換モジュール
GB0914251D0 (en) * 2009-08-14 2009-09-30 Nat Univ Ireland Cork A hybrid substrate
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
WO2011084450A1 (en) 2009-12-16 2011-07-14 The Board Of Trustees Of The University Of Illinois Electrophysiology in-vivo using conformal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
CN105496423A (zh) 2010-03-17 2016-04-20 伊利诺伊大学评议会 基于生物可吸收基质的可植入生物医学装置
CN102473598A (zh) 2010-03-19 2012-05-23 松下电器产业株式会社 用于布置微结构的方法
US8965476B2 (en) 2010-04-16 2015-02-24 Sanofi-Aventis Deutschland Gmbh Tissue penetration device
KR101058880B1 (ko) 2010-05-07 2011-08-25 서울대학교산학협력단 액티브 소자를 구비한 led 디스플레이 장치 및 그 제조방법
US8349653B2 (en) 2010-06-02 2013-01-08 Maxim Integrated Products, Inc. Use of device assembly for a generalization of three-dimensional metal interconnect technologies
US10672748B1 (en) 2010-06-02 2020-06-02 Maxim Integrated Products, Inc. Use of device assembly for a generalization of three-dimensional heterogeneous technologies integration
US10329139B2 (en) 2010-06-08 2019-06-25 Northeastern University Interfacial convective assembly for high aspect ratio structures without surface treatment
JPWO2012008253A1 (ja) * 2010-07-14 2013-09-09 シャープ株式会社 微細な物体の配置方法、配列装置、照明装置および表示装置
KR102321916B1 (ko) * 2010-09-01 2021-11-05 엔티에이치 디그리 테크놀로지스 월드와이드 인코포레이티드 발광, 발전 또는 기타 전자 장치 및 이의 제조 방법
KR101429036B1 (ko) * 2010-09-01 2014-08-12 엔티에이치 디그리 테크놀로지스 월드와이드 인코포레이티드 다이오드, 다이오드 또는 기타 2-단자 집적 회로의 액체 또는 겔 현탁액의 인쇄 가능한 조성물, 및 이의 제조 방법
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
EP2712491B1 (de) 2011-05-27 2019-12-04 Mc10, Inc. Flexible elektronische struktur
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US20130175516A1 (en) * 2011-09-02 2013-07-11 The Procter & Gamble Company Light emitting apparatus
CN108389893A (zh) 2011-12-01 2018-08-10 伊利诺伊大学评议会 经设计以经历可编程转变的瞬态器件
US20130199831A1 (en) 2012-02-06 2013-08-08 Christopher Morris Electromagnetic field assisted self-assembly with formation of electrical contacts
US9281451B2 (en) 2012-02-17 2016-03-08 Industrial Technology Research Institute Light emitting element and fabricating method thereof
EP2830492B1 (de) 2012-03-30 2021-05-19 The Board of Trustees of the University of Illinois An ein körperteil montierbare, oberflächenkonformierbare, elektronische vorrichtungen und zugehöriges herstellungsverfahren
CN104508843B (zh) * 2012-04-20 2017-04-26 伦斯勒理工学院 一种用于将一排发光二极管裸片组装于衬底上的方法
EP2688093B1 (de) 2012-07-19 2018-07-18 Technische Universität Ilmenau Verfahren und Vorrichtung zur Selbstmontage mittels eines Fluids von Komponenten auf einem Substrat
EP2690059A1 (de) * 2012-07-24 2014-01-29 Biocartis SA Verfahren zur Herstellung von Mikroträgern
WO2014040614A1 (en) * 2012-09-11 2014-03-20 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic device and optoelectronic device
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
CN103000780B (zh) * 2012-12-14 2015-08-05 京东方科技集团股份有限公司 一种led芯片封装结构及制作方法、显示装置
JP6068165B2 (ja) 2013-01-29 2017-01-25 スタンレー電気株式会社 半導体光学装置、および半導体光学装置の製造方法
US9548411B2 (en) * 2013-03-15 2017-01-17 Sandia Corporation Photoelectrochemically driven self-assembly method
