JPH0265579U - - Google Patents
Info
- Publication number
- JPH0265579U JPH0265579U JP14609488U JP14609488U JPH0265579U JP H0265579 U JPH0265579 U JP H0265579U JP 14609488 U JP14609488 U JP 14609488U JP 14609488 U JP14609488 U JP 14609488U JP H0265579 U JPH0265579 U JP H0265579U
- Authority
- JP
- Japan
- Prior art keywords
- printing mask
- solder
- solder printing
- paste
- mask used
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000000034 method Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例によるはんだ印刷
マスクと被印刷配線板の斜視図、第２図は従来の
はんだ印刷マスクと被印刷配線板の斜視図である
。
図において、１ははんだ印刷マスク、２はメツ
シユ、３はメタル部、４ははんだペースト透過用
透孔、５は被印刷配線板、６は銅箔パターン、７
は位置合わせマーク、８は位置合わせ銅箔パター
ンを示す。尚、図中、同一符号は同一、又は相当
部分を示す。
FIG. 1 is a perspective view of a solder printing mask and printed wiring board according to an embodiment of this invention, and FIG. 2 is a perspective view of a conventional solder printing mask and printed wiring board. In the figure, 1 is a solder printing mask, 2 is a mesh, 3 is a metal part, 4 is a through hole for solder paste transmission, 5 is a printed wiring board, 6 is a copper foil pattern, and 7
8 indicates an alignment mark, and 8 indicates an alignment copper foil pattern. In the drawings, the same reference numerals indicate the same or equivalent parts.
Claims (1)
スト状はんだ印刷用マスクにおいて、はんだ印刷
マスクの位置合わせマークをはんだペースト印刷
範囲内に設けた事を特徴とするはんだ印刷マスク
。 A solder printing mask used in a paste-like solder printing mask used in the process of mounting electronic components on printed wiring boards, characterized in that alignment marks of the solder printing mask are provided within the solder paste printing range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14609488U JPH0265579U (en) | 1988-11-08 | 1988-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14609488U JPH0265579U (en) | 1988-11-08 | 1988-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0265579U true JPH0265579U (en) | 1990-05-17 |
Family
ID=31415263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14609488U Pending JPH0265579U (en) | 1988-11-08 | 1988-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265579U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004130820A (en) * | 2001-01-16 | 2004-04-30 | Hirotake Kasuya | Screen for screen printing |
-
1988
- 1988-11-08 JP JP14609488U patent/JPH0265579U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004130820A (en) * | 2001-01-16 | 2004-04-30 | Hirotake Kasuya | Screen for screen printing |