Nothing Special   »   [go: up one dir, main page]

JP2012009632A - Light-emitting element package and light-emitting element package group with light-emitting element package - Google Patents

Light-emitting element package and light-emitting element package group with light-emitting element package Download PDF

Info

Publication number
JP2012009632A
JP2012009632A JP2010144366A JP2010144366A JP2012009632A JP 2012009632 A JP2012009632 A JP 2012009632A JP 2010144366 A JP2010144366 A JP 2010144366A JP 2010144366 A JP2010144366 A JP 2010144366A JP 2012009632 A JP2012009632 A JP 2012009632A
Authority
JP
Japan
Prior art keywords
light
led
phosphor
led package
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010144366A
Other languages
Japanese (ja)
Other versions
JP5613475B2 (en
Inventor
Keiji Kiba
啓嗣 騎馬
Ryoji Yokoya
良二 横谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Panasonic Electric Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co Ltd filed Critical Panasonic Electric Works Co Ltd
Priority to JP2010144366A priority Critical patent/JP5613475B2/en
Publication of JP2012009632A publication Critical patent/JP2012009632A/en
Application granted granted Critical
Publication of JP5613475B2 publication Critical patent/JP5613475B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce occurrence of uneven luminance in a light-emitting element package by eliminating a non-light-emitting portion resulting from the gap between phosphors of juxtaposed light-emitting element packages.SOLUTION: An LED package 1 comprises a mounting substrate 3 on which an LED element 2 is mounted, and a phosphor 4 provided on the mounting surface of the mounting substrate 3. The mounting substrate 3 has an end face 31 which faces the outline in plan view of other LED package when the other LED package is juxtaposed. The phosphor 4 is constituted to be aligned with the end face 31 or to extend outward therefrom. Since the phosphor 4 extends outward from the end face 31 of the mounting substrate 3 and is in contact with the outline of the other LED package, multiple LED packages can be juxtaposed with no gap. Consequently, a non-light-emitting portion does not occur between juxtaposed packages and light can be emitted while reducing uneven luminance.

Description

本発明は、LEDなどの発光素子を実装した発光素子パッケージ、及びそれを備えた発光素子パッケージ群に関する。   The present invention relates to a light emitting device package on which a light emitting device such as an LED is mounted, and a light emitting device package group including the light emitting device package.

従来より、この種の発光素子パッケージにおいて、白色光など所望の色の発光を得るため、LED素子が実装された実装基板上に、LED素子からの放射光を波長変換する蛍光体部を備えたLEDパッケージが知られている(例えば、特許文献1及び2参照)。このようなLEDパッケージについては、用途によって様々な使用態様が考えられ、その1つとして、LEDパッケージ同士を互いに並び配置し、これら並び配置された複数パッケージにより1つの発光部を形成するといった使用態様がある。   Conventionally, in this type of light emitting device package, in order to obtain light emission of a desired color such as white light, a phosphor portion that converts the wavelength of emitted light from the LED device is provided on a mounting substrate on which the LED device is mounted. LED packages are known (see, for example, Patent Documents 1 and 2). Various usage modes are conceivable for such LED packages depending on the application, and one of them is a usage mode in which LED packages are arranged side by side and one light emitting unit is formed by a plurality of these arranged packages. There is.

ところで、上記各特許文献に示されるLEDパッケージでは、LED素子を覆う蛍光体部が基板端面部よりも内側に形設されているため、LEDパッケージ同士を互いの基板端面部が接するように並び配置したとき、各々の蛍光体間に隙間が生じる。そのため、これら複数パッケージにより形成される発光部は、上記の隙間により生ずる非発光の部分を含むことになり、輝度むらが生じたものになってしまう。このような輝度むらが発光部に生じていると、発光部からの放射光を集光用のレンズを用いて配光制御した際、照射面に照射ムラが生じることにもなる。   By the way, in the LED package shown by each said patent document, since the fluorescent substance part which covers an LED element is formed inside the board | substrate end surface part, it arranges so that a mutual board | substrate end surface part may contact LED packages. When it does, a clearance gap will arise between each fluorescent substance. For this reason, the light-emitting portion formed by these plural packages includes a non-light-emitting portion generated by the above-described gap, resulting in uneven brightness. If such brightness unevenness occurs in the light emitting part, when the light distribution from the light emitting part is subjected to light distribution control using a condensing lens, irradiation unevenness also occurs on the irradiated surface.

特開2009−267039号公報JP 2009-267039 A 特表2008−541411号公報Special table 2008-541411

本発明は、上記問題を解決するためになされたものであり、互いに並び配置される発光素子パッケージ間で各々の蛍光体部間での隙間により生じる非発光部分を無くして、輝度むらの発生を低減するようにした発光素子パッケージ及び発光素子パッケージ群を提供することを目的とする。   The present invention has been made to solve the above-described problems, and eliminates non-light-emitting portions caused by gaps between the respective phosphor portions between the light-emitting element packages arranged side by side, thereby generating uneven brightness. It is an object to provide a light emitting device package and a light emitting device package group which are reduced.

本発明の発光素子パッケージは、発光素子が実装された実装基板と、前記実装基板の実装面に設けられ、前記発光素子からの放射光を波長変換する蛍光体部とを備えた発光素子パッケージにおいて、前記実装基板は、他の発光素子パッケージが並び配置されるときに、該他の発光素子パッケージの平面視外形と対面する端面部を有し、前記蛍光体部は、前記端面部と一致又は該端面部から外側に延出するように構成されていることを特徴とする。   The light emitting device package of the present invention is a light emitting device package comprising: a mounting substrate on which the light emitting device is mounted; and a phosphor portion that is provided on the mounting surface of the mounting substrate and converts the wavelength of the emitted light from the light emitting device. The mounting substrate has an end surface portion facing a plan view outer shape of the other light emitting device package when the other light emitting device packages are arranged side by side, and the phosphor portion coincides with the end surface portion or It is configured to extend outward from the end face.

本発明の発光素子パッケージ群は、上記の発光素子パッケージを複数有し、これら複数の発光素子パッケージが各々の蛍光体部を互いに接するように配置され、前記複数の発光素子パッケージの全ての蛍光体部を覆うように集光用のレンズ部が配置されて成ることを特徴とする。   The light emitting device package group of the present invention has a plurality of the above light emitting device packages, and the plurality of light emitting device packages are arranged so that the respective phosphor portions are in contact with each other, and all the phosphors of the plurality of light emitting device packages are arranged. A condensing lens part is arranged so as to cover the part.

この発光素子パッケージ群において、前記レンズ部は、蛍光体部に対面する部位に蛍光体部の集合体の外表面と同形状の凹部を有することが好ましい。   In this light emitting element package group, it is preferable that the lens portion has a concave portion having the same shape as the outer surface of the aggregate of the phosphor portions at a portion facing the phosphor portion.

