KR101391704B1 - Handler for semiconductor package, and operating method thereof - Google Patents

Abstract

Disclosed are a semiconductor package handler and an operation method thereof. The semiconductor package handler according to an embodiment of the present invention comprises a dry block in which semiconductor packages are mounted; a first alignment table with a first loading unit alternately arranging first loading grooves in which the semiconductor packages are loaded and first non-loading regions in which the semiconductor packages are not loaded and a second loading unit alternately arranging, in an opposite pattern, second loading grooves in which the semiconductor packages are loaded and second non-loading regions in which the semiconductor packages are not loaded; and an alignment table picker which alternately picks up the semiconductor packages mounted on the dry block and successively transfers the semiconductor packages to the first loading grooves and second loading grooves of the alignment table several times.

Description

TECHNICAL FIELD [0001] The present invention relates to a semiconductor package handler and a semiconductor package handler,

The present invention relates to a semiconductor package handler capable of performing cleaning, drying, inspection, sorting, and the like of an individual semiconductor package and a method of operating the semiconductor package handler.

A semiconductor package includes a process of attaching a plurality of semiconductor chips on a substrate, a process of electrically connecting the chip and the substrate, a process of molding the substrate into resin resin, Followed by sawing. In addition, the semiconductor package cut into individual units is subjected to a cleaning process for removing foreign substances, a drying process for cleaning and drying, an inspection process for inspecting defects after drying, and a sorting process for loading and unloading according to the results after inspection do.

The semiconductor package handler is a device capable of collectively performing a cutting process, a cleaning process, a drying process, an inspection process, a sorting process, and the like, or selectively performing a part of processes in the semiconductor package manufacturing processes. Korean Patent Registration No. 10-0574584 (published on Apr. 27, 2006) discloses an example of such a semiconductor package handler.

Patent Document 1: Korean Patent Publication No. 10-0574584 (2006. 04. 27. Announcement)

SUMMARY OF THE INVENTION The present invention provides a semiconductor package handler and a method of operating the semiconductor package that can realize reliable transfer and loading of semiconductor packages to increase process reliability.

Another object of the present invention is to provide a semiconductor package handler and a method of operating the semiconductor package that can increase the drying effect by alternately stacking the semiconductor packages in a drying process.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a drying block on which semiconductor packages are mounted; A semiconductor package comprising: a first stacking portion in which first loading grooves on which semiconductor packages are stacked and first non-stacking regions that are not stacked are alternately arranged; second stacking grooves on which semiconductor packages are stacked; An aligning table having a second stacking portion arranged alternately in a pattern opposite to the first stacking portion; And an alignment table picker for alternately picking up the semiconductor packages mounted on the drying block and sequentially transferring the first and second loading grooves of the alignment table in succession over a plurality of times, .

Wherein the alignment table picker comprises first and second adsorption holes arranged alternately with each other, a first pneumatic line communicated with the first adsorption holes, and a second pneumatic line communicated with the second adsorption holes, One pneumatic line and a second pneumatic line separated.

Wherein the alignment table picker comprises: an adsorption pad on which the first adsorption holes and the second adsorption holes are formed; A pad supporting member supporting the adsorption pad and having first and second through holes communicating with the first and second adsorption holes; Zigzag first distribution grooves for supporting the pad supporting member and communicating the first pneumatic line with the first adsorption bores and zigzag second distribution grooves communicating the second pneumatic line and the second adsorption bores, And the like.

Wherein the drying block comprises first dry adsorption holes and second dry adsorption holes arranged inter-alternately on an upper surface, a first drying side pneumatic line in communication with the first dry adsorption holes, And a second dry side pneumatic line communicated with the balls and separated from the first dry side pneumatic line.

Wherein the semiconductor package handler further comprises a unit picker for picking up the separated semiconductor packages and moving the separated semiconductor packages to the drying block, wherein the unit picker comprises first unit adsorption holes and second unit adsorption holes arranged inter- A first unit side pneumatic line communicating with the first unit adsorption holes and a second unit side pneumatic line communicating with the second unit adsorbing holes and separated from the first unit side pneumatic line .

According to another aspect of the present invention, there is provided a semiconductor device comprising: a drying block on which semiconductor packages are mounted; A first alignment table having first loading grooves on which semiconductor packages are loaded and first loading portions on which first non-loading regions that are not loaded are alternately arranged; A second alignment table having second loading grooves on which the semiconductor packages are loaded and second unloading areas that are not loaded on the second loading tables, wherein the second loading grooves are alternately arranged in an opposite pattern to the first loading portions; And an alignment table picker for alternately picking up the semiconductor packages mounted on the drying block and sequentially transferring the first stacking grooves of the first alignment table and the second stacking grooves of the second alignment table in succession A semiconductor package handler may be provided.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a first transferring step of alternately picking up some of semiconductor packages seated on the drying block using the alignment table picker and transferring the semiconductor packages to the first loading grooves; And a second transfer process of picking up the remaining semiconductor packages mounted on the drying block after the first transfer process with the alignment table picker and transferring the semiconductor packages to the second loading grooves may be provided .

According to another aspect of the present invention, semiconductor packages loaded on the first dry suction holes of the drying block are picked up by the alignment table picker and transferred to the first loading grooves, A first transfer step of releasing the attraction force of the adsorption holes and maintaining the adsorption force of the second dry adsorption holes; The semiconductor packages loaded on the second dry adsorption holes of the drying block after the first transfer process are picked up by the alignment table picker and transferred to the second loading grooves, A method of operating a semiconductor package handler including a secondary transfer process for releasing attraction force can be provided.

