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WO2019174065A1 - 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法 - Google Patents

电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法 Download PDF

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Publication number
WO2019174065A1
WO2019174065A1 PCT/CN2018/080019 CN2018080019W WO2019174065A1 WO 2019174065 A1 WO2019174065 A1 WO 2019174065A1 CN 2018080019 W CN2018080019 W CN 2018080019W WO 2019174065 A1 WO2019174065 A1 WO 2019174065A1
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Prior art keywords
layer
shielding layer
shielding
film
particles
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PCT/CN2018/080019
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English (en)
French (fr)
Inventor
苏陟
Original Assignee
广州方邦电子股份有限公司
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Publication date
Application filed by 广州方邦电子股份有限公司 filed Critical 广州方邦电子股份有限公司
Priority to US16/623,939 priority Critical patent/US10881039B1/en
Priority to KR1020197037363A priority patent/KR102298791B1/ko
Priority to JP2019570450A priority patent/JP6931406B2/ja
Publication of WO2019174065A1 publication Critical patent/WO2019174065A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/32—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed at least two layers being foamed and next to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the invention relates to the field of electronics, and in particular to a method for preparing an electromagnetic shielding film, a circuit board and an electromagnetic shielding film.
  • Electromagnetic Interference Shielding With the integration of functions such as mobile phones, the internal components are rapidly high-speed and high-speed. For example, in addition to the original audio transmission function, the camera function has become a necessary function, and WLAN (Wireless Local Area Networks) GPS (Global Positioning System) and Internet access functions have become popular, and with the integration of future sensing components, the trend of high-speed and high-speed components is even more inevitable. Under the drive of high frequency and high speed. The induced electromagnetic interference inside and outside the component, the attenuation of the signal during transmission, and the insertion loss and jitter problems are becoming more serious.
  • EMI Shielding Electromagnetic Interference Shielding
  • the shielding film commonly used in existing circuit boards includes a shielding layer and a conductive adhesive layer, and the shielding layer is connected to the circuit board ground layer through a conductive adhesive layer, thereby introducing interference charges into the circuit board formation to achieve shielding.
  • the conductive particles in the conductive adhesive layer may cause eddy current loss, which leads to an increase in the insertion loss of the circuit board and affects the signal transmission integrity.
  • An object of the embodiments of the present invention is to provide a method for preparing an electromagnetic shielding film, a circuit board, and an electromagnetic shielding film, which can reduce insertion loss and be effectively applied for ultra-high frequency transmission.
  • an embodiment of the present invention provides an electromagnetic shielding film including a first shielding layer, a second shielding layer, a film layer and a plurality of convex particles;
  • the first shielding layer includes an opposite first surface and a second surface, the second surface is a flat surface;
  • the plurality of convex particles are attached on the second surface of the first shielding layer;
  • the second shielding layer is disposed in the second surface of the first shielding layer Surfacely covering the plurality of convex particles, thereby forming a convex portion at a position corresponding to the convex particles on an outer surface of the second shielding layer, and forming a gentle portion at other positions;
  • the film A layer is disposed on an outer surface of the second shield layer.
  • the convex particles include one or more of conductor particles, semiconductor particles, insulator particles, and coated composite particles.
  • the height of the convex particles is from 0.1 ⁇ m to 30 ⁇ m.
  • a plurality of conductive bumps are formed on the outer surface of the second shield layer.
  • the conductive bumps are concentratedly distributed on the bosses.
  • the film layer includes an adhesive layer containing conductive particles.
  • the film layer includes an adhesive layer containing no conductive particles.
  • the first shielding layer and the second shielding layer include one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer.
  • the metal shielding layer comprises a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and It is made of any one of gold materials made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the electromagnetic shielding film further includes a protective film layer, and the first surface of the first shielding layer is formed with the protective film layer.
  • the embodiment of the invention discloses an electromagnetic shielding film, and a convex portion is formed on a position corresponding to the convex particle on an outer surface of the second shielding layer, and a flat portion is formed at other positions.
  • the surface of the second shielding layer is provided with the film layer, and the protrusion portion ensures that the shielding layer penetrates the film layer smoothly during the pressing process, thereby ensuring that the interference charge is normally discharged, and at the same time, the flat portion is further It can reduce the insertion loss during use and is suitable for UHF transmission.
  • the embodiment of the present invention further provides a circuit board, comprising a printed circuit board and the electromagnetic shielding film according to any one of the above, wherein the electromagnetic shielding film is pressed with the printed circuit board through a film layer thereof; The raised portion pierces the film layer and extends to the formation of the printed wiring board.
  • the embodiment of the present invention discloses a circuit board including a printed circuit board and the electromagnetic shielding film according to any one of the above, wherein the electromagnetic shielding film passes through a film layer thereof
  • the printed circuit board is pressed together, the convex portion pierces the rubber film layer and extends to the ground layer of the printed circuit board, so as to realize the smooth discharge of the interference charge, and the flat portion can reduce the use process. Insertion loss for UHF transmission.
  • the embodiment of the invention further relates to a method for preparing an electromagnetic shielding film, which is suitable for preparing the electromagnetic shielding film according to any one of the above items, comprising the steps of:
  • the first shielding layer is formed in the following manner in the step S1:
  • step S4 the forming a film layer on the outer surface of the second shielding layer is specifically:
  • a film layer is directly coated on the outer surface of the second shielding layer to form the film layer on the outer surface of the second shielding layer.
  • the electromagnetic shielding film provided by the embodiment of the present invention is formed by forming a plurality of convex particles on the second surface of the first shielding layer on the second surface on which the convex particles are distributed. Forming a second shielding layer, so that a convex portion is formed on a position corresponding to the convex particles on an outer surface of the second shielding layer, and a flat portion is formed at other positions, so that the shielding layer can be smoothly punctured during the pressing process It is suitable for ultra-high frequency transmission by wearing a film layer to achieve reliable grounding, practicality, and low insertion loss during use.
  • Figure 1 is a schematic view showing the structure of an electromagnetic shielding film in Embodiment 1 of the present invention.
