WO2010150825A1 - 撮像ユニット - Google Patents
撮像ユニット Download PDFInfo
- Publication number
- WO2010150825A1 WO2010150825A1 PCT/JP2010/060674 JP2010060674W WO2010150825A1 WO 2010150825 A1 WO2010150825 A1 WO 2010150825A1 JP 2010060674 W JP2010060674 W JP 2010060674W WO 2010150825 A1 WO2010150825 A1 WO 2010150825A1
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- WIPO (PCT)
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- substrate
- endoscope
- terminal
- imaging unit
- terminal portion
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
- A61B1/051—Details of CCD assembly
Definitions
- the present invention relates to an imaging unit incorporated in a distal end portion of an insertion portion of an endoscope having an insertion portion that can be introduced into a subject.
- endoscopes have been used in various medical fields such as internal medicine or surgery.
- laparoscopic surgery is performed in which a therapeutic procedure is performed without opening the abdomen in order to reduce invasion to a patient.
- a trocar that guides an observation endoscope into a body cavity and a trocar that guides a treatment tool to a treatment site in the body cavity are punctured into the abdomen of the patient.
- a so-called rigid endoscope (hereinafter, also simply referred to as a rigid endoscope) in which there is no curved portion near the distal end of the insertion portion and the insertion portion is formed of a hard member is used as an observation endoscope. .
- a rigid endoscope for example, a rigid endoscope with a curved portion provided with a curved portion in the vicinity of the distal end portion is also used.
- an elongated and flexible insertion part is inserted into the body through a natural opening such as the mouth or anus for observation, or if necessary, a treatment instrument is placed in a treatment instrument channel provided in the insertion part.
- Endoscopes that can be inserted to perform various treatments or treatments (hereinafter also referred to as flexible endoscopes) are used.
- a bending portion is provided in the vicinity of a distal end portion, and the bending portion can be bent according to a user operation.
- Hard endoscopes and flexible endoscopes include an optical endoscope and an electronic endoscope.
- an optical endoscope an optical image observed through an observation window is transmitted to an eyepiece by an image guide formed by an optical fiber bundle inserted into the insertion portion or a relay lens. Visual observation can be performed by looking into the section.
- an optical image observed through an observation window is formed on an imaging surface of an imaging element such as a CCD disposed at the distal end of the insertion portion.
- the optical image formed on the imaging surface is converted into an electrical signal by the imaging device, and then transmitted to the video processor to be converted into a video signal. Then, when the video signal is output to the display device, an endoscopic image is displayed on the screen and observation can be performed.
- the diameter of an insertion portion can be reduced and observation with a high-quality image can be performed by downsizing an image sensor and increasing the number of pixels.
- An electronic endoscope incorporates an image pickup unit including small and expensive electronic components such as an image pickup element in an insertion portion. For this reason, an electronic endoscope is generally more expensive than an optical endoscope in which an image guide or a relay lens is inserted through the insertion portion.
- An electronic endoscope has an advantage that observation by a plurality of users can be easily performed because an endoscope image is displayed on a screen of a display device. Note that even in an optical endoscope, an endoscopic image can be displayed on the screen of a display device by mounting an imaging camera (sometimes referred to as a camera head) including an imaging device on an eyepiece. Is possible.
- an imaging camera sometimes referred to as a camera head
- an endoscope image optimal for observation is displayed on the screen of a display device by connecting the endoscope to a video processor.
- the use state of the endoscope connected to the video processor is registered in the video processor once, so that when the endoscope is reconnected to the video processor, the endoscope is repeatedly used. It is also possible to obtain and observe an optimal endoscopic image.
- the electronic endoscope has an advantage that the endoscope image can be easily displayed on the display device by connecting the endoscope to the video processor.
- an electronic endoscope has an advantage that a high-quality image can be easily displayed on a display device, it has a simple configuration and an optical endoscope with low component cost and low assembly cost. Compared with the disadvantage that the price is high.
- the size of the imaging unit is being pursued for the purpose of reducing the ease of insertion and patient suffering, so the parts used are very small and time is also required for assembly. As a result, the price is high.
- Patent Document 1 Japanese Patent Laid-Open No. 10-216084 (hereinafter referred to as Patent Document 1) shows an endoscope imaging apparatus that can provide a low-cost imaging apparatus.
- a stepped terminal surface is provided on one circuit board, a duodenal connection terminal is formed on one of the stepped terminal surfaces, and a stomach connection terminal is formed on the other terminal surface. Forming.
- an image pickup device for duodenum by changing the attachment position of the CCD by selectively connecting a lead attached to the CCD to a connection terminal for a duodenum or stomach formed on a circuit board, And an imaging device for the stomach can be obtained with a single circuit board.
