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CN1251319C - 微电子组件的插入物的制造方法 - Google Patents

微电子组件的插入物的制造方法 Download PDF

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Publication number
CN1251319C
CN1251319C CNB031486444A CN03148644A CN1251319C CN 1251319 C CN1251319 C CN 1251319C CN B031486444 A CNB031486444 A CN B031486444A CN 03148644 A CN03148644 A CN 03148644A CN 1251319 C CN1251319 C CN 1251319C
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CN
China
Prior art keywords
tap
middle coupling
coupling element
thin slice
fuse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031486444A
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English (en)
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CN1495870A (zh
Inventor
伊格尔·Y·汉洛斯
盖坦·L·马希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32686436&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1251319(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/340,144 external-priority patent/US5917707A/en
Priority claimed from US08/452,255 external-priority patent/US6336269B1/en
Priority claimed from US08/457,479 external-priority patent/US6049976A/en
Priority claimed from US08/533,584 external-priority patent/US5772451A/en
Priority claimed from US08/554,902 external-priority patent/US5974662A/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN1495870A publication Critical patent/CN1495870A/zh
Application granted granted Critical
Publication of CN1251319C publication Critical patent/CN1251319C/zh
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    • G01R1/067—Measuring probes
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    • H05K7/00—Constructional details common to different types of electric apparatus
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    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
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    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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Abstract

本发明提供一种微电子组件的插入物的制造方法，其包含：在第一导电材料的薄片中生成一具第一分接头及第二分接头的中间连接元件，该第一分接头和第二分接头位于薄片的平面内；折弯该两分接头，使两分接头中的一个以第一方向自薄片的一个表面延伸出来，两分接头中的另一个以第二方向自薄片的一相对表面延伸出来；以一具较第一导电材料屈服强度高的第二导电材料外覆该两分接头。

Description

微电子组件的插入物的制造方法
本申请是申请号为95197034.8、申请日为1995年11月13日的专利申请的分案申请。
技术领域
本发明有关制造电子组件之间、特别是微电子组件之间的中间连接元件，具体地说，是展现弹性的互连元件及其制造方法。
本申请案为1995年5月26日提出申请的共用、共同尚待核定的美国专利第08/452,255号申请案(“母案”，状态：待核定)的部分连续案，而尚待核定之申请案则为1994年11月15日提出申请的共有、共同尚待核定的美国专利第08/152,812号申请案的部分连续案(状态：待核定)，此一申请案是1993年11月16日提出申请的共有、共同尚待核定的美国专利第08/152,812号申请案的部分连续案(状态：待核定/已核准)。
背景技术
电子组件，特别是诸如半导体元件(晶片)的微电子组件，通常具有多个端子(亦指接合垫、电极、或传导区)。为将此等元件锁组装成一有用的系统(或子系统)，若干的个别元件必须彼此电气互连，一般通过一印刷电路(或接线)板(PCB、PWB)的中间物。
半导体元件一般配置于一具有多个以接脚、垫、引线、焊球、及类似物形式的外部接点的半导体包装内部。许多形式的半导体包装为已知，且连接包装内部半导体元件的技术包括接线、带式自动键合(TAB)及其类似者。在某些例子中，半导体元件提供有提升突块触点，且藉浮片晶片技术连接至另一电子组件上。
一般而言，电子组件间的互连可分类成“相对永久”及“容易拆卸”之两个概括的种类。
一个“相对永久”连接的例子为软焊接。一旦两个组件彼此焊接时，必须用去焊接的程序来分开该等元件。线接合则是另一个“相对永久”连接的例子。
一个“容易拆卸”连接的例子为一电子组件的刚性接脚由另一电子组件的弹性插槽元件所收纳。此插槽元件在诸接脚上使用一充分的接触力(压力)以确保该处可靠的电气连接。此处欲造成与一电子组件压力接触的互连元件是指“弹簧”或“弹簧元件”。
弹簧元件是众所周知的、且以多样的形状及大小呈现。在现今微电子环境中，十分需要包括弹簧的所有的互连元件变得越来越小，以便大多数此等互连元件能配置于一小的区域，以达到对电子组件的高密度互连。
制造弹簧元件的现有技术一般涉及冲锻(冲孔)或蚀刻诸如磷青铜或铍铜合工或钢或镍-铁-钴(如kovar)合金的的弹簧材料，以形成个别的弹簧元件、形成弹簧元件使具有一弹簧形状(如弧形的等)、以一良好接触材质(例如，诸如金的贵金属，其接触同类材质时可展现低接触电阻)电镀弹簧元件、以及将多个此种形状、电镀的弹簧元件造模成一线性的、一周边或一阵列模图。当将金电镀上前述的诸材质时，有时一薄(例如，0.762-1.27微米)的镍阻隔剂层乃是恰当的。
种种问题与限制和这种制造弹簧元件的技术一致。
例如，当应用要求多个弹簧(中间互连元件)以一微细的间距(例如，254微米)间隔配置时，此等程序即受到限制。如此微细的间距势必要每个弹簧的大小(例如以横截面而言)实质上较小(例如76.2微米)于间距。冲锻区必须调节，且将会限制有多少的材料留下以形成弹簧。最好，即使其可以相当笔直地冲锻与25.4微米一样小的弹簧，此等小的尺寸将强制能被弹簧尽量使用的接触力的限度。此对于弹簧制造区阵列特别严厉。
一般而言，需要一特定最小接触力导致对电子组件(例如对于电子组件上的端子)可靠的压力接触。举例而言，一约为15克(每接触包括，如2克一样小或更小，及如150克或更多)的接触(负载)力可确保一可靠的电气连接被施于一电子组件的端子上，该端子可能会受其表面上薄膜的污染或其表面上产生腐蚀或氧化。每个弹簧所需的最小接触力要求增加弹簧材料的屈服强度或弹簧元件的尺寸。对一般的设计而言，一材料的屈服强度越高，越难加以利用(例如冲压、弯曲等)。且欲使弹簧更小的要求必需排除使其在横截面较大。
