CN104427776A - Manufacturing method of yin-yang copper-thickness printed circuit board - Google Patents
Manufacturing method of yin-yang copper-thickness printed circuit board Download PDFInfo
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- CN104427776A CN104427776A CN201310364780.3A CN201310364780A CN104427776A CN 104427776 A CN104427776 A CN 104427776A CN 201310364780 A CN201310364780 A CN 201310364780A CN 104427776 A CN104427776 A CN 104427776A
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- Prior art keywords
- copper face
- thick
- wiring board
- printed wiring
- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention is applicable to the technical field of processing of a printed circuit board and provides a manufacturing method of a yin-yang copper-thickness printed circuit board. Separate etching processing of a thick copper surface and a thin copper surface is adopted so as to solve a problem of incapability of processing fine lines in the prior art. The manufacturing method includes the following steps: providing a printed circuit board with different copper foil thicknesses; manufacturing conductive lines: manufacturing a first conductive line and a second conductive line on a thick copper surface and a thin copper surface respectively; and post-processing. The step of manufacturing the first conductive line on the thick copper surface includes the following steps: outer-layer pattern transference, pattern tinning and alkaline etching. The step of manufacturing the second conductive line on the thin copper surface includes the following steps: outer-layer pattern transference and alkaline etching. In the method, the first conductive pattern and the second conductive pattern are manufactured on the thick copper surface and the thin copper surface respectively so as to manufacture fine lines on the printed circuit board with different copper foil thicknesses so that the manufacturing method is suitable for processing a printed circuit board, in which the range of copper foil thicknesses of two surfaces is an any value.
Description
Technical field
The invention belongs to printed circuit board (PCB) processing technique field, particularly relate to the manufacture method of the thick printed wiring board of a kind of negative and positive copper.
Background technology
In the manufacture of printed wiring board, etch process is a wherein indispensable important step.Particularly along with the develop rapidly of microelectric technique, the extensive use of large scale integrated circuit and very lagre scale integrated circuit (VLSIC), make the conductor width on printed wiring board and spacing more and more less, wiring density and precision also more and more higher, the precision etched and tolerance are proposed to the technical requirement of more Gao Gengyan, the quality of etching quality directly has influence on the quality good or not of printed wiring board.
For the printed wiring board that copper thickness is identical, usually, adopt two sides to etch simultaneously, can meet the demands.But for the printed wiring board that copper thickness is different, two sides etches and cannot meet the demands, and at present, common mode has simultaneously: a kind of is that the circuit etching compensation rate on two sides compensates on an equal basis by the one side that copper thickness is thicker, then carries out etch processes; Another kind is that two sides makes circuit etching compensation by actual copper thickness, and by adjustment etching pressure during etching, this mode is only applicable to the situation that two sides copper thickness extreme difference is less than or equal to 1 ounce.But these two kinds of modes are all suitable only for the printed wiring board of the non-constant width of line pitch, cannot process the printed wiring board of fine-line, and, also cannot process the printed wiring board that two sides copper thickness extreme difference is greater than 1 ounce.
Summary of the invention
The object of the present invention is to provide the manufacture method of the thick printed wiring board of a kind of negative and positive copper, adopt thick copper face and thin copper face to separate etch processes, be intended to solve the problem cannot processing fine-line in prior art.
The embodiment of the present invention is achieved in that the manufacture method of the thick printed wiring board of a kind of negative and positive copper comprises the following steps:
There is provided printed wiring board, described printed wiring board comprises copper thickness difference and the thick copper face be oppositely arranged and thin copper face;
Make conducting wire, on described thick copper face and described thin copper face, make the first conducting wire and the second conducting wire respectively; And
Reprocessing, makes in described first conducting wire and described second surface, conducting wire the solder mask shielded, and carries out processing and forming to described printed wiring board;
Wherein, described thick copper face makes described first conducting wire, comprising:
Outer graphics shifts, and described thick copper face makes positive circuit, and exposed described thin copper face;
Pattern tin plating, zinc-plated to the whole plate of described printed wiring board, and resist layer is formed on described positive circuit He on described thin copper face;
Alkali etching, etching is exposed to the Lu Tong district of described resist layer, and forms described first conducting wire on described thick copper face;
Described thin copper face makes the second conducting wire, comprising:
Outer graphics shifts, and described thin copper face makes negative film circuit, described thick copper face makes anticorrosion protection film;
Acid etching, etches described thin copper face, and forms the second conducting wire on described thin copper face.
Further, the step making the film is also comprised in the step making conducting wire, be specially: make the positive film and the negative film film according to the line pattern that described printed wiring board will configure, the described positive film is arranged to make described positive circuit on described thick copper face, and the described negative film film is arranged on described thin copper face to make described negative film circuit.
Further, the step that described thick copper face carries out outer graphics transfer is comprised:
Pad pasting, described thick copper face attaches rete against corrosion, and exposed described thin copper face;
Exposure, is attached at described film surface against corrosion by the described positive film, under UV-irradiation, the line pattern on the described positive film is transferred to the position that described thick copper face needs to make circuit;
Development, carries out development treatment to the described printed wiring board after exposure-processed, described thick copper face forms required circuit.
Further, the step of described graphic plating comprises:
Copper facing, the circuit that described thick copper face is formed and described thin copper face electroplates one deck and adds thick copper layer; And
Zinc-plated, to power on plating one deck tin at the described thick copper layer that adds, form described resist layer.
Further, the step of described alkali etching comprises:
Striping, removes the rete against corrosion that described thick copper face attaches;
Etching, adopt alkaline etching liquid to carry out etch processes to described thick copper face, described alkaline etching liquid is sal-ammoniac copper etchant solution; And
Stripping tin, utilizes stripping tin liquor to remove described resist layer.
Further, the step that described thin copper face carries out outer graphics transfer is comprised:
Pad pasting, described thin copper face and described thick copper face make photoresistive mask;
Exposure, is attached at the photoresistive mask surface of described thin copper face by the described negative film film, under UV-irradiation, the line pattern on the described negative film film is transferred to the position that described thin copper face needs to make circuit;
Development, carries out development treatment to the described printed wiring board after exposure-processed, described thin copper face forms required circuit.
Further, the step of described acid etching comprises:
Etching, the described thin copper face of employing acidic etching liquid etching is exposed to the copper face outside described photoresistive mask; And
Striping, removes the described photoresistive mask on described thin copper face and described thick copper face.
Further, described acidic etching liquid is hydrochloric acid-ferric trichloride, hydrochloric acid-chlorine, hydrochloric acid-hydrogen peroxide, hydrochloric acid-sodium chloride or acid copper chloride etching liquid.
Further, the step of printed wiring board is provided to comprise:
Pressing, carries out pressing by described copper foil laminations different with thickness to prepreg, internal layer circuit plate, obtains described printed wiring board;
Boring: process via on described printed wiring board;
Heavy copper: heavy Copper treatment is carried out to described via and forms layers of copper at the hole wall of described via;
Copper facing a: copper plate is plated to the hole wall of described via and the thick copper face of described printed wiring board and thin copper face.
Further, the step of reprocessing comprises:
Welding resistance, adopts wire mark mode to apply solder mask on described thick copper face and described thin copper face, forms described solder mask;
Character, adopts wire mark mode to apply character marking ink on described solder mask; And
Shaping, sharp processing is carried out to described printed wiring board.
The manufacture method of the thick printed wiring board of negative and positive copper provided by the invention by separately making corresponding first conducting wire and the second conducting wire on thick copper face and thin copper face, when thick copper face makes the first conducting wire, utilize resist layer to protect thin copper face, ensure only on thick copper face, to carry out etch processes; When thin copper face makes the second conducting wire, thick copper face forms anticorrosion protection film, ensure only on thin copper face, to carry out etch processes.Like this, carry out etch processes respectively obtain corresponding conducting wire to thick copper face and thin copper face, this method can make fine-line on the printed wiring board of different copper thickness, and, not by the restriction of copper thickness extreme difference.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of the thick printed wiring board of negative and positive copper that the embodiment of the present invention provides.
Fig. 2 is the flow chart of the making conducting wire that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please Parameter Map 1 and Fig. 2, the manufacture method of the thick printed wiring board of negative and positive copper that the embodiment of the present invention provides comprises the following steps:
S1: printed wiring board is provided, described printed wiring board comprises copper thickness difference and the thick copper face be oppositely arranged and thin copper face; Understandably, the thick copper face in the present embodiment and thin copper face are relative concept.
