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JP2004172361A - Substrate mounting structure of coil component for power supply device - Google Patents

Substrate mounting structure of coil component for power supply device Download PDF

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Publication number
JP2004172361A
JP2004172361A JP2002336342A JP2002336342A JP2004172361A JP 2004172361 A JP2004172361 A JP 2004172361A JP 2002336342 A JP2002336342 A JP 2002336342A JP 2002336342 A JP2002336342 A JP 2002336342A JP 2004172361 A JP2004172361 A JP 2004172361A
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JP
Japan
Prior art keywords
substrate
coil
mounting
hole
coil component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002336342A
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Japanese (ja)
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JP4021746B2 (en
Inventor
Tetsuo Sugimori
哲夫 杉森
Makoto Takashima
誠 高島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cosel Co Ltd
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Cosel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to JP2002336342A priority Critical patent/JP4021746B2/en
Publication of JP2004172361A publication Critical patent/JP2004172361A/en
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Publication of JP4021746B2 publication Critical patent/JP4021746B2/en
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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly reliable and small substrate mounting structure of a power supply device coil component, which has a simple structure. <P>SOLUTION: The structure is provided with an insulating substrate 22 where circuit patterns 24 in prescribed shapes are installed on a surface and a rear face, a fitting through hole 26 formed in a prescribed position of the substrate 22, and electrode terminals 28 formed near the fitting through hole 26 and in the circuit patterns 24 at the surface and the rear face of the substrate 22. Drawing lines 40 have a coil 35 engaged to the fitting through hole 26 with allowance, and are ends of a coil winding wire 37 of the coil component 35. The lines are connected to the electrode terminals 28 at the two sides of the substrate 22 through the fitting through hole 26. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
この発明は、コイル部品を種々の電子機器用電源装置のプリント基板に取り付けて成る電源装置用コイル部品の基板実装構造に関する。
【0002】
【従来の技術】
【特許文献1】特公平8−8180号公報
