KR101454319B1

KR101454319B1 - Singulation Apparatus for Manufacturing Semiconductor Packages

Info

Publication number: KR101454319B1
Application number: KR1020100043528A
Authority: KR
Inventors: 정현권; 이용구
Original assignee: 한미반도체 주식회사
Priority date: 2010-05-10
Filing date: 2010-05-10
Publication date: 2014-10-28
Also published as: KR20110124000A

Abstract

The present invention relates to a singulation apparatus for manufacturing a semiconductor package, and a singing apparatus for manufacturing a semiconductor package according to the present invention includes: a loading unit for loading a plurality of wafer level packages; A transfer robot for taking out the wafer level package from the loading part and transferring the wafer level package to a post-process position; A wafer aligning unit for aligning and aligning the wafer level package transferred by the transfer robot; And a notch formed on one outer circumferential edge of the wafer level package mounted horizontally on the wafer aligning part so as to be horizontally movable on the wafer aligning part and a reference mark displayed on the upper surface of the wafer level package, A vision camera for detecting a position; A wafer picker for picking up the wafer level package aligned in the wafer aligning portion at a predetermined pickup position and transporting the wafer level package to a post-processing position; A chip tearing unit for cutting and processing the wafer level package carried by the wafer picker by individual semiconductor package units; A unit picker for transporting the individual semiconductor packages to the post-processing position in the cutting work; A vision inspection unit for inspecting whether individual semiconductor packages that have been cut and cut through the cutting process are defective; And an unloading unit for sorting the individual semiconductor packages transported through the vision inspection unit into a plurality of trays according to inspection results.

Description

[0001] Singing Apparatus for Manufacturing Semiconductor Packages [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a singing apparatus for manufacturing a semiconductor package, and more particularly, to a singulation apparatus for manufacturing a semiconductor package, singulation of the individual semiconductor packages and automatically sorting and storing individualized semiconductor packages into trays.

A semiconductor package is manufactured by attaching a plurality of semiconductor chips having a highly integrated circuit such as a transistor and a capacitor to a lead frame having a rectangular plate shape and connecting them to a pad of a lead frame through a wire bonding process, Molding the semiconductor packages on the lead frame, and then singulating the semiconductor packages on the lead frame by a package unit by singulation.

2. Description of the Related Art [0002] As semiconductor packages have diversified in recent years, a circular semiconductor package assembly (hereinafter referred to as a wafer level package (WLP)) is manufactured, and then a singulation process A new packaging technology for manufacturing a semiconductor package is being developed.

When the wafer-level package formed with the semiconductor packages is circular as described above, when the semiconductor packages formed in the wafer-level package are cut and individualized in the singulation process, the wafer level package is transferred to the cutter at the wafer level There is a high possibility that the position of the package is shifted, so that the semiconductor package is not cut along the correct cutting line at the time of cutting, and the semiconductor packages are damaged and defective.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a semiconductor wafer inspection apparatus and a semiconductor wafer inspection apparatus which are capable of accurately and quickly cutting and forming individual semiconductor packages formed in a circular wafer level package, A semiconductor device, and a semiconductor device.

