FI952093A0 - Kapsling foer med akustiska ytvaogefunktionerande byggelement - Google Patents
Kapsling foer med akustiska ytvaogefunktionerande byggelementInfo
- Publication number
- FI952093A0 FI952093A0 FI952093A FI952093A FI952093A0 FI 952093 A0 FI952093 A0 FI 952093A0 FI 952093 A FI952093 A FI 952093A FI 952093 A FI952093 A FI 952093A FI 952093 A0 FI952093 A0 FI 952093A0
- Authority
- FI
- Finland
- Prior art keywords
- ytvaogefunktionerande
- kapsling
- aciskaiska
- byggelement
- foer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/08—Holders with means for regulating temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4415411 | 1994-05-02 | ||
| DE4432566 | 1994-09-13 | ||
| DE19512797 | 1995-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FI952093A0 true FI952093A0 (fi) | 1995-05-02 |
Family
ID=25936202
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI952093A FI952093A0 (fi) | 1994-05-02 | 1995-05-02 | Kapsling foer med akustiska ytvaogefunktionerande byggelement |
| FI964394A FI964394A (fi) | 1994-05-02 | 1996-10-31 | Elektronisten komponenttien kotelo |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI964394A FI964394A (fi) | 1994-05-02 | 1996-10-31 | Elektronisten komponenttien kotelo |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US5831369A (fi) |
| EP (1) | EP0759231B1 (fi) |
| JP (1) | JPH09512677A (fi) |
| KR (1) | KR100648751B1 (fi) |
| CN (1) | CN1099158C (fi) |
| DE (1) | DE59504639D1 (fi) |
| FI (2) | FI952093A0 (fi) |
| RU (1) | RU2153221C2 (fi) |
| WO (1) | WO1995030276A1 (fi) |
Families Citing this family (85)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI952093A0 (fi) * | 1994-05-02 | 1995-05-02 | Siemens Matsushita Components | Kapsling foer med akustiska ytvaogefunktionerande byggelement |
| DE19548048C2 (de) * | 1995-12-21 | 1998-01-15 | Siemens Matsushita Components | Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement (OFW-Bauelement) |
| DE19548046C2 (de) * | 1995-12-21 | 1998-01-15 | Siemens Matsushita Components | Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen |
| DE19820049C2 (de) * | 1998-05-05 | 2001-04-12 | Epcos Ag | Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente |
| JP2000114918A (ja) * | 1998-10-05 | 2000-04-21 | Mitsubishi Electric Corp | 表面弾性波装置及びその製造方法 |
| JP4151164B2 (ja) * | 1999-03-19 | 2008-09-17 | 株式会社デンソー | 半導体装置の製造方法 |
| US6287894B1 (en) | 1999-10-04 | 2001-09-11 | Andersen Laboratories, Inc. | Acoustic device packaged at wafer level |
| DE10006446A1 (de) * | 2000-02-14 | 2001-08-23 | Epcos Ag | Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung |
| US6653762B2 (en) * | 2000-04-19 | 2003-11-25 | Murata Manufacturing Co., Ltd. | Piezoelectric type electric acoustic converter |
| US6914367B2 (en) * | 2000-07-06 | 2005-07-05 | Kabushiki Kaisha Toshiba | Surface acoustic wave device and method of manufacturing the device |
| KR100932358B1 (ko) * | 2000-11-09 | 2009-12-16 | 엔엑스피 비 브이 | 전자 장치, 이 전자 장치를 포함하는 반도체 장치와 이 전자 장치의 제조 방법 |
| JP3974346B2 (ja) * | 2001-03-30 | 2007-09-12 | 富士通メディアデバイス株式会社 | 弾性表面波装置 |
| US6930364B2 (en) | 2001-09-13 | 2005-08-16 | Silicon Light Machines Corporation | Microelectronic mechanical system and methods |
| DE10164494B9 (de) | 2001-12-28 | 2014-08-21 | Epcos Ag | Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung |
| DE10206919A1 (de) | 2002-02-19 | 2003-08-28 | Infineon Technologies Ag | Verfahren zur Erzeugung einer Abdeckung, Verfahren zum Herstellen eines gehäusten Bauelements |
| US6846423B1 (en) | 2002-08-28 | 2005-01-25 | Silicon Light Machines Corporation | Wafer-level seal for non-silicon-based devices |
| US6877209B1 (en) | 2002-08-28 | 2005-04-12 | Silicon Light Machines, Inc. | Method for sealing an active area of a surface acoustic wave device on a wafer |
| DE10253163B4 (de) | 2002-11-14 | 2015-07-23 | Epcos Ag | Bauelement mit hermetischer Verkapselung und Waferscale Verfahren zur Herstellung |