According to still another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a primary seating step of placing a semiconductor package adsorbed on the first unit adsorption holes of the semiconductor packages transferred by the unit picker onto the drying block; A primary drying step of drying the semiconductor packages seated on the drying block by the primary seating process; A secondary settling process in which the semiconductor package adsorbed on the second unit adsorption holes of the unit picker after the primary drying process is further placed on the drying block; And a secondary drying step of drying the semiconductor packages that are seated on the drying block by the primary and secondary seating processes together.

Wherein the first unit adsorption process releases the adsorption forces of the first unit adsorption holes of the unit picker and the second dry adsorption holes of the drying block and the second unit adsorption holes of the unit picker and the second adsorption holes of the drying block Adsorption forces can be imparted to the first dry adsorption holes.

The adsorption force of the first and second unit adsorption holes of the unit picker can be released and the adsorption force can be given to the first and second dry adsorption holes of the drying block in the secondary adsorption process.

According to another aspect of the present invention, there is provided a semiconductor device, comprising: a loading section for accommodating a semiconductor strip; A cutting portion for cutting the semiconductor strip transferred from the loading portion into individual semiconductor packages; A cleaning unit cleaning the semiconductor packages cut at the cut portion; A first drying adsorption hole and a second drying adsorption hole arranged mutually interchangeably on the upper surface and a second drying adsorption hole communicating with the first drying adsorption holes, A drying unit having a pneumatic line and a second drying side pneumatic line communicated with the second dry adsorption holes and separated from the first drying side pneumatic line; An inspection unit for inspecting whether the dried semiconductor packages are defective or not; Wherein the first and second stacking portions are alternately arranged in a stacking manner on a top surface of the first stacking portion and the second stacking portion, the stacking grooves on which the semiconductor packages are stacked, and the non-stacking regions on which the semiconductor packages are not stacked, Wherein the stacking grooves and the non-stacking areas of the first stacking part and the second stacking part are arranged at mutually opposite positions; An aligning part picker alternately picking up the semiconductor packages seated on the drying part and sequentially feeding the first and second stacking parts of the aligning part to the stacking grooves twice in succession; And an unloading unit for sorting and loading the semiconductor packages according to the inspection result.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: cutting a semiconductor strip into individual semiconductor packages; Cleaning the severed semiconductor packages; A first drying side pneumatic line communicating with the first dry adsorption holes and a second drying side pneumatic line communicating with the first dry adsorption holes, Drying on a drying section in communication with the adsorption holes and having a second drying side pneumatic line separated from the first drying side pneumatic line; A first transfer step of picking up the semiconductor packages loaded on the first dry adsorption holes on the drying unit with an alignment table picker and transferring the semiconductor packages to a first loading groove of the alignment table; A second transfer step of picking up the remaining semiconductor packages loaded on the drying section by the alignment table picker and transferring the semiconductor packages to the second loading groove of the alignment table after the first transfer step; Inspecting whether or not the semiconductor packages on the alignment table are defective; And loading the semiconductor packages onto a tray according to the result of the inspection.

The semiconductor package handler according to the embodiment of the present invention is characterized in that the alignment table picker alternately picks up the semiconductor packages of the drying block and feeds them to the first loading groove and the second loading groove of the alignment table a plurality of times, The semiconductor packages to be transferred can be lowered into the first loading groove or the second loading groove deeply. Therefore, it is possible to realize stable and accurate loading, thereby enhancing the reliability of subsequent processes.

In addition, since the semiconductor package handler according to the embodiment of the present invention can maintain the state that the semiconductor packages remaining in the drying block are adsorbed on the drying block in the process of alternately picking up the semiconductor packages from the drying block, It is possible to prevent the semiconductor packages from being disturbed. Therefore, accurate pickup can be realized in the process of transferring the remaining semiconductor packages.

In addition, since the semiconductor package handler according to the present embodiment performs drying a plurality of times while alternately stacking the semiconductor packages on the drying block at a predetermined interval in the drying process, the drying effect of the semiconductor packages can be enhanced.

1 is a plan view showing a schematic structure of a semiconductor package handler according to an embodiment of the present invention.
2 is a cross-sectional view showing the structure of a unit picker and a drying block of a semiconductor package handler according to an embodiment of the present invention.
3 is an exploded perspective view of a unit picker of a semiconductor package handler according to an embodiment of the present invention.
4 is an exploded perspective view of a drying block of a semiconductor package handler according to an embodiment of the present invention.
5 is a plan view showing first and second distribution grooves formed in a picker base portion of a unit picker in a semiconductor package handler according to an embodiment of the present invention.
6 to 11 are perspective views illustrating steps of sequentially stacking semiconductor packages from a unit picker of a semiconductor package handler according to an embodiment of the present invention to a drying block and a drying process performed in the loading process.
12 is a perspective view showing the arrangement and arrangement of the drying block, alignment table picker, and alignment table of the semiconductor package handler according to the embodiment of the present invention.
FIG. 13 is a cross-sectional view showing a configuration of a first loading section and a second loading section of an alignment table picker and an alignment table of a semiconductor package handler according to an embodiment of the present invention.
FIGS. 14 and 15 are perspective views showing a step of a first transfer process for transferring semiconductor packages from a drying block of a semiconductor package handler according to an embodiment of the present invention to a first loading section of an alignment table.
16 is a cross-sectional view illustrating a process of lowering the semiconductor packages picked up by the alignment table picker of the semiconductor package handler to the first loading groove of the alignment table according to the embodiment of the present invention.
17 and 18 are perspective views showing a step of a secondary transfer process for transferring semiconductor packages from a drying block of a semiconductor package handler according to an embodiment of the present invention to a second stacking portion of the alignment table.
19 is a perspective view showing a first alignment table and a second alignment table of a semiconductor package handler according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. The present invention is not limited to the embodiments shown, but may be embodied in other forms. In order to clarify the present invention, the drawings may omit the parts of the drawings that are not related to the description, and the size of the elements and the like may be somewhat exaggerated to facilitate understanding.