- a common substrate on which electronic components are mounted and an image sensor and a signal line such as a coaxial cable are connected is used. It is conceivable to form an imaging unit as a part. In this case, since parts can be shared between different types of endoscopes with or without a curved portion, the number of man-hours for managing components and the like in terms of commonality between the different types of endoscopes There is an advantage that it can contribute to the reduction of the cost or the cost.
- the hard portion is used from the viewpoint of reducing pain when inserted into the patient's body or improving the operability of the distal end portion during bending.
- the size of the image pickup unit housed in the hard part mainly the overall length, affects the length of the hard part.
- a signal line provided on the board is usually connected so that the overall length can be shortened.
- the connection area is configured in a very limited space.
- connection area is a limited space, it is difficult to mechanically connect the signal line to the board, which is left to human work. That is, fine work is required for the worker, and the number of work steps during assembly tends to increase.
- a rigid endoscope As described above, there are different demands between a rigid endoscope, a rigid endoscope with a bending section provided with a bending section, and a flexible endoscope.
- a rigid endoscope with a bending section provided with a bending section
- a flexible endoscope For the purpose of sharing the imaging unit, for example, when the imaging unit is shared so that it can be used for both an endoscope having a bending portion and a rigid endoscope having no bending portion, For example, if it is superior to provide an imaging unit that meets the demands for an endoscope with a curved portion such as a flexible endoscope, the detailed work will occur during assembly. The increase in the manufacturing cost is a factor that can hinder the cost reduction of the electronic rigid endoscope.
- the present invention has been made in view of the above circumstances, and shortens the length of a hard portion such as an endoscope having a curved portion, such as a flexible endoscope, while making common parts constituting an imaging unit. It is possible to reduce the length of the hard part when it is used in endoscopes that require a reduction in the length of the endoscope. For example, an electronic rigid mirror that does not have a curved part is not highly demanded for shortening the hard part length.
- An object of the present invention is to provide an imaging unit that can contribute to cost reduction when used in a mirror.
- An imaging unit includes a substrate to which an imaging element is electrically connected, and the substrate includes a first terminal including a plurality of terminals used when a first endoscope is configured. And a second terminal portion including a plurality of terminals used when configuring the second endoscope, and at least one of the terminal size and the interval between the terminals in the second terminal portion is It is set to be larger than at least one of the terminal dimension or the terminal interval in one terminal portion.
- An imaging unit includes an imaging device, a substrate to which the imaging device is connected, and an electrical component mounted thereon, and provided on the substrate and electrically connected to the imaging device or the electronic component.
- FIG. 6 is a front view of the entire surface of the substrate showing the wiring on the mounting surface side on which the image sensor and the electronic component are mounted.
- Perspective view of the other side of the board explaining the wiring on the other side of the board from the one end side of the board The figure explaining the wiring state of the wiring formed in both surfaces near the cutting part of the 2nd substrate
- substrate used as an imaging unit for 1st endoscopes, or an imaging unit for 2nd endoscopes The perspective view explaining a unit assembly
- an endoscope with a curved portion (hereinafter referred to as an endoscope) 1 and a rigid endoscope (hereinafter referred to as a rigid endoscope) 2 are connected to a light source device 3 and a video processor 4, respectively. Is done. An endoscopic image captured by an imaging device described later included in the endoscope 1 or an endoscopic image captured by an imaging device described later included in the rigid endoscope 2 is displayed on the display device 5. Yes.
- the endoscope 1 is a first endoscope, and includes a rigid distal end portion 11, a bending portion 12 that can be bent in the vertical and horizontal directions, and a flexible flexible tube portion 13, for example.
- An insertion part 10 is provided.
- An operation unit 14 is connected to the proximal end of the insertion unit 10.
- a universal cord 15 extends from the operation unit 14.
- the operation unit 14 is provided with bending operation knobs 16a and 16b that allow the bending unit 12 to perform a bending operation.
- An imaging unit is disposed in the distal end portion 11 constituting the insertion portion 10.
- Reference numeral 17 denotes a light source connector
- reference numeral 18 denotes a signal connector.
- the bending direction of the bending part 12 is made into four directions of up and down, right and left, a bending direction may be two directions up and down, for example.
- the first endoscope may be a rigid endoscope with a bending portion provided with a bending portion in the vicinity of the distal end portion.
- the rigid endoscope is configured to include a rigid tube portion instead of the flexible tube portion.
- the light source device 3 includes a light source connector connecting portion 3a, and includes an illumination lamp in the device.
- the light source connector 17 or the light source connector 24 of the rigid mirror 2 is detachably connected to the light source connector connecting portion 3a.
- the video processor 4 includes a signal connector connection unit 4a, and includes a control unit, a signal processing circuit, a storage unit, and the like in the apparatus.
- the signal connector 18 or the signal connector 25 of the rigid endoscope 2 is detachably connected to the signal connector connecting portion 4a.
