JP5613475B2 - Light emitting device package and light emitting device package group including the same - Google Patents

Description

  The present invention relates to a light emitting device package on which a light emitting device such as an LED is mounted, and a light emitting device package group including the light emitting device package.

  Conventionally, in this type of light emitting device package, in order to obtain light emission of a desired color such as white light, a phosphor portion that converts the wavelength of emitted light from the LED device is provided on a mounting substrate on which the LED device is mounted. LED packages are known (see, for example, Patent Documents 1 and 2). Various usage modes are conceivable for such LED packages depending on the application, and one of them is a usage mode in which LED packages are arranged side by side and one light emitting unit is formed by a plurality of these arranged packages. There is.

  By the way, in the LED package shown by each said patent document, since the fluorescent substance part which covers an LED element is formed inside the board | substrate end surface part, it arranges so that a mutual board | substrate end surface part may contact LED packages. When it does, a clearance gap will arise between each fluorescent substance. For this reason, the light-emitting portion formed by these plural packages includes a non-light-emitting portion generated by the above-described gap, resulting in uneven brightness. If such brightness unevenness occurs in the light emitting part, when the light distribution from the light emitting part is subjected to light distribution control using a condensing lens, irradiation unevenness also occurs on the irradiated surface.

JP 2009-267039 A Special table 2008-541411

  The present invention has been made to solve the above-described problems, and eliminates non-light-emitting portions caused by gaps between the respective phosphor portions between the light-emitting element packages arranged side by side, thereby generating uneven brightness. It is an object to provide a light emitting device package and a light emitting device package group which are reduced.

The light emitting device package group of the present invention is a light emitting device package group in which a plurality of light emitting device packages are arranged so that their light emitting portions are closely packed together , and the light emitting device package is mounted with a light emitting device mounted thereon. a substrate, provided on the mounting surface of the mounting substrate, and a phosphor unit for wavelength conversion of light emitted from the light emitting element, the mounting substrate, when another of the light emitting device package is aligned arrangement, the The phosphor portion has an end face portion facing a plan view outer shape of another light emitting device package, and the phosphor portion is configured to coincide with or extend outward from the end face portion. The phosphor portions of the two light emitting element packages are configured to overlap each other in plan view.

The light emitting device package group of the present invention includes a plurality of the light emitting device package group, the plurality of light emitting device packages group are arranged so as to be in contact with one another phosphor portion of each of all of said plurality of light emitting device packages group A condensing lens portion is arranged so as to cover the phosphor portion.

  In this light emitting element package group, it is preferable that the lens portion has a concave portion having the same shape as the outer surface of the aggregate of the phosphor portions at a portion facing the phosphor portion.

  According to the light emitting device package of the present invention, the phosphor portion has a structure that matches the end surface portion of the mounting substrate or extends outward from the end surface portion and is connected to the outer shape of the other light emitting device package. Therefore, a plurality of LED packages can be arranged side by side without a gap. Thereby, a non-light-emitting part is not generated between the packages arranged side by side, and light emission with less luminance unevenness can be obtained.

The top view which shows the state by which the LED package which concerns on the 1st Embodiment of this invention was put in order with other LED packages. The perspective view of the said LED package. (A) is the top view of the LED package, (b) is the front view. The figure which shows the formation method of the fluorescent substance part of the LED package. The figure which shows the other example of the formation method of the fluorescent substance part. The perspective view which shows the mounting state to the wiring board of the LED package group in which the said LED package was arranged in multiple numbers. The sectional side view of the apparatus which controls light distribution of the light output from the said LED package group. The figure which shows the irradiation pattern in the LED package group. The figure which shows the irradiation pattern in the LED package group of a prior art example. The perspective view which shows the other structure of the LED package of the embodiment. (A) is a perspective view which shows further another structure of the LED package, (b) is the side view. (A) is a perspective view which shows other structure of the LED package, (b) is the front view. The perspective view which shows other structure of the LED package. The figure which shows other structure of the LED package. The top view which shows other structure of the LED package. The top view of the LED package group which concerns on the 2nd Embodiment of this invention. The perspective view of the LED package group which concerns on the 3rd Embodiment of this invention. The side view of the LED package group which concerns on the 4th Embodiment of this invention. The figure which shows the formation method of the fluorescent substance part of the said LED package group. The side view which shows the other structure of the LED package group. The top view which shows the LED package group which concerns on the 5th Embodiment of this invention. The perspective view which shows the LED package group which concerns on the 6th Embodiment of this invention. The perspective view which shows the LED package group which concerns on the 7th Embodiment of this invention.