1, a semiconductor package handler according to an embodiment of the present invention includes a loading unit 100, a cutting unit 200, a cleaning unit 300, a drying unit 400, an alignment unit 500, (600). A strip picker 110 for transferring a semiconductor package (hereinafter referred to as a "strip") manufactured from the loading unit 100 to a substrate 200 to a cutting unit 200; A unit picker 700 for transferring the separated semiconductor packages to the drying unit 400 through the unit 300 and an alignment table picker 800 for transferring the dried individual semiconductor packages in the drying unit 400 to the alignment unit 500 .

The loading unit 100 may include a magazine or a cassette for loading the strip. The strip loaded on the loading section 100 can be supplied to the pickup position of the strip picker 110 by the rail 120. The strip picker 110 picks up the strip supplied from the loading section 100, It can be moved along the guide rail 130 which is elongated in the axial direction and transferred to the cut portion 200.

The cut portion 200 includes a chuck table device 210 for seating and fixing the strip conveyed by the strip picker 110, a guide rail 220 for guiding the movement of the chuck table device 210 in the Y axis direction, And a cutting device 230 for cutting the strip conveyed along the guide rail 220 in a state fixed to the device 210 into an individual semiconductor package.

The chuck table device 210 may include an adsorption means for adsorbing and fixing the strip and a rotating device for rotating the table 211 thereon for changing the cutting direction of the strip. The chuck table device 210 can move in the Y-axis direction along the guide rail 220 in a state where the strip is adsorbed and fixed, and can rotate for changing the cutting direction. The cutting device 230 may cut the strip transferred by the chuck table device 210 into individual semiconductor packages.

The unit picker 700 can move along the guide rail 130 in the X-axis direction. The unit picker 700 can pick up an individual semiconductor package placed on the chuck table device 210 in a cut state and move it to the drying part 400 via the cleaning part 300. [ For this purpose, the cleaning unit 300 and the drying unit 400 may be disposed adjacent to the cutting unit 200.

The cleaning unit 300 may include a cleaning water injection device 310 or a brush device (not shown) disposed under the path of the unit picker 700. The wash water injector 310 may remove foreign matter or by-products resulting from the cutting in a manner that injects the wash water into the individual semiconductor packages conveyed in the pick-up state by the unit picker 700. The wash water injector 310 may further include an air nozzle for injecting air. The brush device may be a method of brushing the package that has been adsorbed to the unit picker apart from the wash water spray to increase the cleaning efficiency, and to sweep away (brush) the foreign matter or cutting off-product. The brush may be installed between the cut portion 200 and the cleaning portion 300. Further, a brush driving device (not shown) for moving the brush in the horizontal direction may be provided. Such a brush driving device may be composed of a ball screw (not shown) and a moving nut (not shown) connected to a known pneumatic cylinder or a thermo-motor. In order to increase the efficiency of the brush, the brush may be provided with a nozzle for spraying water.

The cleaned semiconductor packages are dried in the drying section 400. The drying unit 400 may include a drying block 410 on which the individual semiconductor packages transferred by the unit picker 700 are seated and an air blowing unit 420 for blowing air for drying in the drying block 410 have. In addition, a heating unit may be provided inside the drying block 410 so that drying can be performed more quickly. The drying block 410 is movably supported on a rail 401 extending in the X-axis direction so that the drying block 410 can move toward the alignment unit 500 disposed adjacent to the drying unit after drying or drying.

The air blowing unit 420 is disposed on the drying block 410 and can blow air into the semiconductor packages mounted on the drying block 410 to dry the semiconductor packages. The air blowing unit 420 may be installed to be movable along another guide rail 141 extending in the X-axis direction.

9, the air blowing unit 420 includes a support bar 421 extending in the Y-axis direction on the upper side of the drying block 410 and an air injection nozzle 422 provided on the support bar 421 . An upper vision camera (not shown) is mounted on the supporting bar 421 of the air blowing unit 420 to photograph the upper surface of the semiconductor packages mounted on the drying block 410 while the drying process or the drying block 410 is moving, (430) may be installed.

After drying, the semiconductor packages loaded on the drying block 410 are picked up on the alignment table picker 800 and stacked on the alignment table 520. The alignment table 520 is transferred to the inspection part and then checked for defects or defects. The inspection unit includes a vision camera 510 for performing a vision inspection of the dried semiconductor package, a rail 146 extending in the Y-axis direction in a state where the semiconductor packages transferred by the alignment table picker 800 are loaded, The alignment table 520 moves to the upper side of the lower vision camera 510 while picking up the semiconductor packages stacked on the alignment table 520 to determine whether the lower surface of the semiconductor package is defective or not Lt; / RTI > And may include unloading pickers 541 and 542 that are classified and loaded into an unloading unit 600, which will be described later, according to whether or not there is a defect.