- the display device 5 receives the video signal output from the video processor 4 and displays an endoscopic image captured by the endoscope 1 or the rigid endoscope 2 on the screen 5a.
- the rigid endoscope 2 is a second endoscope, and includes a rigid insertion portion 21, an operation portion 22 connected to the proximal end of the insertion portion 21, and a universal cord 23 extending from the operation portion 22. It is prepared for.
- An imaging unit (reference numeral 30 in FIG. 2), which will be described later, is disposed in the distal end portion of the insertion portion 21.
- Reference numeral 24 denotes a light source connector
- reference numeral 25 denotes a signal connector.
- Reference numeral 6 denotes a video cable, which connects the video processor 4 and the display device 5 and transmits a video signal output from the video processor 4.
- the rigid endoscope 2 includes an illumination optical system 7 and an imaging optical system 8 in the insertion portion 21.
- the illumination optical system 7 is, for example, a light guide fiber bundle 7 a and is disposed at a predetermined position around the imaging optical system 8.
- An illumination window (not shown) is disposed on the tip surface of the light guide fiber bundle 7a.
- the illumination optical system is not limited to the light guide fiber bundle, and may be configured such that a light emitting element such as an LED is disposed around the lens frame 8a.
- the imaging optical system 8 includes a lens frame 8a, an imaging frame 8b, and a rigid pipe 8c having a substantially circular cross section.
- Various optical lenses (not shown) are fixed in the lens frame 8a.
- the imaging frame 8b is fixed to the lens frame 8a, and a cover lens 31 constituting the imaging unit 30 is fixed in the imaging frame 8b.
- the rigid pipe 8c is fixed to the imaging frame 8b, and the imaging unit 30 is disposed in the rigid pipe 8c.
- the imaging unit 30 includes a cover lens 31, a cover glass 32, an imaging element 33, a substrate 40, and a flexible substrate 35 having flexibility in the thickness direction as a signal transmission member. And is configured.
- the image sensor 33 is configured in a substantially rectangular shape and has an imaging surface 33A having a substantially rectangular shape.
- the cover lens 31 is formed in a circular shape and has an outer diameter that is slightly larger than the imaging surface 33 ⁇ / b> A of the imaging element 33.
- the cover glass 32 is formed in a substantially rectangular shape and has substantially the same width as the image sensor 33.
- An image sensor 33 and various electronic components 34 are mounted on the substrate 40.
- the distal end portion of the flexible substrate 35 is connected to a second terminal portion 52 formed on a later-described second endoscope substrate portion 42 constituting the substrate 40.
- a base end portion of the flexible substrate 35 extends through the rigid pipe 8 c and into the operation portion 22.
- the cover lens 31 and the cover glass 32 are bonded and fixed with a transparent adhesive, and the cover glass 32 is disposed on the light receiving surface of the image sensor 33.
- the periphery of the electronic component 34 and the periphery of the electrical connection portion are sealed with a non-conductive resin.
- the hard pipe 8c is filled with a nonconductive sealing resin.
- the endoscope 1 includes an illumination optical system 9, an observation optical system 60, and a treatment instrument channel 70 in the insertion portion 10.
- the treatment instrument channel 70 is mainly configured by a channel base (not shown) made of a metal pipe and a flexible channel tube (not shown) connected to the channel base.
- the channel tube passes through the insertion portion 10 and is connected to a forceps insertion port 71 provided in the operation portion 14.
- a pair of illumination optical systems 9 is provided, for example, with the observation optical system 60 interposed therebetween.
- the illumination optical system 9 includes an illumination window 9a fixed to the distal end portion 11 and a light guide fiber bundle (not shown).
- the observation optical system 60 includes a lens frame 61, an imaging frame 62, and an imaging unit exterior frame 63 configured by stacking, for example, a metal thin plate 64 and a heat shrinkable tube 65.
- the distal end portion of the imaging unit exterior frame 63 is fixed to the small-diameter portion 66 of the imaging frame 62.
- the lens frame 61 and the imaging frame 62 are formed with a peripheral surface disposed at least close to the outer peripheral side of the insertion portion 10 and cut-out surfaces 61 a and 62 a configured by a plane facing the outer periphery.
- a cover lens 31A constituting the imaging unit 30A is fixed to the imaging frame 62.
- the image pickup unit 30A includes a cover lens 31A, a cover glass 32, an image pickup element 33, a substrate 40, and a signal cable 36 that is a signal transmission member.
- the signal cable 36 is flexible so that it can be bent in any direction.
- the cover lens 31 ⁇ / b> A of the present embodiment is formed with a pair of cutout surfaces 31 b constituted by a peripheral surface disposed at least close to the outer peripheral side of the insertion portion 10 and a plane facing the outer periphery. Note that the width of the pair of cutout surfaces of the cover lens 31 ⁇ / b> A is slightly larger than the width of the image sensor 33.