另一附随的现有技术的中间连接元件的限制在于，当运用硬材料(如可被用来制造弹簧)时，则必须要有相当“敌对的”(如，高温)程序，诸如硬焊，来安装中间连接元件于一电子组件的端子上。例如，已知将刚性接脚硬焊至相当“经久耐用”的半导体包装上。此种“敌对的”程序在就确实相当“脆弱的”、诸如半导体元件的电子组件而言，大致是不需要的(且往往是不可行的)。相对地，线接合为一相当“友好的”程序的例子，其比硬焊更不可能损害脆弱的电子组件。软焊则为另一个相当“友好的”程序的例子。
伴随安装弹簧于电子组件上的问题主要是机械性能。倘若弹簧安装于一基材的一端上(其目的在于此一设计被认为是一固定的物体)，且必须对施于其自由端上的力产生反应，该“弱连接”(最弱点，于使用中)将往往会是弹簧(例如，弹簧接合的底座)接至基材上(例如，一电子组件的端子)的点。这可作为至少一部分需要运用“敌对的”程序(如硬焊)以安装弹簧于基材上的理由。
另一中间连接元件的难解问题(包括弹簧接触)在于，往往电子组件的端子并非完全共面的。缺乏某些合并机构以调节此等“公差”(总非平面性)的中间连接元件将被硬压，以制造与电子组件的诸端子一致的接触压力接触。
下列美国专利为关切者引用：第5,386,344、5,336,380、5,317,479、5,086,337、5,067,007、4,989,069、4,893,172、4,793,814、4,777,564、4,764,848、4,667,219、4,642,889、4,330,165、4,295,700、4,067,104、3,795,037、3,616,532、及3,509,270。
发明内容
因此，本发明的一个目的在于提供制造电子组件、尤其是微电子组件之间的中间连接元件的技术。
本发明的另一目的在于提供适于制造对电子组件的压力接触的中间连接元件。
本发明的另一目的在于提供一具有受控阻抗的安全固定中间连接元件的技术。
本发明提供一种微电子组件的插入物的制造方法，其包含：在第一导电材料的薄片中生成一具第一分接头及第二分接头的中间连接元件，该第一分接头和第二分接头位于薄片的平面内；折弯该两分接头，使两分接头中的一个以第一方向自薄片的一个表面延伸出来，两分接头中的另一个以第二方向自薄片的一相对表面延伸出来；以一具较第一导电材料屈服强度高的第二导电材料外覆该两分接头。
根据本发明，公开的是制造中间连接元件，特别是弹簧元件的技术，及安装中间连接元件至电子组件的技术。所公开的技术克服了制造相当小尺寸弹簧元件时的问题，但又能运用充分大小的接触力以确保可靠的中间连接。所公开的技术也克服了安装弹簧于诸如半导体元件之类的电子组件上时的问题。
根据本发明，一复合中间连接元件的制造是藉安装一细长元件(“芯子”)至一电子组件上、将该芯子定形为弹簧形状、及外覆该芯子以强化最终复合中间连接元件和/或安全地将该最终复合中间元件固定至电子组件上实现的。
这里所用的名词“弹簧形状”实际上是指任何形状的细长元件，其会展现细长元件的一端(顶)在施于该端上的力的作用下作弹性的(恢复的)移动。它包括在形状上具有一个或更多个弯曲以及实质上是笔直的细长元件。
或者是，芯子在安装于一电子组件之前即被定形。
或者是，芯子被安装在一非电子组件的牺牲基板上，或是牺牲基板的一部分，牺牲基板在定形后、且在外覆之前或之后被移除。根据本发明的一个方面，具有不同粗表面加工处理的顶端可以配置于中间连接元件的接触端上。(亦可参见母案图11A-11F。)
在本发明的一实施例中，该芯子是一具有相当低屈服强度的“软”材料，且外覆以一具有一相当高屈服强度的“硬”材料。例如，一诸如金线的软材料被附着(如，通过线接合)在一半导体元件的接合垫上，且被外覆(如通过电化电镀)以一诸如镍及其合金的硬材料。
这里描述了相对外覆该芯子，单层及多层外覆层，具有微突出物(见母案图5C及5D)的“粗”外覆层，及自该芯子整个长度或仅是部分长度延伸的外覆层。在后一种情况中，该芯子的顶端可适当地暴露，以供与一电子组件(也可见母案的图5)接触。
一般而言，在此处整篇所述的内容中，名词“电镀”是作为许多外覆该芯子的技术中的一个示范性技术。能外覆该芯子的任何合适的技术均属本发明的范畴之内，它包括但非限定于：自水溶液析出的材料的沉积，电解液电镀，无电镀敷，化学蒸汽沉积法(CVD)，物理蒸汽沉积法(PVD)，造成液体、固体或汽体分解的过程，及所有众所周知的沉积材料的技术。
一般而言，以一诸如镍的金属材料外覆该芯子，电化步骤较为合宜，尤其是无电镀敷。
在本发明的另一实施例中，芯子是一“硬”材料制的细长元件，它原就适于作为弹簧元件，并被安装在电子组件一端子的一端。该芯子及至少该端子的邻接区外覆以一会强化固定该芯子至该端子的材料。以此方式，该芯子毋需在外覆步骤之前即安装好，且可使用很少会损害电子组件的诸步骤，来将该芯子“定位(tack)”在适当位置以供后续的外覆动作。此等“友好的”步骤包括软焊、粘合、及将硬芯子的一端贯穿至端子的一软部分内。
其中，还公开了该芯子是一线的实施例。该芯子为一平坦分接头的实施例亦被公开。
还公开了作芯子及外覆层用的代表性的材料。
在下文中主要描述了以一相当软(低屈服强度)的大致非常小尺寸(例如，50.8微米或更小)的芯子为开始的技术。容易贴附在半导体元件上的软材料，诸如金，一般缺乏作为弹簧的充分的弹性能。(此种软金属材料主要呈现出塑性，而非弹性形变)。而其它可以容易贴附于半导体元件且具有合适弹性能的软材料往往是非导电性的。如在最具弹性的材料中的情形那样。在任一情形中，所需的结构及电气的特性能可通过施加于芯子外的外覆层而赋予最后形成的复合中间连接元件。最后形成的复合中间连接元件可被做得非常小，却能展现合适的接触力。此外，数个这种复合中间连接元件能被配置于一微细的(例如，254微米)间隙中，即使其具有一远大于该间隙的长度(如，254微米)。
复合中间连接元件能以一超小型比例制造，例如供连接器及插槽之用的“微弹簧”，具有25微米(μm)或更小等级的横截面尺寸。此一制造具有以微米而非密耳(mil)测量的尺寸的可靠中间连接，充分地解决现存中间连接技术及未来区域阵列技术的发展需求。
本发明的复合中间连接元件展现优越的电气特性，包括导电性、软焊能力及低接触阻力。在许多情况中，中间连接元件相对所施加的接触力的偏向会导致一“摩擦(wiping)”接触，其有助于确保形成一可靠的接触。
本发明的额外优点在于以本发明的中间连接元件形成的连接可容易地被卸除。为形成电子组件一端子的中间连接，软焊是可选择的，但一般而言，在系统标准内较不合宜。
根据本发明的一个方面，描述了制造具有受控阻抗的中间连接元件的技术。这种技术一般包括用一介电材料(绝缘材料)涂覆(例如，电泳)一传导芯子或整个复合中间连接元件，以及用一传导材料外层外覆该介电材料。通过将外层传导材料接地，最终中间连接元件能有效地被屏蔽，且其阻抗能容易地被控制。(也可参见母案的图10K)。
根据本发明的一个方面，中间连接元件可以预制成一单一单元，作为后来附接至电子组件之用。这里描述了完成此一目的的不同的技术。虽非特别涵括在此文件中，但欲制造可以将多个单独中间连接元件安装至一基材、或者将多个单独中间连接元件悬置于一弹簧体内或一支撑基材上的机器可视为是相当简单明了的。
应可容易地了解到，本发明的复合中间连接元件大大有别于用涂层来强化导电特性或强化对腐蚀的阻力的现有技术。
本发明的外覆层特别趋向于在实质上强化固定中间连接元件至电子组件的端子上和/或赋予所需弹性特性至最终复合中间连接元件。应力(接触力)作用在中间连接元件的特别趋向于吸收应力的部分上。
本发明的一个优点在于，此处所述的程序完全适于“预制”的中间连接元件，特别是弹性中间连接元件，诸如在一待去除构件上，接着将诸中间连接元件安装在一电子组件上。相对于直接将中间连接元件制造在电子组件上，本发明减少了处理电子组件的周期时间。此外，可能会与中间连接元件的制造相关的屈服问题可因此而与电子组件无关。举例而言，对于一种在其它方面完全优良、相当昂贵的集成电路装置来说，因被制造安装于该处的中间连接元件的错误所破坏是非常不值得的。安装预制中间连接元件在电子组件上是相当简单的，这可由下述内容获得证明。
亦应该知道的是，本发明提供了绝对新颖的制造弹簧技术。一般而言，最终弹簧的操作结构是一电镀、而非弯曲及定形的产物。由此提供了使用广泛材料来构造弹簧形状，及多种将芯子的“临时支架(falsework)”贴附至电子组件上的“友好的”程序的机会。外覆层可作为芯子的“临时支架”外的“加强结构(superstructure)”，这两个名词皆源自土木工程领域。
