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TW201803160A - Light emitting device and backlight including the light emitting device - Google Patents

Light emitting device and backlight including the light emitting device Download PDF

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Publication number
TW201803160A
TW201803160A TW106104060A TW106104060A TW201803160A TW 201803160 A TW201803160 A TW 201803160A TW 106104060 A TW106104060 A TW 106104060A TW 106104060 A TW106104060 A TW 106104060A TW 201803160 A TW201803160 A TW 201803160A
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Taiwan
Prior art keywords
light
emitting
emitting element
emitting device
emitting elements
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TW106104060A
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Chinese (zh)
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TWI732821B (en
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赤川星太郎
森川武
西垣健太郎
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日亞化學工業股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

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Abstract

A light emitting device includes at least three light emitting elements arranged side by side, and one or more light transmissive members each containing a phosphor and covering the light emitting elements. The at least three light emitting elements include two outer light emitting elements arranged on outer sides, and an inner light emitting element arranged between the two outer light emitting elements and having a different peak emission wavelength than a peak emission wavelength of the two outer light emitting elements. The phosphor has a longer peak emission wavelength than the peak emission wavelengths of the outer light emitting elements and the peak emission wavelength of the inner light emitting element. The two outer light emitting elements and the inner light emitting element are connected in series.

Description

發光裝置及具備發光裝置之背光Illuminating device and backlight having the same

本發明係關於一種發光裝置及具備該發光裝置之背光。The present invention relates to a light emitting device and a backlight including the same.

一般而言,使用發光二極體等發光元件之發光裝置作為如液晶顯示器之背光、LED燈泡或LED螢光燈、吸頂燈之類的照明器具等各種光源而被廣泛地利用。 例如,專利文獻1中揭示之發光裝置包括紅色螢光體、發出藍色光之發光元件、及發出綠色光之發光元件。藉此,使得作為用於液晶顯示器之背光之發光裝置可獲得較高之色再現性。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2007-158296號公報In general, a light-emitting device using a light-emitting element such as a light-emitting diode is widely used as a light source such as a backlight of a liquid crystal display, an LED light bulb, an LED fluorescent lamp, or a ceiling lamp. For example, the light-emitting device disclosed in Patent Document 1 includes a red phosphor, a light-emitting element that emits blue light, and a light-emitting element that emits green light. Thereby, high light reproducibility can be obtained as a light-emitting device for a backlight of a liquid crystal display. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-158296

[發明所欲解決之問題] 然而,於專利文獻1所揭示之發光裝置中,與具備綠色之螢光體之發光裝置相比,自發光元件出射之光之直進性較強,因此,有產生作為發光裝置之顏色不均之虞。 因此,本發明之目的在於提供一種抑制了顏色不均之發光裝置。 [解決問題之技術手段] 本發明之發光裝置係具有並排配置之至少3個發光元件、及包含螢光體之透光性構件者,且至少3個發光元件具有:2個外側發光元件,其等配置於外側;及內側發光元件,其配置於2個外側發光元件之內側且具有與2個外側發光元件之發光峰值波長不同之發光峰值波長;且螢光體具有較外側發光元件及內側發光元件之發光峰值波長長之發光峰值波長,且2個外側發光元件與內側發光元件串聯地連接。 [發明之效果] 根據本發明,可提供一種抑制了顏色不均之發光裝置。[Problems to be Solved by the Invention] However, in the light-emitting device disclosed in Patent Document 1, the light emitted from the light-emitting element is more straightforward than the light-emitting device having the green phosphor, and thus is generated. As the color of the light-emitting device is uneven. Accordingly, it is an object of the present invention to provide a light-emitting device that suppresses color unevenness. [Means for Solving the Problems] The light-emitting device of the present invention includes at least three light-emitting elements arranged side by side and a light-transmitting member including a phosphor, and at least three light-emitting elements have two outer light-emitting elements. And an inner light-emitting element disposed inside the two outer light-emitting elements and having an emission peak wavelength different from an emission peak wavelength of the two outer light-emitting elements; and the phosphor has an outer light-emitting element and an inner light-emitting element The emission peak wavelength of the element has a long emission wavelength, and the two outer light-emitting elements are connected in series to the inner light-emitting element. [Effects of the Invention] According to the present invention, it is possible to provide a light-emitting device that suppresses color unevenness.