S2: make conducting wire, make the first conducting wire and the second conducting wire respectively on described thick copper face and described thin copper face; Understandably, the step S2 making conducting wire is divided into the step S2a making the first conducting wire on described thick copper face and the step making the second conducting wire S2b on described thin copper face.
S3: reprocessing, makes in described first conducting wire and described second surface, conducting wire the solder mask shielded, and carries out processing and forming to described printed wiring board;
Wherein, S2a: make described first conducting wire on described thick copper face, comprising:
S21, outer graphics shifts, and described thick copper face makes positive circuit, and exposed described thin copper face;
S22, pattern tin plating, zinc-plated to the whole plate of described printed wiring board, and resist layer is formed on described positive circuit He on described thin copper face;
S23, alkali etching, etching is exposed to the Lu Tong district of described resist layer, and forms described first conducting wire on described thick copper face;
S2b: make the second conducting wire on described thin copper face, comprising:
S24, outer graphics shifts, and described thin copper face makes negative film circuit, described thick copper face makes anticorrosion protection film;
S25, acid etching, etches described thin copper face, and forms the second conducting wire on described thin copper face.
This manufacture method adopts separates making first conducting wire and the second conducting wire to thick copper face and thin copper face, namely when thick copper face makes the first conducting wire, thin copper face makes resist layer, to carry out etch processes to thick copper face; When thin copper face makes the second conducting wire, thick copper face makes anticorrosion protection film, to carry out etch processes to thin copper face.By making the first conductive pattern and the second conductive pattern respectively on thick copper face and thin copper face, fine-line can be made on the printed wiring board of different copper thickness, and this manufacture method is not by the restriction of two sides copper thickness extreme difference, for the printed wiring board that two sides copper thickness extreme difference is greater than 1 ounce, still circuit quality can be ensured.
Further, the step making the film is also comprised in the step S2 making conducting wire, be specially: make the positive film and the negative film film according to the line pattern that described printed wiring board will configure, the described positive film is arranged to make described positive circuit on described thick copper face, and the described negative film film is arranged on described thin copper face to make described negative film circuit.The line pattern that printed wiring board will configure refers to according to different user demands, the line pattern that printed wiring board is arranged, and this line pattern is different because of the difference of user demand.Alternatively, the described positive film and the described negative film film all adopt photographic process and make.
Please refer to Fig. 2, the step S21 that described thick copper face carries out outer graphics transfer comprised:
Pad pasting, described thick copper face attaches rete against corrosion, and exposed described thin copper face;
Exposure, is attached at described film surface against corrosion by the described positive film, under UV-irradiation, the line pattern on the described positive film is transferred to the position that described thick copper face needs to make circuit;
Development, carries out development treatment to the described printed wiring board after exposure-processed, described thick copper face forms required circuit.
More preferably, heat posted mode is adopted to be invested on thick copper face by etchant resist laminating.Thick copper face after pad pasting process is exposed and development treatment, namely the energy of ultraviolet light is utilized, the photoactive substance in rete against corrosion is made to carry out photochemical reaction, to reach the effect of selective local crane span structure sclerosis, and complete the object of image transfer, and under the effect of liquid medicine sodium carbonate, after the film layer dissolves against corrosion of unexposed portion is also rinsed, leave photosensitive part, thick copper face forms required line pattern.
Please refer to Fig. 2, further, the step S22 of described graphic plating comprises:
Copper facing, the circuit that described thick copper face is formed and described thin copper face electroplates one deck and adds thick copper layer; And
Zinc-plated, to power on plating one deck tin at the described thick copper layer that adds, form described resist layer.
Carry out graphic plating to the printed wiring board after outer graphics process, copper facing and zinc-plated process respectively on the circuit formed at thick copper face and thin copper face, forms the resist layer of alkali resistant etching, plays the effect of protection circuit figure.
Please refer to Fig. 2, further, the step S23 of described alkali etching comprises:
Striping, removes the rete against corrosion that described thick copper face attaches;
Etching, adopt alkaline etching liquid to carry out etch processes to described thick copper face, described alkaline etching liquid is sal-ammoniac copper etchant solution; And
Stripping tin, utilizes stripping tin liquor to remove described resist layer.