  • Embodiment 2 is a schematic view showing the structure of an electromagnetic shielding film in Embodiment 2 of the present invention.
  • Embodiment 3 is a schematic structural view of a circuit board in Embodiment 3 of the present invention.
  • Embodiment 4 is a schematic structural view of a circuit board in Embodiment 4 of the present invention.
  • FIG. 5 is a schematic flow chart of a method for preparing an electromagnetic shielding film according to Embodiment 5 of the present invention.
  • the electromagnetic shielding film includes a first shielding layer 1, a second shielding layer 2, a film layer 3, and a plurality of a convex particle
  • the first shielding layer 1 includes an opposite first surface 11 and a second surface 12
  • the second surface 12 is a flat surface
  • the plurality of convex particles are attached to the first shielding layer 1
  • the second shielding layer 2 is disposed on the second surface 12 of the first shielding layer 1 and covers the plurality of convex particles so as to be on the outer surface of the second shielding layer 2
  • a convex portion 212 is formed at a position corresponding to the convex particles 4 at 21, and a gentle portion 211 is formed at other positions;
  • the adhesive film layer 3 is disposed on the outer surface 21 of the second shielding layer 2.
  • the first shielding layer 1 and the second shielding layer 2 both have the function of conducting free electrons, and the materials used may be the same or different, specifically including a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer and graphite.
  • the metal shielding layer comprises a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of any of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
  • a material is made of the alloy shielding layer made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the material for the film layer 3 is preferably selected from the group consisting of modified epoxy resins, modified acrylics, modified rubbers, modified thermoplastic polyimides, and modified polyesters.
  • the convex particles 4 are distributed on the second surface 12 of the first shielding film (the second surface 12 is a flat surface), and its function is such that the outer surface 21 of the second shielding film forms a convex portion. 212, so that the convex portion 212 can smoothly pierce the layer of the film layer 3 and the printed circuit board during the process of pressing the electromagnetic shielding film with the printed circuit board to achieve reliable grounding.
  • the convex particles 4 include one or more of conductor particles, semiconductor particles, insulator particles, and coated composite particles (conductor-coated insulator particles, or another insulator-coated insulator particles, etc.), and also include small Large particles agglomerated by particles.
  • the convex particles 4 are diamond powder, titanium white powder, silicon powder, silicide powder, silica powder, aluminide powder, graphene powder, iron powder, nickel powder, copper powder, nickel-plated diamond. Powder, metal-plated inorganic powder, etc. It should be noted that the shape of the convex particles 4 in the present invention is not limited by the drawings, and the material thereof is not limited by the above materials as long as the outer surface 21 of the second shielding layer is formed to be convex. The particles of portion 212 are all within the scope of the present invention.
  • the height of the convex particles 4 is from 0.1 ⁇ m to 30 ⁇ m.
  • the thickness of the film layer 3 and the undulation of the outer surface 21 of the second shielding layer (corresponding to the height of the convex portion 212) satisfy a proportional relationship of preferably 0.8 to 2 to ensure sufficient piercing.
  • the strength and the amount of the glue are embodied as follows: on the one hand, the thickness of the film layer 3 is prevented from being too small relative to the outer surface 21 of the second shielding film, so that the amount of glue is insufficient, thereby causing a phenomenon of bursting; Preventing the undulation of the outer surface 21 of the second shielding film from being too small with respect to the thickness of the film layer 3 causes insufficient puncture strength to cause a ground failure phenomenon. It should be noted that the undulation of the outer surface 21 of the second shielding film is the distance between the highest point and the lowest point of the outer surface 21 of the second shielding film.
  • the convex portion 212 is formed on the outer surface 21 of the second shield layer 2 at a position corresponding to the convex particles 4, and the flat portion 211 is formed at other positions, the second shield layer 2
  • the film layer 3 is disposed on the outer surface 21, and the convex portion 212 of the outer surface 21 of the second shielding layer 2 ensures that the second shielding layer penetrates the film layer 3 smoothly during the pressing process to ensure interference charges.
  • the flat portion 211 can reduce the insertion loss during use, and is suitable for UHF transmission.
  • the adhesive film layer 3 is an adhesive layer containing no conductive particles, which reduces the insertion loss of the circuit board during use, improves the shielding performance, and improves the bending property of the circuit board.
  • the adhesive film layer 3 is an adhesive layer with conductive particles, and the adhesive film layer 3 has a bonding function, so that the wiring board and the electromagnetic shielding film are closely bonded, and further has A conductive function that cooperates with the second shield layer 2 to quickly introduce interfering electrons into the formation of the patch panel.
  • the conductive particles may be conductive particles separated from each other, or may be a large particle conductive particles agglomerated; when the conductive particles are conductive particles separated from each other, the area of electrical contact may be further improved, and electrical contact may be improved. Uniformity; and when the conductive particles are agglomerated large particle conductive particles, the puncture strength can be increased.
  • the electromagnetic shielding film further includes a protective film layer, and the first surface 11 of the first shielding layer 1 is formed with the protective film layer.
  • the protective film layer acts as a barrier to ensure the shielding effectiveness of the first shielding layer 1 and the second shielding layer 2.
  • the protective film layer is a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed by curing the epoxy resin ink, a film layer formed by curing the polyurethane ink, and a modified acrylic resin.
  • first shielding layer 1 and the second shielding layer 2 of the drawing of the present embodiment may have a single layer structure or a multi-layer structure.
  • first shielding layer and the second shielding layer of the drawings of the present embodiment may be disposed in a grid shape, a foamed shape, or the like according to actual production and application requirements.
  • the electromagnetic shielding film includes a first shielding layer 1, a second shielding layer 2, a film layer 3, and a plurality of a convex particle 4, a plurality of convex particles 4 disposed between the first shielding layer 1 and the second shielding layer 2, the first shielding layer 1 including an opposite first surface 11 and a second surface 12,
  • the second surface 12 is a flat surface; the plurality of convex particles 4 are attached on the second surface of the first shielding layer; the second shielding layer 2 is disposed on the second surface 12 of the first shielding layer 1 Up and covering the plurality of convex particles 4, so that the convex portion 212 is formed on the outer surface 21 of the second shield layer 2 at a position corresponding to the convex particles 4, and the flat portion 211 is formed at other positions.