以下基於圖式對本發明之實施形態詳細地進行說明。再者,於以下說明中,視需要使用表示特定之方向或位置之用語(例如,「上」、「下」、及包括該等用語之其他用語),但,該等用語之使用係為了使參照圖式之發明之理解較容易,並非藉由該等用語之意思限制本發明之技術範圍。又,複數個圖式中示出之相同符號之部分表示同一或同等之部分或構件。 進而以下所示之實施形態係例示用以將本發明之技術思想具體化之發光裝置者,並非將本發明限定於以下。又,實施形態中記載之構成零件之尺寸、材質、形狀、其相對配置等只要無特定之記載,則並非係將本發明之範圍僅限於此之宗旨,而係意圖例示者。各圖式所示之構件之大小或位置關係等有時為了使理解較容易等而進行誇張。再者,顏色名稱與色度座標之關係、光之波長範圍與單色光之顏色名稱之關係等係依據JIS Z8110。 本發明之發光裝置具有並排配置之至少3個發光元件、及包含螢光體之透光性構件。至少3個發光元件具備配置於外側之2個外側發光元件、及配置於2個外側發光元件之內側之內側發光元件。而且,2個外側發光元件與內側發光元件串聯地連接。 具有此種構成之本發明之發光裝置可實現各發光元件之出射光與由發光元件之出射光激發之螢光體之出射光之優異之混色性,且可抑制發光裝置之顏色不均。 以下,對本發明之實施形態之發光裝置之詳情進行說明。 1.實施形態1 圖1A係表示發光裝置100之模式性俯視圖,圖1B係表示圖1A之Ib-Ib線剖面之模式性剖視圖。於圖1A中,省略螢光體4之記載以便可容易地辨識配置於透光性構件3內之外側發光元件P、內側發光元件Q。 於發光裝置100中,於配置於樹脂封裝2之凹部之底面之第1簧片36a之上表面並排配置有2個外側發光元件P、及1個內側發光元件Q。而且,內側發光元件Q配置於2個外側發光元件P之內側。各發光元件間之間隔較佳為相同,但亦可不同。 於本說明書中,所謂「並排配置」係指至少3個發光元件呈線狀配置,換言之,係指至少鄰接之發光元件之側面彼此之一部分對面配置。又,所謂「外側發光元件」係指並排配置之複數個發光元件中之配置於端部側之發光元件。外側發光元件P可為一個端部側具有1個,亦可為具有2個以上。於一個端部側具有2個以上外側發光元件P之情形時,2個以上之外側發光元件P發出相同之顏色之光,更具體而言,於外側發光元件P為藍色發光元件之情形時,使用各自之發光峰值波長為430 nm以上且未達490 nm之範圍之發光元件。於一個端部側配置2個以上之外側發光元件P之情形時,例如,2個以上之外側發光元件P可沿著並排配置之複數個發光元件之排列方向L配置,亦可相對於排列方向L垂直地配置。又,所謂「內側發光元件」係指被外側發光元件P夾持而配置之發光元件。內側發光元件Q只要由至少2個外側發光元件P夾持即可,不必為複數個發光元件之中心或配置於凹部之底面之中央。內側發光元件Q可為1個,亦可為2個以上。於內側發光元件Q為2個以上之情形時,2個以上之內側發光元件Q發出相同顏色之光,更具體而言,於內側發光元件Q為綠色發光元件之情形時,使用各自之發光峰值波長為490 nm以上且570 nm以下之範圍之發光元件。於具有2個以上內側發光元件Q之情形時,內側發光元件Q例如可沿著並排配置之複數個發光元件之排列方向L配置,亦可相對於排列方向L垂直地配置。 於圖1A及圖1B所示之發光裝置100中,作為外側發光元件P使用藍色發光元件(第1發光元件10b),作為內側發光元件Q使用綠色發光元件(第2發光元件20g)。 發光裝置100根據所欲獲得之光量等可具有3個以上之外側發光元件P(第1發光元件10b),又,可具有2個以上之內側發光元件Q(第2發光元件20g)。於圖1A所示之實施形態中,自左起依序並列配置有第1發光元件10b、第2發光元件20g、第1發光元件10b。又,於圖1A所示之實施形態中,使用藍色發光元件作為外側發光元件P,使用綠色發光元件作為內側發光元件Q,但並不限定於此,亦可使用綠色發光元件作為外側發光元件P,使用藍色發光元件作為內側發光元件Q。又,根據所欲獲得之發光特性,可為第1發光元件10b之個數較第2發光元件20g之個數多,可為第2發光元件20g之個數較第1發光元件10b之個數多,又,亦可為第1發光元件10b與第2發光元件20g之個數相同。於圖2之發光裝置100A中,具備2個第1發光元件10b及2個第2發光元件20g,於2個第1發光元件10b之內側配置有2個第2發光元件20g。藉由如此調整發光元件之個數,可設為具有任意之色調或光量之發光裝置。 第1發光元件10b之發光之峰值波長處於430 nm以上且未達490 nm之範圍(藍色區域之波長範圍),其中,較佳為處於440 nm以上且470 nm以下之範圍。又,第2發光元件20g之發光之峰值波長處於490 nm以上且570 nm以下之範圍(綠色區域之波長範圍),其中較佳為處於520 nm以上且550 nm以下之範圍。尤其是,第2發光元件20g較佳為使用半值寬為40 nm以下之發光元件,更佳為使用半值寬為30 nm以下之發光元件。藉此,與使用綠色螢光體獲得綠色光之情形相比,綠色光可容易地具有尖峰值。其結果,具備發光裝置100之液晶顯示裝置可達成較高之色再現性。 第1發光元件10b及第2發光元件20g分別例如與如安裝基板之配線層之外部之電路電性連接,且藉由經由該外部電路供給之電力發光。於圖1A所示之發光裝置100中,配置於一個端部側之第1發光元件10b之正電極及負電極之一者經由導線6而連接於第1簧片36a,配置於另一端部側之第1發光元件10b之正電極及負電極之一者經由導線6而與第2簧片36b連接。而且,配置於內側之第2發光元件20g經由導線6而與相鄰配置之第1發光元件10b電性連接。於圖1A所示之發光裝置100中,配置於一端部側之第1發光元件10b、配置於內側之第2發光元件20g、配置於另一端部側之第1發光元件10b依序串聯地連接。 再者,於發光裝置100中,作為支持體7使用樹脂封裝2。於本說明書中,所謂支持體係指用於配置第1發光元件10b及第2發光元件20g之構件,例如,包含用以對發光元件供給電力之導電構件之樹脂封裝或陶瓷基板等。該導電構件配置於支持體7之表面,例如,使用簧片或配線層等。 於圖1A及圖1B所示之發光裝置100中,於樹脂封裝2之凹部內配置有透光性構件3。透光性構件3例如亦可為樹脂或玻璃等。透光性構件3包含具有較外側發光元件及內側發光元件之發光峰值波長長之發光峰值波長之螢光體4。於圖1B所示之發光裝置100中,作為螢光體4使用發光峰值波長處於580 nm以上且680 nm以下之範圍之螢光體4。螢光體4吸收第1發光元件10b發出之藍色光之一部分而發出紅色光。即,螢光體4將藍色光波長轉換為具有不同之波長之紅色光。 較佳為幾乎不存在螢光體4吸收第2發光元件20g之綠色光而發出紅色光之情況。即,較佳為螢光體4實質上未將綠色光轉換為紅色光。而且,較佳為螢光體4相對於綠色光之反射率於綠色光之波長之範圍內平均為70%以上。藉由將螢光體4設為對綠色光之反射率較高之、即吸收綠色光較少之螢光體、即對綠色光進行波長轉換較少之螢光體,可使發光裝置之設計較容易。 若使用綠色光之吸收較大之紅色螢光體,則不僅第1發光元件10b,對於第2發光元件20g亦必須考慮螢光體4之波長轉換而研究發光裝置之輸出平衡。另一方面,若使用幾乎不對綠色光進行波長轉換之螢光體4,則僅考慮第1發光元件10b發出之藍色光之波長轉換即可設計發光裝置之輸出平衡。 作為此種較佳之螢光體4可列舉以下紅色螢光體。螢光體4為該等之至少1種以上。 第1種類為其組成由以下之通式(I)所表示之紅色螢光體。 A2 MF6 :Mn4+ (I) 其中,上述通式(I)中,A係選自由K、Li、Na、Rb、Cs及NH4+ 所組成之群中之至少1種元素,M係選自由第4族元素及第14族元素所組成之群中之至少1種元素。 第4族元素為鈦(Ti)、鋯(Zr)及鉿(Hf)。第14族元素為矽(Si)、鍺(Ge)、錫(Sn)及鉛(Pb)。 作為第1種類之紅色螢光體之具體例可列舉K2 SiF6 :Mn4+ 、K2 (Si,Ge)F6 :Mn4+ 、K2 TiF6 :Mn4+ 。 第2種類為其組成由3.5MgO・0.5MgF2 ・GeO2 :Mn4+ 所表示之紅色螢光體或其組成由以下通式(II)表示之紅色螢光體。 (x-a)MgO・a(Ma)O・b/2(Mb)2 O3 ・yMgF2 ・c(Mc)X2 ・(1-d-e)GeO2 ・d(Md)O2 ・e(Me)2 O3 :Mn4+ (II) 其中,上述通式(II)中,Ma為選自Ca、Sr、Ba、Zn之至少1種,Mb為選自Sc、La、Lu之至少一種,Mc為選自Ca、Sr、Ba、Zn之至少1種,X為選自F、Cl之至少1種,Md為選自Ti、Sn、Zr之至少一種,Me為選自B、Al、Ga、In之至少一種。又,對於x、y、a、b、c、d、e,為2≦x≦4、0<y≦2、0≦a≦1.5、0≦b<1、0≦c≦2、0≦d≦0.5、0≦e<1。 此種透光性構件3覆蓋第1發光元件10b之至少一部分及第2發光元件20g之至少一部分。又,透光性構件3以其至少一部分位於第1發光元件10b及第2發光元件20g之間之方式配置。較佳為透光性構件3跨於第1發光元件10b、第2發光元件20g之上而與其等接觸地配置。如圖1A及圖1B所示,第1發光元件10b之安裝於第1簧片36a或第2簧片36b之底面以外之面(即,上表面及側面)整體實質上可由透光性構件3覆蓋。同樣地,第2發光元件20g之與第1簧片36a或第2簧片36b接觸之底面以外之面(即,上表面及側面)整體實質上可由透光性構件3覆蓋。 藉由透光性構件3覆蓋第1發光元件10b,自第1發光元件10b發出之藍色光之一部分由透光性構件3中之螢光體4吸收,螢光體4發出紅色光。而且,未經螢光體4波長轉換之藍色光及螢光體4發出之紅色光通過透光性構件3且自透光性構件3之上表面(發光裝置100之光提取面)向外側出射。另一方面,自第2發光元件20g發出之綠色光之一部分由螢光體4波長轉換為紅色光,(較佳為未由螢光體4轉換為紅色光(或幾乎未轉換))而通過透光性構件3自透光性構件3之上表面向外側出射。而且,藍色光、紅色光、綠色光於透光性構件3之外側混色,例如,可獲得如白色光之所需顏色之光。 進而,自第2發光元件20g發出之綠色光之一部分較佳為波長未改變而由螢光體4散射。於此情形時,自發光裝置100出射之綠色光之強度分佈變得均一,從而可抑制顏色不均之產生。進而,例如,將透光性構件3設為密封樹脂,將覆蓋第1發光元件10b之樹脂及覆蓋第2發光元件20g之樹脂設為相同之透光性構件3就生產性之觀點而言亦較適當。 以下,對構成發光裝置100之要素之詳情進行說明。 ・發光元件 以下,例示第1發光元件10b與第2發光元件20g之較佳之配置。 如圖1A所示,可使並排配置之2個第1發光元件10b及第2發光元件20g之排列方向L與支持體7之長度方向(圖1A、圖1B之左右方向)平行。又,可使2個第1發光元件10b及第2發光元件20g之排列方向L與支持體7之發光元件載置面之長度方向平行。此處,所謂支持體7之發光元件載置面係於支持體7中載置有發光元件之面。於圖1A及圖1B中,發光元件載置面係指於凹部之底面露出之第1簧片36a之整個面。藉由設為該等配置而遍及發光裝置100整體更均一地使來自發光元件之發光分散。 於發光裝置100中,第2發光元件20g夾持於2個第1發光元件10b而配置。藉由設為此種配置,可使自第2發光元件20g出射之光與自配置於第2發光元件20g之外側之2個第1發光元件10b出射之光容易混色,因此,其結果,可進一步抑制顏色不均之產生。第1發光元件10b及第2發光元件20g之對向之側面彼此之距離較佳為10 μm~300 μm,更佳為50 μm~150 μm。藉此,可將第1發光元件10b與第2發光元件20g靠近配置,因此,可使發光裝置之混色性進一步提昇。 於發光裝置100中,配置於左側之第1發光元件10b與第2發光元件20g之發光元件間之距離和配置於右側之第1發光元件10b與第2發光元件20g之發光元件間之距離設定為大致相等。於第1發光元件10b及第2發光元件20g之各者設置複數個之情形時,較佳為各發光元件等間隔地配置。進而,較佳為複數個發光元件相對於對於排列方向L垂直之中心線C線對稱地配置。於圖1A中所示之發光裝置100中,2個第1發光元件10b及第2發光元件20g相對於中心線C線對稱地配置。藉由將包含第1發光元件10b及第2發光元件20g之複數個發光元件相對於中心線C線對稱地配置,各發光元件間之距離以變為相等之方式配置,且複數個發光元件之俯視下之發光面之面積左右相等。藉由設為該等配置,可抑制發光裝置之顏色不均之產生。 再者,於根據用途而具有發光裝置之理想之配光之情形時,各發光元件間之距離亦可不同。 又,包含2個第1發光元件10b及第2發光元件20g之至少3個發光元件並排配置於1行,可將此種行設置複數行。即,可為包含2個第1發光元件10b及第2發光元件20g之至少3個發光元件整齊排列於1條直線上,另一包含2個第1發光元件10b及第2發光元件20g之至少3個發光元件整齊排列於另一條直線上。 以上所述之較佳之配置可相互組合。 第1發光元件10b及第2發光元件20g可為藉由施加電壓而自發光之例如如發光二極體(LED)般之半導體元件。作為各發光元件中使用之半導體可使用氮化物系半導體(InX AlY Ga1-X-Y N、0≦X、0≦Y、X+Y≦1)等。即,第1發光元件10b及第2發光元件20g可為氮化物半導體元件。第1發光元件10b及第2發光元件20g之平面形狀可為正方形亦可為長方形,或者亦可將其等組合而配置複數個。可配合支持體7之形狀或大小適當選擇發光元件之個數或形狀。 作為發光元件之形狀之一例,如圖3A及圖3B所示,第1發光元件10b及第2發光元件20g之平面形狀亦可為三角形或六邊形。於圖3A所示之發光裝置100B中,第1發光元件10b之與第2發光元件20g對向之側面和第2發光元件20g之與第1發光元件10b對向之側面以成為平行之方式配置。換言之,第1發光元件10b及第2發光元件20g以由b1、b2、g1及g2形成之第1發光元件10b與第2發光元件20g之間之區域成為大致平行四邊形之方式配置。又,於圖3B所示之發光裝置100C中,亦為第1發光元件10b之與第2發光元件20g對向之側面和第2發光元件20g之與第1發光元件10b對向之側面以成為平行之方式配置。藉由使用此種發光元件,可增大發光元件占支持體7之發光元件載置面之比率,因此,可設為光提取良好之發光裝置。 第1發光元件10b之光輸出與第2發光元件20g之光輸出亦可相同。又,根據色再現性等所欲獲得之特性,第1發光元件10b之光輸出亦可與第2發光元件20g之光輸出不同。作為獲得優異之色再現性之1個實施形態,可將第2發光元件20g之光輸出相對於第1發光元件10b之光輸出之比設為0.3以上且0.7以下。又,可將所使用之所有第2發光元件20g之光輸出之總和相對於所使用之所有第1發光元件10b之光輸出之總和之比設為0.2以上且0.6以下。 本說明書中之所謂「光輸出」係JIS Z 8113之放射束。又,發光元件之光輸出之比可利用分光光度計測定發光光譜,並根據藍色發光元件與綠色光元件之發光光譜之積分值之比算出。發光元件之光輸出係根據發光元件之發光峰值波長、發光元件之平面面積、或發光元件所具有之半導體積層體之種類等決定。 又,於圖1B所示之發光裝置100中,第2發光元件20g之上表面以較第1發光元件10b之上表面成為上側之方式配置。即,第2發光元件20g之上表面較第1發光元件10b之上表面更配置於發光裝置100之光提取面(透光性構件3之上表面)之附近。第1發光元件10b之上表面與第2發光元件20g之高低差例如為50 μm~150 μm,較佳為100 μm~120 μm。藉由進行此種配置,例如,即便於第2發光元件20g之光輸出較第1發光元件10b之光輸出低某種程度之情形時,亦可獲得優異之色再現性。再者,並不限定於此,亦能以第2發光元件20g之上表面較第1發光元件10b之上表面成為下側之方式配置,第1發光元件10b之上表面與第2發光元件20g之上表面亦可處於相同高度之位置。 ・透光性構件 透光性構件3由樹脂或玻璃材料等任意之材料形成,且包含螢光體4。於利用樹脂形成透光性構件3之情形時,可使用任意之樹脂。又,可使透光性構件3含有TiO2 或SiO2 等擴散材。藉此,可使第1發光元件10b、第2發光元件20g及螢光體4發出之光充分地擴散。 作為此種較佳之樹脂,可例示矽酮系樹脂、環氧系樹脂等。將此種樹脂設為熔融狀態並使螢光體4混合及分散之後,將該螢光體4分散之樹脂填充於樹脂封裝2之凹部,使樹脂硬化,藉此可形成透光性構件3。 ・支持體 作為支持體7之一形態之樹脂封裝2可由任意之樹脂形成。作為樹脂可使用熱固性樹脂、熱塑性樹脂等,作為較佳之樹脂,可例示尼龍系樹脂、環氧系樹脂及矽酮系樹脂、不飽和聚酯等聚酯系樹脂。 亦可視需要於樹脂封裝2之凹部之表面例如配置如鍍銀(Ag)等金屬之反射材料或於凹部之表面形成反射率較高之構件。藉此,可提高凹部之表面之光之反射率,且可藉由將到達至凹部之表面之光更多地反射至出射方向而進一步提高發光裝置100之效率。 亦可代替具有凹部之樹脂封裝而設為於例如包含陶瓷、樹脂、介電體、玻璃或其等之複合材料之絕緣基板之表面配置有連接端子之支持體。亦可於該支持體配置第1發光元件10b及第2發光元件20g,例如藉由灌注以被覆第1發光元件10b及第2發光元件20g之方式形成包含螢光體4之透光性構件3。 又,作為不使用支持體之發光裝置100之變化例,可例示如圖4A及圖4B所示之發光裝置100D。於圖4A及圖4B所示之發光裝置100D中,具備2個第1發光元件10b及第2發光元件20g、設置於各發光元件之側面側之第1透光性構件12、及覆蓋第1透光性構件12之外表面之被覆構件13。而且,發光裝置100D可具備於作為發光面發揮功能之上表面側含有螢光體4之第2透光性構件15或第3透光性構件16。較佳為第1透光性構件12、第2透光性構件15、及第3透光性構件16使用光之透過率較高之構件,第1透光性構件12及第3透光性構件16為了使來自發光元件之光高效率地透過而不具備光擴散材等。 圖4B中所示之第1發光元件10b包含透光性基板27、半導體積層體28、及一對電極251、252,將透光性基板27配置於第1發光元件10b之上表面側,將半導體積層體28配置於第1發光元件10b之下表面側。而且,第1發光元件10b之一對電極251、252自被覆構件13露出且露出至發光裝置100D之下表面。第2發光元件20g亦同樣。 被覆構件13覆蓋設置於各發光元件之側面之第1透光性構件12之外表面、及各發光元件之側面之露出部分。被覆構件13係由熱膨脹率之大小關係中與第1透光性構件12及各發光元件滿足特定之關係之材料形成。具體而言,以於對第1透光性構件12與各發光元件之熱膨脹率差(將其稱為「第1熱膨脹率差ΔT30」)和被覆構件13與各發光元件之熱膨脹率差(將其稱為「第2熱膨脹率差ΔT40」)進行比較時成為ΔT40<ΔT30之方式選擇被覆構件13之材料。藉此,可抑制第1透光性構件12自各發光元件剝離。 作為可用於被覆構件13之樹脂材料特佳為矽酮樹脂、矽酮改性樹脂、環氧樹脂、酚樹脂等熱固性之透光性樹脂。又,被覆構件13可由光反射性樹脂形成。所謂光反射性樹脂係指相對於來自發光元件之光之反射率為70%以上之樹脂材料。到達至被覆構件13之光被反射而朝向發光裝置100D之上表面側(發光面側),藉此,可提高發光裝置100D之光取出效率。 第1透光性構件12覆蓋各發光元件之側面,將自其側面出射之光導光至發光裝置100D之上表面方向。