- a pair of notch surfaces 61 a, 62 a, and 31 b are formed in the lens frame 61, the imaging frame 62, and the cover lens 31 ⁇ / b> A, and the notch surfaces 61 a, 62 a, and 31 b are approximately the two sides of the image sensor 33. Place them in parallel.
- the image sensor 33 and various electronic components 34 are mounted on the substrate 40, and a plurality of signal lines 37 are inserted into the signal cable 36.
- a lead wire portion 37a of each signal line 37 is exposed by a predetermined amount after the coating on the tip side is removed.
- Each conducting wire portion 37 a is connected to a first terminal portion (see reference numeral 51 in FIG. 7) formed on a first endoscope substrate portion 41 (described later) constituting the substrate 40.
- the base end portion of the signal cable 36 extends through the insertion portion 10, the operation portion 14, and the universal cord 15 and into the signal connector 18.
- a substrate 40 shown in FIGS. 6 and 7 is a common substrate used for the imaging unit 30 ⁇ / b> A of the endoscope 1 and the imaging unit 30 of the rigid endoscope 2.
- the substrate 40 includes a first endoscope substrate portion (hereinafter abbreviated as a first substrate) 41, a second endoscope substrate portion (hereinafter abbreviated as a second substrate) 42, and an inspection substrate portion. 43.
- the first substrate 41 has a substantially rectangular shape formed by a short side 41a substantially parallel to the image sensor 33 and a long side 41b orthogonal to the short side 41a.
- the second substrate 42 has a substantially rectangular shape arranged in parallel with the long side 41b of the first substrate 41 at a predetermined distance.
- the first substrate 41 and the second substrate 42 constitute an integrated substrate 40 by a connecting portion 45 including a second endoscope bending portion 44 indicated by a broken line that is valley-folded.
- the second substrate 42 When the second substrate 42 is bent toward the first substrate 41 along the second endoscope bending portion 44, the one surface side of the first substrate 41 and the one surface side of the second substrate 42 face each other. .
- a gap is formed between the one surface side of the first substrate 41 and the one surface side of the second substrate 42 in which the electronic component 34 mounted on the first substrate 41 can be disposed.
- the connecting portion 45 has a cutting portion 46 indicated by a one-dot chain line parallel to the side surface on the first substrate 41 side.
- the second substrate 42 is cut from the cutting unit 46 when the substrate 40 is used as the imaging unit 30 ⁇ / b> A of the endoscope 1. That is, the connecting portion 45 has a cutting portion 46 in addition to the second endoscope bending portion 44.
- the inspection substrate unit 43 is provided on the base end side of the second substrate 42.
- An inspection terminal portion 90 including a plurality of inspection terminals 91 is formed on the inspection substrate portion 43.
- the inspection substrate section 43 is cut along a cutting line 43C shown by a solid line after the acceptance inspection is completed.
- substrate 42 are equipped with the terminal part and wiring which are mentioned later on the one surface side and the other surface side, respectively.
- the first substrate 41 includes a first mounting part 47 and a second mounting part 48. Between the 1st mounting part 47 and the 2nd mounting part 48, the 1st connection part 50 containing the 1st bending part 49 shown by the broken line broken by a valley is provided. Then, the electronic component 34 mounted on the second mounting portion 48 is opposed to the one surface side of the first mounting portion 47 by bending the second mounting portion 48 along the first bent portion 49 to the first mounting portion 47 side. As a result, the first mounting portion 47 is arranged.
- the width dimension W50 of the first connecting part 50 is set to be narrower than the width dimension W47 of the first mounting part 47 and narrower than the width dimension W48 of the second mounting part 48. According to this setting, when the second mounting portion 48 is folded, the first connecting portion 50, which is a bent portion, gradually has a width dimension toward the base end side as viewed from above in FIG. It is configured in a taper shape that changes narrowly.
- the first mounting portion 47 includes an image sensor mounting surface 53 on which the image sensor 33 is mounted on one surface side, and a first terminal portion 51 to which the conductor portion 37a of the signal line 37 is connected on the other surface side.
- the first terminal unit 51 includes, for example, terminals 81-91.
- the terminals 81-91 are divided into a first group in which the terminals 81-86 are arranged in the width direction and a second group in which the terminals 87-91 are arranged in the width direction from the image sensor 33 side toward the second mounting portion 48. It is formed separately.
- the one surface side of the second mounting portion 48 is an electronic component mounting surface on which various electronic components 34 are mounted.
- the second mounting portion 48 is provided with a third mounting portion 54 on which various electronic components 34 are mounted.
- the 2nd mounting part 48 and the 3rd mounting part 54 are comprised integrally by the 2nd connection part 56 containing the 2nd bending part 55 shown as the continuous line folded in a mountain.
