WO2014103040A1 - 接着剤組成物およびそれを用いた接着シート - Google Patents
接着剤組成物およびそれを用いた接着シート Download PDFInfo
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- WO2014103040A1 WO2014103040A1 PCT/JP2012/084164 JP2012084164W WO2014103040A1 WO 2014103040 A1 WO2014103040 A1 WO 2014103040A1 JP 2012084164 W JP2012084164 W JP 2012084164W WO 2014103040 A1 WO2014103040 A1 WO 2014103040A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/005—Modified block copolymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/226—Presence of unspecified polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
- C09J2400/283—Presence of paper in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Definitions
- the present invention relates to an adhesive composition. More specifically, the present invention can bond metals, metal and organic material, organic material and organic material, has toughness, and has excellent adhesive strength even in a high temperature environment. It is related with the adhesive composition which can be hold
- thermosetting resin such as an epoxy resin
- the epoxy adhesive has a high mechanical strength of the resin itself after curing, but is inferior in toughness.
- a decrease in adhesive strength due to brittle fracture becomes a problem.
- attempts have been made to add flexibility to the epoxy adhesive by adding a thermoplastic resin or the like to the epoxy resin (for example, JP-A-2003-82034).
- the present inventors can realize an adhesive having toughness and excellent adhesive strength even in a high temperature environment by adding a specific acrylic resin to an epoxy resin. I got the knowledge. The present invention is based on this finding.
- an object of the present invention is to provide an adhesive composition that can bond metals, metal and organic material, organic material and organic material, has toughness, and can maintain excellent adhesive strength even in a high temperature environment. Is to provide.
- Another object of the present invention is to provide an adhesive sheet using the adhesive composition as described above.
- the adhesive composition according to the present invention is an adhesive composition comprising an epoxy resin, an acrylic resin, and a curing agent,
- the acrylic resin is composed of a triblock copolymer of methyl methacrylate-butyl acrylate-methyl methacrylate or a modified product thereof.
- the epoxy resin is preferably a bisphenol type epoxy resin.
- the epoxy resin includes two types of bisphenols: a bisphenol type epoxy resin that is liquid at normal temperature and a bisphenol type epoxy resin that is solid at normal temperature and has a glass transition temperature in the range of 50 to 150 ° C. It is preferable to consist of a type epoxy resin.
- the blending ratio of the epoxy resin and the acrylic resin is 100: 4 to 100: 20.
- the bisphenol-type epoxy resin that is liquid at room temperature and the bisphenol-type epoxy resin that is solid at room temperature are included in a ratio of 100: 300 to 300: 100. .
- the epoxy resin may be included in an amount of 140 to 260 parts by mass, the acrylic resin in an amount of 10 to 50 parts by mass, and the curing agent may be included in an amount of 1 to 30 parts by mass. preferable.
- the triblock copolymer includes a methyl methacrylate unit and a butyl acrylate unit in a ratio of 1: 1 to 50: 1.
- the adhesive composition has a sea-island structure in which the epoxy resin is sea and the acrylic resin is island.
- An adhesive sheet according to another aspect of the present invention is an adhesive sheet obtained by laminating a first release paper, an adhesive layer, and a second release paper in this order, and the adhesive layer is bonded to the adhesive sheet. It comprises an agent composition.
- the adhesive layer further includes a core material, and the core material is impregnated with the adhesive.
- An adhesion method is a method of adhering the first adherend and the second adherend using the adhesive sheet, From the adhesive sheet, the first release paper and the second release paper are peeled and removed to expose the adhesive layer, Sandwiching the adhesive layer between the first adherend and the second adherend, and temporarily fixing the first adherend and the second adherend, The adhesive layer is cured by heating to bond the first adherend and the second adherend.
- a bonded body obtained by the above bonding method is also provided.
- the specific acrylic resin is added to the epoxy resin, the metal, the metal and the organic material, the organic material and the organic material can be bonded, and the toughness is provided, and the high temperature An adhesive composition that can maintain excellent adhesive strength even in an environment can be realized.
- FIG. 1 is a schematic cross-sectional view according to an embodiment of an adhesive sheet according to the present invention. It is the cross-sectional schematic by the other embodiment of the adhesive sheet by this invention.
- the adhesive composition according to the present invention contains an epoxy resin, an acrylic resin, and a curing agent as essential components.
