JP4021746B2 - Circuit board mounting structure for power supply coil components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate mounting structure for a coil component for a power supply device in which the coil component is attached to a printed circuit board of a power supply device for various electronic devices.
[0002]
[Prior art]
[Patent Document 1]
JP, 8-8180, A Conventionally, with the thinning of electronic equipment, a thin coil component is demanded and commercialized. However, if the coil component itself is made too thin, the floor area must be increased in order to obtain a predetermined performance. In order to solve such a problem, for example, as shown in FIG. 6, a mounting through-hole 2 is provided at a predetermined position of the substrate 1, and the coil component 3 is dropped into the mounting through-hole 2. There was a mounting structure. In the coil component 3, a winding 5 is wound around a shaft of a bobbin 4, and a core 6 is attached to the center and outside of the bobbin 4 and the winding 5. Each lead wire 5 a of the winding 5 is connected to terminals 7 provided on both sides of the bobbin 4. The terminals 7 are folded and overlapped on the front side surface 1a of the substrate 1 and connected to a circuit pattern 8 printed on the front side surface 1a of the substrate 1 in a predetermined shape. The substrate 1 is provided with through holes 9 at predetermined positions, and the circuit patterns 8 on the front side surface 1a and the back side surface 1b of the substrate 1 are electrically connected to each other. Various electronic components 10 and 11 are placed on the front side surface 1 a and the back side surface 1 b of the substrate 1 and connected to the circuit pattern 8.
[0003]
In addition, as shown in FIG. 7, a coil component 12 is provided by being dropped into the mounting through hole 2 of the substrate 1. The coil component 12 is provided with a block-shaped base 14, and terminals 16 and 18 are insert-molded on the base 14. A core 20 is provided on the base 14, and a winding 5 is wound around the core 20. Each lead wire 5 a of the winding 5 is connected to terminals 16 and 18, and the terminals 16 and 18 extend to the mounting through-hole 2 on the back side surface 1 b of the substrate 1 and are also provided on the back side surface 1 b of the substrate 1. The circuit pattern 8 printed on the shape is connected.
[0004]
In order to reduce the number of turns and increase the operating frequency in order to cope with the miniaturization of the product, a device that increases the coupling coefficient between the windings by using a sandwich structure in which the windings are divided and overlapped with each other. There is a small transformer for mounting on a substrate disclosed in Japanese Patent Publication No. 8-8108.
[0005]
[Problems to be solved by the invention]
In the conventional techniques shown in FIGS. 6 and 7, a plurality of terminals are provided only on one surface of the substrate 1, and a large installation space for electrode terminals on the front and back surfaces of the substrate 1 is required. Furthermore, the terminals cannot be made very thin in order to secure the attachment strength, and a certain thickness is required. On the other hand, in order to ensure insulation between the terminals, it is necessary to keep a certain distance. Therefore, in a limited mounting space, the number of terminals cannot be increased, which hinders high density. Furthermore, a through hole 9 is necessary to energize the electronic components 10 and 11 on the front and back surfaces of the substrate 1, and other electronic components cannot be mounted at the place where the through hole 9 is formed, which hinders downsizing. It was. In addition, a large current is caused to flow through the through-hole 9, which may cause heat generation, which may increase loss and reduce reliability.
[0006]
Also, in the case of the small transformer for mounting on a board disclosed in Japanese Examined Patent Publication No. 8-8108, since the lead wire of the coil winding is connected only to one side of the board, it requires a lot of terminal space and also requires a through hole. There is a problem similar to the above. Further, due to the restriction that the copper foil thickness of a general-purpose printed board is about 100 μm or less, there is a problem that the equivalent series resistance of the board coil increases, loss increases, and efficiency decreases. In order to increase the number of circuits, it is necessary to employ a printed circuit board having a large number of layers, which leads to an increase in cost. When the number of turns is increased by connecting the coils of each layer in series, a through hole is required for the series connection, and there is a risk that heat will be generated due to a large current flowing through the through hole in the same manner as described above. There is a risk of decline.
[0007]
The present invention has been made in view of the above-described problems of the prior art, and provides a substrate mounting structure for a coil component for a power supply device that has a simple structure, is highly reliable, and can be easily downsized. Objective.
