CN104812171A - Printed circuit board and processing method thereof - Google Patents
Printed circuit board and processing method thereof Download PDFInfo
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- CN104812171A CN104812171A CN201410033707.2A CN201410033707A CN104812171A CN 104812171 A CN104812171 A CN 104812171A CN 201410033707 A CN201410033707 A CN 201410033707A CN 104812171 A CN104812171 A CN 104812171A
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Abstract
The invention is applied to the technical field of a printed circuit board, and provides a processing method of a printed circuit board and a printed circuit board formed by use of the processing method, for the purpose of solving the problems that since local electroplating thick gold processing is carried out after external-layer etching processing, a local electroplating thick gold position cannot be conductive and lead wires cannot be added to a part of the printed circuit board in the prior art. The processing method of the printed circuit board comprises the following step of providing a plate substrate, an external-layer pattern, pattern electroplating, nickel plating, thin gold plating, external-layer local electroplating gold pattern processing, the local electroplating thick gold processing and external-layer etching. According to the processing method, before the external-layer etching processing, the external-layer local electroplating gold pattern processing and the local electroplating thick gold processing are carried out, so that conductive lead wires are additionally arranged on an external-layer line pattern, the whole copper foil layer of the plate substrate can be conductive, the membrane removing operation is simple, the manufacturing efficiency is improved, and the processing period is shortened.
Description
Technical field
The invention belongs to printed wiring board technical field, the processing method particularly relating to a kind of printed wiring board and the printed wiring board adopting this processing method to be formed.
Background technology
Along with the continuous upgrading of electronic product, the surface treatment of printed wiring board also becomes increasingly complex, and usually, carries out kinds of surface process to same printed wiring board requires, this increases manufacture difficulty to the processing of printed wiring board.
Common printed wiring board surface treatment is the mode adopting the whole plate thin gold of electricity and local electric thick gold, concrete technique Making programme: pressing → skin boring → outer heavy copper → electric plating of whole board → outer-layer circuit figure → figure copper facing → nickel plating → plate golden figure → local electric thick gold of thin gold → skin etching → welding resistance → outer local electric → move back film → lettering accords with → and shaping.Can find out, outer local electric gold figure carries out after welding resistance, and local electric thick gold position need increase conductive lead wire at inner figure is connected with edges of boards.Because local electric thick carat (measure of the purity of gold) is not exclusively on the edges of boards of printed wiring board, outer-layer circuit figure is difficult to realize increasing conductive lead wire, therefore local electric thick gold circuit network need be connected with edges of boards at inner figure increase conductive lead wire, otherwise local electric thick carat (measure of the purity of gold) cannot conduct electricity and can not complete plating, so increases design difficulty; Part printed wiring board because of ectonexine line pattern distribution reason cannot increase wire.Utilize the method need be attached on solder mask by dry film, after local electric gold, photopolymer layer is not easy to move back totally.
Summary of the invention
The object of the present invention is to provide a kind of processing method of printed wiring board, by carrying out local electric thick gold process before outer etch processes, being intended to solve in prior art and after outer etch processes, carrying out local electric thick gold process and local electric thick carat (measure of the purity of gold) cannot be conducted electricity and part printed wiring board cannot increase the problem of wire.
The present invention is achieved in that a kind of processing method of printed wiring board comprises the following steps:
Plate base material is provided, described plate base material comprises inner plating and establishes and the copper foil layer at least one outer surface of described inner plating, and be provided with the via of through described copper foil layer and described inner plating, described copper foil layer is provided with local electric carat (measure of the purity of gold), and the hole wall of described via is formed with the heavy layers of copper connecting described copper foil layer;
Outer graphics, provides the first dry film and described first dry film is attached at described copper foil layer surface, provide the first film figure and described first film figure is transferred to described copper foil layer on the surface to form outer-layer circuit figure through exposure and development;
Graphic plating, the mode adopting sour copper to electroplate is formed at described outer-layer circuit figure and described heavy layers of copper surface and adds thick copper layer;
Nickel plating, adopts nickel-plating liquid to form nickel coating on the described thick copper layer surface that adds;
Plate thin gold, carry out electrogilding process on described nickel coating surface and form the thin layer gold that thickness is 0.02 ~ 0.05 micron;
Outer local electric gold figure, second dry film is provided and described second dry film is attached at described thin layer gold surface, second film figure is provided and described second film figure is attached at described second dry film surface and is positioned at above described local electric carat (measure of the purity of gold), through exposing and developing described second film Graphic transitions to described local electric carat (measure of the purity of gold) upper area;
Local electric thick gold, is not carried out electrogilding process and forms thick layer gold by the region that described first dry film and described second dry film attach above described local electric carat (measure of the purity of gold); And
Outer etching, removes described first dry film and described second dry film and carries out etch processes to exposed described copper foil layer.
