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KR20150005269A - Cutting and Loading Apparatus of Semiconductor Materials - Google Patents

Cutting and Loading Apparatus of Semiconductor Materials Download PDF

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Publication number
KR20150005269A
KR20150005269A KR1020130079000A KR20130079000A KR20150005269A KR 20150005269 A KR20150005269 A KR 20150005269A KR 1020130079000 A KR1020130079000 A KR 1020130079000A KR 20130079000 A KR20130079000 A KR 20130079000A KR 20150005269 A KR20150005269 A KR 20150005269A
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KR
South Korea
Prior art keywords
wafer
semiconductor material
loading
picker
unit
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KR1020130079000A
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Korean (ko)
Inventor
이용구
Original Assignee
한미반도체 주식회사
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Priority to KR1020130079000A priority Critical patent/KR20150005269A/en
Publication of KR20150005269A publication Critical patent/KR20150005269A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Disclosed are a semiconductor material cutting and loading apparatus and a semiconductor material cutting and loading method using the same capable of performing a cutting process, an ultraviolet radiation process, a classifying and loading process with series of processes by a single apparatus. The semiconductor material cutting and loading apparatus according to an embodiment of the present invention includes: a wafer supply unit, a cutting device which cuts the supplied wafer, an ultraviolet radiation device which radiates ultraviolet rays to the cut wafer, and a classifying and loading device which off-loads the semiconductor material on an off-loading unit by loading the semiconductor material from the wafer. The classifying and loading device includes an intermediate supply unit which supplies the cut wafer. The wafer supplied through the intermediate supply unit is off-loaded as the semiconductor material via the ultraviolet radiation device and the classifying and loading device without passing through the cutting device or is off-loaded as the semiconductor material via the classifying and loading device without passing through the cutting device and the ultraviolet radiation device.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a cutting apparatus for cutting a semiconductor material,

The present invention relates to a semiconductor material cutting and stacking apparatus and a semiconductor material cutting and stacking method using the same. More particularly, the present invention relates to a semiconductor material cutting and stacking apparatus for cutting a semiconductor material, The present invention relates to a semiconductor material cutting and stacking apparatus that can be selectively used, and a semiconductor material cutting and stacking method using the same.

Generally, semiconductor materials include semiconductor chips and semiconductor packages. 2. Description of the Related Art A semiconductor chip is formed by integrating a highly integrated circuit such as a transistor and a capacitor in a plurality of regions arranged in a lattice pattern on a surface of a semiconductor wafer of a disk shape. Each time the circuit is formed, the semiconductor chip is cut into individual semiconductor chips using a cutting device.

After a semiconductor chip is mounted on a silicon semiconductor substrate as an individual unit, the semiconductor substrate is subjected to a molding process using an epoxy molding compound (EMC) on the top surface of the semiconductor substrate. A ball grid array (BGA) or a wire attached to a chip to conduct electricity to the chip is called a strip or a wafer level package (WLP) according to its shape. Such a strip or wafer level package is cut into individual semiconductor packages using a cutting device, which is referred to as singulation.

The wafer or wafer level package key is affixed to the support frame on which the adhesive tape is mounted so that the separated materials are supported without being scattered when the individual materials are being sacked. The support frame is subjected to an ultraviolet irradiation process before being transferred to the semiconductor material separator. That is, a so-called ultraviolet tape is widely used in which the adhesive tape adhered to the support frame is weakened when ultraviolet rays are irradiated. When the support frame is exposed to ultraviolet rays before being transferred to the semiconductor material separator, So that the semiconductor material can be easily separated from the adhesive tape of the support frame.

After the singulation process and the ultraviolet irradiation process, the defectiveness of the individual semiconductor materials is inspected. Pick & Placement process is a process of inspecting by semiconductor material inspecting equipment and classifying good and defective semiconductor materials and storing or loading them in reels, tubes, or trays.

As a prior art, Korean Patent Registration No. 10-0595363 discloses a semiconductor processing apparatus provided with an ultraviolet irradiation apparatus, a semiconductor processing apparatus having an ultraviolet irradiation apparatus, and a wafer sawing apparatus.

Conventional semiconductor equipment including the prior art includes a cutting device for cutting a wafer, a strip, or a wafer level package, a UV curing device for irradiating the adhesive tape with ultraviolet rays, and a semiconductor material, (Pick and Placement) devices were individually operated. Therefore, the volume occupied by each equipment is increased, and the worker is required to handle the next process after performing the individual process, which causes a problem that the work is consumed and the work process is delayed.

Korean Patent Registration No. 10-0595363 (published on June 30, 2006)

An embodiment of the present invention provides an inline concept semiconductor material cutting and stacking apparatus and a semiconductor material cutting and stacking method using the semiconductor material cutting apparatus, ultraviolet ray irradiating apparatus, and sorting apparatus, do.

It is another object of the present invention to provide a semiconductor material cutting and stacking apparatus and a semiconductor material cutting and stacking method using the semiconductor material cutting and stacking apparatus, which can perform not only a series of processes but also a necessary process while omitting individual processes.

According to an aspect of the present invention, there is provided a wafer processing apparatus including: a wafer supply unit; A cutting device for cutting the supplied wafer; An ultraviolet ray irradiating device for irradiating the cut wafer with ultraviolet rays; And a sorting device for loading the semiconductor material from the wafer and offloading the semiconductor material to the off-loading part, wherein the sorting device includes an intermediate supply part for supplying the cut wafer, and the wafer supplied through the intermediate supply part, A semiconductor material cutting-off which is off-loaded into the semiconductor material through the ultraviolet irradiating device and the sorting device without passing through the cutting device, or off-loaded into the semiconductor material through the sorting device without passing through the cutting device and the ultraviolet irradiating device A loading device may be provided.

Wherein the ultraviolet irradiation device includes an ultraviolet irradiation base portion on which the wafer transferred from the cutting device is seated and an ultraviolet ray irradiation portion for irradiating ultraviolet rays by transporting the wafer from the ultraviolet irradiation irradiation portion, A loading unit for picking up the semiconductor material from the wafer; and a conveying gripper for conveying the wafer between the loading unit and the loading unit, Further comprising a unit picker for transferring the wafer between the ultraviolet ray irradiation base portion and the work standby portion of the sorting and stacking apparatus, wherein the conveying gripper is provided with a semiconductor material cutting and stacking apparatus for feeding a wafer from the intermediate supply portion to the work waiting portion .