[0008]
[Means for Solving the Problems]
The present invention has an insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through hole formed at a predetermined position of the substrate, and a space in the mounting through hole. The coil parts are arranged by inserting a plurality of bobbins each having a plurality of terminals into the mounting through holes of the substrate, and the lead wires of the plurality of coil windings are attached to the mounting parts. is inserted is wound to each terminal of the bobbin YoToruana, each terminal of the plurality of bobbins are fixed are respectively connected to the substrate front and back surfaces of electrodes around the mounting Toru holes, the plurality of bobbin This is a board mounting structure of a coil component for a power supply device in which an E-type core penetrates and is magnetically coupled to the coil winding from the front and back surfaces of the substrate.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 illustrate a first embodiment of the present invention. A substrate mounting structure 21 of a coil component for a power supply device according to this embodiment is provided with an insulating substrate 22, and a surface of the substrate 22 is illustrated. A circuit pattern 24 having a predetermined shape is provided on the side surface 22a and the back side surface 22b.
[0010]
A rectangular mounting through hole 26 is formed at a predetermined position of the substrate 22 to which a coil component 35 described later is dropped and mounted. Two electrode terminals 28 connected to the circuit pattern 24 are provided on the front side surface 22 a of the substrate 22 in the vicinity of one edge portion 26 a of the mounting through hole 26. Three electrode terminals 28 connected to the circuit pattern 24 are provided in the vicinity of the edge portion 26 b facing the edge portion 26 a of the mounting through hole 26. Further, the back side surface 22b of the substrate 22 is similarly provided with two electrode terminals 28 in the vicinity of the edge portion 26a of the mounting through hole 26 and three electrode terminals 28 in the vicinity of the edge portion 26b. A through hole 30 that penetrates the substrate 22 is provided outside the edge portion 26 a of the mounting through hole 26 of the substrate 22, and a conductor is provided on the inner peripheral surface of the through hole 30. The circuit patterns 24 on the side surface 22a and the back side surface 22b are electrically connected. Various electronic components 32 and 34 are connected and attached to the circuit pattern 24 at predetermined positions on the front side surface 22 a and the back side surface 22 b of the substrate 22.
[0011]
A coil component 35 is dropped into the mounting through hole 26. The coil component 35 is provided in a cylindrical shape by superposing a plurality of air-core coils 36 around which coil windings 37 are wound. The air-core coil 36 may be a fused coil to prevent deformation. An E-type core 38 is attached to the center of the overlapped air-core coil 36 so as to penetrate from the front and back of the substrate 22. The E-shaped core 38 is provided by attaching a pair of the same shape in the direction of the central axis of the air-core coil 36 and connecting the end faces to each other and magnetically coupling to constitute one coil component 35. Each lead wire 40 of the plurality of air-core coils 36 is connected to a predetermined electrode terminal 28 through the mounting through hole 26. The connection of the electrode terminal 28 is appropriately selected by soldering or the like.
[0012]
Next, the mounting structure 21 is assembled by dropping the coil component 35 so that the axial direction of the air-core coil 23 coincides with the direction of insertion of the mounting through-hole 26, and the lead wire 40 passes through the mounting through-hole 26 and the electrode terminal 28. Then, the E-type core 38 is attached to the air-core coil 36. Alternatively, the lead wire 40 may be connected to the electrode terminal 28 after the E-type core 38 is attached to the air-core coil 36 in advance. Furthermore, the E-shaped core 38 may be appropriately fixed to the inner peripheral surface of the mounting through hole 26 with an adhesive 42.
[0013]
According to the mounting structure 21 of this embodiment, the lead wire 40 is placed on the surface of the substrate 22 on the side where the predetermined electronic components 32 and 34 are located so that a large current does not flow into the through hole 30. The electrode terminals 28 on the front side surface 22a and the back side surface 22b of the substrate 22 can be selected. As a result, a large current from the air-core coil 36 does not need to flow through the through hole 30, heat generation in the through hole 30 is suppressed, energy loss is reduced, and reliability is improved. Furthermore, since the number of electrode terminals 28 can be increased to about twice that of a single side, a multi-function transformer with a large number of circuits can be realized with a small substrate. For example, it is possible to extract many outputs with one transformer, and a multi-output power supply device can be easily configured. In addition, since a large number of auxiliary control coils can be integrally provided, circuit components can be reduced, and the power supply device can be reduced in size.
[0014]
Next, a second embodiment of the present invention will be described with reference to FIG. Here, the same components as those in the above embodiment are denoted by the same reference numerals, and description thereof is omitted. In the mounting structure 44 of this embodiment, the coil component 46 is dropped into the mounting through hole 26 of the substrate 22 and attached. The coil component 46 includes a pair of bobbins 48 and 50 arranged in the axial direction, and coil windings 37 are wound around the shafts of the bobbins 48 and 50, respectively.
