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TW201819086A - Substrate processing method - Google Patents

Substrate processing method Download PDF

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Publication number
TW201819086A
TW201819086A TW106139374A TW106139374A TW201819086A TW 201819086 A TW201819086 A TW 201819086A TW 106139374 A TW106139374 A TW 106139374A TW 106139374 A TW106139374 A TW 106139374A TW 201819086 A TW201819086 A TW 201819086A
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Taiwan
Prior art keywords
substrate
layer
mark
cutting
processing
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TW106139374A
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Chinese (zh)
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TWI794192B (en
Inventor
市川健一
立石薰
伊藤靖
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維亞機械股份有限公司
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Publication of TWI794192B publication Critical patent/TWI794192B/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H7/00—Marking-out or setting-out work
    • B25H7/04—Devices, e.g. scribers, for marking
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/32—After-treatment
    • C03C2218/328—Partly or completely removing a coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

Description

基板的加工方法Processing method of substrate

本發明是關於在使用玻璃基板作為構成材料的基板的正面和背面上形成目標性的標記的基板的加工方法。This invention relates to the processing method of the board | substrate which forms a target mark on the front and back surfaces of a board | substrate using a glass substrate as a constituent material.

藉由例如在玻璃基板的正面和背面上黏貼樹脂層來提供樹脂層，在這樣的基板的加工過程中，存在需要將用於對準位置的如對齊標記這樣的標記形成在樹脂層上的情況。 另一方面，作為在基板上形成對齊標記的方法，習知有藉由如專利文獻1所公開的如鑽頭的機械加工裝置進行的方法。當藉由該方法在上述基板的樹脂層上形成對齊標記時，存在有在玻璃基板上的對齊標記形成位置產生裂紋的問題。The resin layer is provided by, for example, pasting a resin layer on the front and back surfaces of a glass substrate. During the processing of such a substrate, a mark such as an alignment mark for alignment position may be required to be formed on the resin layer. . On the other hand, as a method of forming an alignment mark on a substrate, a method performed by a machining device such as a drill as disclosed in Patent Document 1 is known. When an alignment mark is formed on the resin layer of the substrate by this method, there is a problem that a crack is generated at an alignment mark formation position on a glass substrate.

[習知技術文獻] [專利文獻] 專利文獻1：日本特開2007-7776號公報[Known Technical Literature] [Patent Literature] Patent Literature 1: Japanese Patent Laid-Open No. 2007-7776

[發明所要解決的問題] 鑑於上述情況，本發明的目的是在以玻璃基板作為構成材料的基板的正面和背面上形成目標性的標記時，在玻璃基板上不容易發生裂紋。 [解決問題的方法][Problems to be Solved by the Invention] In view of the foregoing, an object of the present invention is to prevent cracks from easily occurring on a glass substrate when a target mark is formed on the front and back surfaces of a substrate using a glass substrate as a constituent material. [way of solving the problem]

本發明揭示的一種代表性的基板的加工方法，對包含第一層與第二層的前述基板，於前述第二層的每一個上形成目標性的一標記，其中前述第一層由玻璃基板所形成，前述第二層設置在前述第一層的正面和背面的每一個上且與前述第一層為不同材質，在前述基板的加工方法中，從前述基板的一側的面照射一雷射，前述雷射的能量密度能對前述第二層加工但不能對前述第一層加工，以在前述基板的正面和背面對應處同時形成前述標記。 [發明的效果]According to a representative substrate processing method disclosed in the present invention, a target mark is formed on each of the second layers of the substrate including the first layer and the second layer, wherein the first layer is a glass substrate. As a result, the second layer is disposed on each of the front and back surfaces of the first layer and is made of a material different from that of the first layer. In the method for processing the substrate, a light is irradiated from one side of the substrate. The energy density of the laser can process the second layer but cannot process the first layer to form the mark at the same time on the front and back of the substrate. [Effect of the invention]

根據本發明，當在以玻璃基板作為構成材料的基板的正面和背面上形成目標性的標記時，玻璃基板上不容易發生裂紋，並且可在正面和背面的每一個上同時形成目標性的圖案。According to the present invention, when a target mark is formed on the front and back surfaces of a substrate using a glass substrate as a constituent material, cracks are unlikely to occur on the glass substrate, and a target pattern can be simultaneously formed on each of the front and back surfaces .

[實施例] 以下，利用圖式說明本發明的實施方式。首先，說明於玻璃基板的正面和背面上所設置的樹脂層上使用雷射形成對齊標記的實施例1。以下說明中，複數的圖式中，相同的元件將顯示相同的元件符號。[Examples] Hereinafter, embodiments of the present invention will be described using drawings. First, Example 1 in which alignment marks are formed on a resin layer provided on a front surface and a back surface of a glass substrate using laser light will be described. In the following description, the same elements in the plural drawings will show the same element symbols.