(First embodiment)
An LED package (light emitting device package) according to a first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the LED package 1 includes an LED element 2 that is a light emitting element, a mounting substrate 3 on which the LED element 2 is mounted, and a phosphor portion 4 that converts the wavelength of emitted light from the LED element 2. The LED element 2 and the phosphor part 4 form a light emitting part 5. The mounting substrate 3 is provided with a pair of wiring patterns 6 for supplying power to the LED elements 2. The LED package 1 is used side by side with the other LED packages 1a. At this time, the light emitting portions 5 of the package 1 and the light emitting portions 5a of the other packages 1a are arranged so as to be densely packed together. Is done. Hereinafter, the LED module 1 will be described in detail.

  As shown in FIGS. 2 and 3, the LED package 1 is configured by covering a LED element 2 mounted on a mounting substrate 3 with a phosphor portion 4. The LED element 2 is composed of an LED chip having a substantially square light emitting surface, is provided on the mounting surface of the mounting substrate 3, and is disposed near one end in the longitudinal direction from the vicinity of the center of the mounting surface. The LED chip used for the LED element 2 has, for example, an outer shape of about 1 mm × 1 mm. There is no restriction | limiting in particular about the shape and size of the LED element 2, For example, the thing of a substantially cylindrical shape (diameter about 1 mm) may be sufficient. About the kind of LED element 2, since a desired luminescent color should just be obtained by the combination of the LED element 2 and the fluorescent substance part 4, for example, the element which emits visible light may be sufficient, and other than visible light An element that emits light (for example, near ultraviolet light) may be used. Further, the LED element 2 has a pair of electrodes on the surface (element back surface) opposite to the light emitting surface, and these electrodes are electrically connected to the wiring pattern on the mounting substrate 3. As a method for mounting the LED element 2 on the mounting substrate 3, for example, flip chip mounting using Au bumps, die bonding / wire bonding mounting using solder, Ag paste, or the like is available.

  The mounting substrate 3 is formed of a rectangular substrate, and has an end surface portion 31 that faces the external shape of the other light emitting element package when viewed in plan when the other light emitting element packages are arranged side by side. The end surface portion 31 includes an end surface at one end on the side where the LED element 2 is disposed and two end surfaces orthogonal to the end surface. Here, the size of the mounting substrate 3 is an outer diameter of 1.2 mm × 2.5 mm and a thickness of 0.3 mm. For example, an alumina substrate can be used as the mounting substrate 3, but an AlN substrate, a SiC substrate, or the like may be used. When the base body (base material) of the mounting substrate 3 is formed of an insulating material, a composite material may be used for the insulating material. The mounting substrate 3 is not limited to the above configuration, and may be configured by, for example, an Al metal substrate having an insulating layer or a resin substrate using a resin material (such as a thermosetting resin containing an alumina filler).

The wiring pattern 6 on the mounting substrate 3 is made of, for example, a metal film such as titanium (Ti) or gold (Au), and extends forward from the LED element 2 to form an electrode pad 6a. The wiring pattern 6 may be formed of a laminated film made of Ti and Au (Ti and Au are sequentially laminated on the mounting substrate 3). For example, a vapor deposition method or a plating method can be used to form the wiring pattern 6. In a region (surface) on which the LED element 2 is disposed on the mounting substrate 3, it is preferable to form a highly reflective layer such as Al, Ag, or TiO _{2 in} order to increase the light extraction efficiency. When forming this highly reflective layer, it is necessary to take care not to contact the wiring pattern 6 in order to obtain insulation from the wiring pattern 6.