  • the film layer 3 is disposed on the outer surface 21 of the second shielding layer 2; a plurality of conductive protrusion
  • the conductive bump 5 includes one or more of a metal bump, a carbon nanotube bump, and a ferrite bump.
  • the metal protrusions include single metal protrusions and/or alloy protrusions; wherein the single metal protrusions are any of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the conductive bumps 5 may be the same as or different from the materials of the first shielding layer 1 and the second shielding layer 2.
  • the conductive protrusions 5 are preferably distributed on the protrusions 212, and the second shielding layer 2 is more likely to pierce the film layer 3 during the pressing process, thereby achieving grounding and improving the quality of the electromagnetic shielding. .
  • the first shielding layer 1 and the second shielding layer 2 both have the function of conducting free electrons, and the materials used may be the same or different, specifically including a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer and graphite.
  • the metal shielding layer comprises a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of any of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
  • a material is made of the alloy shielding layer made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the material for the film layer 3 is preferably selected from the group consisting of modified epoxy resins, modified acrylics, modified rubbers, modified thermoplastic polyimides, and modified polyesters.
  • the convex particles 4 are distributed on the second surface 12 of the first shielding film (the second surface 12 is a flat surface), and its function is such that the outer surface 21 of the second shielding film forms a convex portion. 212, so that the convex portion 212 can smoothly pierce the layer of the film layer 3 and the printed circuit board during the process of pressing the electromagnetic shielding film with the printed circuit board to achieve reliable grounding.
  • the convex particles 4 include one or more of conductor particles, semiconductor particles, insulator particles, and coated composite particles (conductor-coated insulator particles, or another insulator-coated insulator particles, etc.), and also include small Large particles agglomerated by particles.
  • the convex particles 4 are diamond powder, titanium white powder, silicon powder, silicide powder, silica powder, aluminide powder, graphene powder, iron powder, nickel powder, copper powder, nickel-plated diamond. Powder, metal-plated inorganic powder, etc. It should be noted that the shape of the convex particles 4 in the present invention is not limited by the drawings, and the material thereof is not limited by the above materials as long as the outer surface 21 of the second shielding layer is formed to be convex. The particles of portion 212 are all within the scope of the present invention.
  • the height of the convex particles 4 is from 0.1 ⁇ m to 30 ⁇ m.
  • the ratio of the thickness of the film layer 3 to the undulation of the outer surface 21 of the second shield layer (corresponding to the height of the convex portion 212) and the height of the conductive bump 5 is preferably proportional to 0.8 to 2, in order to ensure sufficient puncture strength and amount of glue, specifically as follows: on the one hand to prevent the thickness of the film layer 3 relative to the outer surface 21 of the second shielding layer and the conductive convex The sum of the heights of 5 is too small to cause insufficient glue amount to cause a blast phenomenon, and on the other hand, the sum of the undulation of the outer surface 21 of the second shield layer and the height of the conductive bump 5 is prevented from being opposite to The thickness of the film layer 3 is too small to cause insufficient piercing strength to cause a grounding failure phenomenon. It should
  • the adhesive film layer 3 is disposed.
  • the convex portion 212 of the outer surface 21 of the second shielding layer and the same The conductive protrusions 5 cooperate with each other to enhance the piercing function, ensuring that the second shielding layer 2 penetrates the film layer 3 smoothly, thereby ensuring the normal discharge of the interference charge and achieving reliable grounding; and the flat portion 211 can reduce the use process. Insertion loss for UHF transmission.
  • the adhesive film layer 3 is an adhesive layer containing no conductive particles, which reduces the insertion loss of the circuit board during use, improves the shielding performance, and improves the bending property of the circuit board.
  • the conductive protrusions 5 are preferably distributed on the convex portion 212, and the second shielding layer 2 is more likely to pierce the film layer 3 during the pressing process, thereby achieving more reliable grounding. Improve the quality of electromagnetic shielding.
  • the adhesive film layer 3 is an adhesive layer with conductive particles, and the adhesive film layer 3 has a bonding function, so that the wiring board and the electromagnetic shielding film are closely bonded, and further has A conductive function that cooperates with the second shield layer 2 to quickly introduce interfering electrons into the formation of the patch panel.
  • the conductive particles may be conductive particles separated from each other, or may be a large particle conductive particles agglomerated; when the conductive particles are conductive particles separated from each other, the area of electrical contact may be further improved, and electrical contact may be improved. Uniformity; and when the conductive particles are agglomerated large particle conductive particles, the puncture strength can be increased.
  • the electromagnetic shielding film further includes a protective film layer, and the first surface 11 of the first shielding layer 1 is formed with the protective film layer.
  • the protective film layer acts as a barrier to ensure the shielding effectiveness of the first shielding layer 1 and the second shielding layer 2.
  • the protective film layer is a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed by curing the epoxy resin ink, a film layer formed by curing the polyurethane ink, and a modified acrylic resin.
  • first shielding layer 1 and the second shielding layer 2 of the drawing of the present embodiment may have a single layer structure or a multi-layer structure.
  • first shielding layer and the second shielding layer of the drawings of the present embodiment may be disposed in a grid shape, a foamed shape, or the like according to actual production and application requirements.
  • FIG. 3 is a schematic structural diagram of a circuit board according to Embodiment 3 of the present invention.
  • the circuit board includes a printed circuit board 6 and an electromagnetic shielding film according to Embodiment 1, and the electromagnetic shielding film passes through a film layer thereof. 3 is pressed against the printed wiring board 6; the raised portion 212 pierces the film layer 3 and extends to the ground layer of the printed wiring board 6.
  • the printed wiring board 6 is one of a flexible single-sided, a flexible double-sided, a flexible multilayer board, and a rigid-flex board.