Alignment table 520 may move along rail 146 to a location proximate to drying block 410 for loading of semiconductor packages carried by alignment table picker 800. The alignment table picker 800 can move the semiconductor packages loaded on the drying block 410 to the alignment table 520 while moving along the guide rail 141 in the X-axis direction.

The alignment table 520 on which the semiconductor packages are mounted can move along the Y-axis directional rails 146 toward the unloading pickers 541 and 542 and rotate for picking up the unloading pickers 541 and 542. [

The unloading pickers 541 and 542 may be configured in plural. That is, the unloading pickers 541 and 542 can be installed on the two rails 142 and 143, which extend in parallel to each other in the X-axis direction. The unloading pickers 541 and 542 may pick up the semiconductor package mounted on the alignment table 520 and then move to the vision camera 510 to inspect the semiconductor package.

The unloading unit 600 is connected to the good and unloading units 610 and 620 from the good product unloading unit 610, the reject unloading unit 620, the empty tray supply unit 630, and the empty tray supply unit 630 And a tray picker 640 that feeds an empty tray T.

The good unloading unit 610 and the reject unloading unit 620 are arranged in a state in which the trays T supplied from the empty tray supply unit 630 are mounted and are lifted along the rails 144 and 145 elongated in the Y- It is possible to move to the lower part of the path where the loading pickers 541 and 542 move. Therefore, the good of the semiconductor packages transferred by the unloading pickers 541 and 542 after the inspection is conveyed to the tray of the good unloading portion 610, Lt; / RTI > The tray picker 640 moves along the X-axis direction guide rail 141 to feed the empty tray T from the empty tray supply unit 630 to the good product unloading unit 610 and the reject unloading unit 620 have.

2 and 3, the unit picker 700, which picks up the individual semiconductor packages placed on the chuck table device 210 after cutting and then transfers the individual semiconductor packages to the drying block 410 through the cleaning part 300, A pad supporting member 720 for supporting the adsorption pad 710, and a picker base unit 730 for supporting the pad supporting member 720. The adsorption pad 710 is provided on the lower surface thereof.

The adsorption pad 710 has first unit adsorption holes 711 and second unit adsorption holes 712 arranged alternately. The absorption pad 710 may be a rubber material or a sponge material for directly protecting the semiconductor package and enhancing the attraction force. The pad supporting member 720 has first and second through holes 721 and 722 communicating with the first and second unit adsorption holes 711 and 712 of the adsorption pad 710.

As shown in Figs. 2, 3 and 5, the picker base portion 730 includes a first unit side pneumatic line 731 for applying a suction force to the first unit adsorbing holes 711, And a second unit side pneumatic line 732 for applying a suction force to the suction holes 712. First distribution grooves 733 formed in a zigzag shape on the lower surface thereof to communicate the first unit adsorption holes 711 with the first unit side pneumatic line 731, And second distribution grooves 734 for communicating the second unit side pneumatic line 732 with each other. The first distribution grooves 733 are communicated with the first unit side pneumatic line 731 by the first communication holes 735 and the second distribution grooves 734 are communicated with the second communication holes 736 through the second communication holes 736 Communicates with the second unit side pneumatic line 732.

  This unit picker 700 imparts a suction force to the first unit adsorption holes 711 through the first unit side pneumatic line 731 to thereby transfer the semiconductor packages arranged to correspond to the first unit adsorption holes 711 It can be adsorbed by the family. In addition, by applying a suction force to the second unit adsorption holes 712 through the second unit side pneumatic line 732, the semiconductor packages arranged to correspond to the second unit adsorption holes 712 can be alternately adsorbed .

That is, the unit picker 700 can alternately select and adsorb semiconductor packages through independent control of the first unit side pneumatic line 731 and the second unit side pneumatic line 732. Of course, when such a unit picker 700 picks up the semiconductor packages from the chuck table device 210, a sucking force acts on both the first unit adsorbing holes 711 and the second unit adsorbing holes 712, Lt; RTI ID = 0.0 > 210 < / RTI >

2 and 4, the drying block 410 includes an adsorption pad 410a having first dry adsorption holes 411 and second dry adsorption holes 412 arranged alternately, And a picker base portion 410b for supporting the lower surface of the absorption pad 410a.

The first dry adsorption holes 411 are arranged to correspond to the first unit adsorption holes 711 of the unit picker 700 and the second dry adsorption holes 412 are arranged to correspond to the second unit adsorption holes 711 of the unit picker 700. [ And are arranged to correspond to the adsorption holes 712. The picker base portion 410b has a first drying side pneumatic line 413 and a second drying side pneumatic line 414 which are separated from each other. The first drying side air pressure line 413 and the second drying side air pressure line 413 are connected to each other by zigzag first distribution grooves 415 for communicating the first drying side air pressure line 413 with the first dry adsorption holes 411, Shaped second distribution grooves 416 communicating with each other. For reference, although each of the first dry adsorbing holes and the second dry adsorbing holes are alternately arranged by zigzag-type distribution grooves in their entirety, when viewed as a whole based on the dry block, And the second dry adsorption holes are arranged in a matrix form (see FIG. 4).

This drying block 410 can independently control the first drying side pneumatic line 413 and the second drying side pneumatic line 414, similarly to the unit picker 700. Therefore, the adsorption by the first dry adsorption holes 411 and the adsorption by the second dry adsorption holes 412 can be realized independently. That is, the semiconductor packages supplied from the unit picker 700 can alternately be selected and adsorbed. 2, the drying block 410 may include a heater 417 for heating the semiconductor package loaded on the upper surface of the drying block 410 in an adsorbed state. The heater 417 radiates heat for drying the semiconductor packages, and the number, structure, and calorific value of the heat rays can be variously selected according to design conditions.