圖2為用以說明本發明的實施例1的圖式，（a）是加工前的工件的俯視圖，（b）是沿（a）的A-A線的剖面圖。在圖2中，1是作為工件的基板，2是用於承載基板1的工作台，3是作為基板1的構成材料的玻璃基板，4是貼附在玻璃基板3的正面上的樹脂層，5是貼附在玻璃基板3的背面上的樹脂層。在此情況下，除了以貼附方式設置樹脂層4和5之外，還可以透過其它方法，例如塗佈處理等來設置樹脂層。6是表示應形成在樹脂層4上的圓形的對齊標記形成位置，在與對齊標記形成位置6對應的工作台2的位置上，設置有直徑比形成的對齊標記的直徑大的雷射通孔7，用於避免雷射照射到工作台2。Fig. 2 is a drawing for explaining Example 1 of the present invention, (a) is a plan view of a workpiece before processing, and (b) is a cross-sectional view taken along line A-A of (a). In FIG. 2, 1 is a substrate as a workpiece, 2 is a table for carrying the substrate 1, 3 is a glass substrate as a constituent material of the substrate 1, and 4 is a resin layer attached to the front surface of the glass substrate 3. 5 is a resin layer attached to the back surface of the glass substrate 3. In this case, in addition to providing the resin layers 4 and 5 in an adhesive manner, the resin layer may be provided by other methods such as a coating process or the like. Reference numeral 6 denotes a circular alignment mark formation position to be formed on the resin layer 4. A laser pass having a diameter larger than the diameter of the alignment mark formed is provided at the position of the table 2 corresponding to the alignment mark formation position 6. Hole 7 is used to prevent the laser beam from hitting the worktable 2.

圖2的（a）、（b）狀態中，如箭頭10所示，對樹脂層4的對齊標記形成位置6的每一個依次從上方用紫外線雷射照射。該紫外線雷射，例如能量密度為20mJ/mm2 ，為可以加工樹脂，但不能加工玻璃的能量密度。 通過正面的樹脂層4的紫外線雷射，可在不損害玻璃基板3的情況下，通過玻璃基板3，並到達背面的樹脂層5。因此，在該加工之後，基板1的剖面圖如圖1所示，在對齊標記形成位置6處的樹脂層4和5被除去，並且分別產生成為圓孔的對齊標記8和9，藉以完成基板1。 在此情況下，由於雷射加工本身的特性使然，即使位於樹脂層5側的對齊標記9的直徑比樹脂層4側的對齊標記8的直徑稍小，因彼此的中心是在上下的對應位置，作為對齊標記並無不妥之處。In the states (a) and (b) of FIG. 2, as shown by an arrow 10, each of the alignment mark formation positions 6 of the resin layer 4 is sequentially irradiated with an ultraviolet laser from above. This ultraviolet laser has, for example, an energy density of 20 mJ / mm 2 and is an energy density that can process resin but cannot process glass. The ultraviolet laser of the resin layer 4 on the front side can pass through the glass substrate 3 and reach the resin layer 5 on the back side without damaging the glass substrate 3. Therefore, after the processing, the cross-sectional view of the substrate 1 is as shown in FIG. 1, and the resin layers 4 and 5 at the alignment mark formation position 6 are removed, and the alignment marks 8 and 9 which become circular holes are respectively generated, thereby completing the substrate. 1. In this case, due to the characteristics of the laser processing itself, even if the diameter of the alignment mark 9 on the resin layer 5 side is slightly smaller than the diameter of the alignment mark 8 on the resin layer 4, the center of each other is the corresponding position above and below. , There is nothing wrong with the alignment mark.

根據以上的實施例1，可以減少對玻璃基板3產生的影響，在樹脂層4和5上同時形成對齊標記8和9，並且其中心形成在上下的正確對應位置上。 在以上的實施例中，如果以紫外線雷射照射進行反覆的小直徑的圓孔鑽孔加工成為大直徑的圓孔，能夠將對齊標記8、9的直徑變大。According to the above embodiment 1, the influence on the glass substrate 3 can be reduced, and the alignment marks 8 and 9 can be formed on the resin layers 4 and 5 at the same time, and the center of the alignment marks 8 and 9 can be formed. In the above embodiment, if the small-diameter circular hole is repeatedly drilled into a large-diameter circular hole by ultraviolet laser irradiation, the diameters of the alignment marks 8 and 9 can be increased.