- an epoxy resin an acrylic resin
- a curing agent a curing agent
- the epoxy resin used in the adhesive composition according to the present invention means a resin obtained by curing a prepolymer having at least one epoxy group or glycidyl group by a crosslinking polymerization reaction in combination with a curing agent.
- Such epoxy resins include bisphenol type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, novolac type epoxy resins such as novolac epoxy resin and cresol novolac epoxy resin, biphenyl type epoxy resin, and stilbene type epoxy.
- Resin triphenolmethane type epoxy resin, alkyl modified triphenolmethane type epoxy resin, epoxy resin such as triazine nucleus-containing epoxy resin, dicyclopentadiene modified phenol type epoxy resin, phenol novolac resin, cresol novolac resin, Triazines such as bisphenol A novolac resins and other novolac phenolic resins, phenolic resins such as resol phenolic resins, urea (urea) resins and melamine resins Resins having an unsaturated polyester resins, bismaleimide resins, polyurethane resins, diallyl phthalate resins, silicone resins, resins having a benzoxazine ring, cyanate ester resins.
- an epoxy resin having a rigid structure such as a biphenyl skeleton, a bisphenol skeleton, or a stilbene skeleton in the main chain is preferable, more preferably a bisphenol type epoxy resin, and particularly preferably a bisphenol A type. It is an epoxy resin.
- the above-mentioned bisphenol A type epoxy resin may be liquid at room temperature or solid at room temperature depending on the number of repeating units of the bisphenol skeleton.
- a bisphenol A type epoxy resin having a main chain of 1 to 3 is liquid at room temperature
- a bisphenol A type epoxy resin having a main chain of 2 to 10 is solid at room temperature.
- Such a relatively low molecular weight bisphenol A type epoxy resin has crystallinity, and even a solid one that is crystallized at room temperature rapidly melts and changes to a low-viscosity liquid when the temperature reaches the melting point or higher. Therefore, in the step of bonding the adherends, the adhesive adheres to the adherend by heating and solidifies by solidifying the adhesive and the adherend, so that the adhesive strength can be increased.
- such a relatively low molecular weight bisphenol A type epoxy resin has a high crosslink density, and therefore has high mechanical strength, good chemical resistance, high curability, and hygroscopicity (because the free volume is small). ) Is also small.
- the bisphenol A type epoxy resin that is solid at room temperature and a bisphenol A type epoxy resin that is liquid at room temperature, as described above, as the bisphenol A type epoxy resin.
- the bisphenol A type epoxy resin By using both solid and liquid at room temperature, it is possible to obtain flexibility while maintaining mechanical strength, while maintaining the mechanical strength inherent to the resin (adhesive composition) Flexibility can be obtained. As a result, the bonding strength between adherends can be improved.
- the bisphenol A type epoxy resin that is solid at normal temperature those having a glass transition temperature in the range of 50 to 150 ° C. are preferable from the viewpoint of mechanical strength and heat resistance.
- JER828 manufactured by Japan Epoxy Resin Co., Ltd. is a bisphenol A type epoxy having a main chain of 2 to 10 which is solid at normal temperature.
- Examples of the resin include JER1001 manufactured by Japan Epoxy Resin Co., Ltd.
- the blending ratio of bisphenol A type epoxy resin that is solid at room temperature and bisphenol A type epoxy resin that is liquid at room temperature depends on the use of the adhesive, but is a ratio of 100: 300 to 300: 100 on a mass basis It is preferable that it is contained. By setting the blending ratio of both in the above range, an adhesive having better adhesive strength can be obtained.
- ⁇ Acrylic resin> As the acrylic resin contained in the adhesive composition according to the present invention, a methyl methacrylate-butyl acrylate-methyl methacrylate triblock copolymer or a modified product thereof is used.
- MMA methacrylic acid ester polymer block
- BA butyl acrylate polymer block
- the MMA portion becomes a “hard” segment and the BA portion becomes a “soft” segment.
- an acrylic resin has been added to impart toughness (flexibility) to the epoxy resin, but the addition of the acrylic resin reduces the heat resistance of the adhesive itself.
- the acrylic resin has both the “hard” and “soft” segments as described above, the “hard” segment will contribute to heat resistance, and the “soft” segment will contribute to toughness and flexibility. It is considered that an adhesive having toughness and capable of maintaining excellent adhesive strength even in a high temperature environment can be realized.
