TWI648147B - 具有防污性之具有凹凸形狀之表面的構造體及其製造方法 - Google Patents
具有防污性之具有凹凸形狀之表面的構造體及其製造方法 Download PDFInfo
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- TWI648147B TWI648147B TW102125748A TW102125748A TWI648147B TW I648147 B TWI648147 B TW I648147B TW 102125748 A TW102125748 A TW 102125748A TW 102125748 A TW102125748 A TW 102125748A TW I648147 B TWI648147 B TW I648147B
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Abstract
本發明之課題為提供具有對附著於凹凸形狀之表面的指紋等髒污的乾拭特性之構造體、及其製造方法。
其解決手段為一種具有凹凸形狀之表面的構造體,其係由含有1分子中具有1個至10個聚合性基之至少1種化合物及光聚合起始劑的組成物所製作,且以熔融石英之馬氏硬度為4100N/mm2之條件來測定時的馬氏硬度為3N/mm2以上、130N/mm2以下。前述構造體係藉由於將前述組成物塗佈於基材上後,將前述基材上之塗膜壓接於模具之具有凹凸形狀的面,在該狀態下使前述塗膜光硬化而成為硬化膜,且將前述基材上之硬化膜由前述模具剝離而製造。
Description
本發明係關於由壓印材料(形成壓印用膜之
組成物)所製作,且馬氏硬度在指定範圍內之具有凹凸形狀之表面的構造體及其製造方法。更詳而言之,係關於可輕易將附著於凹凸形狀之表面的指紋等髒污拭去之具有前述表面的構造體及其製造方法。
1995年,現普林斯頓大學之Chou教授等提倡
了稱為奈米壓印微影術之新技術(專利文獻1)。奈米壓印微影術,係使具有任意圖型之模具與形成有樹脂膜之基材接觸,對該樹脂膜加壓,而且使用熱或光作為外部刺激,將目標圖型形成於經硬化之該樹脂膜的技術,此奈米壓印微影術,相對於以往半導體裝置製造中的光微影術等,具有可簡便、便宜地進行奈米等級之加工的優點。
因此,奈米壓印微影術,係取代光微影術技術,期待
對於半導體裝置、光學裝置(opto-device)、顯示器、記憶媒體、生物晶片等之製造有所應用的技術,因此對於奈米壓印微影術所用之光奈米壓印微影術用硬化性組成物,係有各樣的報導(專利文獻2、專利文獻3)。
光學裝置、顯示器等電子機器中,係要求可
將其表面所附著之指紋等髒污除去的性能。而擦拭時,就電子機器之操作上,期望不使用水等洗淨液而可乾拭。至今為止,關於藉由奈米壓印微影而得之具有凹凸形狀之表面的構造體雖有各種揭示,但該揭示文獻中並無探討或報導將附著於前述構造體之指紋等髒污以布直接乾拭而去除。
〔專利文獻1〕美國專利第5772905號說明書
〔專利文獻2〕日本2008-105414號公報
〔專利文獻3〕日本2008-202022號公報
本發明係基於上述事實而為者,其所欲解決之課題,係提供對附著於凹凸形狀之表面的指紋等髒污具有乾拭特性之構造體、及其製造方法。
本發明者等為了解決上述課題進行努力探討
之結果,發現了藉由使具有凹凸形狀之表面的構造體的硬度在特定範圍內,會展現附著於前述構造體之凹凸形狀之表面的指紋擦拭性,而完成了本發明。
亦即,本發明作為第1觀點,係關於一種具
有凹凸形狀之表面的構造體,其係由含有1分子中具有1個至10個聚合性基之至少1種化合物及光聚合起始劑的組成物所製作,且在熔融石英之馬氏硬度為4100N/mm2之條件測定時之馬氏硬度為3N/mm2以上,130N/mm2以下。
作為第2觀點,係關於如第1觀點記載之構造體,其中前述聚合性基為由丙烯醯氧基、甲基丙烯醯氧基、乙烯基及烯丙基所構成群組中選出之至少1種基。
作為第3觀點,係關於如第1觀點或第2觀點記載之構造體,其中前述組成物進一步含有聚矽氧化合物,且該構造體係藉由壓印該組成物來製作。
作為第4觀點,係關於如第3觀點記載之構造體,其中前述聚矽氧化合物係以下述式(1)或式(2)表示之化合物,
(式中,R1表示氫原子或甲基,R2表示氫原子或碳原子數1至5之烷基,複數個R3係分別獨立地表示氫原子或碳原子數1至3之烷基,n表示1至55之整數,m表示0至97之整數,p表示1至5之整數,q表示1至10之整數)。
作為第5觀點,係關於如第1觀點至第4觀點中任一者記載之構造體,其中前述凹凸形狀為蛾眼構造。
作為第6觀點,係關於一種如第1觀點至第5觀點中任一者記載之構造體之製造方法,其係將含有1分子中具有1個至10個聚合性基之至少1種化合物及光聚合起始劑的前述組成物塗佈於基材上後,將前述基材上之塗膜壓接於模具之具有凹凸形狀的面,在該狀態下使前述塗膜光硬化而成為硬化膜,將前述基材上之硬化膜由前述模具剝離。
作為第7觀點,係關於如第6觀點記載之構造體之製
造方法,其中前述組成物進一步含有界面活性劑。
作為第8觀點,係關於如第6觀點或第7觀點記載之構造體之製造方法,其係包含將進一步含有溶劑之前述組成物塗佈於前述基材上後,藉由烘烤使前述溶劑揮發之步驟。
作為第9觀點,係關於如第6觀點至第8觀點中任一者記載之構造體之製造方法,其中使用薄膜作為前述基材,於將前述薄膜上之硬化膜由前述模具90°剝離的試驗中,將使前述薄膜上之硬化膜由前述模具剝離時的荷重換算為前述薄膜之每1cm寬度之值的脫模力為大於0g/cm、0.7g/cm以下。
作為第10觀點,係關於一種光學構件,其係於基材上具備如第1觀點至第5觀點中任一者記載之構造體。
作為第11觀點,係關於一種固體攝影裝置,其係於基材上具備如第1觀點至第5觀點中任一者記載之構造體。
作為第12觀點,係關於一種LED裝置,其係於基材上具備如第1觀點至第5觀點中任一者記載之構造體。
作為第13觀點,係關於一種半導體元件,其係具備如第1觀點至第5觀點中任一者記載之構造體。
作為第14觀點,係關於一種太陽電池,其係於基材上具備如第1觀點至第5觀點中任一者記載之構造體。
作為第15觀點,係關於一種顯示器,其係於基材上具備如第1觀點至第5觀點中任一者記載之構造體。
作為第16觀點,係關於一種電子裝置,其係於基材上具備如第1觀點至第5觀點中任一者記載之構造體。