亦即,第1透光性構件12係用於在到達至各發光元件之側面之光於該側面被反射而於發光元件內衰減之前將該光通過第1透光性構件12提取至發光元件之外側之構件。第1透光性構件12可使用於發光裝置100中例示之構件,尤其較佳為矽酮樹脂、矽酮改性樹脂、環氧樹脂、酚樹脂等熱固性之透光性樹脂。第2透光性構件15及第3透光性構件16亦可使用第1透光性構件12中例示之構件。第1透光性構件12由於與發光元件之側面接觸,故而容易受到於點亮時於發光元件中產生之熱之影響。熱固性樹脂由於耐熱性優異,故而適於第1透光性構件12。再者,較佳為第1透光性構件12之光之透過率較高。因此,通常較佳為第1透光性構件12中未添加將光反射、吸收或散射之添加物。然而,亦存在為了賦予較理想之特性較佳為於第1透光性構件12添加添加物之情況。例如,為了調整第1透光性構件12之折射率,或為了調整硬化前之第1透光性構件12之黏度,亦可添加各種填料。 於圖4A及圖4B所示之發光裝置100D中,於第1發光元件10b之作為發光面發揮功能之上表面側配置有含有螢光體4之第2透光性構件15,於第2發光元件20g之作為發光面發揮功能之上表面側配置有第3透光性構件16。較佳為配置於第2發光元件20g之上表面側之第3透光性構件16未添加將自第2發光元件20g發出之光反射、吸收或散射之添加物。藉由設為此種配置,自第1發光元件10b、第2發光元件20g、及螢光體4發出之光被混色,例如,可獲得如白色光之所需之顏色之光。又,如圖4B所示,第1發光元件10b與第2發光元件20g由利用濺鍍等形成之金屬膜14串聯地連接。藉由設置此種金屬膜14,可將來自發光元件之熱高效率地釋出至外部。 發光裝置100可藉由以下製造方法製造。 於模具內配置第1簧片36a及第2簧片36b之後,將樹脂填充於模具內,一體地形成樹脂部、第1簧片36a、及第2簧片36b,而獲得樹脂封裝2。於樹脂封裝2之凹部之底面露出之第1簧片36a配置2個第1發光元件10b及第2發光元件20g。其後,如圖1A所示,利用導線6,將第1簧片36a與配置於左側之第1發光元件10b、第1發光元件10b與第2發光元件20g、及第2發光元件20g與配置於右側之第1發光元件10b、及第1發光元件10b與第2簧片36b分別連接。 其次,將包含螢光體4之熔融狀態之樹脂以至少一部分與第1發光元件10b及第2發光元件20g接觸之方式向樹脂封裝2之凹部內填充,使螢光體4沈澱之後,使樹脂硬化,藉此形成透光性構件3。 再者,以上所說明之發光裝置100係將發光裝置之上表面設為光提取面將下表面設為安裝面之稱為頂視型之發光裝置。然而,並不限定於此,本發明之發光裝置亦包含將與光提取面鄰接之面設為安裝面且於與安裝面平行之方向發出光之被稱為所謂側視型之發光裝置。 2.實施形態2 圖5A及圖5B係表示實施形態2之背光200之模式性俯視圖。背光200如以下所說明般包含發光裝置100。然而,以下之說明中所使用之發光裝置100亦可置換為發光裝置100A至100D。 背光200具有殼體21、配置於殼體21內之導光板22、及配置於殼體21內並且朝向導光板22發出光之發光裝置100。背光200將來自發光裝置100之光經由導光板22而例如將光照射至液晶面板等所需之裝置。 殼體21能以其內表面反射光之方式形成。例如,可將內表面設為白色。 將導光板22之4個側面之至少1個用作入射面(入光部)。於圖5A所示之實施形態中,將位於下方之側面設為入射面。發光裝置100以其光提取面與入射面對向之方式配置。較佳為發光裝置100沿著入射面配置有複數個。自發光裝置100發出之光自入射面進入至導光板22之內部。於使用複數個發光裝置100之情形時,自不同之發光裝置100發出之光於導光板22之內部被混合。 導光板22之上表面成為出射面。藉由於出射面上例如配置液晶面板等所需之裝置,自導光板22發出之光朝向該等裝置前進。 可使發光裝置100之光提取面與導光板22之入光部(入射面)之長度方向一致而配置。可藉由將發光裝置100之光提取面之長度方向與導光板之入光面之長度方向設為平行而以更高之效率將發光裝置100之光導入至導光板22。 圖5B係表示實施形態2之背光200之變化例之模式性剖視圖。背光200亦可為如圖5B所示般於導光板22之正下方配置有複數個發光裝置100之所謂正下型之背光裝置。 [產業上之可利用性] 本發明之發光裝置例如可用作液晶顯示器之背光。Embodiments of the present invention will be described in detail below based on the drawings. Furthermore, in the following description, terms indicating a specific direction or position (for example, "upper", "lower", and other terms including the terms) are used as needed, but the terms are used in order to make The understanding of the invention with reference to the drawings is relatively easy, and the technical scope of the present invention is not limited by the meaning of the terms. In addition, the parts of the same symbols in the plural figures represent the same or equivalent parts or components. Further, the embodiment shown below exemplifies a light-emitting device for embodying the technical idea of the present invention, and the present invention is not limited to the following. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the invention, and are intended to be illustrative. The size, positional relationship, and the like of the members shown in the drawings may be exaggerated in order to make the understanding easier. Furthermore, the relationship between the color name and the chromaticity coordinate, the relationship between the wavelength range of the light and the color name of the monochromatic light is based on JIS Z8110. The light-emitting device of the present invention has at least three light-emitting elements arranged side by side and a light-transmitting member including a phosphor. At least three of the light-emitting elements include two outer light-emitting elements disposed on the outer side and inner light-emitting elements disposed on the inner side of the two outer light-emitting elements. Further, the two outer light emitting elements are connected in series to the inner light emitting element. The light-emitting device of the present invention having such a configuration can achieve excellent color mixture of the light emitted from each of the light-emitting elements and the light emitted from the light-emitting body excited by the light-emitting elements, and can suppress color unevenness of the light-emitting device. Hereinafter, details of the light-emitting device of the embodiment of the present invention will be described. 1. Embodiment 1 FIG. 1A is a schematic plan view showing a light-emitting device 100, and FIG. 1B is a schematic cross-sectional view showing a cross section taken along line Ib-Ib of FIG. 1A. In FIG. 1A, the description of the phosphor 4 is omitted so that the outer side light emitting element P and the inner side light emitting element Q disposed in the light transmissive member 3 can be easily recognized. In the light-emitting device 100, two outer light-emitting elements P and one inner light-emitting element Q are arranged side by side on the upper surface of the first reed 36a disposed on the bottom surface of the concave portion of the resin package 2. Further, the inner light-emitting elements Q are disposed inside the two outer light-emitting elements P. The spacing between the light-emitting elements is preferably the same, but may be different. In the present specification, the term "side-by-side arrangement" means that at least three light-emitting elements are arranged in a line, in other words, at least one of the side faces of the adjacent light-emitting elements is disposed opposite to each other. In addition, the "outer light-emitting element" refers to a light-emitting element disposed on the end side among a plurality of light-emitting elements arranged side by side. The outer light-emitting element P may have one end side or two or more. When two or more outer light-emitting elements P are provided on one end side, two or more outer side light-emitting elements P emit light of the same color, and more specifically, when the outer light-emitting element P is a blue light-emitting element. A light-emitting element having a respective emission peak wavelength of 430 nm or more and less than 490 nm is used. When two or more external light-emitting elements P are disposed on one end side, for example, two or more external light-emitting elements P may be arranged along the arrangement direction L of a plurality of light-emitting elements arranged side by side, or may be arranged with respect to the arrangement direction. L is configured vertically. In addition, the "inside light-emitting element" means a light-emitting element that is placed by being sandwiched by the outer light-emitting element P. The inner light-emitting element Q may be sandwiched by at least two outer light-emitting elements P, and is not necessarily centered on a plurality of light-emitting elements or disposed at the center of the bottom surface of the concave portion. The number of the inner light-emitting elements Q may be one or two or more. When the number of the inner light-emitting elements Q is two or more, two or more of the inner light-emitting elements Q emit light of the same color, and more specifically, when the inner light-emitting elements Q are green light-emitting elements, the respective light-emitting peaks are used. A light-emitting element having a wavelength of 490 nm or more and 570 nm or less. In the case where there are two or more inner light-emitting elements Q, the inner light-emitting elements Q may be arranged, for example, along the arrangement direction L of the plurality of light-emitting elements arranged side by side, or may be arranged perpendicular to the arrangement direction L. In the light-emitting device 100 shown in FIG. 1A and FIG. 1B, a blue light-emitting element (first light-emitting element 10b) is used as the outer light-emitting element P, and a green light-emitting element (second light-emitting element 20g) is used as the inner light-emitting element Q. The light-emitting device 100 may have three or more external light-emitting elements P (first light-emitting elements 10b) depending on the amount of light to be obtained, and may have two or more inner light-emitting elements Q (second light-emitting elements 20g). In the embodiment shown in FIG. 1A, the first light-emitting element 10b, the second light-emitting element 20g, and the first light-emitting element 10b are arranged in parallel from the left. Further, in the embodiment shown in FIG. 1A, the blue light-emitting element is used as the outer light-emitting element P, and the green light-emitting element is used as the inner