Further, also comprise in the step that plate base material is provided:
Pressing, is cascading described inner plating, prepreg and described copper foil layer and carries out pressing process to form described plate base material;
Outer boring, carries out Drilling operation to described plate base material and forms the described via running through described plate base material;
Outer heavy copper, carries out heavy Copper treatment to described via and forms at the hole wall of described via the heavy layers of copper be electrically connected with described copper foil layer
The plating of whole plate, sinks the described plate base material after Copper treatment to skin and carries out whole plate electro-coppering, and form copper plate at described copper foil layer and described heavy layers of copper surface.
Further, in outer graphics step, the thickness of described first dry film is 40 microns.
Further, in graphic plating step, described in add thick copper layer thickness be 25 ~ 40 microns.
Further, in nickel plating step, the thickness of described nickel coating is 5 ~ 10 microns.
Further, in the thin golden step of plating, the thickness of described thin layer gold is 0.025 ~ 0.050 micron.
Further, in outside local electric gold patterning step, the evenness of described plate substrate surface is ± 10 microns.
Another object of the present invention is to provide a kind of printed wiring board, adopt the processing method of above-mentioned printed wiring board and make, comprise inner plating, be formed at the layers of copper at least one surface of described inner plating, be formed at the nickel coating on described layers of copper surface and be formed at the thin layer gold on described nickel coating surface, and be provided with the via running through described inner plating and described layers of copper, the hole wall of described via has the heavy layers of copper be electrically connected with described layers of copper, described layers of copper comprises the copper foil layer that forms described inner plating surface and is formed at described copper foil layer surface and adds thick copper layer between described copper foil layer and described nickel coating, described copper foil layer has local electric gold region, and be formed in described local electric gold region the thick layer gold being attached at described thin layer gold surface.
The processing method of the printed wiring board that the embodiment of the present invention provides utilizes carried out outer local electric gold figure and local electric thick gold process before outer etch processes, to realize increasing conductive lead wire on outer-layer circuit figure, the whole copper foil layer of described plate base material can be conducted electricity, and local electric carat (measure of the purity of gold) is put and is not needed to increase conductive lead wire on inner figure and be connected with edges of boards, because described first dry film and described second dry film are attached on metal level, take off membrane operations simple, provide make efficiency, shorten the process-cycle.
Accompanying drawing explanation
Fig. 1 is the process chart of the processing method of the printed wiring board that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please refer to Fig. 1, the processing method of the printed wiring board that the embodiment of the present invention provides comprises the following steps:
S1: plate base material is provided, described plate base material comprises inner plating and establishes and the copper foil layer at least one outer surface of described inner plating, and be provided with the via of through described copper foil layer and described inner plating, described copper foil layer is provided with local electric carat (measure of the purity of gold), and the hole wall of described via is formed with the heavy layers of copper connecting described copper foil layer; Understandably, described inner plating can be single layer substrate, also can be multilayer circuit board.This plate base material can be single-side coated copper plate, also can be double face copper, when described plate base material is single-side coated copper plate, described copper foil layer is formed on a surface of described inner plating, when described plate base material is double face copper, form described copper foil layer two apparent surfaces of described inner plating.Described copper foil layer is provided with local electric carat (measure of the purity of gold), is connected with the edges of boards of described plate base material to make forming conductive lead wire in follow-up local electric thick gold process.