[0015]
On the sides of the bobbins 48 and 50, a plurality of plate-like terminals 52 projecting laterally on both sides are integrally provided. The lead wire 40 of the coil winding 37 is drawn outside the bobbins 48 and 50, inserted through the mounting through holes 26, wound around the terminals 52, and connected. Each terminal 52 is connected to the electrode of the circuit pattern 24 on the front side surface 22a and the back side surface 22b of the substrate 22 and fixed by soldering or the like. The pair of bobbins 48 and 50 are stacked in the axial direction, and an E-type core 38 is attached from the outside of the bobbins 48 and 50. The E-type core 38 passes through the centers of the bobbins 48 and 50, is provided with end faces connected to each other, and is magnetically coupled to form one coil component 46.
[0016]
The mounting structure 44 of this embodiment also has the same effect as that of the above embodiment, can be reduced in size and thickness, and can improve reliability.
[0017]
Next, a third embodiment of the present invention will be described with reference to FIGS. Here, the same components as those in the above embodiment are denoted by the same reference numerals, and description thereof is omitted. In the mounting structure 54 of this embodiment, the coil component 56 is dropped into the attachment through hole 26 of the substrate 22 and attached. The coil component 56 is provided in a cylindrical shape by overlapping a plurality of air-core coils 60 made of a rectangular wire 58. An E-shaped core 38 is attached to the outside of the stacked air-core coils 60. The E-shaped core 38 is provided by attaching a pair of the same shape in the direction of the central axis of the air-core coil 60 and connecting the end faces to each other and magnetically coupling to constitute one coil component 56.
[0018]
The coil component 56 is provided by being dropped with the axial direction of the air core coil 60 aligned with the insertion direction of the mounting through hole 26, and each lead wire 62 of the plurality of air core coils 60 is attached to a predetermined electrode terminal 28. The through-hole 26 is inserted and connected by spot welding or the like.
[0019]
According to the mounting structure 54 of this embodiment, the coil 60 of the rectangular wire 58 has the same effect as that of the above embodiment, and can be reduced in size and thickness, and the reliability can be improved. .
[0020]
In addition, the board | substrate mounting structure of the coil components for power supply devices of this invention is not limited to said each embodiment, It can change suitably. The material, shape, and number of coils of the coil component winding can be freely set.
[0021]
【The invention's effect】
In the power supply device coil component mounting structure according to the present invention, since the lead wire of the winding is attached to the electrode terminal so as to be inserted through the mounting hole of the coil component, the substrate does not pass through the through hole. It is possible to connect the lead wire of the coil winding to the electronic component on the opposite side, and with a simple structure, the reliability is high and the substrate mounting structure can be made thin. Furthermore, since the number of electrode terminals attached to the substrate can be increased as compared with the case of only one side, a multi-function power supply device with a large number of circuits can be realized.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a substrate mounting structure of a coil component for a power supply device according to an embodiment of the present invention.
FIG. 2 is a plan view of a substrate mounting structure of a coil component for a power supply device according to this embodiment.
FIG. 3 is a longitudinal sectional view of a substrate mounting structure of a coil component for a power supply device according to a second embodiment of the present invention.
FIG. 4 is a longitudinal sectional view of a substrate mounting structure of a coil component for a power supply device according to a third embodiment of the present invention.
FIG. 5 is a plan view of a substrate mounting structure of a coil component for a power supply device according to this embodiment.
FIG. 6 is a longitudinal sectional view of a substrate mounting structure of a coil component for a power supply device according to the prior art.
FIG. 7 is a longitudinal sectional view of a substrate mounting structure of a conventional coil component for a power supply device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 21 Board mounting structure 22 Board | substrate 24 Circuit pattern 26 Mounting through-hole 28 Electrode terminal 30 Through-hole 32,34 Electronic component 35 Coil component 36 Air core coil 37 Coil winding 38 E core 40 Leader line

Claims (1)

An insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through hole formed at a predetermined position of the substrate, and a coil component fitted with a clearance in the mounting through hole The coil component is configured such that a plurality of bobbins each having a plurality of terminals are inserted into the mounting through holes of the substrate, and each lead wire of the plurality of coil windings is disposed in the mounting through holes. is inserted is wound to each terminal of the bobbin, each terminal of the plurality of bobbins are fixed are respectively connected to the substrate front and back surfaces of electrodes around the attachment permeable holes, the coil windings of the plurality of bobbins A board mounting structure for a coil component for a power supply device, wherein an E-type core penetrates from the front and back sides of the substrate and is magnetically coupled to form a closed magnetic circuit, which is formed into one coil component.

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