本发明的其它目的，特征及优点将因以下说明而变得明显。
附图说明
现将针对本发明的较佳实施例详细介绍，诸范例将以附图说明。虽然本发明将就此等较佳实施例作说明，但应了解到，这并不意味着将本发明的精神及范畴局限于此等特定的实施例中。
图1A是根据本发明的、一实施例，包括一中间连接元件一端的纵向部分的横截面图；
图1B是根据本发明的、另一实施例，包括一中间连接元件一端的纵向部分的横截面图；
图1C是根据本发明的、另一实施例，包括一中间连接元件一端的纵向部分的横截面图；
图1D是根据本发明的、另一实施例，包括一中间连接元件一端的纵向部分的横截面图；
图1E是根据本发明的、另一实施例，包括一中间连接元件一端的纵向部分的横截面图；
图2A是根据本发明的、安装至一电子组件的端子上、且具有一多层壳的中间连接元件的横截面图；
图2B是根据本发明的、具有一多层壳的中间连接元件的横截面图，其中一中间层是一介电材料；
图2C是根据本发明的、多个安装至一电子组件(如，探针卡嵌入)上的中间连接元件的立体图；
图2D是根据本发明的、供制造中间连接元件的技术的示范性的第一步骤的横截面图；
图2E是根据本发明的、供制造中间连接元件的图2D技术的、示范性的进一步骤的横截面图；
图2F是根据本发明的、供制造中间连接元件的图2E技术的、示范性的进一步骤的横截面图；
图2G是根据本发明的、依图2D-2F技术制造的若干示范性的中间连接元件的横截面图；
图2H是根据本发明的、依图2D-2F技术及互相以一规定的空间关系制造的若干示范性的中间连接元件的横截面图；
图2I是根据本发明的、一制造中间连接元件的替代实施例的横截面图，显示了一元件的一端；
图3A是根据本发明的一插入物的一实施例的横截面图；
图3B是根据本发明的一插入物的另一实施例的横截面图；
图3C是根据本发明的一插入物的另一实施例的横截面图；
图4A是根据本发明，在一制造一插入物的初步步骤中，一软金属箔的俯视图；
图4B是根据本发明，在一后续程序步骤中，图4A中的软金属箔的横截面图；
图4C是根据本发明，在一后续程序步骤中，图4A中的软金属箔的立体图；
图4D是根据本发明，在一后续程序步骤中，图4A中的软金属箔作为两电子组件间的插入物的立体图；
图5A是根据本发明的一代替实施例，在一制造一插入物的初步步骤中，一软金属箔的俯视图；
图5B是根据本发明，在一后续程序步骤中，图5A中的软金属箔的立体图；
图5C是根据本发明，在一后续程序步骤中，图5A中的软金属箔的立体图；
图5D是根据本发明，在一后续程序步骤中，图5A中的软金属箔作为两电子组件间之插入物的立体图；
图6A是根据本发明的一替代实施例，在一制造插入件的初步步骤中，一软金属箔的俯视图；
图6B是根据本发明，在一后续程序步骤中，图6A中的软金属箔的立体图；
图6C是根据本发明，在一后续程序步骤中，图6A中的软金属箔的立体图；
图6D是根据本发明，在一后续程序步骤中，图6A中的软金属泊作为两电子组件间的插入物的立体图；
图7A是根据本发明的一代替实施例，在一制造一插入物的初步步骤中，一软金属箔的俯视图；
图7B是根据本发明，在一后续程序步骤中，图7A中的软金属箔作为两电子组件间的插入物的立体图；
图8A是根据本发明的、一特别适合制造单独中间连接元件的技术的横截面图；
图8B是根据本发明的、另一特别适合制造单独中间连接元件的技术的横截面图；
图9是根据本发明的一连接器及一插入该连接器的适当位置的电子组件的横截面图。
具体实施方式
前述于95年5月26日提出申请的美国第08/452,255号申请案(母案)已并入本案作参考。本申请案概要地叙述这里所揭示的数个技术。
本发明的一重要方面在于一复合中间连接元件的形成可以芯子(其可被安装至电子组件之端子上)为开始，然后在该芯子外覆以合适的材料，从而：(1)建立最终复合中间连接元件的机械特性；和/或(2)当该中间连接元件被安装于一电子组件的端子上时，安全地固定该中间连接元件于该端子上。以此方式，可制造一弹性的中间连接元件(弹簧元件)，它起始于一软材料的芯子，其可容易地被定形成一可弯曲的形状，且易于贴附至甚至最脆弱的电子组件上。鉴于自硬材料形成弹簧元件的现有技术不易明了，且可论证是反直觉的，因此软材料能形成弹簧元件。
图1A、1B、1C及1D以一般的方式绘示了根据本发明的复合中间连接元件的不同的形状。
下文主要描述展现弹性能的复合中间连接元件。然而，应了解到，非弹性复合中间连接元件亦属于本发明范畴之内。
进一步言之，下文主要描述具有一软(容易定形，且容易藉友好程序附加至电子组件上)芯子，外覆以硬(有弹力的)材料的复合中间连接元件。然而，芯子可以是一硬材料，且它亦属于本发明的范畴之内，外覆程序主要是安全地固定中间连接元件至一电子组件的端子上。
在图1A中，电气中间连接元件110包括一“软”材料(例如，具有一小于2800kg/cm2之屈服强度的材料)的芯子112、及一“硬”材料(例如，具有一大于5600kg/cm2屈服强度的材料)的壳114。芯子112是一细长元件作为(构成)一基本直的悬臂梁，且可以是一具有一0.0127至0.0508毫米直径的引线。壳114是借助任何适当的程序，诸如一适当的电镀程序(例如，电化电镀)施于已成形的芯子112上。
图1A绘示的可能是供本发明的中间连接元件的一最简单弹簧形状，亦即，对一施于其顶端110b的力“F”成一角度的直的悬梁臂。当此种力被电子组件的一端子施加至一中间连接元件正作一压力接触之处时，该顶端的向下(如所示)偏向将明显地导致该顶端，以一“磨擦接触”的动作，移过该端子。此种磨擦接触确保一可靠的接触形成于中间连接元件与电子组件的被接触的端子之间。
因其“硬度”之故，且通过控制其厚度(0.00635至0.127毫米)，壳114传递一所需的弹性能至全部的中间连接元件110。以此方式，一种位于诸电子组件(未显示)间的弹性中间连接能于中间连接元件110的二端110a及110b之间达成。(在图1A中，参考标号110a是标示中间连接元件110的一端部，而相对于端110b的实际端并未显示)。在接触电子组件的一端子时，中间连接元件110受一接触力(压力)所影响，如标示“F”的箭号所示。
中间连接元件(如，110)将会响应一施加的力而偏向，该偏向(弹性能)多少取决于中间连接元件的全部形状、外覆材料(相对于芯子的材料)的占优势的(较大的)屈服强度、以及外覆材料的厚度。
在图1B中，电气中间连接元件120类似地包括一软芯子122(比较112)及一硬壳124(比较114)。在此例中，芯子122被定形成具有两个弯曲，且因而可被视为S形。如图1A的例子中，以此方式，位于诸电子组件(未显示)间的弹性中间连接能在中间连接元件120的两端120a与120b间实现。(在图1B中，参考标号120a标示中间连接元件120的一端部，而相对于端120b的实际端并未显示)。在接触电子组件的一端子时，中间连接元件120受一接触力(压力)所影响，如标示“F”的箭号所示。
在图1C中，电气中间连接元件130类似地包括一软芯子132(比较112)及一硬壳134(比较114)。在此例中，芯子132被定形成具有一个弯曲，且因而可被视为U形。如图1A的例子中，以此方式，位于诸电子组件(未显示)间的弹性中间连接能在中间连接元件130的两端130a与130b间实现。(在图1C中，参考标号130a标示中间连接元件130的一端部，而相对于端130b的实际端并未显示)。在接触电子组件的一端子时，中间连接元件130受一接触力(压力)所影响，如标示“F”的箭号所示。或者，中间连接元件130能被运用以作除了其端130b的端处的接触，如标示“F’”的箭号所示。
图1D绘示了具有一软芯子142及一硬壳144的弹性中间连接元件140的另一实施例。在此例中，中间连接元件140是一绝对简单的悬梁臂(比较图1A)，其具有一弯曲的顶端140b，受一垂直作用于其纵向轴的接触力“F”所影响。
图1E绘示一具有一软芯子152及一硬壳154的弹性中间连接元件150的另一实施例。在此例中，中间连接元件150大致呈“C形”，最好具有一稍微弯曲的顶端150b，且适于作一如标示“F”的箭号所示的压力接触。
应了解到，软芯子能容易地被定形成任何可弯曲的形状，换言之，一种将会使一最终复合中间连接元件响应一施加于其顶端上的力而偏向的形状。举例言之，芯子可能被定形成一传统的线圈形状。然而，一线圈形状并不合宜，乃由于中间连接元件的全部长度及伴随而来的电导(或类似者)及在高频(速度)下操作时对电路所产生的不利效果。