従来、電子機器の薄型化に伴いコイル部品も薄型のものが求められ、商品化されている。しかしながら、コイル部品自体を薄くしすぎると、所定の性能を得るために床面積が大きくならざるを得ない。このような課題を解決するため、例えば図6に示すように、基板1の所定位置に取付用透孔2が設けられ、取付用透孔2にコイル部品3が落とし込まれて設けられた基板実装構造があった。このコイル部品3は、ボビン4の軸に巻線5が巻き回され、ボビン4と巻線5の中心及び外側にコア6が取り付けられている。巻線5の各引出線5aは、ボビン4の両側に設けられた端子7に接続されている。端子7は、基板1の表側面1aに折り曲げられて重ねられ、基板1の表側面1aに所定形状に印刷された回路パターン8に接続されている。そして基板1は、所定位置にスル−ホール9が設けられて、基板1の表側面1aと裏側面1bの回路パターン8同士が電気的に接続されている。そして、基板1の表側面1aと裏側面1bに、各種の電子部品10,11が載置され回路パターン8に接続されている。
【0003】
また、その他に図7に示すように、基板1の取付用透孔2にコイル部品12が落とし込まれて設けられているものもある。このコイル部品12は、ブロック状のベース14が設けられ、ベース14には端子16,18がインサート成形されている。ベース14にはコア20が設けられ、コア20の周囲に巻線5が巻き回されている。巻線5の各引き出し線5aは、端子16,18に接続され、端子16,18は、基板1の裏側面1bで取付用透孔2に延出するとともに、基板1の裏側面1bに所定形状に印刷された回路パターン8に接続されている。
【0004】
また、製品の小型化に対応するため、できるだけ巻数を減少させ、作動周波数を高くするため、各巻線を分割して相互を重ね合わせたサンドイッチ構造にして、巻線間の結合係数を大きくする工夫がなされているものとして、特公平8−8108号公報に開示されている基板実装用小形変成器がある。
【0005】
【発明が解決しようとする課題】
上記従来の図6、図7に示す技術の場合、端子は基板1の一方の面のみに複数本が設けられ、基板1の表裏面の電極端子の設置スペースを多く必要としていた。さらに、取り付け強度確保のために端子はあまり細くできず、一定の太さが必要である一方で、端子同士の絶縁を確保するためには、一定間隔を離すことが必要であった。従って、限られた実装スペースでは、端子の数を増やすことができず、高密度化の妨げとなっていた。さらに、基板1の表裏面の電子部品10,11に通電するためにスルーホール9が必要であり、スルーホール9の形成箇所には他の電子部品を実装することができず、小型化の妨げとなっていた。さらに、スルーホール9に大電流を流すことになり、発熱する恐れがあり、損失増加や信頼性の低下の恐れがあった。
【0006】
また、特公平8−8108号公報の基板実装用小形変成器の場合も、基板の片面にのみコイル巻線の引き出し線が接続されるため、端子のスペースを多く必要とし、スルーホールも必要とし上記と同様の問題がある。さらに、汎用的なプリント基板の銅箔厚は約100μm以下であるという制約により、基板コイルの等価直列抵抗が大きくなり、損失が増加し効率が低下するという問題もある。また、回路数を増やすには層数が多いプリント基板を採用する必要があるが、コストアップに繋がるものである。各層のコイルを直列接続して巻き数を増やす場合、直列接続のためにスルーホールが必要となり、上記と同様にスルーホールに大きな電流が流れることにより発熱する恐れがあり、損失増加や信頼性の低下の恐れがある。
【0007】
この発明は、上記従来の技術の問題点に鑑みてなされたものであり、簡単な構造で信頼性が高く、小型化が容易に可能な電源装置用コイル部品の基板実装構造を提供することを目的とする。
【0008】
【課題を解決するための手段】
この発明は、所定形状の回路パターンが表裏面に設けられた絶縁性の基板と、上記基板の所定位置に形成された取付用透孔と、上記取付用透孔の近傍で上記基板の表裏面の回路パターンに接続された電極端子と、上記取付用透孔にゆとりを有して嵌合されるコイル部品と、上記コイル部品のコイル巻線の端部が引き出され側方に突出して位置するとともに、上記基板の表裏の電極端子に上記取付用透孔を介して接続された引出線とから成る電源装置用コイル部品の基板実装構造である。
【0009】
上記コイル部品には、複数本のコイル巻線で巻かれた複数回路のコイルと、複数の上記コイルに貫通したコアとが設けられ、上記複数回路のコイル巻線が磁気結合して一つのコイル部品に形成されているものでも良い。
【0010】
またこの発明は、所定形状の回路パターンが表裏面に設けられた絶縁性の基板と、上記基板の所定位置に形成された取付用透孔と、上記取付用透孔にゆとりを有して嵌合されるコイル部品とから成り、上記コイル部品は、各々複数の端子を備えた複数のボビンが上記基板の取付用孔に対して配置され、複数のコイル巻線の各引出線が上記ボビンの各端子に巻き付けられ、上記複数のボビンの各端子が上記取付用孔の周囲の上記基板表裏の電極に接続され、上記複数のボビンのコイル巻線にコアが貫通し磁気結合して一つのコイル部品に形成されている電源装置用コイル部品の基板実装構造である。
【0011】
【発明の実施の形態】
以下、この発明の実施形態について図面に基づいて説明する。図1,図2はこの発明の第一実施形態について説明したものであり、この実施形態の、電源装置用コイル部品の基板実装構造21は、絶縁性の基板22が設けられ、基板22の表側面22aと裏側面22bには、所定形状の回路パターン24が設けられている。