According to an aspect of the present invention, there is provided a semiconductor device including: a loading unit on which a plurality of wafer level packages are loaded; A transfer robot for taking out the wafer level package from the loading part and transferring the wafer level package to a post-process position; A wafer sorting unit mounted horizontally in an arbitrary direction and rotatable about a vertical axis, the wafer sorting unit including a wafer level package carried by the transfer robot and seated thereon; A wafer level package mounted horizontally above the wafer aligning part, the notch formed on one outer peripheral edge of the wafer level package placed on the wafer aligning part, and the reference mark displayed on the upper surface of the wafer level package, A vision camera for detecting a position for the camera; The wafer level package is picked up at a predetermined pickup position and transported to a post-process position in a state in which the position of the wafer level package is corrected in accordance with positional information of the wafer level package detected by the vision camera, A picker; A cutter for cutting and processing the wafer level package carried by the wafer picker by individual semiconductor package units for individualization; A unit picker for transporting the individual semiconductor packages to the cleaner in the cutting work; A drying unit for drying the individual semiconductor packages cleaned by the cleaning unit; A vision inspection unit for inspecting whether individual semiconductor packages having been cleaned and dried are defective; An unloading unit for sorting individual semiconductor packages transported through the vision inspection unit into trays according to inspection results and storing the sorted packages; And an unloading picker for transporting individual semiconductor packages of the vision inspection unit to an unloading unit and accommodating the individual semiconductor packages in a tray; Wherein the positional correction of the wafer level package is performed so that the pickup center position of the wafer picker and the center of the wafer level package become the same.
According to one aspect of the present invention, the wafer alignment portion includes an alignment table on which a wafer level package is seated and fixed; An XY- &thetas; drive unit for rotating the alignment table in the front, rear, left, and right directions; A plurality of guide pins fixedly installed on the outside of the alignment table and guiding a seating position of the wafer level package in contact with an edge of the wafer level package that is seated on the alignment table; And positioning means for determining a pickup position of the wafer picker when the wafer picker picks up the wafer level package on the aligned table.
And the positioning means includes a pair of positioning holes fixedly installed outside the opposite side portions of the alignment table; And a positioning pin extending downward from both sides of the wafer picker to determine a pick-up position of the wafer picker while being inserted into the positioning hole when the wafer picker picks up the wafer level package on the aligned table .
The chuck table may include a chuck table provided with a wafer level package carried by the wafer picker so as to be seated and fixed and horizontally movable in one direction; A cutter for cutting the wafer level package placed on the chuck table into individual package units; And a brush installed vertically movably on the movement path of the chuck table and moving downward after the cutting operation is completed to contact the scrap other than the semiconductor package placed on the chuck table to remove the scrap .
The unit picker includes a picker head having a plurality of vacuum holes formed on a lower surface thereof for vacuum-sucking a wafer-level package; A manifold having a pneumatic forming main passage in which a lower end communicates with the vacuum holes of the picker head and an upper end communicates with an external pneumatic generating unit; And a suction pipe connected at one end to the lower portion of the pneumatic forming main passage of the manifold and communicated with the vacuum holes of the picker head at the other end to introduce air and moisture sucked through the vacuum hole to the pneumatic forming main flow path of the manifold, And a control unit.
According to another aspect of the present invention, there is provided a wafer leveling apparatus, wherein the vision camera moves horizontally along an X-axis guide frame together with the wafer picker onto the wafer aligning portion to form a notch formed on one outer circumferential edge of the wafer level package, A center position of the wafer level package or a center of rotation position of the alignment table is calculated through the position information by photographing a reference mark to determine a center position of the wafer level package at a pickup center position The position of the wafer-level package is corrected by operating the XY- &thetas; driver.
According to another aspect of the present invention, the drying unit includes: a dry block in which cleaned individual semiconductor packages are mounted and heated; And an air blower for spraying high-pressure air from the upper side of the dry block toward the individual semiconductor package.
The vision inspection unit may include a top vision camera for performing an inspection on a top surface of the semiconductor package, and a bottom vision camera for inspecting a bottom surface of the semiconductor package.
Wherein the unloading unit is provided with a plurality of tray feeders for horizontally moving independently along a plurality of Y-axis guide frames and transporting the respective trays in which the individual semiconductor packages are sorted and stored according to the inspection result of the vision inspection unit in the Y axis direction; A blank tray loading section for loading an empty tray; And a tray picker moving horizontally in the X-axis direction and picking up an empty tray of the empty tray loading unit and supplying the empty tray onto the tray feeder.

According to the present invention, since the wafer level package to be processed is precisely corrected in the wafer aligning portion and then transported to the cutting groove, the cutting operation can be accurately performed, so that the occurrence of defects at the time of cutting can be eliminated and the productivity can be improved .