light-emitting element Q. However, the present invention is not limited thereto, and the green light-emitting element may be used as the outer light-emitting element. P, a blue light-emitting element is used as the inner light-emitting element Q. Further, depending on the desired light-emitting characteristics, the number of the first light-emitting elements 10b may be larger than the number of the second light-emitting elements 20g, and the number of the second light-emitting elements 20g may be larger than the number of the first light-emitting elements 10b. Further, the number of the first light-emitting elements 10b and the second light-emitting elements 20g may be the same. In the light-emitting device 100A of FIG. 2, two first light-emitting elements 10b and two second light-emitting elements 20g are provided, and two second light-emitting elements 20g are disposed inside the two first light-emitting elements 10b. By adjusting the number of light-emitting elements in this manner, it is possible to provide a light-emitting device having an arbitrary color tone or light amount. The peak wavelength of the light emission of the first light-emitting element 10b is in the range of 430 nm or more and less than 490 nm (wavelength range of the blue region), and preferably in the range of 440 nm or more and 470 nm or less. Further, the peak wavelength of the light emission of the second light-emitting element 20g is in the range of 490 nm or more and 570 nm or less (wavelength range of the green region), and preferably in the range of 520 nm or more and 550 nm or less. In particular, the second light-emitting element 20g preferably uses a light-emitting element having a half-value width of 40 nm or less, and more preferably a light-emitting element having a half-value width of 30 nm or less. Thereby, the green light can easily have a sharp peak as compared with the case where green light is used to obtain green light. As a result, the liquid crystal display device including the light-emitting device 100 can achieve high color reproducibility. Each of the first light-emitting element 10b and the second light-emitting element 20g is electrically connected to, for example, a circuit outside the wiring layer of the mounting substrate, and is powered by electric power supplied through the external circuit. In the light-emitting device 100 shown in FIG. 1A, one of the positive electrode and the negative electrode of the first light-emitting element 10b disposed on one end side is connected to the first reed 36a via the wire 6, and is disposed on the other end side. One of the positive electrode and the negative electrode of the first light-emitting element 10b is connected to the second reed 36b via the wire 6. Further, the second light-emitting element 20g disposed on the inner side is electrically connected to the adjacent first light-emitting element 10b via the wire 6. In the light-emitting device 100 shown in FIG. 1A, the first light-emitting element 10b disposed on one end side, the second light-emitting element 20g disposed on the inner side, and the first light-emitting element 10b disposed on the other end side are sequentially connected in series. . Further, in the light-emitting device 100, the resin package 2 is used as the support 7. In the present specification, the support system refers to a member for arranging the first light-emitting element 10b and the second light-emitting element 20g, and for example, a resin package or a ceramic substrate including a conductive member for supplying electric power to the light-emitting element. The conductive member is disposed on the surface of the support 7, and for example, a reed or a wiring layer or the like is used. In the light-emitting device 100 shown in FIGS. 1A and 1B, the light-transmitting member 3 is disposed in the concave portion of the resin package 2. The light transmissive member 3 may be, for example, a resin or glass. The light transmissive member 3 includes a phosphor 4 having an emission peak wavelength which is longer than an emission peak wavelength of the outer side light emitting element and the inner side light emitting element. In the light-emitting device 100 shown in FIG. 1B, as the phosphor 4, the phosphor 4 having an emission peak wavelength of 580 nm or more and 680 nm or less is used. The phosphor 4 absorbs a part of the blue light emitted from the first light-emitting element 10b to emit red light. That is, the phosphor 4 converts the wavelength of the blue light into red light having a different wavelength. It is preferable that the phosphor 4 absorbs the green light of the second light-emitting element 20g and emits red light. That is, it is preferable that the phosphor 4 does not substantially convert green light into red light. Further, it is preferable that the reflectance of the phosphor 4 with respect to the green light is 70% or more in the range of the wavelength of the green light. The illuminating device can be designed by using the phosphor 4 as a phosphor having a high reflectance of green light, that is, a phosphor that absorbs less green light, that is, a phosphor having a small wavelength conversion of green light. It's easier. When a red phosphor having a large absorption of green light is used, not only the first light-emitting element 10b but also the wavelength conversion of the phosphor 4 must be considered for the second light-emitting element 20g to investigate the output balance of the light-emitting device. On the other hand, when the phosphor 4 which does not wavelength-convert the green light is used, the output balance of the light-emitting device can be designed only by considering the wavelength conversion of the blue light emitted from the first light-emitting element 10b. As such a preferable phosphor 4, the following red phosphors are mentioned. The phosphor 4 is at least one of these. The first type is a red phosphor whose composition is represented by the following general formula (I). A 2 MF 6 : Mn 4+ (I) wherein, in the above formula (I), A is at least one element selected from the group consisting of K, Li, Na, Rb, Cs and NH 4+ , M It is selected from at least one element selected from the group consisting of a Group 4 element and a Group 14 element. Group 4 elements are titanium (Ti), zirconium (Zr) and hafnium (Hf). Group 14 elements are germanium (Si), germanium (Ge), tin (Sn), and lead (Pb). Specific examples of the red phosphor of the first type include K 2 SiF 6 :Mn 4+ , K 2 (Si,Ge)F 6 :Mn 4+ , and K 2 TiF 6 :Mn 4+ . The second type is a red phosphor whose composition is represented by 3.5 MgO·0.5 MgF 2 ·GeO 2 :Mn 4+ or a red phosphor represented by the following general formula (II). (x-a)MgO・a(Ma)O・b/2(Mb) 2 O 3・yMgF 2 ·c(Mc)X 2・(1-d-e)GeO 2・d(Md)O 2・e(Me) 2 O 3 : Mn 4+ (II) In the above formula (II), Ma is at least one selected from the group consisting of Ca, Sr, Ba, and Zn, and Mb is selected from the group consisting of Sc, La, and Lu. At least one of Mc is at least one selected from the group consisting of Ca, Sr, Ba, and Zn, X is at least one selected from the group consisting of F and Cl, and Md is at least one selected from the group consisting of Ti, Sn, and Zr, and Me is selected from B, At least one of Al, Ga, and In. Further, for x, y, a, b, c, d, and e, it is 2≦x≦4, 0<y≦2, 0≦a≦1.5, 0≦b<1, 0≦c≦2, 0≦ d≦0.5, 0≦e<1. The light transmissive member 3 covers at least a part of the first light emitting element 10b and at least a part of the second light emitting element 20g. Further, the light transmissive member 3 is disposed such that at least a part thereof is located between the first light emitting element 10b and the second light emitting element 20g. It is preferable that the light-transmitting member 3 is placed over the first light-emitting element 10b and the second light-emitting element 20g so as to be in contact with each other. As shown in FIG. 1A and FIG. 1B, the entire surface of the first light-emitting element 10b attached to the bottom surface of the first reed 36a or the second reed 36b (that is, the upper surface and the side surface) may be substantially entirely made of the light transmissive member 3. cover. Similarly, the entire surface (ie, the