CN110267448A - Complex copper thick substrate production method - Google Patents
Complex copper thick substrate production method Download PDFInfo
- Publication number
- CN110267448A CN110267448A CN201910483477.2A CN201910483477A CN110267448A CN 110267448 A CN110267448 A CN 110267448A CN 201910483477 A CN201910483477 A CN 201910483477A CN 110267448 A CN110267448 A CN 110267448A
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- CN
- China
- Prior art keywords
- copper
- plate
- film
- etching
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 109
- 239000010949 copper Substances 0.000 title claims abstract description 86
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 85
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 title claims abstract description 14
- 238000005530 etching Methods 0.000 claims description 31
- 239000011889 copper foil Substances 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 23
- 230000009471 action Effects 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 5
- 229910001431 copper ion Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 3
- 238000006479 redox reaction Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 230000008859 change Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 15
- 230000004913 activation Effects 0.000 description 2
- 229910001432 tin ion Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention provides a kind of complex copper thick substrate production methods, comprising: makes the route of thick copper, then presses thin copper and make dense wire.By adopting the above-described technical solution, the present invention can just there are two types of the routes of table copper to design for outer layer on same plate, thick copper passes through for high current, and thin copper makees dense wire.By adopting the above-described technical solution, the different circuit board of copper thickness can be made in the present invention, to meet the needs of high current and dense wire.
Description
Technical field
The present invention relates to circuit board manufacturing area, in particular to a kind of complex copper thick substrate production method.
Background technique
The development of science and technology promotes wiring board to multifunction development trend, and wiring board is needed as the carrier of electronic component
To meet multiple function simultaneously.The copper thickness of dense wire, cannot be 350 μm or more thick by big electric current generally at 35 μm or so
Copper can be by big electric current, but cannot be fabricated to dense wire.Copper thickness in the industry is uniform, it is difficult to meet the two function need
It asks.The table copper of complex copper thick substrate has two class thickness, and the corresponding 350 μ m-thick copper wires of high current, it is close that low current corresponds to 35 μm of thin copper
Collect route.
Summary of the invention
The present invention provides a kind of complex copper thick substrate production methods, to solve at least one above-mentioned technical problem.
To solve the above problems, providing a kind of complex copper thick substrate production method as one aspect of the present invention, wrap
It includes: the route of thick copper is made, then press thin copper and make dense wire.
Preferably, comprising the following steps:
Step 1, copper-clad plate sawing sheet: is cut by design size by cutting machine；
Step 2, internal layer etching 1: under scheduled temperature, pressure, dry film is sticked in plate face, then aligned with egative film, finally
The irradiation that ultraviolet light is utilized on exposure machine, makes the uncovered dry film of egative film react, forms required line pattern in plate face,
Then the film not being irradiated by light is dissolved under the action of developer solution by development section, by etching section, in acid etching
Under the action of liquid, under the action of moving back film liquid, film is removed finally by film section is moved back for the copper eating away of exposing, exposes interior layer line
Road figure；
Step 3, printing resin ink: one layer of liquid resin is printed into the copper-clad plate for being etched into line pattern, is then dried
Make resin ink solidification；
Step 4, polishing resin: with the Plate grinder polishing resin ink equipped with ceramics brush, the layers of copper of figure is exposed；
Step 5, walkthrough 1 before pressing: corresponding prepreg and 350 μm of copper foils are ready to and are stacked together；
Step 6, press 1: under predetermined temperature and pressure effect, the resin of prepreg flows, fill line and substrate,
When temperature to a certain extent when, be cured, together by ply adhesion.