【0012】
基板22の所定位置には後述するコイル部品35が落とし込まれて取り付けられる矩形の取付用透孔26が形成されている。基板22の表側面22aには、取付用透孔26の一方の縁部26a近傍に、回路パターン24に接続された電極端子28が2個設けられている。取付用透孔26の縁部26aに対して対向する縁部26b近傍には、回路パターン24に接続された電極端子28が3個設けられている。さらに、基板22の裏側面22bにも同様に、取付用透孔26の縁部26a近傍に電極端子28が2個と、縁部26b近傍に電極端子28が3個設けられている。そして、基板22の取付用透孔26の、縁部26aの外側には、基板22を貫通するスルーホール30が設けられ、スルーホール30の内周面には導体が設けられて基板22の表側面22aと裏側面22bの回路パターン24を電気的に接続している。基板22の表側面22aと裏側面22bの所定位置には、各種の電子部品32,34がそれぞれ回路パターン24に接続されて取り付けられている。
【0013】
取付用透孔26の中には、コイル部品35が落とし込まれて設けられている。コイル部品35は、コイル巻線37が巻かれた空心コイル36が、複数個重ね合わされて筒状に設けられている。空心コイル36は、変形を防ぐために融着コイルでもよい。重ねられた空心コイル36の中心には、E型コア38が基板22の表裏から貫通して取り付けられている。E型コア38は、空心コイル36の中心軸方向に同形の一対を取り付け、互いに端面を接続させて設けられ、磁気結合して一つのコイル部品35を構成するようにしている。複数の空心コイル36の各引出線40は、所定の電極端子28に取付用透孔26を挿通して接続されている。電極端子28の接続は、ハンダ付け等適宜選択される。
【0014】
次に実装構造21の組立方法は、コイル部品35を、空心コイル23の軸方向が取付用透孔26挿通方向に一致させるように落とし込み、引出線40を取付用透孔26を経て電極端子28に接続した後、空心コイル36にE型コア38を取り付ける。または、空心コイル36にE型コア38を予め取り付けてから、引出線40を電極端子28に接続してもよい。さらに、E型コア38は、取付用透孔26の内周面に、接着剤42で適宜固定してもよい。
【0015】
この実施形態の実装構造21によれば、大きな電流がスルーホール30に流れないように、引出線40を、所定の電子部品32,34がある側の基板22の面に、取付用透孔26を挿通させて配置し、基板22の表側面22aと裏側面22bのいずれかの電極端子28を選択することができる。これにより、スルーホール30に空心コイル36からの大きな電流を流さなくても良く、スルーホール30での発熱を抑えてエネルギー損失を少なくし、信頼性が向上する。さらに、電極端子28の数を、片面のみの場合の約2倍に増やせるため、回路数が多い多機能トランスを小型の基板により実現することができる。例えば、一つのトランスで多くの出力を取り出すことが可能となり、容易に多出力電源装置を構成することができる。また、制御用の補助コイルを一体に多数設けることもできるので、回路部品の削減が可能となり、電源装置の小型化を図ることができる。
【0016】
次にこの発明の第二実施形について図3に基づいて説明する。ここで上記実施形態と同様の構成は同一符号を付して説明を省略する。この実施形態の実装構造44は、基板22の取付用透孔26に、コイル部品46が落とし込まれて取り付けられている。コイル部品46は、一対のボビン48,50が軸方向に並んで設けられ、ボビン48,50の軸にはコイル巻線37がそれぞれ巻き回されている。
【0017】
ボビン48,50の側方には、両側の側方へ突出した板状の複数の端子52が一体に設けられている。そして、ボビン48,50の外側には、コイル巻線37の引出線40が引き出され、取付用透孔26を挿通して各端子52に巻き回されて接続されている。各端子52は、基板22の表側面22a及び裏側面22bの回路パターン24の電極に各々接続されてハンダ付け等により固定されている。一対のボビン48,50は、軸方向に重ねられ、ボビン48,50の外側から、E型コア38が取り付けられている。E型コア38は、ボビン48,50の中心を貫通し、互いに端面を接続させて設けられ、磁気結合して一つのコイル部品46を構成するようにしている。
【0018】
この実施形態の実装構造44によっても、上記実施の形態と同様の効果を有し、小型化と薄型化が可能であり、また信頼性を向上させることができる。
【0019】
次にこの発明の第三実施形態について図4,図5に基づいて説明する。ここで上記実施形態と同様の構成は同一符号を付して説明を省略する。この実施形態の実装構造54は、基板22の取付用透孔26に、コイル部品56が落とし込まれて取り付けられている。コイル部品56は、平角線58で作られた空心コイル60が複数個重ねあわされて筒状に設けられている。重ねられた各空心コイル60の外側には、E型コア38が取り付けられている。E型コア38は、空心コイル60の中心軸方向に同形の一対を取り付け、互いに端面を接続させて設けられ、磁気結合して一つのコイル部品56を構成するようにしている。
【0020】
コイル部品56は、空心コイル60の軸方向を取付用透孔26の挿通方向に一致させて落とし込まれて設けられ、複数の空心コイル60の各引出線62は、所定の電極端子28に取付用透孔26を挿通して、スポット溶接等により接続されている。
【0021】
この実施形態の実装構造54によれば、平角線58のコイル60においても上記実施の形態と同様の効果を有し、小型化と薄型化が可能であり、また信頼性を向上させることができる。