1 is a plan view schematically showing a configuration of a singulation apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.
2 is a perspective view showing a picker of a carrier robot of the wafer level package singulation apparatus of FIG.
3 is a side view showing a configuration of a wafer alignment unit of the wafer level package singulation apparatus of FIG.
4 is a perspective view showing a configuration of an embodiment of a unit picker of the wafer level package singulation apparatus of FIG.
Fig. 5 is a longitudinal sectional view of the main part of the unit picker of Fig. 4;

Hereinafter, a preferred embodiment of a singulation apparatus for manufacturing a semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, a singulation apparatus for manufacturing a semiconductor package according to an embodiment of the present invention includes a plurality of semiconductor packages arranged in a lattice form, circular wafer-level packages W accommodated in a magazine M, A wafer aligning part 30 on which the wafer level package W carried out from the loading part 10 is seated and aligned with the wafer aligning part 30; A vision camera 40 installed to detect a position for alignment of the wafer level package W and a transfer robot 10 for transferring the wafer level package W from the loading section 10 onto the wafer alignment section 30 And a wafer level package W which is transferred from the wafer aligning section 30 to the wafer level package W by cutting the wafer level package W into individual packages, (70) by vacuum adsorption, A unit picker 70 for vacuum picking up a semiconductor package on the cutter 60 and sequentially transferring the picked up semiconductor package to the brush cleaning unit 81, the cleaning unit 82 and the drying unit 83; A vision inspection unit 100 for checking whether individual semiconductor packages carried by the dry block 84 are defective and a package transport picker 90 for picking up semiconductor packages from the dry block 84 and transporting the semiconductor packages to the vision inspection unit 100 An unloading unit 110 for sorting individual semiconductor packages transported through the vision inspecting unit 100 into a plurality of trays according to an inspection result and for picking up semiconductor packages from the vision inspecting unit 100, And an unloading picker 120 that is carried to the loading unit 110 and accommodated in the tray T, and the like.

The magazine M housed in the loading unit 10 may be a FOUP (Front Opening Unified Pod) type in which a door (not shown) for opening and closing a front door is formed. In this case, (Not shown) of the door M is constructed.

2, the lower surface of the wafer level package W is connected to the picker 21 of the transport robot 20 by a vacuum (vacuum) A plurality of vacuum holes 22 are formed for adsorption and a suction pad 23 made of a flexible material is provided around the vacuum hole 22 to ensure the formation of vacuum pressure.

The wafer alignment unit 30 corrects the position of the wafer level package W according to the positional information of the wafer level package W detected by the vision camera 40, To be equal to the pick-up center position of the wafer picker (50).

1 and 3, the wafer alignment unit 30 includes an alignment table 31 on which a wafer level package is seated and fixed, XY-θ drive unit 32 for moving the wafer table 31 in the XY-θ direction (forward and backward directions in the axial direction) A plurality of guide pins 37 guiding the seating position of the wafer level package W while being in contact with an edge of the package W and a plurality of guide pins 37 arranged on the wafer level package W on the alignment table 31, And position determining means for determining the pick-up position of the wafer picker 50 when picking up the wafer picker. Here, the positioning means includes a pair of positioning holes 36 fixed to the outside of both side portions of the alignment table 31, and a pair of positioning holes 36 extending downward from both sides of the wafer picker 50 The wafer picker 50 is inserted into the positioning hole 36 when picking up the wafer level package W on the alignment table 31 and a positioning pin (not shown) for determining the pickup position of the wafer picker 50 City).