壳的材料，或至少一多层壳之一层(下述)具有一显然比芯子的材料更高的屈服强度。因此，在建立最终中间连接元件的机械特性(例如，弹性能)方面，壳使芯子相形失色。壳与芯子的屈服强度比最好至少为2∶1，包括至少3∶1及至少5∶1，且可以是与10∶1一样高的比例。亦显然可见的是，该壳，或至少一多层壳的一外部层应该覆盖该芯子的端。(然而，母案所描述的实施例中，芯子的端是暴露的，在该案中，芯子必须是可传导的。)
从一理论的观点看，仅需要在最终形成的复合中间连接元件的弹性(弹簧形状)部分外覆以硬材料。从此观点，对于芯子的两端必须被外覆则大致不必要的。然而，以实际的问题来看，最好是外覆整个芯子。外覆芯子的固定(贴附)至一电子组件上的一端的特别原因及所产生的优点则更详细地讨论于下文。
芯子112、122、132和142的合适材料包括，但并不限于：金、铝、硅、镁及类似者。使用银、钯、铂；诸如铂族金属的元素的金属或合金亦属可行。亦能使用由铅、锡、铟、铋、镉、锑及其合金所构成的软焊。
将芯子(线)的一端相对贴附在一电子元件的端子上(下文会更详加讨论)，一般而言，是易于接合(使用温度、压力及/或超声波能达成的接合)的任何材料(例如，金)的线将适于实施本发明。任何能为芯子所使用的、易于外覆(例如，电镀)的材料，包括非金属材料，均属本发明的范畴之内。
壳114、124、134和144的合适材料包括(且，如下文所述，对一多层壳的个别层而言)，但不并限于：镍、及其合金；铜、钴、铁及其合金；金(尤其是硬金)及银，二者皆展现出的电流载送能力及优良的接触电阻系数特性；铂族元素；贵金属及其合金；钨及钼。在一似软焊处理为需要的情况中，亦能使用锡、铅、铋、铟及其合金。
选作施加此等外覆材料于上述不同芯子材料的技术必然会因应用的不同而有不同。大致而言，电镀及无电电镀是较为合宜的技术。然而，一般而言，欲电镀金芯子可能是反直觉的。根据本发明的一个方面，当电镀(尤其是无电电镀)一镍壳于一金芯子上，首先施一薄铜初始层于该金线杆上，以促进电镀的开始。
一示范性的中间连接元件，诸如图1A-1E所绘示的，可能具有一约为0.0254毫米的芯子直径及0.0254毫米的壳厚度，该中间连接元件因而具有一0.0762毫米的全部直径(亦即，芯子直径加二倍壳厚度)。大致而言，壳的此种厚度将在0.2至5.0(1/5至5)倍于该芯子的厚度(例如，直径)的范围。
一些复合中间连接元件的示范性参数为：
(a)一具有38.1微米的直径的金线芯子被定形成具有一1016微米全高度及一228.6微米半径的大致为C形曲线(比较图1E)，并由19.05微米的镍电镀(全直径＝38.1+2×19.05＝76.2微米)，且可选择性地接受一1.27微米的金的最终外覆(例如，以降低及强化接触阻力)。最终复合中间连接元件展现一0.118-0.197克/微米的弹簧常数(K)。使用时，76.2-127微米的偏向会造成9-25克的接触力。此一例子就作为一插入物的弹簧而言是有用的。
(b)一具有25.4微米直径的金芯子线被定形为具有一889微米全高度及一弯曲的悬梁臂形状，并由31.75微米的镍电镀(全直径＝25.4+2×31.75＝88.9微米)，且选择性地接受1.27微米的金的最后电镀。最终复合中间连接元件展现一约0.118克/微米的弹簧常数，就一探针的弹簧元件而言是有用的。
(c)一具有一1.5直径的金芯子线被定形为具有一508微米全高度及一具有约127微米之半径的大致为S形的曲线，并由19.05微米的镍或铜电镀(全直径＝38.1+2×19.05＝76.2微米)。该最终复合中间连接元件展现一值约0.079-0.118克/微米的弹簧常数(K)，且就一安装于一半导体元件上的弹簧元件而言是有用的。
如下文将被更详细描述的，芯子并不需要一圆的横截面，但反而可以是一自一片延伸的平坦的分接头(具有一方形横截面)。
多层壳
图2A绘示了一安装于一设有一端子214的电子组件212上的中间连接元件210的一实施例200。在此例中，一软的(例如，金)线芯子216被接合(附接)于端子214的一端216a上，其自端子延伸并具有一弹簧形状(比较图1B)，且具有一自由端216b。以此方式的结合、定形及分离是借助使用线接合装置来实现的。在芯子之端216a处的人仅覆盖端子214一相当小部分的暴露表面。
一壳被配置于线芯子216上，在此例中，其被显示以多层，具有一内层218及外层220，二者皆可通过电镀工序合适地施加。多层壳的一层或多层是由一硬材料(诸如镍及其合金)所形成，以传递一所需的弹性能至中间连接元件210。例如，外层220可以为一硬材料，而内层可以为一种将硬材料220电镀至芯子材料216上时，充当一缓冲层或阻隔剂层(或作为一激活层，或作为一附着层)的材料。或者，内层218可以为硬材料，而外层220可以是一种展现包括电气传导性及软焊之卓越电气特性的材料(诸如软金)。当需要软焊料或黄铜焊型接触时，中间连接元件的外层可以分别是铅锡软焊料或金锡黄铜材料。
固定至一端子上
图2A以一大致的方式绘示本发明的另一主要特性，即，弹性中间连接元件能被安全地固定至电子组件上的端子上。由于一施加于中间连接元件自由端210b上的压缩力(箭号“F”)，中间连接元件的接附端210a将受相当的机械应力影响。
如图2A所绘示，外层(218、220)不仅覆盖芯子216，亦覆盖以一连续(非中断)方式邻接于芯子216的端子214整个其余(即，除了结合点216a之外)暴露表面。它安全且可靠地将中间连接元件210固定于端子上，而外覆材料提供了一实质(例如，大于50％)上的贡献，使最终形成的中间连接元件固定至端子上。一般而言，仅需要外覆材料覆盖至少一部分邻接芯子的端子。然而，一般较为合宜的是，外覆材料覆盖端子的整个剩余表面。最好是，壳的每一层皆是金属的。
如一一般的设计，芯子所接附(如，接合)至端子的一相当小的区域上并不完全适合调整由于施加于最终复合中间连接元件的接触力(“F”)所产生的应力。由于壳覆盖端子的整个暴露表面(除了包含芯子端216a接附至端子的接附处的小区域外)，整个中间连接结构被牢靠地固定至端子上。外层的附着力及反应接触力的能力将会远超过芯子端216a本身所具备的。
如此处所用的术语“电子组件”(例如，212)包括，但非限定于：中间连接及插入物基材；半导体晶片及模具，由任何适当的半导体材料，诸如硅(Si)或砷化镓(GaAs)所形成；产品中间连接插槽；测试插槽；待去除构件、元件及基材，如本案所述：半导体包装，包含陶瓷和塑胶包装，及晶片载体；以及连接器。
本发明的中间连接元件特别适用于：
·直接安装中间连接元件至硅模具之上，消除对半导体的的需要；
·中间连接元件(如探针)自基材(下文将详述之)延伸供测试电子组件之用；及
·插入物之中间连接元件(下文详述之)。
本发明的中间连接元件独特之处在于其可自一硬材料的机械特性(例如，高屈服强度)中获利，而不受限于硬材料伴随的典型不良的接合特性。如母案所述，此一特点使壳(外层)作为芯子之一“临时支架”上的“加强结构”的事实大为可行，该两名词皆借自土木工程领域。此大大有别于现有技术的电镀的中间连接元件，其中电镀是作为一保护(如，抗腐蚀)的涂层之用，且大致是无法传递所需的机械特性给中间连接结构。且此的确为一显著的相对于任何非金属、抗腐蚀外覆层，诸如施于电气中间连接的苯并三氮唑(BTA)。
本发明的多个优点在于多个分立的中间连接结构可容易地形成于基材上，自不同的水平，诸如一PCB具有一去耦接电容至高于基材的一相同高度，所以它们的自由端彼此共平面。此外，根据本发明的中间连接元件的电气及机械特性(例如，塑性及弹性)皆容易适合多种特定的应用。例如，在一给定的应用中可能需要中间连接元件同时展现出塑性及弹性偏向(塑性偏向可能被需要用以调节被中间连接元件所互连的组件中的总平面性)。当需要弹性动作时，中间连接元件必须产生一临界最小值的接触力以完成可靠的接触。另一有利的是，由于接触表面上的混杂物污染物膜的偶然出现，中间连接元件形成与一电子组件的端子的磨擦接触。
若干特性详述于本案中：包括，但非限定于：制造中间连接元件于牺牲基板上；成组传输多个中间连接元件至一电子组件；提供具接触端的中间连接元件，最好具有粗表面加工；将中间连接元件用于一电子组件上以形成暂时连接，然后永久地连接在电子组件上；配置诸中间连接元件以在它们的一端与它们的相对端具有不同的空间；在与制造中间连接元件相同的程序中制造弹簧夹及对准销；运用中间连接元件以调节被连接的组件间的热膨胀的差异；排除不连续半导体包装(诸如SIMMs)的需要；及选择性地软焊弹性中间连接元件(弹性接触结构)。
受控的阻抗
图2B显示具有多层的复合中间连接元件220。中间连接元件220的最内部(内部细长传导元件)222是一未涂层芯子或已被外覆之芯子，如上述。最内部222的端222b以一合适的掩模材料(未显示)所标识。一介电层224是以电泳步骤施加于最内部222上。一传导材料的外层226施加于介电层224上。