本発明の発光素子パッケージによれば、蛍光体部は、実装基板の端面部と一致又は該端面部から外側に延出されていて、該他の発光素子パッケージの外形と連接される構造となっているので、複数のLEDパッケージを隙間なく並び配置することができる。これにより、互いに並び配置された各パッケージ間で非発光部分が生じることがなくなり、輝度ムラの少ない発光を得ることができる。   According to the light emitting device package of the present invention, the phosphor portion has a structure that matches the end surface portion of the mounting substrate or extends outward from the end surface portion and is connected to the outer shape of the other light emitting device package. Therefore, a plurality of LED packages can be arranged side by side without a gap. Thereby, a non-light-emitting part is not generated between the packages arranged side by side, and light emission with less luminance unevenness can be obtained.

本発明の第1の実施形態に係るLEDパッケージが他のLEDパッケージと並び配置された状態を示す平面図。The top view which shows the state by which the LED package which concerns on the 1st Embodiment of this invention was put in order with other LED packages. 上記LEDパッケージの斜視図。The perspective view of the said LED package. (a)は同LEDパッケージの平面図、(b)はその正面図。(A) is the top view of the LED package, (b) is the front view. 同LEDパッケージの蛍光体部の形成方法を示す図。The figure which shows the formation method of the fluorescent substance part of the LED package. 同蛍光体部の形成方法の他の例を示す図。The figure which shows the other example of the formation method of the fluorescent substance part. 同LEDパッケージが複数並び配置されたLEDパッケージ群の配線基板への実装状態を示す斜視図。The perspective view which shows the mounting state to the wiring board of the LED package group in which the said LED package was arranged in multiple numbers. 上記LEDパッケージ群から出力される光を配光制御する装置の側断面図。The sectional side view of the apparatus which controls light distribution of the light output from the said LED package group. 同LEDパッケージ群での照射パターンを示す図。The figure which shows the irradiation pattern in the LED package group. 従来例のLEDパッケージ群での照射パターンを示す図。The figure which shows the irradiation pattern in the LED package group of a prior art example. 同実施形態のLEDパッケージの他の構成を示す斜視図。The perspective view which shows the other structure of the LED package of the embodiment. (a)は同LEDパッケージのさらに他の構成を示す斜視図、(b)はその側面図。(A) is a perspective view which shows further another structure of the LED package, (b) is the side view. (a)は同LEDパッケージのさらに他の構成を示す斜視図、(b)はその正面図。(A) is a perspective view which shows other structure of the LED package, (b) is the front view. 同LEDパッケージのさらに他の構成を示す斜視図。The perspective view which shows other structure of the LED package. 同LEDパッケージのさらに他の構成を示す図。The figure which shows other structure of the LED package. 同LEDパッケージのさらに他の構成を示す平面図。The top view which shows other structure of the LED package. 本発明の第2の実施形態に係るLEDパッケージ群の平面図。The top view of the LED package group which concerns on the 2nd Embodiment of this invention. 本発明の第3の実施形態に係るLEDパッケージ群の斜視図。The perspective view of the LED package group which concerns on the 3rd Embodiment of this invention. 本発明の第4の実施形態に係るLEDパッケージ群の側面図。The side view of the LED package group which concerns on the 4th Embodiment of this invention. 上記LEDパッケージ群の蛍光体部の形成方法を示す図。The figure which shows the formation method of the fluorescent substance part of the said LED package group. 同LEDパッケージ群の他の構成を示す側面図。The side view which shows the other structure of the LED package group. 本発明の第5の実施形態に係るLEDパッケージ群を示す平面図。The top view which shows the LED package group which concerns on the 5th Embodiment of this invention. 本発明の第6の実施形態に係るLEDパッケージ群を示す斜視図。The perspective view which shows the LED package group which concerns on the 6th Embodiment of this invention. 本発明の第7の実施形態に係るLEDパッケージ群を示す斜視図。The perspective view which shows the LED package group which concerns on the 7th Embodiment of this invention.

(第1の実施形態)
本発明の第1の実施形態に係るLEDパッケージ(発光素子パッケージ)について図1乃至図9を参照して説明する。図1に示すように、LEDパッケージ1は、発光素子であるLED素子2と、LED素子2を実装する実装基板3と、LED素子2からの放射光を波長変換する蛍光体部4とを備え、LED素子2と蛍光体部4とにより発光部5を形成している。実装基板3には、LED素子2に給電するための一対の配線パターン6が設けられる。LEDパッケージ1は、他のLEDパッケージ1aと並び配置されて使用されるものとなっており、このとき、パッケージ1の発光部5と他のパッケージ1aの発光部5aとが互いに密集するように配置される。以下、LEDモジュール1を詳細説明する。
(First embodiment)
An LED package (light emitting device package) according to a first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the LED package 1 includes an LED element 2 that is a light emitting element, a mounting substrate 3 on which the LED element 2 is mounted, and a phosphor portion 4 that converts the wavelength of emitted light from the LED element 2. The LED element 2 and the phosphor part 4 form a light emitting part 5. The mounting substrate 3 is provided with a pair of wiring patterns 6 for supplying power to the LED elements 2. The LED package 1 is used side by side with the other LED packages 1a. At this time, the light emitting portions 5 of the package 1 and the light emitting portions 5a of the other packages 1a are arranged so as to be densely packed together. Is done. Hereinafter, the LED module 1 will be described in detail.

図2、図3に示すように、LEDパッケージ1は、実装基板3上に実装されたLED素子2を蛍光体部4により覆って成る。LED素子2は、略方形の発光面を有するLEDチップから成り、実装基板3の実装面上に設けられ、実装面の中央付近から長手方向の一端寄りに配置されている。LED素子2に用いるLEDチップは、例えば、外形1mm×1mm程度のものとする。LED素子2の形状及びサイズについて、特に制約はなく、例えば、略円筒形状(直径1mm程度)のものであってよい。LED素子2の種類については、LED素子2と蛍光体部4との組み合わせにより所望の発光色が得らればよいので、例えば、可視光を発する素子であってもよく、また、可視光以外の光(例えば、近紫外光)を発する素子であってもよい。また、LED素子2は、発光面とは反対側の面(素子裏面)に一対の電極を有し、この電極は、実装基板3上の配線パターンと電気接続される。LED素子2の実装基板3への実装方法としては、例えば、Auバンプを用いたフリップチップ実装や、はんだ又はAgペースト等によるダイボンド・ワイヤボンド実装がある。   As shown in FIGS. 2 and 3, the LED package 1 is configured by covering a LED element 2 mounted on a mounting substrate 3 with a phosphor portion 4. The LED element 2 is composed of an LED chip having a substantially square light emitting surface, is provided on the mounting surface of the mounting substrate 3, and is disposed near one end in the longitudinal direction from the vicinity of the center of the mounting surface. The LED chip used for the LED element 2 has, for example, an outer shape of about 1 mm × 1 mm. There is no restriction | limiting in particular about the shape and size of the LED element 2, For example, the thing of a substantially cylindrical shape (diameter about 1 mm) may be sufficient. About the kind of LED element 2, since a desired luminescent color should just be obtained by the combination of the LED element 2 and the fluorescent substance part 4, for example, the element which emits visible light may be sufficient, and other than visible light An element that emits light (for example, near ultraviolet light) may be used. Further, the LED element 2 has a pair of electrodes on the surface (element back surface) opposite to the light emitting surface, and these electrodes are electrically connected to the wiring pattern on the mounting substrate 3. As a method for mounting the LED element 2 on the mounting substrate 3, for example, flip chip mounting using Au bumps, die bonding / wire bonding mounting using solder, Ag paste, or the like is available.