The XY-theta drive unit 32 includes an X-axis moving block 33 that horizontally moves in the X-axis direction by the operation of an X-axis motor 33a and an X-axis ball screw (not shown) installed on the base 30a, A Y-axis moving block 34 horizontally moving in the Y-axis direction by operation of a Y-axis motor 34a and a Y-axis ball screw 34b installed on the X-axis moving block 33, and a Y- And a rotating motor 35 for rotating the alignment table 31 while rotating on the axis moving block 34 at an arbitrary angle? About the vertical axis. The X-axis moving block 33 and the Y Level package W is adjusted by adjusting the position of the alignment table 31 while moving to an arbitrary position of XY- &thetas; by the operation of the axis moving block 34 and the rotation motor 35. [

1, in this embodiment, the vision camera 40 is fixed to one side of the wafer picker 50 and horizontally moves along the X-axis guide frame 52 together with the wafer picker 50, A notch formed on one side outer peripheral edge of the wafer level package W placed on the alignment unit 30 and a fiducial mark displayed on the upper surface of the wafer level package W are picked up to form a wafer level package W ) Of the image.

Of course, in this embodiment, the vision camera 40 is fixed to one side of the wafer picker 50 and moves horizontally with the wafer picker 50, Level package (W) by independently moving the wafer-level package (W) in a horizontal direction.

The chipping table 60 includes a chuck table 61 on which the wafer level package W carried by the wafer picker 50 is seated and fixed and which is horizontally movable in one direction, A cutter 62 for cutting the wafer level package W placed on the chuck table 61 while moving on a chuck table 61 in an individual package unit; And a brush 63 moving downward to contact the scrap other than the semiconductor package placed on the chuck table 61 to remove the scrap. The brush 63 is moved up and down by a linear motion device such as a pneumatic cylinder.

The chuck table 61 is provided with a vacuum hole (not shown) for absorbing a package at a position corresponding to the position of each semiconductor package formed in the wafer level package W, The blade escape groove 61a is formed at a position corresponding to the package cutting line so that the blade edge of the blade 62a of the cutter 62 can be received while not contacting the blade edge. Therefore, when cutting the wafer level package W on the chuck table 61 along the cutting line while the blade 62a of the cutter 62 and the chuck table 61 move relative to each other, The wafer level package W is cut without contacting the chuck table 61 while passing the blade escape groove 61a.

Although not shown in the drawing, a water spray nozzle for cooling the heat generated in the cutting process and removing foreign substances is installed on the cutter 60 when the cutter 62 cuts the wafer level package W.

The brush cleaning unit 81 removes foreign matter while contacting the lower surface of the individual semiconductor package fixed by the unit picker 70. The cleaning unit 82 is provided with a separate semiconductor And functions to spray and clean the packages with water and / or air.

The drying unit 83 is integrally fixed to one side of the package conveying picker 90 and is fixed to the semiconductor package at the upper side of the dry block 84 And an air blower 85 for injecting high-pressure air.

The vision inspection unit 100 includes a plurality of (two in this embodiment) seat blocks 101 on which semiconductor packages are mounted and a plurality of semiconductor blocks 101 mounted on one side of the package transporting pickers 90, A lower side of the unloading picker 120 for picking up the lower surface of the semiconductor package, which is provided below the moving path of the unloading picker 120 and adsorbed by the unloading picker 120; And a vision camera 103 for inspection. The seat block 101 is composed of two upper and lower layers and moves independently in the front-rear direction (Y-axis direction) along the Y-axis guide frame 104 while moving the semiconductor packages to the rear of the unloading picker 120 And returns it to the pickup position.

The unloading unit 110 includes a plurality of trays (not shown) for transporting the tray T in which the semiconductor packages are accommodated in the Y-axis direction while being independently horizontally moved along the plurality of Y-axis guide frames 113 by a known linear motion device. The empty tray of the empty tray loading unit 114 is picked up while horizontally moving in the X-axis direction by a feeder 111, a blank tray loading unit 114 for loading an empty tray, and a known linear moving apparatus, And a tray picker 112 for feeding onto the feeder 111. Semiconductor packages determined to be good are stored in the tray T of one of the tray feeders 111 of the tray feeder 111 and semiconductor packages determined to be defective are stored in the tray T on the other one of the tray feeders 111, do.