- the third mounting portion 54 When the third mounting portion 54 is bent along the second bent portion 55 toward the second mounting portion 48, the other surface side of the third mounting portion 54 is disposed on the other surface side of the second mounting portion 48. As a result, the electronic component 34 mounted on the second mounting unit 48 and the electronic component 34 mounted on the third mounting unit 54 are stacked and disposed on the first mounting unit 47.
- the configuration in which the third mounting portion 54 is arranged in parallel with the second mounting portion 48 is shown, but the first mounting portion 47, the second mounting portion 48, and the third mounting portion 54 are arranged in series.
- the second bent portion 55 and the first bent portion 49 may be disposed so as to have a substantially parallel positional relationship. Further, when the number of electronic components 34 is small, the third mounting unit 54 is not necessary.
- the second substrate 42 is provided with a second terminal portion 52 to which the distal end portion of the flexible substrate 35 is connected on one surface side.
- the width dimension W42 of the second substrate 42 is set wider than the width dimension W47 of the first mounting portion 47 of the first substrate 41. This is because when the second substrate 42 is bent along the second endoscope bending portion 44 of the connecting portion 45 and disposed on the first mounting portion 47, as shown in FIGS. This is because the two substrates 42 are arranged at the substantially wide central portion of the rigid pipe 8c.
- the length dimension of the second substrate 42 is a substrate part used when the second substrate 42 constitutes the imaging unit 30 of the rigid endoscope 2, the electrical connection work of the flexible substrate 35 is taken into consideration. The optimal length is set above.
- the second substrate 42 includes the second terminal portion 52 in a region having a larger width dimension and a longer length than the first mounting portion 47 including the first terminal portion 51 of the first substrate 41.
- the terminals 81-91 constituting the second terminal portion 52 include a first group 52A in which the terminals 81-85 are arranged in the width direction from the connecting portion 45 side to the cutting line 43C side, and terminals 86, 87,
- the second group 52B in which 90 and 91 are arranged in the width direction and the third group 52B in which terminals 88 and 89 are arranged in the width direction are formed separately.
- the terminal intervals and terminal group intervals formed on the second substrate 42 are set to be larger than the terminal intervals and group intervals formed on the first substrate 41.
- the operation of connecting the signal lines to the respective terminals 81-91 can be made easier on the second substrate 42 than on the first substrate 41. Therefore, the number of assembling steps for the second endoscope can be reduced and the cost can be reduced.
- each terminal 81-91 that is, at least one of the terminal width or terminal length, or the distance between terminals, in other words, the width direction of the second substrate 42 (in the direction of arrow W in the figure).
- the number of terminals 51 and 52 is eleven. However, the number of terminals is not limited to 11, and may be 11 or more or less than 11.
- the wiring 57 extending from the first substrate 41 to the second substrate is formed on both the one surface side and the other surface side from the cutting portion 46 to the connecting portion 45 and the second substrate 42 as shown in FIGS. Is formed. Then, as shown in FIG. 8, the adjacent wirings 57 are separated from each other by a distance L so that the wiring 57 formed on the one surface side and the wiring 57 formed on the other surface side do not overlap each other. .
- the imaging units 30 and 30A using the substrate 40 will be described.
- the imaging element 33 and various electronic components 34 are mounted on the substrate 40, and the inspection substrate section 43 is cut.
- the substrate 40 on which the image pickup device 33 and the electronic component 34 are mounted is configured as a unit set 80 by bending the first bent portion 49 and the second bent portion 55 in a predetermined state as shown in FIG.
- the unit set 80 a plurality of electronic components 34 mounted on the second mounting portion 48 and a plurality of electronic components mounted on the third mounting portion 54 on the first mounting portion 47 of the first substrate 41. 34 is laminated.
- the unit set 80 is a common part of the imaging units 30 and 30A.
- a case where the imaging unit 30A for the endoscope 1 is configured using the unit unit set 80 will be described.
- the operator cuts the second substrate 42 from the cutting portion 46 as shown in FIG. 11 to form a unit portion set 80A with a bending portion.
- the wiring 57 formed on each of the one surface side and the other surface side of the second substrate 42 is set to have a non-overlapping positional relationship. It is prevented that they are in electrical contact with each other.
- the operator After cutting the second substrate 42, the operator connects the signal cable 36 through which the plurality of signal lines 37 are inserted to the first terminal portion 51 of the unit portion set 80A with a bending portion. That is, the operator connects the conductor portions 37a of the signal wires 37 from which the coating is removed one by one to the terminals 81-91.
- the imaging unit 30A as shown in FIGS. 4 and 5 is configured.