実装基板3は、直方形状の基板から成り、他の発光素子パッケージが並び配置されるときに、該他の発光素子パッケージの平面視外形と対面する端面部31を有する。この端面部31は、LED素子2が配置される側の一端にある端面と、この端面に直交する2つの端面から成るものである。実装基板3のサイズは、ここでは、外形1.2mm×2.5mm、厚み0.3mmである。実装基板3には、例えば、アルミナ基板を用いることができるが、AlN基板、SiC基板などであってもよい。実装基板3の母体(基材)を絶縁性材料により形成する場合、この絶縁性材料には複合材料が用いられてもよい。実装基板3は、上記構成に限られず、例えば、絶縁層を有するAl金属基板や、樹脂材料(アルミナフィラー入り熱硬化樹脂など)を用いた樹脂基板で構成されていてもよい。   The mounting substrate 3 is formed of a rectangular substrate, and has an end surface portion 31 that faces the external shape of the other light emitting element package when viewed in plan when the other light emitting element packages are arranged side by side. The end surface portion 31 includes an end surface at one end on the side where the LED element 2 is disposed and two end surfaces orthogonal to the end surface. Here, the size of the mounting substrate 3 is an outer diameter of 1.2 mm × 2.5 mm and a thickness of 0.3 mm. For example, an alumina substrate can be used as the mounting substrate 3, but an AlN substrate, a SiC substrate, or the like may be used. When the base body (base material) of the mounting substrate 3 is formed of an insulating material, a composite material may be used for the insulating material. The mounting substrate 3 is not limited to the above configuration, and may be configured by, for example, an Al metal substrate having an insulating layer or a resin substrate using a resin material (such as a thermosetting resin containing an alumina filler).

実装基板3上の配線パターン6は、例えば、チタン(Ti)、金(Au)などの金属膜から成り、LED素子2より前方に延出され、電極パッド6aを形成している。配線パターン6は、Ti及びAuから成る積層膜(実装基板3上にTi、Auを順に積層)により形成されていてよい。配線パターン6の形成には、例えば、蒸着法やメッキ法などを用いることができる。実装基板3上のLED素子2が配置される領域(面)には、光取出し効率を高めるため、AlやAg、TiOなどの高反射層を形成することが好ましい。この高反射層の形成の際には、配線パターン6との絶縁を取るため、配線パターン6に接触しないように留意する必要がある。 The wiring pattern 6 on the mounting substrate 3 is made of, for example, a metal film such as titanium (Ti) or gold (Au), and extends forward from the LED element 2 to form an electrode pad 6a. The wiring pattern 6 may be formed of a laminated film made of Ti and Au (Ti and Au are sequentially laminated on the mounting substrate 3). For example, a vapor deposition method or a plating method can be used to form the wiring pattern 6. In a region (surface) on which the LED element 2 is disposed on the mounting substrate 3, it is preferable to form a highly reflective layer such as Al, Ag, or TiO 2 in order to increase the light extraction efficiency. When forming this highly reflective layer, it is necessary to take care not to contact the wiring pattern 6 in order to obtain insulation from the wiring pattern 6.

蛍光体部4は、実装基板3の実装面上にLED素子2の発光面を取り囲むように配置されており、実装基板3の端面部31から外側に延出するように構成されている。蛍光体部4は、シリコーン製の透光性樹脂に蛍光材料を混合して成り、LED素子2から放射光を受けて励起され、その一部の光の波長変換し光色を変化させる。このような構成により、LED素子2からの放射光のうち、蛍光体部4により光色が変化された光と、その他の光とが混ぜ合わされることになり、所望の色合いの発光を得ることが可能となる。例えば、LED素子2が青色LEDである場合において、蛍光体部4に、青色光を黄色光に波長変換するYAG蛍光材料(YAl12:Ce)が用いられると、白色の発光が得られる。また、蛍光材料としては、青色光を赤色光に波長変換するSCASN蛍光材料((SrCa)AlSiN:Eu)、青色光を深赤色光に波長変換するCASN蛍光材料(CaAlSiN:Eu)、青色光を緑色光に波長変換するCSO蛍光材料(CaSc:Ce)などがある。なお、蛍光材料と透光性樹脂との混成を行う際、拡散材を混入させてもよい。 The phosphor portion 4 is disposed on the mounting surface of the mounting substrate 3 so as to surround the light emitting surface of the LED element 2, and is configured to extend outward from the end surface portion 31 of the mounting substrate 3. The phosphor part 4 is formed by mixing a fluorescent material with a translucent resin made of silicone, excited by receiving radiated light from the LED element 2, and changing the wavelength of part of the light to change the light color. With such a configuration, light emitted from the LED element 2 whose light color has been changed by the phosphor portion 4 is mixed with other light, and light emission having a desired color can be obtained. It becomes possible. For example, when the LED element 2 is a blue LED, when a YAG fluorescent material (Y 3 Al 5 0 12 : Ce) that converts blue light into yellow light is used for the phosphor portion 4, white light emission is generated. can get. As fluorescent materials, SCASN fluorescent material ((SrCa) AlSiN 3 : Eu) that converts blue light into red light, CASN fluorescent material (CaAlSiN 3 : Eu) that converts blue light into deep red light, blue, There are CSO fluorescent materials (CaSc 2 O 4 : Ce) that convert light into green light. Note that a diffusion material may be mixed when the fluorescent material and the translucent resin are mixed.

蛍光体部4の実装基板3上への形成方法を図4を用いて説明する。蛍光体部4の外形と同形状の凹部7aを持つ鋳型7を用いて、この鋳型7の凹部7aに、蛍光材料を混合した透光性流動体(シリコーン樹脂やガラスなど)を適量流し込む。次に、LED素子2が実装された実装基板3を、LED素子2のみが鋳型7の凹部7a内に埋入されるように適切に配置し、LED素子2を透光性流動体中に浸す。最後に、透光性流動体を加熱処理等により硬化させ、これにより、蛍光体部4が実装基板3上に形成される。   A method for forming the phosphor portion 4 on the mounting substrate 3 will be described with reference to FIG. An appropriate amount of a translucent fluid (silicone resin, glass, etc.) mixed with a fluorescent material is poured into the concave portion 7a of the mold 7 using the mold 7 having the concave portion 7a having the same shape as the outer shape of the phosphor portion 4. Next, the mounting substrate 3 on which the LED element 2 is mounted is appropriately arranged so that only the LED element 2 is embedded in the recess 7a of the mold 7, and the LED element 2 is immersed in the translucent fluid. . Finally, the translucent fluid is cured by heat treatment or the like, whereby the phosphor portion 4 is formed on the mounting substrate 3.