upper surface and the side surface) of the second light-emitting element 20g that is in contact with the bottom surface of the first reed 36a or the second reed 36b can be substantially covered by the light-transmitting member 3. When the first light-emitting element 10b is covered by the light-transmitting member 3, part of the blue light emitted from the first light-emitting element 10b is absorbed by the phosphor 4 in the light-transmitting member 3, and the phosphor 4 emits red light. Further, the blue light which is not converted by the wavelength of the phosphor 4 and the red light emitted from the phosphor 4 pass through the light transmissive member 3 and are emitted to the outside from the upper surface of the light transmissive member 3 (light extraction surface of the light-emitting device 100). . On the other hand, a part of the green light emitted from the second light-emitting element 20g is converted into a red light by the phosphor 4 (preferably not converted into a red light (or almost unconverted) by the phosphor 4). The light transmissive member 3 is emitted to the outside from the upper surface of the light transmissive member 3. Further, blue light, red light, and green light are mixed on the outer side of the light transmissive member 3, for example, light of a desired color such as white light can be obtained. Further, a part of the green light emitted from the second light-emitting element 20g is preferably scattered by the phosphor 4 without changing the wavelength. In this case, the intensity distribution of the green light emitted from the light-emitting device 100 becomes uniform, so that generation of color unevenness can be suppressed. Further, for example, the translucent member 3 is made of a sealing resin, and the resin covering the first light-emitting element 10b and the resin covering the second light-emitting element 20g are made of the same translucent member 3, and More appropriate. Hereinafter, details of the elements constituting the light-emitting device 100 will be described.・Light Emitting Element Hereinafter, a preferred arrangement of the first light emitting element 10b and the second light emitting element 20g will be exemplified. As shown in FIG. 1A, the arrangement direction L of the two first light-emitting elements 10b and the second light-emitting elements 20g arranged side by side is parallel to the longitudinal direction of the support 7 (the horizontal direction in FIGS. 1A and 1B). Moreover, the arrangement direction L of the two first light-emitting elements 10b and the second light-emitting elements 20g can be made parallel to the longitudinal direction of the light-emitting element mounting surface of the support 7. Here, the light-emitting element mounting surface of the support 7 is a surface on which the light-emitting element is placed on the support 7. In FIGS. 1A and 1B, the light-emitting element mounting surface refers to the entire surface of the first reed 36a exposed on the bottom surface of the concave portion. By the arrangement, the light emission from the light-emitting elements is more uniformly distributed throughout the entire light-emitting device 100. In the light-emitting device 100, the second light-emitting element 20g is placed between the two first light-emitting elements 10b. With such an arrangement, the light emitted from the second light-emitting element 20g and the light emitted from the two first light-emitting elements 10b disposed on the outer side of the second light-emitting element 20g can be easily mixed, and as a result, Further suppressing the occurrence of color unevenness. The distance between the opposite side faces of the first light-emitting element 10b and the second light-emitting element 20g is preferably 10 μm to 300 μm, and more preferably 50 μm to 150 μm. Thereby, since the first light-emitting element 10b and the second light-emitting element 20g can be arranged close to each other, the color mixture of the light-emitting device can be further improved. In the light-emitting device 100, the distance between the first light-emitting element 10b disposed on the left side and the light-emitting element of the second light-emitting element 20g, and the distance between the light-emitting elements of the first light-emitting element 10b and the second light-emitting element 20g disposed on the right side are set. To be roughly equal. When a plurality of the first light-emitting elements 10b and the second light-emitting elements 20g are provided in plurality, it is preferable that the respective light-emitting elements are arranged at equal intervals. Further, it is preferable that a plurality of light-emitting elements are arranged in line symmetry with respect to a center line C perpendicular to the arrangement direction L. In the light-emitting device 100 shown in FIG. 1A, the two first light-emitting elements 10b and the second light-emitting elements 20g are arranged in line symmetry with respect to the center line C. By arranging a plurality of light-emitting elements including the first light-emitting element 10b and the second light-emitting element 20g symmetrically with respect to the center line C, the distance between the light-emitting elements is set to be equal, and a plurality of light-emitting elements are disposed. The area of the light-emitting surface in plan view is equal to the left and right. By setting these arrangements, it is possible to suppress the occurrence of color unevenness of the light-emitting device. Further, when there is an ideal light distribution of the light-emitting device depending on the use, the distance between the light-emitting elements may be different. Further, at least three light-emitting elements including the two first light-emitting elements 10b and the second light-emitting elements 20g are arranged side by side in one row, and such rows can be arranged in a plurality of rows. In other words, at least three light-emitting elements including the two first light-emitting elements 10b and the second light-emitting elements 20g may be aligned on one straight line, and the other two at least two first light-emitting elements 10b and second light-emitting elements 20g may be included. The three light-emitting elements are arranged neatly on the other straight line. The preferred configurations described above can be combined with each other. The first light-emitting element 10b and the second light-emitting element 20g may be semiconductor elements such as light-emitting diodes (LEDs) that emit light by application of a voltage. A nitride-based semiconductor (In X Al Y Ga 1-XY N, 0≦X, 0≦Y, X+Y≦1) or the like can be used as the semiconductor used in each of the light-emitting elements. In other words, the first light-emitting element 10b and the second light-emitting element 20g may be nitride semiconductor elements. The planar shape of the first light-emitting element 10b and the second light-emitting element 20g may be a square or a rectangular shape, or a plurality of them may be arranged in combination. The number or shape of the light-emitting elements can be appropriately selected in accordance with the shape or size of the support 7. As an example of the shape of the light-emitting element, as shown in FIGS. 3A and 3B, the planar shape of the first light-emitting element 10b and the second light-emitting element 20g may be triangular or hexagonal. In the light-emitting device 100B shown in FIG. 3A, the side surface of the first light-emitting element 10b facing the second light-emitting element 20g and the side surface of the second light-emitting element 20g opposed to the first light-emitting element 10b are arranged in parallel. . In other words, the first light-emitting element 10b and the second light-emitting element 20g are arranged such that the region between the first light-emitting element 10b and the second light-emitting element 20g formed of b1, b2, g1, and g2 is substantially parallelogram. Further, in the light-emitting device 100C shown in FIG. 3B, the side surface of the first light-emitting element 10b facing the second light-emitting element 20g and the side surface of the second light-emitting element 20g facing the first