KR20190143019A - Dry apparatus of semiconductor package - Google Patents

Abstract

Disclosed is a semiconductor package drying apparatus, which includes: a loading module capable of a receiving state on which a semiconductor package is loaded and a drying state forming a drying air current in an upper direction; and a flipper module capable of a drying mode moving on the loading module, forming the drying air current in a lower direction, and drying an upper surface of the semiconductor package loaded on the loading module and a pick-up mode picking up the semiconductor package loaded on the loading module and moving the same on the loading module.

Description

Semiconductor Package Drying Equipment {DRY APPARATUS OF SEMICONDUCTOR PACKAGE}

The present application relates to a semiconductor package dry apparatus.

The semiconductor package manufacturing system includes a cutting step of cutting a semiconductor package cut from a strip in which a plurality of semiconductor packages are formed, a washing step of washing the semiconductor package cut in the cutting step, a drying step of drying the cleaned semiconductor package in the washing step, and drying The semiconductor package inspection process that checks whether the completed semiconductor package is defective and the offload process that classifies the semiconductor package that passed the defect inspection and the semiconductor package that failed the inspection are sequentially performed according to the inspection result. Individual semiconductor packages can be manufactured.

By the way, in the conventional semiconductor package manufacturing system, in the drying apparatus for drying the wash | cleaned semiconductor package, the heater was built in the plate in which the wash | cleaned semiconductor package was loaded, and the lower surface of the semiconductor package was dried by heat-generating the plate. As a result, the lower surface of the semiconductor package had a side surface in which the dried liquid stain remained.

Background art of the present application is disclosed in Korea Patent Publication No. 10-0904496.

The present invention is to solve the above-mentioned problems of the prior art, an object of the present invention is to provide a semiconductor package dry device that can dry the semiconductor package clean and easy to avoid stains on the upper and lower surfaces of the semiconductor package.

However, the technical problem to be achieved by the embodiments of the present application is not limited to the technical problems as described above, and other technical problems may exist.

As a technical means for achieving the above technical problem, a semiconductor package drying apparatus according to an embodiment of the present application, the loading module capable of forming a dry state to form a dry air flow in the receiving state and the upper direction in which the semiconductor package is loaded; And a drying mode for drying the upper surface of the semiconductor package loaded on the loading module by forming a drying airflow in the downward direction while moving on the loading module, and a pickup mode for picking up the semiconductor package loaded on the loading module and moving on the loading module. The flipper module may be included.

According to an embodiment of the present application, the flipper module, at the receiving state of the stacking module, enters the drying mode and includes at least a portion of an upper surface of the semiconductor package loaded on the stacking module using its dry airflow. The portion may be dried, and in the dry state of the stacking module, the pickup mode may be dried to dry a portion including at least a portion of the lower surface of the semiconductor package picked up using the dry airflow of the stacking module.

According to an embodiment of the present disclosure, the stacking module may include: a stacking unit in which a semiconductor package is loaded and movable up and down; And a first drying part provided at a rear side of the loading part along a longitudinal direction of the loading part and forming a drying air flow in an upward direction, wherein the flipper module includes the first drying part such that a length direction corresponds to a length direction of the loading part. Located at the rear of the drying unit, the pickup is possible to pick up the semiconductor package, the pickup portion capable of rotation and forward and rearward movement; And a second drying part provided along the length direction of the pickup part between the pickup part and the loading part to form a dry air flow in a downward direction.

According to an embodiment of the present application, in the receiving state of the stacking module, the stacking portion is loaded so that the semiconductor package exposes the upper surface upward and moves downward to be positioned below the second drying portion, and the second drying portion. The part moves forward and backward on the loading part and forms a dry airflow in a downward direction to perform the drying mode. In the dry state of the loading module, the pickup part exposes the lower surface of the semiconductor package on the loading part downward. Pick up and move forward and backward on the first drying unit, the first drying unit may form a dry air flow in the upper direction from the lower side of the pickup.