S2: outer graphics, provides the first dry film and described first dry film is attached at described copper foil layer surface, provide the first film figure and described first film figure is transferred to described copper foil layer on the surface to form outer-layer circuit figure through exposure and development; Understandably, utilize laminator that described first dry film is attached at described copper foil layer surface by pressure reel, preferably, heat posted mode can be adopted described dry film to be attached at described copper foil layer surface, and described first dry film is the etchant resist with photoactive substance.Thering is provided in the first film patterning step, according to the actual requirements line pattern is being formed on the first film figure, namely described first film figure is being formed with the line pattern of actual demand.Described copper foil layer after pasting dry film process is exposed and development treatment, namely the energy of ultraviolet light is utilized, the photoactive substance in described first dry film is made to carry out photochemical reaction, to reach the effect of selective local crane span structure sclerosis, and complete the object of image transfer, and under the effect of liquid medicine sodium carbonate, described first dry film of unexposed portion to be dissolved and after rinsing, leave photosensitive part, described copper foil layer is formed required described outer-layer circuit figure.
S3: graphic plating, the mode adopting sour copper to electroplate is formed at described outer-layer circuit figure and described heavy layers of copper surface and adds thick copper layer; Understandably, the mode adopting sour copper to electroplate is formed at the outer-layer circuit patterned surface after outer graphics process and adds thick copper layer, the described thick copper layer that adds to be formed on exposed described copper foil layer outside described first dry film to thicken described copper foil layer, makes the thickness of copper foil layer reach actual requirement.
S4: nickel plating, adopts nickel-plating liquid to form nickel coating on the described thick copper layer surface that adds; Understandably, utilize nickel-plating liquid to carry out Nickel Plating Treatment to described plate base material and described add thick copper layer surface formed nickel coating, described nickel coating as the barrier layer of thick layer gold, to prevent the golden copper phase counterdiffusion between thick layer gold with thick copper layer.Alternatively, described Nickel Plating Treatment is low-stress nickel plating process, to increase bond strength.Preferably, described nickel-plating liquid is sulfate type, sulfamic acid salt form.
S5: plate thin gold, carries out electrogilding process on described nickel coating surface and forms the thin layer gold that thickness is 0.02 ~ 0.05 micron; Understandably, described thin layer gold improves adhesion intensity and decrease porosity, protects plating solution and decreasing pollution, plates and have better protecting effect with the thin layer gold of 0.02 ~ 0.05 micron between nickel coating and thick layer gold.Alternatively, the thickness of described thin layer gold is 0.025 ~ 0.05 micron.
S6: outer local electric gold figure, second dry film is provided and described second dry film is attached at described thin layer gold surface, second film figure is provided and described second film figure is attached at described second dry film surface and is positioned at above described local electric carat (measure of the purity of gold), through exposing and developing described second film Graphic transitions to described local electric carat (measure of the purity of gold) upper area; Understandably, utilize laminator that described second dry film is attached at described thin layer gold surface by pressure reel, preferably, heat posted mode can be adopted described second dry film to be attached at described thin layer gold surface, and described second dry film is the etchant resist with photoactive substance.Thering is provided in the second film patterning step, according to the actual requirements line pattern is being formed on the second film figure, namely described second film figure is being formed with the line pattern of actual demand.Described thin layer gold after pasting dry film process is exposed and development treatment, namely the energy of ultraviolet light is utilized, the photoactive substance in described second dry film is made to carry out photochemical reaction, to reach the effect of selective local crane span structure sclerosis, and complete the object of image transfer, and under the effect of liquid medicine sodium carbonate, described second dry film of unexposed portion to be dissolved and after rinsing, leave photosensitive part, described thin layer gold forms required local line figure.Preferably, described second film figure is attached at the described thin layer gold region corresponding with described local electric gold region, namely carries out outer local figure to local electric gold region and obtains described local line figure.
S7: local electric thick gold, is not carried out electrogilding process and forms thick layer gold by the region that described first dry film and described second dry film attach above described local electric carat (measure of the purity of gold); Understandably, the upper area of the local electric carat (measure of the purity of gold) being exposed to described first dry film and described second dry film is carried out electrogilding process, and forms thick layer gold, namely form the conductive lead wire be connected with the edges of boards of plate base material.
S8: outer etching, removes described first dry film and described second dry film and carries out etch processes to exposed described copper foil layer.Understandably, utilize the sodium hydroxide solution of higher concentration that the first dry film and second are dissolved and washed, to make exposed each metal level.Etch processes is utilized to be etched away by exposed described copper foil layer, to form required line pattern on described plate base material.