The phosphor portion 4 is disposed on the mounting surface of the mounting substrate 3 so as to surround the light emitting surface of the LED element 2, and is configured to extend outward from the end surface portion 31 of the mounting substrate 3. The phosphor part 4 is formed by mixing a fluorescent material with a translucent resin made of silicone, excited by receiving radiated light from the LED element 2, and changing the wavelength of part of the light to change the light color. With such a configuration, light emitted from the LED element 2 whose light color has been changed by the phosphor portion 4 is mixed with other light, and light emission having a desired color can be obtained. It becomes possible. For example, when the LED element 2 is a blue LED, when a YAG fluorescent material (Y ₃ Al ₅ 0 ₁₂ : Ce) that converts blue light into yellow light is used for the phosphor portion 4, white light emission is generated. can get. Further, as the fluorescent material, SCASN fluorescent material ((SrCa) AlSiN ₃ : Eu) that converts blue light into red light, CASN fluorescent material (CaAlSiN ₃ : Eu) that converts blue light into deep red light, blue, There are CSO fluorescent materials (CaSc ₂ O ₄ : Ce) that convert light into green light. Note that a diffusion material may be mixed when the fluorescent material and the translucent resin are mixed.

  A method for forming the phosphor portion 4 on the mounting substrate 3 will be described with reference to FIG. An appropriate amount of a translucent fluid (silicone resin, glass, etc.) mixed with a fluorescent material is poured into the concave portion 7a of the mold 7 using the mold 7 having the concave portion 7a having the same shape as the outer shape of the phosphor portion 4. Next, the mounting substrate 3 on which the LED element 2 is mounted is appropriately arranged so that only the LED element 2 is embedded in the recess 7a of the mold 7, and the LED element 2 is immersed in the translucent fluid. . Finally, the translucent fluid is cured by heat treatment or the like, whereby the phosphor portion 4 is formed on the mounting substrate 3.

  Another example of the method for forming the phosphor portion 4 will be described with reference to FIG. As a constituent element of the phosphor portion 4, a fluorescent cap 8 having a recess having the same shape as the outer shape of the LED element 2 is molded by a compression molding method. Next, a translucent fluid is applied to the surface of the molded fluorescent cap 8 facing the mounting substrate 3. Finally, the fluorescent cap 8 is placed on the LED element 2, and then the applied fluid is cured by heat treatment or the like and adhered to the mounting substrate 3. Thereby, the phosphor part 4 is formed on the mounting substrate 3. The method for forming the phosphor portion 4 is not limited to the above, and for example, a printing method, a molding method, an electrophoresis method, or the like can be used.

  Next, an example will be described in which a plurality of LED packages 1 configured as described above are arranged and the plurality of LED packages 1 are mounted on a wiring board. As shown in FIG. 6, the LED packages 1 are arranged on the wiring board 9 so that the light emitting portions 5 are densely arranged. At this time, the phosphor portions 4 are connected to each other. Here, an example in which the light emitting units 5 are densely arranged using four LED packages 1 is shown, and the phosphor unit 4 is connected to two adjacent phosphor units 4. For example, solder, Ag paste, resin paste, or the like is used to mount each LED package 1 on the wiring board 9. The wiring substrate 9 is configured by forming an insulating layer on a substantially circular Al base material. The base material used for the wiring board 9 may be a metal other than Al, or may be silicon or resin. On the wiring substrate 9, a wiring pattern 10 for supplying power to the LED packages 1 arranged in a line is formed. The wiring pattern 10 is electrically connected to the electrode pads 6 a of the LED packages 1 and lead wires 11. One end of the wiring pattern 10 is a power supply unit 10 a that receives power supply from the power supply device, and is connected to the power supply line 12. For the wiring pattern 10, for example, a Cu metal film is used. The connection between the wiring pattern 10 and the electrode pad 6a is not limited to the above, and may be performed by wire bond connection. The wiring pattern 10 may have a lead frame type structure.

  As described above, according to the LED package 1 of the present embodiment, the phosphor portion 4 extends to the outside of the end surface portion 31 of the mounting substrate 3 and is connected to the outer shape of the other light emitting element package. Therefore, a plurality of LED packages can be arranged side by side without a gap. Thereby, a non-light-emitting part is not generated between the packages arranged side by side, and light emission with less luminance unevenness can be obtained.

  Next, a description will be given of an irradiation pattern when light output from the LED packages 1 (hereinafter referred to as LED package group 50) arranged side by side as described above is controlled using a lens. Here, as shown in FIG. 7, the wiring board 9 on which the LED package group 50 is mounted is mounted on the lighting device 13 having a light distribution control function, and the LED package group 50 is turned on by the lighting device 13. It was. First, the lighting device 13 will be described.

