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KR20120096699A - Method for drilling to form via hole in flexible metal clad laminate by using uv laser - Google Patents

Method for drilling to form via hole in flexible metal clad laminate by using uv laser Download PDF

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Publication number
KR20120096699A
KR20120096699A KR1020110015935A KR20110015935A KR20120096699A KR 20120096699 A KR20120096699 A KR 20120096699A KR 1020110015935 A KR1020110015935 A KR 1020110015935A KR 20110015935 A KR20110015935 A KR 20110015935A KR 20120096699 A KR20120096699 A KR 20120096699A
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KR
South Korea
Prior art keywords
ultraviolet laser
via hole
laser
diameter
flexible metal
Prior art date
Application number
KR1020110015935A
Other languages
Korean (ko)
Inventor
이상철
임창균
정제영
Original Assignee
스템코 주식회사
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Priority to KR1020110015935A priority Critical patent/KR20120096699A/en
Publication of KR20120096699A publication Critical patent/KR20120096699A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE: A drilling method using an ultraviolet laser for forming via holes on a FMCL(Flexible Metal Clad Laminate) is provided to form via holes in a FMCL by irradiating an ultraviolet laser without a pretreatment work for removing or blackening a metal layer. CONSTITUTION: A drilling method using an ultraviolet laser provides a FMCL(20) having a thickness under 40 micron meters. The FMCL has a first metal layer(25) welded on a polymer layer(22). An ultraviolet laser(12) having the output of 700-900mW and the frequency of 60-100kHz is generated. The ultraviolet laser is focused on the surface of the first metal layer to form via holes(30) penetrating through the FMCL. The diameter of the via holes is under 25 micron meters.

Description

Method for drilling to form via hole in Flexible Metal Clad Laminate by using UV laser}

The present invention relates to a drilling method using an ultraviolet laser for forming a via hole in a flexible metal laminate.

The flexible metal laminate has, for example, a structure in which a copper layer is bonded onto a resin layer such as polyimide or epoxy, or a copper layer is bonded to both surfaces including the upper and lower surfaces of the resin layer. Via holes may be formed in the flexible metal laminate using a laser, and an infrared laser or a CO 2 laser may be used.

By the way, the copper layer has a high light absorption rate for light in the short wavelength region, while a high reflectance for light in the infrared region, which is a long wavelength region. Therefore, in order to form a via hole using an infrared laser, it is necessary to preliminarily remove the copper thin film before irradiating the infrared laser or to blacken the surface of the copper thin film. Therefore, using an infrared laser, the drilling process can be complicated.

On the other hand, when using a CO 2 laser, it is possible to form via holes having a diameter of 50 μm to 100 μm. Therefore, when using a CO 2 laser, it is difficult to form via holes having a diameter of 25 μm.

The problem to be solved by the present invention is to provide a drilling method using an ultraviolet laser for forming a via hole in a flexible metal laminate without removing the copper layer or performing a blackening treatment.

Another object of the present invention is to provide a drilling method using an ultraviolet laser for forming a via hole of 25 μm or less in a flexible metal laminate.

Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

Drilling method using an ultraviolet laser according to an embodiment of the present invention for solving the above problems provides a flexible metal laminate with a thickness of 40μm or less bonded to the first metal layer on the polymer layer, and has an output of 700mW to 900mW, The method may include generating an ultraviolet laser having a frequency of 60 kHz to 100 kHz, focusing the ultraviolet laser on the surface of the first metal layer, and forming a via hole having a diameter of 25 μm or less passing through the flexible metal laminate.

Other specific details of the invention are included in the detailed description and drawings.

1 is a perspective view showing the formation of a via hole in a flexible metal laminate by applying a drilling method using an ultraviolet laser according to an embodiment of the present invention.
2 is a plan view of the via hole formed when the output of the ultraviolet laser is adjusted weakly.
3 is a plan view of the via hole formed when the output of the laser is strongly adjusted.
4 is a conceptual diagram for explaining focusing of an ultraviolet laser.
5 is a perspective view showing the impact drilling method.
6 is a perspective view showing the tripping drilling method.
7 and 8 are plan views showing the movement trajectory of the ultraviolet laser according to an embodiment of the present invention.
9 and 10 are plan views of via holes having a degraded processing quality.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Although the first, second, etc. are used to describe various elements, components and / or sections, it is needless to say that these elements, components and / or sections are not limited by these terms. These terms are only used to distinguish one element, element or section from another element, element or section. Therefore, it goes without saying that the first element, the first element or the first section mentioned below may be the second element, the second element or the second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention.

