TWI423278B - In-line positioning structure of conductive sheet for planar - Google Patents
In-line positioning structure of conductive sheet for planar Download PDFInfo
- Publication number
- TWI423278B TWI423278B TW98108554A TW98108554A TWI423278B TW I423278 B TWI423278 B TW I423278B TW 98108554 A TW98108554 A TW 98108554A TW 98108554 A TW98108554 A TW 98108554A TW I423278 B TWI423278 B TW I423278B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- conductive sheet
- multilayer circuit
- conductive
- annular portion
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Description
本發明係關於一種可防止導電片彎曲翹起的平面式電磁感應元件之導電片串聯定位結構。The present invention relates to a series arrangement of conductive sheets of a planar electromagnetic induction element capable of preventing the conductive sheet from being bent and lifted.
電磁感應元件,例如電感器或變壓器等,其傳統上的做法是於一磁芯上繞設一次側線圈及二次側線圈,利用一次側線圈中電流及電壓的變化,於磁芯上產生變化的磁場,進而激發二次側線圈產生變化的電流及電壓;然而,上述現有技術之電磁感應元件的體積大且難以進一步縮小,是現今各式電子裝置力求輕、薄、短、小之下的阻礙,此外,線圈繞設的步驟難以利用機器自動化進行,更導致其製作上的不便以及造價的高昂。Electromagnetic induction components, such as inductors or transformers, are conventionally practiced by winding a primary side coil and a secondary side coil on a magnetic core, and utilizing changes in current and voltage in the primary side coil to cause changes on the magnetic core. The magnetic field, in turn, excites the secondary side coil to produce varying currents and voltages; however, the above-described prior art electromagnetic induction elements are bulky and difficult to further shrink, and today various electronic devices strive to be light, thin, short, and small. Obstruction, in addition, the step of coil winding is difficult to perform by machine automation, which leads to inconvenience in manufacturing and high cost.
是以,有人設計出一種平面式電磁感應元件,其係利用多個層疊設置的弧形導電片間以並聯或串聯方式相接,再於各導電片之間軸向穿設一磁芯,藉此形成線圈繞設的效果,俾達到縮小該電磁感應元件的體積以及簡化該電子感應元件之製作方式的目的。Therefore, a planar electromagnetic induction element is designed, which uses a plurality of stacked arc-shaped conductive sheets to be connected in parallel or in series, and then a magnetic core is axially inserted between the conductive sheets. This forms the effect of coil winding, which achieves the purpose of reducing the volume of the electromagnetic induction element and simplifying the manner in which the electronic sensing element is fabricated.
參見第三圖所示,為一現有技術之平面式電磁感應元件(以變壓器為例),其包含有一多層電路板(50),二導電片(60)及二磁芯(80);Referring to the third figure, a prior art planar electromagnetic induction component (taking a transformer as an example) includes a multilayer circuit board (50), two conductive sheets (60) and two magnetic cores (80);
進一步參見第四圖所示,該多層電路板(50)上貫穿形成有一穿孔(51),且包含有複數層交錯設置的絕緣層(52)以及導電層(53),每一導電層(53)呈一環繞該穿孔(51)的弧形片體而具有一第一端(531)及一第二端(532),其中,當兩相鄰導電層(53)之第一端(531)對應相接且第二端(532)對應相接時,該二導電層(53)之間係以並聯方式相連,而當一導電層(53)之第一端(531)與另一導電層(53)之第二端(532)對應相接時,則該二導電層(53)之間係以串聯方式相連;Referring further to the fourth figure, a multi-layer circuit board (50) is formed with a through hole (51) therethrough, and includes a plurality of layers of insulating layers (52) and a conductive layer (53), each conductive layer (53). Having a curved body surrounding the perforation (51) and having a first end (531) and a second end (532), wherein the first end (531) of the two adjacent conductive layers (53) When the corresponding ends are connected and the second ends (532) are correspondingly connected, the two conductive layers (53) are connected in parallel, and when the first end (531) of one conductive layer (53) is connected to another conductive layer When the second end (532) of (53) is correspondingly connected, the two conductive layers (53) are connected in series;