【0022】
なお、この発明の電源装置用コイル部品の基板実装構造は、上記各実施の形態に限定されず、適宜変更可能である。コイル部品の巻線の素材、形状、コイルの数など自由に設定することができる。
【0023】
【発明の効果】
この発明の電源装置用コイル部品の基板実装構造は、コイル部品の取付用透孔を挿通するようにして巻線の引出線が電極端子に取り付けられているので、スルーホールを経由せずに基板の反対側の電子部品にコイル巻線の引出線を接続することが可能であり、簡単な構造で、信頼性が高く、基板実装構造を薄型にすることもできる。さらに、基板に取り付ける電極端子の数を、片面のみの場合よりも多くすることができるため、回路数が多い多機能電源装置を実現することができる。
【図面の簡単な説明】
【図1】この発明の一実施形態の電源装置用コイル部品の基板実装構造の縦断面図である。
【図2】この実施形態の電源装置用コイル部品の基板実装構造の平面図である。
【図3】この発明の第二実施形態の電源装置用コイル部品の基板実装構造の縦断面図である。
【図4】この発明の第三実施形態の電源装置用コイル部品の基板実装構造の縦断面図である。
【図5】この実施形態の電源装置用コイル部品の基板実装構造の平面図である。
【図6】従来の技術の電源装置用コイル部品の基板実装構造の縦断面図である。
【図7】従来の技術の電源装置用コイル部品の基板実装構造の縦断面図である。
【符号の説明】
21 基板実装構造
22 基板
24 回路パターン
26 取付用透孔
28 電極端子
30 スルーホール
32,34 電子部品
35 コイル部品
36 空心コイル
37 コイル巻線
38 E型コア
40 引出線
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate mounting structure of a coil device for a power supply device in which a coil component is mounted on a printed circuit board of a power supply device for various electronic devices.
[0002]
[Prior art]
[Patent Document 1] Japanese Patent Publication No. 8-8180 Conventionally, as electronic devices have become thinner, thinner coil components have been demanded and commercialized. However, if the coil component itself is too thin, the floor area must be increased in order to obtain predetermined performance. In order to solve such a problem, for example, as shown in FIG. 6, a mounting hole 2 is provided at a predetermined position of a substrate 1, and a coil component 3 is provided by being dropped into the mounting hole 2. There was a mounting structure. In the coil component 3, a winding 5 is wound around a bobbin 4, and a core 6 is attached to the center and outside of the bobbin 4 and the winding 5. Each lead 5 a of the winding 5 is connected to terminals 7 provided on both sides of the bobbin 4. The terminal 7 is folded and superimposed on the front surface 1 a of the substrate 1 and is connected to a circuit pattern 8 printed in a predetermined shape on the front surface 1 a of the substrate 1. The substrate 1 is provided with a through hole 9 at a predetermined position, and the circuit patterns 8 on the front surface 1a and the back surface 1b of the substrate 1 are electrically connected to each other. Various electronic components 10 and 11 are mounted on the front side 1 a and the back side 1 b of the substrate 1 and connected to the circuit pattern 8.