使用时，使外层226电气接地将会造成中间连接元件220具有受控阻抗。一介电层224的示范性材料是一聚合材料，以任何方式施加至任何适当的厚度(例如，2.54-76.2微米)。
外层226可以是多层的。例如，在最内部222是一未涂层之芯子的例子中，当有需要全部的中间连接元件展现弹性时，至少一层外层226是弹簧材料。
探针卡插入
图2C绘示了一实施例230，其中多个(所示为六个)中间连接元件231…236被安装于一电子组件240、诸如一探针卡插入(一以传统方式安装至一探针卡的组件)的一表面上。探针卡插入的诸端子及传导轨迹为说明清晰起见，已被排除于此图之外。中间连接元件231…236的附接端231a…236a起始于一第一间隙(空间)，诸如一0.254毫米的间隙。中间连接元件231…236被定形和/或定向，以便它们的自由端(顶)在一第二、更细的间隙内，诸如0.127毫米。从一间隙至另一间隙形成中间接合的中间接合组件一般叫做“空间变换”。
如上所述，中间连接元件的顶端231b…236b被排列成平行的两行，以便与具有平行两行接合区(接触点)的半导体装置接触(供测试和/或焊上)。中间连接元件也可排列成具有其它顶端模图的形式，以便与具有其它接触点模图诸如阵列的电子元件接触。
一般来说，所有此处所公开的实施例，虽仅有一中间连接元件可以显示，但本发明也可应用于制造多个以彼此规定的空间关系配置的中间连接组件，诸如在一周边模图或一方形阵列模图上。
牺牲基板的使用
直接安装中间连接元件至电子组件的端子上已于上文讨论过。一般而言，本发明的中间连接元件能被制造于，或被安装至包括待去除座的任何合适基材的合适表面上。
请注意母案，它参考图11A-11F，描述了制造多个中间连接结构(例如，弹性接触结构)作为分离且不同结构供安装至电子组件上，且参考图12A-12C，描述了安装一牺牲基板(载体)然后转移该多个中间连接元件至一电子组件上。
图2D-2F绘示供使用一牺牲基板制造多个具有预塑端结构的中间连接元件之用的技术。
图2D绘示技术250的第一步骤，其中掩模材料252的一模型层被施加在牺牲基板254的一表面上。牺牲基板254可以是薄(25.4-254微米)的铜或铝箔，掩模材料252可以为普通光刻胶。掩模层252被铸成具多个(所示有三个)在位置256a、256b和256c的开口，在该处，需要制造中间连接元件。位置256a、256b、及256c最好在上阶段处理成具有一粗糙的或有特性的表面结构。如所示，其可以一压花工具257以机械的方式在箔254内的位置256a、256b及256c处形成凹陷而完成之。或者，在此等位置的箔的表面利用化学蚀刻的方式使其具有表面结构。任何适于完成此一般目的的技术皆属于本发明的范围之内，例如喷砂法、槌平及类似者。
接着，使多个(此处显示一个)传导端结构258形成于各位置(如，256b)处，如图2E所示。此可用任何适合的技术(诸如电镀)完成之，且可以包括具有多层材料的端结构。例如，端结构258可以具有一薄(如，0.254-2.54微米)的施于牺牲基板上的镍的阻隔层，接着为一薄(如，0.254微米)层的软金，接着为一薄(如，0.508微米)层的硬金，接着为一相当厚(如，5.08微米)的镍，最后为薄(如，2.54微米)的软金。一般而言，第一薄阻隔层的镍用来保护后续层金，以免于被基材254的材料(如，铝、铜)“毒害”，此相当厚的镍层给端结构提供强度，而最后一薄层软金提供一容易接合的表面。本发明不限定端结构是如何形成于牺牲基板上的，因为此等形成方法会因应用之不同而不同。
如图2E所示，多个(此处显示一个)供中间连接元件之用的芯子260可以形成于端结构258上，诸如藉任何将一软线芯子接合至上述电子组件的端子的技术。芯子260接着以一最好是硬的金属262以上述之方式外覆之，且接着将掩模材料252移除，结果多个分立的中间连接元件264安装至牺牲基板的表面上，如图2F所示。
以一类似于将外覆材料至少覆盖如图2A所述的端子214的邻接区域的方法，利用外覆材料262牢靠地将芯子260固定至其相对的端结构258上，且若有需要，将弹性特征赋予最终中间连接元件264。如见于母案，该多个安装至待去除基座的中间连接元件可以为组传输至一电子组件的诸端子上。或者，可采用二个较扩散的路径。
如图2G所绘示，藉由任何适合的步骤，诸如选择化学蚀刻，可简单地移除牺牲基板254。因为多数选择的化学蚀刻步骤将会以一远大于一其它材料的速率蚀刻一材料，且该其它材料在此步骤中可以稍微被蚀刻，此一现象则有利地被运用，以在移除牺牲基板同时移除端结构中的薄镍阻隔层。然而，若需要，薄镍阻隔层能在一后续的蚀刻步骤被移除。由此形成数个(此显示三个)独立、分离、单一的中间连接元件264，如虚线266所标示，其可随后被安装(藉诸如软焊或硬焊的方式)至电子组件的诸端子上。
应该提及的是，外覆材料亦可稍微地在移除牺牲基板和/或薄阻隔层的程序中稍微变薄。然而，此情形最好不要发生。
为防止外覆材料的薄化，较佳的是利用金薄层，或者如在约0.508微米的硬金上外覆约0.254微米的软金；以作为外覆材料262外的最外层，使用此种金的外层主要是因其优越的导电性、接触抗性及可焊性，且其通常不受因使用去除薄障碍层及牺牲基板的蚀刻溶液的影响。
另外，如图2H所示，在移去牺牲基板254之前，可藉由如其中具许多孔的薄板的任何合适的支撑结构266，将许多(示出其中三个)连接元件以所希望的相对空间位置关系互相“固定”，在此情况下移去基材。支撑结构266可为绝缘材料，或外覆有绝缘材料的导电材料。可进行进一步的处理(不另说明)，如将许多连接元件装设于如硅晶片或印刷电路板的电子零件上。此外，在某些应用中，有必要稳定中间连接元件264的尖端(相对于尖端结构)，以避免移动，特别是使用接触力时，为此目的，有必要以适当的具有许多孔的片材268，如绝缘材料制成的筛网来限制中间连接元件尖端的移动。
上述技术250的独特优点在于：尖端结构258可由实际上所希望的材料制成，且可为任何所希望的构造。如前所述，金是一种表现极佳电导体性质、低接触抗性、可焊性及抗腐蚀等电的特性的贵金属的典型。由于金亦可延展，故特别适合作为所述任何连接元件的最后外覆，特别是此处所述的弹性连接元件。其它贵金属展示相似的所希望的性质。然而，展示此类优异电的特性的如铷的某些材料并不适合外覆整个连接元件。举例而言，铷是明显易碎的，且当其作为弹性连接元件的外覆时，表现并不好。以此作考虑，以技术250作为典型的技术可稳定地克服此种限制。例如，多层端结构(见258)的第一层可为铷(非以上所述的金)，以此利用其优异的电的特性供连接电子零件，但不致对所得的连接元件的机械性能产生影响。
图2I说明供制造连接元件的另一实施例270。在此实施例中，以相当于以上图2D所述的技术，在牺牲基板274上施以一掩模材料272，并将其图案化使之具有许多(示出其中之一)开口276，在该等开口276所限定的区域上，以分立结构形式制造连接元件。(如直至目前为止说明书中所述的，当其一端接合至电子零件的终端或牺牲基板的区域，但连接元件的相对端并未接合至电子零件或牺牲基板时，一连接元件是“分立的”。)
可以任何适当方法使开口区域内具有某种结构，如一次以上的压缩，如延伸入牺牲基板274表面的单一压痕278所表示。
一芯子(线杆)280被一至开口276中的牺牲基板的表面，且可为任何适当型状。在此说明中，为清楚说明起见，仅示出一连接元件之一端。另一端(未示出)可附接于一电子零件上。可清楚观察到，技术270不同于前述技术250处在于：芯子直接接合至牺牲基板274上，而非接合至端结构258上。藉由此例，以传统线接合技术，金线芯子280可稳固地接合至铝基材274的表面。
在方法270的下一步骤中，在芯子280上及开口276中基材274的暴露区(包含在压痕278)上施以(如，以电镀法)一金层282，此层282的主要目的是在所得连接元件(如，一旦移除牺牲基板)的端部形成一接触表面。
之后，在层282外施以一如镍的相对硬的材料层284。如前所述，层284的主要目在于将所需的机械性质(如弹性)赋予所得的复合连接元件。在此实施例中，层284的另一主要目的是加强所得连接元件较低端(如图所示)上所制造的接触表面的耐久性。金的最终层(未示出)可施于层284外，以加强所得连接元件的电的性质。
在最终步骤中，除去掩模材料272及牺牲基板274，制成许多或是单一的连接元件(比较图2G)，或是具有预定的彼此空间关系的许多连接元件(比较图2H)。