- the above-described MMA-BA-MMA triblock copolymer can be produced by using general living radical polymerization. Among these, from the viewpoint of easy control of the polymerization reaction, it can be suitably produced by primordial transfer radical polymerization.
- the atom transfer radical polymerization method is a polymerization method using an organic halide or a sulfonyl halide compound as an initiator and a metal complex as a catalyst.
- a method of sequentially adding monomer units a method of polymerizing the next polymer block using a polymer synthesized in advance as a polymer initiator
- Examples thereof include a method in which polymer blocks separately polymerized are combined by reaction, and it is preferable to produce a MMA-BA-MMA triblock copolymer by a method in which monomer units are sequentially added.
- the order of addition of the methacrylic acid ester constituting the MMA block and the butyl acrylate constituting the BA block is as follows: There are a method of adding a butyl acrylate monomer after first polymerizing a methacrylic acid ester monomer and a method of adding a methacrylic acid ester monomer after first polymerizing a butyl acrylate monomer. Polymerization control is easier when the monomer is polymerized to polymerize the MMA block from the polymerization end of the BA block.
- the ratio of MMA to BA can be controlled by the amount of monomer introduced when the living radical polymerization reaction is performed.
- the ratio of MMA block to BA block in the MMA-BA-MMA triblock copolymer increases the toughness and flexibility of the adhesive as the BA block ratio increases, while the MMA block ratio increases. Then, the heat resistance of the adhesive is improved.
- the ratio of the MMA block to the BA block is preferably 1: 1 to 50: 1 in the number of monomer units.
- the above-mentioned MMA-BA-MMA triblock copolymer may be a modified product in which a functional group such as carboxylic acid or hydroxyl group is introduced into a part of the BA block.
- a functional group such as carboxylic acid or hydroxyl group
- the heat resistance is further improved and the compatibility with the above-described epoxy resin is also improved, so that the adhesive strength is further improved.
- the MMA-BA-MMA triblock copolymer When the MMA-BA-MMA triblock copolymer is added to the epoxy resin, the MMA block part is compatible with the epoxy resin, and the BA block part is not compatible with the epoxy resin. Self-organization as a matrix occurs. As a result, a sea-island structure in which the epoxy resin is the sea and the acrylic resin is the island appears. By exhibiting such a sea-island structure, interface fracture can be avoided and excellent adhesive strength can be maintained.
- an epoxy resin and an acrylic resin are blended at a ratio of 100: 4 to 100: 20 on a mass basis. It is preferable to do.
- the acrylic resin (island) is dispersed in the form of nano-order fine particles in the epoxy resin (sea).
- ⁇ Curing agent> The reaction between the acrylic resin and the epoxy resin proceeds by heating or the like and the adhesive composition is cured, but in the present invention, a curing agent is included in the adhesive composition in order to accelerate the curing reaction.
- the curing agent include aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylylenediamine (MXDA), diaminodiphenylmethane (DDM), m-phenylenediamine (MPDA), diaminodiphenylsulfone ( In addition to aromatic polyamines such as DDS), amine curing agents such as polyamine compounds including dicyandiamide (DICY) and organic acid dihydralazide, and alicyclic rings such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA) Acid anhydride curing agents such as aromatic acid anhydrides such as aromatic acid anhydrides (liquid acid
- Phenolic curing agent can be exemplified.
- dicyandiamide (DICY) is a latent curing agent, and thus is excellent in storage stability and has a pot life of several weeks even at room temperature storage.
- imidazoles as a hardening accelerator.
- the content of the curing agent in the adhesive composition is 1 to 30 parts by mass when the epoxy resin content is 140 to 260 parts by mass and the acrylic resin is 10 to 50 parts by mass. Is preferred.
- the blending ratio of the curing agent is less than this range, the heat resistance after joining is low, and the adhesive strength is likely to deteriorate due to a temperature change.
- the content of the curing agent exceeds this range, when the adhesive sheet is stored until it is bonded to the adherend, the storage stability (pot life) during the storage period decreases, and after the adhesive is cured However, the unreacted curing agent remains, so that there is a problem that the adhesive strength is lowered.
- the adhesive composition may include, for example, processability, heat resistance, weather resistance, mechanical properties, dimensional stability, antioxidant properties, slip properties, mold release properties, flame retardancy, antifungal properties.
- processability heat resistance, weather resistance, mechanical properties, dimensional stability, antioxidant properties, slip properties, mold release properties, flame retardancy, antifungal properties.