[0003]
In addition, as shown in FIG. 7, there is another type in which the coil component 12 is provided by being dropped into the mounting through hole 2 of the substrate 1. The coil component 12 is provided with a block-shaped base 14, on which terminals 16 and 18 are insert-molded. A core 20 is provided on the base 14, and the winding 5 is wound around the core 20. Each lead wire 5a of the winding 5 is connected to terminals 16 and 18, and the terminals 16 and 18 extend into the mounting through hole 2 on the back side 1b of the board 1 and are provided on the back side 1b of the board 1 at predetermined intervals. It is connected to a circuit pattern 8 printed in a shape.
[0004]
In addition, in order to respond to the miniaturization of products, the number of turns is reduced as much as possible, and in order to increase the operating frequency, each winding is divided into a sandwich structure in which they are overlapped with each other to increase the coupling coefficient between the windings. A small transformer for mounting on a board is disclosed in Japanese Patent Publication No. 8-8108.
[0005]
[Problems to be solved by the invention]
In the conventional technique shown in FIGS. 6 and 7, a plurality of terminals are provided only on one surface of the substrate 1, and a large installation space for the electrode terminals on the front and back surfaces of the substrate 1 is required. Further, the terminals cannot be made very thin to secure the mounting strength, and a certain thickness is required. On the other hand, in order to ensure insulation between the terminals, it is necessary to keep a certain interval. Therefore, in a limited mounting space, the number of terminals cannot be increased, which hinders high density. Further, through-holes 9 are required to supply electric current to the electronic components 10 and 11 on the front and back surfaces of the substrate 1, and other electronic components cannot be mounted at the positions where the through-holes 9 are formed. It was. Furthermore, a large current flows through the through-hole 9, which may cause heat generation, which may increase loss and decrease reliability.
[0006]
Also, in the case of the small transformer for board mounting disclosed in Japanese Patent Publication No. 8-8108, since the lead wire of the coil winding is connected to only one side of the board, a large space for terminals and a through hole are required. There is the same problem as above. Further, there is a problem that the equivalent series resistance of the substrate coil increases, the loss increases, and the efficiency decreases due to the restriction that the copper foil thickness of the general-purpose printed circuit board is about 100 μm or less. To increase the number of circuits, it is necessary to use a printed circuit board having a large number of layers, but this leads to an increase in cost. When the number of windings is increased by connecting the coils of each layer in series, a through hole is necessary for the series connection, and a large current flows through the through hole as in the above, which may cause heat generation, increasing loss and increasing reliability. There is a risk of decline.
[0007]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems of the related art, and has as its object to provide a substrate mounting structure of a coil component for a power supply device which has a simple structure, has high reliability, and can be easily miniaturized. Aim.
[0008]
[Means for Solving the Problems]
The present invention provides an insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through hole formed at a predetermined position on the substrate, and a front and back surface of the substrate near the mounting through hole. An electrode terminal connected to the circuit pattern of (1), a coil component which is loosely fitted into the mounting through hole, and an end of a coil winding of the coil component is pulled out and positioned to protrude to the side. In addition, the present invention provides a substrate mounting structure for a coil device for a power supply device, comprising a lead wire connected to the electrode terminals on the front and back of the substrate via the mounting holes.
[0009]
The coil component is provided with a coil of a plurality of circuits wound by a plurality of coil windings and a core penetrating the plurality of coils, and the coil windings of the plurality of circuits are magnetically coupled to form one coil. It may be formed on a part.