導電片(60)亦呈一弧形片體而具有一第一端(61)及一第二端(62),其係分別設於該多層電路板(50)兩相對側的導電層(53)上,其中,當該導電片(60)與該多層電路板(50)之導電層(53)以並聯方式相接時,係使該二者間以焊接方式相互貼附,而當該導電片(60)與該多層電路板(50)之導電層(53)以串聯方式相接時(如第四圖所示),則於該二者間加設一絕緣膜(70),並使該導電片(60)的第二端(62)與該導電層(53)的第一端(531)以焊接方式相接,導電片(60)的第一端(61)則與該多層電路板(50)上所設的一焊墊(54)以焊接方式相接,並透過該焊墊(54)與該多層電路板(50)內的電路電性相接;The conductive sheet (60) also has a curved body and has a first end (61) and a second end (62) respectively disposed on opposite sides of the multilayer circuit board (50). Wherein, when the conductive sheet (60) and the conductive layer (53) of the multilayer circuit board (50) are connected in parallel, the two are attached to each other by soldering, and when the conductive When the sheet (60) and the conductive layer (53) of the multilayer circuit board (50) are connected in series (as shown in the fourth figure), an insulating film (70) is interposed therebetween, and The second end (62) of the conductive sheet (60) is soldered to the first end (531) of the conductive layer (53), and the first end (61) of the conductive sheet (60) is connected to the multilayer circuit A solder pad (54) disposed on the board (50) is soldered, and electrically connected to the circuit in the multilayer circuit board (50) through the solder pad (54);
磁芯(80)係於一底板(81)中央突伸有一磁柱(82),該二磁芯(80)分別設於該多層電路板(50)的兩相對側,使其磁柱(82)軸向穿設於該多層電路板(50)之穿孔(51)間,並藉該底板(82)將前述多層電路板(50)、絕緣膜(70)及導電片(60)夾合定位,組合而成一平面式變壓器。The magnetic core (80) is protruded from a bottom plate (81) by a magnetic column (82), and the two magnetic cores (80) are respectively disposed on opposite sides of the multilayer circuit board (50) to make the magnetic column (82) The axial direction is disposed between the through holes (51) of the multilayer circuit board (50), and the multi-layer circuit board (50), the insulating film (70) and the conductive sheet (60) are sandwiched and positioned by the bottom plate (82) , combined into a planar transformer.
惟,當前述導電片(60)以串聯方式設於該多層電路板(50)上時,僅於其二端部(61)(62)進行焊接,而導電片(60)所承受之應力集中在該二端部(61)(62)的結果將會導致導電片(60)其他部位彎曲翹起,從而因變形而損壞,故現有技術之串聯式平面電磁感應元件中導電片的定位方式時有其待進一步改進之處。However, when the conductive sheets (60) are arranged in series on the multilayer circuit board (50), only the two ends (61) (62) are soldered, and the conductive sheets (60) are subjected to stress concentration. The result of the two end portions (61) (62) will cause other portions of the conductive sheet (60) to be bent and lifted, thereby being damaged by deformation, so that the positioning method of the conductive sheets in the prior art tandem planar electromagnetic induction element is There are areas for further improvement.
有鑑於前述現有技術的不足,本發明提供一種平面式電磁感應元件之導電片串聯定位結構,希藉此設計解決目前現有技術之平面式電磁感應元件中,一導電片以串聯方式設於一多層電路板上時,會因應力集中在其端部而導致該導電片的其他部位彎曲翹起的缺點。In view of the above-mentioned deficiencies of the prior art, the present invention provides a series arrangement structure of conductive sheets of a planar electromagnetic induction element, which is designed to solve the prior art planar electromagnetic induction elements, wherein a conductive sheet is arranged in series in one more When the layer is on the circuit board, the stress is concentrated on the end portion thereof, which causes the other portion of the conductive sheet to be bent and lifted.
為了達到上述的發明目的,本發明所利用的技術手段係於一平面式電磁感應元件上加設一定位機構,其係設置於一多層電路板與一導電片的環型部之間,藉此將導電片的環形部與多層電路板相互結合固定,該定位機構的具體構造係包含有設置在多層電路板上的至少一輔助焊墊,以及突伸成型於該導電片上的至少一定位凸部,該二者間係對應相接。In order to achieve the above object, the technical means utilized by the present invention is to add a positioning mechanism to a planar electromagnetic induction component, which is disposed between a multilayer circuit board and a ring portion of a conductive sheet. The inner portion of the conductive sheet is fixedly coupled to the multi-layer circuit board. The specific structure of the positioning mechanism includes at least one auxiliary pad disposed on the multilayer circuit board, and at least one positioning protrusion protrudingly formed on the conductive sheet. Department, the two are correspondingly connected.