- lubricants plasticizers, fillers, fillers, antistatic agents, antiblocking agents, crosslinking agents, antioxidants, UV absorbers, Light stabilizers, colorants such as dyes and pigments, and the like may be added.
- a coupling agent such as silane, titanium, and aluminum can be further included.
- the adhesive composition used in the present invention can be prepared by mixing the above-described components and kneading and dispersing as necessary.
- the mixing or dispersing method is not particularly limited, and a conventional kneading and dispersing machine such as a two-roll mill, a three-roll mill, a pebble mill, a tron mill, a Szegvari attritor, a high-speed impeller disperser, a high-speed stone mill, A high speed impact mill, a desper, a high speed mixer, a ribbon blender, a kneader, an intensive mixer, a tumbler, a blender, a desperser, a homogenizer, an ultrasonic disperser, and the like can be applied.
- a conventional kneading and dispersing machine such as a two-roll mill, a three-roll mill, a pebble mill, a tron mill, a Szegvari attritor, a high-speed
- the adhesive sheet according to the present invention has a layer structure in which a first release paper and a second release paper are provided on both surfaces of an adhesive layer made of the above adhesive composition.
- the first release paper 21A and the second release paper 21B are collectively referred to as release paper 21.
- the adhesive layer further includes a core material, and the core material may be impregnated with the adhesive.
- a core material a woven fabric or a nonwoven fabric is preferable, and various conventionally known woven fabrics or nonwoven fabrics can be used.
- the core material include heat-resistant plastic fibers such as liquid crystal polymers, glass fibers, aramid fibers, and carbon fibers, and woven fabrics and nonwoven fabrics composed of these fibers can be used.
- the adhesive layer includes a core material
- a first release paper 21 (described later) and the core material 15 are overlapped and run using a coating machine, and the above-described adhesive 13 composition is applied to the surface of the core material 15.
- the second release paper 21B is bonded to the coated surface after drying, whereby the adhesive sheet 1 is obtained.
- the method for applying the adhesive composition to the release paper is not particularly limited. For example, roll coating, reverse roll coating, transfer roll coating, gravure coating, gravure reverse coating, comma coating, rod coat, blade Coating, bar coating, wire bar coating, die coating, lip coating, dip coating, etc. can be applied.
- the second release paper is applied.
- the pattern paper 21B may be attached.
- the viscosity of the composition (coating solution) is adjusted to about 1 to 20000 centistokes (25 ° C.), preferably 1 to 2000 centistokes. When the core material 15 is impregnated and applied, it is preferable that the viscosity is low, and it is 1 to 1000 centistokes.
- the first release paper 21A and the second release paper 21B may be the same or different.
- the release paper 21 conventionally known ones such as a release film, a separate paper, a separate film, a separate paper, a release film, and a release paper can be suitably used.
- the release layer is not particularly limited as long as it is a material having releasability.
- the release layer is formed by applying a coating liquid in which a release layer component is dispersed and / or dissolved to one side of a release paper base film, followed by heating and drying and / or curing.
- a coating method of the coating liquid a known and arbitrary coating method can be applied, for example, roll coating, gravure coating, spray coating and the like.
- the peel strength of the first and second release papers is preferably about 1 to 2000 mN / cm, and more preferably 100 to 1000 mN / cm with respect to the adhesive sheet.
- the release force of the release layer is less than 1 mN / cm, the release force from the adhesive sheet or the adherend is weak, and it peels off or partially floats.
- the peeling force of a release layer is strong and it is hard to peel.
- addition and / or polycondensation-type curable silicone resins for release paper which are mainly composed of polydimethylsiloxane, are preferred.
- the first release paper 21A and the second release paper 21B of the adhesive sheet 1 are peeled off and the adhesive layer 11 is exposed.
- the exposed adhesive layer 11 is sandwiched between two identical or different first adherends and second adherends and held with the adhesiveness of the adhesive layer 11.
- the adhesive layer 11 can be cured by heating or pressurizing to firmly bond the first adherend and the second adherend.
- the adherends can be temporarily fixed using the initial tackiness, and then the adhesive sheet is thermally cured by, for example, a batch method. Therefore, the process such as preheating can be omitted and the productivity is remarkably improved.
- the adherend is not particularly limited, and examples thereof include metals, inorganic materials, organic materials, composite materials combining these materials, and laminated materials.