[0010]
The present invention also provides an insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through-hole formed at a predetermined position on the substrate, and a fitting in the mounting through-hole with a margin. And a plurality of bobbins each having a plurality of terminals are arranged with respect to the mounting hole of the substrate, and each lead wire of the plurality of coil windings is connected to the bobbin. Wound around each terminal, each terminal of the plurality of bobbins is connected to the electrodes on the front and back of the substrate around the mounting hole, and a core passes through the coil windings of the plurality of bobbins and is magnetically coupled to form one coil. 4 is a circuit board mounting structure of a power supply coil component formed on a component.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIGS. 1 and 2 illustrate a first embodiment of the present invention. In this embodiment, a substrate mounting structure 21 of a coil component for a power supply device is provided with an insulating substrate 22. A circuit pattern 24 having a predetermined shape is provided on the side surface 22a and the back side surface 22b.
[0012]
At a predetermined position of the substrate 22, a rectangular mounting hole 26 into which a coil component 35 described later is dropped and mounted is formed. Two electrode terminals 28 connected to the circuit pattern 24 are provided on the front side surface 22a of the substrate 22 near one edge 26a of the mounting through hole 26. Three electrode terminals 28 connected to the circuit pattern 24 are provided in the vicinity of the edge 26b facing the edge 26a of the mounting through hole 26. Similarly, two electrode terminals 28 are provided near the edge 26a of the mounting hole 26 and three electrode terminals 28 are provided near the edge 26b on the rear side surface 22b of the substrate 22. A through hole 30 penetrating the substrate 22 is provided outside the edge portion 26 a of the mounting through hole 26 of the substrate 22, and a conductor is provided on an inner peripheral surface of the through hole 30 so that the surface of the substrate 22 The circuit pattern 24 on the side surface 22a and the back side surface 22b is electrically connected. Various electronic components 32 and 34 are attached to predetermined positions on the front side surface 22a and the back side surface 22b of the board 22 by being connected to the circuit pattern 24, respectively.
[0013]
A coil component 35 is provided in the mounting through hole 26. The coil component 35 is provided in a cylindrical shape with a plurality of air core coils 36 around which a coil winding 37 is wound superposed. The air core coil 36 may be a fusion coil to prevent deformation. An E-shaped core 38 is attached to the center of the superposed air-core coils 36 so as to penetrate from the front and back of the substrate 22. The E-shaped core 38 is provided with a pair of the same shape attached in the center axis direction of the air-core coil 36 and provided with their end faces connected to each other, and is magnetically coupled to form one coil component 35. Each lead wire 40 of the plurality of air-core coils 36 is connected to a predetermined electrode terminal 28 through the mounting through hole 26. The connection of the electrode terminal 28 is appropriately selected, such as soldering.
[0014]
Next, the method of assembling the mounting structure 21 is as follows. The coil component 35 is dropped so that the axial direction of the air-core coil 23 matches the insertion direction of the mounting through-hole 26, and the lead wire 40 is passed through the mounting through-hole 26 and the electrode terminal 28. After that, the E-shaped core 38 is attached to the air-core coil 36. Alternatively, the lead wire 40 may be connected to the electrode terminal 28 after the E-shaped core 38 is attached to the air core coil 36 in advance. Further, the E-shaped core 38 may be appropriately fixed to the inner peripheral surface of the mounting through-hole 26 with an adhesive 42.
[0015]
According to the mounting structure 21 of this embodiment, the lead wire 40 is provided on the surface of the substrate 22 on the side where the predetermined electronic components 32 and 34 are provided so that a large current does not flow through the through hole 30. Can be inserted, and any one of the electrode terminals 28 on the front side surface 22a and the back side surface 22b of the substrate 22 can be selected. As a result, it is not necessary to flow a large current from the air-core coil 36 to the through hole 30, heat generation in the through hole 30 is suppressed, energy loss is reduced, and reliability is improved. Furthermore, since the number of electrode terminals 28 can be increased to about twice that of the case of only one side, a multifunctional transformer having a large number of circuits can be realized with a small-sized substrate. For example, it is possible to take out many outputs with one transformer, and it is possible to easily configure a multi-output power supply device. Further, since a large number of control auxiliary coils can be provided integrally, the number of circuit components can be reduced, and the size of the power supply device can be reduced.