FIGS. 6 to 11 illustrate the primary and secondary seating processes in which the semiconductor packages are sequentially placed from the unit picker 700 to the drying block 410 with a time lag and the semiconductor packages sequentially stacked on the drying block 410 And the primary and secondary drying processes in which the packages are also sequentially dried.

6 shows that the unit picker 700 has moved to an upper portion of the drying block 410 in a state in which semiconductor packages are picked up. FIG. 7 shows a state in which the unit picker 700 is lowered to the upper portion of the drying block 410 to perform the primary loading, and FIG. 8 shows the state in which the unit picker 700 is raised again after performing the primary loading.

8, in the primary seating process, only the semiconductor packages adsorbed to the first unit adsorption holes 711 among the semiconductor packages transferred by the unit picker 700 are loaded onto the drying block 410 do. At this time, the first unit adsorption holes 711 of the unit picker 700 and the second dry adsorption holes 412 of the drying block 410 release the adsorption force and the second unit adsorption holes 711 of the unit picker 700 (712) and the first dry adsorption holes (411) of the drying block (410) give adsorption force. In this way, as shown in FIG. 2, some of the semiconductor packages are seated alternately in the drying block 410 with mutual spacing. In addition, the semiconductor packages placed on the first dry adsorption holes 411 of the drying block 410 can be stably fixed because the adsorption force acts on the first dry adsorption holes 411.

9, after the drying block 410 is moved to the lower portion of the air blowing unit 420, the semiconductor packages loaded on the drying block 410 are primarily dried by the air blown by the air blowing unit 420 The drying process is carried out.

Since the semiconductor packages are stacked alternately on the drying block 410, the primary drying process can smoothly blow air between the semiconductor packages. If blowing is performed in a state where all of the semiconductor packages are placed on the drying block 410, the moisture is not completely removed due to a narrow boundary portion between the packages, and the cutting residue (bur), which is not removed even after cleaning, It may remain in a state that it remains without being removed. There is a high possibility that an overkill may occur during the inspection by the upper vision camera 430. However, in the present invention, since air is sprayed while being alternately and spacedly mounted on the drying block 410, overkill is reduced. Therefore, the drying effect by blowing air can be enhanced. Of course, since the drying block 410 is heated by the heater 417 inside the drying block 410, the drying effect can be further enhanced.

The present embodiment shows only the case where the air blowing unit 420 blows air toward the semiconductor packages mounted on the drying block 410 in the primary drying process, (700). If the air is sprayed in both directions, the remaining semiconductor packages that are held in the unit picker 700 can be dried together, thereby improving the drying effect.

After the primary drying step, the drying block 410 moves to the lower part of the unit picker 700 again as shown in FIGS. 10 and 11, and the unit picker 700 moves to the second unit adsorption holes 712 to the drying block 410 to be placed thereon. The first and second unit adsorption holes 711 and 712 of the unit picker 700 release the adsorption force and the first and second dried adsorption holes 411 and 412 of the drying block 410 . Thus, all semiconductor packages, including semiconductor packages that have undergone primary drying, are placed on the drying block 410 from the unit picker 700. The semiconductor packages mounted on the drying block 410 can be stably fixed to the drying block 410 because the suction force is applied to the first and second dry suction holes 411 and 412.

11, after the secondary placing process, the drying block 410 moves again toward the air blowing unit 420, and the secondary packages are dried in the secondary drying process in which the semiconductor packages mounted together by the primary and secondary seating processes are dried together .

As described above, the semiconductor package handler of the present embodiment improves the drying effect of the semiconductor packages because the semiconductor packages are drivably mounted on the drying block 410 alternately while alternately mounting the semiconductor packages on the drying block 410 at a plurality of times. If the drying effect is increased, the subsequent inspection process can be more smoothly performed, so that the reliability of the entire process can be enhanced. Further, it is preferable that the number of times is plural times. More specifically, some of the semiconductor packages (packages corresponding to the first loading grooves of the alignment table) loaded on the drying block are picked up alternately with the alignment table picker while all the semiconductor materials are adsorbed on the drying block And is primarily transported to the first loading groove of the alignment table. Then, the alignment table picker moves again onto the drying block, picking up the remaining semiconductor packages loaded on the drying block with the alignment table picker, and transferring the semiconductor packages to the second loading groove of the alignment table. That is, the semiconductor packages loaded in the drying block can be loaded into the loading grooves of the alignment table twice. Of course, the semiconductor packages loaded in the drying block in excess of two times may be picked up and transferred to the loading grooves of the alignment table, but two times is most preferable considering the package processing speed (UPH) per unit time.

The dried semiconductor packages are transferred to the alignment table 520 in a state of being placed on the drying block 410. The inspection picker 800 picks up the semiconductor packages mounted on the drying block 410 for inspection, (520).

12 and 13, the alignment table 520 includes first and second mounting grooves 521a and 521b on which semiconductor packages are mounted, and first non-mounting areas 521b on which the semiconductor packages are mounted, 1 stacking portion 521 and the second stacking grooves 522a on which the semiconductor packages are stacked and the second unloading regions 522b on which the semiconductor packages are stacked are formed in an opposite pattern to the first stacking portion 521, And a second loading portion 522 disposed thereon. That is, the positions of the first loading grooves 521a on which the semiconductor packages are loaded in the first loading section 521 correspond to the positions of the second unloading areas 522b in which the semiconductor packages are not loaded in the second loading section And the position of the first unloading areas 521b in which the semiconductor package is not loaded in the first loading part 521 corresponds to the position of the second loading groove 522a in which the semiconductor package is loaded in the second loading part 521 .