蛍光体部4の形成方法の他の例を図5を用いて説明する。蛍光体部4の構成エレメントとして、LED素子2の外形と同形状の凹部を有した蛍光キャップ8を、コンプレッションモールド方式により成型する。次に、成形された蛍光キャップ8の、実装基板3との対向面に、透光性流動体を塗布する。最後に、この蛍光キャップ8をLED素子2に被せた後、塗布した流動体を加熱処理等により硬化させ、実装基板3に接着させる。これにより、実装基板3上に蛍光体部4が形成される。蛍光体部4の形成方法は、上記に限られず、例えば、印刷法やモールド法、電気泳動法などを用いることができる。   Another example of the method for forming the phosphor portion 4 will be described with reference to FIG. As a constituent element of the phosphor portion 4, a fluorescent cap 8 having a recess having the same shape as the outer shape of the LED element 2 is molded by a compression molding method. Next, a translucent fluid is applied to the surface of the molded fluorescent cap 8 facing the mounting substrate 3. Finally, the fluorescent cap 8 is placed on the LED element 2, and then the applied fluid is cured by heat treatment or the like and adhered to the mounting substrate 3. Thereby, the phosphor part 4 is formed on the mounting substrate 3. The method for forming the phosphor portion 4 is not limited to the above, and for example, a printing method, a molding method, an electrophoresis method, or the like can be used.

次に、上記のように構成されたLEDパッケージ1が複数並び配置され、これら複数のLEDパッケージ1が配線基板に実装された例を説明する。図6に示すように、各LEDパッケージ1は、配線基板9上に、各々の発光部5が密集するように並び配置され、このとき、各々の蛍光体部4が互いに連接状態となる。ここでは、LEDパッケージ1を4つを用いて各発光部5を密集配置した例を示しており、蛍光体部4は、隣り合う2つの蛍光体部4と連接状態となっている。各LEDパッケージ1の配線基板9への実装には、例えば、はんだやAgペースト、樹脂ペーストなどが用いられる。配線基板9は、略円形のAl基材に絶縁層を形成したもので構成される。配線基板9に用いる基材材料は、Al以外の金属でもよく、シリコンや樹脂などであってもよい。配線基板9には、並び配置された各LEDパッケージ1に給電するための配線パターン10が形成され、この配線パターン10は、各LEDパッケージ1の電極パッド6aとリード線11により電気接続される。配線パターン10の一端は、電源装置からの電力供給を受ける給電部10aとなっており、電源線12と接続される。配線パターン10には、例えば、Cu金属膜が用いられる。配線パターン10と電極パッド6aとの接続は、上記に限られず、ワイヤボンド接続により行われてもよい。また、配線パターン10は、リードフレーム型の構造を有したものであってよい。   Next, an example will be described in which a plurality of LED packages 1 configured as described above are arranged and the plurality of LED packages 1 are mounted on a wiring board. As shown in FIG. 6, the LED packages 1 are arranged on the wiring board 9 so that the light emitting portions 5 are densely arranged. At this time, the phosphor portions 4 are connected to each other. Here, an example in which the light emitting units 5 are densely arranged using four LED packages 1 is shown, and the phosphor unit 4 is connected to two adjacent phosphor units 4. For example, solder, Ag paste, resin paste, or the like is used to mount each LED package 1 on the wiring board 9. The wiring substrate 9 is configured by forming an insulating layer on a substantially circular Al base material. The base material used for the wiring board 9 may be a metal other than Al, or may be silicon or resin. On the wiring substrate 9, a wiring pattern 10 for supplying power to the LED packages 1 arranged in a line is formed. The wiring pattern 10 is electrically connected to the electrode pads 6 a of the LED packages 1 and lead wires 11. One end of the wiring pattern 10 is a power supply unit 10 a that receives power supply from the power supply device, and is connected to the power supply line 12. For the wiring pattern 10, for example, a Cu metal film is used. The connection between the wiring pattern 10 and the electrode pad 6a is not limited to the above, and may be performed by wire bond connection. The wiring pattern 10 may have a lead frame type structure.

このように本実施形態のLEDパッケージ1によれば、蛍光体部4は、実装基板3の端面部31外側に延出されていて、該他の発光素子パッケージの外形と連接される構造となっているので、複数のLEDパッケージを隙間なく並び配置することができる。これにより、互いに並び配置された各パッケージ間で非発光部分が生じることがなくなり、輝度ムラの少ない発光を得ることができる。   As described above, according to the LED package 1 of the present embodiment, the phosphor portion 4 extends to the outside of the end surface portion 31 of the mounting substrate 3 and is connected to the outer shape of the other light emitting element package. Therefore, a plurality of LED packages can be arranged side by side without a gap. Thereby, a non-light-emitting part is not generated between the packages arranged side by side, and light emission with less luminance unevenness can be obtained.

次に、上記のように互いに並び配置された各LEDパッケージ1(以下、LEDパッケージ群50という)から出力される光をレンズを用いて配光制御したときの照射パターンを説明する。ここでは、図7に示すように、LEDパッケージ群50が実装された配線基板9を、配光制御機能を有した点灯装置13に搭載し、この点灯装置13によりLEDパッケージ群50の点灯を行った。まず、点灯装置13について説明する。   Next, a description will be given of an irradiation pattern when light output from the LED packages 1 (hereinafter referred to as LED package group 50) arranged side by side as described above is controlled using a lens. Here, as shown in FIG. 7, the wiring board 9 on which the LED package group 50 is mounted is mounted on the lighting device 13 having a light distribution control function, and the LED package group 50 is turned on by the lighting device 13. It was. First, the lighting device 13 will be described.

点灯装置13は、LEDパッケージ群50を収容する筐体14と、筐体14の光出射用の開口を覆う配光制御用のレンズ15とを備える。筐体14は、上面が開口された箱形状の部材から成り、その底面部に、LEDパッケージ群50を実装した配線基板9がネジ止めされる。筐体14は、例えば、アルミなどの金属により形成される。なお、筐体14には、放熱フィン16がねじ止めされる。レンズ15は、狭角配光型のレンズから成り、例えば、アクリル製、ポリカーボネイド製の透光部材より形成される。レンズ15は、その上端縁部が筐体14とそれに設けられた枠体17とで挟持される。この枠体17は筐体14にネジ止めされる。レンズ15の焦点は、LEDパッケージ群50の中心表面又はその近傍部に設定される。配線基板9からの電源線12は、筐体14の開口部(図示せず)を通って外部に導出され、電源装置に接続される。なお、配光制御用部材としてレンズ15を用いる必要はなく、レンズ15と同様の位置に焦点を有する反射鏡を用いてもよい。   The lighting device 13 includes a housing 14 that houses the LED package group 50 and a light distribution control lens 15 that covers an opening for light emission of the housing 14. The housing 14 is formed of a box-shaped member having an upper surface opened, and the wiring board 9 on which the LED package group 50 is mounted is screwed to the bottom surface portion thereof. The housing 14 is made of a metal such as aluminum. In addition, the radiation fin 16 is screwed to the housing 14. The lens 15 is formed of a narrow-angle light distribution type lens, and is formed of, for example, a transparent member made of acrylic or polycarbonate. The upper end edge of the lens 15 is sandwiched between the housing 14 and the frame body 17 provided thereon. The frame body 17 is screwed to the housing 14. The focal point of the lens 15 is set on the central surface of the LED package group 50 or its vicinity. The power supply line 12 from the wiring board 9 is led out through an opening (not shown) of the casing 14 and connected to the power supply device. It is not necessary to use the lens 15 as the light distribution control member, and a reflecting mirror having a focal point at the same position as the lens 15 may be used.