DE102013205594A1 (de) 2013-03-28 2014-10-02 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
JP2015038957A (ja) * 2013-07-16 2015-02-26 株式会社東芝 半導体装置及びその製造方法
CN103531458A (zh) * 2013-09-09 2014-01-22 长春理工大学 一种利用两步法对GaAs基材料进行湿法刻蚀的方法
KR101534705B1 (ko) * 2013-12-30 2015-07-07 현대자동차 주식회사 반도체 기판의 접합 방법
US9305807B2 (en) 2014-02-27 2016-04-05 Palo Alto Research Center Incorporated Fabrication method for microelectronic components and microchip inks used in electrostatic assembly
US10312731B2 (en) 2014-04-24 2019-06-04 Westrock Shared Services, Llc Powered shelf system for inductively powering electrical components of consumer product packages
US10945669B2 (en) 2014-10-08 2021-03-16 Arizona Board Of Regents On Behalf Of The University Of Arizona Flowable electronics
FR3028050B1 (fr) * 2014-10-29 2016-12-30 Commissariat Energie Atomique Substrat pre-structure pour la realisation de composants photoniques, circuit photonique et procede de fabrication associes
US10852492B1 (en) * 2014-10-29 2020-12-01 Acacia Communications, Inc. Techniques to combine two integrated photonic substrates
US10319878B2 (en) 2014-10-31 2019-06-11 eLux, Inc. Stratified quantum dot phosphor structure
US9985190B2 (en) 2016-05-18 2018-05-29 eLux Inc. Formation and structure of post enhanced diodes for orientation control
US10249599B2 (en) 2016-06-29 2019-04-02 eLux, Inc. Laminated printed color conversion phosphor sheets
US10446728B2 (en) * 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
US10516084B2 (en) * 2014-10-31 2019-12-24 eLux, Inc. Encapsulated fluid assembly emissive elements
US9917226B1 (en) * 2016-09-15 2018-03-13 Sharp Kabushiki Kaisha Substrate features for enhanced fluidic assembly of electronic devices
US10381335B2 (en) 2014-10-31 2019-08-13 ehux, Inc. Hybrid display using inorganic micro light emitting diodes (uLEDs) and organic LEDs (OLEDs)
US10535640B2 (en) 2014-10-31 2020-01-14 eLux Inc. System and method for the fluidic assembly of micro-LEDs utilizing negative pressure
US10381332B2 (en) 2014-10-31 2019-08-13 eLux Inc. Fabrication method for emissive display with light management system
US9755110B1 (en) 2016-07-27 2017-09-05 Sharp Laboratories Of America, Inc. Substrate with topological features for steering fluidic assembly LED disks
US10418527B2 (en) * 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
US9892944B2 (en) 2016-06-23 2018-02-13 Sharp Kabushiki Kaisha Diodes offering asymmetric stability during fluidic assembly
US9722145B2 (en) * 2015-06-24 2017-08-01 Sharp Laboratories Of America, Inc. Light emitting device and fluidic manufacture thereof
US10242977B2 (en) 2014-10-31 2019-03-26 eLux, Inc. Fluid-suspended microcomponent harvest, distribution, and reclamation
US9825202B2 (en) 2014-10-31 2017-11-21 eLux, Inc. Display with surface mount emissive elements
US10520769B2 (en) 2014-10-31 2019-12-31 eLux, Inc. Emissive display with printed light modification structures
US10236279B2 (en) 2014-10-31 2019-03-19 eLux, Inc. Emissive display with light management system
US10543486B2 (en) 2014-10-31 2020-01-28 eLux Inc. Microperturbation assembly system and method
MX2017015587A (es) 2015-06-01 2018-08-23 Univ Illinois Metodo alternativo para sensor uv.
