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TW202214799A - 端部受保護之覆金屬積層板、印刷配線基板之製造方法、及印刷配線基板用中間體之製造方法 - Google Patents

端部受保護之覆金屬積層板、印刷配線基板之製造方法、及印刷配線基板用中間體之製造方法 Download PDF

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Publication number
TW202214799A
TW202214799A TW110132823A TW110132823A TW202214799A TW 202214799 A TW202214799 A TW 202214799A TW 110132823 A TW110132823 A TW 110132823A TW 110132823 A TW110132823 A TW 110132823A TW 202214799 A TW202214799 A TW 202214799A
Authority
TW
Taiwan
Prior art keywords
metal
clad laminate
adhesive layer
protected
mentioned
Prior art date
Application number
TW110132823A
Other languages
English (en)
Chinese (zh)
Inventor
內田徳之
渡邊良一
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202214799A publication Critical patent/TW202214799A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW110132823A 2020-09-03 2021-09-03 端部受保護之覆金屬積層板、印刷配線基板之製造方法、及印刷配線基板用中間體之製造方法 TW202214799A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-148505 2020-09-03
JP2020148505 2020-09-03

Publications (1)

Publication Number Publication Date
TW202214799A true TW202214799A (zh) 2022-04-16

Family

ID=80492226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110132823A TW202214799A (zh) 2020-09-03 2021-09-03 端部受保護之覆金屬積層板、印刷配線基板之製造方法、及印刷配線基板用中間體之製造方法

Country Status (5)

Country Link
JP (1) JPWO2022050360A1 (fr)
KR (1) KR20230058589A (fr)
CN (1) CN115868254A (fr)
TW (1) TW202214799A (fr)
WO (1) WO2022050360A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023136171A1 (fr) * 2022-01-13 2023-07-20 積水化学工業株式会社 Ruban adhésif simple face

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283832A (ja) * 1992-03-30 1993-10-29 Hitachi Chem Co Ltd 端面保護膜を含む金属ベース基板及びその製造方法
JP3001485B2 (ja) * 1997-11-20 2000-01-24 富山日本電気株式会社 多層プリント配線板の製造方法
JP2000234081A (ja) * 1998-12-14 2000-08-29 Toyo Ink Mfg Co Ltd 接着シート及び該シートの製造方法並びに該シートの利用
JP2005197443A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd プリント配線板の製造方法
JPWO2006038547A1 (ja) * 2004-10-01 2008-05-15 東洋インキ製造株式会社 活性エネルギー線粘着力消失型感圧接着剤、それを塗布した活性エネルギー線粘着力消失型粘着シート、及びエッチング化金属体の製造方法
JP2009239215A (ja) * 2008-03-28 2009-10-15 Kyocer Slc Technologies Corp 銅張積層板およびこれを用いた配線基板の製造方法ならびに銅張積層板の端面処理方法およびこれに用いる端面処理装置
JP5163292B2 (ja) * 2008-06-02 2013-03-13 日立電線株式会社 プリント配線板用金属張基板およびプリント配線板ならびにその製造方法
JP5995314B2 (ja) * 2012-03-16 2016-09-21 日東電工株式会社 粘着剤組成物および粘着シート
JP2015021067A (ja) 2013-07-19 2015-02-02 Dic株式会社 熱伝導性粘着テープ、物品及び画像表示装置
JP6100654B2 (ja) 2013-09-06 2017-03-22 帝人株式会社 耐熱性粘着テープ用基材及びそれからなる耐熱性粘着テープ
JP6367598B2 (ja) 2013-11-22 2018-08-01 日東電工株式会社 両面粘着シート
JP6852404B2 (ja) * 2017-01-06 2021-03-31 大日本印刷株式会社 インターポーザー及びその製造方法、並びに、インターポーザーを備える半導体装置

Also Published As

Publication number Publication date
JPWO2022050360A1 (fr) 2022-03-10
KR20230058589A (ko) 2023-05-03
WO2022050360A1 (fr) 2022-03-10
CN115868254A (zh) 2023-03-28

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