上記のような構成において、LEDパッケージ群50に電力が供給されると、各LEDパッケージ1のLED素子2が点灯する。LED素子2より出力された光の一部は、蛍光体部4によって波長変換され、これにより、蛍光体部4全体が所定の光色で発光する。各蛍光体部4から出射されレンズ15に入射した光は、レンズ入射面及び出射面での屈折作用とレンズ内面での全反射作用により狭角配光され、照射面に向けて照射される。この照射面での照射パターンを図8に示す。LEDパッケージ群50は輝度ムラの小さい発光を行うため、照射パターン(円形)に照射ムラが低減され、均斉度の高いものとなる。   In the above configuration, when power is supplied to the LED package group 50, the LED elements 2 of the LED packages 1 are turned on. A part of the light output from the LED element 2 is wavelength-converted by the phosphor portion 4, whereby the entire phosphor portion 4 emits light in a predetermined light color. Light emitted from each phosphor portion 4 and incident on the lens 15 is distributed at a narrow angle by the refraction action at the lens entrance surface and the exit surface and the total reflection effect at the lens inner surface, and is irradiated toward the irradiation surface. The irradiation pattern on this irradiation surface is shown in FIG. Since the LED package group 50 emits light with small luminance unevenness, the irradiation unevenness is reduced in the irradiation pattern (circular), and the uniformity is high.

また、比較例として、従来型のLEDパッケージ群50での照射パターンを図9に示す。このLEDパッケージ群50では、各々の発光部5に生じた隙間により非発光の部分が部分的に存在しているため、照射パターンは照射ムラ18が際立ったものとなる。   Moreover, the irradiation pattern in the conventional LED package group 50 is shown in FIG. 9 as a comparative example. In this LED package group 50, the non-light emitting part is partially present due to the gap generated in each light emitting part 5, and therefore, the irradiation pattern has the uneven irradiation 18.

次に、図10を用いてLEDパッケージ1の他の構成例を説明する。このLEDパッケージ1においては、実装基板3上には、複数個のLED素子2が設けられている。このとき、各LED素子2間の配線方法は、直列配線、並列配線のいずれであってもよい。   Next, another configuration example of the LED package 1 will be described with reference to FIG. In the LED package 1, a plurality of LED elements 2 are provided on the mounting substrate 3. At this time, the wiring method between the LED elements 2 may be either serial wiring or parallel wiring.

次に、図11乃至図13を用いてLEDパッケージ1のさらに他の構成例を説明する。図11に示すLEDパッケージ1では、実装基板3の端面に給電端子19が設けられており、この給電端子19は、実装基板3内に形成されたビア20及び内部配線パターン21によって、LED素子2の電極と電気接続される構成となっている。また、図12に示すLEDパッケージ1では、給電端子19が実装基板3の実装面とは反対側の面(裏面)に設けられた構成となっている。給電端子19は、上記同様、ビア20及び内部配線パターン21によりLED素子2の電極と接続される。また、図13に示すLEDパッケージ1では、給電端子19を上記同様に実装基板3の裏面に設け、さらに、蛍光体部4を実装基板3の実装面全体に形成し、かつ、蛍光体部4の全ての端面を実装基板3の端面部31から外方に延出させるようにしている。   Next, still another configuration example of the LED package 1 will be described with reference to FIGS. 11 to 13. In the LED package 1 shown in FIG. 11, a power supply terminal 19 is provided on the end surface of the mounting substrate 3, and the power supply terminal 19 is connected to the LED element 2 by a via 20 and an internal wiring pattern 21 formed in the mounting substrate 3. The electrode is electrically connected to the electrode. Further, the LED package 1 shown in FIG. 12 has a configuration in which the power supply terminal 19 is provided on the surface (back surface) opposite to the mounting surface of the mounting substrate 3. The power supply terminal 19 is connected to the electrode of the LED element 2 by the via 20 and the internal wiring pattern 21 as described above. Further, in the LED package 1 shown in FIG. 13, the power supply terminal 19 is provided on the back surface of the mounting substrate 3 as described above, and the phosphor portion 4 is formed on the entire mounting surface of the mounting substrate 3. All the end faces are extended outward from the end face portion 31 of the mounting substrate 3.

次に、図14を用いてLEDパッケージ1のさらに他の構成例を説明する。上記では、図14の左図に示されるように、蛍光体部4は端面全体が実装基板3の端面部31から外側に延出する構成であったが、これに限られず、図14の右図に示すように、蛍光体部4の端面の一部だけが実装基板3の端面部31より外方に延びていてもよい。例えば、蛍光体部4の端面が傾斜して周縁部分のみが延出しているものや、蛍光体部4周縁が丸みを帯び、端面中腹部のみが延出しているものが挙げられる。   Next, still another configuration example of the LED package 1 will be described with reference to FIG. In the above description, as shown in the left diagram of FIG. 14, the phosphor portion 4 has a configuration in which the entire end surface extends outward from the end surface portion 31 of the mounting substrate 3. As shown in the drawing, only a part of the end face of the phosphor portion 4 may extend outward from the end face portion 31 of the mounting substrate 3. For example, the end surface of the phosphor part 4 is inclined and only the peripheral part extends, and the peripheral part of the phosphor part 4 is rounded and only the middle part of the end surface extends.

次に、図15を用いてLEDパッケージ1のさらに他の構成例を説明する。この図に示すように、各LEDパッケージ1は、各々の発光部5が横並びになるように並び配置されるような構成であってもよい。   Next, still another configuration example of the LED package 1 will be described with reference to FIG. As shown in this figure, each LED package 1 may be configured such that the light emitting sections 5 are arranged side by side so as to be side by side.

(第2の実施形態)
本発明の第2の実施形態に係るLEDパッケージ群について図16を参照して説明する。このLEDパッケージ群50は、複数のLEDパッケージ1を有し、これらLEDパッケージ1が各々の蛍光体部4を互いに接するように配置される。
LEDパッケージ群50は、これら複数のLEDパッケージ1の各々の蛍光体部4間に蛍光ペースト22が介在される。この蛍光ペースト22は、透光性材料に蛍光材料を混合した流動体から成り、この流動体を蛍光体部4間に充填した後、熱処理によって硬化させることにより形成される。上記の透光性材料には、粘度の高いシリコーン系材料を用いることが好ましい。蛍光材料には、蛍光体部4に使用されている蛍光材料と同じものが使用される。また、蛍光ペースト22は、蛍光材料に代えて、ガラス、アルミナ、TiOなどの光拡散材料が混合されていてもよい。
(Second Embodiment)
An LED package group according to a second embodiment of the present invention will be described with reference to FIG. The LED package group 50 includes a plurality of LED packages 1 and these LED packages 1 are arranged so that the phosphor portions 4 are in contact with each other.
In the LED package group 50, the fluorescent paste 22 is interposed between the phosphor portions 4 of the plurality of LED packages 1. The fluorescent paste 22 is made of a fluid in which a fluorescent material is mixed with a translucent material. The phosphor paste 22 is formed by filling the fluid between the phosphor portions 4 and then curing it by heat treatment. It is preferable to use a silicone material having a high viscosity as the light-transmitting material. As the fluorescent material, the same fluorescent material used for the phosphor portion 4 is used. The fluorescent paste 22 may be mixed with a light diffusing material such as glass, alumina, TiO 2 instead of the fluorescent material.

本実施形態のLEDパッケージ群50によれば、LEDパッケージ1の幾何公差や実装公差によって蛍光体部4間に生じる隙間を蛍光ペースト22により補完し、この蛍光ペースト22の発光又は光拡散作用によって蛍光体部4間で非発光部分が生じないようにしたので、輝度ムラを抑制する効果が一層高くなる。   According to the LED package group 50 of the present embodiment, the gap created between the phosphor portions 4 due to the geometrical tolerance and mounting tolerance of the LED package 1 is complemented by the fluorescent paste 22, and fluorescence is generated by the light emission or light diffusion action of the fluorescent paste 22. Since no non-light emitting portion is generated between the body parts 4, the effect of suppressing luminance unevenness is further enhanced.

(第3の実施形態)
本発明の第3の実施形態に係るLEDパッケージ群について図17を参照して説明する。LEDパッケージ群50は、複数のLEDパッケージ1を有し、各LEDパッケージ1の蛍光体部4は、全ての端面が実装基板3の端面部31から外方に延出された構成となっている。各LEDパッケージ1は、各々の蛍光体部4が互いに接するように密集配列され、ここでは、縦方向及び横方向にそれぞれ3つずつ配列されたものとなっている。ここに、各LEDパッケージ1において、LED素子2への配線パターンは、実装基板3の裏面に形成される。
(Third embodiment)
An LED package group according to a third embodiment of the present invention will be described with reference to FIG. The LED package group 50 includes a plurality of LED packages 1, and the phosphor portion 4 of each LED package 1 has a configuration in which all end surfaces extend outward from the end surface portion 31 of the mounting substrate 3. . Each LED package 1 is densely arranged so that the respective phosphor parts 4 are in contact with each other, and here, three LED packages 1 are arranged in the vertical direction and the horizontal direction, respectively. Here, in each LED package 1, the wiring pattern to the LED element 2 is formed on the back surface of the mounting substrate 3.

本実施形態のLEDパッケージ群50によれば、複数のLEDパッケージ1を蛍光体部4の全てが互いに接するように配列して1つの発光部を形成することができるので、LEDパッケージ群50の設計の自由度が高まる。   According to the LED package group 50 of the present embodiment, a plurality of LED packages 1 can be arranged so that all the phosphor parts 4 are in contact with each other to form one light emitting part. The degree of freedom increases.

(第4の実施形態)
本発明の第4の実施形態に係るLEDパッケージ群について図18及び図19を参照して説明する。図18に示すように、LEDパッケージ群50は、複数のLEDパッケージ1a、1bを有し、これらLEDパッケージ1a、1bが互いに並び配置されるとき、一方のLEDパッケージ1aの蛍光体部4aと、もう一方のLEDパッケージ1bの蛍光体部4bとが平面視で互いに重なり合うように構成される。LEDパッケージ1aの蛍光体部4aは、その端面上部のみが実装基板3の端面部31から外側に延出され、LEDパッケージ1bの蛍光体部4bは、その端面下部のみが実装基板3の端面部31から外側に延出される。
(Fourth embodiment)
An LED package group according to a fourth embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 18, the LED package group 50 includes a plurality of LED packages 1a and 1b, and when these LED packages 1a and 1b are arranged side by side, the phosphor portion 4a of one LED package 1a, The phosphor part 4b of the other LED package 1b is configured to overlap each other in plan view. Only the upper end surface of the phosphor portion 4a of the LED package 1a extends outward from the end surface portion 31 of the mounting substrate 3. The phosphor portion 4b of the LED package 1b has the lower end surface portion of the mounting substrate 3 only. 31 extends outward.

蛍光体部4a、4bの形成方法を説明する。図19に示すように、鋳型7を用いてコンプレッションモールド方式により、蛍光体部4a、4bの構成エレメントをシート状に一括形成し、これを切断して所望の蛍光体部4a、4bを得る。このように形成された蛍光体部4a、4bを、それぞれ、LED素子が実装された実装基板に取り付ける。   A method for forming the phosphor portions 4a and 4b will be described. As shown in FIG. 19, the constituent elements of the phosphor portions 4a and 4b are collectively formed into a sheet shape by a compression molding method using the mold 7, and the desired phosphor portions 4a and 4b are obtained by cutting the components. The phosphor portions 4a and 4b thus formed are each attached to a mounting substrate on which the LED elements are mounted.

本実施形態のLEDパッケージ群50によれば、蛍光体部4a、4b同士が重なり合うことにより、蛍光体部4間に非発光部分が生じることがなくなるので、輝度ムラが低減される。   According to the LED package group 50 of the present embodiment, the phosphor portions 4a and 4b are overlapped with each other, so that no non-light emitting portion is generated between the phosphor portions 4, so that luminance unevenness is reduced.

次に、図20を用いて上記LEDパッケージ群の他の構成例を説明する。ここでは、一方のLEDパッケージ1aの蛍光体部4aは、四角錘形状とされ端面が傾斜しており、他方のLEDパッケージ1bの蛍光体部4bは、蛍光体部4aの形状とは上下反対の四角錘形状とされ、その端面が蛍光体部4aと端面に沿うように傾斜している。このようなLEDパッケージ群50においても、一方のLEDパッケージ1aの蛍光体部4aと、もう一方のLEDパッケージ1bの蛍光体部4bとが平面視で互いに重なりあうように配置できるので、輝度ムラが低減される。   Next, another configuration example of the LED package group will be described with reference to FIG. Here, the phosphor portion 4a of one LED package 1a has a quadrangular pyramid shape and the end surface is inclined, and the phosphor portion 4b of the other LED package 1b is vertically opposite to the shape of the phosphor portion 4a. It has a quadrangular pyramid shape, and its end surface is inclined so as to follow the phosphor portion 4a and the end surface. Also in such an LED package group 50, since the phosphor portion 4a of one LED package 1a and the phosphor portion 4b of the other LED package 1b can be arranged so as to overlap each other in plan view, luminance unevenness is caused. Reduced.

(第5の実施形態)
本発明の第5の実施形態に係るLEDパッケージ群について図21を参照して説明する。このLEDパッケージ群50においては、各LEDパッケージ1の実装基板3は、端面部31の2端面のなす角が60°とされ、蛍光体部4は、この端面部31から外側に延出するように構成されている。このようなLEDパッケージ群50においても、輝度ムラの少ない発光を得ることができる。
(Fifth embodiment)
An LED package group according to a fifth embodiment of the present invention will be described with reference to FIG. In this LED package group 50, the mounting substrate 3 of each LED package 1 has an angle formed by the two end surfaces of the end surface portion 31 of 60 °, and the phosphor portion 4 extends outward from the end surface portion 31. It is configured. Even in such an LED package group 50, light emission with less luminance unevenness can be obtained.