- the imaging unit 30A since the terminals 81-91 are disposed in the vicinity of the imaging device 33, when the signal line 37 is connected to the first terminal portion 51, the first mounting in a state where the electronic components 34 are stacked. Since the signal line 37 is disposed on the other surface side of the portion 47, the distal end portion 36a of the signal cable 36 can be further disposed on the image sensor 33 side, and the hard length can be shortened. Further, by providing the cutting portion 46 on the first substrate 41 side, the width of the imaging unit 30A can be reduced when the cutting portion 46 cuts.
- the imaging unit 30 for the rigid endoscope 2 is configured using the unit set 80.
- the operator connects the flexible substrate 35 to the second terminal portion 52 of the unit portion set 80. That is, as shown in FIG. 12, the operator faces the flexible substrate 35 and the second terminal portion 52, aligns them, and then collectively joins them with solder, bumps, anisotropic conductive resin, or the like. .
- a terminal portion (not shown) of the flexible substrate 35 and the respective terminals 81-91 of the second terminal portion 52 can be electrically connected at a time.
- the operator connects the flexible substrate 35 to the second terminal portion 52 of the second substrate 42 and then bends the connecting portion 45 of the second substrate 42 along the second endoscope bending portion 44.
- the second substrate 42 to which the flexible substrate 35 is connected is stacked on the first mounting portion 47 in a state where the electronic components 34 are stacked, and is shown in FIGS.
- An imaging unit 30 is configured.
- At least one of the terminal interval, the terminal group interval, or the terminal dimension of the second terminal portion 52 provided on the second substrate 42 is set as the terminal interval, terminal of the first terminal portion 51 of the first substrate 41.
- the signal cable 36 such as a coaxial cable having a plurality of signal lines 37 to each terminal 81-91 of the second terminal portion 52, which is set larger than the group interval or the terminal dimension, the flexible substrate 35 The terminal is connected.
- the terminals 81-91 of the first terminal portion 51 provided on the other surface side of the first mounting portion 47 are insulated and sealed by attaching sealing resin or insulating tape. ing.
- the substrate 40 including the first substrate 41 provided with the first terminal portion 51 and the second substrate 42 provided with the second terminal portion 52 is configured.
- a unit portion set 80A with a curved portion obtained by cutting the second substrate 42 from the substrate 40 is used, and for an endoscope without a curved portion.
- the imaging unit 30 is configured, the unit set 80 is used without cutting the second substrate 42. Accordingly, it is possible to use a common substrate for an imaging unit used in an endoscope having a bending portion and an endoscope having no bending portion.
- the imaging unit 30 using the unit set for bending portion 80A, the length of the hard portion of the flexible endoscope having the bending portion can be shortened. Further, by connecting the flexible substrate 35 to the unit set 80, an inexpensive flexible substrate 35 can be inserted into the insertion portion 21 of the rigid endoscope 2 instead of inserting an expensive signal cable 36 such as a coaxial cable. it can. Therefore, it becomes possible to contribute to the cost reduction of the rigid mirror by reducing the cost of the rigid mirror parts.
- each terminal interval and terminal group interval formed on the second substrate 42 is larger than each terminal interval and group interval formed on the first substrate 41, the terminal portion of the flexible substrate 35 and By positioning the connection work with each of the terminals 81-91, the connection can be made quickly and reliably, so that the assembly cost of the rigid endoscope can be reduced.
- the work of stripping the covering of the plurality of signal wires 37 included in the signal cable 36 and exposing the conductor portion 37a by a predetermined amount is unnecessary, so that the working time can be shortened and the assembly cost can be further reduced. . These can further contribute to the cost reduction of the rigid endoscope.