The alignment table 520 includes first non-stacking areas 521b between the first stacking grooves 521a and a second non-stacking area 522b between the second stacking grooves 522a So that the semiconductor packages can be accurately loaded in the respective loading grooves 521a and 522a. In addition, since the mounting portion of the alignment table 520 is provided with the guide inclined portion, the dried semiconductor package can be accurately loaded in the loading groove without error. In addition, the first stacking part 521 and the second stacking part 522 are formed in a mutually opposing pattern, so that the semiconductor packages mounted on the drying block 410 are alternately picked up to form the first stacking part 521 and the second stacking part 522, (522).

The inspection picker 800 may be provided in substantially the same form as the unit picker 700 as shown in Fig. That is, the alignment table picker 800 supports the adsorption pad 810 and the adsorption pad 810 in which the first adsorption holes 811 and the second adsorption holes 812 are alternately arranged, A pad support member 820 having first and second through holes 821 and 822 communicating with the second adsorption holes 811 and 812 and a pad support member 820 supporting the pad support member 820 and supporting the first pneumatic line 831 and the first Zigzag shaped first distribution grooves 833 for communicating the adsorption holes 811 and zigzag shaped second distribution grooves (not shown) for communicating the second adsorption holes 812 with the second pneumatic line 832, (Not shown).

The alignment table picker 800 alternately picks up the semiconductor packages mounted on the drying block 410 in such a manner that an attraction force acts alternately on the first suction holes 811 and the second suction holes 812. [ And sequentially transferred to the first stacking grooves 521a and the second stacking grooves 522a of the alignment table 520 twice in sequence.

14 to 16 illustrate a primary transfer process in which the alignment table picker 800 alternately picks up the semiconductor packages mounted on the drying block 410 and transfers them to the first loading portion 521 of the alignment table 520 FIGS. 17 and 18 show a second transfer process of picking up the remaining semiconductor packages mounted on the drying block 410 and transferring them to the second stacking portion 522 of the alignment table 520.

In the primary transfer process, the alignment table picker 800 applies the suction force to the first suction holes 811 and releases the attraction force of the second suction holes 812. In this state, the alignment table picker 800 alternately picks up only semiconductor packages that are seated on the first dry suction holes 411 of the drying block 410, as shown in Figs. 14 to 16, To the first loading grooves 521a provided in the first loading section 521 of the second loading section 520.

When the alignment table picker 800 picks up the semiconductor packages in the primary transferring process, the drying block 410 releases the attraction force of the first dry suction holes 411, thereby smoothly picking up the semiconductor packages loaded at the corresponding positions And maintains the remaining semiconductor packages fixed to the drying block 410 by maintaining the suction force of the second dry adsorption holes 412.

If the suction force is maintained in the second dry suction holes 412 of the drying block 410 in the first transfer process, the semiconductor packages remaining in the drying block 410 can be prevented from being disturbed. Therefore, it is possible to make an accurate pickup of the remaining semiconductor packages in the subsequent secondary transfer process.

16, when the semiconductor packages picked up by the alignment table picker 800 are lowered into the first loading grooves 521a of the alignment table 520, the picked up semiconductor packages P are transferred to the first loading grooves 521a The lower surface of the alignment table picker 800 is brought close to the upper surface of the alignment table 520 so as to deeply enter the inside of the alignment table 520a. At this time, the alignment table picker 800 picks up the semiconductor packages P alternately using only the first suction holes 811, so that the picked-up semiconductor packages P are separated from the first pick- 1 non-stacking area 521b. The gap t between the lower surface of the alignment table picker 800 and the upper surface of the alignment table 520 can be minimized.

When the alignment table picker 800 releases the attraction force in a state where the semiconductor packages P picked up in the alignment table picker 800 are deeply introduced into the first loading groove 521a, It is possible to minimize the drop height of the semiconductor package P falling on the semiconductor package P, thereby realizing accurate and stable loading.

Unlike the present invention, conventionally, all the semiconductor packages having the alignment table pickers mounted on the drying block are simultaneously picked up, and then sequentially lowered to the first loading unit and the second loading unit of the alignment table. Therefore, in the process of first lowering a part of the semiconductor packages picked up by the alignment table picker, the first non-stacking area of the first stacking part and the remaining semiconductor packages holding the adsorption state on the alignment table picker may be interfered. For example, when the semiconductor package adsorbed on the first adsorption bore is lowered into the first loading groove, the alignment table picker is brought close to the alignment table because the semiconductor package adsorbed on the second adsorption bore interferes with the first unloading area There was a limit. As a result, when the semiconductor package is loaded on the alignment table, the semiconductor package picked up on the alignment table picker hits the alignment table and must be dropped from the relatively high position to the first loading groove so as not to be damaged. Since the gap between the semiconductor package and the alignment table is opened in the atmosphere to prevent the interference between the semiconductor package and the first non-stacking area adsorbed on the second suction holes, external air is rapidly introduced through the gap, The vacuum attraction force is weakened, and a loading error is liable to occur. When the size of the semiconductor package is small, the semiconductor package is not stuck on the alignment table picker due to the residual pressure even if the vacuum of the alignment table picker is canceled during the seating of the material, The package has to be loaded, so that the vacuum force of the alignment table loading groove can not reach the semiconductor package, causing a load error.