本發明之構造體,可乾拭附著於其凹凸形狀之表面的指紋等髒污。因此,本發明之構造體可適合使用於太陽電池、LED裝置、顯示器等之使用要求指紋等髒污之擦拭性的構件之製品。
本發明之構造體中,凸部係表示相較於作為基準之面更突出之部分,凹部係表示相較於作為基準之面更凹陷的部分。本發明之構造體可具有凹部及凸部兩者,亦可僅具有任一者。又,使用本發明之構造體作為裝置之抗反射膜時,該構造體之表面較佳為蛾眼形狀。此處,蛾眼形狀係表示凹部與凸部係為連續的波浪形狀。
關於本發明之構造體之表面的凹凸形狀,其
尺寸無特殊限制,縱橫比例如為1.0以上,3.0以下;較佳為1.0以上,1.5以下。此處,縱橫比係表示(凸部或凹部之自基準面起的平均高度或平均深度)/(相對於凸部或凹部之至少某一方向的平均週期)。
又,本發明之構造體之製造所用之光壓印用
模具材,可列舉例如石英、矽、鎳、氧化鋁、羰基矽烷、玻璃石墨(glassy carbon),但只要可得到目標之圖型,則無特殊限定。又,為了提高脫模性,亦可進行於模具之表面形成氟系化合物等之薄膜的脫模處理。脫模處理所用之脫模劑,可列舉例如大金工業股份有限公司製之OPTOOL(註冊商標)HD、同DSX,但只要可得到目標之圖型,則無特殊限定。
光壓印之圖型尺寸為奈米等級,具體而言準
用未達1微米之圖型尺寸。
本發明之構造體之製造所用之將含有1分子
中具有1個至10個聚合性基之至少1種化合物及光聚合起始劑的組成物(壓印材料)塗佈於基材上之方法,可列舉公知或周知之方法,例如、旋轉塗佈法、浸漬法、流動塗佈法、噴墨法、噴霧法、棒塗佈法、凹版塗佈法、狹縫塗佈法、輥塗佈法、轉印印刷法、刷毛塗佈、刮刀塗佈法、氣刀塗佈法。
本發明之構造體的製造所用之塗佈上述壓印
材料的基材,可列舉由例如矽、成膜有銦錫氧化物(ITO)之玻璃(以下,本說明書中略稱為「ITO基板」)、成膜有氮化矽(SiN)之玻璃(SiN基板)、成膜有銦鋅氧化物(IZO)之玻璃、聚對苯二甲酸乙二酯(PET)、三乙醯基纖維素(TAC)、壓克力、塑膠、玻璃、石英、陶瓷等所成之基材。又,亦可使用由具有可撓性之可撓性基材,例如三乙醯基纖維素、聚對苯二甲酸乙
二酯、聚甲基丙烯酸甲酯、環烯烴(共)聚合物、聚乙烯醇、聚碳酸酯、聚苯乙烯、聚醯亞胺、聚醯胺、聚烯烴、聚丙烯、聚乙烯、聚萘二甲酸乙二酯、聚醚碸、以及組合該等聚合物之共聚物所成之基材。
將上述壓印材料塗佈於基材上後硬化的光
源,並無特殊限定,可列舉例如高壓水銀燈、低壓水銀燈、無電極燈、金屬鹵化物燈、KrF準分子雷射、ArF準分子雷射、F2準分子雷射、電子束(EB)、極紫外線(EUV)。又,波長一般而言,可使用436nm之G線、405nm之H線、365nm之I線、或GHI混合線。進一步地,曝光量較佳為30mJ/cm2至2000mJ/cm2、更佳為30mJ/cm2至1000mJ/cm2。
上述壓印材料含有溶劑時,亦可對光照射前
之塗膜及光照射後之硬化膜的至少一者,以使溶劑蒸發為目的而增加烘烤步驟。用於烘烤之機器並無特殊限定,只要係例如可使用加熱板、烘箱、熔爐(furnace),在適切的環境下,亦即大氣、氮等惰性氣體、或在真空中燒成者即可。烘烤溫度只要以使溶劑蒸發為目的,則無特殊限定,例如可在40℃至200℃進行。
進行光壓印之裝置,只要可得到目標之構造
體則無特殊限定,可列舉例如東芝機械股份有限公司製之ST50、同公司製之ST50S-LED、Obducat公司製之Sindre(註冊商標)60、明昌機工股份有限公司製之NM-0801HB等市售之裝置。且可用使用該裝置將塗佈於基材
上之壓印材料與模具壓接,於光硬化後脫模的方法。
本發明之構造體,以奈米壓痕之馬氏硬度,以熔融石英為4100N/mm2之條件測定時必須為3N/mm2以上,較佳為8N/mm2以上,130N/mm2以下。比8N/mm2小則難以以光壓印形成構造體、比130N/mm2大則擦拭附著於構造體之凹凸形狀之表面的指紋時,容易發生構造體的破壞。測定裝置係使用超微小壓入硬度試驗機ENT-2100(Elionix股份有限公司製)、壓頭係使用稜間角115°之鈦製三角壓頭(東京金剛石工具製作所股份有限公司製)來測定。
本說明書中評估脫模力之90°剝離試驗,一般係指將接著物(本發明中相當於藉由光壓印所形成之硬化膜)貼附於被著物(本發明中相當於作為基材使用之薄膜),於指定時間後測定以指定之剝離速度向90°方向剝離時所產生之抵抗力(張力)之試驗,通常測定係以參考JIS Z0237之評估法實施。於此,可將使所測定之抵抗力換算為單位寬度的被著物之值作為脫模力來評估。本發明中,將含有1分子中具有1個至10個聚合性基之至少1種化合物及光聚合起始劑的組成物塗佈於薄膜上,將該薄膜上之塗膜接著於模具之具有凹凸形狀的面,接著將該塗膜在接著於模具之具有凹凸形狀的面的狀態下光硬化,之後將
薄膜上之硬化被膜由模具之具有凹凸形狀的面90°剝離的試驗中所測量的脫模力、亦即將該薄膜上之被膜由模具之具有凹凸形狀的面完全剝離時的荷重換算為該薄膜之橫寬度每1cm之值,係越小越佳,例如較佳為大於0g/cm、且0.7g/cm以下。
以下詳述用以形成本發明之構造體的壓印材料(組成物)。
1分子中具有1個至10個聚合性基之化合物,只要可得到所期望的硬度,則可單獨亦可為2種以上之組合。又,分子中亦可具有酯鍵、醚鍵或胺基甲酸酯鍵。前述聚合性基可列舉例如丙烯醯氧基、甲基丙烯醯氧基、乙烯基、烯丙基。此處,丙烯醯氧基亦可表現為acryloxy基、甲基丙烯醯氧基可表現為methacryloxy基。
上述化合物可列舉例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸n-丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸tert-丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸n-月桂酯、(甲基)丙烯酸n-硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸n-丁氧基乙酯、丁氧基二乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸環己酯、(甲