  The lighting device 13 includes a housing 14 that houses the LED package group 50 and a light distribution control lens 15 that covers an opening for light emission of the housing 14. The housing 14 is formed of a box-shaped member having an upper surface opened, and the wiring board 9 on which the LED package group 50 is mounted is screwed to the bottom surface portion thereof. The housing 14 is made of a metal such as aluminum. In addition, the radiation fin 16 is screwed to the housing 14. The lens 15 is formed of a narrow-angle light distribution type lens, and is formed of, for example, a transparent member made of acrylic or polycarbonate. The upper end edge of the lens 15 is sandwiched between the housing 14 and the frame body 17 provided thereon. The frame body 17 is screwed to the housing 14. The focal point of the lens 15 is set on the central surface of the LED package group 50 or its vicinity. The power supply line 12 from the wiring board 9 is led out through an opening (not shown) of the casing 14 and connected to the power supply device. It is not necessary to use the lens 15 as the light distribution control member, and a reflecting mirror having a focal point at the same position as the lens 15 may be used.

  In the above configuration, when power is supplied to the LED package group 50, the LED elements 2 of the LED packages 1 are turned on. A part of the light output from the LED element 2 is wavelength-converted by the phosphor portion 4, whereby the entire phosphor portion 4 emits light in a predetermined light color. Light emitted from each phosphor portion 4 and incident on the lens 15 is distributed at a narrow angle by the refraction action at the lens entrance surface and the exit surface and the total reflection effect at the lens inner surface, and is irradiated toward the irradiation surface. The irradiation pattern on this irradiation surface is shown in FIG. Since the LED package group 50 emits light with small luminance unevenness, the irradiation unevenness is reduced in the irradiation pattern (circular), and the uniformity is high.

  Moreover, the irradiation pattern in the conventional LED package group 50 is shown in FIG. 9 as a comparative example. In this LED package group 50, the non-light emitting part is partially present due to the gap generated in each light emitting part 5, and therefore, the irradiation pattern has the uneven irradiation 18.

  Next, another configuration example of the LED package 1 will be described with reference to FIG. In the LED package 1, a plurality of LED elements 2 are provided on the mounting substrate 3. At this time, the wiring method between the LED elements 2 may be either serial wiring or parallel wiring.

  Next, still another configuration example of the LED package 1 will be described with reference to FIGS. 11 to 13. In the LED package 1 shown in FIG. 11, a power supply terminal 19 is provided on the end surface of the mounting substrate 3, and the power supply terminal 19 is connected to the LED element 2 by a via 20 and an internal wiring pattern 21 formed in the mounting substrate 3. The electrode is electrically connected to the electrode. Further, the LED package 1 shown in FIG. 12 has a configuration in which the power supply terminal 19 is provided on the surface (back surface) opposite to the mounting surface of the mounting substrate 3. The power supply terminal 19 is connected to the electrode of the LED element 2 by the via 20 and the internal wiring pattern 21 as described above. Further, in the LED package 1 shown in FIG. 13, the power supply terminal 19 is provided on the back surface of the mounting substrate 3 as described above, and the phosphor portion 4 is formed on the entire mounting surface of the mounting substrate 3. All the end faces are extended outward from the end face portion 31 of the mounting substrate 3.

  Next, still another configuration example of the LED package 1 will be described with reference to FIG. In the above description, as shown in the left diagram of FIG. 14, the phosphor portion 4 has a configuration in which the entire end surface extends outward from the end surface portion 31 of the mounting substrate 3. As shown in the drawing, only a part of the end face of the phosphor portion 4 may extend outward from the end face portion 31 of the mounting substrate 3. For example, the end surface of the phosphor part 4 is inclined and only the peripheral part extends, and the peripheral part of the phosphor part 4 is rounded and only the middle part of the end surface extends.

  Next, still another configuration example of the LED package 1 will be described with reference to FIG. As shown in this figure, each LED package 1 may be configured such that the light emitting sections 5 are arranged side by side so as to be side by side.