- the heating temperature at the time of curing is about 60 ° C to 250 ° C, preferably 100 ° C to 180 ° C.
- the heating time is 1 to 240 minutes, preferably 10 to 120 minutes. Since the adhesive layer 11 of the cured adhesive sheet 1 has initial tackiness, there is no preheating process, and the work can be performed while holding the adherend with only the tackiness, so that the workability is good and the cost is low. Moreover, by selecting the material of the adhesive layer and the blending ratio thereof, the metals, the metal and the organic material, and the organic material and the organic material can be bonded.
- ⁇ Bonded body> By using the adhesive sheet according to the present invention, it is possible to strongly bond materials (adherents) such as FRP of glass fiber and carbon fiber, different metals, which are difficult with conventional welding methods, for example, metals such as aluminum and iron. And a bonded body of FRP and CFRP can be obtained. These bonded bodies can maintain excellent adhesive strength without undergoing temperature change, have low brittleness, and have excellent shear strength, high impact resistance, and heat resistance.
- the present invention can be used in the fields of electronic devices, electronic device casings, home appliances, infrastructure structures, lifeline building materials, general building materials, and the like.
- each composition of each layer is the mass part of solid content except a solvent.
- Examples 1 to 14 and Comparative Examples 1 to 5 ⁇ Preparation of adhesive composition> According to the composition shown in Table 1 below, an adhesive was prepared by adding a curing agent to a bisphenol A type epoxy resin and mixing with a stirrer, and then adding and mixing an acrylic resin to the mixture.
- JER828, JER1001 and JER1009 are bisphenol A type epoxy resins manufactured by Mitsubishi Chemical Corporation.
- W-197C is an ethyl acrylate-methyl methacrylate copolymer manufactured by Negami Kogyo Co., Ltd.
- SK Dyne 1495 is an acrylic-vinyl acetate copolymer manufactured by Soken Chemical Co., Ltd.
- LC # 6500 is a polymethyl methacrylate manufactured by Toei Kasei Co., Ltd.
- SM4032XM10 is a triblock copolymer of modified methyl methacrylate-butyl acrylate-methyl methacrylate having a carboxyl group introduced by Arkema
- M22 is a triblock copolymer of methyl methacrylate-butyl acrylate-methyl methacrylate manufactured by Arkema
- M22N is a triblock copolymer of modified methyl methacrylate-butyl acrylate-methyl methacrylate having a hydroxyl group introduced by Arkema
- KBM-403 is a silane coupling agent manufactured by Shin-Etsu Silicone
- DICY7 is a dicyandiamit manufactured by Mitsubishi Chemical Corporation.
- HIPA-2E4MZ is clathrate imidazole manufactured by Nippon Soda Co., Ltd.
- Amicure MY-H and Amicure PN-50 are amine adducts made by Ajinomoto Fine Techno, FXR-1030 represents a urea adduct manufactured by Ajinomoto Fine Techno Co., respectively.
- the obtained adhesive sheet was cut into 25 mm ⁇ 12.5 mm, one of the separator films was peeled off to expose the adhesive layer, and one of the adherends CFRP (length 100 mm ⁇ width 25 mm ⁇ thickness 1.5 mm) ).
- the separator film is peeled off from the adhesive sheet attached to the CFRP to expose the adhesive layer, and the end of the other adherend CFRP (length 100 mm ⁇ width 25 mm ⁇ thickness 1.5 mm) is formed on the adhesive layer portion.
- the part was pasted.
- a bonded body was obtained by applying a load of 3 kg on the temporarily fixed adherend and heating and curing the adhesive layer at 130 ° C. for 2 hours.
- ⁇ Evaluation of film forming property> Apply an adhesive to a Sepa film (SP-PET 01BU, manufactured by Tosero Co., Ltd.) with a comma coater so that the coating amount after drying is 50 g / m 2, and dry at 100 ° C. for 3 minutes. The appearance of was observed.
- the evaluation criteria were as follows. ⁇ : The coating film has a uniform thickness ( ⁇ 5 ⁇ m). X: There is a portion where the adhesive is repelled on the surface of the separator film and the evaluation result is as shown in Table 2 below.