On the other hand, the unit picker 70 vacuum-sucks the individual semiconductor packages on the cutter 60 and transfers them to a post-process position. At this time, the semiconductor packages placed on the chuck table 61 of the cutter 60 are cut Water is sucked together with the air when the unit picker 70 vacuum-adsorbs the semiconductor packages. If the water sucked by the unit picker 70 does not properly filter on the way, it adversely affects the external pneumatic pressure generating unit. Therefore, it is preferable that the water is not completely sucked but is filtered in the middle, and only air is sucked.

In this embodiment, the unit picker 70 has a structure in which water sucked with air is not introduced into the pneumatic pressure generating unit. 4 and 5, the unit picker 70 includes a picker head 71 formed with a plurality of vacuum holes 72a for vacuum-sucking a wafer-level package W on a lower surface thereof, A manifold 74 having a pneumatic pressure forming main flow path 75 communicating with the vacuum holes 72a of the head 71 and having an upper end communicating with an external pneumatic pressure generating unit 79, And the other end communicates with the vacuum holes 72a of the picker head 71 and sucks air and moisture sucked through the vacuum hole 72a into the manifold (74) for guiding air to the main flow path (75).

The picker head 71 includes a plurality of vacuum holes 72a and a base block 77b connected to a lower end of each of the vacuum holes 72a and having a flexible material adsorption pad 77 for vacuum- And a connecting block (72) connected to the upper side of the base block (72) and forming an intermediate flow path (73a) communicating with the vacuum holes (72a) 73).

The lower end of the pneumatic forming main passage 75 of the manifold 74 communicates with the intermediate passage 73a through the central portion of the connecting block 73. The suction pipes 76 may be formed using a flexible hose or the like and communicate with the intermediate flow path 73a through a peripheral portion of the connection block 73.

When the suction force is generated through the external air pressure generating unit 79, the unit picker 70 configured as described above sucks air through the vacuum hole 72a to generate vacuum pressure at the lower end of the picker head 71, Are vacuum-adsorbed. At this time, the water on the chuck table 61 (see FIG. 1) is sucked together with air through the vacuum hole 72a, and the sucked air and water are sucked through the suction pipe 76 to the main passage 75 . The light air in the water and the water sucked into the pneumatic forming main channel 75 flows upward and flows toward the pneumatic generating unit 79. However, the heavy water can not flow to the upper part, And when the pneumatic pressure is released, it falls by its own weight and is discharged to the outside through the vacuum hole 72a again. Therefore, when the unit picker 70 vacuum-chucks and transports the semiconductor packages on the chuck table 61, the water sucked with the air can be safely processed without entering the external pneumatic generating unit 79.

The wafer level package singulation apparatus of the present invention constructed as above operates as follows.

The wafer level package W in which the picker 21 of the carrier robot 20 is housed horizontally in the magazine M of the loading section 10 is vacuum-adsorbed and taken out from the magazine M, The wafer level package W is transferred to the wafer stage 30 and placed on the alignment table 31. At this time, the edge portion of the wafer level package W is guided by the guide pin 37 fixed to the outside of the alignment table 31, so that the wafer level package W is guided by the guide pin 37, Lt; / RTI >

The vision camera 38 moves horizontally along the X-axis guide frame 52 together with the wafer picker 50 and moves onto the wafer alignment unit 30, (Not shown) and reference marks (not shown) formed on the outer circumferential edge of one side of the wafer level package W while horizontally moving in the direction of the wafer level package W, The center position of the wafer level package W and / or the rotational center position of the aligning table 31 are calculated through the center position of the wafer level package W and the center position of the wafer level package W is matched with the pickup center position of the wafer picker 50 The position of the wafer level package W is corrected by operating the XY- [theta]

The wafer picker 50 descends from the upper side of the wafer aligning section 30 and the wafer level of the wafer level package W placed on the alignment table 31 The package W is vacuum-adsorbed. At this time, positioning pins (not shown) extending downward at both side ends of the wafer picker 50 are inserted into the positioning holes 36 fixed to the outside of both sides of the alignment table 31, 50 can always pick up the wafer level package W at a constant pick-up position.