US10677647B2 (en) 2015-06-01 2020-06-09 The Board Of Trustees Of The University Of Illinois Miniaturized electronic systems with wireless power and near-field communication capabilities
TWI665800B (zh) * 2015-06-16 2019-07-11 友達光電股份有限公司 發光二極體顯示器及其製造方法
US10539433B2 (en) * 2015-08-17 2020-01-21 Pangolin Laser Systems, Inc. Light detector employing trapezoidal chips and associated methods
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
US9627437B1 (en) 2016-06-30 2017-04-18 Sharp Laboratories Of America, Inc. Patterned phosphors in through hole via (THV) glass
CN111029450B (zh) * 2016-08-05 2021-08-10 群创光电股份有限公司 发光二极管显示装置
US10243097B2 (en) 2016-09-09 2019-03-26 eLux Inc. Fluidic assembly using tunable suspension flow
CN107833525B (zh) * 2016-09-15 2020-10-27 伊乐视有限公司 发光显示器的流体组装的系统和方法
US9837390B1 (en) 2016-11-07 2017-12-05 Corning Incorporated Systems and methods for creating fluidic assembly structures on a substrate
EP3352211B1 (de) * 2017-01-19 2020-08-05 eLux Inc. Verfahren zur fluidischen anordnung von emissionsanzeigen
TWI660440B (zh) * 2017-01-31 2019-05-21 日商新川股份有限公司 半導體裝置的製造方法及製造裝置
TWI785052B (zh) * 2017-06-01 2022-12-01 美商康寧公司 包括穿透孔洞貫孔的組件基板及其製作方法
CN107681462B (zh) * 2017-09-12 2019-10-08 北京工业大学 一种半导体芯片自对准摆片
CN107651648B (zh) * 2017-10-20 2019-11-22 常州工学院 一种基于微振动激励微器件自装配装置及方法
WO2019132050A1 (ko) * 2017-12-26 2019-07-04 박일우 Led 디스플레이 장치 및 그 제조 방법
CN110112075A (zh) * 2018-02-01 2019-08-09 上海瑞章物联网技术有限公司 晶片的封装方法
WO2019181044A1 (ja) * 2018-03-23 2019-09-26 株式会社 東芝 処理液及び処理方法
CN110349865A (zh) * 2018-04-04 2019-10-18 上海瑞章物联网技术有限公司 芯片的封装方法
CN110364470A (zh) * 2018-04-11 2019-10-22 上海瑞章物联网技术有限公司 用于晶片封装的载体以及晶片的封装方法
EP3836234A4 (de) 2018-08-10 2022-05-04 Lin, Hong-Cheng Diodenvorrichtung, anzeigetafel und flexible anzeige
CN110911435A (zh) * 2018-09-14 2020-03-24 英属开曼群岛商镎创科技股份有限公司 显示装置、显示装置的制程方法及显示装置的基板
CN111129245B (zh) * 2018-10-31 2022-09-06 成都辰显光电有限公司 一种led芯片、显示面板及显示面板的组装设备
CN111162064B (zh) * 2018-11-08 2022-03-25 成都辰显光电有限公司 Led单元、导引板、led显示器及其制造方法
CN111816751B (zh) * 2019-04-12 2022-02-22 成都辰显光电有限公司 微发光二极管显示面板及其制备方法
KR102323256B1 (ko) * 2019-09-19 2021-11-08 엘지전자 주식회사 반도체 발광소자의 자가조립 장치
CN113314446B (zh) * 2020-02-27 2023-06-02 上海微电子装备(集团)股份有限公司 芯片转移装置及芯片转移方法
US11764095B2 (en) * 2020-07-10 2023-09-19 Samsung Electronics Co., Ltd. Wet alignment method for micro-semiconductor chip and display transfer structure
US11562984B1 (en) 2020-10-14 2023-01-24 Hrl Laboratories, Llc Integrated mechanical aids for high accuracy alignable-electrical contacts
KR102511685B1 (ko) * 2020-12-09 2023-03-21 (주)포인트엔지니어링 미소 소자, 미소 소자의 정렬 장치 및 방법
DE102021102332A1 (de) * 2021-02-02 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung einer anordnung von halbleiterchips und anordnung von halbleiterchips
US20220285188A1 (en) * 2021-03-02 2022-09-08 Samsung Electronics Co., Ltd. Display transfer structure including light emitting elements and transferring method of light emitting elements
US12057429B1 (en) 2021-06-23 2024-08-06 Hrl Laboratories, Llc Temporary bonding structures for die-to-die and wafer-to-wafer bonding
WO2023277310A1 (ko) * 2021-06-30 2023-01-05 삼성전자주식회사 무기 발광 소자, 디스플레이 모듈 및 그 제조 방법
CN113540061A (zh) * 2021-06-30 2021-10-22 上海天马微电子有限公司 显示面板及其制备方法
WO2023016625A1 (en) 2021-08-09 2023-02-16 X-Celeprint Limited Integrated-circuit module collection and deposition
CN116705924A (zh) * 2023-08-04 2023-09-05 季华实验室 发光单元转移方法及筛网

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3439416A (en) * 1966-02-03 1969-04-22 Gen Telephone & Elect Method and apparatus for fabricating an array of discrete elements