According to the exemplary embodiment of the present application, when the semiconductor package delivered from the cleaning apparatus is loaded, the loading unit and the first drying unit are in the accommodation state for a first predetermined time, and the second drying unit is the first predetermined time. While the drying mode is performed, and the pickup unit picks up the semiconductor package loaded in the loading unit after the first predetermined time and performs the pickup mode for a second predetermined time, and the first drying unit is configured to perform the pickup mode. It may be in the dry state for a predetermined time.

According to one embodiment of the present application, the loading portion may be a material that can be deformed in response to an external force applied by the semiconductor package loaded thereon.

The above-mentioned means for solving the problems are merely exemplary and should not be construed as limiting the present application. In addition to the above-described exemplary embodiments, additional embodiments may exist in the drawings and detailed description of the invention.

According to the above-described problem solving means of the present application, when the semiconductor package is loaded on the stacking module, the flipper module moves on the stacking module and forms a dry airflow in the downward direction so that the portion including the upper surface of the semiconductor package is dried by the airflow. The portion including the bottom surface of the semiconductor package may be dried by the airflow when the semiconductor package is moved on the loading module in a state where the semiconductor package is picked up by the flipper module. Accordingly, since not only the upper surface of the semiconductor package but also the lower surface thereof may be dried by dry airflow, stains may remain in the semiconductor package.

In addition, according to the above-described problem solving means of the present application, when the semiconductor package is loaded on the stacking module, the flipper module moves on the stacking module and forms a dry air stream in the downward direction so that the portion including the upper surface of the semiconductor package is caused by the airflow. Best drying of the semiconductor package by drying both the top and bottom surfaces of the semiconductor package by drying the air flow upwards when the semiconductor module is picked up by the flipper module and moving on the loading module. The state can be maintained and the drying efficiency of a semiconductor package can be improved.

1 is a perspective view of a semiconductor package dry apparatus according to an embodiment of the present application before a semiconductor package is loaded.
2 is a perspective view of a semiconductor package dry apparatus according to an embodiment of the present disclosure in which a semiconductor package transferred from a cleaning apparatus is loaded into a loading unit.
3 is a perspective view of a semiconductor package dry apparatus according to an exemplary embodiment of the present disclosure in which the loading unit moves downward.
4 is a perspective view of a semiconductor package dry apparatus according to an embodiment of the present disclosure in which a stacking module is in a housed state and a flipper module is in a drying mode.
5 is a perspective view of a semiconductor package dry apparatus according to an exemplary embodiment of the present disclosure in which a pickup unit is rotated.
6 is a perspective view of a semiconductor package dry apparatus according to an embodiment of the present disclosure in which the loading module is in a dry state and the flipper module is in a pickup mode.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present disclosure. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted for simplicity of explanation, and like reference numerals designate like parts throughout the specification.

Throughout this specification, when a portion is "connected" to another portion, this includes not only "directly connected" but also "electrically connected" with another element in between. do.

Throughout this specification, when a member is said to be located on another member "on", "upper", "top", "bottom", "bottom", "bottom", this means that any member This includes not only the contact but also the presence of another member between the two members.

Throughout this specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding the other components unless specifically stated otherwise.

In addition, in the description of the embodiments of the present application, terms related to directions or positions (upper, lower, front, rear, etc.) are set based on the arrangement state of each component shown in the drawings. For example, as shown in FIGS. 1 to 6, the 12 o'clock direction may be generally higher, the 6 o'clock direction is generally lower, the 8 o'clock is generally forward, and the 2 o'clock is generally backward.

The present application relates to a semiconductor package dry apparatus.

Hereinafter, a semiconductor package dry apparatus (hereinafter referred to as “the present dry apparatus”) according to an exemplary embodiment of the present application will be described.