藉由上述導電片之定位凸部與電路板上之輔助焊墊相接之設計,可使該導電片之各部位平均受力,進而穩定地設置於該多層電路板上,有效達到避免導電片彎曲翹起,防止該導電片變形損壞的目的。By designing the positioning convex portion of the conductive sheet to be in contact with the auxiliary soldering pad on the circuit board, the portions of the conductive sheet can be uniformly applied to the multilayer circuit board, thereby effectively avoiding the conductive sheet. Bending and lifting to prevent deformation and damage of the conductive sheet.
參見第一圖所示之一平面式電磁感應元件(以變壓器為例)之導電片串聯定位結構,其包含有一多層電路板(10)、至少一絕緣膜(20)、至少一導電片(30)及一定位機構(40),其中:Referring to the first embodiment of the planar electromagnetic induction component (taking a transformer as an example), the conductive sheet series positioning structure comprises a multilayer circuit board (10), at least one insulating film (20), and at least one conductive sheet (30). And a positioning mechanism (40), wherein:
多層電路板(10)上貫穿成型有一穿孔(11),且包含有複數層交錯設置的絕緣層(12)以及導電層(13),並於至少一側面上設有一焊墊(14),該導電層(13)呈一弧形片體而具有一環形部(133)、一第一端(131)與一第二端(132),各導電層(13)之間分別以該第一端(131)及第二端(132)對應相接,該環形部(133)環繞於多層電路板(10)之穿孔(11)設置,該焊墊(14)對應成型於該導電層(13)之第一端(131)的旁側,且與該多層電路板(10)內的電路電性相接;A multi-layer circuit board (10) is formed with a through hole (11), and comprises a plurality of layers of insulating layers (12) and a conductive layer (13), and a pad (14) is disposed on at least one side thereof. The conductive layer (13) has an arc-shaped body and has a ring portion (133), a first end (131) and a second end (132), and the first end is respectively disposed between the conductive layers (13) (131) and the second end (132) are correspondingly connected, the annular portion (133) is disposed around the through hole (11) of the multilayer circuit board (10), and the solder pad (14) is correspondingly formed on the conductive layer (13) a side of the first end (131) and electrically connected to the circuit in the multilayer circuit board (10);
絕緣膜(20)設置於該多層電路板(10)之導電層(13)的環形部(133)上;An insulating film (20) is disposed on the annular portion (133) of the conductive layer (13) of the multilayer circuit board (10);
導電片(30)設於該絕緣膜(20)上,其係呈一弧形片體而具有一環形部(33)、一第一端(31)及一第二端(32),該環形部(33)對應設置於該絕緣膜(20)上,使導電片(30)之環形部(33)與多層電路板(10)之導電層(13)的環形部(133)之間形成絕緣,導電片(30)之第一端(31)與該多層電路板(10)之焊墊(14)對應相接,導電片(30)之第二端(32)與該多層電路板(10)之導電層(13)的第一端(131)對應相接;The conductive sheet (30) is disposed on the insulating film (20) and has an arc-shaped sheet body having an annular portion (33), a first end (31) and a second end (32). The portion (33) is disposed on the insulating film (20) to insulate between the annular portion (33) of the conductive sheet (30) and the annular portion (133) of the conductive layer (13) of the multilayer circuit board (10). The first end (31) of the conductive sheet (30) is correspondingly connected to the solder pad (14) of the multilayer circuit board (10), and the second end (32) of the conductive sheet (30) and the multilayer circuit board (10) The first end (131) of the conductive layer (13) corresponds to each other;
定位機構(40)設置在多層電路板(10)與導電片(30)的環形部(33)間,藉此將導電片(30)的環形部(33)與多層電路板(10)相互結合固定,此定位機構(40)包含有至少一輔助焊墊(41)及至少一定位凸部(42),該輔助焊墊(41)設置在多層電路板(10)的至少一側面上,且係成型於導電層(13)之環形部(133)的旁側,該定位凸部(42)突伸成型在導電片(30)之環形部(33)上,並且與該多層電路板(10)上的輔助焊墊(41)對應相接,於本發明之較佳實施例中,該輔助焊墊(41)可不與該多層電路板(10)內的電路電性相接,而僅作為與導電片(30)上之定位凸部(42)相互固定之用,又,該輔助焊墊(41)亦可與該多層電路板(10)內的電路電性相接,以進一步具有接地的功效;The positioning mechanism (40) is disposed between the multilayer circuit board (10) and the annular portion (33) of the conductive sheet (30), thereby combining the annular portion (33) of the conductive sheet (30) with the multilayer circuit board (10) Fixed, the positioning mechanism (40) includes at least one auxiliary pad (41) and at least one positioning protrusion (42) disposed on at least one side of the multilayer circuit board (10), and Formed on the side of the annular portion (133) of the conductive layer (13), the positioning protrusion (42) is formed on the annular portion (33) of the conductive sheet (30), and the multilayer circuit board (10) The auxiliary pad (41) on the substrate is correspondingly connected. In the preferred embodiment of the present invention, the auxiliary pad (41) may not be electrically connected to the circuit in the multilayer circuit board (10), but only And the positioning convex portion (42) on the conductive sheet (30) is fixed to each other, and the auxiliary soldering pad (41) can also be electrically connected to the circuit in the multilayer circuit board (10) to further have a grounding. Efficacy
又前述定位凸部(42)與輔助焊墊(41)相互結合處,其較佳的設置處係位在該導電片(30)之環形部(33)的中央位置處,該中央位置分別與導電片(30)的第一端(31)及第二端(32)的距離為相等。Further, the positioning protrusion (42) and the auxiliary pad (41) are coupled to each other, and the preferred arrangement is located at a central position of the annular portion (33) of the conductive sheet (30), and the central position is respectively The distance between the first end (31) and the second end (32) of the conductive sheet (30) is equal.
如上所述之設計,該導電片(30)除了以第一端(31)與該多層電路板(10)之焊墊(14)相接,以及以第二端(32)與多層電路板(10)之導電層(13)的第一端(131)相接而達到串聯的效果之外,更進一步以該定位凸部(34)與多層電路板(10)上的輔助焊墊(15)相接,藉此使導電片(30)的各部位受力平均,以穩定地設置於該多層電路板(10)上,有效達到避免導電片(30)因受力不均而彎曲翹起,進而防止該導電片(30)因變形而損壞的效果。In the above design, the conductive sheet (30) is connected to the pad (14) of the multilayer circuit board (10) with the first end (31), and the second end (32) and the multilayer circuit board ( 10) The first end (131) of the conductive layer (13) is connected to achieve the effect of series connection, and further the auxiliary protrusion (34) and the auxiliary pad (15) on the multilayer circuit board (10) Therefore, the respective portions of the conductive sheet (30) are force-averaged to be stably disposed on the multilayer circuit board (10), thereby effectively preventing the conductive sheet (30) from being bent and lifted due to uneven force. Further, the effect of the conductive sheet (30) being damaged by deformation is prevented.
以上所述僅是本發明的較佳實施方式而已,並非對本發明作任何形式上的限制,雖然本發明已以較佳實施方式揭露如上,然而並非用以限定本發明,任何熟悉本專業的技術人員,在不脫離本發明技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施方式,但凡是未脫離本發明技術方案的內容,依據本發明的技術實質對以上實施方式所作的任何簡單修改、等同變化與修飾,均仍屬於本發明技術方案的範圍內。The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention A person skilled in the art can make some modifications or modifications to the equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. It is still within the scope of the technical solution of the present invention to make any simple modifications, equivalent changes and modifications to the above embodiments.
(10)...多層電路板(10). . . Multi-layer circuit board
(11)...穿孔(11). . . perforation
(12)...絕緣層(12). . . Insulation
(13)...導電層(13). . . Conductive layer
(131)...第一端(131). . . First end
(132)...第二端(132). . . Second end
(133)...環形部(133). . . Ring
(14)...焊墊(14). . . Solder pad
(20)...絕緣膜(20). . . Insulating film
(30)...導電片(30). . . Conductive sheet
(31)...第一端(31). . . First end
(32)...第二端(32). . . Second end
(33)...環形部(33). . . Ring
(40)...定位機構(40). . . Positioning mechanism
(41)...輔助焊墊(41). . . Auxiliary pad
(42)...定位凸部(42). . . Positioning convex
(50)...多層電路板(50). . . Multi-layer circuit board
(51)...穿孔(51). . . perforation
(52)...絕緣層(52). . . Insulation
(53)...導電層(53). . . Conductive layer
(531)...第一端(531). . . First end
(532)...第二端(532). . . Second end
(54)...焊墊(54). . . Solder pad
(60)...導電片(60). . . Conductive sheet
(61)...第一端(61). . . First end
(62)...第二端(62). . . Second end
(70)...絕緣膜(70). . . Insulating film
(80)...磁芯(80). . . Magnetic core
(81)...底板(81). . . Bottom plate
(82)...磁柱(82). . . Magnetic column
第一圖為本發明之立體分解圖。The first figure is an exploded perspective view of the present invention.