Wherein the ultraviolet irradiation device includes an ultraviolet irradiation base portion on which the wafer transferred from the cutting device is seated and an ultraviolet ray irradiation portion for irradiating ultraviolet rays by transporting the wafer from the ultraviolet irradiation irradiation portion, A loading unit for picking up the semiconductor material from the wafer, and a transferring picker for transferring the wafer between the loading unit and the loading unit, wherein the loading picker includes: Further comprising a unit picker for transferring the wafer between the ultraviolet ray irradiation standby portion and the working standby portion of the sorting and stacking apparatus, wherein a wafer is supplied from the intermediate supply portion to the operation waiting portion.

Wherein the ultraviolet irradiating device includes an ultraviolet ray irradiation base portion on which the wafer transferred from the cutting device is seated and an ultraviolet ray irradiating portion for irradiating the wafer with the ultraviolet ray by transporting the wafer from the ultraviolet ray irradiation base portion, A transfer picker for transferring the wafer from the ultraviolet ray irradiating unit of the irradiating apparatus; a work waiting base on which the wafer transferred by the transfer picker is seated on the loading table; and a loading unit for picking up the semiconductor material from the wafer placed on the loading table, And the loading table is provided in a pair so that the wafer is transferred from the transfer picker alternately and transfers the wafer while moving between the work standby portion and the loading portion, Which is transferred to the job waiting unit A cutting load device may be provided.

According to another aspect of the present invention there is provided a method of manufacturing a wafer, strip, or wafer level package, comprising the steps of providing a wafer, strip, or wafer level package attached with an adhesive tape on a support frame; cutting the wafer, The method comprising: irradiating the wafer level package with ultraviolet light to weaken the adhesive strength of the adhesive tape; loading individual semiconductor materials from the wafer, strip, or wafer level package; And a step of classifying and offloading the semiconductor material into a good product and a defective product according to the determined information; Irradiating the cut wafer, strip, or wafer level package provided from the intermediate supply unit with ultraviolet light to weaken the adhesive force of the adhesive tape; Loading individual semiconductor materials from the wafer, strip, or wafer level package; inspecting the semiconductor material to determine good and defective products; and classifying the semiconductor material into good and defective products according to the determined information, A second process in which the loading step is performed continuously; Or a wafer-level package provided from the intermediate supply unit, inspecting the semiconductor material to judge a good product and a defective product, and judging whether the semiconductor material A third process in which a step of classifying and offloading the product into a good product and a defective product is continuously performed; A semiconductor material cutting load method capable of selectively performing any one or more of the following methods can be provided.

The semiconductor material cutting and stacking apparatus and the semiconductor material cutting and stacking method using the same according to the embodiment of the present invention can cut semiconductor materials, irradiate ultraviolet rays, And the volume can be reduced, and it is possible to shorten the working time without requiring handling due to manpower in the middle of the process.

In addition, it is possible not only to perform all of the series of processes, but also to perform necessary processes while omitting the individual processes, thereby widening the operation range of the equipment.

FIG. 1 is a view showing a semiconductor material cutting and stacking apparatus according to a first embodiment of the present invention.
2 is a view showing a semiconductor material cutting and stacking apparatus according to a second embodiment of the present invention.
3 is a view showing a semiconductor material cutting and stacking apparatus according to a third embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. The present invention is not limited to the embodiments shown, but may be embodied in other forms. For the sake of clarity of the present invention, the drawings may omit the parts of the drawings that are not related to the description, and the size of the elements and the like may be somewhat exaggerated to facilitate understanding.

FIG. 1 is a view showing a semiconductor material cutting and stacking apparatus according to a first embodiment of the present invention.

The semiconductor material of the present invention includes a semiconductor chip for cutting a wafer into individual circuit forming regions and a semiconductor package for cutting a strip or a wafer level package (WLP) . Hereinafter, the wafer and the wafer level package are collectively referred to as a wafer W, and the semiconductor chip and the semiconductor package are collectively referred to as a semiconductor material (P). Unlike the circular wafer W, the case of using the strip is also included in the embodiment of the present invention.

Referring to FIG. 1, the semiconductor material cutting and stacking apparatus according to the first embodiment of the present invention can be roughly divided into four unit devices. A cutting device 2 for cutting the wafer W, an ultraviolet irradiation device 3 for irradiating the wafer W with ultraviolet light, And a sorting apparatus 4 for separating and classifying and loading the semiconductor material P. [

The supply apparatus 1 includes an inlet section 10 in which circular wafers W having a plurality of semiconductor materials P arranged in a lattice form are supplied in a state accommodated in the magazine 11.

The cutting apparatus 2 includes an aligning unit 20 in which the wafer W taken out from the inlet unit 10 is seated and aligned and a wafer W placed on the aligning unit 20 in the inlet unit 10 A cutting portion 30 for cutting the wafer W transferred from the aligning portion 20 in units of individual packages and a second aligning picker 21 for transferring the wafer W from the aligning portion 20 A second alignment picker 31 for picking up the wafer W to be transferred to the cut section 30 and a cleaning section 40 for cleaning the cut wafer W. [

The ultraviolet irradiator 3 includes an ultraviolet irradiator 53 for irradiating ultraviolet rays to the wafer W after the cutting process and the cleaning process.

The classification stacking apparatus 4 includes a work standby unit 60 on which a wafer W carried by the cutting unit 2 or the ultraviolet ray irradiating unit 3 is placed by the unit picker 5 and waits for a work, A loading section 70 for separating the individual semiconductor material P from the wafer W transferred by the transfer gripper 71, a transfer gripper 71 for transferring the wafer W from the base section 60, A loader picker 74 for picking up the semiconductor material P from the loading unit 70, an intermediate offloader picker 83 for temporarily holding the semiconductor material P from the loader picker 74, A downstream look-up vision 82 for inspecting the first side of the semiconductor material P seated on the intermediate loader 83 and a semiconductor material P from the intermediate offloader picker 83, An offloader picker 83 for transporting the semiconductor material P to the ejection section 100 and an optical pickup device 83 for picking up the semiconductor material P picked up by the offloader picker 83 A tray feeder 93 for supplying a tray to the good material loading section 91 and a good material tray 92 for loading the semiconductor material P on which the loading of the semiconductor material P is completed A tray feeder 96 for feeding the tray and a tray picker 97 for conveying the tray between the good-quality tray loading portion 95, the tray feeder 93 and the tray feeding portion 96 .

The unit picker 5 transports the wafer W while moving between the cutting device 2 and the ultraviolet irradiator 3 and the sorting device 4 and is not included in any one device configuration.

The division of the apparatus is merely a division according to the function, not the physical division, for convenience. Since the semiconductor material cutting and stacking apparatus according to the embodiment of the present invention is characterized in that the devices can be included in one device and can function as a series of functions, Will be included in the embodiment of the present invention.