The processing method of the printed wiring board that the embodiment of the present invention provides utilizes carried out outer local electric gold figure and local electric thick gold process before outer etch processes, to realize increasing conductive lead wire on outer-layer circuit figure, namely by forming thick layer gold to be connected with edges of boards in local electric thick gold region, simple to operate; Also be conducive in addition increasing wire on ectonexine line pattern; The method makes the whole copper foil layer of described plate base material conduct electricity, and local electric carat (measure of the purity of gold) is put and is not needed to increase conductive lead wire on inner figure and be connected with edges of boards, because described first dry film and described second dry film are attached on metal level, take off membrane operations simple, provide make efficiency, shorten the process-cycle.
Please refer to Fig. 1, further, also comprise in the step S1 that plate base material is provided:
Pressing, is cascading described inner plating, prepreg and described copper foil layer and carries out pressing process to form described plate base material; Understandably, for single-side coated copper plate, described inner plating, described prepreg and described copper foil layer are cascading and put into laminating machine and carries out pressing process; For double face copper, there are two-layer prepreg and two pieces of described copper foil layers, prepreg, described inner plating, second half cured sheets and copper foil layer described in another described in copper foil layer, described in one are cascading and put into laminating machine and carries out pressing process.
Outer boring, carries out Drilling operation to described plate base material and forms the described via running through described plate base material; Understandably, described bore mode can be punching method in advance, machine drilling method, laser drilling method, method for plasma etching or chemical method for etching.
Outer heavy copper, carries out heavy Copper treatment to described via and forms at the hole wall of described via the heavy layers of copper be electrically connected with described copper foil layer; Understandably, utilize heavy Copper treatment to form heavy layers of copper at the hole wall of described via, utilize described heavy layers of copper to be electrically connected inner plating and copper foil layer, ensure the conducting of each circuit in described plate base material.
The plating of whole plate, sinks the described plate base material after Copper treatment to skin and carries out whole plate electro-coppering, and form copper plate at described copper foil layer and described heavy layers of copper surface.Understandably, described plate base material is put into the base material of plate described in copper electroplating solution and carry out whole plate electro-coppering process, to make the copper layer thickness of described plate base material be evenly distributed, circuit is uniformly distributed.
Please refer to Fig. 1, further, in outer graphics step S2, the thickness of described first dry film is 40 microns.Understandably, by controlling the thickness of described first dry film to ensure that described first dry film can protect copper foil layer in the various metal process of plating, prevent from the various metal process of plating, destroying copper foil layer and affecting circuit performance.
Please refer to Fig. 1, further, in graphic plating step S3, described in add thick copper layer thickness be 25 ~ 40 microns.Understandably, described in add thick copper layer and described copper foil layer and form copper layer thickness needed for reality, ensure that line pattern is electrically connected and the layers of copper of each line pattern is evenly distributed.
Please refer to Fig. 1, further, in nickel plating step S4, the thickness of described nickel coating is 5 ~ 10 microns.Understandably, utilize nickel coating as the barrier layer of thick layer gold, prevent the golden copper phase counterdiffusion between thick layer gold with thick copper layer.
Please refer to Fig. 1, further, in the thin golden step S5 of plating, the thickness of described thin layer gold is 0.025 ~ 0.050 micron.Understandably, described thin layer gold is arranged to improve the adhesion of thick layer gold between described nickel coating and thick layer gold, and plays protection effect.
Please refer to Fig. 1, further, in outside local electric gold patterning step S6, the evenness of described plate substrate surface is ± 10 microns.By controlling the evenness of described plate base material to ensure that the second dry film can be fitted in described plate substrate surface preferably, reach desirable local electric thick gold effect.