- Adhesive sheet 11 Adhesive layer 13: Adhesive 15: Core material 21: Release paper 21A: First release paper 21B: Second release paper
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Abstract
Description
前記アクリル系樹脂が、メチルメタクリレート-ブチルアクリレート-メチルメタクリレートのトリブロック型共重合体またはその変性物からなることを特徴とするものである。
前記接着シートから、第1離型紙および第2離型紙を剥離し除去して接着層を露出させ、
前記接着層を、前記第1被着体および前記第2被着体で挟んで、前記第1被着体および前記第2被着体の仮固定を行い、
前記接着層を、加熱することにより硬化させて、前記第1被着体および前記第2被着体を接着することを含んでなるものである。
本発明による接着剤組成物に用いられるエポキシ系樹脂は、少なくとも1つ以上のエポキシ基またはグリシジル基を有するプレポリマーが、硬化剤との併用により架橋重合反応により硬化したものを意味する。このようなエポキシ系樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂等のビスフェノール型エポキシ樹脂、ノボラックエポキシ樹脂、クレゾールノボラックエポキシ樹脂等のノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、スチルベン型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、アルキル変性トリフェノールメタン型エポキシ樹脂、トリアジン核含有エポキシ樹脂、ジシクロペンタジエン変性フェノール型エポキシ樹脂等のエポキシ樹脂等が挙げられ、またフェノールノボラック樹脂、クレゾールノボラック樹脂、ビスフェノールAノボラック樹脂等のノボラック型フェノール樹脂、レゾールフェノール樹脂等のフェノール樹脂、ユリア(尿素)樹脂、メラミン樹脂等のトリアジン環を有する樹脂、不飽和ポリエステル樹脂、ビスマレイミド樹脂、ポリウレタン樹脂、ジアリルフタレート樹脂、シリコーン樹脂、ベンゾオキサジン環を有する樹脂、シアネートエステル樹脂等が挙げられる。これらエポキシ系樹脂の中でも、本発明においては、ビフェニル骨格、ビスフェノール骨格、スチルベン骨格などの剛直構造を主鎖に持つエポキシ樹脂が好ましく、より好ましくは、ビスフェノール型エポキシ樹脂、特に好ましくは、ビスフェノールA型エポキシ樹脂である。
本発明による接着剤組成物に含まれるアクリル系樹脂として、メチルメタクリレート-ブチルアクリレート-メチルメタクリレートのトリブロック型共重合体またはその変性物を使用する。このようなメタアクリル酸エステル重合体ブロック(以下、MMAと略す場合がある)と、アクリル酸ブチル重合体ブロック(以下、BAと略す場合がある)とからなるトリブロック型共重合体を、上記したエポキシ系樹脂に添加することにより、靱性を有し、かつ、高温環境下においても優れた接着強度を保持できる接着剤を実現できる。その理由は定かではないが、以下のように推定できる。
アクリル系樹脂とエポキシ系樹脂とは加熱等により反応が進行して接着剤組成物が硬化するが、本発明においては、硬化反応を促進するために、接着剤組成物中に硬化剤が含まれる。硬化剤としては、例えばジエチレントリアミン(DETA)、トリエチレンテトラミン(TETA)、メタキシレリレンジアミン(MXDA)などの脂肪族ポリアミン、ジアミノジフェニルメタン(DDM)、m-フェニレンジアミン(MPDA)、ジアミノジフェニルスルホン(DDS)などの芳香族ポリアミンのほか、ジシアンジアミド(DICY)、有機酸ジヒドララジドなどを含むポリアミン化合物等のアミン系硬化剤、ヘキサヒドロ無水フタル酸(HHPA)、メチルテトラヒドロ無水フタル酸(MTHPA)などの脂環族酸無水物(液状酸無水物)、無水トリメリット酸(TMA)、無水ピロメリット酸(PMDA)、ベンゾフェノンテトラカルボン酸(BTDA)等の芳香族酸無水物等の酸無水物系硬化剤、フェノール樹脂等のフェノール系硬化剤が例示できる。特に、ジシアンジアミド(DICY)は潜在性の硬化剤のため、保存安定性に優れ、室温保存でもポットライフが数週間もあるので好ましい。また、硬化促進剤としてイミダゾール類を含ませてもよい。