基)丙烯酸四氫糠酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸二甲基胺基乙酯、(甲基)丙烯酸二乙基胺基乙酯、(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基琥珀酸、2-甲基丙烯醯氧基乙基六氫鄰苯二甲酸、鄰苯二甲酸2-甲基丙烯醯氧基乙基-2-羥基丙酯、(甲基)丙烯酸環氧丙酯、2-甲基丙烯醯氧基乙基酸式磷酸酯、甲氧基聚乙二醇(甲基)丙烯酸酯、苯氧基聚乙二醇(甲基)丙烯酸酯、羥基乙基化o-苯基酚丙烯酸酯、o-苯基酚環氧丙基醚丙烯酸酯、新戊基二醇二(甲基)丙烯酸酯、2-羥基丙二醇二(甲基)丙烯酸酯、甲基丙烯酸2-羥基-3-丙烯醯氧基丙酯、異丙二醇二(甲基)丙烯酸酯、乙氧化雙酚A二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚四亞甲二醇#650二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、二噁烷二醇二(甲基)丙烯酸酯、環氧乙烷環氧丙烷共聚物二(甲基)丙烯酸酯、乙氧化聚丙二醇#700二(甲基)丙烯酸酯、雙苯氧基乙醇茀二甲基丙烯酸酯、季戊四醇三丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、乙氧化三羥甲基丙烷三丙烯酸酯、乙氧化
甘油三丙烯酸酯、乙氧化三聚異氰酸三丙烯酸酯、ε-己內酯改質參-(2-丙烯醯氧基乙基)三聚異氰酸酯、季戊四醇四丙烯酸酯、乙氧化季戊四醇四丙烯酸酯、二-三羥甲基丙烷四丙烯酸酯、二季戊四醇六丙烯酸酯、乙氧化二季戊四醇六丙烯酸酯、二季戊四醇聚丙烯酸酯、聚甘油單環氧乙烷聚丙烯酸酯、聚甘油聚乙二醇聚丙烯酸酯、季戊四醇三丙烯酸酯六亞甲基二異氰酸酯胺基甲酸酯預聚物、季戊四醇三丙烯酸酯甲苯二異氰酸酯胺基甲酸酯預聚物、季戊四醇三丙烯酸酯異佛酮二異氰酸酯胺基甲酸酯預聚物、二季戊四醇五丙烯酸酯六亞甲基二異氰酸酯胺基甲酸酯預聚物。再者,本說明書中(甲基)丙烯酸酯,係指丙烯酸酯化合物與甲基丙烯酸酯化合物兩者。
上述化合物可作為市售品而獲得,其具體例
可列舉Light Ester M、同E、同NB、同IB、同TB、同EH、同ID、同L、同S、同BC、同130MA、同041MA、同CH、同THF(1000)、同BZ、同PO、同IB-X、同HO-225(N)、同HOP(N)、同HOA(N)、同HOP-A(N)、同HOB(N)、同DM、同DE、同A、同HOMS(N)、同HO-HH(N)、同HO-MPP(N)、同G、同P-1M、同G-101P、同G-201P、同EG、UA-306H、UA-306T、UA-306I、UA-510H(以上,共榮社化學股份有限公司製)、NK ESTER AM-30G、同AM-90G、同AM-130G、同AM-230G、同M-20G、同M-40G、同M-90G、同TM230G、同AMP-10G、同AMP-20GY、同AMP-
60G、同PHE-1G、同A-LEN-10、同401P、同S1800A、同A-SA、同SA、701A、同701、同ABE300、同A-BPE-4、同A-BPE-6、同A-BPE-10、同A-BPE-20、同A-BPE-30、同BPE-80N、同BPE-100N、同BPE-200、同BPE-500、同BPE-900、BPE-1300N、同A-DCP、同DCP、同A-200、同A-400、同A-600、同A-1000、同1G、同2G、同3G、同4G、同9G、同14G、同23G、同A-PTMG65、同APG-100、同APG-200、同APG-400、同APG-700、同3PG、同9PG、同A-DOG、同A-HD-N、同HD-N、同A-NOD-N、同NOD-N、同A-DOD、同DOD-N、同A-TMM-3LMN、同A-TMPT、同TMPT、同A-TMPT-3EO、同A-GLY-3E、同A-GLY-9E、同A-GLY-20E、同A-9300、同A-9300-1CL、同A-9300-6CL、同A-TMMT、同ATM-4E、同ATM-35E、同AD-TMP、同A-DPH、同A-DPH-12E、同A-9550、同A-9530、同ADP-51EH、同ATM-31EH、NK Economer A-1000PER、同A-PG5009E、同A-PG5027E、同A-PG5054E、UA-W2A、UA-W2、UA-7000、UA-7100、UA-7200、U-108A、UA-2235-PEUA-4200、U-2PPA、U-6HA、UA-32P、U-324A(以上,新中村化學工業股份有限公司製)、KAYARAD(註冊商標)NPGDA、同R-712、同R-604、同R-684、同T-1420、同D-330、同D-310、同DPCA-20、同DPCA-30、同DPCA-60、同DPCA-120、同GPO-303、同TMPTA、同THE-330、同TPA-320、同TPA-330、同
PET-30、同RP-1040、同DPHA、同DPHA-2C、同DN-0075、同DN-2475、同DPEA-12(以上,日本化藥股份有限公司製)、FANCRYL(註冊商標)FA-P240A、同FA-P270A、同FA-023M(以上,日立化成工業股份有限公司製)、OGSOL(註冊商標)EA-0200(大阪Gas Chemical股份有限公司製)。
作為光聚合起始劑,只要會吸收光硬化時使用之光源者,則無特殊限定,可列舉例如tert-丁基過氧基-iso-丁酸酯、2,5-二甲基-2,5-雙(苄醯基二氧基)己烷、1,4-雙〔α-(tert-丁基二氧基)-iso-丙氧基〕苯、二-tert-丁基過氧化物、2,5-二甲基-2,5-雙(tert-丁基二氧基)己烯氫過氧化物、α-(iso-丙基苯基)-iso-丙基氫過氧化物、tert-丁基氫過氧化物、1,1-雙(tert-丁基二氧基)-3,3,5-三甲基環己烷、丁基-4,4-雙(tert-丁基二氧基)戊酸酯、環己酮過氧化物、2,2’,5,5’-四(tert-丁基過氧基羰基)二苯甲酮、3,3’,4,4’-四(tert-丁基過氧基羰基)二苯甲酮、3,3’,4,4’-四(tert-戊基過氧基羰基)二苯甲酮、3,3’,4,4’-四(tert-己基過氧基羰基)二苯甲酮、3,3’-雙(tert-丁基過氧基羰基)-4,4’-二羧基二苯甲酮、tert-丁基過氧基苯甲酸酯、二-tert-丁基二過氧基間苯二甲酸酯等之有機過氧化物;9,10-蒽醌、1-氯蒽醌、2-氯蒽醌、八甲基蒽醌、1,2-苯并蒽醌等之醌類;甲基苯偶姻、苯偶姻乙基醚、α-