Hereinafter, each configuration will be described in detail.

The wafer W according to the embodiment of the present invention is mounted on the support frame F. [ The wafer W may be distorted or the alignment state may be changed in the process of cutting the wafer W into individual semiconductor material P units. In this case, in order to prevent the semiconductor material P from being cut properly along with the cutting line, a defective semiconductor material P may be produced. To prevent this, the wafer W is sandwiched between the support frame F and the wafer W W are firmly supported on the support frame F. [

The inlet section (10) includes a magazine (11). The magazine 11 housed in the inlet section 10 may be a FOUP (Front Opening Unified Pod) type in which a door (not shown) for opening and closing a front door is formed. In this case, 11) can be configured to open the door (not shown). Further, the magazine 11 may include a vertically arranged multi-stage storage unit, and an elevator device (not shown) may be used to adjust the height of the storage unit 20 with the alignment unit 20. [

The first alignment picker 21 may include a guide pin 24 for aligning the wafer W and a draw-out gripper 22 for withdrawing the wafer W from the magazine 11. The drawing gripper 22 can grip one side of the edge of the supporting frame F to grip the wafer W on the aligning part 20. [ At this time, the support frame F can move along the inlet rail 23, and a roller (not shown) is disposed between the inlet section 10 and the alignment section 20, Can be easily moved.

The first alignment picker 21 is installed on the main guide rail 6 and is movable in the x-axis direction. The first alignment picker 21 may include four guide pins 24. The pair of guide pins 24 may be arranged on the upper and lower sides of the wafer W, and two pairs of the guide pins 24 may be moved in the y-axis, or any pair of the guide pins 24 may be moved in the y-axis. The distance between the two pairs of guide pins 24 is narrowed and the center position of the wafer W can be positioned at the set position by firmly supporting the wafer W by the guide pin 24. [

The alignment table 25 on which the wafer W is seated in the alignment section 20 can rotate in the direction of? (Angle on the xy plane). Even when the center position of the wafer W is set, the angle of the wafer may be misaligned so that it is corrected.

In another embodiment of the alignment unit 20, the alignment table 25 on which the wafer W is seated and fixed is movable in the x-axis direction and the y-axis direction, and can rotate in the? Direction. The aligning unit 20 includes a plurality of guides 24 fixedly provided on the outer side of the aligning table 25 and guiding the seating position of the wafer W while being in contact with the edge of the wafer W placed on the aligning table 25, A pin 24 and a positioning means (not shown) for determining a pickup position of the first alignment picker 21 when the first alignment picker 21 picks up the wafer W on the alignment table 25 .

Although not shown in the drawings, a vision camera (not shown) may be included to enhance the accuracy of such an alignment process. The vision camera can be supported on the first alignment picker 21 and moved in the x-axis direction together with the first alignment picker 21 and can be moved in the x-axis direction and positioned on the outer periphery of one side of the wafer W, A notch formed and a fiducial mark displayed on the upper surface of the wafer W are photographed to detect the position of the wafer W. [

Of course, in this embodiment, the vision camera is fixed to one side of the first alignment picker 21 and performs a position detection operation while horizontally moving together with the first alignment picker 21. Alternatively, The wafer W may be independently moved horizontally to perform the position detecting operation of the wafer W.

The cutting unit 30 includes a chuck table 32 on which the wafer W carried by the second aligning picker 31 is seated and fixed and horizontally movable in the y axis direction, And a cutter 33 for cutting the wafer W placed on the chuck table 32 into individual semiconductor material P units.

The second aligning picker 31 is provided on the main guide rail 6 and is movable in the x-axis direction and is means for transporting the wafer W from the aligning portion 20 to the cutting portion 30.

The cut portion 30 is provided so as to be movable up and down on the movement path of the chuck table 32 so that the cut portion 30 moves downward after the cutting operation is completed and contacts the scrap other than the semiconductor material placed on the chuck table 32 And a brush (not shown) for removing scrap. The brush can be moved up and down by a linear motion device such as a pneumatic cylinder.

The chuck table 32 is provided with an adsorption vacuum hole on its upper surface so as to stably attract the wafer W. Since the suction vacuum holes adsorb the individual semiconductor materials, it is possible to prevent the semiconductor materials from being twisted by the forces generated in the cutting process. The chuck table 32 is formed with a blade escape groove so as to be accommodated in a position corresponding to a semiconductor material cutting line formed in a lattice pattern on the wafer W while the blade edge of the cutter 33 is in a non-contact state. Therefore, when cutting the wafer W on the chuck table 32 along the cutting line while the blade of the cutter 33 and the chuck table 32 move relative to each other, the blade edge of the blade passes through the blade escape groove, The wafer W can be cut without coming into contact with the wafer 32.

Although not shown in the drawing, a water jet nozzle (not shown) or an air blower (not shown) is provided on the cutout 30 to cool the heat generated in the cutting process when the cutter 33 cuts the wafer W, (Not shown) may be installed.

The cleaning unit 40 is a means for cleaning and drying the wafer W, which has been cut off from the chuck table 32, while being transported by the unit picker 5. One example of the cleaning unit 40 is a spinner. The spinner rotates at a high speed after the spinner table 41 grasps the wafer W by a vacuum suction method or the like and injects the washing water through a cleaning spray nozzle (not shown) during rotation, (W) divided in units of (P). At this time, the cleaning spray nozzle can be positioned not only on the upper surface but also on the lower surface of the wafer W, so that both surfaces of the wafer W can be effectively cleaned.

The cleaning unit 40 can perform a drying process as well as a cleaning process. A high speed spinner generally performs a drying operation by rotation. However, a dry block (not shown) for heating the wafer W may be provided on the spinner table 41, or a high-pressure air may be sprayed from the upper side of the wafer W An air blower (not shown) may be installed to perform a drying operation.

The ultraviolet ray irradiating device 3 includes an ultraviolet ray irradiation base portion 50 on which the wafer W carried by the unit picker 5 is seated and waiting and an ultraviolet ray irradiating portion 53 for irradiating the wafer W with ultraviolet rays .

The ultraviolet ray irradiation standby section 50 includes a waiting table 51 capable of holding the wafer W by warning by vacuum suction and a rail 52 connecting the waiting table 51 and the ultraviolet ray irradiating section 53 .