(Second Embodiment)
An LED package group according to a second embodiment of the present invention will be described with reference to FIG. The LED package group 50 includes a plurality of LED packages 1 and these LED packages 1 are arranged so that the phosphor portions 4 are in contact with each other.
In the LED package group 50, the fluorescent paste 22 is interposed between the phosphor portions 4 of the plurality of LED packages 1. The fluorescent paste 22 is made of a fluid in which a fluorescent material is mixed with a translucent material. The phosphor paste 22 is formed by filling the fluid between the phosphor portions 4 and then curing it by heat treatment. It is preferable to use a silicone material having a high viscosity as the light-transmitting material. As the fluorescent material, the same fluorescent material used for the phosphor portion 4 is used. The fluorescent paste 22 may be mixed with a light diffusing material such as glass, alumina, TiO ₂ instead of the fluorescent material.

  According to the LED package group 50 of the present embodiment, the gap created between the phosphor portions 4 due to the geometrical tolerance and mounting tolerance of the LED package 1 is complemented by the fluorescent paste 22, and fluorescence is generated by the light emission or light diffusion action of the fluorescent paste 22. Since no non-light emitting portion is generated between the body parts 4, the effect of suppressing luminance unevenness is further enhanced.

(Third embodiment)
An LED package group according to a third embodiment of the present invention will be described with reference to FIG. The LED package group 50 includes a plurality of LED packages 1, and the phosphor portion 4 of each LED package 1 has a configuration in which all end surfaces extend outward from the end surface portion 31 of the mounting substrate 3. . Each LED package 1 is densely arranged so that the respective phosphor parts 4 are in contact with each other, and here, three LED packages 1 are arranged in the vertical direction and the horizontal direction, respectively. Here, in each LED package 1, the wiring pattern to the LED element 2 is formed on the back surface of the mounting substrate 3.

  According to the LED package group 50 of the present embodiment, a plurality of LED packages 1 can be arranged so that all the phosphor parts 4 are in contact with each other to form one light emitting part. The degree of freedom increases.

(Fourth embodiment)
An LED package group according to a fourth embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 18, the LED package group 50 includes a plurality of LED packages 1a and 1b, and when these LED packages 1a and 1b are arranged side by side, the phosphor portion 4a of one LED package 1a, The phosphor part 4b of the other LED package 1b is configured to overlap each other in plan view. Only the upper end surface of the phosphor portion 4a of the LED package 1a extends outward from the end surface portion 31 of the mounting substrate 3. The phosphor portion 4b of the LED package 1b has the lower end surface portion of the mounting substrate 3 only. 31 extends outward.

  A method for forming the phosphor portions 4a and 4b will be described. As shown in FIG. 19, the constituent elements of the phosphor portions 4a and 4b are collectively formed into a sheet shape by a compression molding method using the mold 7, and the desired phosphor portions 4a and 4b are obtained by cutting the components. The phosphor portions 4a and 4b thus formed are each attached to a mounting substrate on which the LED elements are mounted.

  According to the LED package group 50 of the present embodiment, the phosphor portions 4a and 4b are overlapped with each other, so that no non-light emitting portion is generated between the phosphor portions 4, so that luminance unevenness is reduced.

  Next, another configuration example of the LED package group will be described with reference to FIG. Here, the phosphor portion 4a of one LED package 1a has a quadrangular pyramid shape and the end surface is inclined, and the phosphor portion 4b of the other LED package 1b is vertically opposite to the shape of the phosphor portion 4a. It has a quadrangular pyramid shape, and its end surface is inclined so as to follow the phosphor portion 4a and the end surface. Also in such an LED package group 50, since the phosphor portion 4a of one LED package 1a and the phosphor portion 4b of the other LED package 1b can be arranged so as to overlap each other in plan view, luminance unevenness is caused. Reduced.

(Fifth embodiment)
An LED package group according to a fifth embodiment of the present invention will be described with reference to FIG. In this LED package group 50, the mounting substrate 3 of each LED package 1 has an angle formed by the two end surfaces of the end surface portion 31 of 60 °, and the phosphor portion 4 extends outward from the end surface portion 31. It is configured. Even in such an LED package group 50, light emission with less luminance unevenness can be obtained.