接下來，說明實施例2，在設置在玻璃基板的正面和背面上的樹脂層上利用雷射形成裁切時的裁切用切割標記，裁切用切割標記用於將該基板分割成多個矩形的小基板。該裁切用切割標記用於防止樹脂層附著到裁切機的刀片阻礙裁切，並除去樹脂層的切割部分。Next, Example 2 will be described, in which a cutting mark for cutting is formed on a resin layer provided on a front surface and a back surface of a glass substrate when cutting by cutting, and the cutting mark for cutting is used to divide the substrate into a plurality of pieces. Small rectangular substrate. This cutting mark for cutting is used to prevent the resin layer from adhering to the blade of the cutting machine from obstructing cutting, and to remove the cut portion of the resin layer.

圖4是用以說明實施例2的圖，（a）是加工前的工件的俯視圖，（b）是加工途中沿（a）的B-B線的剖面圖。在圖4中，21是作為工件的基板，22是用於承載基板21的工作台，23是作為基板21的構成材料的玻璃基板，24是貼附在玻璃基板23的正面上的樹脂層，25是貼附在玻璃基板23的背面的樹脂層。在此情況下，除了以貼附方式設置樹脂層24和25之外，還可以透過其他方法，例如塗佈處理等來設置樹脂層。26是表示應形成在樹脂層24上的裁切用切割標記形成位置，在與裁切用切割標記形成位置26對應的工作台22的位置處，設置有面積較形成的裁切用切割標記的面積更寬廣的雷射通孔27，用於避免雷射照射到工作台22。 應當注意，在該示例中，裁切用切割標記是呈十字形，藉以將基板21分成四個矩形的小基板，但也可以使用其他形狀。FIG. 4 is a diagram for explaining Example 2. (a) is a plan view of a workpiece before processing, and (b) is a cross-sectional view taken along line B-B of (a) during processing. In FIG. 4, 21 is a substrate as a workpiece, 22 is a table for carrying the substrate 21, 23 is a glass substrate as a constituent material of the substrate 21, and 24 is a resin layer attached to the front surface of the glass substrate 23. 25 is a resin layer attached to the back surface of the glass substrate 23. In this case, in addition to providing the resin layers 24 and 25 in a sticking manner, the resin layer may be provided by other methods such as a coating process or the like. 26 indicates a cutting mark forming position to be formed on the resin layer 24, and a cutting mark having a larger area is provided at a position of the table 22 corresponding to the cutting mark forming position 26. A wider laser through hole 27 is used to prevent the laser from irradiating the table 22. It should be noted that in this example, the cutting marks for cutting are in a cross shape, so that the substrate 21 is divided into four rectangular small substrates, but other shapes may be used.

在圖4（a）和4（b）的狀態中，如箭頭20所示，在裁切用切割標記形成位置26一邊從上方用紫外線雷射照射，一邊相對移動工作台22，使紫外線雷射朝箭頭31的方向移動。該紫外線雷射，如同於實施例1的情況，能量密度為20mJ/mm2 ，成為可以加工樹脂但不能加工玻璃的能量。 通過正面的樹脂層24的紫外線雷射可在不損傷玻璃基板23的情況下，通過玻璃基板23並到達背面的樹脂層25。因此，在紫外線雷射通過後的樹脂層24和25的部分28和29將被除去，加工之後，在樹脂層24和25的裁切用切割標記形成位置26上形成有凹槽28、29，完成基板21。基板21的正面側如圖3所示，30是藉由凹槽28的裁切用切割標記，並且在背面側的對應位置處還形成有藉由凹槽29的裁切用切割標記。 在此情況下，由於雷射加工本身的特性使然，即使樹脂層25側的裁切用切割標記的凹槽29的寬度比樹脂層24側的裁切用切割標記30的凹槽28的寬度稍小，如果凹槽的寬度相對於裁切機的刀片寬度存在餘裕，因彼此的中心是上下的對應位置，做為裁切用切割標記並無不妥之處。In the states of FIGS. 4 (a) and 4 (b), as shown by arrow 20, the cutting mark forming position 26 for cutting is irradiated with ultraviolet laser light from above, while moving the table 22 relatively, so that the ultraviolet laser light is emitted. Move in the direction of arrow 31. This ultraviolet laser has an energy density of 20 mJ / mm 2 as in the case of Example 1, and has energy that can process resin but cannot process glass. The ultraviolet laser beam passing through the resin layer 24 on the front side can pass through the glass substrate 23 and reach the resin layer 25 on the back side without damaging the glass substrate 23. Therefore, the portions 28 and 29 of the resin layers 24 and 25 after the ultraviolet laser light passes will be removed. After processing, the grooves 28 and 29 are formed in the cutting mark forming position 26 for cutting of the resin layers 24 and 25. The substrate 21 is completed. As shown in FIG. 3, the front side of the substrate 21 is a cutting mark for cutting with a groove 28, and a cutting mark for cutting with a groove 29 is formed at a corresponding position on the back side. In this case, due to the characteristics of the laser processing itself, even if the width of the groove 29 of the cutting mark on the resin layer 25 side is slightly larger than the width of the groove 28 of the cutting mark 30 on the resin layer 24 side If the width of the groove is larger than the width of the blade of the cutting machine, since the centers of the grooves are corresponding to each other, there is nothing wrong with cutting marks for cutting.