  • the film layer 3 is pierced by the convex portion 212 of the second shielding layer 2 during the pressing process, so that at least a portion of the outer surface 21 of the second shielding layer 2 and the printed circuit board
  • the formation is connected to realize the introduction of the interfering charges in the first shielding layer 1 and the second shielding layer 2, thereby avoiding the accumulation of interference charges and forming an interference source, affecting the normal operation of the circuit board; and the flat portion 211 can be reduced. Insertion loss during use, suitable for UHF transmission.
  • the circuit board includes a printed circuit board 6 and an electromagnetic shielding film according to Embodiment 2, and the electromagnetic shielding film passes through a film layer thereof. 3 is pressed against the printed wiring board 6; the raised portion 212 pierces the film layer 3 and extends to the ground layer of the printed wiring board 6.
  • the convex portion 212 and the conductive protrusions 5 thereon are used to pierce the film layer 3 in cooperation with each other during the nip process, so that the outer surface 21 of the second shielding layer is at least partially Connecting with the ground layer of the printed circuit board, thereby realizing the interference charge introduction in the first shielding layer 1 and the second shielding layer 2, avoiding the accumulation of interference charges and forming an interference source, affecting the normal operation of the circuit board;
  • the smoothing portion 211 can reduce the insertion loss during use and is suitable for UHF transmission.
  • FIG. 5 is a schematic flow chart of a method for preparing an electromagnetic shielding film according to Embodiment 5 of the present invention.
  • the method is applicable to the preparation of the electromagnetic shielding film described in Embodiment 1, and includes the steps of:
  • the first shielding layer is formed by:
  • step S4 the forming a film layer on the outer surface of the second shielding layer is specifically:
  • a film layer is directly coated on the outer surface of the second shielding layer to form the film layer on the outer surface of the second shielding layer.
  • first shielding layer the convex particles, the second shielding layer or the glass layer
  • formation of the first shielding layer, the convex particles, the second shielding layer or the glass layer may preferably be performed by electroless plating, PVD, CVD, evaporation plating, sputtering plating, electroplating or a composite process thereof.
  • the step further comprises the step of:

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Abstract

一种电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法，其中，电磁屏蔽膜包括第一屏蔽层（1）、第二屏蔽层（2）、胶膜层（3）和若干凸状颗粒（4）；第一屏蔽层（1）包括相对的第一表面（11）和第二表面（12），第二表面（12）为平整表面；若干凸状颗粒（4）附着在第一屏蔽层（1）的第二表面（12）上；第二屏蔽层（2）配置在第一屏蔽层（1）的第二表面（12）上，并覆盖若干凸状颗粒（4），从而在第二屏蔽层（2）的外表面（21）的与凸状颗粒（4）对应的位置形成凸起部（212），而在其他位置形成平缓部（211）；胶膜层（3）配置在第二屏蔽层（2）的外表面（21）上，则凸起部（212）在压合过程中保证屏蔽层顺利刺穿胶膜层（3），保证干扰电荷正常导出，同时第二屏蔽层（2）的平缓部（211）又能降低使用过程中的插入损耗，适用于超高频传输。

Description

电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法 技术领域
本发明涉及电子领域，尤其涉及一种电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法。
背景技术
随着电子工业的迅速发展，电子产品进一步向小型化，轻量化，组装高密度化发展，极大地推动挠性电路板的发展，从而实现元件装置和导线连接一体化。挠性电路板可广泛应用于手机、液晶显示、通信和航天等行业。
在国际市场的推动下，功能挠性电路板在挠性电路板市场中占主导地位，而评价功能挠性电路板性能的一项重要指标是电磁屏蔽((Electromagnetic Interference Shielding，简称EMI Shielding)。随着手机等通讯设备功能的整合，其内部组件急剧高频高速化。例如：手机功能除了原有的音频传播功能外，照相功能已成为必要功能，且WLAN(Wireless Local Area Networks，无线局域网)、GPS(Global Positioning System，全球定位系统)以及上网功能已普及，再加上未来的感测组件的整合，组件急剧高频高速化的趋势更加不可避免。在高频及高速化的驱动下所引发的组件内部及外部的电磁干扰、信号在传输中衰减以及插入损耗和抖动问题逐渐严重。
目前，现有线路板常用的屏蔽膜包括屏蔽层和导电胶层，通过导电胶层将屏蔽层与线路板地层连接，进而将干扰电荷导入线路板地层，实现屏蔽。但是在高频传输时，导电胶层中的导电粒子会产生涡流损耗，进而导致线路板的插入损耗增大，影响信号传输完整性。
发明内容
本发明实施例的目的是提供一种电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法，能降低插入损耗，有效应用用于超高频传输。
为实现上述目的，本发明实施例提供了一种电磁屏蔽膜，包括第一屏蔽层、第二屏蔽层、胶膜层和若干凸状颗粒；所述第一屏蔽层包括相对的第一表面和第二表面，所述第二表面为平整表面；所述若干凸状颗粒附着在所述第一屏蔽层的第二表面上；所述第二屏蔽层配置在所述第一屏蔽层的第二表面上，并覆盖所述若干凸状颗粒，从而在所述第二屏蔽层的外表面上与所述凸状颗粒对应的位置形成凸起部，而在其他位置形成平缓部；所述胶膜层配置在所述第二屏蔽层的外表面上。
作为上述方案的改进，所述凸状颗粒包括导体颗粒、半导体颗粒、绝缘体颗粒和包覆复合颗粒的一种或多种。
作为上述方案的改进，所述凸状颗粒的高度为0.1μm-30μm。
作为上述方案的改进，所述第二屏蔽层的外表面上还形成有若干导电凸起。
作为上述方案的改进，所述导电凸起集中分布于所述凸起部。
作为上述方案的改进，所述胶膜层包括含有导电粒子的黏着层。
作为上述方案的改进，所述胶膜层包括不含导电粒子的黏着层。
作为上述方案的改进，所述第一屏蔽层和第二屏蔽层包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。
作为上述方案的改进，所述金属屏蔽层包括单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。
作为上述方案的改进，所述电磁屏蔽膜还包括保护膜层，所述第一屏蔽层的第一表面形成有所述保护膜层。
与现有技术相比，本发明实施例公开了一种电磁屏蔽膜，在所述第二屏蔽层的外表面上与所述凸状颗粒对应的位置形成凸起部，而在其他位置形成平缓部，所述第二屏蔽层的外表面上设有所述胶膜层，所述凸起部在压合过程中保证屏蔽层顺利刺穿胶膜层，保证干扰电荷正常导出，同时平缓部又能降低使用过程中的插入损耗，适用于超高频传输。
本发明实施例还对应提供了一种线路板，包括印刷线路板和上述任意一项所述的电磁屏蔽膜，所述电磁屏蔽膜通过其胶膜层与所述印刷线路板相压合；所述凸起部刺穿所述胶膜层，并延伸至所述印刷线路板的地层。
与现有技术相比，本发明实施例公开了一种线路板，所述线路板包括印刷线路板和上述任意一项所述的电磁屏蔽膜，所述电磁屏蔽膜通过其胶膜层与所述印刷线路板相压合，所述凸起部刺穿所述胶膜层，并延伸至所述印刷线路板的地层，实现干扰电荷顺利导出，同时所述平缓部又能降低使用过程中的插入损耗，适用于超高频传输。
本发明实施例还对应一种电磁屏蔽膜的制备方法，适用于制备上述任一项所述的电磁屏蔽膜，包括步骤：
S1、形成第一屏蔽层；其中，所述第一屏蔽层包括相对的第一表面和第二表面，所述第二表面为平整表面；
S2、在第一屏蔽层的第二表面形成若干凸状颗粒；
S3、在分布有所述凸状颗粒的第二表面上形成第二屏蔽层；其中，所述第二屏蔽层的外表面在与所述凸状颗粒对应的位置形成凸起部，而在其他位置形成平缓部；
S4、在所述第二屏蔽层的外表面上形成胶膜层。
作为上述方案的改进，步骤S1中通过以下方式形成所述第一屏蔽层：
在载体膜上形成保护膜层，在所述保护膜层上形成所述第一屏蔽层；其中， 所述第一表面与所述保护膜层贴合；或
在载体膜上形成可剥离层，在所述可剥离层的表面上形成所述第一屏蔽层，在所述第一屏蔽层的第一表面形成保护膜层后，将所述载体膜层剥离。
作为上述方案的改进，在所述第二屏蔽层的外表面上形成胶膜层前还包括以下步骤：