GB1285708A (en) * 1968-10-28 1972-08-16 Lucas Industries Ltd Semi-conductor devices
GB1315479A (en) * 1970-06-24 1973-05-02 Licentia Gmbh Method for manufacturing diodes
US3725160A (en) * 1970-12-30 1973-04-03 Texas Instruments Inc High density integrated circuits
GB1581171A (en) * 1976-04-08 1980-12-10 Bison North America Inc Alignment plate construction for electrostatic particle orientation
DE2656019C3 (de) * 1976-12-10 1980-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Vorrichtung zum Ausrichten und Anlöten von Podesten bzw. Ronden bezüglich der bzw. an den lötfähigen ohmschen Kontakten) von Halbleiterbauelementen
JPS6048104B2 (ja) * 1980-01-30 1985-10-25 三洋電機株式会社 半導体ウエハの分割方法
US4843035A (en) * 1981-07-23 1989-06-27 Clarion Co., Ltd. Method for connecting elements of a circuit device
GB2154365A (en) * 1984-02-10 1985-09-04 Philips Electronic Associated Loading semiconductor wafers on an electrostatic chuck
US4542397A (en) * 1984-04-12 1985-09-17 Xerox Corporation Self aligning small scale integrated circuit semiconductor chips to form large area arrays
JPS6281745A (ja) * 1985-10-05 1987-04-15 Fujitsu Ltd ウエハ−規模のlsi半導体装置とその製造方法
US4802951A (en) * 1986-03-07 1989-02-07 Trustees Of Boston University Method for parallel fabrication of nanometer scale multi-device structures
US5187547A (en) * 1988-05-18 1993-02-16 Sanyo Electric Co., Ltd. Light emitting diode device and method for producing same
US4949148A (en) * 1989-01-11 1990-08-14 Bartelink Dirk J Self-aligning integrated circuit assembly
JP2784537B2 (ja) * 1989-03-29 1998-08-06 新日本無線株式会社 発光ダイオードの製造方法
US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
US4990462A (en) * 1989-04-12 1991-02-05 Advanced Micro Devices, Inc. Method for coplanar integration of semiconductor ic devices
US5075253A (en) * 1989-04-12 1991-12-24 Advanced Micro Devices, Inc. Method of coplanar integration of semiconductor IC devices
GB2237143A (en) * 1989-09-15 1991-04-24 Philips Electronic Associated Two-terminal non-linear devices and their fabrication
US4975143A (en) * 1989-11-22 1990-12-04 Xerox Corporation Keyway alignment substrates
US5034802A (en) * 1989-12-11 1991-07-23 Hewlett-Packard Company Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates
US5063177A (en) * 1990-10-04 1991-11-05 Comsat Method of packaging microwave semiconductor components and integrated circuits
JPH04148999A (ja) * 1990-10-12 1992-05-21 Dainippon Printing Co Ltd Icカード
JP2940138B2 (ja) * 1990-10-29 1999-08-25 日本電気株式会社 発光ダイオード
US5258325A (en) * 1990-12-31 1993-11-02 Kopin Corporation Method for manufacturing a semiconductor device using a circuit transfer film
US5355577A (en) * 1992-06-23 1994-10-18 Cohn Michael B Method and apparatus for the assembly of microfabricated devices

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EP1372194A1 (de) 2003-12-17
JP3828567B2 (ja) 2006-10-04
CN1103118C (zh) 2003-03-12
CA2177276C (en) 2008-04-01
EP0734586A1 (de) 1996-10-02
EP0734586B1 (de) 2003-11-26
EP1463116A3 (de) 2007-12-05
CN1492483A (zh) 2004-04-28
JP2006074062A (ja) 2006-03-16
JP3884426B2 (ja) 2007-02-21
DE69433361T2 (de) 2004-09-16
CA2177276A1 (en) 1995-06-22
US5783856A (en) 1998-07-21
JPH09506742A (ja) 1997-06-30
CN1137329A (zh) 1996-12-04
CN1263098C (zh) 2006-07-05
AU681928B2 (en) 1997-09-11
EP1463116A2 (de) 2004-09-29
AU1304695A (en) 1995-07-03
EP0734586A4 (de) 1998-10-14
CN100466250C (zh) 2009-03-04
JP2004165680A (ja) 2004-06-10
WO1995017005A1 (en) 1995-06-22
US5545291A (en) 1996-08-13
CN1893062A (zh) 2007-01-10
JP3535166B2 (ja) 2004-06-07

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