The embodiment of the present invention additionally provides printed wiring board, adopt the processing method of above-mentioned printed wiring board and make, comprise inner plating, be formed at the layers of copper at least one surface of described inner plating, be formed at the nickel coating on described layers of copper surface and be formed at the thin layer gold on described nickel coating surface, and be provided with the via running through described inner plating and described layers of copper, the hole wall of described via has the heavy layers of copper be electrically connected with described layers of copper, described layers of copper comprises the copper foil layer that forms described inner plating surface and is formed at described copper foil layer surface and adds thick copper layer between described copper foil layer and described nickel coating, described copper foil layer has local electric gold region, and be formed in described local electric gold region the thick layer gold being attached at described thin layer gold surface.The processing method of the printed wiring board in this embodiment is described in detail above, does not repeat herein.Understandably,
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a processing method for printed wiring board, is characterized in that, comprises the following steps:
Plate base material is provided, described plate base material comprises inner plating and establishes and the copper foil layer at least one outer surface of described inner plating, and be provided with the via of through described copper foil layer and described inner plating, described copper foil layer is provided with local electric carat (measure of the purity of gold), and the hole wall of described via is formed with the heavy layers of copper connecting described copper foil layer;
Outer graphics, provides the first dry film and described first dry film is attached at described copper foil layer surface, provide the first film figure and described first film figure is transferred to described copper foil layer on the surface to form outer-layer circuit figure through exposure and development;
Graphic plating, the mode adopting sour copper to electroplate is formed at described outer-layer circuit figure and described heavy layers of copper surface and adds thick copper layer;
Nickel plating, adopts nickel-plating liquid to form nickel coating on the described thick copper layer surface that adds;
Plate thin gold, carry out electrogilding process on described nickel coating surface and form the thin layer gold that thickness is 0.02 ~ 0.05 micron;
Outer local electric gold figure, second dry film is provided and described second dry film is attached at described thin layer gold surface, second film figure is provided and described second film figure is attached at described second dry film surface and is positioned at above described local electric carat (measure of the purity of gold), through exposing and developing described second film Graphic transitions to described local electric carat (measure of the purity of gold) upper area;
Local electric thick gold, is not carried out electrogilding process and forms thick layer gold by the region that described first dry film and described second dry film attach above described local electric carat (measure of the purity of gold); And
Outer etching, removes described first dry film and described second dry film and carries out etch processes to exposed described copper foil layer.
2. the processing method of printed wiring board as claimed in claim 1, is characterized in that, also comprise in the step providing plate base material:
Pressing, is cascading described inner plating, prepreg and described copper foil layer and carries out pressing process to form described plate base material;
Outer boring, carries out Drilling operation to described plate base material and forms the described via running through described plate base material;
Outer heavy copper, carries out heavy Copper treatment to described via and forms at the hole wall of described via the heavy layers of copper be electrically connected with described copper foil layer
The plating of whole plate, sinks the described plate base material after Copper treatment to skin and carries out whole plate electro-coppering, and form copper plate at described copper foil layer and described heavy layers of copper surface.
3. the processing method of printed wiring board as described in claim 1 or 2, it is characterized in that, in outer graphics step, the thickness of described first dry film is 40 microns.
4. the processing method of as described in claim 1 or 2 printed wiring board, is characterized in that, in graphic plating step, described in add thick copper layer thickness be 25 ~ 40 microns.
5. the processing method of printed wiring board as described in claim 1 or 2, it is characterized in that, in nickel plating step, the thickness of described nickel coating is 5 ~ 10 microns.
6. the processing method of printed wiring board as described in claim 1 or 2, is characterized in that, in the thin golden step of plating, the thickness of described thin layer gold is 0.025 ~ 0.050 micron.
7. the processing method of printed wiring board as described in claim 1 or 2, is characterized in that, in outside local electric gold patterning step, the evenness of described plate substrate surface is ± 10 microns.
8. a printed wiring board, it is characterized in that, adopt the processing method of the printed wiring board as described in claim 1 to 7 any one and make, comprise inner plating, be formed at the layers of copper at least one surface of described inner plating, be formed at the nickel coating on described layers of copper surface and be formed at the thin layer gold on described nickel coating surface, and be provided with the via running through described inner plating and described layers of copper, the hole wall of described via has the heavy layers of copper be electrically connected with described layers of copper, described layers of copper comprises the copper foil layer that forms described inner plating surface and is formed at described copper foil layer surface and adds thick copper layer between described copper foil layer and described nickel coating, described copper foil layer has local electric gold region, and be formed in described local electric gold region the thick layer gold being attached at described thin layer gold surface.