The ultraviolet ray irradiating unit 53 includes an ultraviolet lamp (not shown) for irradiating ultraviolet rays and an entrance (not shown) in and out of the support frame F on which the wafer W is placed. The ultraviolet light emitted from an ultraviolet lamp (not shown) weakens the adhesive force of the adhesive tape T on the support frame F so that the individual semiconductor material P is easily separated from the wafer W. [ Since the adhesive tape T has a strong adhesive force in order to prevent the wafer W from being twisted in the process of cutting the wafer W, a large force is required in the process of separating into the separate semiconductor material P, It can be a cause. Therefore, by irradiating ultraviolet rays in the ultraviolet ray irradiating unit 53, the viscosity of the adhesive tape T is weakened so that the semiconductor material P can be easily separated from the adhesive tape T in the process of being separated into the individual semiconductor material P. do.

The sorting apparatus 4 includes a work waiting unit 60 on which a wafer W carried by the unit picker 5 is seated and awaiting a sorting work and a work waiting unit 60 on which the wafer W is loaded, P, a pre-caser 81 for temporarily storing the semiconductor material, an offloader picker 83 for loading the semiconductor material P on a tray, a tube or a reel, An offloading unit 90 for loading a semiconductor material P which is a good one of the semiconductor materials P divided into a good product and a defective product by the process and a rejection unit 100 for collecting the defective semiconductor material P And may include a rework section (not shown) for loading the rework semiconductor material P that requires rework as needed.

The work waiting portion 60 is a means for waiting the next work on the wafer W carried by the unit picker 5 and is provided with a rail 61 for connecting the work waiting portion 60 and the loading portion 70 .

The loading section 70 grips the wafer W from the work standby section 60 as a means for picking up the individual semiconductor material P from the wafer W cut in the individual unit and transfers it to the loading table 73 A loading table 73 on which the wafer W carried by the carrying gripper 71 is seated and an individual semiconductor material P from the loading table 73, A loader picker 74 for picking up and a check vision 75 for inspecting a pickup position where the loader picker 74 picks up.

The conveying gripper 71 grips one side edge of the support frame F of the cutting apparatus 2 and seats the wafer W on the loading table 73. [ The loading table 73 is capable of supporting the wafer W by a vacuum adsorption method and is provided with an ejector (not shown) for ejecting the semiconductor material P from the wafer W placed on the loading table, So that the individual semiconductor material P can be picked up by the loader picker 74.

The loader picker 74 can move in the z-axis direction (height direction with respect to the xy plane) to pick up the semiconductor material P from the wafer W. [ The loader picker 74 can pick up the semiconductor material P using a vacuum suction method, move in the x and y axis directions, and rotate in the? Direction.

Although not shown in the drawing, the loading portion 70 may include an ejector (not shown). Since the semiconductor material P is attached on the adhesive tape T, the loader picker 74 physically separates the semiconductor material P and the adhesive tape T in addition to the operation of vacuum- It is necessary to add an external force. The ejector (not shown) pushes up the semiconductor material P in a state in which the semiconductor material P is vacuum-adsorbed to the loader picker 74 so that the semiconductor material P is separated from the adhesive tape T, (T) can be used to pull down. For a more detailed configuration of the ejector (not shown), reference can be made to U.S. Patent No. 8,250,742 and U.S. Published Patent Application No. US 2011/0214819.

The inspection vision 75 can detect the error between the set position and the actual position of the semiconductor material P by checking the pickup position where the loader picker 74 picks up. In order to correct the error, the loader picker 74 is movable in the x- and y-axis directions and can rotate in the [theta] direction.

The presciser 81 receives the semiconductor material P from the loader picker 74 and places it in the respective loading grooves. The pre-aligner 81 can be provided with a loading groove in a row. This is because the semiconductor material P can be received in turn from the loader picker 74 in the x-axis direction and is easily inspected by one down-looking vision 82.

Downlooking vision 82 may be provided on top of presciser 81 to inspect the first side of semiconductor material P seated in presciser 81. [ The first face may be a solder ball or a wire bonded face and may be inspected by the downlooking vision 82 to determine the state of the ball (number, diameter, connection state, etc.) or the bonding and placement of the wire, can do.

The offloader picker 83 receives the semiconductor material P from the presciser 81 and loads the semiconductor material P on the offloading unit 90 or the reject unit 100. The uplink vision 84 can be installed under the path of the offloader picker 83 to inspect the second side of the semiconductor material P picked up by the offloader picker 83. The second surface may be the marking surface, and the marking state such as the presence or absence of marking on the surface, the marking direction, and the marking position can be inspected by the uplooking vision 84.

The presciser 81 and the offloader picker 83 can transport along the picker rail 85 in the x-axis direction. In addition, two pieces of the presciser 81 and the offloader picker 83 may be arranged in the vertical direction. By providing a pair, the waiting time of the loader picker 74 can be reduced to improve the work process speed. Also, when positioned side by side in close proximity to one another, the first face of the material can be inspected by one downlooking vision 82 and the second face of the material can be inspected by one uplooking vision 84 have.

The semiconductor material P having both sides checked by the downlooking vision 82 and the uplooking vision 84 is classified into a good product and a defective product and the good product is loaded on the offloading part 90. The defective product is classified into a reject part 100). ≪ / RTI > Defective products can be stored in a collection box because sorting work is unnecessary. In the case of rework materials which require additional work, they can be selectively loaded in a separate off-loading unit.

The offloading unit 90 includes a good material loading unit 91 for loading and receiving a good semiconductor material from the offloader picker 83, a good material loading unit 95 for storing a tray filled with a good material semiconductor material, And a tray feeder 96 for feeding the tray 92. [

The good article loading section 91 supplies the good article tray 92 with the tray feeder 93. [ The tray feeder 93 is movable along the tray feeder rail 94 in the y-axis direction. The good-quality tray 92 filled with the good-quality semiconductor material from the offloader picker 83 in the good-quality mounting portion 91 moves along the y-axis along the tray feeder rail 94 and is stored in the good-quality tray loading portion 95, A good-quality tray 92 is supplied to the feeder 93 from the tray supply unit 96. A tray picker 97 is provided between the tray feeder 95 and the tray feeder 93 so as to move along the tray picker rail 98 in the x-axis direction.

The reject unit 100 may include the reject tray 101 as a place where the semiconductor material determined to be defective by the inspection apparatus is collected.

The semiconductor material cutting and stacking apparatus according to the first embodiment of the present invention may include an intermediate supply unit 110 capable of providing a wafer W under the y axis direction of the work waiting unit 60. [ The semiconductor material cutting and stacking apparatus according to the embodiment of the present invention is a semiconductor material cutting and stacking apparatus for cutting semiconductor material P through a series of processes of a feeder 1, a cutting device 2, an ultraviolet irradiator 3, . ≪ / RTI > However, it is desirable to use a cut wafer (CW) and to use a wafer (CW) which does not require an ultraviolet ray irradiation process, in order to enhance the operability of the equipment.