通过物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺在所述第二屏蔽层的外表面形成若干导电凸起。
作为上述方案的改进，在步骤S4中，所述在所述第二屏蔽层的外表面上形成胶膜层具体为：
在离型膜上涂布胶膜层，然后将所述胶膜层压合转移至所述第二屏蔽层的外表面，从而在所述第二屏蔽层的外表面上形成所述胶膜层；或
直接在所述第二屏蔽层的外表面涂布胶膜层，从而在所述第二屏蔽层的外表面上形成所述胶膜层。
与现有技术相比，本发明实施例所提供的电磁屏蔽膜的制备方法，通过在第一屏蔽层的第二表面形成若干凸状颗粒，在分布有所述凸状颗粒的第二表面上形成第二屏蔽层，从而在所述第二屏蔽层的外表面上与所述凸状颗粒对应的位置形成凸起部，在其他位置形成平缓部，可在压合过程中保证屏蔽层顺利刺穿胶膜层，实现可靠的接地，实用性强，同时降低使用过程中的插入损耗，适用于超高频传输。
附图说明
图1是本发明实施例1中一种电磁屏蔽膜的结构示意图。
图2是本发明实施例2中一种电磁屏蔽膜的结构示意图。
图3是本发明实施例3中一种线路板的结构示意图。
图4是本发明实施例4中一种线路板的结构示意图。
图5是本发明实施例5中一种电磁屏蔽膜的制备方法的流程示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
参见图1，是本发明实施例1中一种电磁屏蔽膜的结构示意图，如图1所示，所述电磁屏蔽膜包括第一屏蔽层1、第二屏蔽层2、胶膜层3和若干凸状颗粒，所述第一屏蔽层1包括相对的第一表面11和第二表面12，所述第二表面12为平整表面，所述若干凸状颗粒附着在所述第一屏蔽层1的第二表面12上；所述第二屏蔽层2配置在所述第一屏蔽层1的第二表面12上，并覆盖所述若干凸状颗粒，从而在所述第二屏蔽层2的外表面21上与所述凸状颗粒4对应的位置形成凸起部212，而在其他位置形成平缓部211；所述胶膜层3配置在所述第二屏蔽层2的外表面21上。
所述第一屏蔽层1和第二屏蔽层2均具有传导自由电子的功能，其所用的材料可相同也可不同，具体包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。其中，所述金属屏蔽层包括单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。另外，所述胶膜层3所用材料优选自以下几种：改性环氧树脂类、改性丙烯酸类、改性橡胶类、改性热塑性聚酰亚胺类、改性聚酯类。
在本实施例中，所述凸状颗粒4分布于第一屏蔽膜的第二表面12上(第二表面12为平整表面)，其功能为使得第二屏蔽膜的外表面21形成凸起部212，从而使得电磁屏蔽膜与印刷线路板压合过程中，该凸起部212能顺利刺穿胶膜层3与印刷线路板的地层，实现可靠接地。所述凸状颗粒4包括导体颗粒、半导体颗粒、绝缘体颗粒和包覆复合颗粒(导体包覆的绝缘体颗粒，或者绝缘体包覆的另一种绝缘体颗粒等)的一种或多种，还包括小颗粒团聚而成的大颗粒。实际应用中，所述凸状颗粒4为钻石粉、钛白粉、硅粉末、硅化物粉末、二氧化硅粉末、铝化物粉末、石墨烯粉体、铁粉、镍粉、铜粉、镀镍钻石粉，镀金属无机粉体等。需要说明的是，本发明中的凸状颗粒4的形状并不受图示的限制，其材料也不受上述材料的限制，只要是具有使得所述第二屏蔽层的外表面21形成凸起部212的颗粒，均在本发明的保护范围之内。
为了满足所述第二屏蔽膜的外表面21形成足够刺穿胶膜层3的凸起部212，所述凸状颗粒4的高度为0.1μm-30μm。另外，所述胶膜层3的厚度与所述第二屏蔽层的外表面21的起伏度(相当于凸起部212的高度)满足比例关系优选为：0.8～2，以保证足够的刺穿强度和容胶量，具体体现为：一方面防止胶膜层3的厚度相对于第二屏蔽膜的外表面21的起伏度过小而导致容胶量不足，进而导致爆板现象；另一方面防止第二屏蔽膜的外表面21的起伏度相对于胶膜层3的厚度过小而导致刺穿强度不足而导致接地失效现象产生。需要说明的是，所述第二屏蔽膜的外表面21的起伏度为所述第二屏蔽膜的外表面21的最高点和最低点的距离。
基于上述结构，在所述第二屏蔽层2的外表面21上与所述凸状颗粒4对应的位置形成凸起部212，而在其他位置形成平缓部211，所述第二屏蔽层2的外表面21上设有所述胶膜层3，所述第二屏蔽层2的外表面21的凸起部212在压合过程中保证第二屏蔽层顺利刺穿胶膜层3，保证干扰电荷正常导出，同时平缓部211又能降低使用过程中的插入损耗，适用于超高频传输。
优选地，所述胶膜层3为不含导电粒子的黏着层，降低使用过程中线路板的插入损耗，提高屏蔽效能的同时改善线路板的弯折性。
在另一优选实施例中，所述胶膜层3为带有导电粒子的黏着层，则所述胶膜层3除了具有黏合的作用，使所述接线板和电磁屏蔽膜紧密黏合，还具有导电的功能，其与第二屏蔽层2相配合，将干扰电子迅速导入所述接线板的地层中。其中，所述导电粒子可以为相互分离的导电粒子，也可以为团聚而成的大颗粒导电粒子；当所述导电粒子为相互分离的导电粒子时，可进一步提高电气接触的面积，提高电气接触的均匀度；而当所述导电粒子为团聚而成的大颗粒导电粒子，可增加刺穿强度。
优选地，所述电磁屏蔽膜还包括保护膜层，所述第一屏蔽层1的第一表面11形成有所述保护膜层。所述保护膜层起到隔绝作用从而保证所述第一屏蔽层1和第二屏蔽层2的屏蔽效能。所述保护膜层为PPS薄膜层、PEN薄膜层、聚酯薄膜层、聚酰亚胺薄膜层、环氧树脂油墨固化后形成的膜层、聚氨酯油墨固化后形成的膜层、改性丙烯酸树脂固化后形成的膜层、聚酰亚胺树脂固化后形成的膜层中的一种。
需要说明的是，本实施例附图的第一屏蔽层1和第二屏蔽层2可为单层结构，也可以为多层结构。另外，根据实际生产和应用的需要，本实施例附图的第一屏蔽层和第二屏蔽层可设置为网格状、发泡状等。
参见图2，是本发明实施例2中一种电磁屏蔽膜的结构示意图，如图2所示，所述电磁屏蔽膜包括第一屏蔽层1、第二屏蔽层2、胶膜层3和若干凸状颗粒4，若干凸状颗粒4设于所述第一屏蔽1层和第二屏蔽层2之间，所述第一屏蔽层1包括相对的第一表面11和第二表面12，所述第二表面12为平整表面；所述若干凸状颗粒4附着在所述第一屏蔽层的第二表面上；所述第二屏蔽层2配置在所述第一屏蔽层1的第二表面12上，并覆盖所述若干凸状颗粒4，从而在所述第二屏蔽层2的外表面21上与所述凸状颗粒4对应的位置形成凸起部212，而在其他位 置形成平缓部211；所述胶膜层3配置在所述第二屏蔽层2的外表面21上；所述第二屏蔽层2的外表面21上还形成有若干导电凸起5。
所述导电凸起5包括金属凸起、碳纳米管凸起和铁氧体凸起中的一种或多种。此外，所述金属凸起包括单金属凸起和/或合金凸起；其中，所述单金属凸起由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金凸起由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。需要说明的是，导电凸起5可与跟第一屏蔽层1、第二屏蔽层2的材料相同，也可不相同。
所述导电凸起5优选为集中分布于所述凸起部212上，则所述第二屏蔽层2在压合过程中更容易刺穿胶膜层3，从而实现接地，提高电磁屏蔽的质量。
所述第一屏蔽层1和第二屏蔽层2均具有传导自由电子的功能，其所用的材料可相同也可不同，具体包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。其中，所述金属屏蔽层包括单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。另外，所述胶膜层3所用材料优选自以下几种：改性环氧树脂类、改性丙烯酸类、改性橡胶类、改性热塑性聚酰亚胺类、改性聚酯类。
在本实施例中，所述凸状颗粒4分布于第一屏蔽膜的第二表面12上(第二表面12为平整表面)，其功能为使得第二屏蔽膜的外表面21形成凸起部212，从而使得电磁屏蔽膜与印刷线路板压合过程中，该凸起部212能顺利刺穿胶膜层3与印刷线路板的地层，实现可靠接地。所述凸状颗粒4包括导体颗粒、半导体颗粒、绝缘体颗粒和包覆复合颗粒(导体包覆的绝缘体颗粒，或者绝缘体包覆的另一种绝缘体颗粒等)的一种或多种，还包括小颗粒团聚而成的大颗粒。实际应用中，所述凸状颗粒4为钻石粉、钛白粉、硅粉末、硅化物粉末、二氧化硅粉末、 铝化物粉末、石墨烯粉体、铁粉、镍粉、铜粉、镀镍钻石粉，镀金属无机粉体等。需要说明的是，本发明中的凸状颗粒4的形状并不受图示的限制，其材料也不受上述材料的限制，只要是具有使得所述第二屏蔽层的外表面21形成凸起部212的颗粒，均在本发明的保护范围之内。
为了满足所述第二屏蔽层的外表面21形成足够刺穿胶膜层3的凸起部212，所述凸状颗粒4的高度为0.1μm-30μm。另外，所述胶膜层3的厚度与所述第二屏蔽层的外表面21的起伏度(相当于凸起部212的高度)和所述导电凸起5的高度的和满足比例关系优选为：0.8～2，以保证足够的刺穿强度和容胶量，具体体现为：一方面防止胶膜层3的厚度相对于所述第二屏蔽层的外表面21的起伏度与所述导电凸起5的高度的和过小而导致容胶量不足进而导致爆板现象，另一方面防止所述第二屏蔽层的外表面21的起伏度与所述导电凸起5的高度的和相对于胶膜层3的厚度过小而导致刺穿强度不足进而导致接地失效现象产生。需要说明的是，所述第二屏蔽层的外表面21的起伏度为所述第二屏蔽层的外表面21的最高点和最低点的距离。
基于上述结构，由于在所述第二屏蔽层2的外表面21的与所述凸状颗粒4对应的位置形成凸起部212，而在其他位置形成平缓部211，所述胶膜层3配置在所述第二屏蔽层2的外表面21上，且第二屏蔽层2的外表面21上还形成有若干导电凸起5，则第二屏蔽层的外表面21的凸起部212和其上的导电凸起5相互协同，增强刺穿功能，保证第二屏蔽层2顺利刺穿胶膜层3，从而确保干扰电荷正常导出，实现可靠接地；同时平缓部211又能降低使用过程中的插入损耗，适用于超高频传输。
优选地，所述胶膜层3为不含导电粒子的黏着层，降低使用过程中线路板的插入损耗，提高屏蔽效能的同时改善线路板的弯折性。
另外，所述导电凸起5优选为集中分布于所述凸起部212上，则所述第二屏蔽层2在压合过程中更容易刺穿胶膜层3，从而实现更可靠的接地，提高电磁屏 蔽的质量。
在另一优选实施例中，所述胶膜层3为带有导电粒子的黏着层，则所述胶膜层3除了具有黏合的作用，使所述接线板和电磁屏蔽膜紧密黏合，还具有导电的功能，其与第二屏蔽层2相配合，将干扰电子迅速导入所述接线板的地层中。其中，所述导电粒子可以为相互分离的导电粒子，也可以为团聚而成的大颗粒导电粒子；当所述导电粒子为相互分离的导电粒子时，可进一步提高电气接触的面积，提高电气接触的均匀度；而当所述导电粒子为团聚而成的大颗粒导电粒子，可增加刺穿强度。
优选地，所述电磁屏蔽膜还包括保护膜层，所述第一屏蔽层1的第一表面11形成有所述保护膜层。所述保护膜层起到隔绝作用从而保证所述第一屏蔽层1和第二屏蔽层2的屏蔽效能。所述保护膜层为PPS薄膜层、PEN薄膜层、聚酯薄膜层、聚酰亚胺薄膜层、环氧树脂油墨固化后形成的膜层、聚氨酯油墨固化后形成的膜层、改性丙烯酸树脂固化后形成的膜层、聚酰亚胺树脂固化后形成的膜层中的一种。
需要说明的是，本实施例附图的第一屏蔽层1和第二屏蔽层2可为单层结构，也可以为多层结构。另外，根据实际生产和应用的需要，本实施例附图的第一屏蔽层和第二屏蔽层可设置为网格状、发泡状等。
参见图3，为本发明实施例3提供的一种线路板的结构示意图，所述线路板包括印刷线路板6和实施例1所述的电磁屏蔽膜，所述电磁屏蔽膜通过其胶膜层3与所述印刷线路板6相压合；所述凸起部212刺穿所述胶膜层3，并延伸至所述印刷线路板6的地层。
在本实施例中，关于电磁屏蔽膜的实现方式可参考上述实施例1的描述，在此不再赘述。
优选地，所述印刷线路板6为挠性单面、挠性双面、挠性多层板、刚挠结合板中的一种。
通过上述结构，在压合过程中，利用所述第二屏蔽层2的凸起部212将胶膜层3刺穿，从而使得第二屏蔽层2的外表面21至少一部分与所述印刷电路板的地层连接，从而实现第一屏蔽层1和第二屏蔽层2中的干扰电荷导入地中，避免了干扰电荷的积聚而形成干扰源，影响线路板的正常工作；同时平缓部211又能降低使用过程中的插入损耗，适用于超高频传输。
参见图4，为本发明实施例4提供的一种线路板的结构示意图，所述线路板包括印刷线路板6和实施例2所述的电磁屏蔽膜，所述电磁屏蔽膜通过其胶膜层3与所述印刷线路板6相压合；所述凸起部212刺穿所述胶膜层3，并延伸至所述印刷线路板6的地层。
在本实施例中，关于电磁屏蔽膜的实现方式可参考上述实施例2的描述，在此不再赘述。