light-emitting element 10b are also Parallel configuration. By using such a light-emitting element, the ratio of the light-emitting element to the light-emitting element mounting surface of the support 7 can be increased. Therefore, a light-emitting device having excellent light extraction can be used. The light output of the first light-emitting element 10b and the light output of the second light-emitting element 20g may be the same. Further, the light output of the first light-emitting element 10b may be different from the light output of the second light-emitting element 20g in accordance with characteristics desired to be obtained such as color reproducibility. In one embodiment in which excellent color reproducibility is obtained, the ratio of the light output of the second light-emitting element 20g to the light output of the first light-emitting element 10b can be set to 0.3 or more and 0.7 or less. Further, the ratio of the sum of the light outputs of all the second light-emitting elements 20g to be used to the total of the light outputs of all the first light-emitting elements 10b to be used can be 0.2 or more and 0.6 or less. The "light output" in this specification is a radiation beam of JIS Z 8113. Further, the ratio of the light output of the light-emitting element can be measured by a spectrophotometer and calculated based on the ratio of the integrated values of the light-emitting spectra of the blue light-emitting element and the green light-emitting element. The light output of the light-emitting element is determined according to the peak wavelength of the light-emitting element, the plane area of the light-emitting element, or the type of the semiconductor laminate of the light-emitting element. Further, in the light-emitting device 100 shown in FIG. 1B, the upper surface of the second light-emitting element 20g is disposed above the upper surface of the first light-emitting element 10b. In other words, the upper surface of the second light-emitting element 20g is disposed closer to the light extraction surface (the upper surface of the light-transmitting member 3) of the light-emitting device 100 than the upper surface of the first light-emitting element 10b. The difference in height between the upper surface of the first light-emitting element 10b and the second light-emitting element 20g is, for example, 50 μm to 150 μm, preferably 100 μm to 120 μm. By performing such an arrangement, for example, even when the light output of the second light-emitting element 20g is lower than the light output of the first light-emitting element 10b, excellent color reproducibility can be obtained. In addition, the upper surface of the second light-emitting element 20g is disposed lower than the upper surface of the first light-emitting element 10b, and the upper surface of the first light-emitting element 10b and the second light-emitting element 20g are not limited thereto. The upper surface can also be at the same height. The translucent member translucent member 3 is formed of any material such as a resin or a glass material, and includes the phosphor 4 . When a light-transmitting member 3 is formed using a resin, any resin can be used. Further, the light transmissive member 3 may contain a diffusion material such as TiO 2 or SiO 2 . Thereby, the light emitted from the first light-emitting element 10b, the second light-emitting element 20g, and the phosphor 4 can be sufficiently diffused. As such a preferable resin, an anthrone-based resin, an epoxy resin, or the like can be exemplified. After the resin is melted and the phosphor 4 is mixed and dispersed, the resin in which the phosphor 4 is dispersed is filled in the concave portion of the resin package 2 to cure the resin, whereby the light transmissive member 3 can be formed.・The resin package 2 in which the support is one of the supports 7 can be formed of any resin. A thermosetting resin, a thermoplastic resin, or the like can be used as the resin, and a preferred resin is a polyester resin such as a nylon resin, an epoxy resin, an anthrone resin, or an unsaturated polyester. It is also possible to provide a reflective material of a metal such as silver plating (Ag) or a member having a high reflectance on the surface of the concave portion, for example, on the surface of the concave portion of the resin package 2. Thereby, the reflectance of light on the surface of the concave portion can be increased, and the efficiency of the light-emitting device 100 can be further improved by reflecting more light reaching the surface of the concave portion to the emission direction. Instead of the resin package having the concave portion, a support for connecting the terminals may be disposed on the surface of the insulating substrate including a composite material of ceramic, resin, dielectric, glass, or the like. The first light-emitting element 10b and the second light-emitting element 20g may be disposed on the support, and the light-transmitting member 3 including the phosphor 4 may be formed by, for example, immersing the first light-emitting element 10b and the second light-emitting element 20g. . Moreover, as a modification of the light-emitting device 100 in which the support is not used, the light-emitting device 100D shown in FIGS. 4A and 4B can be exemplified. The light-emitting device 100D shown in FIG. 4A and FIG. 4B includes two first light-emitting elements 10b and second light-emitting elements 20g, a first light-transmitting member 12 provided on the side surface side of each light-emitting element, and a first cover. The covering member 13 on the outer surface of the light transmissive member 12. In addition, the light-emitting device 100D may include the second light-transmitting member 15 or the third light-transmitting member 16 that includes the phosphor 4 on the surface side as a light-emitting surface. It is preferable that the first light transmissive member 12, the second light transmissive member 15, and the third light transmissive member 16 use a member having a high light transmittance, the first light transmissive member 12 and the third light transmissive property. The member 16 does not have a light-diffusing material or the like in order to efficiently transmit light from the light-emitting element. The first light-emitting device 10b shown in FIG. 4B includes the light-transmitting substrate 27, the semiconductor laminate 28, and the pair of electrodes 251 and 252, and the light-transmitting substrate 27 is disposed on the upper surface side of the first light-emitting device 10b. The semiconductor laminate 28 is disposed on the lower surface side of the first light-emitting element 10b. Further, one of the first light-emitting elements 10b is exposed to the electrodes 251 and 252 from the covering member 13 and exposed to the lower surface of the light-emitting device 100D. The same applies to the second light-emitting element 20g. The covering member 13 covers the outer surface of the first light transmitting member 12 provided on the side surface of each of the light emitting elements, and the exposed portion of the side surface of each of the light emitting elements. The covering member 13 is formed of a material that satisfies a specific relationship with the first light transmitting member 12 and each of the light emitting elements in the magnitude relationship of the coefficient of thermal expansion. Specifically, the thermal expansion coefficient difference between the first light-transmitting member 12 and each of the light-emitting elements (referred to as "the first thermal expansion coefficient difference ΔT30") and the thermal expansion coefficient of the covering member 13 and each of the light-emitting elements are different (will This is referred to as "the second thermal expansion coefficient difference ΔT40". The material of the covering member 13 is selected so as to be ΔT40 < ΔT30 when compared. Thereby, peeling of the 1st light transmissive member 12 from each light-emitting element can be suppressed. The resin material which can be used for the covering member 13 is particularly preferably a thermosetting translucent resin such as an anthrone resin, an anthrone modified resin, an epoxy resin