此实施例270是供在连接元件的端部制造突出的接触尖端的技术的典型。在此例中，说明了一“金外覆镍”接触尖端的优异实例，然而，在本发明的范畴中，根据此处所述的技术，可在连接元件的端部制造其它类似的接触尖端。此实施例270的另一特征在于：接触尖端完全突出于牺牲基板274上，而非如前述实施例250所述在牺牲基板254的表面内。
插入物
使用本发明的中间连接元件的主体已叙述于上文中。一般而言，如此处所用的“插入物”是指一基材，其在二相对表面具有接触点，配置于二电子组件之间以互连二电子组件。往往，需要插入物是为了让至少二个互连的电子组件中的一个被移除(例如，为取代、改良、及类似的目的)。
插入物实施例1
图3A绘示了一使用本发明的中间连接元件的插入物的实施例300。大致上，一绝缘基材302(诸如PCB型基材)上设有多个(此处并示两个)导电的穿透孔(例如，电镀通道)306、308或类似者，各具有暴露于绝缘基材302的顶(上)302a及底(下)302b的表面。
一对软芯子311及312附接至基材302的顶表面302a上的穿透孔306的暴露部分。一对软芯子313及314附接至基材302的底表面上的穿透孔306的暴露部分。类似地，一对软芯子315及316附接至基材302的顶表面上的穿透孔308的暴露部分，且一对软芯子317及318附接至基材302的底表面上的穿透孔308的暴露部分。在芯子311…318上外覆以一硬材料320，以在基材302的顶表面302a上形成中间连接结构322及324，且在基材302的底表面302b上形成中间连接结构326及328。以此方式，对应的芯子311…318可牢靠地固定在穿透孔的对应暴露部分，中间连接结构322以电气的方式连接至中间连接结构326，且中间连接结构324电气连接至中间连接结构328。可以看到，通过将各中间连接结构(如，322)设为一对中间连接元件(如，311、312)，则可达成外部组件(未显示)更加可靠的连接(如，相对于单一中间连接元件而言)。
如所示，中间连接元件311、312、315及316的顶部组皆以同样的形状形成，且中间连接元件的底部组皆具有相同的形状。应该了解的是，中间连接元件的底部组能设有一种与中间连接元件顶部组不同的形状，其将能提供一种机会，以制造出与从基材的底表面延伸的中间连接结构不同机械性质的从绝缘基材的顶表面延伸的中间连接结构。
插入物实施例2
图3B绘示了使用本发明的中间连接元件的一插入物的另一实施例330。在此实施例中，多个(此处显示一个)中间连接元件332制造于一牺牲基板(未显示)的所需的模图(例如，一阵列)上。一支撑基材334在一对应模图中设有多个孔336。支撑基材334置于中间连接元件332之上，以便中间连接元件332伸出孔336。中间连接元件332藉一合适的材料338(诸如一弹性体)松弛地固持于支撑基材之内，且从该支撑基材的顶及底表面延伸出来。然后，移除牺牲基板。明显地，在制造此一插入物组件的程度中，支撑基材334(比较266)能简单地“掉落”在多个安装于牺牲基板254的中间连接元件(比较264)上。
插入物实施例3
图3C绘示了使用本发明的中间连接元件的一插入物的另一实施例360。此实施例360类似前述的实施例330，除了中间连接结构362(比较332)是通过将中间连接结构362的中间部分软焊至支撑基材的穿透孔366的电镀部分368而支撑于孔366(比较336)中。此外，支撑基材364(比较266)能简单地在制造此插入物组件的程序中“掉落”在多个安装于牺牲基板254的中间连接元件(比较266)上。
图3B及3C绘示的事实为，一单一中间连接元件(332、362)能被用作完成两件电子组件的对应端子的单一连接。应被了解且属本发明范围的是，任何传导元件可用以代替本发明的中间连接元件，如图3B及3C所示。
应被了解的是，在图3A、3B及3C所示的插入物的实施例中，电子组件(未显示)可配置于插入物300、330和360的两端，以便插入物在诸端子(未显示)间形成电气连接。
由薄片形成中间连接元件
上述内容主要集中于由软线芯子形成的中间连接元件，其以一硬材料定形与外覆。本发明亦适于形成这样一种中间连接元件，其由铸形(诸如藉冲锻或蚀刻)的软的金属薄片形成，且外覆以一硬材料。
关于由弹性材质的平坦金属层形成可向垂直方向变形的连接结构的现有技术已被说明，例如，在美国专利第4,893,172号(“MATSUMOTO”)中。MATSUMOTO案公开了制造在一绝缘薄片上的螺旋传导平坦弹簧。各该弹簧的内部端与一穿过绝缘片的孔对齐，该绝缘片对应于晶片电极32的位置，且由软焊料31焊至该电极上。各弹簧的外部端固定至绝缘薄片，且与一基材电极以软焊料41连接。
MATSUMOTO案的弹簧的制造是通过将一薄的、平坦的弹簧材料(铜、铜合金、或铜的复合金属)粘至一绝缘薄片(聚酰亚胺树脂、玻璃、环氧树脂、玻璃聚酰亚胺树脂、多元脂树脂、包含石英纤维的聚酰亚胺树脂、或一聚酰亚胺、包含碳纤维的环氧树脂或多元脂)形成的。接着，在绝缘薄片材料上形成各大于尚待形成的传导平坦弹簧的螺旋部分的孔。接着，该平坦弹簧材料藉光蚀刻形成一螺旋形状。最后，将传导平坦弹簧软焊至对应的切角电极32及基材电极42上。对此一步骤次序的一些替换叙述于MATSUMOTO案中(例如第4列，第27-36行)，其包括热压缩接合、硬焊或取代软焊的焊接。所述各弹簧较适宜的大小范围为，10-40μm厚度及40-70μm宽度(直径)。MATSUMOTO案中所述的弹簧结构在于在互连电极32和42间的固有的长传导路径，如上所述，该结构并不适于许多应用。此外，在垂直方向(以给定的弹簧常数)的增加的运行使一较大直径的螺旋弹簧成为必要。再者，MATSUMOTO案的装置仅仅为诸电极间的全部中间连接的每弹簧确立一单一的弹簧常数。
从上所述可见，本发明易于建立复合中间连接元件(外覆芯子)的一第一弹簧常数，该中间连接元件向上突出以与一第一电子组件连接，以及建立复合中间连接元件(外覆芯子)的一与该第一弹簧常数不类似的第二弹簧常数，该中间连接元件向下突出以与一第二电子组件连接(例如，见图3A)。一般而言，对一给定的外覆，且就同时对所有芯子进行外覆而言，完全不同的弹簧速率可容易地通过调整芯子元件的物理特性(例如，厚度、形状等等)而实现。此概念由下述的悬臂实施例所实现。
悬臂实施例1
图4A、4B、4C及4D说明根据本发明的用以制造一插入物的技术。在图4A中，显示了一平坦、薄(诸如0.0254-0.127毫米)的软金属(例如，金、软铜合金、软铝合金)薄片402被铸形(如通过冲锻或蚀刻)以形成此处所述的多个(此处显示两个)细长元件404、406。各细长元件具有一个中间部分及两个自中间部分在薄片平面上延伸的端部分。
如图4B所示，一层掩模材料408(诸如光刻胶)施加于诸细长元件区域外的软金属薄层上。各细长元件的端部相对该薄片弯离平面。细长元件404的一端部404a向一单一方向(向上，如所示)弯曲，藉以形成一自薄片402向上延伸的分接头。该细长元件的另一端部404b向一相对(向下，如所示)方向弯曲，藉以形成一自薄片402向下延伸的分接头。分接头404a、404b可以自薄片延伸至实质上任何所需的距离，例如127-2540微米，以供微电子应用。这种分接头404a、404b的形状能独立地受控于弯曲步骤，故向上延伸的分接头具有与向下延伸的分接头相同或不同的形状。
应了解到，分接头能以与细长元件的铸形相同的步骤成形，且此等步骤能以现有的设备执行。
如图4C所示，一绝缘(介电)支撑层410(诸如铥(Tm)或聚酰亚胺的薄层(膜、板))上设有多个孔412。绝缘薄片410置于软金属薄片402上，故诸孔412在相对于掩模材料的薄片的一侧与诸分接头对齐，且由合适的粘结剂(未显示)固定于软金属薄片上。
在此实施例及下述诸实施例中的绝缘薄片可是一具有介电材料涂层的金属板，且它们均属于本发明的范畴。
整个组件于是被外覆以一硬材料，诸如镍及其合金。支撑薄片410及掩模材料408确保仅有细长元件被外覆以硬材料。最后，剥除掩模材料408，而尚未被外覆的软金属被诸如选定的化学蚀刻法移除。可选择的方式为，在后完工步骤时，中间连接元件可以以一展现良好接触阻力特性，诸如金的材质加以外覆。
由此造成一具有复合中间连接元件(外覆的分接头)的中间连接结构，而复合中间连接元件自其顶及底表面延伸，如图4D所示，各该向上延伸的复合中间连接元件的作用为一悬臂，且被一薄片连接至一亦作悬臂而向下延伸的其中一个相对分接头上，各该复合中间连接元件足以传递一所需的接触力(例如，15克)至一电子组件的对应端子处。
以此方式，可获得一插入物400，其具有二尖端供连接一第一电子组件(未显示)的端子420至一第二电子组件(未显示)的端子422之用，且可获得一适于使用于一插入物的第二中间连接结构件，该结构具有二尖端供连接该第一电子组件(未显示)的端子424至该第二电子组件(未显示)的对应端子426之用。