本発明による接着シートは、図1に示すように、上記の接着剤組成物からなる接着層の両面に第1離型紙および第2離型紙が設けられている層構成を有する。なお、本明細書では、第1離型紙21Aと第2離型紙21Bとを合わせて離型紙21と呼称する。接着層は、図2に示すように、芯材をさらに含み、接着剤が芯材に含浸されていてもよい。芯材としては、織布または不織布が好ましく、従来公知の種々の織布または不織布を使用できる。芯材としては、例えば、液晶ポリマーなどの耐熱性のあるプラスチックの繊維、ガラス繊維、アラミド繊維、炭素繊維などが例示でき、これらで構成した織布、不織布が使用できる。
被着体との接合は、接着シート1の第1離型紙21Aおよび第2離型紙21Bを剥離し除去して、接着層11を露出させる。露出した接着層11を、2つの同じまたは異なる第1被着体および第2被着体で挟み、接着層11の粘着性で保持させる。次いで、加熱、または加圧加熱することで接着層11を硬化させて、第1被着体および第2被着体を強固に接着させることができる。このように、本発明による接着シートを用いることにより、初期粘着性を利用して、被着体どうしを仮固定でき、その後に、例えばバッチ方式により粘接着シートを熱硬化させて被着体を接着できるため、プレヒートなどの工程を省くことができるとともに、生産性が著しく向上する。
本発明による接着シートを用いることにより、従来の溶接法では困難な、ガラス繊維や炭素繊維のFRP、異種金属などの材料(被着体)を強力に接合でき、例えば、アルミニウムと鉄等の金属との貼合体や、FRPやCFRPどうしの貼合体を得ることができる。これら貼合体は、温度変化を受けることなく優れた接着強度を保持できるとともに、脆質性が低く、優れた剪断強度と高い耐衝撃性、耐熱性を有するため、自動車、航空機、船舶等の分野に限らず、電子機器類、電子機器筐体、家電製品、インフラ系構造物、ライフライン建材、一般建材等の分野で利用することができる。
<接着剤組成物の調製>
下記の表1に示す組成に従って、ビスフェノールA型エポキシ樹脂に硬化剤を添加して攪拌機により混合した後、混合物にアクリル系樹脂を添加して混合することにより、接着剤を調製した。なお、下記の表1中、
JER828、JER1001およびJER1009は、三菱化学社製のビスフェノールA型エポキシ樹脂を、
W-197Cは、根上工業社製のアクリル酸エチル-メタアクリル酸メチル共重合体を、
SKダイン1495は、総研化学社製のアクリル-酢酸ビニル共重合体を、
LC#6500は、東栄化成社製のポリメタクリル酸メチルを、
SM4032XM10は、アルケマ社製のカルボキシル基が導入された変性メチルメタクリレート-ブチルアクリレート-メチルメタクリレートのトリブロック型共重合体を、
M22は、アルケマ社製のメチルメタクリレート-ブチルアクリレート-メチルメタクリレートのトリブロック型共重合体を、
M22Nは、アルケマ社製の水酸基が導入された変性メチルメタクリレート-ブチルアクリレート-メチルメタクリレートのトリブロック型共重合体を、
KBM-403は、信越シリコーン社製のシランカップリング剤を、
DICY7は、三菱化学社製のジシアンジアミトを、
HIPA-2E4MZは、日本曹達社製の包接イミダゾールを、
アミキュアMY-HおよびアミキュアPN-50は、味の素ファインテクノ社製のアミンアダクトを、
FXR-1030は、味の素ファインテクノ社製の尿素アダクトを、それぞれ表す。
得られた接着剤を、セパフィルム(SP-PET 03BU、東セロ社製)に重ね合わせた芯材(ベクルスMBBK6FZSO、クラレ社製)の表面に、コンマコーターにて、塗布量が100g/m2となるように塗布して、芯材に接着剤を含浸させて接着層を形成し、その接着層上に、セパフィルム(SP-PET 01BU、東セロ社製)を貼り合わせることにより接着シートを作製した。
得られた接着シートを25mm×12.5mmに裁断し、一方のセパフィルムを剥離して接着層を露出させて、一方の被着体であるCFRP(長さ100mm×幅25mm×厚み1.5mm)の先端部分に貼り付けた。CFRPに貼りつけた接着シートからセパフィルムを剥離して接着層を露出させて、その接着層部分に、他方の被着体であるCFRP(長さ100mm×幅25mm×厚み1.5mm)の先端部分を貼りつけた。
得られた各貼合体について、室温(25℃)および80℃の各環境下での接着強度の評価を行った。上記で得られた試料の両端をテンシロン(オリエンテック製RTA-1T)に固定して、1mm/minで引張り、せん断強度を測定した。評価結果は、下記の表2に示される通りであった。
セパフィルム(SP-PET 01BU、東セロ社製)に、乾燥後の塗布量が50g/m2となるように接着剤をコンマコーターにて塗布し、100℃で3分間の乾燥を行い、塗布面の外観を観察した。評価基準は以下の通りとした。
○:塗布膜が均一な厚み(±5μm)である