(Sixth embodiment)
An LED package group according to a sixth embodiment of the present invention will be described with reference to FIG. The LED package group 50 includes a plurality of LED packages 1 and a hemispherical condensing lens portion 23 disposed so as to cover all the phosphor portions 4 of the LED packages 1. The lens portion 23 is formed by providing a transparent outer frame on a hemisphere having a thickness of about 0.5 mm filled with a translucent material so as to cover the phosphor portion 4 of the LED package 1 and heat curing. The For example, a silicone resin is used for the outer frame of the lens and the translucent material filled therein.

  According to such an LED package group 50, since the refractive index difference on the surface of the phosphor portion 4 (interface with the lens portion 23) is reduced by providing the lens portion 23, the light enters the phosphor portion 4 from the LED element 2. The emitted light passes through the lens unit 23 and is extracted with high efficiency. Therefore, the light extraction efficiency of the light emitting unit is improved, and the light output amount of the package group is improved. Moreover, since the shape of the lens part 23 is spherical, the incident angle on the surface of the lens part 23 becomes small, and the reflection loss on the surface of the lens part 23 is reduced. According to the experimental results, the light extraction efficiency was improved by about 10% compared to the case where the lens portion 23 was not provided.

(Seventh embodiment)
An LED package group according to a seventh embodiment of the present invention will be described with reference to FIG. In this LED package group 50, the lens portion 23 is formed of a hemispherical solid lens, and has a concave portion 23 a having the same shape as the outer surface of the aggregate of the phosphor portions 4 at a portion facing the phosphor portion 4. The concave portion 23a of the lens portion 23 does not need to have the same shape as the outer surface of the aggregate of the phosphor portions 4, and has a shape or size that allows the lens portion 23 to be tightly bonded to the LED package group 50 so that no bubbles are generated. If it is. As a method of forming the lens portion 23, the concave portion 23a of the lens portion 23 is filled with a translucent material for bonding, and then attached so as to cover the phosphor portion 4 of the LED package 1, and the filled portion is introduced and cured. The LED package group 50 is joined.

  According to such an LED package group 50, since the lens part 23 has the recessed part 23a of the same shape as the outer surface of the aggregate | assembly of the fluorescent substance part 4, positioning of the lens part 23 becomes easy and optical control is stabilized. . Moreover, since the translucent material with which the lens part 23 is filled is very small, it is maintained by the surface tension between the lens part 23 and the phosphor part 4 when the lens part 23 is mounted. The resin leakage hardly occurs during the curing of the conductive material, and the LED package group 50 can be easily manufactured. Moreover, the generation | occurrence | production of the bubble by resin leak can also be prevented.

  In addition, this invention is not restricted to the structure of the said various embodiment, A various deformation | transformation is possible in the range which does not change the meaning of invention. For example, in the above description, the phosphor portion 4 is configured to extend outward from the end surface portion of the mounting substrate 3, but may be configured to coincide with the end surface portion. In this case, the end surface portion of the mounting substrate 3 comes into contact with the end surface portion of the adjacent mounting substrate.

1 LED package (light emitting device package)
2 LED elements (light emitting elements)
3 Mounting substrate 31 End face part 4 Phosphor part 50 LED package group (light emitting element package group)
23 Lens part 23a Concave part

Claims (3)

In a light emitting device package group configured by arranging a plurality of light emitting device packages so that their light emitting portions are closely packed together ,
The light emitting device package includes a mounting substrate on which the light emitting device is mounted, and a phosphor portion that is provided on a mounting surface of the mounting substrate and converts the wavelength of emitted light from the light emitting device ,
The mounting substrate has an end surface portion facing a plan view outer shape of the other light emitting device package when the other light emitting device packages are arranged side by side,
The phosphor portion is configured to coincide with or extend outward from the end surface portion, and further, the phosphor portions of two adjacent light emitting element packages overlap each other in plan view. A light emitting element package group characterized by comprising: A plurality of light emitting device package groups according to claim 1,
The plurality of light emitting device package groups are arranged so that the respective phosphor portions are in contact with each other,
A light-emitting element package group , wherein a light-collecting lens part is disposed so as to cover all phosphor parts of the plurality of light-emitting element package groups.   The light emitting element package group according to claim 2, wherein the lens portion has a concave portion having the same shape as the outer surface of the aggregate of phosphor portions at a portion facing the phosphor portion.

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