图4D绘示了一中间连接结构400，其由一细长元件416形成，并以形成前述中间连接结构的方式外覆以相同的材料412。细长元件416与细长元件406以一距离纵向地成一列，而细长元件404则与细长元件406以一距离横向地成一列，由此表示中间连接元件可以以阵列配置。邻接的细长元件之间的空间将针对图7A及7B更详细地描述。
此技术及将会明显的后述的技术的一个优点在于，一可轻易成形(冲锻及定形)的软的、非弹性金属薄片可以以一类似于软线芯子被定形及外覆以展现弹性的方式被外覆，并展现强韧的弹性特性。
一夹具可以在外覆(例如，电镀)程序期间执行掩模的功能，而使掩模材料为非必要的，这也属于本发明的技术范畴之内。
多个中间连接元件可以形成一对应接触结构，接着在彼此附近以诸如一支撑薄片被支撑，这也属本发明的技术范围之内。
一般而言，支撑层410以一彼此规定的关系，诸如以一垂直(x，y)阵列模型，支撑多个中间连接元件。支撑层可以是可挠的，如上所述，也可以是刚性的(例如，由陶瓷制成)。一可挠的支撑层具有可让被支撑的中间连接元件在某一定程序的垂直位置“悬浮”的优点，以调整待连接的电子组件的表面差异(公差)。此主题将会在讨论图7A及7B时予以详述。
悬臂实施例2
图5A-5F绘示了由一平坦金属薄片制造一插入物的代替技术。
如图5A所示，一平坦软金属(例如，铜)薄片(如，箔)被铸形(冲锻、蚀刻、或类似方法)，以便具有对立的细长元件504及506，它们大致彼此邻接且平行。细长元件506及504的底端由一环508所固持。
以一类似于图4A-4D的实施例的方法，细长元件504的一端被弯曲成一向一方向弯曲的分接头，而另一被弯曲成向一相反方向的分接头，导致图5B(比较图4B)所示的状态。
如图5C所示，一合适的掩模材料510(诸如光刻胶)施加于薄片502上，且在环508及细长元件504及506的区域之外。
薄片502于是被外覆(如，电镀)以一硬金属材料(如镍或其合金)512，藉以将分接头(定形的细长元件504及506)转换成具有弹簧功能的中间连接元件。接着，藉由诸如选定的蚀刻法将掩模材料510移除，形甩图5D所示的插入物结构500，它具有上指的复合中间连接元件及对应的下指的复合中间连接元件，向上及向下指的中间连接元件皆作为悬臂，各足以传递一所需的接触力(如，15克)至一电子组件的对应端子。
以此方式可获得插入物500，它具有两端，供将一第一电子组件(未显示)的端子520连接至一第二电子组件(未显示)的对应端子522之用。
一般来说，图4A-4D的实施例400较优于图5D-5A的实施例500。
悬臂实施例3
如图6A-6D所示，通过将一软金属薄片602铸形成具有两个平行(并排)的细长元件604及606，且它们共用一底部608，可形成一类似产品(如，针对图5A-5E前述实施例而言)。
细长元件604的一端被弯曲成一向一方向延伸的分接头，而细长元件的另一个被弯曲成向一相对方向延伸的分接头，造成如图6B所示的形态(比较图5B)。
如图6C所示，将合适的掩模材料，诸如光刻胶610施加于薄片602上，但在细长元件604及606及它们的共用底部608区域之外。
接着，薄片602被外覆(如，电镀)一硬金属材料(如镍或其合金)612，藉以将分接头(定形的细长元件604及606)转换成具有弹簧功能的中间连接元件。接着，藉由诸如被选定的蚀刻法将掩模材料610移除，且将所有非外覆(藉612)的软金属602移除，形成图6D所示的插入物结构600，它具有上指的复合中间连接元件及对应的下指的复合中间连接元件，向上及向下指的中间连接元件皆作为悬臂，各足以传递一所需的接触力(如，15克)至一电子组件的对应端子。
以此方式，可获得插入物600，它具有两端，供将一第一电子组件(未显示)的端子620连接至一第二电子组件(未显示)的对应端子622之用。
虽未显示，但多个中间连接元件可以通过将它们固定至一诸如设有多个孔的合适的支撑组件上，而配置于一所需的模图(如一矩形阵列)上，如图4C所示。
“混成”实施例
参照图4A-4D所示的实施例，很明显，在细长元件404、406原长(弯曲前)基础上建立的分接头限制了自该薄片延伸的长度，换言之，即最终中间连接元件的长度(和/或高度)受到了限制。
这里所使用的名词“长度”一般指一细长元件在定形(若有)之前的纵向大小，而名词“高度”一般指细长元件(及最终中间连接元件)在定形及涂层之后的纵向大小。为本文献的的缘故，这些名词大致上是可替换的。
如上所述，在一微电子区域中建立一具有微细间隙的、诸如邻近中间连接元件间为0.254毫米(254微米)的中间连接元件阵列是人所希望的。然而，对于各中间连接元件而言，能具有1270微米、2540微米或更多高度亦是人所希望的。参见图4D，可明显看到，位于邻近中间连接结构间(例如，406、416)的254微米的空间会使中间连接元件的此种高度在实质性上是不可能的。
图7A及7B绘示了根据本发明克服实质性上限制的技术。
图7A绘示一软材质制的平坦薄片702。一单一细长元件704(比较404、504、604)形成于薄片702上，且向一方向(向下，如所示)弯曲，藉以形成一个自薄片702向下延伸的分接头。
因为，如上述，人们期望具有相当长度但又彼此紧密配置的中间连接元件，于是，将芯子710附接于分接头的上(如所示)表面，靠近分接头自由端处，且定形成具有弹簧功能的形状。该芯子可形成具有弹簧功能的任何形状(例如，比较图1B所示的形状)，且能成为实质上想要的任何长度，且一金接合线合适地连接该分接头，如图7B所示，分接头704及芯子710的最终组件是外覆以一诸如镍及其合金的硬材料712。芯子710大致正规地(如，以九十度)延伸至分接头704的表面。
以此方式，可获得一适于使用于一插入物的中间连接结构，它具有两端，供将一第一电子组件(未显示)的端子720连接至一第二电子组件(未显示)的一对应的端子722之用。
分接头(外电镀以材料712的细长元件704)作为芯子710的一“悬浮支撑”，且也在该芯子的下端(如所示)建立一接触尖端。这是有利的，尤其在需要中间连接元件来调节一待接触的电子组件诸端子的同平面性上总偏差的应用。举例言之，一电子组件可以具有非平面的表面，此情况下电子组件诸端子(如，722)将会在“Z”(垂直)轴的不同位置上。两个机构可用来调节这种非平面性。首先，分接头704容易地用来调节这种不规则(位置上的公差)，而允许中间连接元件710建立一相当坚固且可预测的弹性力在该两互连的电子组件之间。第二，外覆的芯子亦可以展现塑性及弹性形变的组合，塑性形变可调节电子组件上的端子的非平面性。因此，外覆的细长元件704主要作为外覆细长元件710的悬浮支撑，而毋需制造一相当的结构给外覆的细长元件710提供所使用的接触力，即使其较硬于外覆的细长元件710。(比较图3B所示实施例330的弹性支撑338)。
或者，细长元件704可以实质上整个被掩模(例如，比较图5C的掩模材料510)，以便细长元件704对主要由塑性形变而非由弹性形变所形成的力作反应。在此方面，这种替代的结构会承受一些(有限的)如图3B所示实施例的功能上的类似点。细长元件704是部分或完全地被掩模，以便借助控制形成于其上的外覆材料712的量而视需要调整其物理特性，这也属于本发明的范围之内。
明显地，图7A-7B的实施例700能使中间连接元件以一微细(如，254微米)的间隙制成，但其长度及延伸的高度(如，2540微米)远大于它们的间隙。
芯子710能安装于一端部平坦螺旋弹簧上，诸如示于前述美国专利第4,893,172号案中的螺旋弹簧的内部端，这也属于本发胆的范围内。
制造单独的中间连接元件
图8A及8B绘示了制造单独中间连接元件的技术，诸如堆积多个这种“弹簧接触”的元件，且随后自动地将它们组装成一诸如半导体元件或插入物的支撑基材的电子组件。
图8A绘示了一技术800，其中诸如软铜材质的一平坦薄片(箔)802通过冲锻、蚀刻或类似方法已形成多个(此显示一个)细长元件(分接头)804。细长元件804随后被定形成具有一弹簧的形状。各细长元件804具有一底部804a，其实质上为薄片802的一残余(剩余)部，且其最好被允许保持与薄片802共平面。各细长元件804自底部804a的相对端具有一端(顶)部804b。细长元件804位于顶部804b与一邻接于底部804a的部分804d之间的区域804c，弯曲成任何适当的、具有弹簧功能的形状。
合适的掩模材料806(诸如光刻胶)施加于薄片802的两侧，包括(如所示)可选择地加于细长元件804的底部804a上，留下细长元件804的“可操作”部分为未掩模的状态。然后，细长元件外覆以一合格的材料808，且如上所述，选定作为传递弹性至最终中间连接元件的能力。外覆材料可以选择性地覆盖细长元件804的底部804a.