The wafer picker 50 transports the wafer level package W picked up by the wafer sorting unit 30 to the cutter 60 and places it on the chuck table 61. At this time, since the position of the wafer level package W in the wafer aligner 30 with respect to the wafer picker 50 is accurately aligned, the position of the wafer level package W is changed even when it is placed on the chuck table 61 And remain correctly aligned.

When the wafer level package W is placed on the chuck table 61 as described above, the chuck table 61 moves rearward in the Y-axis direction and then moves relative to the blade 62a of the cutter 62, The package W is cut and processed individually for each package unit.

When the cutting operation is completed, the chuck table 61 again moves forward in the Y-axis direction. At this time, the brush 63 is lowered to come into contact with the scraps on the chuck table 61, and the scraps fall off the chuck table 61 and are removed.

When the chuck table 61 moves completely forward, the unit picker 70 vacuum-seals the individual semiconductor packages on the chuck table 61 and transfers them to the brush cleaning part 81 and the cleaning part 82 to completely remove foreign matter Remove the semiconductor packages on the dry block 84 of the drying section 83 and then move again to the cut-to-cut processing 60 and prepare to receive the next wafer level package W. [

When the unit picker 70 releases the semiconductor packages to the dry block 84 of the drying unit 83 as described above, the package transport picker 90 is slowly moved toward the dry block 84 and the air blower 85, the semiconductor packages on the dry block 84 are dried. At the same time, the vision camera 102 for top surface inspection visually photographs the semiconductor package on the dry block 84 to check whether the top surface of the semiconductor package is defective.

When the drying is completed, the package carrier picker 90 vacuum deposits all the semiconductor packages on the dry block 84 and places them on the seat block 101 of the vision inspection part 100. The seat block 101 moves rearward along the Y-axis guide frame 104 and stops below the movement path of the unloading picker 120.

The unloading picker 120 moves to the upper side of the inspection vision camera 103 when the semiconductor packages on the seat block 101 are vacuum adsorbed and the lower vision inspection camera 103 moves to the unloading picker 120. [ The lower surface of the semiconductor package which is attracted to the semiconductor package is inspected for defects.

The unloading picker 120 moves in the X-axis direction to transport the semiconductor packages to the unloading unit 110, and the unloading unit (not shown) 110 in a tray (T).

The embodiments of the singulation apparatus for manufacturing a semiconductor package according to the present invention are presented for illustrative purposes only to facilitate understanding of the present invention and the present invention is not limited thereto, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: loading section 20: carrying robot
30: wafer alignment unit 31: alignment table
32: XY-theta drive unit 36: positioning hole
37: guide pin 40: vision camera
50: wafer picker 60:
61: Chuck table 62: Cutter
62a: Blade 63: Brush
70: Unit picker 81: Brush cleaning unit
82: Tax administration 83: Drying department
84: Dry block 85: Air blower
90: Package transporting picker 100: Vision inspection part
101: Seat block 102: Vision camera for inspection of upper surface
103: a lower vision inspection vision camera 110:
111: tray feeder 120: unloading picker
M: Magazine W: Wafer level package
T: Tray

Claims

A loading section on which a plurality of wafer level packages are loaded;
A transfer robot for taking out the wafer level package from the loading part and transferring the wafer level package to a post-process position;
A wafer sorting unit mounted horizontally in an arbitrary direction and rotatable about a vertical axis, the wafer sorting unit including a wafer level package carried by the transfer robot and seated thereon;
A wafer level package mounted horizontally above the wafer aligning part, the notch formed on one outer peripheral edge of the wafer level package placed on the wafer aligning part, and the reference mark displayed on the upper surface of the wafer level package, A vision camera for detecting a position for the camera;
A wafer picker for picking up the aligned wafer level package and transferring the picked up wafer level package to a post-process position in a state of correcting the position of the wafer level package in accordance with positional information of the wafer level package detected by the vision camera;
A cutter for cutting and processing the wafer level package carried by the wafer picker by individual semiconductor package units for individualization;
A unit picker for transporting the individual semiconductor packages to the cleaner in the cutting work;
A drying unit for drying the individual semiconductor packages cleaned by the cleaning unit;
A vision inspection unit for inspecting whether individual semiconductor packages having been cleaned and dried are defective;
An unloading unit for sorting individual semiconductor packages transported through the vision inspection unit into trays according to inspection results and storing the sorted packages; And
And an unloading picker for transporting individual semiconductor packages of the vision inspection unit to the unloading unit and storing the semiconductor packages in a tray;
Wherein the positional correction of the wafer level package is performed so that the pickup center of the wafer picker and the center of the wafer level package become the same.