(第6の実施形態)
本発明の第6の実施形態に係るLEDパッケージ群について図22を参照して説明する。このLEDパッケージ群50は、複数のLEDパッケージ1と、これらLEDパッケージ1の全ての蛍光体部4を覆うように配置された半球形状の集光用のレンズ部23を有している。レンズ部23は、厚み約0.5mmの半球上の透明外枠内に透光性材料を充填したものを、LEDパッケージ1の蛍光体部4を覆うように設け、加熱硬化することにより形成される。レンズの外枠及びこれに充填される透光性材料には、例えば、シリコーン樹脂を用いる。
(Sixth embodiment)
An LED package group according to a sixth embodiment of the present invention will be described with reference to FIG. The LED package group 50 includes a plurality of LED packages 1 and a hemispherical condensing lens portion 23 disposed so as to cover all the phosphor portions 4 of the LED packages 1. The lens portion 23 is formed by providing a transparent outer frame on a hemisphere having a thickness of about 0.5 mm filled with a translucent material so as to cover the phosphor portion 4 of the LED package 1 and heat curing. The For example, a silicone resin is used for the outer frame of the lens and the translucent material filled therein.

このようなLEDパッケージ群50によれば、レンズ部23を設けることで蛍光体部4表面(レンズ部23との界面)の屈折率差が小さくなるため、LED素子2から蛍光体部4に入射した光がレンズ部23を通って高効率で取り出される。そのため、発光部の光取り出し効率が向上し、パッケージ群の光出力量が向上する。また、レンズ部23の形状が球状であるため、レンズ部23表面への入射角度が小さくなり、レンズ部23表面での反射ロスが低減される。実験結果によると、レンズ部23を設けない場合に比べて、光取り出し効率が約10%向上した。   According to such an LED package group 50, since the refractive index difference on the surface of the phosphor portion 4 (interface with the lens portion 23) is reduced by providing the lens portion 23, the light enters the phosphor portion 4 from the LED element 2. The emitted light passes through the lens unit 23 and is extracted with high efficiency. Therefore, the light extraction efficiency of the light emitting unit is improved, and the light output amount of the package group is improved. Moreover, since the shape of the lens part 23 is spherical, the incident angle on the surface of the lens part 23 becomes small, and the reflection loss on the surface of the lens part 23 is reduced. According to the experimental results, the light extraction efficiency was improved by about 10% compared to the case where the lens portion 23 was not provided.

(第7の実施形態)
本発明の第7の実施形態に係るLEDパッケージ群について図23を参照して説明する。このLEDパッケージ群50において、レンズ部23は、半球形状の中実レンズから成り、蛍光体部4に対向する部位に蛍光体部4の集合体の外表面と同形状の凹部23aを有する。レンズ部23の凹部23aは、蛍光体部4の集合体の外表面と同形状である必要はなく、レンズ部23をLEDパッケージ群50に対し気泡が生じないように密着接合できる形状又は大きさであればよい。レンズ部23の形成方法としては、レンズ部23の凹部23aに接合用の透光性材料を充填した後、LEDパッケージ1の蛍光体部4を覆うように取付け、充填した導入し硬化させることで、LEDパッケージ群50に接合される。
(Seventh embodiment)
An LED package group according to a seventh embodiment of the present invention will be described with reference to FIG. In this LED package group 50, the lens portion 23 is formed of a hemispherical solid lens, and has a concave portion 23 a having the same shape as the outer surface of the aggregate of the phosphor portions 4 at a portion facing the phosphor portion 4. The concave portion 23a of the lens portion 23 does not need to have the same shape as the outer surface of the aggregate of the phosphor portions 4, and has a shape or size that allows the lens portion 23 to be tightly bonded to the LED package group 50 so that no bubbles are generated. If it is. As a method of forming the lens portion 23, the concave portion 23a of the lens portion 23 is filled with a translucent material for bonding, and then attached so as to cover the phosphor portion 4 of the LED package 1, and the filled portion is introduced and cured. The LED package group 50 is joined.

このようなLEDパッケージ群50によれば、レンズ部23が、蛍光体部4の集合体の外表面と同形状の凹部23aを有するので、レンズ部23の位置決めが容易となり、光学制御が安定する。また、レンズ部23に充填する透光性材料が微量であり、レンズ部23を搭載する際に、レンズ部23と蛍光体部4間での表面張力で維持されるようになるので、透光性材料の硬化中に樹脂もれが生じにくくなり、LEDパッケージ群50を容易に作製できるようになる。また、樹脂もれによる気泡発生も防止できる。   According to such an LED package group 50, since the lens part 23 has the recessed part 23a of the same shape as the outer surface of the aggregate | assembly of the fluorescent substance part 4, positioning of the lens part 23 becomes easy and optical control is stabilized. . Moreover, since the translucent material with which the lens part 23 is filled is very small, it is maintained by the surface tension between the lens part 23 and the phosphor part 4 when the lens part 23 is mounted. The resin leakage hardly occurs during the curing of the conductive material, and the LED package group 50 can be easily manufactured. Moreover, the generation | occurrence | production of the bubble by resin leak can also be prevented.

なお、本発明は、上記各種実施形態の構成に限られず、発明の趣旨を変更しない範囲で種々の変形が可能である。例えば、上記では、蛍光体部4が実装基板3の端面部から外側に延出する構成されたものを示したが、端面部と一致するように構成されていてもよい。この場合、実装基板3の端面部は、隣り合う実装基板の端面部と接するようになる。   In addition, this invention is not restricted to the structure of the said various embodiment, A various deformation | transformation is possible in the range which does not change the meaning of invention. For example, in the above description, the phosphor portion 4 is configured to extend outward from the end surface portion of the mounting substrate 3, but may be configured to coincide with the end surface portion. In this case, the end surface portion of the mounting substrate 3 comes into contact with the end surface portion of the adjacent mounting substrate.