甲基苯偶姻、α-苯基苯偶姻等之苯偶姻衍生物;2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥基-環己基-苯基-酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮、1-〔4-(2-羥基乙氧基)-苯基〕-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-〔4-{4-(2-羥基-2-甲基-丙醯基)苄基}-苯基〕-2-甲基-丙烷-1-酮、苯基乙醛酸甲酯、2-甲基-1-〔4-(甲基硫)苯基〕-2-嗎啉丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉苯基)-丁酮-1、2-二甲基胺基-2-(4-甲基-苄基)-1-(4-嗎啉-4-基-苯基)-丁烷-1-酮等之烷基苯甲酮(alkylphenone)系化合物;雙(2,4,6-三甲基苄醯基)-苯基膦氧化物、2,4,6-三甲基苄醯基-二苯基-膦氧化物等之醯基膦氧化物系化合物;1,2-辛二酮、1-〔4-(苯基硫)-,2-(O-苄醯基肟)〕、乙酮、1-〔9-乙基-6-(2-甲基苄醯基)-9H-咔唑-3-基〕-,1-(O-乙醯基肟)等之肟酯系化合物。
上述化合物可作為市售品而獲得,其具體例
可列舉IRGACURE(註冊商標)651、同184、同500、同2959、同127、同754、同907、同369、同379、同379EG、同819、同819DW、同1800、同1870、同784、同OXE01、同OXE02、同250、Darocur(註冊商標)1173、同MBF、同4265、Lucirin(註冊商標)TPO(以上,BASF Japan股份有限公司製)、KAYACURE(註冊商標)DETX、同MBP、同DMBI、同EPA、同OA(以上,日本化藥股份有限公司製)、VICURE-10、同55(以上,STAUFFER Co.LTD製)、ESACURE(註冊商標)
KIP150、同TZT、同1001、同KTO46、同KB1、同KL200、同KS300、同EB3、Triazine-PMS、Triazine A、Triazine B(以上,日本SIBER HEGNER股份有限公司製)、Adeka Optomer N-1717、同N-1414、同N-1606(ADEKA股份有限公司製)。
上述光聚合起始劑可單獨或組合2種以上使用。
聚矽氧化合物係對使樹脂膜由模具剝離時所測量的脫模力降低作出貢獻。係表示於分子內具有聚矽氧骨架(矽氧烷骨架)之化合物,較佳為具有二甲基聚矽氧骨架者、特佳為以前述式(1)或式(2)表示之化合物。
上述化合物可作為市售品而獲得,其具體例
可列舉BYK-302、BYK-307、BYK-322、BYK-323、BYK-330、BYK-333、BYK-370、BYK-375、BYK-378、BYK-UV 3500、BYK-UV 3570(以上,BYK Japan股份有限公司製)、X-22-164、X-22-164AS、X-22-164A、X-22-164B、X-22-164C、X-22-164E、X-22-163、X-22-169AS、X-22-174DX、X-22-2426、X-22-9002、X-22-2475、X-22-4952、KF-643、X-22-343、X-22-2404、X-22-2046、X-22-1602(以上,信越化學工業股份有限公司製)。
上述具有聚矽氧骨架之化合物可單獨或組合2
種以上使用。
用以形成本發明之構造體的壓印材料,亦可添加界面活性劑。界面活性劑係扮演調整所得塗膜之製膜性的角色。
上述界面活性劑可列舉例如聚氧乙烯月桂基醚、聚氧乙烯硬脂基醚、聚氧乙烯鯨蠟基醚、聚氧乙烯油基醚等之聚氧乙烯烷基醚類;聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚等之聚氧乙烯烷基芳基醚類;聚氧乙烯.聚氧丙烯嵌段共聚物類;山梨醇酐單月桂酸酯、山梨醇酐單棕櫚酸酯、山梨醇酐單硬脂酸酯、山梨醇酐單油酸酯、山梨醇酐三油酸酯、山梨醇酐三硬脂酸酯等之山梨醇酐脂肪酸酯類;聚氧乙烯山梨醇酐單月桂酸酯、聚氧乙烯山梨醇酐單棕櫚酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐三油酸酯、聚氧乙烯山梨醇酐三硬脂酸酯等之聚氧乙烯山梨醇酐脂肪酸酯類等之非離子系界面活性劑;商品名Eftop(註冊商標)EF301、同EF303、同EF352(三菱材料電子化成股份有限公司(舊Jemco股份有限公司製))、商品名Megaface(註冊商標)F171、同F553、同F554、同F477、同F173、同R-08、同R-30(DIC股份有限公司製)、Fluorad FC430、同FC431(住友3M股份有限公司製)、商品名Asahiguard(註冊商標)AG710、Surflon(註冊商標)S-382、同SC101、同
SC102、同SC103、同SC104、同SC105、同SC106(旭硝子股份有限公司製)等之氟系界面活性劑;及有機矽氧烷聚合物KP341(信越化學工業股份有限公司製)。
上述界面活性劑可單獨或組合2種以上使
用。使用界面活性劑時,相對於上述1分子中具有1個至10個聚合性基之化合物,其比例較佳為0.01phr至40phr、更佳為0.01phr至10phr。
用以形成本發明之構造體的壓印材料亦可含有溶劑。溶劑係發揮調整所得之構造體的膜厚之角色。
上述溶劑可列舉例如甲苯、p-二甲苯、o-二甲
苯、苯乙烯、乙二醇二甲基醚、丙二醇單甲基醚、乙二醇單甲基醚、丙二醇單乙基醚、乙二醇單乙基醚、乙二醇單異丙基醚、乙二醇甲基醚乙酸酯、丙二醇單甲基醚乙酸酯、乙二醇乙基醚乙酸酯、二乙二醇二甲基醚、丙二醇單丁基醚、乙二醇單丁基醚、二乙二醇二乙基醚、二丙二醇單甲基醚、二乙二醇單甲基醚、二丙二醇單乙基醚、二乙二醇單乙基醚、三乙二醇二甲基醚、二乙二醇單乙基醚乙酸酯、二乙二醇、1-辛醇、乙二醇、己二醇、二丙酮醇、糠醇、四氫糠醇、丙二醇、苄基醇、1,3-丁二醇、1,4-丁二醇、2,3-丁二醇、γ-丁內酯、丙酮、甲基乙基酮、甲基異丙基酮、二乙基酮、甲基異丁基酮、甲基n-丁基酮、環己酮、2-庚酮、乙酸乙基、乙酸異丙基、乙酸n-丙基、乙
酸異丁基、乙酸n-丁基、乳酸乙基、甲醇、乙醇、異丙醇、tert-丁醇、烯丙醇、n-丙醇、2-甲基-2-丁醇、異丁醇、n-丁醇、2-甲基-1-丁醇、1-戊醇、2-甲基-1-戊醇、2-乙基己醇、三亞甲二醇、1-甲氧基-2-丁醇、異丙基醚、1,4-二噁烷、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、1,3-二甲基-2-咪唑啉酮、二甲基亞碸、N-環己基-2-吡咯啶,只要係可調節用以形成本發明之構造體的壓印材料之黏度者,則無特殊限定。
用以形成本發明之構造體的壓印材料,只要不損及本發明之效果,亦可依需要含有環氧化合物、光酸產生劑、光敏感劑、紫外線吸收劑、抗氧化劑、密合輔助劑或脫模性提高劑。
上述環氧化合物可列舉例如Epolead(註冊商
標)GT-401、同PB3600、Celloxide(註冊商標)2021P、同2000、同3000、EHPE3150、同EHPE3150CE、Cyclomer(註冊商標)M100(以上,Daicel股份有限公司製)、Epiclon(註冊商標)840、同840-S、同N-660、同N-673-80M(以上,DIC股份有限公司製)。
上述光酸產生劑可列舉例如IRGACURE(註
冊商標)PAG103、同PAG108、同PAG121、同PAG203、同CGI725(以上,BASF Japan股份有限公司製)、WPAG-145、WPAG-170、WPAG-199、WPAG-
281、WPAG-336、WPAG-367(以上,和光純藥工業股份有限公司製)、TFE Triazine、TME- Triazine、MP-Triazine、Dimethoxytriazine(二甲氧基三嗪)、TS-91、TS-01(三和化學股份有限公司製)。
上述光敏感劑可列舉例如噻噸系、呫噸系、
酮系、噻喃鎓(thiopyrylium)鹽系、苯乙烯基化合物(basestyryl)系、部花青素系、3-取代香豆素系、3,4-取代香豆素系、花青系、吖啶系、噻嗪系、酚噻嗪系、蒽系、蔻系、苯并蒽系、苝系、香豆素酮系、香豆素系、硼酸鹽/酯系。
上述光敏感劑可單獨或組合2種以上使用。
藉由使用該光敏感劑,亦可調整UV區域之吸收波長。
上述紫外線吸收劑可列舉例如TINUVIN(註
冊商標)PS、同99-2、同109、同328、同384-2、同400、同405、同460、同477、同479、同900、同928、同1130、同111FDL、同123、同144、同152、同292、同5100、同400-DW、同477-DW、同99-DW、同123-DW、同5050、同5060、同5151(以上,BASF Japan股份有限公司)。
上述紫外線吸收劑可單獨或組合2種以上使
用。藉由使用該紫外線吸收劑,光硬化時可控制膜之最表面的硬化速度,可能可提高脫模性。
上述抗氧化劑可列舉例如IRGANOX(註冊商
標)1010、同1035、同1076、同1135、同1520L(以
上,BASF Japan股份有限公司)。
上述抗氧化劑可單獨或組合2種以上使用。藉由使用該抗氧化劑,可防止因氧化,使膜變為黃色。
上述密合輔助劑,可列舉例如3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷。藉由使用該密合輔助劑,與基材之密合性會提高。該密合輔助劑之含量,相對於上述(A)成分之質量或(A)成分及上述(D)成分之總質量,較佳為5phr至50phr、更佳為10phr至50phr。
上述脫模性提高劑,可列舉例如含有氟之化合物。含有氟之化合物,可列舉例如R-5410、R-1420、M-5410、M-1420、E-5444、E-7432、A-1430、A-1630(以上,大金工業股份有限公司製)。
用以形成本發明之構造體的壓印材料之調製方法,並無特殊限定,只要混合1分子中具有1個至10個聚合性基之至少1種化合物及光聚合起始劑、以及任意成分之聚矽氧化合物、界面活性劑及溶劑以及依期望之其他添加劑,使壓印材料成為均勻的狀態即可。
又,混合1分子中具有1個至10個聚合性基之至少1種化合物及光聚合起始劑、聚矽氧化合物、界面活性劑及溶劑、以及依期望之其他添加劑時的順序,只要可得到均勻的壓印材料則無問題,並無特殊限定。該壓印材料之
調製方法,可列舉例如於1分子中具有1個至10個聚合性基之至少1種化合物中,以指定比例混合光聚合起始劑之方法。又,亦可列舉於其中進一步混合聚矽氧化合物、界面活性劑及溶劑,成為均勻的壓印材料之方法。進一步地,可列舉於此調製方法之適當階段,依照需要進一步添加其他添加劑並混合之方法。
具備本發明之構造體的半導體元件、以及於
基材上具備前述構造體之光學構件、固體攝影元件、LED裝置、太陽電池、顯示器及電子裝置亦為本發明之對象。
以下列舉實施例及比較例,進一步詳細說明本發明,但本發明不受該等實施例限定。
於具備攪拌機、溫度計及凝縮器之500ml容的燒瓶中裝入甲苯60.8質量份、硬脂醇(NAA-46;日本油脂股份有限公司製、羥基價:207)8.4質量份,昇溫至40℃。之後確認硬脂醇完全溶解,裝入六亞甲基二異氰酸酯之三聚異氰酸酯改質型(Takenate(註冊商標)D-170N;三井化學股份有限公司製、NCO%:20.9)50質量份,昇溫至70℃。於同溫度反應30分鐘後,裝入月桂酸二丁基錫0.02質量份,於同溫度保持3小時。之後,裝入聚己內酯改質丙烯酸羥基乙酯(Placcel(註冊商標)FA2D;Daicel
股份有限公司製、羥基價:163)83.5質量份、月桂酸二丁基錫0.02質量份、氫醌單甲基醚0.02質量份,於70℃保持3小時使反應結束後,以蒸發器去除甲苯,得到固體成分100質量%之胺基甲酸酯丙烯酸酯(I)。
於與合成例1中所用者同樣的燒瓶中,裝入甲苯48.2質量份、硬脂醇(NAA-46)4.2質量份,昇溫至40℃。之後確認硬脂醇完全溶解,裝入六亞甲基二異氰酸酯之三聚異氰酸酯改質型(Takenate(註冊商標)D-170N)25質量份,昇溫至70℃。於同溫度反應30分鐘後,裝入月桂酸二丁基錫0.02質量份,於同溫度保持3小時。之後,裝入聚己內酯改質丙烯酸羥基乙酯(Placcel(註冊商標)FA5;Daicel股份有限公司製、羥基價:81.8)83.3質量份、月桂酸二丁基錫0.02質量份、氫醌單甲基醚0.02質量份,於70℃保持3小時使反應結束後,以蒸發器去除甲苯,得到固體成分100質量%之胺基甲酸酯丙烯酸酯(II)。
於與合成例1中所用者同樣的燒瓶中,裝入甲苯44.8質量份、硬脂醇(NAA-46)4.6質量份,昇溫至40℃。之後確認硬脂醇完全溶解,裝入苯二甲基二異氰酸酯之三羥甲基丙烷加成物改質型(Takenate(註冊商標)D-110N;
三井化學股份有限公司製、固體成分:75%、NCO%:11.5)50質量份,昇溫至70℃。於同溫度反應30分鐘後,裝入月桂酸二丁基錫0.02質量份,於同溫度保持3小時。之後,裝入聚己內酯改質丙烯酸羥基乙酯(Placcel(註冊商標)FA5)91.7質量份、月桂酸二丁基錫0.02質量份、氫醌單甲基醚0.02質量份,於70℃保持3小時使反應結束後,以蒸發器去除甲苯,得到固體成分100質量%之胺基甲酸酯丙烯酸酯(III)。
於與合成例1中所用者同樣的燒瓶中,裝入甲苯61.3質量份、二十二烷醇(NAA-422;日本油脂股份有限公司製、羥基價:180)9.7質量份,昇溫至40℃。之後確認二十二烷醇完全溶解,裝入六亞甲基二異氰酸酯之三聚異氰酸酯改質型(Takenate(註冊商標)D-170N)50質量份,昇溫至70℃。於同溫度反應30分鐘後,裝入月桂酸二丁基錫0.02質量份,於同溫度保持3小時。之後,裝入聚己內酯改質丙烯酸羥基乙酯(Placcel(註冊商標)FA2D)83.4質量份、月桂酸二丁基錫0.02質量份、氫醌單甲基醚0.02質量份,於70℃保持3小時使反應結束後,以蒸發器去除甲苯,得到固體成分100質量%之胺基甲酸酯丙烯酸酯(IV)。
於合成例1中製作之胺基甲酸酯丙烯酸酯(I)5g中添加Lucirin(註冊商標)TPO(BASF Japan股份有限公司製)(以下略稱為「Lucirin TPO」)0.125g(相對於胺基甲酸酯丙烯酸酯(I)之質量,為2.5phr),調製壓印材料PNI-1。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為合成例2中得到之胺基甲酸酯丙烯酸酯(II)以外,係與調製例1同樣方式調製壓印材料PNI-2。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為合成例3中得到之胺基甲酸酯丙烯酸酯(III)以外,係與調製例1同樣方式調製壓印材料PNI-3。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為合成例4中得到之胺基甲酸酯丙烯酸酯(IV)以外,係與調製例1同樣方式調製壓印材料PNI-4。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為
UA-7100(新中村化學工業股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-5。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為NK Economer A-1000PER(以下略稱為「A-1000PER」)(新中村化學工業股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-6。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為X-22-1602(信越化學工業股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-7。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為FANCRYL(註冊商標)FA-023M(日立化成工業股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-8。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為NK ESTER APG-700(以下略稱為「APG-700」)(新中村化學工業股份有限公司製)以外,係與調製例1同樣方
式調製壓印材料PNI-9。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為NK ESTER ATM-35E(新中村化學工業股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-10。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為NK ESTER A-TMPT-9EO(新中村化學工業股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-11。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為四乙二醇二丙烯酸酯(東京化成工業股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-12。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為KAYARAD(註冊商標)DPEA-12(以下,本說明書中略稱為「DPEA-12」)(日本化藥股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-13。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為NK ESTER A-TMPT-3EO(新中村化學工業股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-14。
除了將調製例1之胺基甲酸酯丙烯酸酯(I)變更為NK ESTER A-DCP(新中村化學工業股份有限公司製)以外,係與調製例1同樣方式調製壓印材料PNI-15。
將NK ESTER AM-90G(以下略稱為「AM-90G」)(新中村化學工業股份有限公司製)2.5g與NK ESTER A-TMPT(以下,本說明書中略稱為「A-TMPT」)(新中村化學工業股份有限公司製)2.5g混合,於該混合物中添加Lucirin TPO0.125g(相對於AM-90G與A-TMPT之總質量,為2.5phr),調製壓印材料PNI-16。