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| CN201410033707.2A CN104812171A (en) | 2014-01-23 | 2014-01-23 | Printed circuit board and processing method thereof |
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| CN201410033707.2A CN104812171A (en) | 2014-01-23 | 2014-01-23 | Printed circuit board and processing method thereof |
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| CN105578778A (en) * | 2015-12-17 | 2016-05-11 | 江门崇达电路技术有限公司 | Manufacturing method of single-face local thick-gold plated PCB |
| CN106535504A (en) * | 2016-11-18 | 2017-03-22 | 江门崇达电路技术有限公司 | Manufacturing technology of whole-plate nickel and gold plating half-slotted hole |
| CN106993377A (en) * | 2017-03-21 | 2017-07-28 | 昆山沪利微电有限公司 | A kind of printed circuit board (PCB) locally thickeies the thick preparation method of copper |
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| CN108055785A (en) * | 2017-11-27 | 2018-05-18 | 大连崇达电路有限公司 | A kind of figure nickel gold process of optimization |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| KR101310256B1 (en) * | 2011-06-28 | 2013-09-23 | 삼성전기주식회사 | Electroless plated layers of printed circuit board and method for preparing the same |
-
2014
- 2014-01-23 CN CN201410033707.2A patent/CN104812171A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| KR101310256B1 (en) * | 2011-06-28 | 2013-09-23 | 삼성전기주식회사 | Electroless plated layers of printed circuit board and method for preparing the same |
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| CN105578778A (en) * | 2015-12-17 | 2016-05-11 | 江门崇达电路技术有限公司 | Manufacturing method of single-face local thick-gold plated PCB |
| CN106535504A (en) * | 2016-11-18 | 2017-03-22 | 江门崇达电路技术有限公司 | Manufacturing technology of whole-plate nickel and gold plating half-slotted hole |
| CN106993377A (en) * | 2017-03-21 | 2017-07-28 | 昆山沪利微电有限公司 | A kind of printed circuit board (PCB) locally thickeies the thick preparation method of copper |
| CN107041077A (en) * | 2017-04-27 | 2017-08-11 | 广东依顿电子科技股份有限公司 | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity |
| CN109211992B (en) * | 2017-06-29 | 2024-07-19 | 深圳市理邦精密仪器股份有限公司 | Electrode circuit board for blood gas biochemical measurement and method for manufacturing electrode |
| CN109211992A (en) * | 2017-06-29 | 2019-01-15 | 深圳市理邦精密仪器股份有限公司 | The method of telegraph circuit plate and production electrode for vim and vigour Biochemistry measurement |
| CN108055785A (en) * | 2017-11-27 | 2018-05-18 | 大连崇达电路有限公司 | A kind of figure nickel gold process of optimization |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| CN108617105A (en) * | 2018-05-23 | 2018-10-02 | 惠州美锐电子科技有限公司 | A kind of pcb board production technology of plate lead electricity gold |
| CN110351955A (en) * | 2019-06-17 | 2019-10-18 | 江门崇达电路技术有限公司 | A kind of production method of the PCB with local electric thick gold PAD |
| CN110351955B (en) * | 2019-06-17 | 2021-07-23 | 江门崇达电路技术有限公司 | Manufacturing method of PCB with local electrical thick gold PAD |
| CN110831343B (en) * | 2019-11-04 | 2020-10-02 | 上海申和热磁电子有限公司 | Surface treatment method for selective chemical silver deposition of DBC substrate |
| CN110831343A (en) * | 2019-11-04 | 2020-02-21 | 上海申和热磁电子有限公司 | Surface treatment method for selective chemical silver deposition of DBC substrate |
| CN114007343A (en) * | 2021-10-22 | 2022-02-01 | 深圳明阳电路科技股份有限公司 | Printed Circuit Board (PCB) electric thick gold, PCB and manufacturing method thereof |
| CN114007343B (en) * | 2021-10-22 | 2024-05-17 | 深圳明阳电路科技股份有限公司 | Printed circuit board electro-thick gold, printed circuit board and manufacturing method thereof |
| CN113825320A (en) * | 2021-11-24 | 2021-12-21 | 四川英创力电子科技股份有限公司 | Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board |
| CN113825320B (en) * | 2021-11-24 | 2022-02-11 | 四川英创力电子科技股份有限公司 | Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board |
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