or a phenol resin. Further, the covering member 13 can be formed of a light reflective resin. The light reflective resin refers to a resin material having a reflectance of 70% or more with respect to light from the light emitting element. The light reaching the covering member 13 is reflected toward the upper surface side (light emitting surface side) of the light-emitting device 100D, whereby the light extraction efficiency of the light-emitting device 100D can be improved. The first light transmitting member 12 covers the side surfaces of the respective light emitting elements, and guides the light emitted from the side surface to the upper surface direction of the light emitting device 100D. In other words, the first light transmissive member 12 is configured to extract the light to the light emitting element through the first light transmissive member 12 before the light reaching the side surface of each of the light emitting elements is reflected on the side surface and attenuated in the light emitting element. The outer member. The first light transmissive member 12 can be used as a member exemplified in the light-emitting device 100, and particularly preferably a thermosetting light-transmitting resin such as an anthrone resin, an anthrone modified resin, an epoxy resin, or a phenol resin. The members exemplified in the first light transmitting member 12 may be used as the second light transmitting member 15 and the third light transmitting member 16 . Since the first light transmitting member 12 is in contact with the side surface of the light emitting element, it is susceptible to heat generated in the light emitting element at the time of lighting. The thermosetting resin is suitable for the first light transmitting member 12 because it is excellent in heat resistance. Further, it is preferable that the light transmittance of the first light transmitting member 12 is high. Therefore, it is generally preferred that the first light-transmitting member 12 is not provided with an additive that reflects, absorbs, or scatters light. However, it is preferable to add an additive to the first light-transmitting member 12 in order to impart preferable characteristics. For example, in order to adjust the refractive index of the first light transmissive member 12 or to adjust the viscosity of the first light transmissive member 12 before curing, various fillers may be added. In the light-emitting device 100D shown in FIG. 4A and FIG. 4B, the second light-transmitting member 15 including the phosphor 4 is disposed on the surface side of the first light-emitting device 10b as a light-emitting surface, and the second light-emitting member 15 is disposed. The element 20g functions as a light-emitting surface, and the third light-transmissive member 16 is disposed on the upper surface side. It is preferable that the third light-transmissive member 16 disposed on the upper surface side of the second light-emitting element 20g is not provided with an additive that reflects, absorbs, or scatters light emitted from the second light-emitting element 20g. With such an arrangement, the light emitted from the first light-emitting element 10b, the second light-emitting element 20g, and the phosphor 4 is mixed, and for example, light of a desired color such as white light can be obtained. Further, as shown in FIG. 4B, the first light-emitting element 10b and the second light-emitting element 20g are connected in series by a metal film 14 formed by sputtering or the like. By providing such a metal film 14, heat from the light-emitting element can be efficiently released to the outside. The light emitting device 100 can be manufactured by the following manufacturing method. After the first reed 36a and the second reed 36b are placed in the mold, the resin is filled in the mold, and the resin portion, the first reed 36a, and the second reed 36b are integrally formed to obtain the resin package 2. The two first light-emitting elements 10b and the second light-emitting elements 20g are disposed on the first reed 36a exposed on the bottom surface of the concave portion of the resin package 2. Then, as shown in FIG. 1A, the first reed 36a and the first light-emitting element 10b disposed on the left side, the first light-emitting element 10b, the second light-emitting element 20g, and the second light-emitting element 20g are disposed by the wire 6. The first light-emitting element 10b on the right side and the first light-emitting element 10b and the second spring piece 36b are connected to each other. Then, the resin containing the molten state of the phosphor 4 is filled into the concave portion of the resin package 2 so that at least a part thereof comes into contact with the first light-emitting element 10b and the second light-emitting element 20g, and the phosphor 4 is precipitated, thereby causing the resin. It is hardened, whereby the light transmissive member 3 is formed. Further, the light-emitting device 100 described above is a top-view type light-emitting device in which the upper surface of the light-emitting device is a light extraction surface and the lower surface is a mounting surface. However, the present invention is not limited thereto, and the light-emitting device of the present invention also includes a so-called side view type light-emitting device in which a surface adjacent to the light extraction surface is a mounting surface and emits light in a direction parallel to the mounting surface. 2. Embodiment 2 FIG. 5A and FIG. 5B are schematic plan views showing a backlight 200 according to Embodiment 2. The backlight 200 includes the light emitting device 100 as described below. However, the light-emitting device 100 used in the following description may also be replaced with the light-emitting devices 100A to 100D. The backlight 200 includes a casing 21, a light guide plate 22 disposed in the casing 21, and a light-emitting device 100 disposed in the casing 21 and emitting light toward the light guide plate 22. The backlight 200 irradiates light from the light-emitting device 100 to the device required for the liquid crystal panel or the like via the light guide plate 22, for example. The housing 21 can be formed in such a manner that its inner surface reflects light. For example, the inner surface can be made white. At least one of the four side faces of the light guide plate 22 is used as an incident surface (light incident portion). In the embodiment shown in Fig. 5A, the side surface located below is referred to as an incident surface. The light-emitting device 100 is disposed such that its light extraction surface faces the incident direction. Preferably, the light-emitting device 100 is disposed in plural along the incident surface. The light emitted from the light-emitting device 100 enters the inside of the light guide plate 22 from the incident surface. In the case where a plurality of light-emitting devices 100 are used, light emitted from the different light-emitting devices 100 is mixed inside the light guide plate 22. The upper surface of the light guide plate 22 serves as an exit surface. Light emitted from the light guide plate 22 is advanced toward the devices by means of a device such as a liquid crystal panel disposed on the exit surface. The light extraction surface of the light-emitting device 100 can be arranged to coincide with the longitudinal direction of the light-input portion (incidence surface) of the light guide plate 22. The light of the light-emitting device 100 can be introduced into the light guide plate 22 with higher efficiency by making the longitudinal direction of the light extraction surface of the light-emitting device 100 parallel to the longitudinal direction of the light-incident surface of the light guide plate. Fig. 5B is a schematic cross-sectional view showing a modification of the backlight 200 of the second embodiment. The backlight 200 may be a so-called down-type backlight device in which a plurality of light-emitting devices 100 are disposed directly under the light guide plate 22 as shown in FIG. 5B. [Industrial Applicability] The light-emitting device of the present invention can be used, for example, as a backlight of a liquid crystal display.