將2.5g之DPEA-12與合成例1中得到之胺基甲酸酯丙烯酸酯(I)2.5g混合,於該混合物中添加Lucirin TPO0.125g(相對於DPEA-12與胺基甲酸酯丙烯酸酯(I)之總質量,為2.5phr),調製壓印材料PNI-17。
除了將調製例17之胺基甲酸酯丙烯酸酯(I)變更為合成例2中得到之胺基甲酸酯丙烯酸酯(II)以外,係與調製例17同樣方式調製壓印材料PNI-18。
除了將調製例17之胺基甲酸酯丙烯酸酯(I)變更為合成例3中得到之胺基甲酸酯丙烯酸酯(III)以外,係與調製例17同樣方式調製壓印材料PNI-19。
除了將調製例17之胺基甲酸酯丙烯酸酯(I)變更為合成例4中得到之胺基甲酸酯丙烯酸酯(IV)以外,係與調製例17同樣方式調製壓印材料PNI-20。
將KAYARAD(註冊商標)DPHA(以下略稱為「DPHA」)2.5g與A-1000PER2.5g混合,於該混合物中添加Lucirin TPO0.125g(相對於DPHA與A1000PER之總質量,為2.5phr),調製壓印材料PNI-21。
將DPHA2.75g與A-1000PER2.25g混合,於該混合物
中添加Lucirin TPO0.125g(相對於DPHA與A1000PER之總質量,為2.5phr),調製壓印材料PNI-22。
將DPHA3.0g與A-1000PER2.0g混合,於該混合物中添加Lucirin TPO0.125g(相對於DPHA與A1000PER之總質量,為2.5phr),調製壓印材料PNI-23。
將DPHA0.25g、UA-306H(共榮社化學股份有限公司製)1.75g、A-1000PER3.0g混合,於該混合物中添加Lucirin TPO0.125g(相對於DPHA、UA-306H、A1000PER之總質量,為2.5phr),調製壓印材料PNI-24。
將0.5g之DPEA-12、A-TMPT2.0g、A-1000PER2.5g混合,於該混合物中添加Lucirin TPO0.125g(相對於DPEA-12、A-TMPT、A1000PER之總質量,為2.5phr),調製壓印材料PNI-25。
將0.5g之DPEA-12、UA-306H2.0g、A-1000PER2.5g、BYK-333(BYK Japan股份有限公司製)0.05g(相對於DPEA-12、UA-306H、A1000PER之總質量,為1phr)混
合,於該混合物中添加Lucirin TPO0.125g(相對於DPEA-12、UA-306H、A1000PER之總質量,為2.5phr),調製壓印材料PNI-26。
將0.5g之DPEA-12、UA-306H2.0g、2.5g之APG-700混合,於該混合物中添加Lucirin TPO0.125g(相對於DPEA-12、UA-306H、APG-700之總質量,為2.5phr),調製壓印材料PNI-27。
將0.5g之DPEA-12、DPHA2.0g、A-1000PER2.5g混合,於該混合物中添加Lucirin TPO0.125g(相對於DPEA-12、DPHA、A-1000PER之總質量,為2.5phr),調製壓印材料PNI-28。
將NK ESTER A1000(以下略稱為「A1000」)(新中村化學工業股份有限公司製)5g、Lucirin TPO 0.125g(相對於A1000之質量,為2.5phr)、甲基乙基酮(以下略稱為「MEK」)5.125g混合,調製壓印材料PNI-29。
將UA-306H1.75g、3.25g之X-22-1602、Lucirin
TPO0.125g(相對於UA-306H、X-22-1602之總質量,為2.5phr)、MEK5.125g混合,調製壓印材料PNI-30。
將UA-306H2.0g、3.0g之X-22-1602、Lucirin TPO 0.125g(相對於UA-306H、X-22-1602之總質量,為2.5phr)、MEK5.125g混合,調製壓印材料PNI-31。
將UA-306H2.25g、2.75g之X-22-1602、Megaface(註冊商標)F477(DIC股份有限公司製)0.0025g(相對於UA-306H、X-22-1602之總質量,為0.05phr)、Lucirin TPO 0.125g(相對於UA-306H、X-22-1602之總質量,為2.5phr)、MEK5.125g混合,調製壓印材料PNI-32。
將A-TMPT5g、Lucirin TPO 0.125g(相對於A-TMPT之質量,為2.5phr)混合,調製壓印材料PNI-33。
將KAYARAD PET30(以下略稱為「PET30」)(日本化藥股份有限公司製)5g、Lucirin TPO0.125g(相對於PET30之質量,為2.5phr)混合,調製壓印材料PNI-34。
將UA-510(共榮社化學股份有限公司製)5g、Lucirin TPO0.125g(相對於UA-510之質量,為2.5phr)混合,調製壓印材料PNI-35。
將DPHA3.25g、A-1000PER1.75g、Lucirin TPO0.125g(相對於DPHA、A-1000PER之總質量,為2.5phr)混合,調製壓印材料PNI-36。
將DPHA3.5g、A-1000PER1.5g、Lucirin TPO0.125g(相對於DPHA、A-1000PER之總質量,為2.5phr)混合,調製壓印材料PNI-37。
將鎳製之週期250nm、高度250nm之蛾眼圖型模具(INOX股份有限公司製)及矽晶圓,浸漬於將OPTOOL(註冊商標)DSX(大金工業股份有限公司製)以Novec(註冊商標)HFE-7100(氫氟醚、住友3M股份有限公司)(以下,本說明書中略稱為「NovecHFE-7100」)稀釋為0.1質量%之溶液,使用溫度90℃、濕度90RH%之高溫高濕裝置處理1小時,以NovecHFE-7100潤洗後,以
空氣乾燥。