In order to solve such a problem, when the depth of the loading groove is shallowly modified, the guide section is shortened to cause a problem in the alignment function of the semiconductor package. In the case of forming a large static pressure or a large vacuum pressure, The alignment table is hit strongly, which results in product damage.

However, as shown in FIGS. 17 and 18, the alignment table picker 800 in the present invention transfers a part of the semiconductor package to the first stacking portion 521 through the first transfer process, (The remaining semiconductor packages) mounted on the second dry suction holes 412 of the first and second loading holes 412 and 410 are picked up and transferred to the second loading grooves 522a. When the alignment table picker 800 picks up the semiconductor packages from the drying block 810 in the secondary transfer process, the drying block 410 releases the attraction force of the second dry adsorption holes 412.

The alignment table picker 800 can lower the semiconductor packages sucked by the second suction holes 812 in the second loading grooves 522a of the second loading portion 522 in the second transferring process So that stable and accurate loading can be realized. Therefore, since only the semiconductor package to be mounted is picked up, the alignment table picker can be brought into close contact with the loading groove of the alignment table and the semiconductor package can be placed down.

The semiconductor package handler of the present embodiment can prevent the alignment table picker 800 from alternately picking up the semiconductor packages of the drying block 410 and aligning the first loading groove 521a and the second loading groove 522a of the alignment table 520, The semiconductor packages to be transferred to the alignment table 520 can be lowered into the first loading groove 521a or the second loading groove 522a. Therefore, it is possible to realize stable and accurate loading, thereby enhancing the reliability of a subsequent inspection process.

19 shows a semiconductor package handler according to another embodiment of the present invention. The example of FIG. 19 includes a first alignment table 520a and a second alignment table 520b that operate separately. The first alignment table 520a is provided with a first stacking part 521 in which first stacking grooves 521a on which the semiconductor packages are stacked and first non-stacking areas 521b on which the semiconductor packages are stacked alternately . The second alignment grooves 522a on which the semiconductor packages are mounted and the second non-mounting areas 522b on which the semiconductor packages are mounted are formed in the second alignment table 520b in an opposite pattern to the first mounting portions 521, And the second stacking portion 522 may be provided.

In FIG. 19, the alignment table picker 800 can sequentially transfer semiconductor packages to the first and second alignment tables 520a and 520b by a first transfer process and a second transfer process, as in the above-described example. That is, in the first transfer step, the semiconductor packages mounted on the drying block 410 are alternately picked up and transferred to the first loading grooves 521a of the first alignment table 520a. In the second transfer process, 410 may be picked up and transferred to the second loading grooves 522b of the second alignment table 520b.

According to another embodiment of the present invention, when loading is completed in the first sorting table, it is not necessary to wait until the loading on the second sorting table is completed, and it is possible to move to the inspection unit immediately. Therefore, since the transfer operation is not delayed, the package processing speed (UPH) per unit time can be improved.

100: loading part, 110: strip picker,
200: cutting section, 210: chuck table device,
300: washing section, 400: drying section,
410: drying block, 411: first dry adsorption ball,
412: second dry adsorption ball, 420: blowing unit,
430: upper vision camera, 640: tray picker,
500: alignment unit, 510: lower vision camera,
520: alignment table, 521: first loading section,
521a: first loading groove, 522b: first unloading area,
522: second loading section, 522a: first loading groove,
522b: second unloading area, 600: unloading part,
610: Good article unloading section, 620: Reject unloading section,
700: unit picker, 711: first unit adsorption ball,
712: second unit adsorption ball, 800: alignment table picker,
811: first adsorption ball, 812: second adsorption ball.

Claims (16)