根據以上的實施例2，可以減少對玻璃基板23的影響，在樹脂層24和25上同時形成裁切用切割標記，並且其中心形成在上下的正確對應位置。According to the above embodiment 2, the influence on the glass substrate 23 can be reduced, and the cutting marks for cutting can be formed on the resin layers 24 and 25 at the same time, and the center of the cutting marks can be formed at the correct corresponding positions above and below.

上述內容雖然使用雷射在設置於玻璃基板的正面和背面上的樹脂層上形成對齊標記和裁切用切割標記的情況的實施例，但是本發明也可應用於在玻璃基板的正面和背面設置的樹脂層上形成其他標記的情況。The foregoing is an example of a case where an alignment mark and a cutting mark for cutting are formed on a resin layer provided on a front surface and a back surface of a glass substrate using a laser, but the present invention is also applicable to When other marks are formed on the resin layer.

1、21‧‧‧基板1, 21‧‧‧ substrate

2、22‧‧‧工作台2.22‧‧‧Workbench

3、23‧‧‧玻璃基板3, 23‧‧‧ glass substrate

4、5、24、25‧‧‧樹脂層4, 5, 24, 25‧‧‧ resin layer

6‧‧‧對齊標記形成位置6‧‧‧ alignment mark formation position

7、27‧‧‧雷射通孔7, 27‧‧‧laser through hole

8、9‧‧‧對齊標記8, 9‧‧‧ alignment marks

10‧‧‧紫外線雷射10‧‧‧ ultraviolet laser

26‧‧‧切割標記形成位置26‧‧‧ Cutting mark formation position

28、29‧‧‧凹槽28, 29‧‧‧ groove

30‧‧‧切割標記30‧‧‧cut marks

20、31‧‧‧箭頭20, 31‧‧‧ arrows

A‧‧‧割面線A‧‧‧ cut line

B‧‧‧割面線B‧‧‧ cut line

圖1是表示根據本發明的實施例1，加工後的狀態的剖面圖； 圖2是用於說明本發明的實施例1的圖，（a）是工件加工前的俯視圖，（b）是沿著（a）的A-A線的剖面圖； 圖3是表示根據本發明的實施例2，加工後的狀態的剖面圖；以及 圖4是用於說明本發明的實施例2的圖，（a）是工件加工前的俯視圖，（b）是加工途中沿著（a）的B-B線的剖面圖。1 is a cross-sectional view showing a state after processing according to Embodiment 1 of the present invention; FIG. 2 is a diagram for explaining Embodiment 1 of the present invention, (a) is a plan view before a workpiece is processed, and (b) is a view along the A sectional view taken along the line AA of FIG. 3; FIG. 3 is a sectional view showing a processed state according to Embodiment 2 of the present invention; and FIG. 4 is a view for explaining Embodiment 2 of the present invention, (a) It is a plan view before the workpiece is processed, and (b) is a sectional view taken along the line BB of (a) during processing.

Claims (4)

一種基板的加工方法，對包含第一層與第二層的前述基板，於前述第二層的每一個上形成目標性的一標記，其中前述第一層由玻璃基板所形成，前述第二層設置在前述第一層的正面和背面的每一個上且與前述第一層為不同材質， 在前述基板的加工方法中，從前述基板的一側的面照射一雷射，前述雷射的能量密度能對前述第二層加工但不能對前述第一層加工，以在前述基板的正面和背面對應處同時形成前述標記。A method for processing a substrate, wherein a target mark is formed on each of the aforementioned second substrates including a first layer and a second layer, wherein the first layer is formed of a glass substrate and the second layer is formed It is disposed on each of the front surface and the back surface of the first layer and is made of a different material from the first layer. In the processing method of the substrate, a laser is irradiated from one surface of the substrate, and the energy of the laser is The density can process the second layer but cannot process the first layer to form the mark at the same time on the front and back of the substrate. 如申請專利範圍第1項所述之基板的加工方法，其中，前述標記是前述基板於加工中用於對準位置的對齊標記。The method for processing a substrate according to item 1 of the scope of patent application, wherein the aforementioned mark is an alignment mark used to align the position of the aforementioned substrate during processing. 如申請專利範圍第2項所述之基板的加工方法，其中，前述雷射的照射是用以進行鑽孔加工。The method for processing a substrate according to item 2 of the scope of patent application, wherein the laser irradiation is used for drilling. 如申請專利範圍第1項所述之基板的加工方法，其中，前述標記是裁切前述基板時的切割標記。The method for processing a substrate according to item 1 of the scope of patent application, wherein the mark is a cut mark when the substrate is cut.
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