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Abstract
Description
しかし、硬性鏡の分野において、光学式の内視鏡は、電子式の内視鏡に比較して安価である。このため、光学式の硬性鏡は、電子式の硬性鏡に比べて多く利用されている。
そのため、腹腔鏡下外科手術等で使用される硬性鏡の分野においても、高画質な画像を容易に表示装置の画面に表示させることが可能な電子式の硬性鏡が望まれている。
これは、内視鏡の種類によって、撮像ユニットが収められる先端部(以下、硬質部とも記載する)の長さに対する要求が異なることが要因の一つにある。
図1-図12を参照して本発明の一実施形態を説明する。
図1に示すように、湾曲部付の内視鏡(以下、内視鏡と記載)1及び硬性内視鏡(以下、硬性鏡と記載)2は、それぞれ光源装置3及びビデオプロセッサ4に接続される。内視鏡1が備える後述する撮像素子で撮像された内視鏡画像、或いは硬性鏡2が備える後述する撮像素子で撮像された内視鏡画像は、表示装置5に表示されるようになっている。
なお、符号6は映像ケーブルであり、ビデオプロセッサ4と表示装置5とを接続し、ビデオプロセッサ4から出力される映像信号を伝送する。
照明光学系9は、例えば観察光学系60を挟んで一対、設けられている。照明光学系9は、先端部11に固設された照明窓9aと、図示しないライトガイドファイバ束とで構成されている。
本実施形態のカバーレンズ31Aには、少なくとも挿入部10の外周側に近接して配置される周面、およびその外周に対向する平面で構成した一対の切り欠き面31bが形成されている。
なお、カバーレンズ31Aの一対の切り欠き面の幅は、撮像素子33の幅より僅かに大きく形成されている。
基板40は、第1内視鏡用基板部(以下、第1基板と略記する)41と、第2内視鏡用基板部(以下、第2基板と略記する)42と、検査用基板部43とを備えて構成されている。
第1基板41は、第1実装部47と第2実装部48とを備えている。第1実装部47と第2実装部48との間には、谷折りされる破線に示す第1折り曲げ部49を含む第1連結部50が設けられている。そして、第2実装部48を第1折り曲げ部49に沿って第1実装部47側に折り曲げることによって、第2実装部48に実装された電子部品34が第1実装部47の一面側に対峙して、第1実装部47上に配置された状態になる。
なお、本実施形態においては、第2実装部48に第3実装部54を並設させる構成を示したが、第1実装部47、第2実装部48、第3実装部54を直列に配置し、第2折り曲げ部55と第1折り曲げ部49とを互いに略平行な位置関係となるように配置しても良い。また、電子部品34の数が少ない場合には、第3実装部54は不要である。
また、第2基板42の長さ寸法は、この第2基板42が硬性鏡2の撮像ユニット30を構成する際に用いられる基板部であるため、フレキシブル基板35の電気的な接続作業を考慮した上で最適な長さ寸法に設定してある。
また、第1基板41から第2基板に延出する配線57は、図6、図7に示すように切断部46から連結部45、第2基板42に至る一面側及び他面側の両面に形成されている。そして、図8に示すように一面側に形成した配線57と他面側に形成した配線57とが、重なった位置関係とならないように隣り合う配線57同士が距離Lだけ、それぞれ離間されている。
撮像ユニット30、30Aを構成する際、図9に示すように基板40上には撮像素子33、各種電子部品34が実装され、検査用基板部43は切断されている。また、撮像素子33、電子部品34を実装した基板40は、図10に示すように第1折り曲げ部49及び第2折り曲げ部55を所定の状態に折り曲げてユニット部組80として構成されている。
作業者は、切断部46から図11に示すように第2基板42を切断して湾曲部付用ユニット部組80Aを形成する。このとき、前記図8で示したように第2基板42の一面側及び他面側のそれぞれに形成した配線57を、重ならない位置関係に設定したことによって、切断した際に配線57の切断面同士が電気的に接触することが防止されている。
作業者は、フレキシブル基板35をユニット部組80の第2端子部52に接続する。即ち、作業者は、図12に示すようにフレキシブル基板35と第2端子部52とを対峙させ、位置合わせを行った後、半田、バンプ、又は異方性導電樹脂などにより一括して接合する。このことによって、フレキシブル基板35の図示しない端子部と第2端子部52の各端子81-91とを一度に電気的に接続することができる。
また、ユニット部組80にフレキシブル基板35を接続することによって硬性鏡2の挿入部21内に、同軸ケーブル等の高価な信号ケーブル36を挿通させる代わりに、安価なフレキシブル基板35を挿通することができる。したがって、硬性鏡の部品を安価なものにして、硬性鏡の価格低減に貢献できるようになる。
Claims (11)
- 撮像素子が電気的に接続される基板を具備し、
前記基板に、第1の内視鏡を構成する際に使用する複数の端子を含む第1の端子部、及び第2の内視鏡を構成する際に使用する複数の端子を含む第2の端子部を設けると共に、
前記第2の端子部における端子寸法と端子間の間隔の少なくとも一方を、前記第1の端子部における端子寸法又は端子間隔の少なくとも一方よりも大きく設定したことを特徴とする撮像ユニット。 - 撮像素子と、
前記撮像素子が接続され、電気部品が実装される基板と、
前記基板に設けられ、前記撮像素子または前記電子部品に対して電気的に接続される信号伝送部材を接続する複数の端子を含む端子部と、を備え、
前記端子部は、前記信号伝送部材が選択的に接続される第1の端子部と第2の端子部とを備え、