A drying block on which semiconductor packages are mounted;
A semiconductor package comprising: a first stacking part in which first loading grooves on which semiconductor packages are stacked and first non-stacking areas that are not stacked are alternately arranged; second stacking grooves on which semiconductor packages are stacked; An aligning table having a second stacking portion arranged alternately in a pattern opposite to the first stacking portion; And
And an alignment table picker for alternately picking up the semiconductor packages seated on the drying block and sequentially transferring the semiconductor packages to the first loading grooves and the second loading grooves of the alignment table a plurality of times,
Wherein the alignment table picker comprises first and second adsorption holes arranged alternately with each other, a first pneumatic line communicated with the first adsorption holes, and a second pneumatic line communicated with the second adsorption holes, A semiconductor package handler comprising a first pneumatic line and a second pneumatic line. delete The method according to claim 1,
The alignment table picker
An adsorption pad on which the first adsorption holes and the second adsorption holes are formed;
A pad supporting member supporting the adsorption pad and having first and second through holes communicating with the first and second adsorption holes, respectively;
Zigzag first distribution grooves for supporting the pad supporting member and communicating the first pneumatic line with the first adsorption bores and zigzag second distribution grooves communicating the second pneumatic line and the second adsorption bores, And a picker base portion equipped with the picker base portion. The method according to claim 1,
Wherein the drying block comprises first dry adsorption holes and second dry adsorption holes arranged inter-alternately on an upper surface, a first drying side pneumatic line in communication with the first dry adsorption holes, And a second dry side pneumatic line communicated with the balls and separated from the first dry side pneumatic line. 5. The method of claim 4,
Further comprising a unit picker for picking up the separated individual semiconductor packages and moving them to the drying block,
Wherein the unit picker comprises first unit adsorption holes and second unit adsorption holes arranged mutually alternately on the lower surface, a first unit side pneumatic line communicated with the first unit adsorption holes, And a second unit side pneumatic line communicated with the balls and separated from the first unit side pneumatic line. The method according to claim 1,
And said plurality of times are two times. The method according to claim 1,
The positions of the first loading grooves on which the semiconductor packages are loaded in the first loading section correspond to the positions of the second non-loading areas on which the semiconductor packages are not loaded in the second loading section, Wherein the positions of the first unloading areas that are not loaded correspond to the positions of the second loading slots on which the semiconductor packages are loaded in the second loading part. A drying block on which semiconductor packages are mounted;
A first alignment table having first loading grooves on which semiconductor packages are loaded and first loading portions on which first non-loading regions that are not loaded are alternately arranged;
A second alignment table having second loading grooves on which the semiconductor packages are loaded and second unloading areas that are not loaded on the second loading tables, wherein the second loading grooves are alternately arranged in an opposite pattern to the first loading portions; And
And an alignment table picker for alternately picking up the semiconductor packages mounted on the drying block and sequentially transferring the first and second stacking grooves of the first alignment table and the second alignment grooves sequentially in a plurality of times and,
Wherein the drying block comprises first dry adsorption holes and second dry adsorption holes arranged inter-alternately on an upper surface, a first drying side pneumatic line in communication with the first dry adsorption holes, And a second dry side pneumatic line communicated with the balls and separated from the first dry side pneumatic line. delete 9. The method of claim 8,
And said plurality of times are two times. 10. A method of operating a semiconductor package handler according to any one of claims 1, 3, 8, and 10,
A first transfer step of alternately picking up some of the semiconductor packages seated on the drying block by using the alignment table picker and transferring the semiconductor packages to the first loading grooves;
And a second transfer process for picking up the remaining semiconductor packages mounted on the drying block after the first transfer process and the second transfer grooves for transferring the semiconductor packages to the second loading grooves. A method of operating a semiconductor package handler according to claim 4 or 8,
The semiconductor packages mounted on the first dry adsorption holes of the drying block are picked up by the alignment table picker and transferred to the first loading grooves so as to release the attraction force of the first dry adsorption holes in the pickup process, 2 primary transfer process to maintain the adsorption force of dry adsorption balls;
The semiconductor packages loaded on the second dry adsorption holes of the drying block after the first transfer process are picked up by the alignment table picker and transferred to the second loading grooves, And a secondary transfer step of releasing the attraction force. A method of operating a semiconductor package handler according to claim 5,
A primary seating step of placing the semiconductor package adsorbed on the first unit adsorption holes of the semiconductor packages transferred by the unit picker onto the drying block;
A primary drying step of drying the semiconductor packages seated on the drying block by the primary seating process;
A secondary settling process in which the semiconductor package adsorbed on the second unit adsorption holes of the unit picker after the primary drying process is further placed on the drying block;
And a secondary drying step of drying together the semiconductor packages seated on the drying block by the primary and secondary seating processes. 12. The method of claim 11,
In the first placing process, releasing the attraction force between the first unit adsorbing holes of the unit picker and the second dry adsorbing holes of the drying block, and the second unit adsorbing holes of the unit picker and the drying block Thereby imparting an adsorption force to the first dry adsorption holes,
A method of operating a semiconductor package handler for releasing the attraction force of the first and second unit adsorption holes of the unit picker in the secondary seating process and imparting attraction force to the first and second dry adsorption holes of the drying block . A loading portion for accommodating the semiconductor strip;
A cutting portion for cutting the semiconductor strip transferred from the loading portion into individual semiconductor packages;
A cleaning unit cleaning the semiconductor packages cut at the cut portion;
A first drying adsorption holes and a second drying adsorption holes disposed on the upper surface in a mutually interchangeable manner for vacuum adsorption of the semiconductor packages cleaned in the cleaning section; and a second drying adsorption holes communicating with the first drying adsorption holes, A drying unit having a side pneumatic line and a second drying side pneumatic line communicated with the second dry adsorption holes and separated from the first drying side pneumatic line;
An inspection unit for inspecting whether the dried semiconductor packages are defective or not;
Wherein the first and second stacking portions are alternately arranged in a stacking manner on a top surface of the first stacking portion and the second stacking portion, the stacking grooves on which the semiconductor packages are stacked, and the non-stacking regions on which the semiconductor packages are not stacked, Wherein the stacking grooves and the non-stacking areas of the first stacking part and the second stacking part are arranged at mutually opposite positions;
An aligning part picker alternately picking up the semiconductor packages seated on the drying part and sequentially feeding the first and second stacking parts of the aligning part to the stacking grooves twice in succession; And
And an unloading unit for sorting and loading the semiconductor packages according to a result of the inspection by the inspection unit. Cutting the semiconductor strip into individual semiconductor packages;
Cleaning the severed semiconductor packages;
A first drying side pneumatic line communicating with the first dry adsorption holes and a second drying side pneumatic line communicating with the first dry adsorption holes, Drying on a drying section in communication with the adsorption holes and having a second drying side pneumatic line separated from the first drying side pneumatic line;
A first transfer step of picking up the semiconductor packages loaded on the first dry adsorption holes on the drying unit with an alignment table picker and transferring the semiconductor packages to a first loading groove of the alignment table;
A second transfer step of picking up the remaining semiconductor packages loaded on the drying unit by the alignment table picker after the first transfer step and transferring the picked up semiconductor packages to a second loading groove of the alignment table;
Inspecting whether or not the semiconductor packages on the alignment table are defective; And
And loading the semiconductor packages onto a tray according to the result of the inspection.

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