Step 7, internal layer etching 2: working principle etches the layers of copper figure of needs with internal layer etching 1；
Step 8, press before walkthrough 2: will prepare it is corresponding do not flow prepreg, copper-clad plate and copper foil, by copper-clad plate
Copper etches away, and the figure after control internal layer etching 2 will not flow prepreg and cover bronzing plate gong sky, area of absence and figure pair
It answers, bigger 0.1mm more unilateral than figure；Prepreg will not be flowed and cover bronzing plate " set " on the plate after internal layer etching 2, then plus
Upper 18 μm of copper foil is stacked together, and copper foil is that gong is not empty for complete copper foil；
Step 9,2 are pressed: similar with 1 working principle of pressing；
Step 10, the copper foil on the layers of copper figure after etching 2 and the polishing of the glue of spilling is clean, side nog plate: is brushed with ceramics
Process is processed after an action of the bowels；
Step 11, it drills: according to the requirement of client, drilling machine processing is carried out on suppressing the plate come, for convenience of rear work
The conducting of sequence ectonexine is prepared；
Step 12, the copper/plate that sinks plates: by the de-smear of front, dirty removal bored into the drilling in hole, makes to clean in hole, after
Logical activation adsorbs colloid palladium in surface and hole, and redox reaction occurs in heavy copper cylinder, forms layers of copper；Then, pass through electricity
Plating thickeies hole/face copper copper thickness, and process is processed after convenience；
Step 13, outer light imaging: under predetermined temperature, pressure, dry film is sticked in plate face, then aligned with egative film, finally existed
The irradiation that ultraviolet light is utilized on exposure machine, makes the uncovered dry film of egative film react, forms required line pattern in plate face, so
The film not being irradiated by light is dissolved, stroke dry film figure under the action of developer solution by development section afterwards；
Step 14, graphic plating: by pre-treatment, cleaning plate face, copper facing, tin plating cylinder anodic solution go out copper ion,
Tin ion is moved to cathode in electric field action, obtains electronics, forms layers of copper, tin layers；
Step 15, outer layer etches: under the action of lye, film is removed and exposes copper face to be etched, etching cylinder copper with
Copper ion reacts, and production is cuprous, reaches etching action, is moving back tin cylinder because nitric acid and tin face react, removing tin coating,
Expose line pad copper face.
By adopting the above-described technical solution, the different circuit board of copper thickness can be made in the present invention, to meet big
The demand of electric current and dense wire.
Detailed description of the invention
Fig. 1 schematically shows the schematic diagram of step 1；
Fig. 2 schematically shows the schematic diagrames of step 2；
Fig. 3 schematically shows the schematic diagram of step 3；
Fig. 4 schematically shows the schematic diagrames of step 4；
Fig. 5 schematically shows the schematic diagram of step 5；
Fig. 6 schematically shows the schematic diagram of step 6；
Fig. 7 schematically shows the schematic diagram of step 7；
Fig. 8 schematically shows the schematic diagram of step 8；
Fig. 9 schematically shows the schematic diagram of step 9；
Figure 10 schematically shows the schematic diagram of step 10；
Figure 11 schematically shows the schematic diagram of step 11；
Figure 12 schematically shows the schematic diagram of step 12；
Figure 13 schematically shows the schematic diagram of step 13；
Figure 14 schematically shows the schematic diagram of step 14；
Figure 15 schematically shows the schematic diagram of step 15.
Specific embodiment
The embodiment of the present invention is described in detail below in conjunction with attached drawing, but the present invention can be defined by the claims
Implement with the multitude of different ways of covering.
The present invention provides a kind of complex copper thick substrate production methods, first make the route of thick copper, then press
It closes thin copper and makees dense wire.It need to be selected when pressing and not flow prepreg, the glue spilt on copper face when pressing in this way compares
It is few to be easy polishing completely.It needs to use simultaneously to cover bronzing plate, because the thickness of copper-clad plate is substantially unchanged before and after pressing, in this way
The height of thick copper is substantially concordant with 18 μm of copper foils after pressing.Prepreg will not be flowed before pressing and covers bronzing plate by the figure of thick copper
Shape gong is empty, and when such lamination is embedded on core plate just, and the surface of thick copper figure is directly contacted with 18 μm of copper foils.It is brushed with ceramics
Nog plate removes the layers of copper of thick copper patterned surface and the glue of spilling, and such complex copper thickness is just formed, and then carries out post-processing production figure
Shape etc..
First normal production internal layer circuit, first time press 350 μm of copper foils and etch line pattern the present invention, will not flow half
Cured sheets and copper-clad plate gong are empty, and copper-clad plate etches layers of copper completely, and the overall thickness for not flowing PP and tabula rasa is slightly above 350 μm, gong
Empty region is consistent with line pattern, and the core plate after the PP, tabula rasa and etching of gong sky is stacked, and covers 18 μm of copper foils and carries out the
Second pressing, copper foil cover PP and copper thick-layer.Plate face is substantially smooth after pressing, and the plate after pressing is carried out nog plate, will be on thick copper
It 18 μm of copper foils and does not flow PP and overflows and come that glue polishing is clean, and such superficies just have 2 kinds of different Cu thickness, then normal drill is simultaneously
Rear process is covered, the figure of thick copper has been made before second pressing, and dense wire makes after second pressing.It is same in this way
Just there are two types of the routes of table copper to design for outer layer on block plate, and thick copper passes through for high current, and thin copper makees dense wire.
The present invention is a kind of complex copper thick substrate production method, and process is as follows: sawing sheet-internal layer etches 1-printing resin oil
Walkthrough 2-pressing 2-nog plates-drilling-before walkthrough-1-internal layer of pressing etching 2-presses before ink-polishing resin-pressing
Heavy copper/plate plating-outer light imaging-graphic plating-outer layer etching-rear process.
The specific steps of the present invention are as follows:
1. sawing sheet
Copper-clad plate is cut into design size by cutting machine.
2. internal layer etching 1
Under certain temperature, pressure, dry film is sticked in plate face, then aligned with egative film, finally using ultraviolet on exposure machine
The irradiation of light makes the uncovered dry film of egative film react, and forms required line pattern in plate face, then passes through development Duan Xian
Under the action of shadow liquid, the film not being irradiated by light is dissolved, will be exposed under the action of acidic etching liquid by etching section
Copper eating away under the action of moving back film liquid, film is removed finally by film section is moved back, expose inner line figure.
3. printing resin ink
One layer of liquid resin is printed into the copper-clad plate for being etched into line pattern, then drying makes resin ink solidification
4. resin of polishing
With the Plate grinder polishing resin ink equipped with ceramics brush, the layers of copper of figure is exposed.
5, walkthrough 1 before pressing
Corresponding prepreg and 350 μm of copper foils are ready to and are stacked together.
6. pressing 1
Under certain temperature and pressure effect, the resin of prepreg flows, fill line and substrate, when temperature is to centainly
It when degree, is cured, together by ply adhesion.
7. internal layer etching 2
Working principle etches the layers of copper figure of needs with internal layer etching 1.
8. walkthrough 2 before pressing
To prepare it is corresponding do not flow prepreg, copper-clad plate and copper foil, the copper of copper-clad plate is etched away, control internal layer erosion
Figure after carving 2 will not flow prepreg and cover bronzing plate gong sky.Area of absence and figure are corresponding, more unilateral than figure bigger
0.1mm.Prepreg will not be flowed and cover bronzing plate " set " on the plate after internal layer etching 2, along with 18 μm of copper foils stack
Together, copper foil is that gong is not empty for complete copper foil.
9. pressing 2
It is similar with 1 working principle of pressing, see below effect picture.
10. nog plate
The glue of copper foil and spilling on the layers of copper figure after etching 2 polished with ceramics brush clean, it is convenient after process process
11. drilling
According to the requirement of client, drilling machine processing is carried out on suppressing the plate come, is connected for convenience of rear process ectonexine
It prepares
12. heavy copper/plate plating
By the de-smear of front, dirty removal is bored into the drilling in hole, makes to clean in hole, rear logical activation is in surface and hole
Colloid palladium is adsorbed, redox reaction occurs in heavy copper cylinder, forms layers of copper.Then hole/face copper copper thickness is added by being electroplated
Thickness, process is processed after facilitating.
13. outer light imaging.
Under certain temperature, pressure, dry film is sticked in plate face, then aligned with egative film, finally using ultraviolet on exposure machine
The irradiation of light makes the uncovered dry film of egative film react, and forms required line pattern in plate face, then passes through development Duan Xian
Under the action of shadow liquid, the film not being irradiated by light is dissolved, stroke dry film figure.
14. graphic plating
By pre-treatment, plate face is cleaned, goes out copper ion, tin ion in copper facing, tin plating cylinder anodic solution, in electric field action
It is moved to cathode, obtains electronics, forms layers of copper, tin layers.
15. outer layer etches
Under the action of lye, film is removed and exposes copper face to be etched, reacted in etching cylinder copper with copper ion, it is raw
It produces cuprous, reaches etching action, moving back tin cylinder because nitric acid and tin face react, remove tin coating, expose line pad copper face.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (2)
1. a kind of complex copper thick substrate production method characterized by comprising make the route of thick copper, then press
Thin copper makees dense wire.
2. conjunction copper thick substrate production method according to claim 1, which comprises the following steps:
Step 1, copper-clad plate sawing sheet: is cut by design size by cutting machine；
Step 2, internal layer etching 1: under scheduled temperature, pressure, dry film is sticked in plate face, then aligned with egative film, finally exposed
The irradiation that ultraviolet light is utilized on ray machine, makes the uncovered dry film of egative film react, forms required line pattern in plate face, then
Through development section under the action of developer solution, the film not being irradiated by light is dissolved, by etching section, in acidic etching liquid
Under effect, under the action of moving back film liquid, film is removed finally by film section is moved back for the copper eating away of exposing, exposes internal layer circuit figure
Shape；
Step 3, printing resin ink: one layer of liquid resin is printed into the copper-clad plate for being etched into line pattern, then drying makes to set
Rouge ink solidification；
Step 4, polishing resin: with the Plate grinder polishing resin ink equipped with ceramics brush, the layers of copper of figure is exposed；
Step 5, walkthrough 1 before pressing: corresponding prepreg and 350 μm of copper foils are ready to and are stacked together；
Step 6, press 1: under predetermined temperature and pressure effect, the resin of prepreg flows, and fill line and substrate work as temperature
When spending to a certain extent, it is cured, together by ply adhesion.
Step 7, internal layer etching 2: working principle etches the layers of copper figure of needs with internal layer etching 1；
Step 8, walkthrough 2 before pressing: will prepare it is corresponding do not flow prepreg, copper-clad plate and copper foil, the copper of copper-clad plate is lost
Quarter is fallen, and the figure after control internal layer etching 2 will not flow prepreg and cover bronzing plate gong sky, and area of absence and figure are corresponding,
Bigger 0.1mm more unilateral than figure；Prepreg will not be flowed and cover bronzing plate " set " on the plate after internal layer etching 2, added
18 μm of copper foil is stacked together, and copper foil is that gong is not empty for complete copper foil；
Step 9,2 are pressed: similar with 1 working principle of pressing；
Step 10, nog plate: it is with ceramics brush that the copper foil on the layers of copper figure after etching 2 and the polishing of the glue of spilling is clean, after convenient
Process processing；
Step 11, it drills: according to the requirement of client, drilling machine processing is carried out on suppressing the plate come, for convenience of rear in-process
Outer layer conducting is prepared；
Step 12, the copper/plate that sinks plates: by the de-smear of front, dirty removal bored into the drilling in hole, makes to clean in hole, it is logical afterwards to live
Change and adsorb colloid palladium in surface and hole, redox reaction occurs in heavy copper cylinder, forms layers of copper；It then, will by plating