2‧‧‧樹脂封裝2‧‧‧Resin packaging

3‧‧‧透光性構件3‧‧‧Transparent components

4‧‧‧螢光體4‧‧‧Fertior

6‧‧‧導線6‧‧‧Wire

7‧‧‧支持體7‧‧‧Support

10b‧‧‧第1發光元件10b‧‧‧1st light-emitting element

20g‧‧‧第2發光元件20g‧‧‧2nd light-emitting element

12‧‧‧第1透光性構件12‧‧‧1st translucent member

13‧‧‧被覆構件13‧‧‧covered components

14‧‧‧金屬膜14‧‧‧Metal film

15‧‧‧第2透光性構件15‧‧‧2nd light transmissive member

16‧‧‧第3透光性構件16‧‧‧3rd translucent member

21‧‧‧殼體21‧‧‧ housing

22‧‧‧導光板22‧‧‧Light guide plate

27‧‧‧透光性基板27‧‧‧Transmissive substrate

28‧‧‧半導體積層體28‧‧‧Semiconductor laminate

36a‧‧‧第1簧片36a‧‧‧1st reed

36b‧‧‧第2簧片36b‧‧‧2nd reed

100‧‧‧發光裝置100‧‧‧Lighting device

100A‧‧‧發光裝置100A‧‧‧Lighting device

100B‧‧‧發光裝置100B‧‧‧Lighting device

100C‧‧‧發光裝置100C‧‧‧Lighting device

100D‧‧‧發光裝置100D‧‧‧Lighting device

200‧‧‧背光200‧‧‧ Backlight

251、252‧‧‧電極251, 252‧‧‧ electrodes

C‧‧‧中心線C‧‧‧ center line

L‧‧‧排列方向L‧‧‧Orientation

P‧‧‧外側發光元件P‧‧‧Outside light-emitting elements

Q‧‧‧內側發光元件Q‧‧‧Internal light-emitting elements

圖1A係實施形態1之發光裝置100之模式性俯視圖。 圖1B係表示圖1A之Ib-Ib線剖面之模式性剖視圖。 圖2係表示發光裝置100之變化例之發光裝置100A之模式性俯視圖。 圖3A係表示發光裝置100之變化例之發光裝置100B之模式性俯視圖。 圖3B係表示發光裝置100之變化例之發光裝置100C之模式性俯視圖。 圖4A係表示發光裝置100之變化例之發光裝置100D之模式性俯視圖。 圖4B係表示圖4A之IIb-IIb線剖面之模式性剖視圖。 圖5A係表示實施形態2之背光200之模式性俯視圖。 圖5B係表示實施形態2之背光200之變化例之模式性剖視圖。Fig. 1A is a schematic plan view of a light-emitting device 100 according to a first embodiment. Fig. 1B is a schematic cross-sectional view showing a cross section taken along line Ib-Ib of Fig. 1A. FIG. 2 is a schematic plan view showing a light-emitting device 100A of a variation of the light-emitting device 100. FIG. 3A is a schematic plan view showing a light-emitting device 100B of a variation of the light-emitting device 100. FIG. 3B is a schematic plan view showing a light-emitting device 100C of a variation of the light-emitting device 100. 4A is a schematic plan view showing a light-emitting device 100D of a variation of the light-emitting device 100. Fig. 4B is a schematic cross-sectional view showing a cross section taken along line IIb-IIb of Fig. 4A. Fig. 5A is a schematic plan view showing a backlight 200 of the second embodiment. Fig. 5B is a schematic cross-sectional view showing a modification of the backlight 200 of the second embodiment.

Claims (8)

一種發光裝置,其係具有並排配置之至少3個發光元件、及包含螢光體之透光性構件者,且 上述至少3個發光元件具有配置於外側之2個外側發光元件、及配置於上述2個外側發光元件之內側且具有與上述2個外側發光元件之發光峰值波長不同之發光峰值波長之內側發光元件, 上述螢光體具有較上述外側發光元件及上述內側發光元件之發光峰值波長長之發光峰值波長,且 上述2個外側發光元件與上述內側發光元件串聯地連接。A light-emitting device comprising at least three light-emitting elements arranged side by side and a light-transmissive member including a phosphor, wherein the at least three light-emitting elements have two outer light-emitting elements disposed outside, and are disposed on the light-emitting device An inner light-emitting element having an emission peak wavelength different from an emission peak wavelength of the two outer light-emitting elements on the inner side of the two outer light-emitting elements, wherein the phosphor has a longer emission peak wavelength than the outer light-emitting element and the inner light-emitting element The emission peak wavelength is obtained, and the two outer light-emitting elements are connected in series to the inner light-emitting element. 如請求項1之發光裝置,其中 上述2個外側發光元件各自之發光峰值波長為430 nm以上且未達490 nm之範圍,且 上述內側發光元件之發光峰值波長為490 nm以上且570 nm以下之範圍。The light-emitting device of claim 1, wherein each of the two outer light-emitting elements has a light-emitting peak wavelength of 430 nm or more and less than 490 nm, and the inner light-emitting element has an emission peak wavelength of 490 nm or more and 570 nm or less. range. 如請求項1或2之發光裝置,其中上述螢光體之發光峰值波長處於580 nm以上且680 nm以下之範圍。The light-emitting device of claim 1 or 2, wherein the luminescence peak wavelength of the phosphor is in a range of 580 nm or more and 680 nm or less. 如請求項1至3中任一項之發光裝置,其中上述螢光體為組成由下述通式(I)表示之螢光體或組成由3.5MgO・0.5MgF2 ・GeO2 :Mn4+ 表示之螢光體之至少一者: A2 MF6 :Mn4+ (I) (其中,上述通式(I)中,A為選自由K、Li、Na、Rb、Cs及NH4+ 所組成之群中之至少1種元素,M為選自由第4族元素及第14族元素所組成之群中之至少1種元素)。The light-emitting device according to any one of claims 1 to 3, wherein the phosphor is a phosphor or composition having a composition represented by the following formula (I): 3.5 MgO·0.5 MgF 2 · GeO 2 :Mn 4+ At least one of the phosphors represented by: A 2 MF 6 : Mn 4+ (I) (wherein, in the above formula (I), A is selected from the group consisting of K, Li, Na, Rb, Cs and NH 4+ At least one element of the group consisting of M is at least one element selected from the group consisting of a Group 4 element and a Group 14 element). 如請求項1至4中任一項之發光裝置,其中上述內側發光元件相對於上述外側發光元件之光輸出之比處於0.3以上且0.7以下之範圍。The light-emitting device according to any one of claims 1 to 4, wherein a ratio of the light output of the inner light-emitting element to the outer light-emitting element is in a range of 0.3 or more and 0.7 or less. 如請求項1至5中任一項之發光裝置,其中上述外側發光元件與上述內側發光元件之間之上述透光性構件中之上述螢光體之含有密度為,相較於自上述內側發光元件之上表面之高度以上者,自上述上表面之高度以下者較高。The light-emitting device according to any one of claims 1 to 5, wherein a density of the phosphor in the light-transmitting member between the outer light-emitting element and the inner light-emitting element is higher than that from the inner side Above the height of the upper surface of the element, it is higher than the height of the upper surface. 如請求項1至6中任一項之發光裝置,其中 上述發光裝置具備支持體,且 上述2個外側發光元件及上述內側發光元件係載置於上述支持體。The light-emitting device according to any one of claims 1 to 6, wherein the light-emitting device includes a support, and the two outer light-emitting elements and the inner light-emitting element are placed on the support. 一種背光,其具備請求項1至7中任一項之發光裝置、及側面具有入光部之導光板,且 上述發光裝置之光提取面與上述入光部相向配置。A backlight comprising the light-emitting device according to any one of claims 1 to 7 and a light guide plate having a light incident portion on a side surface thereof, wherein a light extraction surface of the light-emitting device is disposed to face the light-injecting portion.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750466B (en) * 2018-03-26 2021-12-21 日商日亞化學工業股份有限公司 Method of manufacturing light emitting module, and light emitting module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6583203B2 (en) * 2016-09-30 2019-10-02 日亜化学工業株式会社 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD
JP6658787B2 (en) * 2017-12-22 2020-03-04 日亜化学工業株式会社 Light emitting device
JP7007589B2 (en) * 2018-07-24 2022-01-24 日亜化学工業株式会社 Luminescent device
JP7102321B2 (en) * 2018-11-15 2022-07-19 株式会社日立ハイテク Broadband light source device and biochemical analyzer
CN217062091U (en) * 2022-03-02 2022-07-26 惠州视维新技术有限公司 LED lamp bead and backlight lamp strip

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100524098B1 (en) * 2004-09-10 2005-10-26 럭스피아 주식회사 Semiconductor device capable of emitting light and the menufacturing mehtod of the same
TWI306676B (en) * 2006-09-12 2009-02-21 Univ Nat Chiao Tung Highly saturated red-emitting mn(iv) activated phosphors and method of fabricating the same
WO2009028869A2 (en) * 2007-08-27 2009-03-05 Lg Electronics Inc. Light emitting device package and lighting apparatus using the same
JP4857320B2 (en) * 2008-09-12 2012-01-18 株式会社日立製作所 Backlight device, liquid crystal display device using the same, and video display device
JP5254754B2 (en) * 2008-11-14 2013-08-07 シャープ株式会社 Light emitting device
JP5799212B2 (en) * 2010-09-21 2015-10-21 パナソニックIpマネジメント株式会社 Light emitting module, backlight device and display device
KR101411255B1 (en) * 2011-01-28 2014-06-23 삼성디스플레이 주식회사 Light source module and method of manufacturing the same
JP5173004B1 (en) * 2011-09-14 2013-03-27 シャープ株式会社 Light emitting device for plant cultivation and method for producing the same
CN106030833B (en) * 2014-04-08 2018-08-28 夏普株式会社 Led drive circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750466B (en) * 2018-03-26 2021-12-21 日商日亞化學工業股份有限公司 Method of manufacturing light emitting module, and light emitting module

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