JPS6338368U - - Google Patents
Info
- Publication number
- JPS6338368U JPS6338368U JP13115986U JP13115986U JPS6338368U JP S6338368 U JPS6338368 U JP S6338368U JP 13115986 U JP13115986 U JP 13115986U JP 13115986 U JP13115986 U JP 13115986U JP S6338368 U JPS6338368 U JP S6338368U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- chip components
- circuit board
- hole
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案の一実施例の平面図、第2図は
第1図の断面図、第3図は従来構造の平面図、第
4図は第3図の断面図である。
1,11……プリント基板、2,12……絶縁
性基板、3,13……プリント回路、3a,13
a……プリント回路一部、4,5,14,15…
…チツプ部品、6……スルーホール、7……半田
。
1 is a plan view of an embodiment of the present invention, FIG. 2 is a sectional view of FIG. 1, FIG. 3 is a plan view of a conventional structure, and FIG. 4 is a sectional view of FIG. 3. 1, 11... Printed circuit board, 2, 12... Insulating board, 3, 13... Printed circuit, 3a, 13
a... Part of the printed circuit, 4, 5, 14, 15...
...Chip parts, 6...Through holes, 7...Solder.
Claims (1)
のプリント回路の少なくとも一部には複数個のあ
るいは多数回に亘りチツプ部品を半田付けするよ
うにしたプリント基板において、前記プリント回
路一部に対応する前記絶縁性基板にスルーホール
を形成し、このプリント回路一部をこのスルーホ
ールを通して基板の裏面にまで延在させたことを
特徴とするチツプ部品搭載用プリント基板。 A printed circuit board in which a printed circuit is formed on an insulating substrate, and a plurality of chip components are soldered to at least a part of the printed circuit or a plurality of chip components corresponding to the part of the printed circuit. A printed circuit board for mounting chip components, characterized in that a through hole is formed in the insulating substrate, and a part of the printed circuit extends through the through hole to the back surface of the circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13115986U JPS6338368U (en) | 1986-08-29 | 1986-08-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13115986U JPS6338368U (en) | 1986-08-29 | 1986-08-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6338368U true JPS6338368U (en) | 1988-03-11 |
Family
ID=31029341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13115986U Pending JPS6338368U (en) | 1986-08-29 | 1986-08-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6338368U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006210515A (en) * | 2005-01-26 | 2006-08-10 | Aisin Seiki Co Ltd | Printed board |
JP2020202303A (en) * | 2019-06-11 | 2020-12-17 | 三菱電機エンジニアリング株式会社 | Printed circuit board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5685891A (en) * | 1979-12-14 | 1981-07-13 | Hitachi Ltd | Chip element mounting substrate |
JPS59171193A (en) * | 1983-03-17 | 1984-09-27 | 松下電器産業株式会社 | Printed circuit board with through hole |
-
1986
- 1986-08-29 JP JP13115986U patent/JPS6338368U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5685891A (en) * | 1979-12-14 | 1981-07-13 | Hitachi Ltd | Chip element mounting substrate |
JPS59171193A (en) * | 1983-03-17 | 1984-09-27 | 松下電器産業株式会社 | Printed circuit board with through hole |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006210515A (en) * | 2005-01-26 | 2006-08-10 | Aisin Seiki Co Ltd | Printed board |
JP2020202303A (en) * | 2019-06-11 | 2020-12-17 | 三菱電機エンジニアリング株式会社 | Printed circuit board |