JP4256256B2 - 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 - Google Patents
硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 Download PDFInfo
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- JP4256256B2 JP4256256B2 JP2003504815A JP2003504815A JP4256256B2 JP 4256256 B2 JP4256256 B2 JP 4256256B2 JP 2003504815 A JP2003504815 A JP 2003504815A JP 2003504815 A JP2003504815 A JP 2003504815A JP 4256256 B2 JP4256256 B2 JP 4256256B2
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- 238000001727 in vivo Methods 0.000 title claims abstract description 11
- 238000005286 illumination Methods 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 230000009747 swallowing Effects 0.000 claims 1
- 239000002775 capsule Substances 0.000 abstract description 15
- 238000003384 imaging method Methods 0.000 description 12
- 238000011503 in vivo imaging Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 210000001035 gastrointestinal tract Anatomy 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/0002—Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network
- A61B5/0031—Implanted circuitry
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/041—Capsule endoscopes for imaging
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Surgery (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- Veterinary Medicine (AREA)
- Biophysics (AREA)
- Pathology (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Public Health (AREA)
- Animal Behavior & Ethology (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Optics & Photonics (AREA)
- Radiology & Medical Imaging (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Endoscopes (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
Description
この発明は、たとえば消化管を画像化するための生体内画像化装置およびシステムに関する。
生体内画像化は生体内イメージャの使用を含み得、そこから画像データが外部の受信システムに伝送され得る。たとえば、画像センサと、画像データを伝送するための送信機とを含む経口摂取可能なカプセルが、胃腸(GI)管を画像化するために用いられ得る。
したがって、この発明は、いくつかの実施例に従って、複数の硬質の区域と複数の軟質の区域とを有する回路基板を含む生体内センシング装置を提供する。一実施例に従って、硬質の区域と軟質の区域とは交互にある。随意には、生体内センシング装置は、少なくとも画像センサを含み得る。別の実施例に従って、この装置はまた、画像化カメラなどのセンサから受信システムへ信号を伝送するための送信機を含み得る。一実施例では、装置における画像センサおよび送信機などのさまざまな構成要素が、別々の硬質回路基板区域上に配置される。好ましくは、回路基板は折り畳まれ、積み重ねられた垂直の態様で構成される。さらに他の実施例では、さまざまな硬質の部分が、ばねなどの垂直な連結具によって接続され得る。
以下の説明では、この発明のさまざまな局面が記載される。説明のために、特定の構成および詳細が、この発明を完全に理解できるようにするために述べられる。しかしながら、この明細書中に提示される特定の詳細なしにこの発明が実施され得ることも当業者には明らかである。さらに、周知の特徴は、この発明を不明瞭にしないために省かれるかまたは簡略化され得る。
システムのさらなる例が、イダン(Iddan)他による米国特許第5,604,531号に記載される。これらの公報はともに、この出願の共通の譲受人に譲渡され、引用によりこの明細書中に援用される。代替的には、この発明のシステムは、体内腔または空洞の画像をもたらすいずれの好適な画像化装置においても利用され得る。たとえば、この発明の実施例に従った回路基板は、内視鏡などの、生体内画像化のために用いられる探針において利用され得る。
くともセンサを配置するステップと、生体内センシングのために構成されたハウジングへ回路基板を折り畳むステップとを含む。
Claims (13)
- 嚥下可能な生体内センシング装置であって、
画像信号を送信するアンテナと、
少なくとも1つの電池と、
電池接点を有する回路基板と、を備え、
前記回路基板は複数の硬質の区域を含み、前記硬質の区域のうちの2つは軟質の区域によって接続され、前記少なくとも1つの電池は前記2つの硬質の区域の間に位置決めされるようになっており、
前記電池接点は前記硬質の区域に含まれており、
かつ前記アンテナが前記硬質の区域に位置しており、該硬質の区域から前記装置の一端の空間に突出していることを特徴とする、嚥下可能な生体内センシング装置。 - 画像センサを含む、請求項1に記載の装置。
- pHセンサ、温度センサおよび圧力センサを含む群から選択されるセンサを含む、請求項1に記載の装置。
- 前記アンテナを備えた送信機を含む、請求項1に記載の装置。
- 照明源を含む、請求項1に記載の装置。