The apparatus of claim 1, wherein the wafer alignment unit comprises: an alignment table on which a wafer level package is seated and fixed; An XY- &thetas; drive unit for rotating the alignment table in the front, rear, left, and right directions; A plurality of guide pins fixedly installed on the outside of the alignment table and guiding a seating position of the wafer level package in contact with an edge of the wafer level package that is seated on the alignment table; And positioning means for determining a pickup position of the wafer picker when the wafer picker picks up the wafer level package on the aligned table.

The positioning apparatus according to claim 2, wherein the positioning means comprises: a pair of positioning holes fixedly installed outside the opposite side portions of the alignment table; And a positioning pin extending downward from both sides of the wafer picker to determine a pick-up position of the wafer picker while being inserted into the positioning hole when the wafer picker picks up the wafer level package on the aligned table Wherein the semiconductor package is a semiconductor package.

The chuck table according to claim 1, wherein the chuck table comprises: a chuck table provided with a wafer level package carried by the wafer picker, the chuck table being fixedly mounted and horizontally movable in one direction; A cutter for cutting the wafer level package placed on the chuck table into individual package units; And a brush installed vertically movably on the movement path of the chuck table and moving downward after the cutting operation is completed to contact the scraps other than the semiconductor package placed on the chuck table to remove the scraps. Singulation device for manufacturing semiconductor packages.

The apparatus of claim 1, wherein the unit picker comprises: a picker head having a plurality of vacuum holes formed on a lower surface thereof for vacuum-sucking a wafer-level package; A manifold having a pneumatic forming main passage in which a lower end communicates with the vacuum holes of the picker head and an upper end communicates with an external pneumatic generating unit; And a suction pipe connected at one end to the lower portion of the pneumatic forming main passage of the manifold and communicated with the vacuum holes of the picker head at the other end to introduce air and moisture sucked through the vacuum hole to the pneumatic forming main flow path of the manifold, Wherein the semiconductor package is a semiconductor package.

3. The apparatus according to claim 2, wherein the vision camera moves horizontally along the X-axis guide frame together with the wafer picker onto the wafer alignment part to photograph a notch and a reference mark formed on one outer circumferential edge of the wafer level package, Level package and a center position of the alignment table is calculated through the position information to calculate a center position of the wafer-level package or a center-of-rotation position of the alignment table so that the center position of the wafer- Wherein the XY-theta drive unit is operated to correct the position of the wafer level package.

The method of manufacturing a semiconductor device according to claim 1, wherein the drying unit comprises: a dry block in which cleaned individual semiconductor packages are mounted and heated; And an air blower for spraying high-pressure air from the upper side of the dry block toward the individual semiconductor package side.

2. The semiconductor package according to claim 1, wherein the vision inspection unit includes a top vision camera for performing an inspection on an upper surface of the semiconductor package, and a bottom vision camera for inspecting a bottom surface of the semiconductor package. The device.

The image forming apparatus according to claim 1, wherein the unloading unit independently horizontally moves along a plurality of Y-axis guide frames, and each tray, in which the individual semiconductor packages are classified and accommodated according to the inspection result of the vision inspection unit, A plurality of tray feeders; A blank tray loading section for loading an empty tray; And a tray picker for horizontally moving in the X-axis direction and picking up an empty tray of the empty tray loading unit and supplying the empty tray onto the tray feeder.