Referring to FIG. 1, the dry apparatus includes a loading module 1. The stacking module 1 may be in a state in which the semiconductor package P is loaded and in a dry state in which the airflow is formed in an upward direction. In other words, the loading module 1 may have an accommodating state in which the semiconductor package P is loaded, or may have a dry state which forms a dry airflow in an upward direction.

Here, the accommodating state of the stacking module 1 may mean a state in which the semiconductor package P is stacked on the stacking module 1.

Specifically, referring to FIG. 1 and FIG. 2, the loading module 1 may include a loading part 11 in which the semiconductor package P is loaded and capable of vertically moving. The plurality of semiconductor packages P loaded on the loading unit 11 may be subjected to a cleaning process. In other words, referring to FIG. 2, the semiconductor package P transferred from the cleaning apparatus through the cleaning process may be loaded in the loading unit 11. In addition, the semiconductor package P may be loaded on the mounting part 11 so that the upper surface thereof is exposed upward. The mounting part 11 may vacuum-absorb the semiconductor package P. For example, the semiconductor package P may be seated on the mounting portion 11 such that the bottom surface thereof contacts the top surface of the mounting portion 11. In addition, referring to FIG. 2, a plurality of semiconductor packages P may be arranged in the stacking unit 11 in n rows × m columns.

In addition, the dry state of the loading module 1 may mean that the loading module 1 discharges gas in an upward direction to form a dry airflow. For example, the upper direction may include a direction (about 10 o'clock to 11 o'clock) inclined by a predetermined angle from the vertical direction to the left. Accordingly, the resulting dry airflow can be propagated (transmitted) in various directions in the space as well as in the upward direction.

Specifically, referring to FIG. 1 and FIG. 3, the loading module 1 may include a first drying part 12 provided along the longitudinal direction of the loading part 11 at the rear of the loading part 11. have. The first drying unit 12 may form a dry air stream in an upward direction. For example, the first drying unit 12 may form a dry air stream propagating in various directions in the space by discharging gas in an upward direction. For example, the first drying unit 12 may include a plurality of gas discharge units for discharging gas, and the plurality of gas discharge units may be disposed along a length direction of the loading unit 11. Moreover, the 1st drying part 12 can be arrange | positioned along the longitudinal direction of the loading part 11, and can make the dry airflow which it forms in the longitudinal direction of the loading part 11. FIG. In addition, according to the exemplary embodiment of the present application, the plurality of first drying units 12 may move or rotate in the vertical direction at the side of the loading unit 11 to form a dry air stream in various directions.

In addition, referring to Figure 1, the dry device includes a flipper module (2). The flipper module 2 moves on the loading unit 11 and forms a drying airflow in the downward direction to dry the upper surface of the semiconductor package P loaded on the loading module 1 and to the drying module 1. A pickup mode in which the semiconductor package P to be loaded is picked up and moved on the stacking module 1 is possible.

Specifically, referring to FIG. 1, the flipper module 2 may include a pickup unit 21. 1 and 5 together, the pickup unit 21 is rotatable. For example, the pickup portion 15 may be rotated such that its upper surface faces downward. 1 and 6 together, the pickup unit 21 is capable of moving forward and backward. The pick-up unit 21 may pick up the semiconductor package P by suction. For example, the pick-up part 21 is rotated so that the upper surface on which the semiconductor package P is adsorbed is directed downward, and then moves forward and, in other words, moves onto the loading part 11 and loads the loading part 11. The semiconductor package P can be absorbed and picked up. In addition, the pickup unit 21 may perform the pickup mode by moving forward and backward in the state of picking up the semiconductor package P. FIG. In addition, the forward and backward movement of the pickup unit 21 may be linked with the forward and backward movement of the second drying unit 22. In addition, the rotation of the pickup unit 21 may be made independently of the second drying unit 22. The flipper module 2 may rotate the pickup unit 21 so that the driving of the pickup unit 21 and the second drying unit 22 is performed, and the pickup unit 21 and the second drying unit 22 are rotated. It may include a jig unit 23 that can move the front and rear direction.

