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JPS6063955U - Leads for mounting electronic components - Google Patents

Leads for mounting electronic components

Info

Publication number
JPS6063955U
JPS6063955U JP15698083U JP15698083U JPS6063955U JP S6063955 U JPS6063955 U JP S6063955U JP 15698083 U JP15698083 U JP 15698083U JP 15698083 U JP15698083 U JP 15698083U JP S6063955 U JPS6063955 U JP S6063955U
Authority
JP
Japan
Prior art keywords
leads
electronic components
mounting electronic
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15698083U
Other languages
Japanese (ja)
Inventor
秀樹 久保田
*
工藤 勝次
Original Assignee
株式会社明電舎
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社明電舎 filed Critical 株式会社明電舎
Priority to JP15698083U priority Critical patent/JPS6063955U/en
Publication of JPS6063955U publication Critical patent/JPS6063955U/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図Aは電子部品の斜視図、第1図Bはプリント基板
の部分斜視図、第1図Cは第1図Bの部分拡大図、第2
図A、 B、 Cはリードの被膜部の例を示す斜視図で
ある。 1・・・・・・電子部品、3・・・・・・リード、4・
・・・・・プリント基板、5・・・・・・配線パターン
、6・・・・・・ランド、7・・・・・・スルーホール
、8・・・・・・被膜部。
Figure 1A is a perspective view of an electronic component, Figure 1B is a partial perspective view of a printed circuit board, Figure 1C is a partially enlarged view of Figure 1B, and Figure 1B is a partial perspective view of a printed circuit board.
Figures A, B, and C are perspective views showing examples of the coating portion of the lead. 1...Electronic components, 3...Leads, 4.
...Printed circuit board, 5...Wiring pattern, 6...Land, 7...Through hole, 8...Coating portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板4に実装すべき電子部品1におけるリード
3の端部に、前記プリント基板4の配線パターン5及び
ランド6の色彩とは異なる色彩の被膜部8を形成せしめ
てなることを特徴とする電子部品の実装用リード。
An electronic device characterized in that a coating portion 8 having a color different from that of the wiring pattern 5 and land 6 of the printed circuit board 4 is formed on the end of the lead 3 of the electronic component 1 to be mounted on the printed circuit board 4. Leads for mounting parts.
JP15698083U 1983-10-11 1983-10-11 Leads for mounting electronic components Pending JPS6063955U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15698083U JPS6063955U (en) 1983-10-11 1983-10-11 Leads for mounting electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15698083U JPS6063955U (en) 1983-10-11 1983-10-11 Leads for mounting electronic components

Publications (1)

Publication Number Publication Date
JPS6063955U true JPS6063955U (en) 1985-05-07

Family

ID=30346232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15698083U Pending JPS6063955U (en) 1983-10-11 1983-10-11 Leads for mounting electronic components

Country Status (1)

Country Link
JP (1) JPS6063955U (en)

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