The intermediate supply part 110 may include a middle supply part rail (not shown) to supply the wafer CW to the work standby part 60 with the cut wafer W loaded thereon and smooth the supply process .

When the cut wafer CW that does not require an ultraviolet ray irradiation process is loaded on the intermediate supply unit 110, the transfer gripper 71 or the like transports the wafer CW to wait on the work standby unit 60, The wafer CW may be transferred to the loading unit 70 to start the sorting process. On the other hand, if the cut wafer (CW) required for the ultraviolet ray irradiation process is loaded, the wafer (CW) is moved to the work standby portion 60 by the conveying gripper 71 or the like, (CW) is picked up and placed in the ultraviolet ray irradiation standby section (50), so that the ultraviolet ray irradiation process can be prepared.

By including the intermediate supply unit 110 as described above, not only a series of semiconductor material processes but also a cutting process and an ultraviolet irradiation process can be selected as options, thereby widening the operation of the apparatus.

The intermediate supply unit 110 not only loads the cut wafer CW for the selective process as described above but also has a function of recovering the support frame F from which the semiconductor material P is all picked up from the loading unit 70 . ≪ / RTI >

2 is a view showing a semiconductor material cutting and stacking apparatus according to a second embodiment of the present invention.

1, the feeding device 1, the cutting device 2, and the ultraviolet irradiating device 3 are the same. Therefore, in FIG. 2, the description will be made centering on the classification storage device 200 according to the second embodiment.

2, the sorting apparatus 200 according to the second embodiment of the present invention includes transfer pickers 210 and 220 for transferring wafers, a loading unit 240 for loading the semiconductor material P, A loader picker 243 for picking up the semiconductor material P from the loading part 240, a seat block 250 for temporarily holding the semiconductor material P, An offloader picker 260, an offloader 270, and an inspection vision 252, 253.

The wafer W that has been irradiated with ultraviolet rays in the ultraviolet ray irradiating section 53 is supplied to the work standby section 201 by the unit picker 5. [ The transporting picker may include a first transporting picker 210 and a second transporting picker 220.

The first conveying picker 210 is supported on the sub guide rail 202 by a first conveying picker supporting member 211 moving in the x axis direction and the second conveying picker 220 is supported on the sub guide rail 202 and is supported by a second conveyance picker supporting member 221 which moves in the x-axis direction. The two transfer pickers 210 and 220 can carry the wafer W by vacuum suction.

The transfer pickers 210 and 220 can function as a wafer W alignment means. When the semiconductor material P is loaded in the loading unit 240, the wafer W that has been misaligned through the cutting apparatus 2 and the ultraviolet irradiator 3 requires a position correction process, Delayed, and the accuracy of the operation may deteriorate. Therefore, each of the transporting pickers 210 and 220 is provided so as to be relatively movable in the x-axis direction, so that the center position of the wafer W in the x-axis direction can be made coincident with the set position.

The transfer pickers 210 and 220 can transport the wafer W to the loading table 241 and mount the wafer W thereon. The loading table 241 can support the wafer W by a vacuum suction method and can be installed to be movable along the loading table rail 242 in the y-axis direction.

The alignment vision 230 is provided on the second conveyance picker support member 221 so that an error is detected between the set position at which the transfer pickers 210 and 220 are picked up and placed on the loading table 241 and the actual position of the wafer W can do. In order to correct the error, the loading table 241 moves in the y-axis direction so that the center position of the wafer W in the x-axis direction can coincide with the set position. Further, the loading table 241 can rotate in the &thetas; direction, and the degree of deformation of the wafer W can be corrected.

The loader picker 243 can move in the y-axis direction on the loader-picker rail 244 moving on the sub-guide rail 202 in the x-axis direction. Further, the loader picker 243 can move in the z-axis direction (height direction with respect to the xy plane) to pick up the semiconductor material P from the wafer W. [ Therefore, the loader picker 243 can be movable in the x, y, and z axis directions. In FIG. 2, the second conveyance picker support member 221 and the loader picker rail 244 are shown as the same members, but they may be provided as separate members.

 The loader picker 243 can pick up the semiconductor material P using a vacuum adsorption method. The loading process is as follows.

The loading unit 70 may include an ejector 245. Since the semiconductor material P is attached on the adhesive tape T, the loader picker 243 physically isolates the semiconductor material P and the adhesive tape T in addition to the operation of vacuum- It is necessary to add an external force. The ejector 245 pushes up the semiconductor material P in a state in which the semiconductor material P is vacuum-adsorbed to the loader picker 243 so as to separate the semiconductor material P from the adhesive tape T, T) can be used to pull it down.

The ejector 245 may be movable along the ejector rail 246 in the x-axis direction. The loading table 241 can move in the y-axis direction and the ejector 245 can move in the x-axis direction, so that the semiconductor material P can be loaded over the entire area of the wafer W. [

The loader picker 243 may be provided with a pickup unit arranged in a line in the y-axis direction. The loader picker 243 moves along the loader picker rail 244 in the y axis direction to pick up a plurality of semiconductor materials P at one time to improve the efficiency of the work process. The loader picker 243 picks up the semiconductor material P from the loading part 240 and places it on the seat block 250.

The sheet block 250 is a means for temporarily loading the semiconductor material P to inspect the first side. The seat block 250 can move in the y axis direction along the seat block rail 251 and a downlooking vision 252 for inspecting the first side of the semiconductor material P on the seat block rail 251 . The first surface may be a solder ball or a surface to which the wire is bonded, and the down-looking vision 252 may check the bonding state and the placement state of the ball or the wire.

At least two sheet blocks 250 may be provided. FIG. 2 shows two sheet blocks 250 arranged in the x-axis direction. By using the two sheet blocks 250, the waiting time for the loader picker 243 or the offloader picker 260 to wait during the inspection process can be reduced. When two or more sheet blocks 250 are provided, the downlooking vision 252 can be moved in the x-axis direction along the vision rail 253, and all the sheet blocks 250 on each sheet block rail 251 can be inspected Do.

The offloader picker 260 can move in the y axis direction on the subordinate guide rail 202 on the offloader picker rail 261 moving in the x axis direction. Further, the offloader picker 260 is movable in the z-axis direction (height direction with respect to the xy plane), so that the semiconductor material P can be loaded on the good- Accordingly, the offloader picker 260 can be movable in the x, y, and z axis directions.