More specifically, referring to FIG. 1, the pickup part 21 may be located at the rear of the first drying part 12 so that the longitudinal direction corresponds to the longitudinal direction of the loading part 11. Accordingly, the pick-up unit 21 may pick up the semiconductor package P loaded on the stacking unit 11 by moving onto the stacking unit 11 only by moving in the front-rear direction without moving in the longitudinal direction. In other words, the pickup section 21 is located behind the first drying section 12 so that its longitudinal direction corresponds to the longitudinal direction of the stacking section 11, thereby picking up the semiconductor package P on the stacking section 11. It is possible to simplify the moving copper wire that moves to move and the forward and backward moving copper wire on the loading section 1 in order to do so.

In addition, referring to FIG. 1, the flipper module 2 may include a second drying unit 22. Referring to FIGS. 1 and 4, the second drying unit 22 is provided along the length direction of the pickup unit 21 (loading unit 11) between the pickup unit 21 and the loading unit 11 so as to be lowered. Dry airflow can be formed in the direction. For example, the lower direction may include a direction (about 5 o'clock) inclined by an angle from the lower vertical direction to the right. For example, the second drying unit 32 may form a dry air stream propagating in various directions on the space by discharging the gas in the downward direction. For example, the second drying unit 22 may include a plurality of gas discharge units for discharging gas, and the plurality of gas discharge units may be disposed along the longitudinal direction of the pickup unit 21. In addition, the second drying unit 22 may move in the front-rear direction. For example, referring to FIG. 1, the second drying unit 22 may be provided to be connected to the pickup unit 21. Accordingly, the second drying unit 22 may move forward and backward in the pickup unit 21. It can move forward and backward in conjunction with. Moreover, since the 2nd drying part 22 is arrange | positioned along the longitudinal direction of the pick-up part 21, the dry airflow by the 2nd drying part 22 is the longitudinal direction of the pick-up part 21, ie, the longitudinal direction ( It can be formed along the longitudinal direction of the mounting portion (11). In addition, according to the exemplary embodiment of the present application, the plurality of second drying units 22 may move or rotate in the vertical direction at the side of the pick-up unit 21 to form the drying airflow in various directions.

In addition, the mounting portion 11 may be a material capable of shape deformation in response to an external force applied by the semiconductor package P loaded thereon. In other words, when the semiconductor package P is loaded, the loading part 11 may be deformed by the load of the semiconductor package P being loaded. According to this, at least a part of the mounting portion 11 is in contact with the lower surface of the semiconductor package P by the load (external force) of the semiconductor package P, and the side surface (a circumferential surface between the upper and lower surfaces) of the semiconductor package P is formed. At least in part.

In addition, the mounting portion 11 may be a material for absorbing fluid. Accordingly, when the semiconductor package P is loaded into the stacking unit 11, the stacking unit 11 may absorb at least a portion of the fluid flowing in (flowing down) from the semiconductor package P. For example, when the semiconductor package P is loaded, the loading part 11 is in contact with the lower surface of the semiconductor package P, and thus may absorb at least a portion of the fluid distributed on the lower surface of the semiconductor package P. will be. In addition, as described above, when the semiconductor package P is loaded in the loading unit 11, at least a part of the loading unit 11 is deformed by an external force by the semiconductor package P, and the side surface of the semiconductor package P is changed. At least some of them may be contacted. In this case, the mounting portion 11 may also absorb at least a portion of the fluid on the side of the semiconductor package P.

For example, such a loading portion 11 may be a porous material.

As such, the stacking portion 11 on which the plurality of semiconductor packages P are seated is made of a porous material, so that each semiconductor package may be provided without a seating groove in which each semiconductor package is seated or a sheet replacement for each size of the semiconductor package product. It can be fixed by vacuum adsorption.

In addition, a lower part of the loading part 11 is provided with a discharge part through which the fluid absorbed by the loading part 11 is discharged. The loading part 11 is formed by the airflow of the first drying part 12 and the second drying part 22. Suction and discharge unit for sucking the foreign matter (dust, etc.) separated from the) may be provided.

Hereinafter, the driving and related configurations of the dry apparatus will be described in more detail.

Referring to FIG. 2, a semiconductor package P delivered from a cleaning apparatus provided in a neighborhood of a dry apparatus may be loaded in the loading unit 11.

2 and 3, when the semiconductor package P delivered from the cleaning apparatus is loaded on the loading unit 11, the loading unit 11 and the first drying unit 12 of the loading module 1 are loaded. ) May be moved downward. At least some of the plurality of semiconductor packages P to be loaded may be in a state that needs to be dried (wet).

In addition, the stacking unit 11 and the first drying unit 12 may maintain a state moved downward in the receiving state and the drying state of the stacking module 1. In other words, in the receiving state and the drying state of the stacking module 1, the stacking section 11 and the first drying section 12 are located relatively lower than the pickup section 21 and the second drying section 22. can do. Accordingly, in the receiving state of the loading module 1, the loading portion 11 is loaded so that the semiconductor package P exposes the upper surface upward and moves downward so as to be located below the second drying portion 22. In other words, the loading part 11 may move downward with the semiconductor package P loaded so that the upper surface thereof is exposed upward and positioned below the second drying part 22 (more precisely, the front lower side). have.

3 and 4, the flipper module 2 is placed in the drying mode in the receiving state of the stacking module 1, and is loaded using its dry airflow formed by the second drying unit 22. The part including at least a part of the upper surface of the semiconductor package loaded in the module 1 may be dried. Specifically, in the receiving state of the loading module 1, the second drying unit 22 moves in the front-rear direction on the loading unit 11 moved downward and forms a dry air flow in the lower direction to perform the drying mode. Can be. According to this, a portion including at least a portion of the upper surface of the semiconductor package P loaded while exposing the upper surface upward on the mounting portion 11 may be dried by airflow. In addition, the second drying unit 22 is a loading unit so that the air flow by the second drying unit 22 can propagate in the entire range in the longitudinal direction of the held semiconductor package P loaded on the loading unit 11. It may be provided in the length range of the length of (11) or more.

In addition, in the dry state of the stacking module 1, the flipper module 2 enters the pick-up mode and uses the dry airflow formed by the first drying unit 12 of the stacking module 1 to pick up the semiconductor. The part including at least a part of the lower surface of the package P can be dried. For example, the drying state of the loading module 1 may be started after the drying mode of the flipper module 2 ends.

For example, referring to FIG. 6, in the dry state of the stacking module 1, the pickup unit 21 picks up the semiconductor package P on the stacking unit 11 so that the bottom surface thereof is exposed downward (pickup mode). ) Can move in the front-rear direction (round trip) on the stacking module 1 and the first drying unit 12, the first drying unit 12 forms a drying air flow from the lower side of the pickup portion 21 to the upper direction can do.

Specifically, the pick-up unit 21 may rotate so that its upper surface, which is capable of adsorption of the semiconductor package P, faces downward, may move forward and be located on the stacking unit 11, and the stacking unit 11 ), The semiconductor package P loaded in the package can be vacuum-adsorbed. When the pickup part 21 is positioned on the loading part 11, the loading part 11 moves upward to move the semiconductor package P loaded on the loading part 11 downward. The upper surface may be approached, and the pickup 21 may adsorb the upper surface of the approaching semiconductor package P. In this way, the adsorption of the semiconductor package P of the pickup unit 21 may be performed. Alternatively, as another example, after the pickup 21 is positioned on the mounting portion 11, the upper surface of the pickup portion 21 is moved downward and faces downward to the semiconductor package P loaded on the loading portion 11. And the pick-up part 21 performs suction (suction) to adsorb the semiconductor package P. According to this, the upper surface of the semiconductor package P may be absorbed by the upper surface of the pickup portion 21 and the lower surface thereof may be exposed downward.

As such, the pickup unit 21 that absorbs the semiconductor package P may perform the pickup mode by moving in the front-rear direction on the first drying unit 12. In addition, in the pickup mode of the pickup unit 21 (in the dry state of the loading module 1), the first drying unit 12 may form a dry air flow in the upward direction from the lower side of the pickup unit 21. According to this, since the semiconductor package P picked up by the pickup unit 21 is moved in the front-rear direction and exposed to the dry air stream on the dry air stream formed by the first drying unit 12, a dry air stream is formed. A portion including at least a portion of the lower surface of the semiconductor package P having the lower portion exposed to the lower side may be dried. In this manner, the present dry device can dry the lower surface of the semiconductor package P with airflow. In addition, the first drying unit 12 is the pickup unit 21 so that the air flow by the first drying unit 12 can propagate in the entire range in the longitudinal direction of the semiconductor package P held by the pickup unit 21. (Or the loading portion 11) may be provided in the length range or more.

As such, according to an exemplary embodiment of the present application, when the semiconductor package is loaded in the stacking module, the flipper module moves on the stacking module and forms a dry airflow in a downward direction so that the portion including the upper surface of the semiconductor package is dried by the airflow. When the semiconductor package is moved on the loading module with the semiconductor package picked up by the flipper module, the portion including the bottom surface of the semiconductor package may be dried by the airflow by forming the drying airflow upward. Accordingly, since not only the upper surface of the semiconductor package but also the lower surface thereof may be dried by a drying air stream, staining of the semiconductor package may be prevented, unlike the prior art of removing moisture from the semiconductor package by heat. In addition, by drying both the upper and lower surfaces of the semiconductor package, it is possible to maintain the best drying state of the semiconductor package and to increase the drying efficiency of the semiconductor package.

According to the above, this dry apparatus can be driven in the following steps.

First, when the semiconductor package P delivered from the cleaning apparatus is loaded, the stacking unit 11 and the first drying unit 12 move downward and pick up the unit 21 and the second drying unit for the first predetermined time. The semiconductor package P is loaded at a position lower than the position 22 to have an accommodating state, and the second drying unit 22 has a dry airflow thereunder on the mounting unit 11 for a first predetermined time. The drying mode can be performed by moving in the front-rear direction while forming a. Accordingly, the portion including at least a portion of the upper surface of the semiconductor package P can be dried by the air flow.

After the first predetermined time, the pickup part 21 may move onto the loading part 11 to pick up the semiconductor package P loaded in the loading part 11, and in the state of picking up the semiconductor package P. The pickup mode may be performed by moving in the front-rear direction on the first drying unit 12 for a second predetermined time. To this end, the pick-up section 21 has its top surface before picking up the semiconductor package P (for example, at one time before the first predetermined time, during the first predetermined time and after the first predetermined time). The semiconductor package P on the mounting portion 11 may be picked up by rotating downward. According to this, the semiconductor package P may be reciprocated in the front-rear direction on the first drying unit 12 with the lower surface (lower portion) exposed downward. In addition, during the second predetermined time, the first drying unit 12 may be in a dry state by forming a dry air stream in an upward direction. As a result, the semiconductor package P may be reciprocated in the front-rear direction on the dry air stream formed by the first drying unit 12 while the lower surface of the semiconductor package P is exposed downward for a second predetermined time. The portion comprising at least a portion of can be dried by airflow.

After the second predetermined time, the pick-up part 21 can reposition (reload) the semiconductor package P which he picked up (gripping) to the loading part 11. Repositioning process of the semiconductor package P Also, similarly to the adsorption process of the semiconductor package P, when the pickup 21 is located on the loading section 11, the loading section 11 is moved upwards or The pickup unit 221 may include a process of moving in the downward direction. For reference, the first predetermined time may mean a time at which a portion including at least a portion of the upper surface of the semiconductor package may be dried by a dry air flow, and more preferably, a portion including the entire upper surface may be dried. It can be time. In addition, the second predetermined time may mean a time when the portion including at least a portion of the lower surface of the semiconductor package can be dried by the drying airflow, and more preferably, the time when the portion including the entire lower surface can be dried. Can be.

When the semiconductor package P is repositioned in the stacking section 11, the pick-up section 21 (and the second drying section 22 provided with the pick-up section 21) is at an initial position, that is, the stacking section 11. ) And the rear part of the first drying part 12, and the loading part 11 (and the first drying part 12 connected to the loading part 11) may be moved upward to an initial position, that is, It can be returned to the same level (height) position as the loading part 11.

As such, when the drying process for the semiconductor package P is completed, the semiconductor package P on the loading unit 11 may be moved to the table or vision device side where the inspection process is performed by a separate holding device for the subsequent process. have.

The above description of the present application is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present application. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present application is indicated by the following claims rather than the above description, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present application.

1: loading module
11: loading part
12: first drying unit
2: flipper module
21: pickup section
22: second drying unit
23: Jig Unit
P: semiconductor package

Claims (7)

In the semiconductor package dry device,
A loading module capable of receiving a state in which the semiconductor package is loaded and a drying state of forming a dry airflow in an upward direction; And
The drying mode which moves on the loading module and forms a dry air flow in a downward direction to dry the upper surface of the semiconductor package loaded on the loading module and the pickup mode which picks up the semiconductor package loaded on the loading module and moves on the loading module Flipper module available,
Dry device comprising a. The method of claim 1,
The flipper module,
In the accommodating state of the loading module, the drying mode is dried, and a portion including at least a part of the upper surface of the semiconductor package loaded on the loading module is dried using its drying airflow.
And in the drying state of the stacking module, a drying mode of the stacking module to dry a portion including at least a portion of a lower surface of the semiconductor package picked up therein by using a dry airflow of the stacking module. The method of claim 2,
The stacking module,
A stacking portion in which the semiconductor package is loaded and which is movable in a vertical direction; And
A first drying part provided along the longitudinal direction of the loading part at the rear of the loading part and forming a drying air stream in an upward direction;
The flipper module,
A pickup unit positioned at the rear of the first drying unit such that a longitudinal direction thereof corresponds to the longitudinal direction of the loading unit, and capable of picking up the semiconductor package, and capable of rotating and moving in the front and rear directions; And
And a second drying part provided along the longitudinal direction of the pickup part between the pickup part and the loading part to form a dry air flow in a downward direction. The method of claim 3,
In the receiving state of the loading module,
The stacking portion is mounted to expose the upper surface of the semiconductor package to the upper side and moved downward to be positioned below the second drying portion, and the second drying portion moves forward and backward on the stacking portion and forms a dry airflow in the downward direction. Perform the drying mode,
In the dry state of the loading module,
The pickup part picks up the semiconductor package on the loading part so that the bottom surface thereof is exposed downward, and moves forward and backward on the first drying part, and the first drying part forms a dry air flow from the lower side to the upper direction of the pickup part. Dry device. The method of claim 4, wherein
When the semiconductor package transferred from the cleaning apparatus is loaded in the loading unit, the loading unit and the first drying unit are moved downwards, so that the pick-up unit and the first unit are in the receiving state and the drying state of the loading module. The dry apparatus which is located below 2 drying parts. The method of claim 5,
When the semiconductor package delivered from the cleaning device is loaded, the stacking unit and the first drying unit may be in the accommodation state for a first predetermined time.
The second drying unit performs the drying mode for the first predetermined time,
The pickup unit picks up the semiconductor package loaded in the loading unit after the first predetermined time, and performs the pickup mode for a second predetermined time.
And the first drying unit is in the dry state for the second predetermined time. The method of claim 1,
And the loading portion is a material capable of shape deformation in response to an external force applied by the semiconductor package loaded thereon.

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