| DE10300958A1 (de) * | 2003-01-13 | 2004-07-22 | Epcos Ag | Modul mit Verkapselung |
| US7108344B2 (en) * | 2003-11-03 | 2006-09-19 | Hewlett-Packard Devleopment Company, L.P. | Printmode for narrow margin printing |
| DE102004005668B4 (de) | 2004-02-05 | 2021-09-16 | Snaptrack, Inc. | Elektrisches Bauelement und Herstellungsverfahren |
| US7750420B2 (en) * | 2004-03-26 | 2010-07-06 | Cypress Semiconductor Corporation | Integrated circuit having one or more conductive devices formed over a SAW and/or MEMS device |
| US7259499B2 (en) | 2004-12-23 | 2007-08-21 | Askew Andy R | Piezoelectric bimorph actuator and method of manufacturing thereof |
| US7288847B2 (en) * | 2005-01-25 | 2007-10-30 | Medtronic, Inc. | Assembly including a circuit and an encapsulation frame, and method of making the same |
| US8074622B2 (en) * | 2005-01-25 | 2011-12-13 | Borgwarner, Inc. | Control and interconnection system for an apparatus |
| DE102005034011B4 (de) * | 2005-07-18 | 2009-05-20 | Infineon Technologies Ag | Halbleiterbauteil für Hochfrequenzen über 10 GHz und Verfahren zur Herstellung desselben |
| JP4760357B2 (ja) * | 2005-12-19 | 2011-08-31 | パナソニック株式会社 | 電子部品パッケージ |
| DE102007058951B4 (de) | 2007-12-07 | 2020-03-26 | Snaptrack, Inc. | MEMS Package |
| US8059425B2 (en) * | 2008-05-28 | 2011-11-15 | Azurewave Technologies, Inc. | Integrated circuit module with temperature compensation crystal oscillator |
| DE102008030842A1 (de) | 2008-06-30 | 2010-01-28 | Epcos Ag | Integriertes Modul mit intrinsischem Isolationsbereich und Herstellungsverfahren |
| DE102008040775A1 (de) * | 2008-07-28 | 2010-02-04 | Robert Bosch Gmbh | Verkapselung, MEMS sowie Verfahren zum selektiven Verkapseln |
| DE102008042106A1 (de) * | 2008-09-15 | 2010-03-18 | Robert Bosch Gmbh | Verkapselung, MEMS sowie Verfahren zum Verkapseln |
| JP5453787B2 (ja) * | 2008-12-03 | 2014-03-26 | パナソニック株式会社 | 弾性表面波デバイス |
| WO2012120968A1 (ja) * | 2011-03-09 | 2012-09-13 | 株式会社村田製作所 | 電子部品 |
| US9583414B2 (en) | 2013-10-31 | 2017-02-28 | Qorvo Us, Inc. | Silicon-on-plastic semiconductor device and method of making the same |
| US9812350B2 (en) | 2013-03-06 | 2017-11-07 | Qorvo Us, Inc. | Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer |
| JP2014192782A (ja) * | 2013-03-28 | 2014-10-06 | Japan Radio Co Ltd | 封止部材、封止補助部材、封止方法および封止補助方法 |
| JP5695145B2 (ja) * | 2013-08-19 | 2015-04-01 | スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 | 弾性表面波デバイス |
| CN104604346B (zh) * | 2013-08-30 | 2016-04-20 | 新电元工业株式会社 | 电气设备及其制造方法、以及电气设备的设计方法 |
| EP2996143B1 (en) | 2014-09-12 | 2018-12-26 | Qorvo US, Inc. | Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same |
| US10085352B2 (en) | 2014-10-01 | 2018-09-25 | Qorvo Us, Inc. | Method for manufacturing an integrated circuit package |
| US10431533B2 (en) | 2014-10-31 | 2019-10-01 | Ati Technologies Ulc | Circuit board with constrained solder interconnect pads |
| US9530709B2 (en) | 2014-11-03 | 2016-12-27 | Qorvo Us, Inc. | Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer |
| JP5921733B2 (ja) * | 2015-02-05 | 2016-05-24 | スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 | 弾性表面波デバイスを製造する方法 |
| US9613831B2 (en) | 2015-03-25 | 2017-04-04 | Qorvo Us, Inc. | Encapsulated dies with enhanced thermal performance |
| US9960145B2 (en) | 2015-03-25 | 2018-05-01 | Qorvo Us, Inc. | Flip chip module with enhanced properties |
| US20160343604A1 (en) | 2015-05-22 | 2016-11-24 | Rf Micro Devices, Inc. | Substrate structure with embedded layer for post-processing silicon handle elimination |
| US10276495B2 (en) | 2015-09-11 | 2019-04-30 | Qorvo Us, Inc. | Backside semiconductor die trimming |
| JP6350510B2 (ja) * | 2015-12-24 | 2018-07-04 | 株式会社村田製作所 | 弾性表面波装置 |
| US10020405B2 (en) | 2016-01-19 | 2018-07-10 | Qorvo Us, Inc. | Microelectronics package with integrated sensors |
| US10090262B2 (en) | 2016-05-09 | 2018-10-02 | Qorvo Us, Inc. | Microelectronics package with inductive element and magnetically enhanced mold compound component |
| US10784149B2 (en) | 2016-05-20 | 2020-09-22 | Qorvo Us, Inc. | Air-cavity module with enhanced device isolation |
| US10773952B2 (en) | 2016-05-20 | 2020-09-15 | Qorvo Us, Inc. | Wafer-level package with enhanced performance |
| US10468329B2 (en) | 2016-07-18 | 2019-11-05 | Qorvo Us, Inc. | Thermally enhanced semiconductor package having field effect transistors with back-gate feature |
| US10103080B2 (en) | 2016-06-10 | 2018-10-16 | Qorvo Us, Inc. | Thermally enhanced semiconductor package with thermal additive and process for making the same |
| JP7035014B2 (ja) | 2016-08-12 | 2022-03-14 | コーボ ユーエス，インコーポレイティド | 性能が強化されたウェハレベルパッケージ |
| US10109550B2 (en) | 2016-08-12 | 2018-10-23 | Qorvo Us, Inc. | Wafer-level package with enhanced performance |
| US10486965B2 (en) | 2016-08-12 | 2019-11-26 | Qorvo Us, Inc. | Wafer-level package with enhanced performance |
| US10109502B2 (en) | 2016-09-12 | 2018-10-23 | Qorvo Us, Inc. | Semiconductor package with reduced parasitic coupling effects and process for making the same |
| US10090339B2 (en) | 2016-10-21 | 2018-10-02 | Qorvo Us, Inc. | Radio frequency (RF) switch |
| US10749518B2 (en) | 2016-11-18 | 2020-08-18 | Qorvo Us, Inc. | Stacked field-effect transistor switch |
| US10068831B2 (en) | 2016-12-09 | 2018-09-04 | Qorvo Us, Inc. | Thermally enhanced semiconductor package and process for making the same |
| US10490471B2 (en) | 2017-07-06 | 2019-11-26 | Qorvo Us, Inc. | Wafer-level packaging for enhanced performance |
| RU2658596C1 (ru) * | 2017-08-07 | 2018-06-21 | Акционерное общество "Научно-производственное предприятие "Радар ммс" | Чувствительный элемент на поверхностных акустических волнах для измерения давления жидкостей и газов |
| US10366972B2 (en) | 2017-09-05 | 2019-07-30 | Qorvo Us, Inc. | Microelectronics package with self-aligned stacked-die assembly |
| US10784233B2 (en) | 2017-09-05 | 2020-09-22 | Qorvo Us, Inc. | Microelectronics package with self-aligned stacked-die assembly |
| US11152363B2 (en) | 2018-03-28 | 2021-10-19 | Qorvo Us, Inc. | Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process |
| US12062700B2 (en) | 2018-04-04 | 2024-08-13 | Qorvo Us, Inc. | Gallium-nitride-based module with enhanced electrical performance and process for making the same |
| US12046505B2 (en) | 2018-04-20 | 2024-07-23 | Qorvo Us, Inc. | RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation |
| US10804246B2 (en) | 2018-06-11 | 2020-10-13 | Qorvo Us, Inc. | Microelectronics package with vertically stacked dies |
| CN118213279A (zh) | 2018-07-02 | 2024-06-18 | Qorvo美国公司 | Rf半导体装置及其制造方法 |
| US10964554B2 (en) | 2018-10-10 | 2021-03-30 | Qorvo Us, Inc. | Wafer-level fan-out package with enhanced performance |
| US11069590B2 (en) | 2018-10-10 | 2021-07-20 | Qorvo Us, Inc. | Wafer-level fan-out package with enhanced performance |
| US11646242B2 (en) | 2018-11-29 | 2023-05-09 | Qorvo Us, Inc. | Thermally enhanced semiconductor package with at least one heat extractor and process for making the same |
| WO2020153983A1 (en) | 2019-01-23 | 2020-07-30 | Qorvo Us, Inc. | Rf semiconductor device and manufacturing method thereof |
| US11387157B2 (en) | 2019-01-23 | 2022-07-12 | Qorvo Us, Inc. | RF devices with enhanced performance and methods of forming the same |
| US12057374B2 (en) | 2019-01-23 | 2024-08-06 | Qorvo Us, Inc. | RF devices with enhanced performance and methods of forming the same |
| US12046570B2 (en) | 2019-01-23 | 2024-07-23 | Qorvo Us, Inc. | RF devices with enhanced performance and methods of forming the same |
| US12046483B2 (en) | 2019-01-23 | 2024-07-23 | Qorvo Us, Inc. | RF devices with enhanced performance and methods of forming the same |