Utilize striping liquid to remove rete against corrosion on thick copper face, carry out alkali etching process so that follow-up to thick copper face, alternatively, this striping liquid is sodium hydroxide solution or organic striping liquid.Utilize alkaline etching liquid to carry out etch processes to the layers of copper on thick copper face, and divest the resist layer on printed wiring board, alternatively, described stripping tin liquor is salpeter solution.
The step S24 that described thin copper face carries out outer graphics transfer is comprised:
Pad pasting, described thin copper face and described thick copper face make photoresistive mask;
Exposure, is attached at the photoresistive mask surface of described thin copper face by the described negative film film, under UV-irradiation, the line pattern on the described negative film film is transferred to the position that described thin copper face needs to make circuit;
Development, carries out development treatment to the described printed wiring board after exposure-processed, described thin copper face forms required circuit.
Similar to the step of carrying out outer graphics transfer on thick copper face, difference is, during pad pasting, thick copper face also will attach photoresistive mask to protect the etching of thick copper face acid and alkali etching solution; During exposure, use the negative film film to be attached at the photoresistive mask surface of thin copper face, and through development treatment, thin copper face forms required line pattern.Alternatively, described photoresistive mask is acid resistance rete, and more preferably, this photoresistive mask is organic film resist layer.
Further, the step S25 of described acid etching comprises:
Etching, the described thin copper face of employing acidic etching liquid etching is exposed to the copper face outside described photoresistive mask; And
Striping, removes the described photoresistive mask on described thin copper face and described thick copper face.
Copper generation chemical reaction on acidic etching liquid and thin copper face, thin copper face is formed required circuit, and utilizes striping liquid to remove photoresistive mask on thin copper face and thick copper face, obtains the line pattern on thin copper face.Alternatively, this striping liquid is alkaline striping liquid, and more preferably, this striping liquid is potassium hydroxide or sodium hydroxide solution.
More preferably, described acidic etching liquid is hydrochloric acid-ferric trichloride, hydrochloric acid-chlorine, hydrochloric acid-hydrogen peroxide, hydrochloric acid-sodium chloride or acid copper chloride etching liquid.The copper generation chemical reaction of this acidic etching liquid and thin copper face, forms the line pattern on thin copper face.
Further, the step S1 of printed wiring board is provided to comprise:
Pressing, carries out pressing by described Copper Foils different for thickness, prepreg and internal layer circuit plate lamination, obtains described printed wiring board;
Boring: process via on described printed wiring board;
Heavy copper: heavy Copper treatment is carried out to described via and forms layers of copper at the hole wall of described via;
Copper facing a: copper plate is plated to the hole wall of described via and the thick copper face of described printed wiring board and thin copper face.
More preferably, this printed wiring board is the multilayer circuit board through pressing process.In other embodiments, this printed wiring board is comprise substrate and be attached at substrate two apparent surface and the different layers of copper of copper thickness, can as the inner plating of multilayer circuit board.And the printed wiring board after pressing is holed, heavy copper and copper plating treatment, make via and thick copper face and thin copper face mutual conduction.
Further, the step S3 of reprocessing comprises:
Welding resistance, adopts wire mark mode to apply solder mask on described thick copper face and described thin copper face, forms described solder mask;
Character, adopts wire mark mode to apply character marking ink on described solder mask; And
Shaping, sharp processing is carried out to described printed wiring board.
Best printed wiring board finished product is obtained by welding resistance, character and forming processes.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a manufacture method for the thick printed wiring board of negative and positive copper, is characterized in that, comprise the following steps:
There is provided printed wiring board, described printed wiring board comprises copper thickness difference and the thick copper face be oppositely arranged and thin copper face;
Make conducting wire, on described thick copper face and described thin copper face, make the first conducting wire and the second conducting wire respectively; And
Reprocessing, makes in described first conducting wire and described second surface, conducting wire the solder mask shielded, and carries out processing and forming to described printed wiring board;
Wherein, described thick copper face makes described first conducting wire, comprising:
Outer graphics shifts, and described thick copper face makes positive circuit, and exposed described thin copper face;
Pattern tin plating, zinc-plated to the whole plate of described printed wiring board, and resist layer is formed on described positive circuit He on described thin copper face;
Alkali etching, etching is exposed to the Lu Tong district of described resist layer, and forms described first conducting wire on described thick copper face;
Described thin copper face makes the second conducting wire, comprising:
Outer graphics shifts, and described thin copper face makes negative film circuit, described thick copper face makes anticorrosion protection film;
Acid etching, etches described thin copper face, and forms the second conducting wire on described thin copper face.
2. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 1, it is characterized in that, the step making the film is also comprised in the step making conducting wire, be specially: make the positive film and the negative film film according to the line pattern that described printed wiring board will configure, the described positive film is arranged to make described positive circuit on described thick copper face, and the described negative film film is arranged on described thin copper face to make described negative film circuit.
3. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 2, is characterized in that, comprise the step that described thick copper face carries out outer graphics transfer:
Pad pasting, described thick copper face attaches rete against corrosion, and exposed described thin copper face;
Exposure, is attached at described film surface against corrosion by the described positive film, under UV-irradiation, the line pattern on the described positive film is transferred to the position that described thick copper face needs to make circuit;
Development, carries out development treatment to the described printed wiring board after exposure-processed, described thick copper face forms required circuit.
4. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 3, it is characterized in that, the step of described graphic plating comprises:
Copper facing, the circuit that described thick copper face is formed and described thin copper face electroplates one deck and adds thick copper layer; And
Zinc-plated, to power on plating one deck tin at the described thick copper layer that adds, form described resist layer.
5. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 4, it is characterized in that, the step of described alkali etching comprises:
Striping, removes the rete against corrosion that described thick copper face attaches;
Etching, adopt alkaline etching liquid to carry out etch processes to described thick copper face, described alkaline etching liquid is sal-ammoniac copper etchant solution; And
Stripping tin, utilizes stripping tin liquor to remove described resist layer.
6. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 2, is characterized in that, comprise the step that described thin copper face carries out outer graphics transfer:
Pad pasting, described thin copper face and described thick copper face make photoresistive mask;
Exposure, is attached at the photoresistive mask surface of described thin copper face by the described negative film film, under UV-irradiation, the line pattern on the described negative film film is transferred to the position that described thin copper face needs to make circuit;
Development, carries out development treatment to the described printed wiring board after exposure-processed, described thin copper face forms required circuit.
7. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 6, it is characterized in that, the step of described acid etching comprises:
Etching, the described thin copper face of employing acidic etching liquid etching is exposed to the copper face outside described photoresistive mask; And
Striping, removes the described photoresistive mask on described thin copper face and described thick copper face.
8. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 7, it is characterized in that, described acidic etching liquid is hydrochloric acid-ferric trichloride, hydrochloric acid-chlorine, hydrochloric acid-hydrogen peroxide, hydrochloric acid-sodium chloride or acid copper chloride etching liquid.
9. the manufacture method of the thick printed wiring board of negative and positive copper as described in claim 1 to 8 any one, is characterized in that, provides the step of printed wiring board to comprise:
Pressing, carries out pressing by described copper foil laminations different with thickness to prepreg, internal layer circuit plate, obtains described printed wiring board;
Boring: process via on described printed wiring board;
Heavy copper: heavy Copper treatment is carried out to described via and forms layers of copper at the hole wall of described via;
Copper facing a: copper plate is plated to the hole wall of described via and the thick copper face of described printed wiring board and thin copper face.
10. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 9, it is characterized in that, the step of reprocessing comprises:
Welding resistance, adopts wire mark mode to apply solder mask on described thick copper face and described thin copper face, forms described solder mask;
Character, adopts wire mark mode to apply character marking ink on described solder mask; And
Shaping, sharp processing is carried out to described printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310364780.3A CN104427776B (en) | 2013-08-20 | 2013-08-20 | The manufacture method of negative and positive copper thickness printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310364780.3A CN104427776B (en) | 2013-08-20 | 2013-08-20 | The manufacture method of negative and positive copper thickness printed wiring board |
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| Publication Number | Publication Date |
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| CN104427776A true CN104427776A (en) | 2015-03-18 |
| CN104427776B CN104427776B (en) | 2017-11-07 |
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| CN201310364780.3A Expired - Fee Related CN104427776B (en) | 2013-08-20 | 2013-08-20 | The manufacture method of negative and positive copper thickness printed wiring board |
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| CN105578774A (en) * | 2015-12-25 | 2016-05-11 | 惠州中京电子科技有限公司 | Fabrication method for female and male copper thicknesses of printed circuit board (PCB) |
| CN106211600A (en) * | 2016-07-28 | 2016-12-07 | 陈国富 | The manufacture method of the LED printed substrate of copper etching area can be saved |
| CN106852033A (en) * | 2017-04-06 | 2017-06-13 | 昆山苏杭电路板有限公司 | High precision part very high current printed circuit board processing method |
| CN107683025A (en) * | 2017-11-01 | 2018-02-09 | 汕头凯星印制板有限公司 | A kind of manufacture method of the non-homogeneous copper thickness pcb board of same aspect |
| CN108811353A (en) * | 2018-08-15 | 2018-11-13 | 江门崇达电路技术有限公司 | A kind of engraving method of two sides different Cu thickness PCB |
| CN110267448A (en) * | 2019-06-04 | 2019-09-20 | 深圳市迅捷兴科技股份有限公司 | Complex copper thick substrate production method |
| CN112235951A (en) * | 2020-10-20 | 2021-01-15 | 盐城维信电子有限公司 | Method for manufacturing circuit boards with different copper thicknesses |
| CN113133214A (en) * | 2021-04-07 | 2021-07-16 | 洛阳伟信电子科技有限公司 | Method for manufacturing asymmetric copper thick multilayer board |
| CN113840478A (en) * | 2021-09-08 | 2021-12-24 | 景旺电子科技(珠海)有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN114158195A (en) * | 2021-12-03 | 2022-03-08 | 四会富仕电子科技股份有限公司 | Method for manufacturing precise circuit with assistance of laser |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578774A (en) * | 2015-12-25 | 2016-05-11 | 惠州中京电子科技有限公司 | Fabrication method for female and male copper thicknesses of printed circuit board (PCB) |
| CN106211600A (en) * | 2016-07-28 | 2016-12-07 | 陈国富 | The manufacture method of the LED printed substrate of copper etching area can be saved |
| CN106211600B (en) * | 2016-07-28 | 2019-03-05 | 陈国富 | The production method that the LED printed wiring board of copper etching area can be saved |
| CN106852033A (en) * | 2017-04-06 | 2017-06-13 | 昆山苏杭电路板有限公司 | High precision part very high current printed circuit board processing method |
| CN107683025A (en) * | 2017-11-01 | 2018-02-09 | 汕头凯星印制板有限公司 | A kind of manufacture method of the non-homogeneous copper thickness pcb board of same aspect |
| CN108811353A (en) * | 2018-08-15 | 2018-11-13 | 江门崇达电路技术有限公司 | A kind of engraving method of two sides different Cu thickness PCB |
| CN110267448A (en) * | 2019-06-04 | 2019-09-20 | 深圳市迅捷兴科技股份有限公司 | Complex copper thick substrate production method |
| CN110267448B (en) * | 2019-06-04 | 2024-05-14 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing composite copper thick substrate |
| CN112235951A (en) * | 2020-10-20 | 2021-01-15 | 盐城维信电子有限公司 | Method for manufacturing circuit boards with different copper thicknesses |
| CN112235951B (en) * | 2020-10-20 | 2021-09-21 | 盐城维信电子有限公司 | Method for manufacturing circuit boards with different copper thicknesses |
| CN113133214A (en) * | 2021-04-07 | 2021-07-16 | 洛阳伟信电子科技有限公司 | Method for manufacturing asymmetric copper thick multilayer board |
| CN113840478A (en) * | 2021-09-08 | 2021-12-24 | 景旺电子科技(珠海)有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN114158195A (en) * | 2021-12-03 | 2022-03-08 | 四会富仕电子科技股份有限公司 | Method for manufacturing precise circuit with assistance of laser |
| CN114158195B (en) * | 2021-12-03 | 2023-10-24 | 四会富仕电子科技股份有限公司 | Method for manufacturing precise circuit with assistance of laser |
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