1 LEDパッケージ(発光素子パッケージ)
2 LED素子(発光素子)
3 実装基板
31 端面部
4 蛍光体部
50 LEDパッケージ群(発光素子パッケージ群)
23 レンズ部
23a 凹部
1 LED package (light emitting device package)
2 LED elements (light emitting elements)
3 Mounting substrate 31 End face part 4 Phosphor part 50 LED package group (light emitting element package group)
23 Lens part 23a Concave part

Claims (3)

発光素子が実装された実装基板と、前記実装基板の実装面に設けられ、前記発光素子からの放射光を波長変換する蛍光体部とを備えた発光素子パッケージにおいて、
前記実装基板は、他の発光素子パッケージが並び配置されるときに、該他の発光素子パッケージの平面視外形と対面する端面部を有し、
前記蛍光体部は、前記端面部と一致又は該端面部から外側に延出するように構成されていることを特徴とする発光素子パッケージ。
In a light emitting device package comprising: a mounting substrate on which a light emitting device is mounted; and a phosphor portion that is provided on a mounting surface of the mounting substrate and converts the wavelength of emitted light from the light emitting device.
The mounting substrate has an end surface portion facing a plan view outer shape of the other light emitting device package when the other light emitting device packages are arranged side by side,
The phosphor part is configured to coincide with the end face part or to extend outward from the end face part.
請求項1に記載の発光素子パッケージを複数有し、
これら複数の発光素子パッケージが各々の蛍光体部を互いに接するように配置され、
前記複数の発光素子パッケージの全ての蛍光体部を覆うように集光用のレンズ部が配置されて成ることを特徴とする発光素子パッケージ群。
A plurality of light emitting device packages according to claim 1,
The plurality of light emitting device packages are arranged so that each phosphor portion is in contact with each other,
A light-emitting element package group, wherein a condensing lens part is disposed so as to cover all the phosphor parts of the plurality of light-emitting element packages.
前記レンズ部は、蛍光体部に対向する部位に蛍光体部の集合体の外表面と同形状の凹部を有することを特徴とする請求項2に記載の発光素子パッケージ群。   The light emitting element package group according to claim 2, wherein the lens portion has a concave portion having the same shape as the outer surface of the aggregate of phosphor portions at a portion facing the phosphor portion.
JP2010144366A 2010-06-25 2010-06-25 Light emitting device package and light emitting device package group including the same Active JP5613475B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010144366A JP5613475B2 (en) 2010-06-25 2010-06-25 Light emitting device package and light emitting device package group including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010144366A JP5613475B2 (en) 2010-06-25 2010-06-25 Light emitting device package and light emitting device package group including the same

Publications (2)

Publication Number Publication Date
JP2012009632A true JP2012009632A (en) 2012-01-12
JP5613475B2 JP5613475B2 (en) 2014-10-22

Family

ID=45539851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010144366A Active JP5613475B2 (en) 2010-06-25 2010-06-25 Light emitting device package and light emitting device package group including the same

Country Status (1)

Country Link
JP (1) JP5613475B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013110540A1 (en) * 2012-01-24 2013-08-01 Osram Opto Semiconductors Gmbh Luminaire and method for the production of a luminaire
WO2013151411A1 (en) * 2012-04-06 2013-10-10 Cree, Inc. Light emitting diode components and methods for emitting a desired light beam pattern
JP2016115934A (en) * 2014-12-11 2016-06-23 シチズン電子株式会社 Light-emitting device and method of manufacturing light-emitting device
JP2017063193A (en) * 2015-09-21 2017-03-30 隆達電子股▲ふん▼有限公司 LED chip package
JP2017522734A (en) * 2014-07-18 2017-08-10 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. LED light source for automotive applications

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54109473U (en) * 1978-01-19 1979-08-01
JP2004253745A (en) * 2003-02-24 2004-09-09 Citizen Electronics Co Ltd Method of producing pastel led
JP2005244076A (en) * 2004-02-27 2005-09-08 Matsushita Electric Works Ltd Light-emitting device
JP2006278741A (en) * 2005-03-29 2006-10-12 Kyocera Corp Light emitting device and lighting device
JP2007059618A (en) * 2005-08-24 2007-03-08 Matsushita Electric Works Ltd Led light fixture
JP2009049000A (en) * 2007-07-26 2009-03-05 Panasonic Electric Works Co Ltd Led illumination device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54109473U (en) * 1978-01-19 1979-08-01
JP2004253745A (en) * 2003-02-24 2004-09-09 Citizen Electronics Co Ltd Method of producing pastel led
JP2005244076A (en) * 2004-02-27 2005-09-08 Matsushita Electric Works Ltd Light-emitting device
JP2006278741A (en) * 2005-03-29 2006-10-12 Kyocera Corp Light emitting device and lighting device
JP2007059618A (en) * 2005-08-24 2007-03-08 Matsushita Electric Works Ltd Led light fixture
JP2009049000A (en) * 2007-07-26 2009-03-05 Panasonic Electric Works Co Ltd Led illumination device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013110540A1 (en) * 2012-01-24 2013-08-01 Osram Opto Semiconductors Gmbh Luminaire and method for the production of a luminaire
US9777894B2 (en) 2012-01-24 2017-10-03 Osram Opto Semiconductors Gmbh Luminaire and method of production of a luminaire
WO2013151411A1 (en) * 2012-04-06 2013-10-10 Cree, Inc. Light emitting diode components and methods for emitting a desired light beam pattern
CN104364904A (en) * 2012-04-06 2015-02-18 克利公司 Light emitting diode components and methods for emitting a desired light beam pattern
CN104364904B (en) * 2012-04-06 2017-12-08 克利公司 For launching the Light emitting diode component and method of desired beam pattern
JP2017522734A (en) * 2014-07-18 2017-08-10 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. LED light source for automotive applications
JP2016115934A (en) * 2014-12-11 2016-06-23 シチズン電子株式会社 Light-emitting device and method of manufacturing light-emitting device
JP2017063193A (en) * 2015-09-21 2017-03-30 隆達電子股▲ふん▼有限公司 LED chip package

Also Published As

Publication number Publication date
JP5613475B2 (en) 2014-10-22

Similar Documents

Publication Publication Date Title
JP6852336B2 (en) Light emitting device
JP5810758B2 (en) Light emitting device
JP5903672B2 (en) LIGHT EMITTING DEVICE AND LIGHTING DEVICE USING THE SAME
JP4238681B2 (en) Light emitting device
JP5899507B2 (en) LIGHT EMITTING DEVICE AND LIGHTING DEVICE USING THE SAME
JP5810301B2 (en) Lighting device
US9420642B2 (en) Light emitting apparatus and lighting apparatus
TWI780180B (en) Light-emitting device, integrated light-emitting device, and light-emitting module
TW202301711A (en) Light source
JP6107415B2 (en) Light emitting device
JP2013110273A (en) Semiconductor light-emitting device
JP6959548B2 (en) Light emitting device and its manufacturing method
JP6004795B2 (en) LED light source device and light reflective substrate
JP2013140823A (en) Light-emitting device
JP2011114093A (en) Lighting system
CN104247057A (en) Light emitting device package
JP5613475B2 (en) Light emitting device package and light emitting device package group including the same
JP2014060328A (en) Light-emitting device
JP2016115934A (en) Light-emitting device and method of manufacturing light-emitting device
JP2017162940A (en) Light-emitting device and illuminating device
JP2020107837A (en) Light-emitting device and manufacturing method thereof
JP5330944B2 (en) Light emitting device
JP2009206228A (en) Side emission type light emitting device and manufacturing method thereof, and lighting device
JP5970215B2 (en) Light emitting device and manufacturing method thereof
JP5811770B2 (en) Light emitting device and manufacturing method thereof

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20120117

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130513

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131120

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131203

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140131

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140311

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140414

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140902

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140908

R151 Written notification of patent or utility model registration

Ref document number: 5613475

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151