×:セパフィルムの表面で接着剤が弾いて塗布されていない箇所が存在する
評価結果は下記の表2に示される通りであった。
11:接着層
13:接着剤
15:芯材
21:離型紙
21A:第1離型紙
21B:第2離型紙
Claims (12)
- エポキシ系樹脂と、アクリル系樹脂と、硬化剤と、を含んでなる接着剤組成物であって、
前記アクリル系樹脂が、メチルメタクリレート-ブチルアクリレート-メチルメタクリレートのトリブロック型共重合体またはその変性物からなることを特徴とする、接着剤組成物。 - 前記エポキシ系樹脂がビスフェノール型エポキシ樹脂である、請求項1に記載の接着剤組成物。
- 前記エポキシ系樹脂が、常温で液状のビスフェノール型エポキシ樹脂およびガラス転移温度が50~150℃の範囲にある常温で固体のビスフェノール型エポキシ樹脂の2種のビスフェノール型エポキシ樹脂からなる、請求項1または2に記載の接着剤組成物。
- 前記エポキシ系樹脂と前記アクリル系樹脂との配合割合が、100:4~100:20である、請求項1~3のいずれか一項に記載の接着剤組成物。
- 前記室温で液状のビスフェノール型エポキシ樹脂と、前記室温で固体のビスフェノール型エポキシ樹脂とが、100:300~300:100の割合で含まれている、請求項3に記載の接着剤組成物。
- 前記エポキシ系樹脂が140~260質量部、前記アクリル系樹脂が10~50質量部、および、前記硬化剤が1~30質量部、含まれてなる、請求項1~5のいずれか一項に記載の接着剤組成物。
- 前記トリブロック型共重合体が、メチルメタクリレート単位とブチルアクリレート単位とを1:1~50:1の割合で含む、請求項1~6のいずれか一項に記載の接着剤組成物。
- 接着剤組成物中で、前記エポキシ系樹脂が海、前記アクリル系樹脂が島である海島構造を有する、請求項1~7のいずれか一項に記載の接着剤組成物。
- 第1離型紙と、接着層と、第2離型紙とを、この順で積層してなる接着シートであって、前記接着層が、請求項1~8のいずれか一項に記載の接着剤組成物を含んでなる、接着シート。
- 前記接着層が芯材をさらに含んでなり、前記接着剤が前記芯材に含浸されている、請求項9に記載の接着シート。
- 請求項9または10に記載の接着シートを用いて第1被着体と第2被着体とを接着する方法であって、
前記接着シートから、第1離型紙および第2離型紙を剥離し除去して接着層を露出させ、
前記接着層を、前記第1被着体および前記第2被着体で挟んで、前記第1被着体および前記第2被着体の仮固定を行い、
前記接着層を、加熱することにより硬化させて、前記第1被着体および前記第2被着体を接着することを含んでなる、方法。 - 請求項11に記載の方法により得られる貼合体。
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WO2016179010A1 (en) * | 2015-05-01 | 2016-11-10 | Lord Corporation | Adhesive for rubber bonding |
CN107567486A (zh) * | 2015-05-01 | 2018-01-09 | 洛德公司 | 用于橡胶粘接的粘合剂 |
US10005935B2 (en) | 2015-05-01 | 2018-06-26 | Lord Corporation | Adhesive for rubber bonding |
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JP2021126841A (ja) * | 2020-02-14 | 2021-09-02 | リンテック株式会社 | 剥離シート |
Also Published As
Publication number | Publication date |
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KR101938450B1 (ko) | 2019-01-14 |
CN104968745A (zh) | 2015-10-07 |
EP2940092A4 (en) | 2016-05-25 |
US10066135B2 (en) | 2018-09-04 |
KR20150100689A (ko) | 2015-09-02 |
EP2940092A1 (en) | 2015-11-04 |
EP2940092B1 (en) | 2020-04-08 |
US20160032157A1 (en) | 2016-02-04 |
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