JPS63184576U - - Google Patents
Info
- Publication number
- JPS63184576U JPS63184576U JP1987074875U JP7487587U JPS63184576U JP S63184576 U JPS63184576 U JP S63184576U JP 1987074875 U JP1987074875 U JP 1987074875U JP 7487587 U JP7487587 U JP 7487587U JP S63184576 U JPS63184576 U JP S63184576U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component lead
- contact surface
- land portion
- solder contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る電子部品リードの一実施
例を示す斜視図、第２図は第１図の要部拡大斜視
図、第３図及び第４図は本考案の他の実施例を示
す要部拡大斜視図、第５図はリードとランド部の
相対位置を示す平面図である。
１……部品リード、２……ランド部、３……電
子部品、４……プリント配線板（基板）、５……
回路パターン、６……貫通孔、７……切込部、８
……凹溝。
Fig. 1 is a perspective view showing one embodiment of an electronic component lead according to the present invention, Fig. 2 is an enlarged perspective view of the main part of Fig. 1, and Figs. 3 and 4 show other embodiments of the present invention. FIG. 5 is a plan view showing the relative positions of the lead and the land portion. 1...Component lead, 2...Land portion, 3...Electronic component, 4...Printed wiring board (substrate), 5...
Circuit pattern, 6... Through hole, 7... Notch, 8
...concave groove.
Claims (1)
部に半田付けされる電子部品リードにおいて、該
電子部品リードの前記ランド部との接触面以外に
半田接触面を形成したことを特徴とする電子部品
リード。 (2) 半田接触面は電子部品リードを貫通する孔
部の内周面であることを特徴とする実用新案登録
請求の範囲第１項記載の電子部品リード。 (3) 半田接触面は電子部品リードに形成された
切込部の内壁面であることを特徴とする実用新案
登録請求の範囲第１項記載の電子部品リード。 (4) 半田接触面は電子部品リードのランド部と
の当接面に形成された凹溝であることを特徴とす
る実用新案登録請求の範囲第１項記載の電子部品
リード。[Claims for Utility Model Registration] (1) In an electronic component lead that is soldered to a land portion of a circuit pattern formed on a board, a solder contact surface other than the contact surface with the land portion of the electronic component lead is provided. An electronic component lead characterized by being formed. (2) The electronic component lead according to claim 1, wherein the solder contact surface is the inner circumferential surface of a hole penetrating the electronic component lead. (3) The electronic component lead according to claim 1, wherein the solder contact surface is an inner wall surface of a notch formed in the electronic component lead. (4) The electronic component lead according to claim 1, wherein the solder contact surface is a groove formed in the contact surface with the land portion of the electronic component lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987074875U JPS63184576U (en) | 1987-05-19 | 1987-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987074875U JPS63184576U (en) | 1987-05-19 | 1987-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63184576U true JPS63184576U (en) | 1988-11-28 |
Family
ID=30920500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987074875U Pending JPS63184576U (en) | 1987-05-19 | 1987-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63184576U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014238918A (en) * | 2013-06-06 | 2014-12-18 | 第一精工株式会社 | Coaxial connector device |
-
1987
- 1987-05-19 JP JP1987074875U patent/JPS63184576U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014238918A (en) * | 2013-06-06 | 2014-12-18 | 第一精工株式会社 | Coaxial connector device |