Although the loader picker 243 and the offloader picker 260 are described above as means for performing separate functions, the two devices 243 and 260 can perform the loading operation and the offloading operation concurrently. That is, both devices 243 and 260 may be involved in the loading operation, and both devices 243 and 260 may be involved in the offloading operation.

The uplink vision 254 can be installed under the path of the offloader picker 260 to inspect the second side of the semiconductor material P picked up by the offloader picker 83. The second side may be the marking surface and the uplinking vision 254 may examine the surface for scratches, chipping, or marking.

The semiconductor material P having both sides checked by the downlooking vision 252 and the uplink vision 254 is classified into a good product and a defective product so that the good product is classified into the offloading portion 270 and the defective product is classified into the reject portion 280, Lt; / RTI >

The offloading unit 270 includes a good-quality loading unit 272 for loading and receiving the good-quality semiconductor material from the offloader picker 260, a good-quality tray loading unit 271 for storing a tray filled with the good-quality semiconductor material, And a tray feeder 273 for feeding the tray 92. [

The good-quality tray filled with the good-quality semiconductor material from the offloader picker 260 is stored in the good-quality tray loading unit 271 and the good-quality tray is supplied from the tray supplying unit 273 to the good- . At this time, a tray picker 274 which moves in the x-axis direction along the sub-guide rail 202 is provided between the good-quality tray loading portion 271, the good-loading portion 272 and the tray supplying portion 273, The tray picker 274 is supported on the tray picker support member 275 and can move along the sub guide rail 202.

In FIG. 2, the offloader picker rail 261 and the tray picker support member 275 are shown as the same members, but they may be provided as separate members.

The reject unit 280 is a place where the semiconductor material P judged to be defective by the inspection apparatus is collected. The seat block 250, the down looking vision 252, the up-look vision 254, and the reject portion 280 of the semiconductor material cutting loader according to the embodiment of the present invention can be positioned adjacent to each other in the y- have. As shown in FIG. 2, the seat block 250 moves in the y-axis direction along the seat block rail 251, and is not inspected by the down-look vision 252, thereby requiring no separate operation for inspection. The offloader picker 260 picks up the semiconductor material P from the seat block 250 and is immediately inspected by the uplink vision 254 positioned below the y-axis direction of the seat block rail 251, The front surface inspection of the semiconductor material P can be completed by moving the distance. The semiconductor material P determined to be defective can be judged as being inferior to the uplinking vision 254 in the direction of the y axis of the uplink vision 254. [ It can be collected in the reject part 280 positioned thereon, so that the working time can be shortened.

The semiconductor material cutting and stacking apparatus according to the second embodiment of the present invention may include an intermediate supply unit 110 capable of providing a wafer W under the y axis direction of the work waiting unit 201. [ The semiconductor material cutting and stacking apparatus according to the embodiment of the present invention is a device for cutting semiconductor material P through a series of processes of a feeder 1, a cutting device 2, an ultraviolet irradiator 3, . ≪ / RTI > However, it is desirable to use a cut wafer (CW) and to use a wafer (CW) which does not require an ultraviolet ray irradiation process, in order to enhance the operability of the equipment.

The intermediate supply part 110 may include a middle supply part rail (not shown) to supply the wafer CW to the work standby part 201 by loading the cut wafer CW and to smooth the supply process .

The transfer pickers 210 and 220 transport the wafer CW and wait the wafer CW in the work standby portion 201 when the cut wafer CW that does not require the ultraviolet irradiation process is loaded on the intermediate supply portion 110 , The wafer (CW) may be transferred to the loading unit (240) to start the sorting process. On the other hand, when the cut wafer (CW) requiring the UV irradiation process is loaded, the wafer (CW) is moved to the work waiting portion 201 by the transfer pickers 210 and 220, The wafer CW may be picked up and placed in the ultraviolet ray irradiation standby portion 50 to prepare the ultraviolet ray irradiation process.

By including the intermediate supply unit 110 as described above, not only a series of semiconductor material processes but also a cutting process and an ultraviolet irradiation process can be selected as options, thereby widening the operation of the apparatus.

The intermediate feeder 110 not only loads cut wafers CW for the selective process as described above but also has a function of retrieving the support frame F from which all the semiconductor material P is picked up by the loading unit 240 . ≪ / RTI >

3 is a view showing a semiconductor material cutting and stacking apparatus according to a third embodiment of the present invention.

1, the feeding device 1, the cutting device 2, and the ultraviolet irradiating device 3 are the same. 3, the description will be made with reference to the classification storage device 300 according to the third embodiment. The classification storage apparatus 300 according to the third embodiment simplifies the off-loading process by omitting a separate inspection process when only one piece of the semiconductor material (marking surface) is recorded with the positive information on the material or only the semiconductor material of the good article The speed of the work process can be improved.

3, the sorting apparatus 300 according to the third embodiment of the present invention includes transfer pickers 310 and 320 for transferring wafers, a loading unit 340 for loading the semiconductor material P, An offloader 360 for picking up the semiconductor material P from the loading unit 340 and loading the offloading unit 360 on the offloading unit 360 and an inspection vision 352.

The wafer W that has been irradiated with ultraviolet rays in the ultraviolet ray irradiating section 53 is supplied to the work standby section 301 by the transfer pickers 310 and 320. The transporting picker may include a first transporting picker 310 and a second transporting picker 320. The first conveying picker 310 is supported by a first conveying picker support member 311 moving in the x axis direction on the sub guide rail 302 and the second conveying picker 320 is supported on the sub guide rail 302 and is supported by a second transporting-picker supporting member 321 moving in the x-axis direction. The two transfer pickers 310 and 320 can carry the wafer W by vacuum suction.

3 shows that the main guide rail 6 and the sub guide rail 302 are positioned in the same x-axis direction in order to simplify the equipment. However, the present embodiment is preferably located on the same axis for the purpose of simplifying the apparatus.

The transfer pickers 310 and 320 can function as wafer W alignment means. This is the same as that described with reference to FIG. 2, and therefore, a detailed description thereof will be omitted.

The transfer pickers 310 and 320 can pick up the wafer W from the ultraviolet ray irradiation standby portion 50 and transfer the wafer W to the loading table 341 located in the work standby portion 301 to mount the wafer W thereon. The loading table 341 can support the wafer W by a vacuum suction method and can be installed to be movable in the y axis direction along the loading table rail 342, (340).

The loading unit 340 is disposed at a position where the loading table 342 moves along the loading table rail 342 in the y axis direction and meets the offloader picker rail 351 and is transported by the offloader picker 350 to the individual semiconductor material P ). ≪ / RTI >

The offloader picker 350 can move in the x-axis direction on the offloader picker rail 351, and the loading operation and the offloading operation can be performed in parallel. The offloader picker 350 can move in the z-axis direction (height direction with respect to the xy plane) to pick up and load the semiconductor material P from the wafer W, move in the z- The semiconductor material P can be loaded and offloaded. The offloader picker 350 can pick up the semiconductor material P using a vacuum adsorption method. The process of loading and offloading will be described in detail below.

The loading unit 340 may include an ejector (not shown). Description of the ejector (not shown) is the same as or similar to that described with reference to FIG. 1 or FIG. 2, and thus a detailed description thereof will be omitted.

The offloader picker 350 may be provided with a pickup unit arranged in a line in the x-axis direction. The offloader picker 350 can pick up a plurality of semiconductor materials P at one time while moving in the x-axis direction along the offloader picker rail 351, thereby improving the efficiency of the work process.

The uplink vision 352 can be installed under the path of the offloader picker 350 to inspect the second side of the semiconductor material P picked up by the offloader picker 350. The second side may be the marking surface and the marking of the surface may be inspected by the uplink vision 352. The marking on the second side may include information on the ammunition of the semiconductor material (P).

The classification storage apparatus 300 according to the third embodiment of the present invention is configured such that the uplink vision 352 is installed on the path of the offloader picker 350 between the loading unit 340 and the offloading unit 360, No work is required for the inspection process. Therefore, if the second side of the semiconductor material P is inspected during the movement of the offloader picker 350, and if it is judged as a good product through the positive judgment, it is immediately loaded on the off-loading unit 360, .

The offloading unit 360 is a means for transferring and receiving a good semiconductor material from the offloader picker 350. The reject unit 370 is a means for transferring the semiconductor material P determined to be defective by the uplink vision 352, Is collected.

In the above description, it is described that the semiconductor material P is preceded by the positive judgment or the positive judgment is not required. However, the classification storage apparatus 300 according to the third embodiment of the present invention includes an inspection process for positive judgment You may. At this time, a vision for picking up the semiconductor material P is provided on the upper part of the wafer W including the alignment vision 330 to inspect the first surface of the semiconductor material P, State, and so on. It is also possible to inspect both sides of the semiconductor material P by checking the marking state in the uplink vision 352.

As shown in FIG. 3, at least two of the work waiting unit 301, the loading unit 340, the offloader picker 350, and the uplink vision 352 may be provided to improve work process efficiency. 3 shows a state in which the work waiting unit 301 is located on both sides in the x direction with respect to the offloading unit 360 and the transfer pickers 310 and 320 alternately transfer the wafers W to the two work waiting units 301 Can be seated. The loading table 341 of the work waiting unit 301 moves to the loading unit 340 after the wafer W is seated and starts the loading operation and the off loading operation and this operation is performed simultaneously in the loading units on both sides . At this time, the off-loading picker 350 and the off-loading picker rail 351 may be positioned adjacent to each other on the y-axis and downward.

The semiconductor material cutting and stacking apparatus according to the third embodiment of the present invention may include an intermediate supply unit 110 capable of providing the wafer W between the two work waiting units 301. [ The semiconductor material cutting and stacking apparatus according to the embodiment of the present invention is a device for cutting semiconductor material P through a series of processes of a feeder 1, a cutting device 2, an ultraviolet irradiator 3, . ≪ / RTI > However, it is desirable to use a cut wafer (CW) and to use a wafer (CW) which does not require an ultraviolet ray irradiation process, in order to enhance the operability of the equipment.

The intermediate supply part 110 may include the intermediate supply part rail 111 to supply the wafer CW to the work standby part 301 by loading the cut wafer CW and smooth the supply process.

When the cut wafer (CW) which does not require the ultraviolet ray irradiation process is loaded on the intermediate supply unit 110, the transfer pickers 310 and 320 carry the wafer CW and wait the work waiting unit 301 , The wafer (CW) may be transferred to the loading unit 340 to start the sorting process. On the other hand, when the cut wafer (CW) requiring the ultraviolet ray irradiation process is loaded, the wafer (CW) is picked up by the transfer pickers (310, 320) and waits in the ultraviolet ray irradiation standby section (50) can do.

By including the intermediate supply unit 110 as described above, not only a series of semiconductor material processes but also a cutting process and an ultraviolet irradiation process can be selected as options, thereby widening the operation of the apparatus.

The intermediate feeder 110 not only loads cut wafers CW for the selective process as described above but also has a function of retrieving the support frame F from which all the semiconductor material P is picked up by the loading unit 240 . ≪ / RTI >

1: feeding device, 2: cutting device,
3: ultraviolet irradiation device, 4: sorting device,
5: unit picker, 6: main guide rail,
10: inlet portion, 11: magazine,
20: alignment part, 21: first alignment picker,
22: drawing gripper, 23: inlet rail,
24: guide pin, 25: alignment table,
30: cut portion, 31: second alignment picker,
32: chuck table, 33: cutter,
40: washing section, 41: spinner table,
50: ultraviolet irradiation stand, 51: waiting table,
52: rail, 53: ultraviolet irradiation part,
60: work stand, 61: rail,
70: loading part, 71: conveying gripper,
72: rail, 73: loading table,
74: loader picker, 75: inspection vision,
81: presciser, 82: downlooking vision,
83: offloader picker, 84: uplooking vision,
85: Picker rail, 90: Offloading section,
91: Good-quality loading part, 92: Good-quality tray,
93: a tray feeder, 94: a tray feeder rail,
95: good-quality tray loading section, 96: tray feeding section,
97: Tray picker, 98: Tray picker rail,
100: reject part, 101: reject tray,
110: intermediate supply part, 111: intermediate supply part rail,
201: working stand, 202: sub guide rail,
210: first transporting picker, 211: first transporting picker supporting member,
220: second transporting picker, 221: second transporting picker supporting member,
230: alignment vision, 240: loading section,
241: a loading table, 242: a loading table rail,
243: Loader picker, 244: Loader picker rail,
245: ejector, 246: ejector rail,
250: seat block, 251: seat block rail,
252: downlooking vision, 253: vision rail,
254: uplinking vision, 260: offloader picker,
261: an offloader picker rail, 270: an offloading section,
271: Loading tray for good paper, 272: Loading part for good paper,
273: a tray supply unit, 274: a tray picker,
275: tray picker supporting member, 280: reject portion,
301: work standby portion, 302: sub guide rail,
310: first transporting picker, 311: first transporting picker supporting member,
320: second transporting picker, 321: second transporting picker supporting member,
330: alignment vision, 340: loading section,
341: Loading table, 342: Loading table rail,
350: offloader picker, 351: offloader picker rail,
352: uplinking vision, 360: offloading section,
370: Reject section