[0016]
Next, a second embodiment of the present invention will be described with reference to FIG. Here, the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. In the mounting structure 44 of this embodiment, a coil component 46 is dropped and mounted in the mounting through hole 26 of the substrate 22. The coil component 46 is provided with a pair of bobbins 48 and 50 arranged in the axial direction, and the coil winding 37 is wound around the axes of the bobbins 48 and 50, respectively.
[0017]
On the sides of the bobbins 48 and 50, a plurality of plate-shaped terminals 52 projecting to both sides are integrally provided. A lead wire 40 of the coil winding 37 is drawn out of the bobbins 48 and 50, and is wound around and connected to each terminal 52 through the mounting through hole 26. Each terminal 52 is connected to an electrode of the circuit pattern 24 on the front side surface 22a and the back side surface 22b of the substrate 22, and is fixed by soldering or the like. The pair of bobbins 48 and 50 are overlapped in the axial direction, and the E-shaped core 38 is attached from outside the bobbins 48 and 50. The E-shaped core 38 penetrates the centers of the bobbins 48 and 50, is provided with their end faces connected to each other, and is magnetically coupled to form one coil component 46.
[0018]
According to the mounting structure 44 of this embodiment, the same effects as those of the above embodiment can be obtained, miniaturization and thinning can be achieved, and reliability can be improved.
[0019]
Next, a third embodiment of the present invention will be described with reference to FIGS. Here, the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. In the mounting structure 54 of this embodiment, a coil component 56 is dropped and mounted in the mounting through hole 26 of the substrate 22. The coil component 56 is provided in a tubular shape by stacking a plurality of air-core coils 60 made of a flat wire 58. An E-shaped core 38 is attached to the outside of each superimposed air core coil 60. The E-shaped core 38 is provided with a pair of the same shape attached in the direction of the center axis of the air-core coil 60, provided with their end faces connected to each other, and magnetically coupled to form one coil component 56.
[0020]
The coil component 56 is provided by being dropped so that the axial direction of the air-core coil 60 matches the insertion direction of the mounting through-hole 26, and each lead wire 62 of the plurality of air-core coils 60 is attached to a predetermined electrode terminal 28. And is connected by spot welding or the like.
[0021]
According to the mounting structure 54 of this embodiment, the coil 60 having the flat wire 58 has the same effects as those of the above-described embodiment, and can be reduced in size and thickness, and the reliability can be improved. .
[0022]
The substrate mounting structure of the coil device for a power supply device of the present invention is not limited to the above embodiments, and can be appropriately changed. The material, shape, number of coils, etc. of the windings of the coil component can be freely set.
[0023]
【The invention's effect】
In the substrate mounting structure of the coil device for a power supply device according to the present invention, since the lead wire of the winding is attached to the electrode terminal so as to pass through the mounting hole of the coil component, the substrate can be mounted without passing through the through hole. It is possible to connect the lead wire of the coil winding to the electronic component on the opposite side, and to achieve a simple structure, high reliability, and a thinner board mounting structure. Further, since the number of electrode terminals attached to the substrate can be increased as compared with the case of only one side, a multifunctional power supply device having a large number of circuits can be realized.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a substrate mounting structure of a power supply coil component according to an embodiment of the present invention.
FIG. 2 is a plan view of a substrate mounting structure of the coil component for a power supply device of the embodiment.
FIG. 3 is a longitudinal sectional view of a substrate mounting structure of a coil device for a power supply device according to a second embodiment of the present invention.
FIG. 4 is a longitudinal sectional view of a substrate mounting structure of a power supply coil component according to a third embodiment of the present invention.
FIG. 5 is a plan view of a substrate mounting structure of the coil component for a power supply device of the embodiment.
FIG. 6 is a longitudinal sectional view of a conventional board mounting structure of a power supply coil component for a power supply device.
FIG. 7 is a longitudinal sectional view of a conventional board mounting structure of a power supply coil component for a power supply device.