With reference to Figure 1, a drilling method using an ultraviolet laser according to an embodiment of the present invention will be described. 1 is a perspective view showing the formation of a via hole in a flexible metal laminate by applying a drilling method using an ultraviolet laser according to an embodiment of the present invention.

Referring to FIG. 1, a drilling method using an ultraviolet laser provides a flexible metal laminate 20 having a thickness of 40 μm or less in which a first metal layer 25 is bonded onto a polymer layer 22, and has an output of 700 mW to 900 mW. A UV laser 12 having a frequency of 60 kHz to 100 kHz is generated, and the UV laser 12 is focused on the surface of the first metal layer 25 and irradiated to penetrate the flexible metal laminate 20, and the via hole having a diameter of 25 μm or less. Forming 30.

Flexible metal clad laminate (FMCL) has a structure in which the first metal layer 25 is bonded on the polymer layer 22. The flexible metal laminate 20 may be, for example, a flexible copper clad laminate (FCCL) in which copper (Cu) is bonded onto a polyimide (PI) film. Referring to FIG. 1, the flexible metal laminate 20 may further include a second metal layer 27 bonded to a lower portion of the polymer layer 22. That is, the flexible metal laminate 20 may have a structure in which the first metal layer 25 and the second metal layer 27 are formed on both sides of the polymer layer 22, respectively. For convenience of description, the description will be made based on the flexible metal laminate 20 having the metal layers 25 and 27 formed on both surfaces of the polymer layer 22.

The thickness of the flexible metal laminate 20 may be 40 μm or less. For example, the thickness of the polymer layer 22 may be 35 μm to 40 μm, and the thickness of the metal layers 25 and 27 may be 1 μm to 3 μm.

The polymer layer 22 may be formed of a polymer having excellent flexibility, heat resistance, and insulation. However, the material of the polymer layer 22 is not limited to polyimide, and, for example, any one of polyethylene terephthalate (PET), polyether sulfate (PES), polythetheylene napthalene (PEN), polyetheretherketone (PEEK), and polyphenylene sulfate (PPS) It may be formed of a material containing.

The first metal layer 25 and the second metal layer 27 may be a material having high electrical conductivity. The first metal layer 25 and the second metal layer 27 are not limited to copper, and for example, metal foil of any one of silver (Ag), gold (Au), platinum (Pt), and nickel (Ni). Can be.

In order to manufacture the flexible metal laminate 20, there are three methods for bonding the polymer layer 22 and the metal layers 25 and 27.

First, the polymer layer 22 and the metal layers 25 and 27 may be bonded by casting a liquid polymer on the metal foil used as the metal layers 25 and 27. For example, the molten polyimide may be applied onto a metal foil and cured.

Second, an adhesive layer (not shown) may be disposed between the polymer layer 22 and the metal layers 25 and 27 to bond the polymer layer 22 to the metal layers 25 and 27. By means of an adhesive layer (not shown), the metal layers 25 and 27 may be laminated on the polymer layer 22. The adhesive layer (not shown) may include, for example, any one of epoxy, silicone, and acrylic, but is not limited thereto.

Finally, a tie coat is formed on the polymer layer 22, and the polymer layer 22 and the metal layer are electroplated on the tie coat (not shown). (25, 27) can be joined.

Tie coats (not shown) enhance the adhesion between adjacent coatings and can improve the reliability of the metal layers 25 and 27. The tie coat (not shown) may include, for example, any one of chromium, nickel, palladium, titanium, vanadium, aluminum, iron, chromium-based alloys and nickel-based alloys.

The metal layers 25 and 27 can be formed by electroplating. If necessary, a seed layer for forming the metal layers 25 and 27 may be formed on the tie coat (not shown), and then the metal layers 25 and 27 may be electroplated.

Drilling method according to an embodiment of the present invention uses an ultraviolet laser. The ultraviolet laser 12 has a wavelength in the range of 100 nm to 400 nm and is produced in the laser irradiation apparatus 10.

When the via holes 30 are formed in the flexible metal laminate 20 using the ultraviolet laser 12, the metal layers 25 and 27 are removed or blackened to the metal layers 25 and 27 before the ultraviolet laser 12 is irradiated. There is no need to do any preliminary work. That is, via holes 30 may be formed in the flexible metal laminate 20 only by irradiation of the ultraviolet laser 12.

In addition, a via hole of 25 μm or less may be formed in the flexible metal laminate 20 using the ultraviolet laser 12. The minimum diameter of the via hole 30 that can be formed in the flexible metal laminate 20 is determined according to the type of laser used for drilling. For example, using a CO 2 laser, it is possible to form via holes having a diameter of 50 μm to 100 μm. Therefore, when the ultraviolet laser 12 is used, it is advantageous to form via holes having a smaller diameter in the flexible metal laminate 20 than in the case of using a CO 2 laser.

The conditions for forming the via holes 30 in the flexible metal laminate 20 are different from the conditions for forming the via holes in a rigid substrate. Hereinafter, the optimum processing conditions for forming the via hole 30 in the flexible metal laminate 20 will be described.

2 and 3, the optimum output of the ultraviolet laser 12 will be described. FIG. 2 is a plan view of the via hole formed when the output of the ultraviolet laser is weakly adjusted, and FIG. 3 is a plan view of the via hole formed when the output of the laser is strongly adjusted.

As described above, the flexible metal laminate 20 may have a structure having three layers in which the first metal layer 25 and the second metal layer 27 are formed on both sides of the upper and lower portions of the polymer layer 22, respectively. . In order to irradiate the ultraviolet laser 12 to form the via hole 30 penetrating three layers, the ultraviolet laser 12 must have sufficient power. However, when the output of the ultraviolet laser 12 is 700 mW or less, the output is insufficient, and as shown in FIG. 2, drilling may not be performed to the second metal layer 27 under the polymer layer 22.

However, when the output of the ultraviolet laser 12 is too large, the polymer layer 22 may explode under high pressure during the drilling of the first metal layer 25 on the polymer layer 22. If the output of the ultraviolet laser 12 is 900mW or more, as shown in FIG. 3, the polymer layer 22 may explode before the first metal layer 25 is drilled.

As a result, the output of the ultraviolet laser 12 according to an embodiment of the present invention may be 700mW to 900mW.

Next, the optimum frequency of the ultraviolet laser 12 will be described.

The frequency of the ultraviolet laser 12 is closely related to the processing time of the via hole 30. The higher the frequency of the ultraviolet laser 12, the higher the peak power of the ultraviolet laser 12. As the peak power of the ultraviolet laser 12 is higher, the time for processing the via hole 30 can be shortened. Therefore, when the frequency of the ultraviolet laser 12 is 60 kHz or less, the peak power is relatively low, so that the processing time of the via hole 30 may be delayed.

However, the peak power of the ultraviolet laser 12 affects the processing quality of the via hole 30. When the ultraviolet laser 12 has a high peak power to process the via hole 30 in an excessively short time, the processing quality of the via hole 30 may be degraded. Therefore, when the frequency of the ultraviolet laser 12 is 100kHz or more, the peak power is relatively high, so that the processing quality of the via hole 30 may be degraded.

As a result, the frequency of the ultraviolet laser 12 according to an embodiment of the present invention may be 60kHz to 100kHz.

4, the optimal focusing of the ultraviolet laser 12 will be described. 4 is a conceptual diagram for explaining focusing of an ultraviolet laser.

The cross section of the via hole 30 is determined according to the cross section of the ultraviolet laser 12 on the surface of the flexible metal laminate 20. For example, if the cross section of the ultraviolet laser 12 on the surface of the flexible metal laminate 20 is an ellipse, it is an sectional ellipse of the via hole 30 formed in the flexible metal laminate 20 by the ultraviolet laser 12. Therefore, although the cross section of the ultraviolet laser 12 should be a circle on the surface of the flexible metal laminate 20, the via hole 30 having a circular cross section can be formed.

The laser has a cross section close to the circle at the point of focus. That is, before and after the focusing point, the ellipse has a cross section, and the laser cross section is inverted based on the focusing point. Therefore, when the ultraviolet laser 12 is focused on the upper surface of the flexible metal laminate 20 and irradiated, the via hole 30 having a circular cross section may be formed on the flexible metal laminate 20.

Next, referring to FIGS. 5 and 6, a method of forming the via hole 30 using the ultraviolet laser 12 will be described. Figure 5 is a perspective view showing the impact drilling method, Figure 6 is a perspective view showing the tripping drilling method.

The via hole 30 is formed by using the ultraviolet laser 12. There is a percussion drilling method and a trepanning drilling method.

First, a method of forming the via hole 30 using the impact drilling method will be described. Referring to Figure 5, the impact drilling scheme includes a constant beam and one or more pulses to penetrate through the thickness of the material. And, in the impact drilling method, the diameter of the via hole 30 is determined by the diameter and power level of the ultraviolet laser 12. That is, the impact drilling method may be used to form a via hole having a diameter corresponding to the diameter of the spot 15 of the ultraviolet laser 30.

The impact drilling method may irradiate the ultraviolet laser 12 to form the via hole 30 penetrating the flexible metal laminate 20. In the case of the impact drilling method, the ultraviolet laser 12 is irradiated onto the flexible metal laminate 20 without moving the ultraviolet laser 12. Since the via hole 30 is formed by the ultraviolet laser 12 penetrating the flexible metal laminate 20, the diameter of the via hole 30 may be proportional to the diameter of the spot 15 of the ultraviolet laser 12.

Next, a method of forming the via hole 30 using the triple panning drilling method will be described.

Referring to FIG. 6, the tripping drilling method involves cutting the outer shape of the via hole 30 while moving the ultraviolet laser 12. The triple-panning drilling scheme can be used to manufacture via holes 30 having a diameter larger than the spot 15 of the ultraviolet laser 12. For example, the ultraviolet laser 12 can travel along a circular path or a spiral path. Therefore, the diameter of the via hole 30 is determined according to the movement path of the ultraviolet laser 12.

However, the drilling method using the ultraviolet laser according to an embodiment of the present invention describes the movement along the spiral path of the triple-panning drilling method, which will be described later may be applied to the movement of the ultraviolet laser along the circular path. Is apparent to those skilled in the art.

The method of forming the via hole 30 penetrating the flexible metal laminate 20 by irradiating the ultraviolet laser 12 by the tripping drilling method is as follows. The spot 15 of the ultraviolet laser 12 has a diameter smaller than the diameter of the via hole 30 to be formed, and the spiral track 40 in which the ultraviolet laser 12 is positioned at a point inside the via hole 30. Irradiating n (but n> 1) times while moving in a phase to form a via hole, but spot 15 of the ultraviolet laser 12 when irradiating the ultraviolet laser 12 m (where 0 <m <n) times ) And the ultraviolet laser 12 are moved on the spiral orbit 40 so that the spot 15 of the ultraviolet laser 12 at the time of m + 1 irradiation is overlapped.

Referring to FIGS. 7 and 8, a method of forming the via hole 30 penetrating the flexible metal laminate 20 by irradiating the ultraviolet laser 12 by the tripping drilling method will be described in detail. 7 and 8 are plan views showing the movement trajectory of the ultraviolet laser according to an embodiment of the present invention.

The spot 15 of the ultraviolet laser 12 has a diameter smaller than the diameter of the via hole 30 to be formed. The diameter of the spot 15 of the ultraviolet laser 12 may be 10 μm to 15 μm, and the diameter of the via hole 30 to be formed is 25 μm or less. The diameter of the spot 15 of the ultraviolet laser 12 can be adjusted via the laser irradiation apparatus 10.

The ultraviolet laser 12 is moved to form the via hole 30 having a diameter larger than the diameter of the spot 15 of the ultraviolet laser 12 using the ultraviolet laser 12. Ultraviolet laser 12 moves along spiral track 40. The spiral track 40 has one point inside the via hole 30 as a starting point. The starting point of the spiral track 40 may coincide with the center point of the cross section of the via hole 30, for example. For example, the spiral track 40 rotates about the viewpoint, but draws a spiral trajectory in which the radius gradually increases from the viewpoint.

The spiral track 40 may draw a trajectory that rotates 720 degrees to 750 degrees around the time when the ultraviolet laser 12 starts to move in the via hole 30. That is, the spiral track 40 can draw a trajectory that rotates about two turns. If the spiral track 40 draws the trajectory of the ultraviolet laser 12 rotating below 720 degrees around the viewpoint, the ultraviolet laser 12 can be sufficiently irradiated because the length of the spiral track 40 is relatively short. Therefore, the processing quality of the via hole 30 may be degraded. In addition, if the spiral trajectory 40 draws the trajectory of the ultraviolet laser 12 rotating more than 750 degrees around the viewpoint, the ultraviolet laser 12 is irradiated more than necessary, so that the machining process may be inefficient.

As a result, the spiral track 40 according to an embodiment of the present invention may be a track that rotates 720 degrees to 750 degrees around the time when the ultraviolet laser 12 starts to move in the via hole 30.

The ultraviolet laser 12 is irradiated n (but n> 1) times while moving to the spiral orbit 40. However, the ultraviolet laser 12 moves so that the spot 15 of the ultraviolet laser 12 overlaps on the spiral track 40. For example, the spot 15 of the ultraviolet laser 12 when irradiating the ultraviolet laser 12 with m (0 <m <n) times and the spot of the ultraviolet laser 12 when irradiating with m + 1 times The ultraviolet laser 12 can be moved on the helical trajectory 40 so that the 15 overlaps. In this way, the via hole 30 can be precisely processed by moving so as to overlap between the spots 15 of the ultraviolet laser 12.

In order to precisely process the via hole 30, the degree of overlap between the spots 15 of the ultraviolet laser 12 may be adjusted. In the case where the overlap ratio between the spots 15 of the ultraviolet laser 12 is maintained, for example, 50% or more, the processing quality of the via hole 30 can be improved. In order to control the degree of overlap between the spots 15 of the ultraviolet laser 12, the speed at which the ultraviolet laser 12 moves on the helical trajectory 40 can be adjusted. However, when irradiating the ultraviolet laser 12 too closely, the processing time of the via hole 30 can be increased, the moving speed of the ultraviolet laser 12 can maintain 8mm / s to 12mm / s. For example, the moving speed of the ultraviolet laser 12 may be 10 mm / s.

To describe the spiral track 40 in detail, a sub movement path 42 may be defined. The sub moving path 42 means a moving path for moving the ultraviolet laser 12 on the spiral track 40 to irradiate the ultraviolet laser 12 m times and to perform the m + 1th irradiation. The length of the sub movement path 42 may be 0.6 to 0.8 times the diameter of the spot 15 of the ultraviolet laser, for example, the length of the sub movement path 42 is 0.7 times the diameter of the spot 15 of the ultraviolet laser. Can be.

 That is, after irradiating the ultraviolet laser 12 m times, the ultraviolet laser 12 can be irradiated m + 1 times by moving 0.6 times-0.8 times the diameter of the spot 15 of the ultraviolet laser. When the diameter of the spot 15 of the ultraviolet laser 12 is 10 μm to 15 μm, the length of the sub moving path 42 may be 6 μm to 12 μm. As such, when the ultraviolet laser 12 is moved along the sub-movement path 42 set to 0.6 to 0.8 times the diameter of the spot 15 of the ultraviolet laser, it may be advantageous to form the cross section of the via hole 30 close to the circle. .

9 and 10 are plan views of via holes having a degraded processing quality. 9 and 10 are cross-sectional views of the formed via holes without considering the movement speed and sub-movement path of the above-described ultraviolet laser. That is, without considering the factors related to the moving speed and the sub-movement path of the ultraviolet laser, the via holes can be formed in the cross section as shown in Figs.

When the ultraviolet laser 12 is irradiated m times, it can be irradiated for a sufficient time to enable drilling through the flexible metal laminate 20. After the mth round irradiation, the ultraviolet laser 12 may be moved along the spiral track 40 to start the m + 1th round irradiation. As the irradiation of the ultraviolet laser 12 continues, the size of the via hole formed through the flexible metal laminate 20 little by little is gradually increased. When the ultraviolet laser 12 moves to the portion corresponding to the edge of the via hole 30 in the spiral track 40 and finishes irradiation, the final shape of the via hole 30 is completed.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

10: laser irradiation device 12: ultraviolet laser
15: UV laser spot 20: Flexible metal laminate
22 polymer layer 25 first metal layer
27: second metal layer 30: via hole
40: spiral track 42: sub-movement path

Claims (7)

Providing a flexible metal laminate having a thickness of 40 μm or less in which a first metal layer is bonded onto a polymer layer,
Generate an ultraviolet laser having an output of 700 mW to 900 mW and a frequency of 60 kHz to 100 kHz,
And focusing the ultraviolet laser beam on a surface of the first metal layer to form a via hole having a diameter of 25 μm or less penetrating the flexible metal laminate. The method of claim 1,
The flexible metal laminate is a drilling method using an ultraviolet laser further comprises a second metal layer bonded to the lower portion of the polymer layer. The method of claim 1,
The spot of the ultraviolet laser has a diameter smaller than the diameter of the via hole to be formed, and the ultraviolet laser is irradiated n (where n> 1) times while moving the ultraviolet laser on a spiral orbit with a point inside the via hole. Form the via hole,
The helical laser is spirally wound such that the spot of the ultraviolet laser when the ultraviolet laser is irradiated with the m (but 0 <m <n) times and the spot of the ultraviolet laser when the m + 1 irradiation is overlapped with each other. Drilling method using ultraviolet laser to move on orbit. The method of claim 3, wherein
The length of the traveling path for moving the ultraviolet laser on the helical trajectory for irradiating the ultraviolet laser to the mth round and the m + 1th round irradiation is 0.6 times to 0.8 times the diameter of the spot of the ultraviolet laser. Drilling method using The method of claim 3, wherein
The diameter of the spot of the ultraviolet laser is 10μm to 15μm, the length of the moving path for moving the ultraviolet laser on the helical orbit for irradiating the m laser and the m + 1 round irradiation of the ultraviolet laser is 6μm to Drilling method using an ultraviolet laser of 12μm. The method of claim 3, wherein
The diameter of the spot of the ultraviolet laser is 10μm to 15μm, the spiral track is a drilling method using an ultraviolet laser is a trajectory that rotates 720 to 750 degrees around the viewpoint of the inside of the via hole. The method of claim 3, wherein
Drilling method using an ultraviolet laser is a speed of the ultraviolet laser is moving on the spiral track is 8mm / s to 12mm / s.
KR1020110015935A 2011-02-23 2011-02-23 Method for drilling to form via hole in flexible metal clad laminate by using uv laser KR20120096699A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
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KR20160147956A (en) * 2014-04-29 2016-12-23 코닝 인코포레이티드 Abrasive jet forming laminated glass structures
KR20180054442A (en) * 2016-11-15 2018-05-24 비아 메카닉스 가부시키가이샤 Substrate machining method
CN110421265A (en) * 2019-07-01 2019-11-08 中国科学院上海光学精密机械研究所 A kind of method and apparatus using femtosecond laser processing different shape sub-wavelength period structure
CN116441765A (en) * 2023-03-24 2023-07-18 中国科学院西安光学精密机械研究所 Straight round hole laser processing spiral line track planning method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160147956A (en) * 2014-04-29 2016-12-23 코닝 인코포레이티드 Abrasive jet forming laminated glass structures
KR20180054442A (en) * 2016-11-15 2018-05-24 비아 메카닉스 가부시키가이샤 Substrate machining method
CN110421265A (en) * 2019-07-01 2019-11-08 中国科学院上海光学精密机械研究所 A kind of method and apparatus using femtosecond laser processing different shape sub-wavelength period structure
CN110421265B (en) * 2019-07-01 2021-06-01 中国科学院上海光学精密机械研究所 Method and device for processing sub-wavelength periodic structures with different shapes by femtosecond laser
CN116441765A (en) * 2023-03-24 2023-07-18 中国科学院西安光学精密机械研究所 Straight round hole laser processing spiral line track planning method
CN116441765B (en) * 2023-03-24 2024-04-05 中国科学院西安光学精密机械研究所 Straight round hole laser processing spiral line track planning method

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