然后，去除掩模材料806，诸如藉由选择的蚀刻。由此形成多个单独复合中间连接元件，这种元件能安装至一电子组件上，或通过它们的底部804a被固定在一支撑基材上，而以彼此规定的空间关系(如，一阵列)被支承。或者，多个根据此一技术形成的中间连接元件能被一弹性体支撑于一阵列中。
图8B绘示了另一技术850，其中诸如软铜材质的一平坦薄片(箔)852通过冲锻、蚀刻或类似方法而形成多个(此处示六个)细长元件(分接头)854。细长元件804随后被定形成具有一弹簧的形状。各分接头854a可比得上先前实施例800中的底部804a。在此实施例850中，薄片被冲锻以便底部854a全部彼此连接。所绘示的“桥”856仅是例示性质。细长元件可以在冲锻期间或之后被定形。
细长元件854被定形成具有弹簧形状，然后如上所述被外覆以合适的材料(未显示)。外覆层(未显示，如上述)最好在细长元件仍然彼此互连之际施加，且不需要施加任何掩模材料。
在一最终步骤时，包含多个互连的、外覆的细长元件的薄片被进一步冲锻，以便彼此分离(分隔)成单独的外覆细长元件。
如前述例子800，此技术850形成多个单独的中间连接元件，它们能安装至一电子组件、或通过将它们的底部固定在一支承基材上而彼此被支撑于一阵列中。或者，多个根据此一技术形成的中间连接元件能被一弹簧体悬置于一阵列中。
制造连接器/插槽
图9绘示了使用上述关于自一软金属薄片制造中间连接元件的另一个优点，该软金属薄片已被外覆以一硬材料。连接器900包含一塑料的本体902及多个(显示两个)用于连接器本体902内的中间连接元件904、906。各中间连接元件906、904以一类似于上述有关图4A-4D的插入物的方式被制造，即一软金属薄片910被铸形及定形成具有一特定形状，然后外覆以一硬材料912以提供所需的机械特性(如弹性)。如先前的例子，具有杰出电气特性(如，金)的材料的一最后层(未显示)能施加于外覆的中间连接元件上。
连接器900适于容纳另一个匹配的连接器或电子组件，如所示，具有自表面延伸的接脚924及926的电子组件920，接脚924及926分别插入中间连接元件904及906。
如上所述，本发明大大有别于现有技术，其中一外覆层是用来提供所需的机械特性(如，弹性)给另一非弹性、易成形、不完全的中间连接元件(接触结构)。在现有技术中，涂层(包括金电镀)主要用于强化中间连接元件的电气特性，且防止腐蚀。
中间连接元件能在电子组件上“于其原来的位置”被制成，或“预先制造”供随后安装于电子组件之用。
虽然本发明已在附图及前述说明中详细予以绘示及说明，但其乃作为说明而非作为限制。应该了解到仅有较佳实施例被显示及描述，但所有来自本发明精神的变化及修改均应被保护。无疑地，本发明技术领域内的熟练人员会联想到许多其它上述“主题”的“变化”，但这些变化乃应属于本发明范畴之内。若干这种变化则在母案中有描述。

Claims (14)

1.一种微电子组件的插入物的制造方法，其包含：在第一导电材料的薄片中生成一具第一分接头及第二分接头的中间连接元件，该第一分接头和第二分接头位于薄片的平面内；折弯该两分接头，使两分接头中的一个以第一方向自薄片的一个表面延伸出来，两分接头中的另一个以第二方向自薄片的一相对表面延伸出来；以一具较第一导电材料屈服强度高的第二导电材料外覆该两分接头。
2.根据权利要求1所述的方法，其特征在于，还包含：提供许多中间连接元件；将该许多中间连接元件连接于一绝缘片材。
3.根据权利要求1所述的方法，其特征在于：在折弯该两分接头之前，在薄片的平面内将第一分接头与第二分接头纵向地排成一线。
4.根据权利要求1所述的方法，其特征在于：在折弯该两分接头之前，在薄片的平面内该第一分接头平行于第二分接头。
5.根据权利要求1所述的方法，其特征在于：在折弯该两分接头之前，该第一分接头平行于第二分接头，且这些分接头共用一底部。
6.根据权利要求1所述的方法，其特征在于：该第一导电材料是可挠的，并且该两分接头被弯折成使其待与一微电子组件接触的自由端与薄片平面相隔开。
7.根据权利要求1所述的方法，其特征在于，还包含：用一掩模层覆盖薄片的一部分，其中，该两分接头被选择性地实施外覆，在该两分接头被实施外覆时，该掩模层防止薄片的所述部分被外覆。
8.根据权利要求1所述的方法，其特征在于：一底部将该两分接头互连于一起，该底部被外覆以该第二导电材料。
9.根据权利要求1所述的方法，其特征在于：该两分接头是可挠的，并且所外覆的外覆层的尺寸足以让分接头发生弹性作用并允许一接触元件在弹性作用下移动，该接触元件即包括一分接头和一相应的外覆层。
10.根据权利要求1所述的方法，其特征在于：该第一导电材料的厚度为0.0254-0.127毫米。
11.根据权利要求1所述的方法，其特征在于：每个分接头自薄片延伸一段127-2540微米的距离。
12.根据权利要求1所述的方法，其特征在于：该第一导电材料选自由金、软铜合金、软铝合金组成的集合。
13.根据权利要求1所述的方法，其特征在于：该第二导电材料包括镍。
14.根据权利要求1所述的方法，其特征在于，还包含：生成中间连接元件的步骤还包括在该薄片中生成另一具第三分接头及第四分接头的中间连接元件，该第三分接头和第四分接头位于薄片的平面内；弯折分接头的步骤包括弯折第三分接头和第四分接头，使第三分接头沿第一方向延伸，第四分接头沿第二方向延伸；外覆分接头的步骤还包括以第二导电材料外覆第三分接头和第四分接头；在生成中间连接元件的步骤之后，将薄片连接于一支撑基材上；从支撑基材上去除一部分薄片而使该两个中间连接元件彼此电气绝缘。
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