通过上述结构，在压合过程中，利用所述凸起部212和其上的导电凸起5相互协同刺穿所述胶膜层3，从而使得所述第二屏蔽层的外表面21至少一部分与所述印刷电路板的地层连接，从而实现第一屏蔽层1和第二屏蔽层2中的干扰电荷导入地中，避免了干扰电荷的积聚而形成干扰源，影响线路板的正常工作；同时平缓部211又能降低使用过程中的插入损耗，适用于超高频传输。
参见图5，为本发明实施例5提供的一种提供的电磁屏蔽膜制备方法的流程示意图，该方法适用于实施例1所述的电磁屏蔽膜的制备，包括步骤：
S1、形成第一屏蔽层；其中，所述第一屏蔽层包括相对的第一表面和第二表面，所述第二表面为平整表面；
其中，在步骤S1中通过以下方式形成所述第一屏蔽层：
在载体膜上形成保护膜层，在所述保护膜层上形成所述第一屏蔽层；其中，所述第一表面与所述保护膜层贴合；或
在载体膜上形成可剥离层，在所述可剥离层的表面上形成所述第一屏蔽层，在所述第一屏蔽层的第一表面形成保护膜层后，将所述载体膜层剥离。
S2、在第一屏蔽层的第二表面形成若干凸状颗粒；
S3、在分布有所述凸状颗粒的第二表面上形成第二屏蔽层；其中，在分布有所述凸状颗粒的第二表面上形成第二屏蔽层；其中，所述第二屏蔽层的外表面在与所述凸状颗粒对应的位置形成凸起部，而在其他位置形成平缓部；
S4、在所述第二屏蔽层的外表面上形成胶膜层。
其中，在步骤S4中，所述在所述第二屏蔽层的外表面上形成胶膜层具体为：
在离型膜上涂布胶膜层，然后将所述胶膜层压合转移至所述第二屏蔽层的外表面，从而在所述第二屏蔽层的外表面上形成所述胶膜层；或
直接在所述第二屏蔽层的外表面涂布胶膜层，从而在所述第二屏蔽层的外表面上形成所述胶膜层。
需要说明的是，形成第一屏蔽层、凸状颗粒、第二屏蔽层或玻璃层均可优选为采用化学镀方式、PVD、CVD、蒸发镀、溅射镀、电镀或者其复合工艺进行。
在适用于制备实施例2所述的电磁屏蔽膜的另一优选实施例中，在步骤S4前还包括步骤：
通过物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺在所述第二屏蔽层的外表面形成若干导电凸起。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (15)

  1. 一种电磁屏蔽膜，其特征在于，包括第一屏蔽层、第二屏蔽层、胶膜层和若干凸状颗粒；所述第一屏蔽层包括相对的第一表面和第二表面，所述第二表面为平整表面；所述若干凸状颗粒附着在所述第一屏蔽层的第二表面上；所述第二屏蔽层配置在所述第一屏蔽层的第二表面上，并覆盖所述若干凸状颗粒，从而在所述第二屏蔽层的外表面的与所述凸状颗粒对应的位置形成凸起部，而在其他位置形成平缓部；所述胶膜层配置在所述第二屏蔽层的外表面上。
  2. 如权利要求1所述的电磁屏蔽膜，其特征在于，所述凸状颗粒包括导体颗粒、半导体颗粒、绝缘体颗粒和包覆复合颗粒的一种或多种。
  3. 如权利要求1所述的电磁屏蔽膜，其特征在于，所述凸状颗粒的高度为0.1μm-30μm。
  4. 如权利要求1任一项所述的电磁屏蔽膜，其特征在于，所述第二屏蔽层的外表面上还形成有若干导电凸起。
  5. 如权利要求4所述的电磁屏蔽膜，其特征在于，所述导电凸起集中分布于所述凸起部。
  6. 如权利要求1所述的电磁屏蔽膜，其特征在于，所述胶膜层包括含有导电粒子的黏着层。
  7. 如权利要求1所述的电磁屏蔽膜，其特征在于，所述胶膜层包括不含导电粒子的黏着层。
  8. 如权利要求1任一项所述的电磁屏蔽膜，其特征在于，所述第一屏蔽层和第二屏蔽层包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。
  9. 如权利要求8所述的电磁屏蔽膜，其特征在于，所述金属屏蔽层包括单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。
  10. 如权利要求1所述的电磁屏蔽膜，其特征在于，所述电磁屏蔽膜还包括保护膜层，所述第一屏蔽层的第一表面形成有所述保护膜层。
  11. 一种线路板，其特征在于，包括印刷线路板和权利要求1至10任意一项所述的电磁屏蔽膜，所述电磁屏蔽膜通过其胶膜层与所述印刷线路板相压合；所述凸起部刺穿所述胶膜层，并延伸至所述印刷线路板的地层。
  12. 一种电磁屏蔽膜的制备方法，其特征在于，适用于制备权利要求1至10任一项所述的电磁屏蔽膜，包括步骤：
    S1、形成第一屏蔽层；其中，所述第一屏蔽层包括相对的第一表面和第二表 面，所述第二表面为平整表面；
    S2、在第一屏蔽层的第二表面形成若干凸状颗粒；
    S3、在分布有所述凸状颗粒的第二表面上形成第二屏蔽层；其中，所述第二屏蔽层的外表面在与所述凸状颗粒对应的位置形成凸起部，而在其他位置形成平缓部；
    S4、在所述第二屏蔽层的外表面上形成胶膜层。
  13. 如权利要求12所述的电磁屏蔽膜的制备方法，其特征在于，步骤S1中通过以下方式形成所述第一屏蔽层：
    在载体膜上形成保护膜层，在所述保护膜层上形成所述第一屏蔽层；其中，所述第一表面与所述保护膜层贴合；或
    在载体膜上形成可剥离层，在所述可剥离层的表面上形成所述第一屏蔽层，在所述第一屏蔽层的第一表面形成保护膜层后，将所述载体膜层剥离。
  14. 如权利要求12或13所述的电磁屏蔽膜的制备方法，其特征在于，在所述第二屏蔽层的外表面上形成胶膜层前还包括以下步骤：
    通过物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺在所述第二屏蔽层的外表面形成若干导电凸起。
  15. 如权利要求12任一项所述的电磁屏蔽膜的制备方法，其特征在于，在步骤S4中，所述在所述第二屏蔽层的外表面上形成胶膜层具体为：
    在离型膜上涂布胶膜层，然后将所述胶膜层压合转移至所述第二屏蔽层的外 表面，从而在所述第二屏蔽层的外表面上形成所述胶膜层；或
    直接在所述第二屏蔽层的外表面涂布胶膜层，从而在所述第二屏蔽层的外表面上形成所述胶膜层。
PCT/CN2018/080019 2018-03-14 2018-03-22 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法 WO2019174065A1 (zh)

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