JP3879933B2 - 有機elパネル - Google Patents
有機elパネル Download PDFInfo
- Publication number
- JP3879933B2 JP3879933B2 JP2005099568A JP2005099568A JP3879933B2 JP 3879933 B2 JP3879933 B2 JP 3879933B2 JP 2005099568 A JP2005099568 A JP 2005099568A JP 2005099568 A JP2005099568 A JP 2005099568A JP 3879933 B2 JP3879933 B2 JP 3879933B2
- Authority
- JP
- Japan
- Prior art keywords
- organic
- hygroscopic
- moisture
- panel
- sealing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 31
- 239000010419 fine particle Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 14
- 239000012044 organic layer Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- 239000006096 absorbing agent Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000314 lubricant Substances 0.000 claims description 3
- 239000008187 granular material Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 229910001583 allophane Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Images
Landscapes
- Electroluminescent Light Sources (AREA)
- Drying Of Gases (AREA)
Description
2 ガラス基板(支持基板)
3 透明電極(陽極)
5 有機層
6 背面電極(陰極)
7 封止部材
8 吸湿部材
8a 吸湿体
8b バインダ
8c 樹脂微粒子
9 有機EL素子
Claims (1)
- 少なくとも発光層を有する有機層を陽極と陰極とで狭持した有機EL素子を透光性の支持基板上に形成し、前記有機層を覆うように封止部材を前記支持基板上に設け、吸湿部材が少なくとも吸湿粉粒体からなる吸湿体と、前記吸湿体を保持する不活性液体からなるバインダと、潤滑剤である樹脂微粒子とからなり、前記樹脂微粒子は、耐熱温度120℃以上で含水率1%以下で平均粒径40μm以下で前記吸湿部材に0.3〜5wt%含まれており、前記吸湿部材を前記封止部材に膜状に設けたことを特徴とする有機ELパネル。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005099568A JP3879933B2 (ja) | 2005-03-30 | 2005-03-30 | 有機elパネル |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005099568A JP3879933B2 (ja) | 2005-03-30 | 2005-03-30 | 有機elパネル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006272283A JP2006272283A (ja) | 2006-10-12 |
JP3879933B2 true JP3879933B2 (ja) | 2007-02-14 |
Family
ID=37207534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005099568A Expired - Fee Related JP3879933B2 (ja) | 2005-03-30 | 2005-03-30 | 有機elパネル |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3879933B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101073558B1 (ko) * | 2009-10-08 | 2011-10-17 | 삼성모바일디스플레이주식회사 | 기판 합착 장치 및 기판 합착 방법 |
JP6112425B2 (ja) * | 2014-12-24 | 2017-04-12 | パナソニックIpマネジメント株式会社 | 有機発光デバイスおよび有機表示装置 |
JP6103390B2 (ja) * | 2014-12-24 | 2017-03-29 | パナソニックIpマネジメント株式会社 | 有機発光デバイスおよび有機表示装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277254A (ja) * | 1999-03-26 | 2000-10-06 | Tdk Corp | 有機el素子 |
JP2002198170A (ja) * | 2000-12-26 | 2002-07-12 | Nippon Seiki Co Ltd | 有機elパネル |
JP4178887B2 (ja) * | 2002-09-04 | 2008-11-12 | 凸版印刷株式会社 | 有機エレクトロルミネッセンス素子 |
-
2005
- 2005-03-30 JP JP2005099568A patent/JP3879933B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006272283A (ja) | 2006-10-12 |
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