第二圖為本發明之立體外觀圖。The second figure is a perspective view of the present invention.
第三圖為限有技術之立體分解圖。The third figure is a three-dimensional exploded view of the limited technology.
第四圖為現有技術之另一立體分解圖。The fourth figure is another perspective exploded view of the prior art.
(10)...多層電路板(10). . . Multi-layer circuit board
(11)...穿孔(11). . . perforation
(12)...絕緣層(12). . . Insulation
(13)...導電層(13). . . Conductive layer
(131)...第一端(131). . . First end
(132)...第二端(132). . . Second end
(133)...環形部(133). . . Ring
(14)...焊墊(14). . . Solder pad
(20)...絕緣膜(20). . . Insulating film
(30)...導電片(30). . . Conductive sheet
(31)...第一端(31). . . First end
(32)...第二端(32). . . Second end
(33)...環形部(33). . . Ring
(41)...輔助焊墊(41). . . Auxiliary pad
(42)...定位凸部(42). . . Positioning convex
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98108554A TWI423278B (en) | 2009-03-17 | 2009-03-17 | In-line positioning structure of conductive sheet for planar |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98108554A TWI423278B (en) | 2009-03-17 | 2009-03-17 | In-line positioning structure of conductive sheet for planar |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201036007A TW201036007A (en) | 2010-10-01 |
TWI423278B true TWI423278B (en) | 2014-01-11 |
Family
ID=44856089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98108554A TWI423278B (en) | 2009-03-17 | 2009-03-17 | In-line positioning structure of conductive sheet for planar |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI423278B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI671769B (en) * | 2018-05-02 | 2019-09-11 | 聯寶電子股份有限公司 | Magnetic induction element and method of manufacturing same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM243767U (en) * | 2003-07-10 | 2004-09-11 | Acbel Polytech Inc | Improved structure for transformer |
-
2009
- 2009-03-17 TW TW98108554A patent/TWI423278B/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM243767U (en) * | 2003-07-10 | 2004-09-11 | Acbel Polytech Inc | Improved structure for transformer |
Also Published As
Publication number | Publication date |
---|---|
TW201036007A (en) | 2010-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101317820B1 (en) | Electronic unit | |
JP5339398B2 (en) | Multilayer inductor | |
TWI630628B (en) | Capacitive resistance voltage conversion device | |
JP7369546B2 (en) | coil parts | |
US8446244B1 (en) | Integrated magnetic element | |
TWI578872B (en) | Multi-layer wire structure of pcb, magnetic element and manufacturing method thereof | |
JP2012038941A (en) | Transformer | |
JP4873522B2 (en) | Multilayer inductor | |
JPH08107023A (en) | Inductance element | |
CN104637650A (en) | Multi-layer type inductor | |
JP2002299130A (en) | Composite element for power source | |
TWI423278B (en) | In-line positioning structure of conductive sheet for planar | |
JP2008205350A (en) | Magnetic device | |
JP2003197439A (en) | Electromagnetic device | |
KR102444844B1 (en) | Magnetic coupling device and flat panel display device including the same | |
KR101664092B1 (en) | Coil assembly type transformer | |
JP5911441B2 (en) | DC-DC converter transformer wiring structure | |
TW201526044A (en) | Modular coil layer, coil assembly including such coil layer and planar transformer using the same | |
JP4021746B2 (en) | Circuit board mounting structure for power supply coil components | |
JP2009027045A (en) | Transformer | |
KR20190014727A (en) | Dual Core Planar Transformer | |
TWM480152U (en) | Modular planar coil and planar transformer using the same | |
JP5397325B2 (en) | Coil parts | |
JP5544180B2 (en) | Transformer module and electronic device | |
JP6083143B2 (en) | Chip inductor built-in wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |