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DE69413602D1 - Halbleiteranordnung und Herstellungsverfahren - Google Patents

Halbleiteranordnung und Herstellungsverfahren

Info

Publication number
DE69413602D1
DE69413602D1 DE69413602T DE69413602T DE69413602D1 DE 69413602 D1 DE69413602 D1 DE 69413602D1 DE 69413602 T DE69413602 T DE 69413602T DE 69413602 T DE69413602 T DE 69413602T DE 69413602 D1 DE69413602 D1 DE 69413602D1
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69413602T
Other languages
English (en)
Other versions
DE69413602T2 (de
Inventor
Yasuo Yamasaki
Norikata Hama
Munenori Kurasawa
Nobuaki Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE69413602D1 publication Critical patent/DE69413602D1/de
Application granted granted Critical
Publication of DE69413602T2 publication Critical patent/DE69413602T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69413602T 1993-06-04 1994-06-03 Halbleiteranordnung und Herstellungsverfahren Expired - Lifetime DE69413602T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP13474093 1993-06-04
JP13473893 1993-06-04
JP13473993 1993-06-04
JP12691294A JP3329073B2 (ja) 1993-06-04 1994-05-17 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
DE69413602D1 true DE69413602D1 (de) 1998-11-05
DE69413602T2 DE69413602T2 (de) 1999-04-22

Family

ID=27471251

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69413602T Expired - Lifetime DE69413602T2 (de) 1993-06-04 1994-06-03 Halbleiteranordnung und Herstellungsverfahren

Country Status (7)

Country Link
US (1) US5554885A (de)
EP (1) EP0627766B1 (de)
JP (1) JP3329073B2 (de)
KR (1) KR100198502B1 (de)
DE (1) DE69413602T2 (de)
HK (1) HK1005420A1 (de)
TW (1) TW338559U (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2852178B2 (ja) * 1993-12-28 1999-01-27 日本電気株式会社 フィルムキャリアテープ
JPH0878605A (ja) * 1994-09-01 1996-03-22 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
JP3170182B2 (ja) * 1995-08-15 2001-05-28 株式会社東芝 樹脂封止型半導体装置及びその製造方法
JP2687946B2 (ja) * 1995-08-16 1997-12-08 日本電気株式会社 リードフレーム
JPH09129686A (ja) * 1995-11-06 1997-05-16 Toshiba Microelectron Corp テープキャリヤ及びその実装構造
US5952711A (en) * 1996-09-12 1999-09-14 Wohlin; Leslie Theodore Lead finger immobilization apparatus
US6006981A (en) * 1996-11-19 1999-12-28 Texas Instruments Incorporated Wirefilm bonding for electronic component interconnection
JP2877122B2 (ja) * 1997-01-20 1999-03-31 ソニー株式会社 半導体装置及びリードフレーム
US6008528A (en) * 1997-11-13 1999-12-28 Texas Instruments Incorporated Semiconductor lead frame with channel beam tie bar
JPH11265971A (ja) * 1998-03-17 1999-09-28 Hitachi Ltd Ｔｓｏｐ型半導体装置
US6179210B1 (en) * 1999-02-09 2001-01-30 Motorola, Inc. Punch out pattern for hot melt tape used in smartcards
WO2000049655A1 (en) * 1999-02-18 2000-08-24 Seiko Epson Corporation Semiconductor device, circuit board, method of manufacturing circuit board, and electronic device
JP3555927B2 (ja) * 1999-04-07 2004-08-18 Ｎｅｃエレクトロニクス株式会社 テープキャリアパッケージ
US6256200B1 (en) * 1999-05-27 2001-07-03 Allen K. Lam Symmetrical package for semiconductor die
JP3360723B2 (ja) * 1999-06-08 2002-12-24 日本電気株式会社 半導体素子のチップサイズパッケージ
TW567594B (en) * 2001-01-15 2003-12-21 Chuen Khiang Wang Method of packaging microchip devices, the interposer used therefor and the microchip device packaged thereby
JP4611579B2 (ja) * 2001-07-30 2011-01-12 ルネサスエレクトロニクス株式会社 リードフレーム、半導体装置およびその樹脂封止法
JP2003204027A (ja) * 2002-01-09 2003-07-18 Matsushita Electric Ind Co Ltd リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法
DE10297756B4 (de) * 2002-06-19 2008-03-06 United Test And Assembly Center (S) Pte Ltd. Konfektionierung einer Mikrochip-Vorrichtung
JP2005530358A (ja) * 2002-06-19 2005-10-06 ワン，チェン，キーアン マイクロチップデバイスのパッケージング
JP3975181B2 (ja) * 2003-06-11 2007-09-12 三菱電機株式会社 電力用半導体装置
TWM255510U (en) * 2004-03-24 2005-01-11 Optimum Care Int Tech Inc Chip mounting structure improvement
TWI239088B (en) * 2004-12-30 2005-09-01 Chipmos Technologies Inc Tape for tape carrier package
JP4797817B2 (ja) * 2006-06-12 2011-10-19 株式会社デンソー 半導体装置およびその製造方法
JP4882732B2 (ja) * 2006-12-22 2012-02-22 株式会社デンソー 半導体装置
DE112008003425B4 (de) * 2007-12-20 2023-08-31 Aisin Aw Co., Ltd. Verfahren zum Herstellen eines Halbleiterbauelements
JP4605272B2 (ja) * 2008-08-22 2011-01-05 住友金属鉱山株式会社 Ｃｏｆ基板
JP5896302B2 (ja) 2010-11-02 2016-03-30 大日本印刷株式会社 Ｌｅｄ素子搭載用リードフレーム、樹脂付リードフレーム、半導体装置の製造方法、および半導体素子搭載用リードフレーム
KR101259844B1 (ko) 2011-01-31 2013-05-03 엘지이노텍 주식회사 리드 크랙이 강화된 전자소자용 탭 테이프 및 그의 제조 방법
US9041188B2 (en) * 2012-11-10 2015-05-26 Vishay General Semiconductor Llc Axial semiconductor package
JP6028592B2 (ja) 2013-01-25 2016-11-16 三菱電機株式会社 半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0815193B2 (ja) * 1986-08-12 1996-02-14 新光電気工業株式会社 半導体装置及びこれに用いるリードフレーム
JPH01157541A (ja) * 1987-09-04 1989-06-20 Mitsubishi Electric Corp 半導体装置
JPH01315150A (ja) * 1988-06-15 1989-12-20 Oki Electric Ind Co Ltd 樹脂封止半導体装置
JPH0222850A (ja) * 1988-07-11 1990-01-25 Hitachi Cable Ltd 半導体装置用のリードフレーム
US5157478A (en) * 1989-04-19 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Tape automated bonding packaged semiconductor device incorporating a heat sink
JPH036843A (ja) * 1989-06-03 1991-01-14 Shinko Electric Ind Co Ltd Ｔａｂ用テープキャリア
JPH0370150A (ja) * 1989-08-09 1991-03-26 Mitsubishi Electric Corp キャリアテープ及びこれを用いた半導体装置の製造方法
JPH0680706B2 (ja) * 1989-08-22 1994-10-12 三菱電機株式会社 キャリアテープ及びこれを用いた半導体装置の製造方法
JP2784235B2 (ja) * 1989-10-16 1998-08-06 新光電気工業株式会社 リードフレーム及び半導体装置
US5237202A (en) * 1989-10-16 1993-08-17 Shinko Electric Industries Co., Ltd Lead frame and semiconductor device using same
JP2815984B2 (ja) * 1990-07-03 1998-10-27 富士通株式会社 半導体装置
JPH04124846A (ja) * 1990-09-14 1992-04-24 Nippon Steel Corp テープキャリヤ
JP2819825B2 (ja) * 1990-11-21 1998-11-05 セイコーエプソン株式会社 Ｔａｂ内蔵型半導体装置
JPH04369234A (ja) * 1991-06-18 1992-12-22 Nec Corp アウターリードガイドテープ付きテープキャリアパッケージ
JP3044872B2 (ja) * 1991-09-25 2000-05-22 ソニー株式会社 半導体装置
JPH0637141A (ja) * 1992-07-15 1994-02-10 Hitachi Ltd 半導体集積回路装置

Also Published As

Publication number Publication date
EP0627766A1 (de) 1994-12-07
EP0627766B1 (de) 1998-09-30
HK1005420A1 (en) 1999-01-08
JPH0750312A (ja) 1995-02-21
US5554885A (en) 1996-09-10
TW338559U (en) 1998-08-11
JP3329073B2 (ja) 2002-09-30
DE69413602T2 (de) 1999-04-22
KR100198502B1 (ko) 1999-06-15

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Legal Events

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8364 No opposition during term of opposition