[Explanation of symbols]
Reference Signs List 21 board mounting structure 22 board 24 circuit pattern 26 mounting hole 28 electrode terminal 30 through hole 32, 34 electronic component 35 coil component 36 air core coil 37 coil winding 38 E-type core 40 lead wire

Claims (3)

所定形状の回路パターンが表裏面に設けられた絶縁性の基板と、上記基板の所定位置に形成された取付用透孔と、上記取付用透孔の近傍で上記基板の表裏面の回路パターンに接続された電極端子と、上記取付用透孔にゆとりを有して嵌合されるコイル部品と、上記コイル部品のコイル巻線の端部が引き出され側方に突出して位置するとともに、上記基板の表裏の電極端子に上記取付用透孔を介して接続された引出線とから成ることを特徴とする電源装置用コイル部品の基板実装構造。An insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through hole formed at a predetermined position on the substrate, and a circuit pattern on the front and back surfaces of the substrate in the vicinity of the mounting through hole. The connected electrode terminal, a coil component which is loosely fitted in the mounting hole, and an end of a coil winding of the coil component is pulled out and laterally protruded, and the substrate And a lead wire connected to the front and back electrode terminals via the mounting through-holes. 上記コイル部品には、複数本のコイル巻線で巻かれた複数回路のコイルと、複数の上記コイルに貫通したコアとが設けられ、上記複数回路のコイル巻線が磁気結合して一つのコイル部品に形成されていることを特徴とする請求項1記載の電源装置用コイル部品の基板実装構造。The coil component is provided with a plurality of circuit coils wound by a plurality of coil windings, and a core penetrating the plurality of coils. The coil windings of the plurality of circuits are magnetically coupled to form one coil. The substrate mounting structure for a coil component for a power supply device according to claim 1, wherein the component is formed on a component. 所定形状の回路パターンが表裏面に設けられた絶縁性の基板と、上記基板の所定位置に形成された取付用透孔と、上記取付用透孔にゆとりを有して嵌合されるコイル部品とから成り、上記コイル部品は、各々複数の端子を備えた複数のボビンが上記基板の取付用孔に対して配置され、複数のコイル巻線の各引出線が上記ボビンの各端子に巻き付けられ、上記複数のボビンの各端子が上記取付用孔の周囲の上記基板表裏の電極に接続され、上記複数のボビンのコイル巻線にコアが貫通し磁気結合して一つのコイル部品に形成されていることを特徴とする電源装置用コイル部品の基板実装構造。An insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through-hole formed at a predetermined position on the substrate, and a coil component fitted with a clearance in the mounting through-hole In the coil component, a plurality of bobbins each having a plurality of terminals are arranged with respect to the mounting hole of the board, and each lead wire of the plurality of coil windings is wound around each terminal of the bobbin. Each terminal of the plurality of bobbins is connected to electrodes on the front and back of the substrate around the mounting hole, and a core penetrates and is magnetically coupled to the coil windings of the plurality of bobbins to form a single coil component. A substrate mounting structure for a coil component for a power supply device.
JP2002336342A 2002-11-20 2002-11-20 Circuit board mounting structure for power supply coil components Expired - Fee Related JP4021746B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101223253B1 (en) 2010-04-19 2013-01-17 리엔 창 일렉트로닉 엔터프라이즈 컴퍼니 리미티드 movable transformer embedded into an opening of a PCB and a method of installing the same
JP2013219396A (en) * 2013-07-24 2013-10-24 Mitsubishi Electric Corp Circuit board
JP2013219395A (en) * 2013-07-24 2013-10-24 Mitsubishi Electric Corp Circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101223253B1 (en) 2010-04-19 2013-01-17 리엔 창 일렉트로닉 엔터프라이즈 컴퍼니 리미티드 movable transformer embedded into an opening of a PCB and a method of installing the same
JP2013219396A (en) * 2013-07-24 2013-10-24 Mitsubishi Electric Corp Circuit board
JP2013219395A (en) * 2013-07-24 2013-10-24 Mitsubishi Electric Corp Circuit board

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