Irg4Ph50Kdpbf: Insulated Gate Bipolar Transistor With Ultrafast Soft Recovery Diode Short Circuit Rated Ultrafast Igbt
Irg4Ph50Kdpbf: Insulated Gate Bipolar Transistor With Ultrafast Soft Recovery Diode Short Circuit Rated Ultrafast Igbt
Irg4Ph50Kdpbf: Insulated Gate Bipolar Transistor With Ultrafast Soft Recovery Diode Short Circuit Rated Ultrafast Igbt
IRG4PH50KDPbF
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
High short circuit rating optimized for motor control, tsc =10s, VCC = 720V , TJ = 125C, VGE = 15V Combines low conduction losses with high switching speed Tighter parameter distribution and higher efficiency than previous generations IGBT co-packaged with HEXFREDTM ultrafast, ultrasoft recovery antiparallel diodes Lead-Free
Features
VCES = 1200V
G E
n-ch an nel
Benefits
Latest generation 4 IGBT's offer highest power density motor controls possible HEXFREDTM diodes optimized for performance with IGBTs. Minimized recovery characteristics reduce noise, EMI and switching losses This part replaces the IRGPH50KD2 and IRGPH50MD2 products For hints see design tip 97003
TO-247AC
Parameter
Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Q Clamped Inductive Load Current R Diode Continuous Forward Current Diode Maximum Forward Current Short Circuit Withstand Time Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec. Mounting Torque, 6-32 or M3 Screw.
Max.
1200 45 24 90 90 16 90 10 20 200 78 -55 to +150 300 (0.063 in. (1.6mm) from case) 10 lbfin (1.1 Nm)
Units
V
s V W C
Thermal Resistance
Parameter
RJC RJC RCS RJA Wt Junction-to-Case - IGBT Junction-to-Case - Diode Case-to-Sink, flat, greased surface Junction-to-Ambient, typical socket mount Weight
Min.
Typ.
0.24 6 (0.21)
Max.
0.64 0.83 40
Units
C/W
g (oz)
04/26/04
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IRG4PH50KDPbF
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)CES
V(BR)CES/TJ
VCE(on)
Parameter Min. Typ. Collector-to-Emitter Breakdown VoltageS 1200 Temperature Coeff. of Breakdown Voltage 0.91 Collector-to-Emitter Saturation Voltage 2.77 3.28 2.54 Gate Threshold Voltage 3.0 Temperature Coeff. of Threshold Voltage -10 Forward Transconductance T 13 19 Zero Gate Voltage Collector Current Diode Forward Voltage Drop 2.5 2.1 Gate-to-Emitter Leakage Current
Max. Units Conditions V VGE = 0V, IC = 250A V/C VGE = 0V, IC = 1.0mA 3.5 IC = 24A VGE = 15V V IC = 45A See Fig. 2, 5 IC = 24A, TJ = 150C 6.0 VCE = VGE, IC = 250A mV/C VCE = VGE, IC = 250A S VCE = 100V, IC = 24A 250 A VGE = 0V, VCE = 1200V 6500 VGE = 0V, VCE = 1200V, TJ = 150C 3.5 V IC = 16A See Fig. 13 3.0 IC = 16A, TJ = 150C 100 nA VGE = 20V
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IRG4PH50KDPbF
30
F o r b o th :
25
20
S q u a re w a v e :
15
10
Id e a l d io d e s
0 0.1
10
100
f, Frequency (KHz)
100
100
TJ = 150 C
10
T J = 150 C 10
TJ = 25 C
TJ = 25 C
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IRG4PH50KDPbF
50 4.0
40
3.5
IC = 48A
30
3.0
IC = 24A
2.5
20
IC = 12A
2.0
10
25
50
75
100
125
150
20
40
60
TC , Case Temperature ( C)
TJ , Junction Temperature ( C)
D = 0.50 0.20 0.1 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE)
0.01
0.001 0.00001
Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = PDM x Z thJC + TC 0.1 0.0001 0.001 0.01
P DM t1 t2 1
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IRG4PH50KDPbF
4000
C, Capacitance (pF)
3000
VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc
20
VCC = 400V I C = 24A
16
Cies
12
2000
1000
Coes Cres
1 10 100
40
80
120
160
200
7.0
6.6
100
5.0 RG = Ohm VGE = 15V 800V VCC = 960V
IC = 48 A
10
6.2
IC = 24 A IC = 12 A
5.8
5.4
10
20
30
40
50
20
40
60
TJ , Junction Temperature ( C )
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IRG4PH50KDPbF
20
15
RG TJ VCC CC VGE
1000
VGE = 20V T J = 125 o C
100
10
10
100
T J = 150C
10
T J = 125C T J = 25C
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300
40
IRG4PH50KDPbF
VR = 200 V T J = 125C T J = 25C
I F = 1 6A I F = 8 .0 A
I R R M - (A )
trr - (ns)
IF = 3 2 A
20
I F = 32A I F = 16 A I F = 8 .0A
100 10
0 100
d i f /dt - (A / s)
1000
0 100
di f /dt - (A / s)
1000
VR = 2 00 V T J = 125C T J = 25C
900
600
I F = 16A
d i(rec )M /d t - (A / s)
I F = 3 2A
Q R R - (nC )
100
I F = 32 A I F =1 6A I F = 8 .0 A
I F = 8 .0A
300
0 100
di f /d t - (A / s)
1000
10 100
di f /d t - (A / s)
1000
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IRG4PH50KDPbF
90% Vge +Vge Same ty pe device as D .U.T.
V ce
10% Vce
9 0 % Ic Ic 5 % Ic
td (o ff)
tf
E o ff =
t1 + 5 S V c e ic d t t1
Fig. 18a - Test Circuit for Measurement of ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
t1 t2
G A T E V O L T A G E D .U .T . 1 0 % +V g +Vg
Ic
trr
Q rr =
icdt
trr id d t tx
1 0 % Irr V cc
Irr
Ic D IO D E R E C O V E R Y W A V E FO R M S
td (o n )
tr
5% Vce t2 E o n = V ce ie d t t1
t1
t2
Vcicdt
t4 V d id d t t3
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IRG4PH50KDPbF
V g G A T E S IG N A L D E V IC E U N D E R T E S T C U R R E N T D .U .T .
V O L T A G E IN D .U .T .
C U R R E N T IN D 1
t0
t1
t2
D.U.T.
RL= 0 - 480V
960V 4 X I C @25C
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IRG4PH50KDPbF
Notes:
Q Repetitive rating: VGE=20V; pulse width limited by maximum junction temperature (figure 20) R VCC=80%(VCES), VGE=20V, L=10H, RG= 5.0 (figure 19) S Pulse width 80s; duty factor 0.1%. T Pulse width 5.0s, single shot.
PART NUMBER
IRFPE30
56 035H 57
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 04/04
10
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Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/