| US12125825B2 (en) | 2019-01-23 | 2024-10-22 | Qorvo Us, Inc. | RF devices with enhanced performance and methods of forming the same |
| US12074086B2 (en) | 2019-11-01 | 2024-08-27 | Qorvo Us, Inc. | RF devices with nanotube particles for enhanced performance and methods of forming the same |
| US11646289B2 (en) | 2019-12-02 | 2023-05-09 | Qorvo Us, Inc. | RF devices with enhanced performance and methods of forming the same |
| US11923238B2 (en) | 2019-12-12 | 2024-03-05 | Qorvo Us, Inc. | Method of forming RF devices with enhanced performance including attaching a wafer to a support carrier by a bonding technique without any polymer adhesive |
| US12129168B2 (en) | 2019-12-23 | 2024-10-29 | Qorvo Us, Inc. | Microelectronics package with vertically stacked MEMS device and controller device |
| WO2022186857A1 (en) | 2021-03-05 | 2022-09-09 | Qorvo Us, Inc. | Selective etching process for si-ge and doped epitaxial silicon |
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|---|---|---|---|---|
| DE252473C (fi) | ||||
| US2824219A (en) * | 1954-11-08 | 1958-02-18 | Midland Mfg Co Inc | Piezoelectric crystal assembly |
| US3622816A (en) * | 1970-06-12 | 1971-11-23 | Electro Dynamics | Piezoelectric crystal assembly |
| DE2610172C3 (de) * | 1975-03-12 | 1980-08-21 | Murata Manufacturing Co., Ltd., Nagaokakyo, Kyoto (Japan) | Filter auf der Basis der akustischen Oberflächenwellen |
| GB1512593A (en) * | 1975-03-13 | 1978-06-01 | Murata Manufacturing Co | Elastic surface wave filter |
| DE2819499C3 (de) * | 1978-05-03 | 1981-01-29 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Gehäuse für eine Halbleiteranordnung |
| US4213104A (en) * | 1978-09-25 | 1980-07-15 | United Technologies Corporation | Vacuum encapsulation for surface acoustic wave (SAW) devices |
| JPS55112019A (en) * | 1979-02-22 | 1980-08-29 | Murata Mfg Co Ltd | Elastic surface wave device |
| US4270105A (en) * | 1979-05-14 | 1981-05-26 | Raytheon Company | Stabilized surface wave device |
| CH626479A5 (fi) * | 1979-07-05 | 1981-11-13 | Suisse Horlogerie | |
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| US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
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| FI952093A0 (fi) * | 1994-05-02 | 1995-05-02 | Siemens Matsushita Components | Kapsling foer med akustiska ytvaogefunktionerande byggelement |
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-
1995
- 1995-05-02 FI FI952093A patent/FI952093A0/fi unknown
- 1995-05-02 DE DE59504639T patent/DE59504639D1/de not_active Expired - Lifetime
- 1995-05-02 EP EP95918622A patent/EP0759231B1/de not_active Expired - Lifetime
- 1995-05-02 RU RU96123275/09A patent/RU2153221C2/ru not_active IP Right Cessation
- 1995-05-02 CN CN95192901A patent/CN1099158C/zh not_active Expired - Lifetime
- 1995-05-02 JP JP7528011A patent/JPH09512677A/ja active Pending
- 1995-05-02 KR KR1019960706133A patent/KR100648751B1/ko not_active IP Right Cessation
- 1995-05-02 WO PCT/EP1995/001658 patent/WO1995030276A1/de active IP Right Grant
-
1996
- 1996-10-31 FI FI964394A patent/FI964394A/fi unknown
- 1996-11-04 US US08/743,540 patent/US5831369A/en not_active Expired - Lifetime
-
1998
- 1998-06-17 US US09/099,019 patent/US6446316B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6446316B1 (en) | 2002-09-10 |
| EP0759231A1 (de) | 1997-02-26 |
| CN1099158C (zh) | 2003-01-15 |
| JPH09512677A (ja) | 1997-12-16 |
| FI964394A0 (fi) | 1996-10-31 |
| KR100648751B1 (ko) | 2007-03-02 |
| KR970703062A (ko) | 1997-06-10 |
| EP0759231B1 (de) | 1998-12-23 |
| WO1995030276A1 (de) | 1995-11-09 |
| DE59504639D1 (de) | 1999-02-04 |
| CN1147319A (zh) | 1997-04-09 |
| FI964394A (fi) | 1996-10-31 |
| US5831369A (en) | 1998-11-03 |
| RU2153221C2 (ru) | 2000-07-20 |
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