JPS63100871U - - Google Patents
Info
- Publication number
- JPS63100871U JPS63100871U JP19522986U JP19522986U JPS63100871U JP S63100871 U JPS63100871 U JP S63100871U JP 19522986 U JP19522986 U JP 19522986U JP 19522986 U JP19522986 U JP 19522986U JP S63100871 U JPS63100871 U JP S63100871U
- Authority
- JP
- Japan
- Prior art keywords
- land
- positioning
- determining
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例を示す図、第２図は本
考案の他の実施例を示す図、第３図は従来の表面
実装部品を実装するランドを示す図、第４図は従
来の表面実装部品の実装方法を説明するための図
である。
第１図、第２図において、１０は基板、１１は
パターン、１２はランド、１２ａは位置決め、１
３は表面実装部品である。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing another embodiment of the present invention, FIG. 3 is a diagram showing a land on which a conventional surface mount component is mounted, and FIG. 4 is a diagram showing a conventional land. FIG. 2 is a diagram for explaining a method for mounting surface-mounted components. 1 and 2, 10 is a substrate, 11 is a pattern, 12 is a land, 12a is a positioning device, 1
3 is a surface mount component.
Claims (1)
ドであつて、 上記実装部品１３の半田付け位置を決める位置
決め１２ａをランド１２上に設けたことを特徴と
する位置決め付きランド構造。[Claims for Utility Model Registration] A land of a printed circuit board on which surface-mounted components are mounted, characterized in that a positioning 12a for determining the soldering position of the mounted component 13 is provided on the land 12. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19522986U JPS63100871U (en) | 1986-12-20 | 1986-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19522986U JPS63100871U (en) | 1986-12-20 | 1986-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63100871U true JPS63100871U (en) | 1988-06-30 |
Family
ID=31152930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19522986U Pending JPS63100871U (en) | 1986-12-20 | 1986-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63100871U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013132569A1 (en) * | 2012-03-05 | 2013-09-12 | 三菱電機株式会社 | Semiconductor device |
| JPWO2013132569A1 (en) * | 2012-03-05 | 2015-07-30 | 三菱電機株式会社 | Semiconductor device |
-
1986
- 1986-12-20 JP JP19522986U patent/JPS63100871U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013132569A1 (en) * | 2012-03-05 | 2013-09-12 | 三菱電機株式会社 | Semiconductor device |
| CN104170534A (en) * | 2012-03-05 | 2014-11-26 | 三菱电机株式会社 | Semiconductor device |
| JPWO2013132569A1 (en) * | 2012-03-05 | 2015-07-30 | 三菱電機株式会社 | Semiconductor device |
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