- 前記回路基板の少なくとも1つの硬質の区域上に配置される画像センサを含む、請求項1に記載の装置。
- センサは、前記回路基板の硬質の区域上に配置され、前記アンテナを備えた送信機は、前記回路基板の別の硬質の区域上に配置される、請求項1に記載の装置。
- 前記硬質の区域は、前記軟質の区域と交互にある、請求項1に記載の装置。
- 前記回路基板は、前記回路基板の前記硬質の区域が互いに平行になるように前記装置の内部において垂直に前記装置の軸に沿って柱状に積み重ねられるように折り畳まれる、請求項1に記載の装置。
- 前記硬質の区域は、垂直な連結具によってさらに接続される、請求項1に記載の装置。
- 前記垂直な連結具は、電気導体またはばねである、請求項10に記載の装置。
- 前記回路基板は、フレキシガラスを含む、請求項1に記載の装置。
- 前記装置の前記少なくとも1つの構成要素は、前記少なくとも1つの硬質の区域においてマイクロビアを介して電気的に接続される、請求項1に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29838701P | 2001-06-18 | 2001-06-18 | |
PCT/IL2002/000480 WO2002102224A2 (en) | 2001-06-18 | 2002-06-18 | In vivo sensing device with a circuit board having rigid sections and flexible sections |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006160087A Division JP4751772B2 (ja) | 2001-06-18 | 2006-06-08 | 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004533879A JP2004533879A (ja) | 2004-11-11 |
JP2004533879A5 JP2004533879A5 (ja) | 2007-04-05 |
JP4256256B2 true JP4256256B2 (ja) | 2009-04-22 |
Family
ID=23150276
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003504815A Expired - Fee Related JP4256256B2 (ja) | 2001-06-18 | 2002-06-18 | 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 |
JP2006160087A Expired - Fee Related JP4751772B2 (ja) | 2001-06-18 | 2006-06-08 | 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006160087A Expired - Fee Related JP4751772B2 (ja) | 2001-06-18 | 2006-06-08 | 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7998065B2 (ja) |
EP (2) | EP1418833B1 (ja) |
JP (2) | JP4256256B2 (ja) |
AT (2) | ATE404114T1 (ja) |
AU (1) | AU2002311613A1 (ja) |
DE (1) | DE60228266D1 (ja) |
IL (2) | IL159450A0 (ja) |
WO (1) | WO2002102224A2 (ja) |
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2002
- 2002-06-18 DE DE60228266T patent/DE60228266D1/de not_active Expired - Lifetime
- 2002-06-18 US US10/481,126 patent/US7998065B2/en not_active Expired - Fee Related
- 2002-06-18 EP EP02738602A patent/EP1418833B1/en not_active Expired - Lifetime
- 2002-06-18 WO PCT/IL2002/000480 patent/WO2002102224A2/en active IP Right Grant
- 2002-06-18 JP JP2003504815A patent/JP4256256B2/ja not_active Expired - Fee Related
- 2002-06-18 IL IL15945002A patent/IL159450A0/xx unknown
- 2002-06-18 AT AT02738602T patent/ATE404114T1/de not_active IP Right Cessation
- 2002-06-18 AU AU2002311613A patent/AU2002311613A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
---|---|
DE60228266D1 (de) | 2008-09-25 |
IL159450A (en) | 2009-09-22 |
US7998065B2 (en) | 2011-08-16 |
WO2002102224A3 (en) | 2004-03-11 |
EP1982636B2 (en) | 2016-09-07 |
AU2002311613A1 (en) | 2003-01-02 |
ATE546086T1 (de) | 2012-03-15 |
IL159450A0 (en) | 2004-06-01 |
EP1418833B1 (en) | 2008-08-13 |
JP2006297119A (ja) | 2006-11-02 |
EP1418833A2 (en) | 2004-05-19 |
JP2004533879A (ja) | 2004-11-11 |
WO2002102224A2 (en) | 2002-12-27 |
EP1982636A1 (en) | 2008-10-22 |
JP4751772B2 (ja) | 2011-08-17 |
ATE404114T1 (de) | 2008-08-15 |
EP1982636B1 (en) | 2012-02-22 |
US20040171914A1 (en) | 2004-09-02 |
EP1418833A4 (en) | 2005-04-13 |
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