Hole/face copper copper thickness thickeies, and process is processed after convenience；
Step 13, outer light imaging: under predetermined temperature, pressure, dry film is sticked in plate face, then aligned with egative film, finally exposed
The irradiation that ultraviolet light is utilized on machine, makes the uncovered dry film of egative film react, forms required line pattern in plate face, then lead to
Development section is crossed under the action of developer solution, the film not being irradiated by light is dissolved, stroke dry film figure；
Step 14, graphic plating: by pre-treatment, cleaning plate face, copper facing, tin plating cylinder anodic solution go out copper ion, tin from
Son is moved to cathode in electric field action, obtains electronics, forms layers of copper, tin layers；
Step 15, outer layer etches: under the action of lye, film is removed and exposes copper face to be etched, etching cylinder copper and copper from
Son reacts, and production is cuprous, reaches etching action, is moving back tin cylinder because nitric acid and tin face react, removing tin coating, exposes
Line pad copper face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910483477.2A CN110267448B (en) | 2019-06-04 | 2019-06-04 | Method for manufacturing composite copper thick substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910483477.2A CN110267448B (en) | 2019-06-04 | 2019-06-04 | Method for manufacturing composite copper thick substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110267448A true CN110267448A (en) | 2019-09-20 |
| CN110267448B CN110267448B (en) | 2024-05-14 |
Family
ID=67916814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910483477.2A Active CN110267448B (en) | 2019-06-04 | 2019-06-04 | Method for manufacturing composite copper thick substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110267448B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970818A (en) * | 2020-09-01 | 2020-11-20 | 胜宏科技（惠州）股份有限公司 | Sheet connecting operation method for copper-buried plate |
| CN113141726A (en) * | 2021-03-17 | 2021-07-20 | 东莞联桥电子有限公司 | Manufacturing method of circuit board with locally thickened plating layer |
| CN114760768A (en) * | 2022-06-10 | 2022-07-15 | 四川英创力电子科技股份有限公司 | Inner-layer cathode-anode copper printed circuit board processing method and printed circuit board |
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|---|---|---|---|---|
| WO2003069966A1 (en) * | 2002-02-11 | 2003-08-21 | Ksg Leiterplatten Gmbh | Method for the production of a semi-finished product for a printed board, semi-finished product, and printed board |
| CN102883534A (en) * | 2012-09-27 | 2013-01-16 | 沪士电子股份有限公司 | Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board |
| CN104427776A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Manufacturing method of yin-yang copper-thickness printed circuit board |
| CN104717849A (en) * | 2013-12-12 | 2015-06-17 | 深南电路有限公司 | Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board |
-
2019
- 2019-06-04 CN CN201910483477.2A patent/CN110267448B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003069966A1 (en) * | 2002-02-11 | 2003-08-21 | Ksg Leiterplatten Gmbh | Method for the production of a semi-finished product for a printed board, semi-finished product, and printed board |
| CN102883534A (en) * | 2012-09-27 | 2013-01-16 | 沪士电子股份有限公司 | Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board |
| CN104427776A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Manufacturing method of yin-yang copper-thickness printed circuit board |
| CN104717849A (en) * | 2013-12-12 | 2015-06-17 | 深南电路有限公司 | Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970818A (en) * | 2020-09-01 | 2020-11-20 | 胜宏科技（惠州）股份有限公司 | Sheet connecting operation method for copper-buried plate |
| CN113141726A (en) * | 2021-03-17 | 2021-07-20 | 东莞联桥电子有限公司 | Manufacturing method of circuit board with locally thickened plating layer |
| CN114760768A (en) * | 2022-06-10 | 2022-07-15 | 四川英创力电子科技股份有限公司 | Inner-layer cathode-anode copper printed circuit board processing method and printed circuit board |
| CN114760768B (en) * | 2022-06-10 | 2022-08-30 | 四川英创力电子科技股份有限公司 | Inner-layer cathode-anode copper printed circuit board processing method and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110267448B (en) | 2024-05-14 |
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