前記第2の端子部における端子寸法と端子間隔の少なくとも一方を、前記第1の端子部の端子寸法又は端子間隔よりも大きく設定して設けたことを特徴とする撮像ユニット。 - 前記基板の前記第1の端子部と、前記第2端子部との間には切断部が設けられ、
前記基板を、第1の内視鏡の撮像ユニットとして用いる際には前記切断部で前記第2の端子部を切り離し、前記信号伝送部材を前記第1の端子部に接続することを特徴とする請求項1または請求項2に記載の撮像ユニット。 - 前記基板の前記第1の端子部と、前記第2の端子部との間に折り曲げ部が設けられ、
前記基板を、第2の内視鏡の撮像ユニットとして用いる際には前記折り曲げ部で折り曲げ、前記信号伝送部材を前記第2の端子部に接続することを特徴とする請求項1または請求項2に記載の撮像ユニット。 - 前記基板の前記第1の端子部と、前記第2の端子部との間に切断部及び折り曲げ部を含む連結部が設けられ、
前記基板を、第1の内視鏡の撮像ユニットとして用いる際には前記切断部で前記第2の端子部を切り離し、前記第1の端子部に前記信号伝送部材を接続し、
前記基板を、第2の内視鏡の撮像ユニットとして用いる際には前記折り曲げ部で折り曲げて、前記第2の端子部に前記信号伝送部材を接続することを特徴とする請求項1または請求項2に記載の撮像ユニット。 - 前記基板は、
前記撮像素子の撮像面に略平行な短辺、及び前記短辺に直交する長辺から形成される矩形形状で第1の端子部を有する第1内視鏡用基板部と、
前記第1内視鏡用基板部と前記長辺を挟んで隣り合うように設けられた、第2の端子部を有する第2内視鏡用基板部とを含み、
前記第1内視鏡用基板部と前記第2内視鏡用基板部とを、前記連結部によって連結されることを特徴とする請求項5に記載の撮像ユニット。 - 前記第1の内視鏡は、前記撮像ユニットが収められる挿入部の先端部近傍に湾曲部を備えた内視鏡であり、前記第2の内視鏡は、前記撮像ユニットが収められる挿入部の先端部近傍に湾曲部を持たず、前記挿入部の少なくとも前記先端部近傍が実質的に可撓性を有さない部材で構成された内視鏡であることを特徴とする請求項5に記載の撮像ユニット。
- 前記信号伝送部材は、前記基板が前記第1の内視鏡の撮像ユニットとして用いられる場合には、前記第1の端子部に接続される信号ケーブルであり、
前記基板が前記第2の内視鏡の撮像ユニットとして用いられる場合には、前記第2の端子部に接続されるフレキシブル基板であることを特徴とする請求項7に記載の撮像ユニット。 - 前記第2内視鏡用基板部の幅寸法は、前記第1内視鏡用基板部の第1端子部を備える第1実装部の幅寸法より幅が広いことを特徴とする請求項6に記載の撮像ユニット。
- 前記第2内視鏡用基板部の長さ寸法は、前記第1内視鏡用基板部の第1端子部を備える第1実装部の長さ寸法より長さが長いことを特徴とする請求項6に記載の撮像ユニット。
- 前記基板は、前記第1内視鏡用基板部から前記第2内視鏡用基板部に至る複数の配線を備え、
前記切断部から前記折り曲げ部を介して第2内視鏡用基板部に至る配線は、前記第2内視鏡用基板部の一面側及び他面側に形成され、少なくとも前記切断部における断面において前記一面側に形成した配線と、前記他面側に形成した配線とは重ならない位置関係で設けられることを特徴とする請求項6に記載の撮像ユニット。
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JP2014221203A (ja) * | 2013-05-13 | 2014-11-27 | シェリー ファイバーオプティック ゲゼルシャフト ミット ベシュレンクテル ハフツングSchoellyFiberoptic GmbH | 内視鏡 |
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JPWO2016157597A1 (ja) * | 2015-03-30 | 2017-04-27 | オリンパス株式会社 | 内視鏡 |
JP2017074207A (ja) * | 2015-10-14 | 2017-04-20 | 富士フイルム株式会社 | 電子内視鏡 |
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JP6393018B1 (ja) * | 2017-04-06 | 2018-09-19 | オリンパス株式会社 | 撮像ユニット、および内視鏡 |
WO2018186163A1 (ja) * | 2017-04-06 | 2018-10-11 | オリンパス株式会社 | 撮像ユニット、および内視鏡 |
JP2021057777A (ja) * | 2019-09-30 | 2021-04-08 | パナソニックIpマネジメント株式会社 | 撮像ユニット、機器、インターホンシステム、及び筐体 |
JP7390549B2 (ja) | 2019-09-30 | 2023-12-04 | パナソニックIpマネジメント株式会社 | 撮像ユニット、機器、及びインターホンシステム |
Also Published As
Publication number | Publication date |
---|---|
JPWO2010150825A1 (ja) | 2012-12-10 |
US20110295064A1 (en) | 2011-12-01 |
JP4916595B2 (ja) | 2012-04-11 |
EP2446808A4 (en) | 2013-01-02 |
US8821382B2 (en) | 2014-09-02 |
CN102802497B (zh) | 2015-03-25 |
CN102802497A (zh) | 2012-11-28 |
EP2446808A1 (en) | 2012-05-02 |
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