將調製例1至調製例37所得之各壓印材料,於厚度80μm之三乙醯基纖維素薄膜(使用富士軟片股份有限公司製FUJITAC(註冊商標))(以下略稱為「TAC薄膜」)上使用棒塗佈器(全自動薄膜塗抹器KT-AB3120COTEC股份有限公司製)塗佈,將該TAC薄膜上之塗膜以輥壓接於經施以前述脫模處理的蛾眼圖型模具。接著對前述塗膜以無電極均勻照射裝置(QRE-4016A、ORC製作所股份有限公司製)由TAC薄膜側施以350mJ/cm2之曝光,進行光硬化。接著參考JIS Z0237進行90°剝離試驗,測定與模具之具有凹凸形狀的面接著的TAC薄膜上所形成之硬化膜由模具之具有凹凸形狀的面完全剝離時的荷重。接著算出薄膜之每1cm寬度的荷重,作為脫模力(g/cm)。結果如表1及表2所示。
於上述脫模力試驗後,於TAC薄膜上得到作為凹凸形狀之經轉印有蛾眼圖型的構造體。對於該TAC薄膜,以超級噴漆器(Asahipen股份有限公司製),將與得到轉印有蛾眼圖型之構造體的面相反之面塗裝為黑色。然後,於TAC薄膜上所得之構造體的蛾眼圖型上附著人工指紋液(TDK股份有限公司製),於大榮精機(有)製試驗機
安裝BEMCOT(註冊商標)M-1(旭化成纖維股份有限公司製),以570g/cm2荷重進行50次來回的指紋擦拭試驗,以目視確認指紋之擦拭性。該試驗中進行的擦拭為乾拭。擦拭試驗後,將指紋可擦拭掉的情況評估為○、指紋無法擦拭掉,亦即殘存有指紋的情況評估為×,結果如表1及表2所示。
將調製例1至調製例37中所得之各壓印材料,使用棒塗佈器(全自動薄膜塗抹器KT-AB3120 COTEC股份有限公司製)塗佈於石英基板上,將該石英基板上之塗膜以輥壓接於經施以前述脫模處理的矽晶圓。接著,對前述塗膜,以無電極均勻照射裝置(QRE-4016A,ORC製作所股份有限公司製),由石英基板側施以350mJ/cm2之曝光,進行光硬化。然後由前述石英基板剝離矽晶圓,對所得之硬化膜進行馬氏硬度測定。測定裝置係使用超微小壓入硬度試驗機ENT-2100(Elionix股份有限公司製),壓頭係使用稜間角115°之鈦製三角壓頭(東京金剛石工具製作所股份有限公司製),以熔融石英之馬氏硬度為4100N/mm2之條件來測定。所得結果如表1及表2所示。
由表1及表2結果可知,使用壓印材料PNI-1
至PNI-32所製作之實施例1至實施例32的構造體,均能夠進行指紋的乾拭。另一方面,使用壓印材料PNI-33至PNI-37所製作之比較例1至比較例5的構造體,指紋擦拭試驗後均殘存有指紋,無法進行乾拭。
本發明之構造體,可將附著於凹凸形狀之表
面的指紋乾拭,故可適合使用於例如顯示器、太陽電池、LED裝置之表面。
Claims (17)
- 一種具有凹凸形狀之表面的構造體,其係由含有1分子中具有1個至10個聚合性基之至少1種化合物及光聚合起始劑的組成物所製作,且以熔融石英之馬氏硬度為4100N/mm2之條件測定時的馬氏硬度為8N/mm2以上,130N/mm2以下。
- 如請求項1之構造體,其中前述聚合性基係為由丙烯醯氧基、甲基丙烯醯氧基、乙烯基及烯丙基所構成群組中選出之至少1種基。
- 如請求項1之構造體,其中前述組成物進一步含有聚矽氧化合物。
- 如請求項3之構造體,其中前述聚矽氧化合物係為以下述式(1)或式(2)表示之化合物,
- 如請求項1之構造體,其中前述凹凸形狀為蛾眼構造。
- 一種如請求項1至請求項5中任一項之構造體之製造方法,其係將含有1分子中具有1個至10個聚合性基之至少1種化合物及光聚合起始劑的組成物塗佈於基材上後,將前述基材上之塗膜壓接於模具之具有凹凸形狀的面,在前述壓接之狀態下使前述塗膜光硬化而成為硬化膜,將前述基材上之硬化膜由前述模具剝離。
- 如請求項6之構造體之製造方法,其中前述組成物進一步含有界面活性劑。
- 如請求項6之構造體之製造方法,其係包含將進一步含有溶劑之前述組成物塗佈於前述基材上後,藉由烘烤使前述溶劑揮發之步驟。
- 如請求項6之構造體之製造方法,其中使用薄膜作為前述基材,於將前述薄膜上之硬化膜由前述模具90°剝離的試驗中,將使前述薄膜上之硬化膜由前述模具剝離時的荷重換算為前述薄膜之每1cm寬度之值的脫模力為大於0g/cm、0.7g/cm以下。
- 一種光學構件,其係於基材上具備如請求項1至請求項5中任一項之構造體。
- 一種固體攝影裝置,其係於基材上具備如請求項1至請求項5中任一項之構造體。
- 一種LED裝置,其係於基材上具備如請求項1至請求項5中任一項之構造體。
- 一種半導體元件,其係具備如請求項1至請求項5中任一項之構造體。
- 一種太陽電池,其係於基材上具備如請求項1至請求項5中任一項之構造體。
- 一種顯示器,其係於基材上具備如請求項1至請求項5中任一項之構造體。
- 一種電子裝置,其係於基材上具備如請求項1至請求項5中任一項之構造體。
- 如請求項1之構造體,其中前述組成物進一步含有界面活性劑。
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US10907019B2 (en) * | 2015-06-23 | 2021-02-02 | Sharp Kabushiki Kaisha | Synthetic polymer film provided with surface having sterilizing activity |
CN105826471B (zh) * | 2016-03-24 | 2018-02-27 | 吉林大学 | 一种双仿生陷光兼具等离子体表面共振效应的聚合物太阳能电池及其制备方法 |
CN109790305A (zh) * | 2016-09-14 | 2019-05-21 | 夏普株式会社 | 具有具备杀菌作用的表面的合成高分子膜及其制造方法 |
JP6581159B2 (ja) * | 2017-09-14 | 2019-09-25 | シャープ株式会社 | 殺菌作用を備えた表面を有する合成高分子膜を備えるプラスチック製品の製造方法 |
JP6751731B2 (ja) * | 2018-02-21 | 2020-09-09 | シャープ株式会社 | 合成高分子膜および合成高分子膜の製造方法 |
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JP6948369B2 (ja) * | 2018-11-06 | 2021-10-13 | 学校法人東京理科大学 | モスアイ転写型及びモスアイ転写型の製造方法 |
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