Claims (8)

A wafer supply unit;
A cutting device for cutting the supplied wafer;
An ultraviolet ray irradiating device for irradiating the cut wafer with ultraviolet rays; And
And a sorting device for loading the semiconductor material from the wafer and offloading the semiconductor material from the wafer to the offloading part,
The sorting apparatus includes an intermediate supply unit for supplying a cut wafer,
Wherein the wafer supplied through the intermediate supply unit is offloaded to the semiconductor material via the ultraviolet irradiator and the classifying and loading device without going through the cutting device or is fed to the classifying and loading device without going through the cutting device and the ultraviolet irradiator A semiconductor material cutting loader that is offloaded by semiconductor material. The method according to claim 1,
Wherein the ultraviolet ray irradiating device includes an ultraviolet ray irradiation base portion on which the wafer transferred from the cutting device is seated and an ultraviolet ray irradiating portion for transferring the wafer from the ultraviolet ray irradiation base portion to irradiate the ultraviolet ray,
The classification stacking apparatus includes a working standby portion on which the wafer carried by the ultraviolet light emitting device is seated, a loading portion picking up the semiconductor material from the wafer, and a conveying gripper for conveying the wafer between the working waiting portion and the loading portion ≪ / RTI &
Further comprising a unit picker for transferring the wafer between the ultraviolet ray irradiating base portion of the ultraviolet irradiating apparatus and the work standby portion of the classification loading apparatus,
And the transfer gripper supplies the wafer from the intermediate supply unit to the job waiting unit. The method according to claim 1,
Wherein the ultraviolet ray irradiating device includes an ultraviolet ray irradiation base portion on which the wafer transferred from the cutting device is seated and an ultraviolet ray irradiating portion for transferring the wafer from the ultraviolet ray irradiation base portion to irradiate the ultraviolet ray,
The classification and stacking apparatus includes a work standby unit on which the wafer carried by the ultraviolet light irradiating apparatus is placed, a loading unit for picking up the semiconductor material from the wafer, and a transporting picker for transporting the wafer between the work waiting unit and the loading unit ≪ / RTI &
Further comprising a unit picker for transferring the wafer between the ultraviolet ray irradiating base portion of the ultraviolet irradiating apparatus and the work standby portion of the classification loading apparatus,
And the wafer is supplied from the intermediate supply unit to the job waiting unit. The method according to claim 1,
Wherein the ultraviolet ray irradiating device includes an ultraviolet ray irradiation base portion on which the wafer transferred from the cutting device is seated and an ultraviolet ray irradiating portion for transferring the wafer from the ultraviolet ray irradiation base portion to irradiate the ultraviolet ray,
The classification stacking apparatus includes a transfer picker for transferring a wafer from an ultraviolet ray irradiating unit of the ultraviolet irradiating apparatus, a work standby unit on which the wafer transferred by the transfer picker is seated on a loading table, And a loading section for picking up the material,
Wherein the loading table is provided in a pair so that the wafer is transferred from the transfer picker alternately and transfers the wafer while moving between the work waiting portion and the loading portion,
And the wafer supplied from the intermediate supply unit is transferred to the job waiting unit by the transfer picker. The method according to claim 1,
Characterized in that the intermediate supply unit performs the function of loading to supply the cut wafer for the selective process or the function of collecting the empty wafer after all of the semiconductor material is offloaded from the wafer in the classification stacking apparatus Semiconductor material cutting load device. 5. The method according to any one of claims 2 to 4,
The sorting apparatus includes a presciser having a plurality of loading grooves for temporary loading of the semiconductor material from the loading section,
A downlooking vision for inspecting an upper surface of the semiconductor material loaded on the presciser;
An offloader picker for picking up the semiconductor material for which top surface inspection has been completed and loading the semiconductor material on the offloading unit;
Further comprising an uplink vision for inspecting a lower surface of the semiconductor material picked up by the offloader picker. The method according to claim 6,
Wherein said downlooking vision inspects a ball side or a lead side of said semiconductor material and said uplink vision inspects a marking surface or a mold surface of said semiconductor material. Wherein a wafer, strip, or wafer level package attached with an adhesive tape on a support frame is supplied,
Wherein the wafer, strip, or wafer level package is cut,
Irradiating the wafer, strip, or wafer level package with ultraviolet light to weaken the adhesive strength of the adhesive tape,
Loading individual semiconductor materials from the wafer, strip, or wafer level package,
Inspecting the semiconductor material to determine a good product and a defective product; and
And a step of classifying and offloading the semiconductor material into a good product and a defective product according to the determined information, in succession; or
Irradiating the cut wafer, strip, or wafer level package provided from the intermediate supply unit with ultraviolet light to attenuate the adhesive force of the adhesive tape,
Loading individual semiconductor materials from the wafer, strip, or wafer level package,
Inspecting the semiconductor material to determine a good product and a defective product; and
And a step of classifying and offloading the semiconductor material into a good product and a defective product in accordance with the determined information, in succession; or
Loading individual semiconductor materials from the cut wafer, strip, or wafer level package provided from the intermediate supply,
Inspecting the semiconductor material to determine a good product and a defective product; and
A third process in which the step of classifying and offloading the semiconductor material into a good product and a defective product according to the determined information is continuously performed; The method comprising the steps of:
KR1020130079000A 2013-07-05 2013-07-05 Cutting and Loading Apparatus of Semiconductor Materials KR20150005269A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170090795A (en) * 2016-01-29 2017-08-08 한미반도체 주식회사 Semiconductor Package Processing Apparatus
KR20190060493A (en) * 2017-11-24 2019-06-03 한미반도체 주식회사 Sawing Apparatus of Semiconductor Materials
KR20220078361A (en) * 2020-12-03 2022-06-10 세메스 주식회사 Apparatus for transporting semiconductor chip and sawing sorter system including the same
KR20230011159A (en) * 2021-07-13 2023-01-20 한미반도체 주식회사 Sawing method of semiconductor materials

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170090795A (en) * 2016-01-29 2017-08-08 한미반도체 주식회사 Semiconductor Package Processing Apparatus
KR20190060493A (en) * 2017-11-24 2019-06-03 한미반도체 주식회사 Sawing Apparatus of Semiconductor Materials
KR20220078361A (en) * 2020-12-03 2022-06-10 세메스 주식회사 Apparatus for transporting semiconductor chip and sawing sorter system including the same
KR20230011159A (en) * 2021-07-13 2023-01-20 한미반도체 주식회사 Sawing method of semiconductor materials

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